Cooling liquid adding device, cooler and semiconductor equipment

A technology for adding devices and cooling liquid, which is applied in lighting and heating equipment, semiconductor/solid-state device manufacturing, refrigeration and liquefaction, etc. It can solve problems such as environmental pollution, difficulty in finding coolers in time, and time-consuming and labor-intensive manual liquid addition to avoid Environmental pollution and the effect of reducing TVOC indicators

CN112984877AInactive Publication Date: 2021-06-18SHANGHAI HUALI MICROELECTRONICS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2021-06-18
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a cooling liquid adding device, a cooler and semiconductor equipment. The cooling liquid adding device comprises a liquid storage tank, a controller and a liquid adding pipe, a liquid inlet of the liquid adding pipe is connected with the liquid storage tank, and a liquid outlet of the liquid adding pipe is used for being connected with a liquid adding port of the cooler; the liquid storage tank is used for storing cooling liquid; and the controller is used for controlling the liquid adding pipe to add the cooling liquid in the liquid storage tank into the cooler when the liquid level in the cooler is lower than a preset threshold value. According to the cooling liquid adding device, automatic liquid adding can be completed under the condition that the cooler does not stop, temperature control over the cooler can be guaranteed, the cooler downtime risk is avoided, systematic monitoring can be conducted on the liquid adding process of all coolers of the same model, liquid adding information in the liquid adding process is analyzed, so that the purpose of predicting and checking liquid leakage faults of the equipment is achieved, and meanwhile, environmental pollution can be effectively reduced.
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Description

technical field

[0001] The invention relates to the technical field of semiconductor equipment, in particular to a cooling liquid adding device, a cooler and semiconductor equipment. Background technique

[0002] Advanced semiconductor silicon wafer foundries will use dry etching equipment to complete the corresponding process of silicon wafers. During the dry etching process, a large number of chillers are used to precisely control the temperature during the process. The temperature control components required by semiconductor equipment (such as ESC, chamber wall and Lid, etc.) are connected through the water supply pipeline and return water pipeline of the cooler, and the circulating cooling liquid is used inside the pipeline for temperature exchange control as the temperature control medium of the cooler The coolant (coolant) will be consumed normally as the cooler is used. In this regard, the engineer needs to go to the site to check the liquid level scale line regular...

Examples

Embodiment Construction

[0030] In order to make the object, advantages and characteristics of the present invention clearer, the following combination Figure 1 to Figure 3 The cooling liquid adding device, cooler and semiconductor equipment proposed by the present invention are further described in detail. It should be noted that the drawings are in a very simplified form and all use inaccurate proportions, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention, and are not used to limit the limiting conditions for the implementation of the present invention, so they do not have technical In the substantive meaning above, any modification of structure, change of proportional relationship or adjustment of size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and goals that can be achieved by the present invention. within the scope covered.

[0031] It should...