Cooling liquid adding device, cooler and semiconductor equipment
A technology for adding devices and cooling liquid, which is applied in lighting and heating equipment, semiconductor/solid-state device manufacturing, refrigeration and liquefaction, etc. It can solve problems such as environmental pollution, difficulty in finding coolers in time, and time-consuming and labor-intensive manual liquid addition to avoid Environmental pollution and the effect of reducing TVOC indicators
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2021-06-18
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor equipment, in particular to a cooling liquid adding device, a cooler and semiconductor equipment. Background technique
[0002] Advanced semiconductor silicon wafer foundries will use dry etching equipment to complete the corresponding process of silicon wafers. During the dry etching process, a large number of chillers are used to precisely control the temperature during the process. The temperature control components required by semiconductor equipment (such as ESC, chamber wall and Lid, etc.) are connected through the water supply pipeline and return water pipeline of the cooler, and the circulating cooling liquid is used inside the pipeline for temperature exchange control as the temperature control medium of the cooler The coolant (coolant) will be consumed normally as the cooler is used. In this regard, the engineer needs to go to the site to check the liquid level scale line regular...
Examples
Embodiment Construction
[0030] In order to make the object, advantages and characteristics of the present invention clearer, the following combination Figure 1 to Figure 3 The cooling liquid adding device, cooler and semiconductor equipment proposed by the present invention are further described in detail. It should be noted that the drawings are in a very simplified form and all use inaccurate proportions, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention, and are not used to limit the limiting conditions for the implementation of the present invention, so they do not have technical In the substantive meaning above, any modification of structure, change of proportional relationship or adjustment of size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and goals that can be achieved by the present invention. within the scope covered.
[0031] It should...