Display Devices

By electrically connecting the alignment part or test pad of the input sensor of the display device to the ground pad, the accumulated charge is discharged, and the problem that the input sensor is unreliable due to the accumulation of charge is solved, improving the reliability of the device.

CN112991983BActive Publication Date: 2025-04-11SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202011313383.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2019-12-13
Filing Date
2020-11-20
Publication Date
2025-04-11
Estimated Expiration
2040-11-20

AI Technical Summary

Technical Problem

The input sensor of the display device may be unreliable due to charge accumulation in the alignment pattern or test pads.

Method used

The accumulated charge is prevented from damaging the input sensor by electrically connecting the alignment portion or test pad to the ground pad.

Benefits of technology

Improves the reliability of the input sensor of the display device and prevents damage caused by the accumulation of charge.

✦ Generated by Eureka AI based on patent content.

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Abstract

The display device includes a display panel and an input sensor, the input sensor is disposed on the display panel and has an active area and a peripheral area adjacent to the active area. The input sensor includes: a sensing electrode disposed in the active area; a sensing line disposed in the peripheral area and electrically connected to the sensing electrode; a sensing pad disposed in the peripheral area and electrically connected to the sensing line; a ground pad disposed in the peripheral area and receiving a ground voltage; and a first alignment member disposed in the peripheral area and electrically connected to the ground pad.
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Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0167203, filed on December 13, 2019, which is hereby incorporated by reference in its entirety for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present invention relate generally to display devices, and more particularly, to a display device having an input sensor. Background Art

[0004] The display device displays an image or senses an external input in response to an electrical signal applied thereto. The display device includes a display panel for displaying an image and an input sensor for sensing an external input. The input sensor may include a sensing electrode, a sensing line, and a sensing pad. The sensing line transmits and / or receives a signal.

[0005] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the invention

[0006] Applicants have discovered that input sensors of display devices may be unreliable due to charge that may accumulate in alignment patterns or test pads of the input sensors.

[0007] A display device having an input sensor constructed according to the principles and exemplary embodiments of the present invention provides improved reliability. For example, an alignment portion or a test pad of the input sensor is electrically connected to a ground pad to discharge the charge accumulated in the alignment pattern or the test pad. Therefore, the input sensor of the display device can be prevented from being damaged due to the accumulated charge, and the reliability of the display device is improved.

[0008] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0009] According to one aspect of the present invention, a display device includes: a display panel; and an input sensor, which is disposed on the display panel and has an active area and a peripheral area adjacent to the active area. The input sensor includes: a sensing electrode disposed in the active area; a sensing line disposed in the peripheral area and electrically connected to the sensing electrode; a sensing pad disposed in the peripheral area and electrically connected to the sensing line; a ground pad disposed in the peripheral area and receiving a ground voltage; and a first alignment member disposed in the peripheral area and electrically connected to the ground pad.

[0010] The input sensor may include a test pad disposed in the peripheral region and spaced apart from the sensing pad.

[0011] The test pad may be disposed between the ground pad and the sensing pad.

[0012] The test pad may include a plurality of test pads, and the input sensor further includes a test line connected to the plurality of test pads.

[0013] The test pad may be electrically connected to the ground pad through a connector.

[0014] The input sensor may further include a ground line disposed in the peripheral area and electrically connected to the ground pad.

[0015] A ground wire may surround the active area.

[0016] The first alignment feature may include an alignment key integral with the ground pad.

[0017] The first alignment member may be a first alignment key including an extending portion extending in a first direction and a protruding portion protruding from the extending portion in a second direction intersecting the first direction.

[0018] The extension may be connected to a ground pad.

[0019] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings illustrate exemplary embodiments of the present invention and together with the description serve to explain the inventive concept. The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0021] Figure 1 is a perspective view of an exemplary embodiment of a display device constructed in accordance with the principles of the present invention;

[0022] Figure 2 yes Figure 1 An exploded perspective view of a display device;

[0023] Figure 3 yes Figure 2 A cross-sectional view of an exemplary embodiment of a display module;

[0024] Figure 4 yes Figure 2 A cross-sectional view of another exemplary embodiment of a display module;

[0025] Figure 5 yes Figure 2A plan view of a display panel;

[0026] Figure 6 yes Figure 2 A plan view of the input sensor;

[0027] Fig. 7A is along Figure 6 A cross-sectional view of the input sensor taken along line II';

[0028] Figure 7B is along Figure 6 A cross-sectional view of the input sensor taken along line II-II';

[0029] Figure 8 yes Figure 2 An exploded plan view of an input sensor and a second circuit film;

[0030] Fig. 9 yes Figure 2 A plan view of an input sensor and a second circuit film;

[0031] Fig.10 It shows Figure 8 Area AA' Figure 2 A plan view of another exemplary embodiment of an input sensor of; and

[0032] Fig.11 It shows Figure 8 Area AA' Figure 2 A plan view of another exemplary embodiment of an input sensor. DETAILED DESCRIPTION

[0033] In the following description, for the purpose of illustration, many specific details are set forth in order to provide a thorough understanding of various exemplary embodiments or embodiments of the present invention. As used herein, "embodiment" and "embodiment" are interchangeable words, which are non-limiting examples of devices or methods using one or more inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other examples, known structures and devices are shown in block diagram form to avoid unnecessary confusion of various exemplary embodiments. In addition, various exemplary embodiments may be different, but do not have to be exclusive. For example, without departing from the present invention, the specific shape, configuration and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0034] Unless otherwise specified, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, the features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as "elements") can be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0035] The use of cross hatching and / or shading in the drawings is generally used to clarify the boundaries between adjacent elements. Therefore, unless otherwise stated, the presence or absence of cross hatching or shading cannot convey or indicate a preference or requirement for a specific material, material property, size, ratio, commonality between the elements shown, and / or any other characteristics, attributes, properties, etc. of the element. In addition, in the drawings, the size and relative size of the elements may be exaggerated for clarity and / or description purposes. When the exemplary embodiments can be implemented differently, a specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0036] When an element such as a layer is referred to as being "on", "connected to" or "coupled to" another element or layer, it may be directly on, directly connected to or directly coupled to another element or layer, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there is no intervening element or layer. For this reason, the term "connection" may refer to a physical connection, electrical connection and / or fluid connection with or without an intervening element. In addition, the D1 axis, the D2 axis and the D3 axis are not limited to the three axes of a rectangular coordinate system, such as an x-axis, a y-axis and a z-axis, and may be interpreted in a broader sense. For example, the D1 axis, the D2 axis and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purpose of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0037] Although the terms "first", "second", etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another element. Therefore, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element.

[0038] For descriptive purposes, spatially relative terms such as "below," "beneath," "below," "above," "upper," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein and thereby describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture, in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "below" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "below" may encompass both above and below orientations. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatially relative descriptors used herein should be interpreted accordingly.

[0039] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" are intended to also include the plural forms. In addition, the terms "comprises", "comprising", "includes" and / or "including" when used in this specification specify the presence of the features, wholes, steps, operations, elements, parts and / or groups thereof described, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, parts and / or groups thereof. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms rather than as terms of degree, and thus, are used to allow for inherent deviations in measured values, calculated values ​​and / or provided values ​​that will be recognized by those of ordinary skill in the art.

[0040] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views, which are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Thus, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances should be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be interpreted as being limited to the specific illustrated shapes of the regions, but should include shape deviations due to, for example, manufacturing. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and thus, are not necessarily intended to be limiting.

[0041] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by a person of ordinary skill in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0042] Figure 1 is a perspective view of an exemplary embodiment of a display device DD constructed according to the principles of the present invention, and Figure 2 yes Figure 1 An exploded perspective view of a display device DD.

[0043] refer to Figure 1 and Figure 2 , the display device DD may be a device activated in response to an electrical signal. The display device DD may include various exemplary embodiments. For example, the display device DD may include a tablet computer, a notebook computer, a computer, or a smart TV. In the illustrated exemplary embodiment, for convenience of description, a smart phone is described as an example of the display device DD.

[0044] The display device DD may display an image IM through a front surface FS substantially parallel to a plane defined by the first direction DR1 and the second direction DR2. The front surface FS may include a transmission area TA and a bezel area BZA adjacent to the transmission area TA.

[0045] The display device DD may display an image IM through the transmissive area TA. The image IM may include at least one of a still image and a moving image. Figure 1 As shown in , a clock widget and application icons are shown as examples of the image IM.

[0046] The transmission area TA may have a substantially quadrilateral shape substantially parallel to each of the first direction DR1 and the second direction DR2, but exemplary embodiments are not limited thereto. For example, the transmission area TA may have various shapes.

[0047] The border area BZA may have one or more predetermined colors. The border area BZA may have a relatively lower transmittance than the transmission area TA. The border area BZA may be defined as being adjacent to the transmission area TA. The border area BZA may define the shape of the transmission area TA. The border area BZA may surround the transmission area TA, but exemplary embodiments are not limited thereto. For example, the border area BZA may be provided to be adjacent to only one side of the transmission area TA, or may be omitted. In addition, the display device DD may include various types of display devices, and exemplary embodiments are not limited to a specific type or design.

[0048] The normal direction of the front surface FS may correspond to the thickness direction DR3 (hereinafter referred to as the "third direction") of the display device DD. In the exemplary embodiment shown, the front (or upper) surface and the rear (or lower) surface of each member of the display device DD may be defined according to the direction in which the image IM is displayed. The front surface and the rear surface face each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface is substantially parallel to the third direction DR3. The third direction DR3 may intersect the first direction DR1 and the second direction DR2. The first direction DR1, the second direction DR2, and the third direction DR3 may be substantially perpendicular to each other.

[0049] In addition, in the following description, a plane defined by the first direction DR1 and the second direction DR2 may be defined as a plane, and the expression “viewed in a plan view” means a state of viewing in the third direction DR3 .

[0050] The display device DD may sense an external input TC applied thereto from the outside. The external input TC may include various forms of external inputs, such as a part of a user's body, light, heat, or pressure. In addition, the display device DD may sense other external inputs, such as a proximity input applied when an object such as a stylus pen approaches the display device DD or is adjacent to the display device DD, and a touch input.

[0051] The display device DD may include a window 100, a display module 200, a control module 300, and a housing 400. The window 100 and the housing 400 are coupled to each other to form the exterior of the display device DD.

[0052] The window 100 may be disposed on the display module 200 and may cover the front surface IS of the display module 200. The window 100 may include an optically transparent insulating material. For example, the window 100 may include a glass substrate, a sapphire substrate, or a plastic substrate. The window 100 may have a single-layer or multi-layer structure. In an exemplary embodiment, the window 100 may have a stacked structure of a plurality of plastic films attached to each other by an adhesive or a stacked structure of a glass substrate and a plastic film attached to the glass substrate by an adhesive.

[0053] The window 100 may include a front surface FS exposed to the outside. The front surface FS of the display device DD may be defined by the front surface FS of the window 100.

[0054] The display module 200 may be disposed under the window 100. The display module 200 may display an image IM and may sense an external input TC. The display module 200 may include a front surface IS including an active area AA and a peripheral area NAA. The active area AA may be an area activated by an electrical signal.

[0055] In the illustrated exemplary embodiment, the active area AA may be an area through which the image IM is displayed and the external input TC is sensed substantially at the same time. When viewed in a plan view, the transmissive area TA may overlap the active area AA. For example, the transmissive area TA may substantially overlap the entire surface or at least a portion of the active area AA. Therefore, the user observes the image IM or provides the external input TC through the transmissive area TA, but the exemplary embodiment is not limited thereto. For example, in the active area AA, the area through which the image IM is displayed and the area through which the external input TC is sensed may be separated from each other, but the exemplary embodiment is not limited thereto.

[0056] The peripheral area NAA may be covered by the border area BZA. The display module 200 may be assembled in a flat state so that the peripheral area NAA faces the window 100, but the exemplary embodiment is not limited thereto. A portion of the peripheral area NAA may be bent. In this case, the portion of the peripheral area NAA may be bent toward the rear surface of the display module 200, and thus, the border area BZA may be reduced in the front surface FS of the display device DD. In another exemplary embodiment, the display module 200 may have a partially curved shape in the active area AA, but the exemplary embodiment is not limited thereto. According to another exemplary embodiment, the peripheral area NAA may be omitted.

[0057] The display module 200 may include a display panel DP, an input sensor such as an input sensor ISP, a first circuit film CF1, and a second circuit film CF2.

[0058] The display panel DP may include a configuration suitable for generating an image IM. The image IM generated by the display panel DP may be displayed in the front surface IS through the transmission area TA and may be observed by the user from the outside. According to an exemplary embodiment, the display panel DP may be a light-emitting display panel, but the exemplary embodiment is not limited thereto. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots and quantum rods.

[0059] The input sensor ISP may be disposed on the display panel DP. The input sensor ISP may sense an external input TC applied thereto from the outside.

[0060] The first circuit film CF1 may be electrically connected to the display panel DP. The first circuit film CF1 may connect the display panel DP and the controller 310. In the illustrated exemplary embodiment, the first circuit film CF1 is implemented by a flexible circuit film. However, the exemplary embodiment is not limited thereto. For example, the first circuit film CF1 may not be connected to the controller 310.

[0061] The first circuit film CF1 may include a circuit chip. The circuit chip may be mounted on the first circuit film CF1 in a chip on film (COF) manner. The circuit chip may transmit an electrical signal to the display panel DP. For example, the circuit chip may generate an electrical signal for operating the display panel DP based on a control signal provided from the controller 310, but the exemplary embodiment is not limited thereto. The circuit chip according to the exemplary embodiment may be omitted.

[0062] The second circuit film CF2 may be electrically connected to the input sensor ISP. The second circuit film CF2 may connect the input sensor ISP and the controller 310. In the illustrated exemplary embodiment, the second circuit film CF2 is implemented by a flexible circuit film.

[0063] When viewed in a plan view, the first circuit film CF1 may be disposed at a lower end of the display module 200. When viewed in a plan view, the second circuit film CF2 may be disposed at an upper end of the display module 200. Therefore, the peripheral area NAA of the lower end of the display module 200 may be reduced.

[0064] The control module 300 may be disposed below the display module 200. The control module 300 may include a controller 310 and a power supply 320.

[0065] The controller 310 may provide an electrical signal to the display module 200. The controller 310 may include various functional modules configured to operate the display module 200 and a connector configured to provide power. The functional modules may include a wireless communication module, an image input module, a sound input module, a memory, an external interface, a light emitting module, a light receiving module, and a camera module. The functional modules may be mounted on a mainboard. The mainboard may include a rigid printed circuit board. Some functional modules may be electrically connected to the mainboard via a flexible circuit film without being mounted on the mainboard.

[0066] Each of the first circuit film CF1 and the second circuit film CF2 may be connected to the controller 310, but the exemplary embodiment is not limited thereto. In the display module 200 according to the exemplary embodiment, the display panel DP and the input sensor ISP may be connected to different controllers from each other, and one of the first circuit film CF1 and the second circuit film CF2 may not be connected to the controller 310, but the exemplary embodiment is not limited thereto.

[0067] The power supply 320 may provide power for the overall operation of the display device DD. The power supply 320 may include a conventional battery module.

[0068] The housing 400 may be disposed under the control module 300. The housing 400 may form the exterior of the display device DD together with the window 100. Compared with the display module 200, the housing 400 may include a material having relatively high rigidity.

[0069] refer to Figure 2 , the housing 400 formed as a single body is used as an example for explanation, but the exemplary embodiment is not limited thereto. According to other exemplary embodiments, the housing 400 may include a plurality of bodies assembled to each other. For example, the housing 400 may include a plurality of frames and / or plates formed of glass, plastic, or metal materials. The housing 400 may provide a predetermined accommodation space. The display module 200 and the control module 300 may be accommodated in the accommodation space and may be protected from external impacts.

[0070] Figure 3 yes Figure 2 2 is a cross-sectional view of a display module 200. Figure 3 , the display module 200 may include a display panel DP, an input sensor ISP, and a coupling member SLM.

[0071] The display panel DP may include a first base layer BL, a display circuit layer ML, and a display element layer EML. The first base layer BL may be a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or a stacked structure including a plurality of insulating layers. The display circuit layer ML may be disposed on the first base layer BL. The display circuit layer ML may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The conductive layer may form a signal line or a pixel control circuit. The display element layer EML may be disposed on the display circuit layer ML. The display element layer EML may generate light or may control light transmittance. For example, the display element layer EML of an organic light emitting display panel may include an organic light emitting material. The display element layer EML of a quantum dot light emitting display panel may include at least one of a quantum dot and a quantum rod. The display element layer EML of a liquid crystal display panel may include a liquid crystal layer.

[0072] The input sensor ISP may include a second base layer CBL and a sensing circuit layer ML-T. The second base layer CBL may be disposed on the display element layer EML. The second base layer CBL may be a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or a stacked structure including a plurality of insulating layers. A predetermined space is defined between the second base layer CBL and the display element layer EML. The space may be filled with air or an inert gas. In addition, in an exemplary embodiment, the space may be filled with a filler such as a silicone-based polymer, an epoxy-based resin, or an acrylic-based resin. The sensing circuit layer ML-T may be disposed on the second base layer CBL. The sensing circuit layer ML-T may include a plurality of insulating layers and a plurality of conductive layers. The conductive layer may include a sensing electrode for sensing an external input TC, a sensing line connected to the sensing electrode, and a sensing pad connected to the sensing line.

[0073] The coupling member SLM may be disposed between the first base layer BL and the second base layer CBL. The coupling member SLM may couple the first base layer BL and the second base layer CBL. The coupling member SLM may include an organic material such as a photocurable resin or a photoplastic resin, or may include an inorganic material such as a sealing glass frit, but it should not be particularly limited.

[0074] Figure 4 yes Figure 2 A cross-sectional view of another exemplary embodiment of a display module 200-1 is shown. Figure 4 For ease of description, the same reference numerals are used throughout Figure 3 , and thus, detailed descriptions of the same elements will be omitted to avoid redundancy.

[0075] refer to Figure 4 , the display module 200-1 may include a display panel DP-1 and an input sensor ISP-1. The display panel DP-1 may include a first base layer BL, a display circuit layer ML, a display element layer EML, and a thin film encapsulation layer TFE. The input sensor ISP-1 may include a thin film encapsulation layer TFE and a sensing circuit layer ML-T. Figure 4 The thin film encapsulation layer TFE and Figure 3 The second base layer CBL may be substantially the same element.

[0076] According to an exemplary embodiment, the display panel DP-1 and the input sensor ISP-1 may be formed by a continuous process. For example, the sensing circuit layer ML-T may be directly formed on the thin film encapsulation layer TFE. In another exemplary embodiment, the sensing circuit layer ML-T may be directly formed on the first base layer BL.

[0077] Figure 5 yes Figure 2 A plan view of the display panel DP.

[0078] refer to Figure 5 The display panel DP may include a base layer BL, a plurality of pixels PX, a plurality of signal lines GL, DL, PL, and EL, and a plurality of display pads PDD. The signal lines GL, DL, PL, and EL and the display pads PDD may form Figure 3 The display circuit layer ML.

[0079] The active area AA of the display panel DP may be a region through which the display Figure 1 The pixels PX may be arranged in the active area AA. The peripheral area NAA may be a region in which a driving circuit or a driving line is disposed.

[0080] The signal lines GL, DL, PL, and EL may be connected to the pixels PX to transmit electrical signals to the pixels PX. Figure 5 , the scan line GL, the data line DL, the power line PL, and the light emission control line EL among the signal lines included in the display panel DP are shown as examples, but the exemplary embodiment is not limited thereto. For example, the signal lines included in the display panel DP may further include an initialization voltage line.

[0081] The power pattern VDD may be disposed in the peripheral area NAA. The power pattern VDD may be connected to the plurality of power lines PL. Therefore, since the display panel DP includes the power pattern VDD, the pixel PX may receive a substantially constant first power signal.

[0082] When viewed in a plan view, the display pad PDD may be disposed at a lower end of the display panel DP. The display pad PDD may include a first pad D1 and a second pad D2. The first pad D1 may be provided in plurality, and the first pads D1 may be respectively connected to the data lines DL. The second pad D2 may be connected to the power pattern VDD to be electrically connected to the power line PL. The display panel DP may provide an electrical signal provided from the outside through the display pad PDD to the pixel PX. The display pad PDD may further include pads for receiving other electrical signals in addition to the first pad D1 and the second pad D2, but exemplary embodiments are not limited thereto.

[0083] Figure 6 yes Figure 2 The floor plan of the input sensor ISP, Fig. 7A is along Figure 6 A cross-sectional view of the input sensor ISP taken along line I-I', and Figure 7B is along Figure 6 A cross-sectional view of the input sensor ISP taken along line II-II'.

[0084] refer to Figure 6 , Fig. 7A and Figure 7B , the input sensor ISP may include an active area AA-I and a peripheral area NAA-I defined as being adjacent to the active area AA-I, the active area AA-I and the peripheral area NAA-I being defined in the input sensor ISP. The peripheral area NAA-I may surround the active area AA-I. The active area AA-I may correspond to Figure 5 The peripheral area NAA-I may correspond to Figure 5 The peripheral area NAA.

[0085] The input sensor ISP may include a second base layer CBL, a plurality of sensing electrodes TE1 and TE2, a plurality of sensing lines TL1, TL2, and TL3, a plurality of sensing pads PDT, a ground line GNL, a plurality of ground pads GNP-1 and GNP-2, a plurality of first alignment members such as alignment keys ALK-1 and ALK-2, and a plurality of test pads DTP-1 and DTP-2. The sensing electrodes TE1 and TE2, the sensing lines TL1, TL2, and TL3, the sensing pads PDT, the ground lines GNL, the ground pads GNP-1 and GNP-2, the alignment keys ALK-1 and ALK-2, and the test pads DTP-1 and DTP-2 may form Figure 3 The sensing circuit layer ML-T.

[0086] The plurality of sensing electrodes TE1 and TE2 may include first and second sensing electrodes TE1 and TE2. The first and second sensing electrodes TE1 and TE2 may be disposed in the active area AA-I. The input sensor ISP may obtain information about an external input TC based on a capacitance change between the first and second sensing electrodes TE1 and TE2.

[0087] The first sensing electrode TE1 may include a plurality of first portions SP1 and a plurality of second portions BP1. The first sensing electrode TE1 may extend in the first direction DR1 and may be arranged in the second direction DR2. At least one second portion BP1 may be connected to two first portions SP1 adjacent to each other. The first portion SP1 may be referred to as a first sensing pattern. The second portion BP1 may be referred to as a first connection pattern.

[0088] The second sensing electrode TE2 may include a plurality of sensing patterns SP2 and a plurality of bridge patterns BP2. The second sensing electrode TE2 may extend in the second direction DR2 and may be arranged in the first direction DR1. At least one bridge pattern BP2 may be connected to two sensing patterns SP2 adjacent to each other. The sensing pattern SP2 may be referred to as a second sensing pattern. The bridge pattern BP2 may be referred to as a second connection pattern.

[0089] A plurality of bridge patterns BP2 may be disposed on the second base layer CBL. A first insulating layer IS-IL1 may be disposed on the second base layer CBL and the plurality of bridge patterns BP2. A plurality of first portions SP1, a plurality of sensing patterns SP2, and a plurality of second portions BP1 may be disposed on the first insulating layer IS-IL1. A plurality of first portions SP1 and a plurality of sensing patterns SP2 according to an exemplary embodiment may be disposed on the same layer. The plurality of first portions SP1 may be electrically connected to the plurality of second portions BP1. The first insulating layer IS-IL1 may define at least one opening. The plurality of sensing patterns SP2 may be electrically connected to the plurality of bridge patterns BP2 through the opening. The second insulating layer IS-IL2 may be disposed on the plurality of first portions SP1, the plurality of sensing patterns SP2, and the plurality of second portions BP1.

[0090] The sensing lines TL1, TL2, and TL3 may be disposed in the peripheral area NAA-I. The sensing lines TL1, TL2, and TL3 may include a first sensing line TL1, a second sensing line TL2, and a third sensing line TL3.

[0091] The first sensing line TL1 may be connected to the first sensing electrode TE1. The second sensing line TL2 may be connected to one end of the second sensing electrode TE2. The third sensing line TL3 may be connected to the other end of the second sensing electrode TE2. The other end of the second sensing electrode TE2 connected to the third sensing line TL3 may be opposite to one end of the second sensing electrode TE2 connected to the second sensing line TL2.

[0092] According to the exemplary embodiment shown, the second sensing electrode TE2 may be connected to the second sensing line TL2 and the third sensing line TL3. Therefore, substantially uniform sensitivity may be maintained with respect to the area of ​​the second sensing line TL2 having a relatively longer length than that of the first sensing electrode TE1. However, the exemplary embodiment is not limited thereto. For example, the third sensing line TL3 may be omitted.

[0093] The sensing pad PDT may be disposed in the peripheral area NAA-I. When viewed in a plan view, the sensing pad PDT may be disposed at an upper end of the input sensor ISP. The sensing pad PDT may include a first sensing pad TP1, a second sensing pad TP2, and a third sensing pad TP3. The first sensing pad TP1 may be connected to the first sensing line TL1 and may be electrically connected to the first sensing electrode TE1. The second sensing pad TP2 may be connected to the second sensing line TL2, and the third sensing pad TP3 may be connected to the third sensing line TL3. Therefore, the second sensing pad TP2 and the third sensing pad TP3 may be electrically connected to the second sensing electrode TE2.

[0094] The ground line GNL may be disposed in the peripheral area NAA-I. The ground line GNL may surround the active area AA-I. For example, the ground line GNL may surround the first sensing electrode TE1 and the second sensing electrode TE2 and the first sensing line TL1, the second sensing line TL2, and the third sensing line TL3. The ground line GNL may discharge charges introduced from the outside through the ground pads GNP-1 and GNP-2.

[0095] The ground pads GNP-1 and GNP-2 may be disposed in the peripheral area NAA-I. The ground pads GNP-1 and GNP-2 may be spaced apart from the sensing pads PDT disposed at the outermost position in the first direction DR1, respectively. The ground pads GNP-1 and GNP-2 may include a first ground pad GNP-1 and a second ground pad GNP-2. The ground pads GNP-1 and GNP-2 may be electrically connected to the ground line GNL. For example, the first ground pad GNP-1 may be electrically connected to one end of the ground line GNL, and the second ground pad GNP-2 may be electrically connected to the other end of the ground line GNL. The ground pads GNP-1 and GNP-2 may be electrically connected to Figure 2 The ground pads GNP-1 and GNP-2 may receive a ground voltage from the ground power source.

[0096] The alignment keys ALK-1 and ALK-2 may be disposed in the peripheral area NAA-I. The second circuit film CF2 and the input sensor ISP may be aligned using the alignment keys ALK-1 and ALK-2. The alignment keys ALK-1 and ALK-2 may be electrically connected to the ground pads GNP-1 and GNP-2, respectively. The alignment keys ALK-1 and ALK-2 may be formed of the same material and in the same process as the ground pads GNP-1 and GNP-2.

[0097] According to the exemplary embodiment shown, each of the alignment keys ALK-1 and ALK-2 may be electrically connected to a ground power source. Charge introduced into the alignment keys ALK-1 and ALK-2 may be discharged through the ground pads GNP-1 and GNP-2. By discharging the charge through the ground pads GNP-1 and GNP-2, charge accumulation on the alignment keys ALK-1 and ALK-2 may be prevented. Therefore, the sensing lines TL1, TL2, and TL3 may be prevented from being damaged by charges accumulated on each of the alignment keys ALK-1 and ALK-2 and then discharged and introduced into the sensing lines TL1, TL2, and TL3. Therefore, the reliability of the display device DD may be improved.

[0098] The test pads DTP-1 and DTP-2 may be disposed in the peripheral area NAA-I. The test pads DTP-1 and DTP-2 may be spaced apart from the sensing pad PDT in the first direction DR1. The test pads DTP-1 and DTP-2 may be disposed between the ground pads GNP-1 and GNP-2 and the sensing pad PDT. The test pads DTP-1 and DTP-2 may be used to test Figure 2 The second circuit film CF2 and the sensing pad PDT are combined with each other. The test pads DTP-1 and DTP-2 may include a first test pad DTP-1 and a second test pad DTP-2. The first test pad DTP-1 and the second test pad DTP-2 may be electrically connected to each other.

[0099] Figure 8 yes Figure 2 Input sensors and Figure 2 an exploded plan view of a second circuit film, and Fig. 9 yes Figure 2 Input sensors and Figure 2 A plan view of the second circuit film.

[0100] refer to Figure 8 and Fig. 9 , the sensing pad PDT, the test pads DTP-1 and DTP-2, and the ground pads GNP-1 and GNP-2 may be arranged in the first direction DR1. The sensing pad PDT and the test pads DTP-1 and DTP-2 may be arranged between the first ground pad GNP-1 and the second ground pad GNP-2. The test pads DTP-1 and DTP-2 may be arranged between the sensing pad PDT and the first ground pad GNP-1.

[0101] Each of the alignment keys ALK-1 and ALK-2 may include an extension portion EXP and a protrusion portion PTP. The extension portion EXP may extend in a first direction DR1. The extension portion EXP may extend in a direction away from the sensing pad PDT. The protrusion portion PTP may protrude from the extension portion EXP in a second direction DR2 or a direction opposite to the second direction DR2. For example, the protrusion portion PTP may protrude from the extension portion EXP in a direction intersecting the first direction DR1. The extension portion EXP may be connected to the ground pads GNP-1 and GNP-2. The protrusion portion PTP may face at least one of the sensing lines TL1, TL2, and TL3. The alignment keys ALK-1 and ALK-2 may include a first alignment key ALK-1 and a second alignment key ALK-2.

[0102] According to the exemplary embodiment shown, the alignment keys ALK-1 and ALK-2 may be electrically connected to the ground pads GNP-1 and GNP-2, respectively. The charges introduced into the alignment keys ALK-1 and ALK-2 may be discharged through the ground pads GNP-1 and GNP-2. The charges may be prevented from accumulating on the alignment keys ALK-1 and ALK-2. Therefore, the sensing lines TL1, TL2, and TL3 may be prevented from being damaged due to the charges accumulated on the alignment keys ALK-1 and ALK-2, then discharged, and then introduced into the sensing lines TL1, TL2, and TL3 through the protruding portion PTP. Therefore, the reliability of the display device DD may be improved.

[0103] The alignment keys ALK-1 and ALK-2 may be integrally provided with the ground pads GNP-1 and GNP-2, respectively. The first alignment key ALK-1 may be integrally formed with the first ground pad GNP-1. The second alignment key ALK-2 may be integrally formed with the second ground pad GNP-2.

[0104] According to the exemplary embodiment shown, since a separate line is not required to connect the alignment keys ALK-1 and ALK-2 to the ground pads GNP-1 and GNP-2, the processing time of manufacturing can be shortened. In addition, the charge introduced into the alignment keys ALK-1 and ALK-2 can be discharged through the ground pads GNP-1 and GNP-2. The alignment keys ALK-1 and ALK-2 can be directly connected to the ground pads GNP-1 and GNP-2 that receive the ground voltage. Therefore, the charge introduced into the alignment keys ALK-1 and ALK-2 can be easily discharged through the ground pads GNP-1 and GNP-2. The charge can be prevented from accumulating on the alignment keys ALK-1 and ALK-2. Therefore, the sensing lines TL1, TL2, and TL3 can be prevented from being damaged due to the charge accumulated on the alignment keys ALK-1 and ALK-2 and then discharged and then introduced into the sensing lines TL1, TL2, and TL3 through the protruding portion PTP. Therefore, the reliability of the display device DD can be improved.

[0105] The conductive adhesive member AF may be disposed between the second circuit film CF2 and the input sensor ISP. The conductive adhesive member AF may couple the second circuit film CF2 to the input sensor ISP. The conductive adhesive member AF may be disposed on the sensing pad PDT, the test pads DTP-1 and DTP-2, and the ground pads GNP-1 and GNP-2.

[0106] When viewed in a plan view, the conductive adhesive member AF may overlap the peripheral area NAA-I. The conductive adhesive member AF may extend in the first direction DR1. The conductive adhesive member AF may have conductive properties and adhesive properties. Therefore, the conductive adhesive member AF may physically connect the second circuit film CF2 and electrically connect it to the input sensor ISP. The conductive adhesive member AF may include an anisotropic conductive adhesive film (ACF).

[0107] The second circuit film CF2 may include a base film BF, a plurality of sensing pads PDT-F, a plurality of sensing lines SL-F, a plurality of test pads DTP-F1 and DTP-F2, a plurality of test lines DTL-F1 and DTL-F2, a plurality of ground pads GNP-F1 and GNP-F2, a plurality of ground lines GNL-F1 and GNL-F2, and a plurality of second alignment members such as alignment patterns ALP-1 and ALP-2.

[0108] The base film BF may have a flexible property and an insulating property. Therefore, the second circuit film CF2 may be bent together with the input sensor ISP after being coupled with the input sensor ISP.

[0109] Sensing pads PDT-F, sensing lines SL-F, test pads DTP-F1 and DTP-F2, test lines DTL-F1 and DTL-F2, ground pads GNP-F1 and GNP-F2, ground lines GNL-F1 and GNL-F2, and alignment patterns ALP-1 and ALP-2 may be disposed on the base film BF.

[0110] The sensing pads PDT-F may be connected to one end of the sensing lines SL-F, respectively. The other end of each of the sensing lines SL-F may be electrically connected to Figure 2 The controller 310 of FIG. 310. Therefore, the electrical signal processed by the controller 310 may be output to the sensing pads PDT-F through the sensing lines SL-F. Each of the sensing pads PDT-F may be referred to as a film sensing pad.

[0111] When viewed in a plan view, the sensing pads PDT-F may overlap with the sensing pads PDT of the input sensor ISP, respectively. The sensing pads PDT-F may be connected to the sensing pads PDT of the input sensor ISP, respectively.

[0112] The test pads DTP-F1 and DTP-F2 may include a first test pad DTP-F1 and a second test pad DTP-F2. The test lines DTL-F1 and DTL-F2 may include a first test line DTL-F1 and a second test line DTL-F2. The first test pad DTP-F1 may be connected to one end of the first test line DTL-F1. The second test pad DTP-F2 may be connected to one end of the second test line DTL-F2.

[0113] When viewed in a plan view, the first test pad DTP-F1 may overlap with the first test pad DTP-1 of the input sensor ISP. The first test pad DTP-F1 may be connected to the first test pad DTP-1 of the input sensor ISP. When viewed in a plan view, the second test pad DTP-F2 may overlap with the second test pad DTP-2 of the input sensor ISP. The second test pad DTP-F2 may be connected to the second test pad DTP-2 of the input sensor ISP.

[0114] A defect in the connection between the second circuit film CF2 and the input sensor ISP may be tested by calculating a resistance value between the second circuit film CF2 and the input sensor ISP by means of a voltage supplied through the test lines DTL-F1 and DTL-F2.

[0115] The ground pads GNP-F1 and GNP-F2 may include a first ground pad GNP-F1 and a second ground pad GNP-F2. The ground wires GNL-F1 and GNL-F2 may include a first ground wire GNL-F1 and a second ground wire GNL-F2. The first ground pad GNP-F1 may be connected to one end of the first ground wire GNL-F1. The other end of the first ground wire GNL-F1 may be connected to a ground power source. The second ground pad GNP-F2 may be connected to one end of the second ground wire GNL-F2. The other end of the second ground wire GNL-F2 may be connected to a ground power source. The ground power source may transmit a ground voltage, but the exemplary embodiment is not limited thereto. Each of the ground wires GNL-F1 and GNL-F2 according to the exemplary embodiment may be connected to a different ground power source.

[0116] When viewed in a plan view, the first ground pad GNP-F1 may overlap with the first ground pad GNP-1 of the input sensor ISP. The first ground pad GNP-F1 may be connected to the first ground pad GNP-1 of the input sensor ISP. When viewed in a plan view, the second ground pad GNP-F2 may overlap with the second ground pad GNP-2 of the input sensor ISP. The second ground pad GNP-F2 may be connected to the second ground pad GNP-2 of the input sensor ISP.

[0117] The alignment patterns ALP-1 and ALP-2 may include a first alignment pattern ALP-1 and a second alignment pattern ALP-2. The first alignment pattern ALP-1 may be spaced apart from the first ground pad GNP-F1 in the first direction DR1. The second alignment pattern ALP-2 may be spaced apart from the second ground pad GNP-F2 in the first direction DR1. In an exemplary embodiment, as discussed below, each of the first alignment pattern ALP-1 and the second alignment pattern ALP-2 may define a concave portion to facilitate alignment.

[0118] When viewed in a plan view, the first alignment pattern ALP-1 may be aligned with the first alignment key ALK-1. When viewed in a plan view, the first alignment pattern ALP-1 and the first alignment key ALK-1 may be aligned with each other to form a first alignment mark ALN-1. When viewed in a plan view, the second alignment pattern ALP-2 may be aligned with the second alignment key ALK-2. When viewed in a plan view, the second alignment pattern ALP-2 and the second alignment key ALK-2 may be aligned with each other to form a second alignment mark ALN-2 ( Fig. 9 ). For example, when viewed in a plan view, the protruding portion PTP of each of the first alignment key ALK-1 and the second alignment key ALK-2 may be properly aligned when visually inserted into the concave portions of the first alignment pattern ALP-1 and the second alignment pattern ALP-2, respectively.

[0119] Through the first and second alignment marks ALN-1 and ALN-2, reliability of electrical connection between the second circuit film CF2 and the input sensor ISP may be improved.

[0120] Fig.10 It shows Figure 8 Area AA' Figure 2 A plan view of another exemplary embodiment of an input sensor of FIG. Fig.10 For ease of description, the same reference numerals are used throughout Figure 8 , and thus, detailed descriptions of the same elements will be omitted to avoid redundancy.

[0121] refer to Fig.10 A connector such as a bridge BRG may be provided between the test pad DTP1 and the ground pad GNP1. The bridge BRG may extend in the first direction DR1. The bridge BRG may electrically connect the test pad DTP1 and the ground pad GNP1.

[0122] According to the exemplary embodiment shown, the charges introduced into the test pad DTP1 and the alignment key ALK can be discharged through the ground pad GNP1. The charges can be prevented from being accumulated on the test pad DTP1 and the alignment key ALK. Figure 8 The sensing lines TL1, TL2, and TL3 are damaged due to charges that are discharged after being accumulated on the test pad DTP1 and the alignment key ALK and then introduced into the sensing lines TL1, TL2, and TL3. Therefore, the reliability of the display device DD may be improved.

[0123] Fig.11 It shows Figure 8 Area AA' Figure 2 A plan view of another exemplary embodiment of an input sensor of FIG. Fig.11 For ease of description, the same reference numerals are used throughout Figure 8 , and thus, detailed descriptions of the same elements will be omitted to avoid redundancy.

[0124] refer to Fig.11 , the test pad DTP2 may be provided in a single form. Since the test pad DTP2 is provided in a single form, the area for disposing the sensing pad PDT, the test pad DTP2, and the ground pad GNP2 may be reduced. The test pad DTP2 may be electrically connected to the ground pad GNP2. The test pad DTP2 may be electrically connected to Figure 8 The second circuit film CF2 Figure 8 The ground pad GNP2 can be electrically connected to the second test line DTL-F2. Figure 8 The second circuit film CF2 Figure 8 The first test line DTL-F1 and Figure 8 The first ground line GNL-F1 can be calculated by using the test pad DTP2 and the ground pad GNP2. Figure 8 The second circuit film CF2 and Figure 8 The resistance value between the input sensor ISP is checked Figure 8 A defect in the connection between the second circuit film CF2 and the input sensor ISP.

[0125] According to the exemplary embodiment shown, the charge introduced into the alignment key ALK can be discharged through the ground pad GNP2. The charge can be prevented from accumulating on the alignment key ALK. Therefore, the Figure 8 The sensing lines TL1, TL2, and TL3 are damaged due to charges that are discharged after being accumulated on the align key ALK and then introduced into the sensing lines TL1, TL2, and TL3. Therefore, the reliability of the display device DD may be improved.

[0126] Although certain exemplary embodiments and examples have been described herein, other embodiments and modifications will be apparent from this specification. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and to various obvious modifications and equivalent arrangements that will be apparent to those of ordinary skill in the art.

Claims

1. Display equipment, including: Display panel; as well as An input sensor is disposed on the display panel and has an active area and a peripheral area adjacent to the active area, the input sensor comprising: A sensing electrode is disposed in the effective area; a sensing line disposed in the peripheral region and electrically connected to the sensing electrode; a sensing pad disposed in the peripheral region and electrically connected to the sensing line; a ground pad disposed in the peripheral region and receiving a ground voltage; and a first alignment member disposed in the peripheral region and electrically connected to the ground pad and including an extending portion extending in a first direction and a protruding portion protruding from the extending portion in a second direction intersecting the first direction, and a circuit film disposed on the input sensor, the circuit film including a second alignment member aligned with the protruding portion of the first alignment member by surrounding an end portion of the protruding portion of the first alignment member, The ground pad and the sensing pad are arranged side by side in the first direction and extend in the second direction.

2. The display device according to claim 1, wherein: The input sensor further includes a test pad disposed in the peripheral region and spaced apart from the sensing pad.

3. The display device according to claim 2, wherein: The test pad is disposed between the ground pad and the sensing pad.

4. The display device according to claim 2, wherein: The test pad includes a plurality of test pads, and The input sensor further includes test lines connected to the plurality of test pads.

5. The display device according to claim 2, wherein: The test pad is electrically connected to the ground pad.

6. The display device according to claim 1, wherein: The input sensor further includes a ground line disposed in the peripheral region and electrically connected to the ground pad.

7. The display device according to claim 6, wherein: The ground line surrounds the active area.

8. The display device according to claim 1, wherein: The first alignment feature includes an alignment key integral with the ground pad.

9. The display device according to claim 1, wherein: The extending portion of the first alignment member extends from a middle portion of a long side of the ground pad in the first direction, and the protruding portion extends from a middle portion of a long side of the extending portion in the second direction.

10. The display device according to claim 1, wherein: The extending portion is connected to the ground pad.

11. The display device according to claim 1, wherein: The input sensor further includes a plurality of test pads disposed in the peripheral area and spaced apart from the sensing pads, Wherein, adjacent test pads among the plurality of test pads are directly connected to each other through wiring.

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