Display device

Abstract

The present disclosure relates to a display device comprising: a display panel having a light-emitting region from which light is emitted; and an input sensor disposed on the display panel. The input sensor comprises: a first conductive layer; a first insulating layer disposed on the first conductive layer and provided with a diffraction grating defined therein to correspond to the light-emitting region; and a second conductive layer disposed on and connected to the first insulating layer. The first insulating layer comprises an organic layer covering the first conductive layer and an inorganic layer disposed on the organic layer. The organic layer and the inorganic layer include a plurality of apertures defined therein to define the diffraction grating.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0168981, filed on December 17, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Embodiments of the present invention generally relate to a display device and a method of manufacturing the display device, and more particularly, to a display device having improved viewing angle characteristics and a method of manufacturing the display device. Background Art

[0004] Display devices are categorized into self-luminous display devices and light-receiving display devices. Self-luminous display devices use their light-emitting elements to emit light to display images, while light-receiving display devices control the transmittance of the light provided to them to display images. An example of a self-luminous display device is an organic light-emitting display device. Light generated by the light-emitting layer of an organic light-emitting display device travels in both side and front directions.

[0005] Organic light-emitting display devices include organic light-emitting diodes (OLEDs) that generate light. However, compared to the front light-emitting properties of the OLEDs, the side light-emitting properties of the OLEDs are reduced, resulting in a phenomenon in which the brightness of the OLEDs at side viewing angles is lower than that at front viewing angles.

[0006] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the Invention

[0007] Additional features of the present inventive concept will be set forth in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the present inventive concept.

[0008] One or more embodiments of the present disclosure provide a display device having improved viewing angle characteristics and enhanced display quality.

[0009] One or more embodiments of the present disclosure provide a method of manufacturing a display device.

[0010] According to one or more embodiments of the present invention, a display device includes: a display panel having a light-emitting region from which light is emitted; and an input sensor disposed on the display panel. The input sensor includes: a first conductive layer; a first insulating layer disposed on the first conductive layer and provided with a diffraction grating defined therein to correspond to the light-emitting region; and a second conductive layer disposed on and connected to the first insulating layer. The first insulating layer includes an organic layer covering the first conductive layer and an inorganic layer disposed on the organic layer. The organic layer and the inorganic layer include a plurality of apertures defined therein to define the diffraction grating.

[0011] According to one or more embodiments, each of the holes may include a first hole penetrating the inorganic layer and a second hole penetrating the organic layer, and the first hole and the second hole may be aligned with each other.

[0012] According to one or more embodiments, each of the holes may have a depth substantially the same as a thickness of the first insulating layer.

[0013] According to one or more embodiments, the second conductive layer may include a sensing pattern defining an opening therethrough, and the opening overlaps the diffraction grating when viewed in a plane.

[0014] According to one or more embodiments, the input sensor may further include a second insulating layer covering the second conductive layer, and the second insulating layer may be filled in the hole.

[0015] According to one or more embodiments, the second insulating layer may have a refractive index different from that of the first insulating layer.

[0016] According to one or more embodiments, the second insulating layer may be provided with an opening defined through the second insulating layer to expose the diffraction grating, and the input sensor may further include a third insulating layer covering the first insulating layer and the second insulating layer and being filled in the hole.

[0017] According to one or more embodiments, the refractive index of the first insulating layer, the refractive index of the second insulating layer, and the refractive index of the third insulating layer may be different from each other.

[0018] According to one or more embodiments, the input sensor may further include a base insulating layer, and the first conductive layer is in contact with the base insulating layer.

[0019] According to one or more embodiments, the base insulating layer may be an organic layer.

[0020] According to one or more embodiments, the display panel may include: a base layer; a circuit element layer arranged on the base layer; a display element layer arranged on the circuit element layer; and an encapsulation layer arranged on the display element layer, and the base insulating layer is directly arranged on the encapsulation layer.

[0021] According to one or more embodiments, the holes may be arranged at regular intervals, and at least one of the holes may extend to a portion of the base insulating layer after penetrating the inorganic layer and the organic layer.

[0022] According to one or more embodiments, the inorganic layer may have a thickness smaller than that of the organic layer.

[0023] According to one or more embodiments, the organic layer may be provided with a first through hole defined through the organic layer to expose a portion of the first conductive layer, and the inorganic layer extending to the first through hole to cover a portion of the first conductive layer may be provided with a second through hole to expose another portion of the first conductive layer.

[0024] According to one or more embodiments, the inorganic layer may have a refractive index different from that of the organic layer.

[0025] According to one or more embodiments, the refractive index of the organic layer may be equal to or greater than about 0.7 and equal to or less than about 3, and the refractive index of the inorganic layer may be equal to or greater than about 0.3 and equal to or less than about 1.

[0026] According to one or more embodiments, the organic layer may include a non-photosensitive material.

[0027] According to one or more embodiments of the present invention, a method for manufacturing a display device includes forming a display panel having a light-emitting region defined therein for emitting light, and forming an input sensor disposed on the display panel. Forming the input sensor includes forming a first conductive layer, forming a first insulating layer including an organic layer covering the first conductive layer and an inorganic layer disposed on the organic layer, forming a second conductive layer disposed on the first insulating layer and connected to the first conductive layer via contact holes, forming a plurality of holes defining a diffraction grating in the first insulating layer, and forming a second insulating layer covering the second conductive layer and the first insulating layer.

[0028] According to one or more embodiments, the forming of the first insulating layer includes: forming the organic layer through which the first through hole is defined to expose a portion of the first conductive layer, forming the inorganic layer on the organic layer to cover the inner wall of the first through hole, forming a photoresist layer on the inorganic layer, using a mask to form a first photoresist pattern layer from the photoresist layer including a base portion through which an opening is defined and a protrusion protruding from the base portion, forming a second through hole passing through the inorganic layer, and forming a second photoresist pattern layer including a pattern corresponding to the protrusion from the first photoresist pattern layer.

[0029] According to one or more embodiments, the forming of the first insulating layer may include: forming the organic layer to cover the first conductive layer, forming the inorganic layer on the organic layer, forming a photoresist layer on the inorganic layer, forming a first photoresist pattern layer including a base portion through which an opening is defined and a protrusion protruding from the base portion from the photoresist layer using a mask, forming a contact hole passing through the inorganic layer and the organic layer to expose a portion of the first conductive layer, and forming a second photoresist pattern layer including a pattern corresponding to the protrusion from the first photoresist pattern layer.

[0030] According to one or more embodiments, forming the hole may include patterning the organic layer and the inorganic layer using the second photoresist pattern layer, and patterning the inorganic layer and the organic layer includes: etching an area of ​​the inorganic layer not covered by the second photoresist pattern layer to expose a portion of the organic layer, removing the second photoresist pattern layer, and etching the exposed portion of the organic layer.

[0031] According to one or more embodiments, the input sensor may further include a base insulating layer as an organic layer, and the first conductive layer may be in contact with the base insulating layer.

[0032] According to the above, the light emitted from the organic light-emitting display device, which is directed toward the front, displays a front pixel image on the display surface, and the light directed toward the side is diffracted by the diffraction grating to display multiple replicated pixel images on the display surface. Therefore, even when a user views the display surface from the side, the user can observe the replicated pixel images, thereby improving the side viewing angle of the display device.

[0033] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. They illustrate embodiments of the invention and together with the description serve to explain the inventive concept.

[0035] Figure 1 is a perspective view illustrating a display device according to an embodiment of the inventive concept.

[0036] Figure 2 is a cross-sectional view illustrating a display device according to an embodiment of the inventive concept.

[0037] Figure 3 is a plan view illustrating a display panel according to an embodiment of the inventive concept.

[0038] Figure 4 is a cross-sectional view illustrating a display panel according to an embodiment of the inventive concept.

[0039] Figure 5 is a plan view illustrating an input sensor according to an embodiment of the inventive concept.

[0040] Figure 6 It shows Figure 5 An enlarged plan view of area AA'.

[0041] Figure 7 It is along Figure 6 A cross-sectional view taken along line II' shown in FIG.

[0042] Figure 8 It is along Figure 6 A cross-sectional view taken along line II' shown in FIG.

[0043] Figure 9 is a cross-sectional view illustrating a display device according to an embodiment of the inventive concept.

[0044] Figure 10 is a plan view illustrating a first insulating layer according to an embodiment of the inventive concept.

[0045] Figure 11 is a plan view showing a front pixel image and a replicated pixel image displayed on a display surface through a diffraction grating.

[0046] Figure 12A and Figure 12B is a cross-sectional view illustrating a display device according to an embodiment of the inventive concept.

[0047] Figure 13A 、 Figure 13B 、 Figure 13C 、 Figure 13D 、 Figure 13E 、 Figure 13F 、 Figure 13G and Figure 13H is a view illustrating a method of manufacturing a display device according to an embodiment of the inventive concept.

[0048] Figure 14A 、 Figure 14B 、 Figure 14C 、 Figure 14D 、 Figure 14E 、 Figure 14F 、 Figure 14G and Figure 14H is a view illustrating a method of manufacturing a display device according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0049] In the following description, for purposes of illustration, numerous specific details are set forth to provide a thorough understanding of the various embodiments. However, it is apparent that the various embodiments can be practiced without these specific details or with one or more equivalent arrangements. In the accompanying drawings, the sizes and relative sizes of layers, regions, etc. may be exaggerated for clarity and descriptive purposes. In addition, like reference numerals represent like elements.

[0050] When an element or layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, the element or layer may be directly on, directly connected to or directly coupled to the other element or layer, or there may be an intermediate element or intermediate layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there are no intermediate elements or intermediate layers. For the purposes of this disclosure, "at least one (kind) of X, Y and Z" and "at least one (kind) selected from the group consisting of X, Y and Z" may be understood as only X, only Y, only Z, or any combination of two or more of X, Y and Z, such as with XYZ, XYY, YZ and ZZ as an example. The same reference numerals always represent the same element. As used herein, the term "and / or" includes any combination and all combinations of one or more of the relevant listed items.

[0051] Although the terms first, second, etc. can be used to describe various elements, components, regions, layers and / or parts in this article, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, a component, a region, a layer and / or a part from another element, another component, another region, another layer and / or another part. Therefore, without departing from the teachings of the present disclosure, the first element, first component, first region, first layer and / or first part discussed below can be referred to as second element, second component, second region, second layer and / or second part.

[0052] For descriptive purposes, spatially relative terms such as "under," "beneath," "below," "above," and "on" may be used herein and thereby describe the relationship of one element or feature to another element(s) or feature(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientations depicted in the accompanying drawings. For example, if the device in the accompanying drawings is flipped, an element described as "under" or "beneath" other elements or other features would then be oriented "above" the other elements or other features. Thus, the exemplary term "under" can encompass both above and below orientations. Additionally, the device may be oriented in other ways (e.g., rotated 90 degrees or at other orientations), and therefore, the spatially relative descriptors used herein are interpreted accordingly.

[0053] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are also intended to include the plural forms. In addition, when used in this specification, the terms "comprises", "includes", "contains" and / or "has" illustrate the presence of stated features, wholes, steps, operations, elements, components and / or their groups, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their groups.

[0054] Various embodiments are described herein with reference to cross-sectional and / or exploded views that are schematic representations of idealized embodiments and / or intermediate structures. Thus, variations in the shapes of the illustrations due, for example, to manufacturing techniques and / or tolerances, are to be expected. Thus, the embodiments disclosed herein should not necessarily be construed as limited to the shapes of the specifically illustrated regions, but are to include deviations in shape that result, for example, from manufacturing. In this manner, the regions illustrated in the figures may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of regions of a device and, therefore, are not necessarily intended to be limiting.

[0055] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. Unless explicitly defined as such herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense.

[0056] Figure 1 is a perspective view illustrating a display device 1000 according to an embodiment of the inventive concept. Figure 2is a cross-sectional view illustrating a display device 1000 according to an embodiment of the inventive concept.

[0057] exist Figure 1 In the embodiment, the display device 1000 can be activated in response to an electrical signal. The display device 1000 can be applied to large electronic products such as televisions and monitors, as well as small and medium-sized electronic products such as mobile phones, tablet computers, car navigation units, game units, and smart watches. In this embodiment, a smart phone is described as a representative example of the display device 1000.

[0058] The display device 1000 may display an image 1000-I in a third direction DR3 through a display surface IS substantially parallel to each of the first and second directions DR1 and DR2. The display surface IS through which the image 1000-I is displayed may correspond to a front surface of the display device 1000.

[0059] In an embodiment of the present inventive concept, the front surface (or upper surface) and the rear surface (or lower surface) of each member may be defined relative to the direction in which the image 1000-1 is displayed. The front surface and the rear surface are opposite to each other in the third direction DR3, and the normal direction of each of the front surface and the rear surface may be substantially parallel to the third direction DR3.

[0060] exist Figure 2 In the embodiment, the display device 1000 may include a display panel 100 , an input sensor 200 , an anti-reflection layer 300 , and a window 400 .

[0061] The display panel 100 may have a configuration for generating an image 1000 - I. The display panel 100 may be a light-emitting display panel, for example, an organic light-emitting display panel or a quantum dot light-emitting display panel.

[0062] The input sensor 200 may be provided on the display panel 100. The display panel 100 and the input sensor 200 may be formed by a continuous process or may be coupled to each other by an adhesive member. The adhesive member may include a conventional adhesive or a pressure-sensitive adhesive. For example, the adhesive member may be a transparent adhesive member such as a pressure-sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, or an optically clear resin (OCR).

[0063] The input sensor 200 can sense external input 2000 provided from the outside. The external input 2000 can be a user input. The user input can include various forms of external input, such as a part of the user's body, light, heat, a pen, or pressure. In this embodiment, the external input 2000 is shown as the user's hand, however, this is only exemplary. As described above, the external input 2000 can be provided in various forms, and the input sensor 200 can sense the external input 2000 applied to the side surface or rear surface of the display device 1000 according to the structure of the display device 1000, and it should not be limited to a specific embodiment.

[0064] An anti-reflection layer 300 may be provided on the input sensor 200. The anti-reflection layer 300 may reduce the reflectivity of external light incident on the anti-reflection layer 300 from the outside. The anti-reflection layer 300 may include a retarder and a polarizer. In addition, the anti-reflection layer 300 may include a color filter. The color filters may be arranged in a predetermined arrangement, and the arrangement of the color filters may be determined by considering the emission color of the pixels. The anti-reflection layer 300 may be omitted.

[0065] A window 400 may be provided on the anti-reflection layer 300. The window 400 may comprise an optically transparent insulating material. For example, the window 400 may comprise glass or a plastic material. The window 400 may have a single-layer structure or a multi-layer structure. For example, the window 400 may comprise a plurality of plastic films attached to each other via an adhesive or a glass substrate, and a single plastic film attached to a glass substrate via an adhesive.

[0066] Figure 3 is a plan view illustrating a display panel 100 according to an embodiment of the inventive concept.

[0067] exist Figure 3 In the embodiment of the present invention, the display panel 100 may include an active area 100A and a peripheral area 100N. The active area 100A may be activated in response to an electrical signal. For example, the active area 100A may be a region through which an image is displayed. The peripheral area 100N may surround the active area 100A. A driving circuit or driving line for driving the active area 100A may be provided in the peripheral area 100N.

[0068] The display panel 100 may include a base layer 100 - 1 , a plurality of pixels 110 , a plurality of signal lines 120 , 130 , and 140 , a power pattern 150 , and a plurality of display pads 160 .

[0069] The base layer 100-1 may include a synthetic resin film. The synthetic resin film may include a thermosetting resin. The base layer 100-1 may have a multilayer structure. For example, the base layer 100-1 may have a three-layer structure comprising a synthetic resin layer, an adhesive layer, and a synthetic resin layer. Specifically, the synthetic resin layer may be a polyimide-based resin layer, however, the material used for the synthetic resin layer should not be specifically limited. The synthetic resin layer may include at least one of an acrylic resin, a methacrylic resin, polyisoprene, a vinyl resin, an epoxy resin, a polyurethane resin, a cellulose resin, a siloxane resin, a polyamide resin, and a perylene resin. The base layer 100-1 may include a glass substrate or an organic / inorganic composite substrate.

[0070] Signal lines 120 , 130 , and 140 may be connected to the pixels 110 to transmit electrical signals to the pixels 110 . Figure 3 The signal lines 120, 130, and 140 including the data line 120, the scan line 130, and the power line 140 are shown as representative examples, however, these are merely exemplary. The signal lines 120, 130, and 140 may further include at least one of an initial voltage line and a light emission control line, however, the signal lines 120, 130, and 140 should not be limited to specific embodiments.

[0071] The pixel 110 may be provided in the active area 100A. In this embodiment, an equivalent circuit diagram of one of the pixels 110 is shown as a representative example. The pixel 110 may include a first transistor 111, a second transistor 112, a capacitor 113, and a light-emitting device 114. The first transistor 111 may be a switching device that controls the on / off state of the pixel 110. The first transistor 111 may transmit or block a data signal applied to the first transistor 111 via the data line 120 in response to a scan signal applied to the first transistor 111 via the scan line 130.

[0072] The capacitor 113 may be connected to the first transistor 111 and the power line 140. The capacitor 113 may be charged with an amount of charge corresponding to a difference between a data signal transmitted from the first transistor 111 and a first power signal applied to the power line 140.

[0073] The second transistor 112 may be connected to the first transistor 111, the capacitor 113, and the light-emitting device 114. The second transistor 112 may control a driving current flowing through the light-emitting device 114 in response to the amount of charge charged in the capacitor 113. The on-time of the second transistor 112 may be determined according to the amount of charge charged in the capacitor 113. The second transistor 112 may provide the first power signal applied to the second transistor 112 through the power line 140 to the light-emitting device 114 during the on-time of the second transistor 112.

[0074] The light emitting device 114 may generate light in response to an electrical signal or may control the amount of light. For example, the light emitting device 114 may include an organic light emitting device or a quantum dot light emitting device.

[0075] The light-emitting device 114 can be connected to the power terminal 115 and can receive a power signal different from the first power signal provided through the power line 140 (hereinafter referred to as the "second power signal"). A driving current corresponding to the difference between the first power signal and the second power signal provided by the second transistor 112 flows through the light-emitting device 114, and the light-emitting device 114 can generate light corresponding to the driving current. At the same time, this is only exemplary, and the pixel 110 may include electronic components having various configurations and arrangements, and the pixel 110 should not be particularly limited.

[0076] The power pattern 150 may be provided in the peripheral area 100N. The power pattern 150 may be electrically connected to the plurality of power lines 140. Since the display panel 100 includes the power pattern 150, first power signals having substantially the same level may be provided to the pixels 110.

[0077] The display pad 160 may include a first pad 161 and a second pad 162. The first pad 161 may be provided in plurality, and the first pads 161 may be connected to the data lines 120, respectively. The second pad 162 may be connected to the power pattern 150 to be electrically connected to the power line 140. The display panel 100 may provide an electrical signal applied from the outside to the display panel 100 to the pixel 110 through the display pad 160. Meanwhile, the display pad 160 may further include pads other than the first pad 161 and the second pad 162 to receive other electrical signals, however, the display pad 160 should not be limited thereto or thereby.

[0078] Figure 4 is a cross-sectional view illustrating a display panel according to an embodiment of the present disclosure.

[0079] Reference Figure 4 The display panel 100 may include a plurality of insulating layers, semiconductor patterns, conductive patterns, and signal lines. The insulating layers, semiconductor layers, and conductive layers may be formed by a coating process or a deposition process. Subsequently, the insulating layers, semiconductor layers, and conductive layers may be selectively patterned by a photolithography process. In this manner, the semiconductor patterns, conductive patterns, and signal lines included in the circuit element layer 100-2 and the display element layer 100-3 may be formed. Subsequently, an encapsulation layer 100-4 may be formed to cover the display element layer 100-3.

[0080] At least one inorganic layer may be formed on the upper surface of the base layer 100-1. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed into multiple layers. The inorganic layer may form a barrier layer and / or a buffer layer. In this embodiment, the display panel 100 may include a buffer layer (BFL).

[0081] The buffer layer BFL may improve the coupling force between the base layer 100-1 and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer, and the silicon oxide layer and the silicon nitride layer may be alternately stacked with each other.

[0082] A semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon, however, the semiconductor pattern should not be limited thereto or thereby. The semiconductor pattern may include amorphous silicon or metal oxide.

[0083] Figure 4 Only a portion of the semiconductor pattern is shown, and the semiconductor pattern may also be provided in other regions. The semiconductor pattern may be arranged in the pixel 110 (refer to FIG. Figure 3 ) above. The semiconductor pattern may have different electrical properties depending on whether the semiconductor pattern is doped. The semiconductor pattern may include a doped region and an undoped region. The doped region may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant.

[0084] The doped region may have a conductivity greater than that of the non-doped region and may be substantially used as an electrode or a signal line. The non-doped region may substantially correspond to an active region (or channel) of a transistor. In other words, a portion of the semiconductor pattern may be an active region of a transistor, another portion of the semiconductor pattern may be a source or drain of the transistor, and the remaining portion of the semiconductor pattern may be a connection electrode or a connection signal line.

[0085] like Figure 4 As shown in FIG, the source S1, active area A1, and drain D1 of the first transistor 111 may be formed of a semiconductor pattern, and the source S2, active area A2, and drain D2 of the second transistor 112 may be formed of a semiconductor pattern. The sources S1 and S2 and the drains D1 and D2 may extend in opposite directions from the active areas A1 and A2. Figure 4 A portion of a connection signal line SCL formed of a semiconductor pattern is shown. Although not shown in the drawings, the connection signal line SCL may be connected to the drain D2 of the second transistor 112 in plane.

[0086] A first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may be disposed adjacent to the pixel 110 (see FIG. Figure 3) overlap together and may cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In the present embodiment, the first insulating layer 10 may have a single-layer structure of a silicon oxide layer. Not only the first insulating layer 10 but also the insulating layer of the circuit element layer 100-2 described later may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the above materials.

[0087] Gates G1 and G2 may be disposed on the first insulating layer 10. Gate G1 may correspond to a portion of the metal pattern. Gates G1 and G2 may overlap active areas A1 and A2, respectively. Gates G1 and G2 may serve as masks in a process of doping the semiconductor pattern.

[0088] A second insulating layer 20 may be provided on the first insulating layer 10 and may cover the gates G1 and G2. The second insulating layer 20 may be provided with the pixel 110 (see FIG. Figure 3 ) are overlapped together. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single layer structure or a multilayer structure. In this embodiment, the second insulating layer 20 may have a single layer structure of silicon oxide.

[0089] An upper electrode UE may be provided on the second insulating layer 20. The upper electrode UE may overlap the gate G2 of the second transistor 112. The upper electrode UE may be a portion of the metal pattern. A portion of the gate G2 and the upper electrode UE overlapping a portion of the gate G2 may define a capacitor 113 (see FIG. 1 ). Figure 3 ). In an embodiment of the present disclosure, the upper electrode UE may be omitted.

[0090] A third insulating layer 30 may be disposed on the second insulating layer 20 and may cover the upper electrode UE. In this embodiment, the third insulating layer 30 may have a single-layer structure of silicon oxide. A first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL via a contact hole CNT-1 defined by penetrating the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0091] A fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may have a single-layer structure of silicon oxide. A fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer. A second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a contact hole CNT-2 defined by penetrating the fourth insulating layer 40 and the fifth insulating layer 50.

[0092] A sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer. A first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be connected to the second connection electrode CNE2 via a contact hole CNT-3 defined by penetrating the sixth insulating layer 60. An opening 70-OP may be defined through the pixel-defining layer 70. At least a portion of the first electrode AE ​​may be exposed through the opening 70-OP of the pixel-defining layer 70.

[0093] like Figure 4 As shown in FIG, the active region 100A (refer to Figure 3 ) may include a light emitting region PXA and a non-light emitting region NPXA defined adjacent to the light emitting region PXA. The non-light emitting region NPXA may surround the light emitting region PXA. In this embodiment, the light emitting region PXA may be defined as a portion corresponding to the first electrode AE ​​exposed by the opening 70-OP.

[0094] The hole control layer HCL may be provided in common in the light emitting region PXA and the non-light emitting region NPXA. The hole control layer HCL may include a hole transport layer and may further include a hole injection layer. The light emitting layer EML may be provided on the hole control layer HCL. The light emitting layer EML may be provided in an area corresponding to the opening 70-OP. That is, the light emitting layer EML may be formed in each pixel 110 (refer to FIG. 1 ) after being divided into individual parts. Figure 3 )middle.

[0095] An electron control layer ECL may be provided on the light emitting layer EML. The electron control layer ECL may include an electron transport layer and may also include an electron injection layer. The hole control layer HCL and the electron control layer ECL may be formed together in a plurality of pixels using an open mask. A second electrode CE may be provided on the electron control layer ECL. The second electrode CE may have an integral shape and may be provided together in the pixel 110 (refer to FIG. Figure 3 )middle.

[0096] A capping layer 80 may be disposed on the second electrode CE and may be in contact with the second electrode CE. The capping layer 80 may include an organic material. The capping layer 80 may protect the second electrode CE from subsequent processes such as sputtering and may improve the luminous efficiency of the light-emitting device 114. The capping layer 80 may have a refractive index greater than that of the first inorganic layer 91 described below.

[0097] An encapsulation layer 100-4 may be provided on the display element layer 100-3. The encapsulation layer 100-4 may include a first inorganic layer 91, an organic layer 92, and a second inorganic layer 93. The first inorganic layer 91 and the second inorganic layer 93 may protect the display element layer 100-3 from moisture / oxygen, and the organic layer 92 may protect the display element layer 100-3 from foreign matter such as dust particles. The first inorganic layer 91 and the second inorganic layer 93 may include one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. In an embodiment of the present disclosure, the first inorganic layer 91 and the second inorganic layer 93 may include a titanium oxide layer or an aluminum oxide layer. The organic layer 92 may include an acrylic-based organic layer, however, the organic layer 92 should not be limited thereto or thereby.

[0098] In an embodiment of the present disclosure, an inorganic layer such as a LiF layer may be further provided between the capping layer 80 and the first inorganic layer 91. The LiF layer may improve the light emitting efficiency of the light emitting device 114.

[0099] Figure 5 is a plan view illustrating the input sensor 200 according to an embodiment of the present disclosure.

[0100] Reference Figure 5 , the input sensor 200 may include an active area 200A and a peripheral area 200N. The active area 200A may be activated in response to an electrical signal. For example, the active area 200A may be an area where input is sensed. The peripheral area 200N may surround the active area 200A.

[0101] Input sensor 200 may include a base insulating layer 200-1, a first sensing electrode 210, a second sensing electrode 220, sensing lines 231, 232, and 233, and a sensing pad 240. First sensing electrode 210 and second sensing electrode 220 may be disposed in active region 200A, and sensing lines 231, 232, and 233 and sensing pad 240 may be disposed in peripheral region 200N.

[0102] The base insulating layer 200-1 may be one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. The base insulating layer 200-1 may be directly formed on the second inorganic layer 93 (refer to FIG. Figure 4 The base insulating layer 200-1 may be an organic layer.

[0103] Input sensor 200 may obtain information about an external input based on a change in capacitance between first sensing electrode 210 and second sensing electrode 220 .

[0104] Each of the first sensing electrodes 210 may extend in the first direction DR1 and may be arranged in the second direction DR2. The first sensing electrodes 210 may include first sensing patterns 211 and first connection patterns 212. The first connection pattern 212 may electrically connect two adjacent first sensing patterns 211.

[0105] Each of the second sensing electrodes 220 may extend in the second direction DR2 and may be arranged in the first direction DR1. The second sensing electrodes 220 may include second sensing patterns 221 and second connection patterns 222. The second connection pattern 222 may electrically connect two adjacent second sensing patterns 221.

[0106] The sensing lines 231, 232, and 233 may include a first sensing line 231, a second sensing line 232, and a third sensing line 233. The first sensing lines 231 may be electrically connected to the first sensing electrodes 210, respectively. The second sensing lines 232 may be electrically connected to one end of the second sensing electrodes 220, respectively, and the third sensing lines 233 may be electrically connected to the other end of the second sensing electrodes 220, respectively.

[0107] Second sensing electrode 220 may have a relatively longer length than first sensing electrode 210. Therefore, two sensing lines 232 and 233 may be electrically connected to second sensing electrode 220, respectively. Therefore, the sensitivity of second sensing electrode 220 may be consistently maintained. However, this is merely exemplary, and second sensing line 232 or third sensing line 233 may be omitted.

[0108] The sensing pads 240 may include first, second, and third sensing pads 241, 242, and 243. The first sensing pads 241 may be connected to the first sensing lines 231, the second sensing pads 242 may be connected to the second sensing lines 232, and the third sensing pads 243 may be connected to the third sensing lines 233.

[0109] Figure 6 It shows Figure 5 An enlarged plan view of area AA'. Figure 7 It is along Figure 6 A cross-sectional view taken along line II' shown in FIG.

[0110] Figure 5 、 Figure 6 and Figure 7An enlarged view of the first sensing pattern 211 is shown. The first sensing pattern 211 may have a grid shape. For example, the first sensing pattern 211 may include lines extending in the fourth direction DRa and lines extending in the fifth direction DRb. A plurality of openings 211-OP may be defined in the first sensing pattern 211 by the lines.

[0111] The fourth direction DRa may be defined as a direction between the first direction DR1 and the second direction DR2 , and the fifth direction DRb may be defined as a direction crossing the fourth direction DRa.

[0112] The input sensor 200 may include a base insulating layer 200 - 1 , a first conductive layer 200 - 2 , a first insulating layer 200 - 3 , a second conductive layer 200 - 4 , and a second insulating layer 200 - 5 .

[0113] A first conductive layer 200-2 may be disposed on the base insulating layer 200-1. For example, the first conductive layer 200-2 may be in contact with the base insulating layer 200-1. A first insulating layer 200-3 may be disposed on the base insulating layer 200-1 and may cover the first conductive layer 200-2. A second conductive layer 200-4 may be disposed on the first insulating layer 200-3. A second insulating layer 200-5 may be disposed on the first insulating layer 200-3 and may cover the second conductive layer 200-4. The first conductive layer 200-2 may be connected to the second conductive layer 200-4.

[0114] Each of the first conductive layer 200-2 and the second conductive layer 200-4 may include a conductive pattern forming the first sensing electrode 210 and the second sensing electrode 220. For example, each of the first sensing patterns 211 may include a first sensing pattern layer 211-1 included in the first conductive layer 200-2 and a second sensing pattern layer 211-2 included in the second conductive layer 200-4. The first opening 211-OP1 may be defined by the first sensing pattern layer 211-1, and the second opening 211-OP2 may be defined by the second sensing pattern layer 211-2.

[0115] Each of the first conductive layer 200-2 and the second conductive layer 200-4 may include a metal material and / or a metal alloy and may have a single-layer structure or a multi-layer structure. In this embodiment, each of the first conductive layer 200-2 and the second conductive layer 200-4 may have a multi-layer structure in which titanium (Ti), aluminum (Al), and titanium (Ti) are sequentially stacked.

[0116] The first insulating layer 200-3 may include an organic layer 200-3a and may have a single-layer structure or a multi-layer structure. Depending on the embodiment, the first insulating layer 200-3 may be a single organic layer. The organic layer 200-3a may include at least one of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, a methacrylic resin, polyisoprene, a vinyl resin, a polyurethane resin, a cellulose resin, a siloxane resin, and a perylene resin. Depending on the embodiment, the organic layer 200-3a may include a photosensitive material or a non-photosensitive material. When the organic layer 200-3a includes a non-photosensitive material, the display device may be manufactured using a different process than when the organic layer 200-3a includes a photosensitive material.

[0117] According to embodiments, the first insulating layer may have a multilayer structure of an organic layer and an inorganic layer. The first insulating layer 200-3 may include an inorganic layer 200-3b. The inorganic layer 200-3b may include at least one of silicon nitride, aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. However, the inorganic layer 200-3b should not be specifically limited. For example, the organic layer 200-3a may cover the first conductive layer 200-2, and the inorganic layer 200-3b may be disposed on the organic layer 200-3a. The inorganic layer 200-3b may have a thickness less than that of the organic layer 200-3a and may have a refractive index different from that of the organic layer 200-3a. For example, the inorganic layer 200-3b may have a refractive index equal to or greater than about 0.3 and equal to or less than about 1, and the organic layer 200-3a may have a refractive index equal to or greater than about 0.7 and equal to or less than about 3.

[0118] A diffraction grating GR may be defined in the first insulating layer 200-3. The diffraction grating GR may be formed by defining a plurality of holes DFP in the diffraction grating GR. The diffraction grating GR may diffract at least a portion of the light incident on the diffraction grating GR from the display panel 100. The holes DFP defining the diffraction grating GR may overlap with the light-emitting area PXA. According to an embodiment, although not shown in the drawings, a portion of the diffraction grating GR may overlap with the non-light-emitting area NPXA. That is, some holes in the holes DFP may overlap with the non-light-emitting area NPXA. According to an embodiment, when viewed in a plane, the holes DFP may have a circular shape, however, the shape of the holes DFP should not be limited to or restricted thereto. The holes DFP may have various shapes, such as a polygonal shape or an elliptical shape.

[0119] The diffraction grating GR may be defined by holes DFP defined in the inorganic layer 200-3b and the organic layer 200-3a. According to an embodiment, the holes DFP may include a first hole DFP1 extending through the inorganic layer 200-3b and a second hole DFP2 extending through the organic layer 200-3a. The first hole DFP1 and the second hole DFP2 may be aligned with each other. The depth of the first hole DFP1 may be substantially the same as the thickness of the inorganic layer 200-3b, and the depth of the second hole DFP2 may be substantially the same as the thickness of the organic layer 200-3a. According to an embodiment, the thickness of the first insulating layer 200-3 may be substantially the same as the depth of each hole DFP. Due to process issues, the depths of the holes DFP may vary from one another and may not be identical to the thickness of the first insulating layer 200-3.

[0120] According to an embodiment, the second conductive layer 200-4 may include a sensing pattern defining an opening. More specifically, the second conductive layer 200-4 may include a second sensing pattern layer 211-2 defining a second opening 211-OP2. When viewed in a plane, the opening may overlap with the diffraction grating GR. The diffraction grating GR may be arranged to overlap with the second opening 211-OP2.

[0121] The second insulating layer 200-5 may cover the second conductive layer 200-4. The second insulating layer 200-5 may be filled in the hole DFP.

[0122] The second insulating layer 200-5 may have a refractive index different from that of the first insulating layer 200-3. For example, the refractive index of the second insulating layer 200-5 may be greater than the refractive index of the first insulating layer 200-3. The second insulating layer 200-5 may include an organic material having a refractive index greater than that of the first insulating layer 200-3, or the second insulating layer 200-5 may include an organic material and high-refractive-index particles mixed with the organic material. The high-refractive-index particles may include zirconium oxide (ZrO x ), titanium dioxide (TiO2), calcium carbonate (CaCO3), silicon dioxide (SiO2), zinc oxide (ZnO), aluminum hydroxide (Al(OH)2), magnesium hydroxide (Mg(OH)2) and lithopone (BaSO2+ZnS), however, the high refractive index particles should not be limited to or restricted thereto.

[0123] According to an embodiment, the refractive index of the second insulating layer 200-5 may be smaller than the refractive index of the first insulating layer 200-3. The second insulating layer 200-5 may have a refractive index of about 1.6, and the first insulating layer 200-3 may have a refractive index of about 1.9. Therefore, due to the difference in refractive index between the second insulating layer 200-5 and the first insulating layer 200-3 filled in the hole DFP, the light provided to the diffraction grating GR may be diffracted. As a result, the color shift according to the viewing angle can be reduced. Therefore, the display device 1000 (refer to Figure 1 ) display quality.

[0124] Color shift can be referred to as WAD (white angle dependence). WAD refers to the color shift of the display device 1000 (see Figure 1 ) is located at an angle where a white pattern is located, and the amount of change in brightness and the amount of change in color coordinates relative to the front surface perpendicular to the screen are measured to evaluate the level of change in the characteristics of the white pattern. That is, WAD may refer to a phenomenon in which white changes to another color when a white screen of a display is viewed at different angles. For example, white light from the display device 1000 (refer to Figure 1 ) is visible from the front, but due to the difference in light paths, light with a wavelength different from white light can be observed from the side of the display device.

[0125] Figure 8 It is along Figure 6 A cross-sectional view taken along line II' shown in FIG.

[0126] exist Figure 8 In the embodiment of the present invention, the inorganic layer 200-3b may extend to the sidewall of the contact hole CNT-4 and may cover a portion of the first conductive layer 200-2. In more detail, the first through hole TH1 may be defined through the organic layer 200-3a to expose a portion of the first conductive layer 200-2, and the inorganic layer 200-3b may extend to the first through hole TH1 to cover a portion of the first conductive layer 200-2, and the second through hole TH2 may be defined through the inorganic layer 200-3b to expose another portion of the first conductive layer 200-2. The region where the first through hole TH1 does not overlap with the second through hole TH2 may be the region where the inorganic layer 200-3b is disposed.

[0127] Reference Figure 9 、 Figure 10 and Figure 11The diffraction grating GR can diffract the light incident on the diffraction grating GR to prevent or reduce the occurrence of color shift. More specifically, the apertures DFP, which are arranged at regular intervals a1 (hereinafter referred to as "arrangement intervals") and define the diffraction grating GR, can diffract the second light L2 of the light incident on the apertures DFP that is tilted at a specific angle relative to the first light L1, and can display the replicated pixel image CIM on the display surface IS. In this embodiment, each aperture DFP can have a uniform width b1, that is, a diameter. As an example, the width of each aperture DFP can be approximately 1 micron. The interval between the apertures DFP can be smaller than the width of the corresponding light-emitting area PXA.

[0128] Reference Figure 11 According to an embodiment of the present disclosure, the display surface IS may include a front pixel area FPA and a plurality of replica pixel areas CPA. The replica pixel areas CPA may be arranged to surround the front pixel area FPA. In this embodiment, the replica pixel areas CPA may be defined on both sides of the front pixel area FPA in the first direction DR1 and on both sides of the front pixel area FPA in the second direction DR2. The front pixel area FPA may have substantially the same shape as the replica pixel areas CPA.

[0129] The front pixel area FPA may be arranged to be spaced apart from the copy pixel area CPA. The interval between the front pixel area FPA and the copy pixel area CPA may be referred to as a "copy interval PP." The copy interval PP is the distance between the center portion of the front pixel area FPA and the center portion of each copy pixel area CPA.

[0130] The replica interval PP can be varied depending on the distance z1 between the diffraction grating GR and the light emitting device 114, the refractive index of the second insulating layer 200-5, and the arrangement interval a1 of the holes DFP. For example, the replica interval PP can be increased by increasing the distance z1 between the holes DFP and the light emitting device 114 or by decreasing the arrangement interval a1 of the holes DFP. As described above, the desired replica interval PP can be ensured by adjusting the values ​​of the above variables.

[0131] According to the present embodiment, the first light L1 among the light generated by the light emitting device 114 can be displayed as a front pixel image FIM in the front pixel area FPA of the display surface IS after passing through the intermediate member. When viewed in a plane, the shape of the front pixel image FIM can correspond to the shape of the light emitting device 114. In addition, the second light L2 among the light generated by the light emitting device 114 can be displayed as a duplicate pixel image CIM in the duplicate pixel area CPA of the display surface IS after passing through the intermediate member. The shape of the duplicate pixel image CIM can be displayed by duplicating the front pixel image FIM in the same shape as the front pixel image FIM. Therefore, the image 1000-I (on Figure 1 ) can be provided to the user in a form in which the front pixel image FIM and the copy pixel image CIM are mixed. When compared with a screen through which only the front pixel image FIM is provided, the screen through which the front pixel image FIM and the copy pixel image CIM are provided in a mixed form can transmit the same image quality and color to the user even if the user's viewing angle changes.

[0132] According to an embodiment of the present disclosure, the front pixel image FIM and the copied pixel image CIM can be displayed through the display surface IS using light generated by one light-emitting device 114. Therefore, even if the user views the display surface IS from the side, the user can observe the copied pixel image CIM, and thus, the side viewing angle of the display device 1000 can be improved.

[0133] Figure 12A and Figure 12B is a cross-sectional view illustrating a display device according to an embodiment of the present disclosure.

[0134] exist Figure 12A The plurality of holes DFP-1 defining the diffraction grating GR may have a depth greater than the thickness of the first insulating layer 200-3. The holes DFP-1 may be arranged at regular intervals. At least one of the holes DFP-1 may extend to a portion of the base insulating layer 200-1 after penetrating the inorganic layer 200-3b and the organic layer 200-3a. The base insulating layer 200-1 may include a groove aligned with the first hole DFP1 and the second hole DFP2. The second insulating layer 200-5 may be filled in the hole DFP-1, and thus, the second insulating layer 200-5 may be filled in the groove of the base insulating layer 200-1.

[0135] exist Figure 12BIn the embodiment, the input sensor 200 may further include a third insulating layer 200-6. An opening OP exposing the diffraction grating GR may be defined through the second insulating layer 200-5. The third insulating layer 200-6 may cover the first insulating layer 200-3 and the second insulating layer 200-5 in which the diffraction grating GR is defined. The third insulating layer 200-6 may be filled with a plurality of holes DFP. In an embodiment, the refractive index of the first insulating layer 200-3, the refractive index of the second insulating layer 200-5, and the refractive index of the third insulating layer 200-6 may be different from each other. Therefore, because the input sensor 200 also includes the third insulating layer 200-6 having a refractive index different from the refractive index of the first insulating layer 200-3 and the refractive index of the second insulating layer 200-5, more light diffraction may be caused, and the effect of increasing the viewing angle may be improved.

[0136] Figure 13A 、 Figure 13B 、 Figure 13C 、 Figure 13D 、 Figure 13E 、 Figure 13F 、 Figure 13G and Figure 13H 2 is a view illustrating a method of manufacturing a display device according to an embodiment of the present disclosure. Figure 14A 、 Figure 14B 、 Figure 14C 、 Figure 14D 、 Figure 14E 、 Figure 14F 、 Figure 14G and Figure 14H is a view illustrating a method of manufacturing a display device according to an embodiment of the present disclosure.

[0137] Reference 13A to 13H and 14A to 14H A method for manufacturing a display device may include forming a display panel 100 in which a light emitting area PXA emitting light is defined, and forming an input sensor 200 on the display panel 100. According to an embodiment, forming the input sensor may include forming a first conductive layer 200-2, forming an organic layer 200-3a covering the first conductive layer 200-2 and an inorganic layer 200-3b disposed on the organic layer 200-3a, forming a second conductive layer 200-4 disposed on the first insulating layer 200-3 and connected to the first conductive layer 200-2 through a contact hole CNT-4, forming a hole DFP in the first insulating layer 200-3 to define a diffraction grating GR, and forming a second insulating layer 200-5 covering the second conductive layer 200-4 and the first insulating layer 200-3.

[0138] According to an embodiment, forming the display panel 100 may include forming a base layer 100-1, forming a circuit element layer 100-2 on the base layer 100-1, forming a display element layer 100-3 on the circuit element layer 100-2, and forming an encapsulation layer 100-4 on the display element layer 100-3. According to an embodiment, the input sensor 200 may be directly provided on the encapsulation layer 100-4 of the display panel 100.

[0139] exist 13A to 13H In the embodiment of the present disclosure, forming a first insulating layer may include: forming an organic layer through which a first through hole is defined to expose a portion of the first conductive layer, forming an inorganic layer on the organic layer to cover an inner wall of the first through hole, forming a photoresist layer on the inorganic layer, using a mask to form a first photoresist pattern layer from the photoresist layer including a base portion through which an opening is defined and a protrusion protruding from the base portion, forming a second through hole through the inorganic layer, and forming a second photoresist pattern layer having a pattern corresponding to the protrusion from the first photoresist pattern layer.

[0140] exist Figure 13A In the embodiment, a first conductive layer 200-2 may be formed on a base insulating layer 200-1. The base insulating layer 200-1 may be formed directly on the encapsulation layer 100-4. An organic layer 200-3a may be patterned on the first conductive layer 200-2. The organic layer 200-3a may be provided with a first through hole TH1 to expose a portion of the first conductive layer 200-2. The organic layer may include a photoresist material.

[0141] exist Figure 13B In the embodiment, the inorganic layer 200 - 3 b may be coated on the organic layer 200 - 3 a .

[0142] exist Figure 13C In the embodiment, a photoresist layer (not shown) may be formed on the inorganic layer 200-3b. The photoresist layer may include a positive photoresist material or a negative photoresist material. According to an embodiment, the first photoresist pattern layer PR may be formed of a photoresist layer. The first photoresist pattern layer PR may be formed by providing a mask 500 on the photoresist layer and patterning the photoresist layer using the mask 500. In this embodiment, the mask 500 may be a half-tone mask including a transmissive area 501, a semi-transmissive area 502, and a blocking area 503. The first photoresist pattern layer PR may include a base portion PR-B through which an opening PR-H is defined and a protrusion PR-P protruding from the base portion PR-B.

[0143] exist Figure 13DIn the embodiment of the present invention, a portion of the inorganic layer 200-3b can be etched through the opening PR-H of the first photoresist pattern layer PR, and a contact hole CNT-4 can be formed through which a portion of the first conductive layer 200-2 is exposed. At the same time, the base portion PR-B of the first photoresist pattern layer PR can be removed by an ashing process, so that a second photoresist pattern layer PR-P can be formed. The second photoresist pattern layer PR-P can include only the protrusion PR-P of the first photoresist pattern layer PR. The second photoresist pattern layer PR-P can be used as a mask in the etching process for forming the diffraction grating GR. Herein, the second photoresist pattern layer and the protrusion can use the same reference numeral "PR-P".

[0144] exist Figure 13E In the embodiment, a metal layer MTL may be preliminarily formed on the first insulating layer 200-3 to form the second conductive layer 200-4. Figure 13F In the embodiment, the second conductive layer 200 - 4 may be patterned on the first insulating layer 200 - 3 through an exposure process and a development process.

[0145] exist Figure 13G In the embodiment, a diffraction grating GR may be formed on the first insulating layer 200-3. According to an embodiment, forming the hole DFP may include patterning the inorganic layer 200-3b and the organic layer 200-3a using the second photoresist pattern layer PR-P. Patterning the inorganic layer 200-3b and the organic layer 200-3a may include etching the inorganic layer 200-3b in an area of ​​the first insulating layer 200-3 not covered by the second photoresist pattern layer PR-P to expose a portion of the organic layer 200-3a, performing an ashing process to remove the second photoresist pattern layer PR-P, and performing an etching process on the exposed portion of the organic layer corresponding to the etched area of ​​the inorganic layer 200-3b using the inorganic layer 200-3b as a hard mask.

[0146] exist Figure 13H In the embodiment, the second insulating layer 200-5 may be coated to cover the second conductive layer 200-4 and the first insulating layer 200-3, and the second insulating layer 200-5 may be filled in the hole DFP. The second insulating layer 200-5 may include a material having a refractive index different from that of the first insulating layer 200-3.

[0147] exist 14A to 14HIn the embodiment of the present disclosure, forming a first insulating layer may include: forming an organic layer covering a first conductive layer, forming an inorganic layer on the organic layer, forming a photoresist layer on the inorganic layer, forming a first photoresist pattern layer including a base portion through which an opening is defined and a protrusion protruding from the base portion from the photoresist layer using a mask, forming a contact hole passing through the inorganic layer and the organic layer to expose a portion of the first conductive layer, and forming a second photoresist pattern layer including a pattern corresponding to the protrusion from the first photoresist pattern layer.

[0148] exist Figure 14A In the embodiment of the present invention, a first conductive layer 200-2 may be patterned on a base insulating layer 200-1, and a first insulating layer 200-3 may be formed to cover the first conductive layer 200-2. The first insulating layer 200-3 may include an organic layer 200-3a and an inorganic layer 200-3b disposed on the organic layer 200-3a. The organic layer 200-3a may include a non-photosensitive material. For example, the non-photosensitive material may include silicon oxide.

[0149] exist Figure 14B In the embodiment of the present invention, a photoresist layer (not shown) may be formed on the inorganic layer, and a first photoresist pattern layer PR including a base portion PR-B defining an opening PR-H therethrough and a protrusion PR-P protruding from the base portion PR-B may be formed from the photoresist layer using a mask 500. The mask 500 may be a half-tone mask.

[0150] exist Figure 14C In the embodiment of the present invention, the contact hole CNT-4 can be formed by passing through the opening of the first photoresist pattern layer and penetrating the first insulating layer 200-3 using an etching process. Portions of the inorganic layer and the organic layer not covered by the first photoresist pattern layer can be etched to expose portions of the first conductive layer. At the same time, the base portion can be removed from the first photoresist pattern layer, so that a second photoresist pattern layer PR-P including a pattern corresponding to the protrusion PR-P can be formed.

[0151] exist Figure 14D In the embodiment, a metal layer MTL may be preliminarily formed to form a second conductive layer connected to the first conductive layer 200-2 through the contact hole CNT-4. Figure 14E In the embodiment, the metal layer MTL may be patterned through an exposure process and a development process, and thus, the second conductive layer 200 - 4 may be formed.

[0152] exist Figure 14F In the process, an etching process may be performed on some areas of the first insulating layer 200-3 not covered by the second photoresist pattern layer PR-P to form holes DFP. Figure 14G In the process, the second photoresist pattern layer PR-P can be removed. Figure 14HIn the embodiment, the second insulating layer 200-5 may be coated on the first insulating layer 200-3, and the second insulating layer 200-5 may cover the second conductive layer 200-4 and may be filled in the hole DFP. In this case, the contact hole may be formed substantially simultaneously with the diffraction grating GR, and thus, the efficiency of the mask process may be improved.

[0153] Although certain embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those skilled in the art.

Claims

1. A display device, wherein: The display device includes: a display panel having a light emitting area; and An input sensor is provided on the display panel, and the input sensor includes: a first conductive layer; a first insulating layer disposed on the first conductive layer; and A second conductive layer is provided on the first insulating layer and connected to the first conductive layer, wherein the first insulating layer comprises: an organic layer covering the first conductive layer; and an inorganic layer disposed on the organic layer, wherein the organic layer and the inorganic layer include a plurality of pores, The plurality of holes extend through the organic layer and the inorganic layer with respect to a width direction of the first insulating layer.

2. The display device according to claim 1, wherein The plurality of apertures define a diffraction grating corresponding to the light emitting region.

3. The display device according to claim 1, wherein Each of the plurality of holes includes a first hole penetrating the inorganic layer and a second hole penetrating the organic layer, and the first hole and the second hole are aligned with each other.

4. The display device according to claim 1, wherein Each of the plurality of holes has a depth that is the same as a thickness of the first insulating layer.

5. The display device according to claim 2, wherein The second conductive layer includes a sensing pattern defining an opening therethrough, and the opening overlaps the diffraction grating when viewed in a plane. The display device according to claim 2 , wherein: The input sensor further includes a second insulating layer covering the second conductive layer, and the second insulating layer is filled in the plurality of holes.

7. The display device according to claim 6, wherein: The second insulating layer has a refractive index different from that of the first insulating layer.

8. The display device according to claim 6, wherein: The second insulating layer is provided with openings defined therethrough to expose the diffraction grating, and the input sensor further includes a third insulating layer covering the first insulating layer and the second insulating layer and being filled in the plurality of holes.

9. The display device according to claim 8, wherein A refractive index of the first insulating layer, a refractive index of the second insulating layer, and a refractive index of the third insulating layer are different from each other.

10. The display device according to claim 1, wherein The input sensor further includes a base insulating layer, and the first conductive layer is in contact with the base insulating layer.

11. The display device according to claim 10, wherein: The base insulating layer is an organic layer.

12. The display device according to claim 10, wherein: The display panel includes: base layer; a circuit element layer, disposed on the base layer; A display element layer is provided on the circuit element layer; and The encapsulation layer is arranged on the display element layer, and the base insulating layer is directly arranged on the encapsulation layer.

13. The display device according to claim 10, wherein: The plurality of holes are arranged at regular intervals, and at least one hole among the plurality of holes extends to a portion of the base insulating layer after penetrating the inorganic layer and the organic layer.

14. The display device according to claim 1, wherein The inorganic layer has a thickness smaller than that of the organic layer.

15. The display device according to claim 1, wherein The organic layer is provided with a first through-hole defined through the organic layer to expose a portion of the first conductive layer, and the inorganic layer extending to the first through-hole to cover a portion of the first conductive layer is provided with a second through-hole to expose another portion of the first conductive layer.

16. The display device according to claim 1, wherein The inorganic layer has a refractive index different from that of the organic layer.

17. The display device according to claim 16, wherein: The refractive index of the organic layer is equal to or greater than 0.7 and equal to or less than 3, and the refractive index of the inorganic layer is equal to or greater than 0.3 and equal to or less than 1.

18. The display device according to claim 1, wherein The organic layer includes a non-photosensitive material.

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