Liquid-cooled heat sink

Abstract

The application discloses a liquid cooling heat dissipation device, which is used for thermal contact with an expansion card. The liquid cooling heat dissipation device comprises an assembly plate, a heat conduction block and a liquid cooling row. The assembly plate is used for mounting the expansion card. The heat conduction block is mounted on the assembly plate and cooperates with the assembly plate to surround a liquid chamber. The liquid cooling row is mounted on the assembly plate and communicates with the liquid chamber. The liquid cooling heat dissipation device can reduce the space required by the assembly plate, the heat conduction block and the liquid cooling row through the assembly plate, the heat conduction block and the liquid cooling row stacked together. In this way, the liquid cooling heat dissipation device can avoid occupying the limited space in the computer and improve the heat dissipation efficiency of the expansion card.

Description

TECHNICAL FIELD

[0001] The present invention relates to a heat dissipation device, and more particularly to a liquid cooling heat dissipation device. BACKGROUND

[0002] With the development and progress of technology, computers have gradually become an indispensable necessity in people's daily life. In order to make the computer meet various functional requirements, the mainboard of the computer usually has a plurality of functional expansion slots for installing some functional expansion cards such as display adapters, sound cards, network cards, etc. to enhance their additional functions. However, with the expansion of computer functions, the size of the expansion card also increases, and the installation of multiple expansion cards in a limited space will interfere with each other. In addition, when the functional expansion card is in operation, the current in the circuit will generate unnecessary heat due to the influence of impedance, and if these heat cannot be effectively removed and accumulated on the electronic components inside the functional expansion card, the electronic components may be damaged due to the continuously rising temperature.

[0003] In order to improve the heat dissipation efficiency of the functional expansion card, a water cooling system is generally used to dissipate heat from the functional expansion card. The water cooling system mainly consists of a water cooling head, a water cooling radiator and a pump. When the water cooling system dissipates heat from the electronic components, the pump pumps the coolant into the water cooling head, the coolant absorbs the heat generated by the electronic components, and then the water cooling radiator cools the coolant. However, due to the dispersed assembly position of the current water cooling head, water cooling radiator and pump, it is difficult to reduce the space occupied by the water cooling system. Therefore, in the liquid cooling system, the relative positions of the liquid cooling head, the radiator and the pump are fixed and cannot be adjusted. In addition, due to the different configurations of the electronic components inside the electronic device, the space available for installing the liquid cooling system inside the electronic device is also limited. Therefore, how to avoid the functional expansion card occupying the limited space in the computer while improving the heat dissipation efficiency of the functional expansion card has become a major problem in design. SUMMARY

[0004] The present invention provides a liquid cooling heat dissipation device to avoid the functional expansion card occupying the limited space in the computer while improving the heat dissipation efficiency of the functional expansion card.

[0005] The liquid cooling heat dissipation device disclosed in an embodiment of the present invention is used to be in thermal contact with an expansion card. The liquid cooling heat dissipation device includes an assembly plate, a heat conduction block and a liquid cooling radiator. The assembly plate is used for installing the expansion card. The heat conduction block is installed on the assembly plate and cooperates with the assembly plate to surround a liquid chamber. The liquid cooling radiator is installed on the assembly plate and communicates with the liquid chamber.

[0006] According to the liquid cooling heat dissipation device of the above embodiment, the space occupied by the assembly plate, the heat conduction block and the liquid cooling row can be reduced by the above-mentioned assembly plate, the heat conduction block and the liquid cooling row. In this way, the liquid cooling heat dissipation device of the present embodiment can avoid occupying the limited space in the computer, while improving the heat dissipation efficiency of the expansion card.

[0007] The above description of the present application and the following description of the embodiments are used to demonstrate and explain the principles of the present application, and provide further explanation of the claims of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 A perspective view of the liquid cooling heat dissipation device according to the first embodiment of the present application.

[0009] Figure 2 A perspective view of the liquid cooling heat dissipation device according to the first embodiment of the present application. Figure 1

[0010] Figure 3 A perspective view of the liquid cooling heat dissipation device according to the first embodiment of the present application. Figure 1

[0011] Figure 4 A perspective view of the liquid cooling heat dissipation device according to the first embodiment of the present application. Figure 2

[0012] Figure 5 A perspective view of the liquid cooling heat dissipation device according to the first embodiment of the present application. Figure 2

[0013] Figure 6 A perspective view of the liquid cooling heat dissipation device according to the second embodiment of the present application.

[0014] In the drawings:

[0015] Liquid cooling heat dissipation device 10, 10'

[0016] Expansion card 20

[0017] Processing chip 22

[0018] Assembly plate 100

[0019] First liquid inlet 101

[0020] First liquid outlet 102

[0021] Plate body 110

[0022] First surface 111

[0023] Second surface 112

[0024] First coupling hole 113 ​​​​

[0025] Second coupling hole 114

[0026] Groove 115

[0027] Assembled column 120

[0028] Adapter protrusion 130

[0029] Thermal block 200

[0030] Convex hull 210

[0031] Radiator fins 220

[0032] Seal 250

[0033] Liquid cooling array 300

[0034] Second liquid inlet 310

[0035] Second liquid outlet 320

[0036] Pump 350

[0037] Rigid flow tube 370

[0038] Flexible flow tube 370'

[0039] First coupling member 400

[0040] Second coupling member 500

[0041] Fan 600

[0042] Height D1, D2

[0043] Liquid chamber S DETAILED DESCRIPTION

[0044] Please refer to Figures 1 to 4 . Figure 1 is a perspective view of a liquid cooling heat sink according to a first embodiment of the present invention. Figure 2 is Figure 1 a perspective view of the liquid cooling heat sink of Figure 3 is Figure 1 an exploded view of the liquid cooling heat sink of Figure 4 is Figure 2 an exploded view of the liquid cooling heat sink of

[0045] The liquid cooling heat sink 10 of the present embodiment is used to be in thermal contact with a graphics card 20. The graphics card 20 is, for example, a display adapter. The liquid cooling heat sink 10 comprises an assembly plate 100, a heat conducting block 200, and a liquid cooling radiator 300. In addition, the liquid cooling heat sink 10 further comprises a plurality of first coupling members 400 and a plurality of second coupling members 500. The heat conducting block 200 is assembled to the assembly plate 100 through the first coupling members 400. The liquid cooling radiator 300 is assembled to the assembly plate 100 through the second coupling members 500.

[0046] The assembly plate 100 is used to assemble the graphics card 20 (as shown in FIG. 1) thereon. The assembly plate 100 comprises a plate body 110, a plurality of assembly columns 120, and two pipe protrusions 130. The plate body 110 has a first face 111 and a second face 112. The second face 112 is opposite to the first face 111. The assembly columns 120 protrude from the second face 112. The assembly columns 120 are used to assemble the graphics card 20. The pipe protrusions 130 protrude from the first face 111. Figure 5

[0047] In addition, the plate body 110 has a plurality of first coupling holes 113 and a plurality of second coupling holes 114. The first coupling holes 113 are, for example, threaded holes and are in the form of through holes penetrating through the first face 111 and the second face 112, but are not limited thereto. In other embodiments, each of the first coupling holes 113 can also be in the form of a blind hole penetrating through the second face 112 but not penetrating through the first face 111. The second coupling holes 114 are, for example, threaded holes and penetrate through the first face 111 and the second face 112.

[0048] The pipe protrusions 130 both protrude from the second face 112 of the plate body 110. The assembly plate 100 has a first liquid inlet 101 and a first liquid outlet 102, and the first liquid inlet 101 and the first liquid outlet 102 are respectively located on the pipe protrusions 130. In addition, the plate body 110 has a groove 115 located on the first face 111 and communicating the first liquid inlet 101 and the first liquid outlet 102 on the pipe protrusions 130.

[0049] The heat conducting block 200 is, for example, a copper block and is assembled to the plate body 110 of the assembly plate 100 through the first coupling members 400 and the first coupling holes 113, respectively, and cooperatively defines a liquid chamber S with the plate body 110 of the assembly plate 100. The heat conducting block 200 has a convex block 210 and a heat dissipation fin 220. The convex block 210 protrudes away from the plate body 110 and protrudes partially from the first face 111 of the plate body 110. The heat dissipation fin 220 is located in the liquid chamber S to improve the heat exchange efficiency between the liquid in the liquid chamber S and the heat conducting block 200. In addition, a sealing member 250 is arranged between the heat conducting block 200 and the plate body 110 to prevent the liquid in the liquid chamber S from leaking out of the gap between the heat conducting block 200 and the plate body 110. ​

[0050] The liquid cooling radiator 300 is mounted in these second mating holes 114 via a second mating member 500 to cover the second surface 112 of the plate 110. That is, the heat-conducting block 200 and the liquid cooling radiator 300 are located on opposite sides of the plate 110 of the assembly plate 100. In addition, the liquid cooling radiator 300 includes a second liquid inlet 310 and a second liquid outlet 320, and the second liquid inlet 310 and the second liquid outlet 320 of the liquid cooling radiator 300 are respectively connected to the first liquid outlet 102 and the first liquid inlet 101 on the two connecting pipe protrusions 130 to form a cooling cycle.

[0051] In this embodiment, the liquid-cooled heat dissipation device 10 further includes a pump 350 and two rigid flow tubes 370. The pump 350 is installed on the liquid cooling radiator 300, and the first liquid inlet 101 and the first liquid outlet 102 are respectively connected to the second liquid outlet 320 and the second liquid inlet 310 through the two rigid flow tubes 370 and the pump 350. Since the rigid flow tubes 370 do not have the problem of deformation and bending, it is easier to install them.

[0052] In this example, the liquid-cooled heat dissipation device 10 is designed with a pump 350, but this is not intended to limit the invention. In other embodiments, if the cooling cycle of the liquid-cooled heat dissipation device can form natural convection, the liquid-cooled heat dissipation device may also be designed without a pump.

[0053] In this embodiment, the liquid-cooled heat dissipation device 10 also includes two fans 600. The two fans 600 are mounted on the liquid cooling radiator 300 and are located on the side of the liquid cooling radiator 300 away from the plate 110.

[0054] In this embodiment, there are two fans 600, but this is not a limitation. In other embodiments, there may be only one fan. Furthermore, in this embodiment, the fan 600 is located on the side of the liquid cooling radiator 300 away from the plate 110, but this is not a limitation. In other embodiments, the fan may be located on the side closer to the plate 110.

[0055] Please see Figure 5 . Figure 5 for Figure 2 The liquid-cooled heat dissipation device is installed on the expansion card's assembly board, as shown in the cross-sectional view at section line 5-5. In this embodiment, the height D1 of each assembly pillar 120 protruding from the first surface 111 is greater than the height D2 of the protrusion 210 of the heat-conducting block 200 protruding from the first surface 111. The height difference between height D1 and height D2 matches the height of the processing chip 22 of the expansion card 20.

[0056] Through the assembly plate 100, the heat-conducting block 200 and the liquid cooling row 300 stacked as above, the space occupied by the assembly plate 100, the heat-conducting block 200 and the liquid cooling row 300 can be reduced. In this way, the liquid cooling heat dissipation device 10 of the present embodiment can avoid occupying the limited space in the computer, while improving the heat dissipation efficiency of the expansion card. In addition, the pump 350 is close to the liquid cooling row 300 in the above-mentioned embodiment, thereby further reducing the space occupied by the liquid cooling heat dissipation device 10 of the present embodiment.

[0057] Please refer to Figure 6 . Figure 6 is a side view of a liquid cooling heat dissipation device according to a second embodiment of the present application.

[0058] The liquid cooling heat dissipation device 10' of the present embodiment is similar to the liquid cooling heat dissipation device 10 of the above-mentioned embodiment in structure, both of which include the assembly plate 100, the heat-conducting block 200, the liquid cooling row 300, the pump 350 and the fan 600, and the connection relationship of the assembly plate 100, the heat-conducting block 200, the liquid cooling row 300, the pump 350 and the fan 600 is also similar to that of the above-mentioned embodiment, so it will not be described again.

[0059] The difference between the liquid cooling heat dissipation device 10' of the present embodiment and the liquid cooling heat dissipation device 10 of the above-mentioned embodiment is that the liquid cooling heat dissipation device 10' of the present embodiment replaces the two rigid flow tubes 370 with two flexible flow tubes 370', that is, the first liquid inlet 101 (as shown in Figure 5 ) and the first liquid outlet 102 (as shown in Figure 5 ) are respectively connected to the second liquid outlet 320 (as shown in Figure 5 ) and the second liquid inlet 310 (as shown in Figure 5 ) through the two flexible flow tubes 370' and the pump 350.

[0060] Through the assembly plate, the heat-conducting block and the liquid cooling row stacked as above, the space occupied by the assembly plate, the heat-conducting block and the liquid cooling row can be reduced. In this way, the liquid cooling heat dissipation device of the present embodiment can avoid occupying the limited space in the computer, while improving the heat dissipation efficiency of the expansion card. In addition, the pump is close to the liquid cooling row in the above-mentioned embodiment, thereby further reducing the space occupied by the liquid cooling heat dissipation device of the present embodiment.

[0061] Although the present application is disclosed as above with the above-mentioned embodiments, it is not intended to limit the present application, and any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present application, so the patent protection scope of the present application should be subject to the scope defined by the appended claims.

Claims

1. A liquid-cooled heat dissipation device for thermal contact with an expansion card, characterized in that, The liquid cooling device comprises: an assembly plate for assembling the expansion card; a heat-conducting block assembled on the assembly plate and located on one side of the assembly plate, and together with the assembly plate to enclose a liquid chamber; and a liquid cooling row assembled on the assembly plate and located on the other side of the assembly plate, and in communication with the liquid chamber; wherein the assembly plate comprises a plate body, the liquid chamber and the liquid cooling row are respectively located on opposite sides of the plate body of the assembly plate, the assembly plate has a first liquid inlet and a first liquid outlet, the liquid cooling row has a second liquid inlet and a second liquid outlet, the first liquid outlet is in communication with the second liquid inlet, and the second liquid outlet is in communication with the first liquid inlet to form a cooling cycle between the liquid cooling row and the liquid chamber; wherein the plate body has a first face and a second face, the plate body further has a groove located on the first face and in communication with the first liquid inlet and the first liquid outlet, the heat-conducting block is assembled on the assembly plate so that the heat-conducting block and the groove form the liquid chamber; the assembly plate further comprises a plurality of assembly columns, the second face is opposite to the first face, the assembly columns protrude from the first face, and the assembly columns are respectively used for assembling the expansion card, the height of each assembly column protruding from the first face is greater than the height of the heat-conducting block protruding from the first face to form a height difference, the height difference matches the height of the processing chip of the expansion card, and three through holes in communication with the first face and the second face are formed on the plate body, and the through holes expose part of the liquid cooling row.

2. The liquid-cooled heat sink of claim 1, wherein, Further comprising a pump assembled on the liquid cooling row.

3. The liquid-cooled heat sink of claim 1, wherein, Further comprising a plurality of first coupling members, the plate body has a plurality of first coupling holes located on the first face, and the heat-conducting block is coupled with the first coupling holes of the plate body through the first coupling members.

4. The liquid-cooled heat sink of claim 3, wherein, Further comprising a plurality of second coupling members, the plate body further has a plurality of second coupling holes penetrating the first face and the second face, and the second coupling members respectively penetrate the second coupling holes and are locked on the liquid cooling row.

5. The liquid-cooled heat sink of claim 1, wherein, Further comprising at least one fan assembled on the liquid cooling row.

6. The liquid-cooled heat sink of claim 5, wherein, The at least one fan is located on the side of the liquid cooling row away from the plate body.

7. The liquid-cooled heat sink of claim 1, wherein, The assembly plate further comprises two pipe protrusions protruding from the second face, and the first liquid inlet and the first liquid outlet are respectively located on the two pipe protrusions.

8. The liquid-cooled heat sink of claim 7, wherein, Further comprising two flexible flow tubes, and the first liquid inlet and the first liquid outlet are respectively in communication with the second liquid outlet and the second liquid inlet through the two flexible flow tubes.

9. The liquid-cooled heat sink of claim 7, wherein, Further comprising two rigid flow tubes, and the first liquid inlet and the first liquid outlet are respectively in communication with the second liquid outlet and the second liquid inlet through the two rigid flow tubes.

Images