Device for sensing and three-dimensional haptics

Abstract

The present invention relates to devices for sensing and three-dimensional haptics. A transducer includes one or more actuator components configured to be surrounded by a cavity of a frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement relative to the plane of the frame and to generate haptic feedback in the in-plane or out-of-plane movement relative to the plane of the frame. The transducer further includes one or more sensing layers configured to detect changes in displacement in the frame, wherein the sensing layers are connected to the one or more actuator components.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to technology for producing sensing and 3D haptic feedback for button replacement and / or other applications. BACKGROUND

[0002] A typical smartphone can have three push buttons on the outer side walls of the frame to turn the phone on and off, and to control the volume. These buttons have drawbacks such as design limitations due to the mechanical presence of the buttons, milling and / or drilling of the phone frame requiring additional cost to the OEM, reduction in the waterproofness (and / or dustproofness) of the phone, and lack of interest / diversity of haptic feedback. SUMMARY

[0003] According to one embodiment, a transducer includes one or more actuator components configured to be enclosed by a cavity of a frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement relative to the frame and to produce haptic feedback in the in-plane or out-of-plane movement relative to the frame. The transducer also includes one or more sensing layers configured to detect changes in displacement in the frame, wherein the sensing layers are connected to the one or more actuator components.

[0004] According to a second embodiment, a mobile device includes a frame defining an outer edge of the phone, wherein the frame includes a cavity; one or more actuator components configured to be enclosed by the cavity of the frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement relative to the frame and to produce haptic feedback in the in-plane or out-of-plane movement relative to the frame in response to an input at the frame; and one or more sensing layers configured to detect changes in displacement in the frame, wherein the sensing layers are connected to the one or more actuator components.

[0005] According to a third embodiment, a transducer includes one or more actuator components configured to protrude into a cavity of a frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement relative to the frame and to produce haptic feedback in the in-plane or out-of-plane movement relative to the frame in response to an input at the frame; one or more sensing layers configured to detect changes in displacement in the frame, wherein the sensing layers are connected to the one or more actuator components; and a printed circuit board (PCB) connected to the one or more actuator components via the sensing layers, the PCB configured to initiate a signal in response to the changes in displacement in the frame detected by the sensing layers. BRIEF DESCRIPTION OF DRAWINGS

[0006] Figure 1A A side profile view of a mobile device with a transducer with three-dimensional haptic feedback on the mobile device is shown.

[0007] Figure 1B An enlarged side profile view of a mobile device including a transducer 103 is shown.

[0008] Figure 2A A side profile view of a mobile device with a transducer in an alternative embodiment is shown.

[0009] Figure 2B A first alternative embodiment of a post portion of an actuator in a transducer is shown.

[0010] Figure 2C A second alternative embodiment of a post portion of an actuator in a transducer is shown.

[0011] Figure 2D A third alternative embodiment of a post portion of an actuator in a transducer is shown.

[0012] Figure 3A A side profile view of a mobile device with a transducer in an alternative embodiment is shown, the alternative embodiment including a single piezoelectric wafer piezoelectric actuation method.

[0013] Figure 3B An example of an enlarged profile of a single piezoelectric wafer piezoelectric actuation method is shown.

[0014] Figure 3C An example of a single piezoelectric wafer piezoelectric during actuation is shown.

[0015] Figure 4A A side profile view of a mobile device with a transducer in an alternative embodiment is shown, the alternative embodiment including a single piezoelectric wafer and dual piezoelectric wafer piezoelectric actuation method.

[0016] Figure 4B A single piezoelectric wafer actuation method is shown.

[0017] Figure 4C A dual piezoelectric wafer piezoelectric actuation method during actuation is shown.

[0018] Figure 5 A side profile view of a mobile device with a transducer in another alternative embodiment is shown.

[0019] Figure 6 A side profile view of a mobile device with a transducer in yet another alternative embodiment is shown, the alternative embodiment having a sensing layer in multiple locations.

[0020] Figure 7A is an example of a cutaway side view profile of a mobile device 701.

[0021] Figure 7B is an enlarged view of a first frame portion and a second frame portion of a mobile device joined by a flexible mount. Detailed Implementation

[0022] Embodiments of this disclosure are described herein. However, it should be understood that the disclosed embodiments are merely examples, and other embodiments may take various and alternative forms. The drawings are not necessarily drawn to scale; some features may be enlarged or minimized to show details of specific components. Therefore, the detailed structural and functional details disclosed herein should not be construed as limiting, but merely as a representative basis for teaching those skilled in the art to utilize the embodiments in various ways. As will be understood by those skilled in the art, various features shown and described with reference to any of the drawings may be combined with features shown in one or more other drawings to produce embodiments not explicitly shown or described. The combinations of features shown provide representative embodiments for typical applications. However, for a particular application or implementation, various combinations and modifications of features consistent with the teachings of this disclosure are desirable.

[0023] This disclosure discusses techniques for generating sensing and 3D haptic feedback for button replacement and / or other similar applications. An example of button replacement is replacing mechanical buttons on electronic devices such as smartphones or vehicle multimedia systems. Through displacement / vibration for haptic feedback, this technique can induce both in-plane and out-of-plane sensations in the skin / finger when pressed. Therefore, sensing functionality can also be integrated into the same design to detect when a button is pressed. The sensing and actuation elements can be either separate or integrated with a readout chip.

[0024] Beyond simple sensing technologies, 3D haptic experiences can be added. In addition to out-of-plane displacement / vibration, 3D haptic experiences can also be generated through in-plane vibration. Traditional push buttons provide out-of-plane haptic feedback but lack in-plane haptic feedback. Actuation can include piezoelectric actuation, as well as other similar methods such as electromagnetic, electrostatic, shape memory alloy, and those that can generate sufficient vibrations in all directions (e.g., in-plane and out-of-plane movement). Furthermore, besides replacing push buttons, other applications include any human-machine interface (HMI) device.

[0025] In addition to out-of-plane displacement / vibration, 3D tactile experience can also be generated through in-plane vibration. Traditional push buttons have out-of-plane tactile feedback but lack in-plane tactile feedback. This disclosure can be divided into three main parts: (1) in-plane vibration, (2) out-of-plane vibration, and (3) sensing. As described below, various configurations of transducers may exist.

[0026] Figure 1A A side view profile of a 3D haptic application on a mobile device 100 is depicted. Figure 1BAn enlarged side profile view of mobile device 100 is depicted showing transducer 103. As shown, a user can press on frame 101, rather than on the button itself, to actuate the area. As shown in the close-up view, the phone frame can include a cavity to enclose portions of transducer 103. Frame 101 can include any type of metal or plastic frame, or any other type of surface, such as a display panel or glass panel. The frame can include a cavity that can house portions of transducer 103, such as actuator component 105. Actuator component 105 can include multiple portions that allow for both in-plane and out-of-plane movement, which allows for 3D haptic feedback that includes both in-plane and out-of-plane vibrations. In addition to out-of-plane (e.g., up and down out of the frame) displacement / vibration, in-plane (e.g., movement in a parallel direction relative to the frame) vibration can create other haptic feedback in addition to traditional out-of-plane vibration only. The recess or cavity in frame 101 can be made to fit the protruding structure (e.g., actuator component). Thus, the recess or cavity can be similar in shape to the protruding structure of actuator component 105. The protruding structure of the actuator component can be connected to a base of actuator component 105 that is located outside of the cavity and below the frame.

[0027] In-plane vibration has advantages because it can be used to generate different types of haptic feedback by changes in friction between the user's skin and the button or device surface. Thus, lateral vibrations generated by in-plane vibration can be a "banging" of the transducer structure in the in-plane direction with the device frame. In one example, transducer 103 can include in-plane movement only, without out-of-plane movement.

[0028] The cavity within frame 101 can allow for increased vibration coupling and feedback for in-plane vibration. Frame 101 can include a gap defined by the open space between the cavity and the actuator component. The gap between frame 101 and the cavity can also be filled with a material to protect against wear and tear, but still allow for good mechanical coupling. Thus, for example, the material can be a polymer material or an adhesive material. In other embodiments, the gap of the cavity can simply be filled with air.

[0029] In one example, the position of the sensing electrode, with capacitive sensing capable of sensing changes in displacement of the metal frame. The metal frame can include a cavity that surrounds the electromechanical actuator. Specifically, the cavity can surround the post of the actuator component of the transducer 103. Although the preferred embodiment can include piezoelectric actuation, the actuation method can also be implemented in other methods, such as electromagnetic, electrostatic, shape memory alloy, etc., as long as the method can generate sufficient vibrations in all directions to produce in-plane and out-of-plane haptic feedback. In alternative embodiments, additional mass can be added to the actuator component or the transducer 103 to achieve stronger vibrational feedback to the frame area where the virtual button is located. For example, if the mass is increased while keeping the speed constant, stronger haptic feedback can be felt at the location of the vibration.

[0030] Figure 2A A side profile view of a mobile device with a transducer in alternative embodiments is shown. The frame 101 is shown with multiple cavity sets and post configurations. In one example, the frame 101 or touch panel can include a single cavity that allows for the post to occupy. The "post" or protruding portion of the actuator component 104 can be the physical piece of the actuator located in the frame that allows for input actuation. The structure of the transducer (e.g., sensors and actuators) that can contact the frame (e.g., via the cavity) can be made of a single post or multiple posts that intersect with the recesses of the frame. This can allow for good mechanical coupling, as well as provide different localized haptic feedback. The frame structure that is weakest in mechanical strength will feel the most vibration, and vice versa. Thus, different designs of the structure can be used to create different haptic feedback patterns. The greater the overlapping contact surface between the transducer and the frame, the better the mechanical coupling.

[0031] Figure 2B is an embodiment of an electromechanical actuator that includes a post configuration with nine individual posts. The nine individual posts can each be located in a separate cavity of the frame or panel of the mobile phone (e.g., nine cavities), in a large cavity that surrounds all of the posts, or in any other grouping of cavities. By increasing the number of individual posts, the feedback can allow for additional pin-point accuracy in response to input from the customer.

[0032] Figure 2C is an embodiment of an electromechanical actuator that includes a post configuration with four individual posts (e.g., protruding portions of the actuator). The four individual posts can each be located in a separate cavity of the frame or panel of the mobile phone (e.g., four cavities), in a large cavity that surrounds all of the posts, or in any other grouping of cavities. As shown in Figure 2C , the posts can be displaced to have two sets of parallel posts around the outside of the cavity or cavities, leaving a middle section empty. By increasing the number of individual posts, the feedback can allow for additional pin-point accuracy in response to input from the customer.

[0033] Figure 2D This is an embodiment of an electromechanical actuator, which includes a column configuration with seven individual columns. (Compared to...) Figure 2B-2C Unlike columns of similar size, seven columns can have different shapes and sizes. Although in Figure 2C The parallel columns in the diagram can be used to classify the middle section as empty. Figure 2D The embodiments allow for the placement of three additional posts in the intermediate segment. Of course, in one embodiment, one or two posts may be placed in this segment. By increasing the number of individual posts, the feedback can allow for additional precise positioning accuracy in response to customer input, particularly in the intermediate segment of the cavity layout.

[0034] Figure 3A-3C This is an example of a transducer utilizing a single piezoelectric chip piezoelectric actuation method. As shown in the figures, in such an embodiment, three cavities or recesses may exist within the telephone frame. However, any number of cavities can be used. With single piezoelectric chip actuation, the system can provide feedback in a planar manner in one direction. The actuation can be electrostatic, piezoelectric, electromagnetic, etc. In such a case, the pillar or protrusion may be generated from a silicon wafer or a flexible, non-stretchable structure. Therefore, the feedback can differ from other electromechanical actuation methods. The non-stretchable structure 302 (e.g., a silicon structure that can be bent based on the force of the sensing layer 301) may be adjacent to the sensing layer 301 (e.g., it may be piezoelectric, electrostatic, etc.). The non-stretchable structure may be within the cavity of the frame and adjacent to the sensing layer 301 in the protrusion of the actuator component 304. Thus, the non-stretchable material 302 may contact the side of the frame (via the cavity), but the sensing layer 301 contacts the top of the cavity of the frame in response to an input at the frame (e.g., a finger press). Therefore, tactile feedback can be provided on the side of the cavity in the frame for in-plane vibration. As shown in the exploded view portion of Figure 3, tactile feedback can occur during in-plane movement when a force is applied to the transducer in an out-of-plane direction (or, in other examples, input activation to receive feedback), causing the non-stretchable material 302 to bend. Thus, the non-stretchable structure 302 can be located in the protruding member and is wholly or partially located in the cavity of the frame. Consequently, the non-stretchable material 302 of the actuator component can induce bending. In one embodiment, the actuator component base 305 can be below the sensing layer 303. Out-of-plane actuation can be performed at any location within the actuator to perform out-of-plane actuation of a single piezoelectric wafer. Figure 3C In the middle, for example, the leftmost thinner layer (e.g., non-stretchable material 302) may be redundant or used as an electrode to apply ground or negative voltage. At a higher level, the middle thinner layer 308 may also be grounded or negatively voltaged, and the rightmost layer may be positively voltaged.

[0035] Figure 4A-4CThis is an example of a dual-piezoelectric wafer piezoelectric actuation method. With dual-piezoelectric wafer actuation, cantilevered arms can be used for actuation or sensing that may include two active layers. The method may also have a passive layer between the two active layers. Conversely, a single piezoelectric wafer may have only one active (i.e., piezoelectric) layer and one passive (i.e., non-piezoelectric) layer. Thus, different types of in-plane movement can be used for different tactile feedback. Actuation can be electrostatic, piezoelectric, electromagnetic, etc. The pillar may include a sensing layer and a rigid or non-stretchable non-sensing material. In one example, the pillar or protrusion of the actuator may be formed from a silicon wafer or a flexible, non-stretchable structure. In one example, dual-piezoelectric wafer in-plane actuation may exist relative to the frame of a mobile device. Therefore, the arrow of in-plane movement relative to the frame may point to the piezoelectric polarization axis. However, the arrow of out-of-plane movement relative to the frame may be the expansion or contraction movement of a flexible, non-stretchable structure. As shown in the breakdown section, dual-piezoelectric wafer in-plane actuation may include multiple sensing layers.

[0036] An out-of-plane actuator 401 may be present within the cavity of the frame, while an in-plane actuator 403 may be used to provide in-plane haptic feedback. Such a design, as shown in Figure 4, can have a variety of actuator numbers and shapes; however, in this example, only two in-plane actuators are shown that will cause the top portion of the transducer (i.e., the combination of out-of-plane actuator 401 and the non-piezoelectric layer 402) to move left and right. For example, the out-of-plane actuator may comprise a single piezoelectric wafer out-of-plane actuator.

[0037] As an example Figure 4A As shown, the transducer may also include one or more sensing elements 405, which include impedance sensing (e.g., capacitive, inductive). The one or more sensing elements 405 may also be electromagnetic sensors, piezoelectric sensors, etc. Piezoelectric sensing can also be accomplished using the same transducer components. On a similar principle, a voltage can be applied to generate displacement of the transducer. Simultaneously, any displacement of the transducer can generate a voltage that can be sensed as an input confirming a "press" of a button. Other possible locations for the sensing layer (such as in...) can be utilized. Figure 6 (As shown in the diagram). Other types of locations for the sensing electrodes can also be utilized. For the purpose of increasing mass or enhancing structural integrity, the non-piezoelectric layer 402 can also be a sensing layer instead of a dummy material. For example, the non-piezoelectric layer 402 can utilize capacitance to sense changes in the displacement of the metal frame. The non-piezoelectric layer 402 can be located on the actuator component base. In alternative embodiments, for example, the actuator component base can be an integrated readout chip.

[0038] The actuator component base 407 or any other portion may be directly or indirectly connected to the PCB 409. For example, the PCB may be soldered to the actuator component (e.g., via base 407) or connected via wire connections (e.g., ribbon cables). In addition to using the PCB 409, the system may also include a microcontroller or any other type of processor or microprocessor, ASIC controller, etc. Out-of-plane vibrations are simultaneously incorporated into in-plane vibrations to generate 3D haptic feedback. The out-of-plane actuator (e.g., a piezoelectric actuator) may be strategically positioned to allow seamless integration with both the in-plane actuator 403, the sensing component 405, and the readout circuitry (e.g., the PCB 409).

[0039] Figure 4C A piezoelectric actuation method using two piezoelectric wafers is illustrated. (Regarding...) Figure 4C The structure can be a dual piezoelectric wafer actuation. In this embodiment, piezoelectric layer 411 may be included in the transducer. Piezoelectric layer 411 may be the same piezoelectric material as the other layers, as long as its function differs when different voltages are applied. When a positive voltage is applied, piezoelectric layer 411 may expand, and when a negative voltage is applied, piezoelectric layer 411 may contract. The small arrows shown at the first piezoelectric layer within the piezoelectric layer indicate the polarity of the layer. In one embodiment, to allow dual piezoelectric wafer actuation to operate, three electrodes may be present sandwiching the two piezoelectric layers, meaning that the two outermost thinner layers 413, 415 are electrodes, and the middle thinner layer 412 is also an electrode. Depending on the polarity of the electrodes, the piezoelectric layer between the electrodes will either expand or contract. For example, the leftmost electrode may be connected to a positive voltage, the middle electrode may be grounded, and the rightmost electrode may be connected to a negative electrode. With different polarity configurations, the piezoelectric layer may expand or contract. The vertical arrows indicate the expansion or contraction of the piezoelectric material.

[0040] Figure 5This is an example of an alternative embodiment of the transducer. The frame 501 of the mobile phone may include a cavity 502. Cavity 502 may include a "post" or other portion of a mass portion 503, which can be used to receive feedback from user input at the mobile phone (e.g., the frame). In an alternative embodiment, cavity 502 may include one or more cavities within the frame. Furthermore, cavity 502 may include a protruding portion of the transducer within the frame, either in all or some of the cavities. Mass portion 503 may be a rubber material or any other material, such as a non-stretchable material. The electromechanical actuator may include a sensing layer 505. Additionally, it may include a 3D actuator or sensor 507. 3D actuator or sensor 507 may be a separate actuator, sensor, or a combination thereof. 3D actuator or sensor 507 can provide tactile feedback in-plane, out-of-plane, or in both directions relative to the frame of the phone. 3D actuators may include piezoelectric, shape memory alloy, electrostatic, electromagnetic, etc., which can produce displacement (in-plane and out-of-plane) on all three axes. Therefore, the 3D actuator can provide additional haptic feedback or vibration during in-plane or out-of-plane (relative to frame 501) movement. The 3D actuator and sensor can be mounted on the back of the phone. The 3D actuator can be schematically shown in... Figure 5 The transducer includes a D33 piezoelectric actuator for out-of-plane vibration and a piezoelectric, electrostatic, or electromagnetic actuator for in-plane vibration. PCB 509 can also be mounted on the back of the telephone, thus allowing the transducer to provide vibration to both the surface and back of the telephone frame 501. PCB 509 can be mounted to the back of the telephone frame via soldering, bonding, or any other method.

[0041] Figure 6This is an example of another alternative embodiment of the transducer. In such an embodiment, the sensing layer 603 is illustrated to be found in almost any location on the transducer, such as above the non-stretchable material 605 in a cavity segment of the frame 601. In yet another embodiment, the sensing layer may be between the mass portion 605 (e.g., non-stretchable material) and the 3D actuator 607. In yet another embodiment, the sensing layer 603 may be between the 3D actuator 607 and the bottom of the telephone frame 609. The closer the sensing layer 603 is to the frame, the higher the sensitivity. The sensing layer may be on top of intersecting structures, between the actuator and the protruding mass portion, or between the actuator and the mounting portion. A single sensing layer or many smaller, separate layers may be used. Separate layers may have the advantage of detecting more tilted actuation from the user, similar to a rocker switch. The sensing layer 603 may be any type of sensing layer (piezoelectric, electromagnetic, electrostatic, etc.) and may be located anywhere on the transducer (e.g., near the top of the frame or at the bottom of the telephone frame 609). However, the closer the sensing layer 603 is to the location where the force is applied, the stronger the signal that the transducer can generate. If the sensing layer 603 is further away from the force (e.g., when the force is applied at or near the cavity, near the bottom of the telephone frame relative to near the cavity), the signal strength is weaker.

[0042] Figure 7A This is an example of a cut-out side view outline of mobile device 701. Figure 7BThis is an enlarged view of a first frame portion and a second frame portion of a mobile device joined by a flexible mounting material. The mobile device 701 may include a frame comprising a first frame portion 705 and a second frame portion 70. The first frame portion 705 may include a cavity surrounding an electromechanical actuator 703 or a transducer. Any of the electromechanical actuators 703 or transducers described above may be operational. The first frame portion may include a surface portion comprising a display panel or a touch display panel. The first frame portion 705 may also include a top portion 708 and a bottom portion 709. As shown in FIG. 7, the first frame portion 705 may have a top portion 708 and a bottom portion 709 directly connected without a back portion or a unified frame member. Alternatively, the second frame portion 707 may be connected to the first frame portion 705 via a flexible mounting member 713 through a top portion 706 and a bottom portion 711 of the second frame. The flexible mounting member 713 may be any flexible material, polymer, or adhesive that allows lateral and vertical movement via such a connection and maintains the connection between the first frame portion and the second frame portion 707. The flexible mounting element 713 on the surface allows for lateral and vertical movement via such a connection. Thus, when a button is activated on the top portion, a portion of the phone (e.g., a side of the frame) can move. When the button is actuated near 703, only the first frame portion 705 vibrates. Similarly, if a button is present on the other side of the frame, only the second frame portion vibrates. The disconnection of the frame with the flexible mounting element 713 as a bridging material provides structural integrity to the entire device and has the ability to generate vibration only on one side of the frame 705. Therefore, the flexible mounting portion can connect the bottom portion of the first frame portion to the bottom portion of the second frame portion. Thus, when input is received via the customer's use of the mechanical actuator (e.g., touching a button or screen to activate a function or command), haptic feedback can be applied not only near the actuator but also to one side of the phone's edge.

[0043] The processes, methods, or algorithms disclosed herein can be transmitted to, implemented by, or fed to a processing device, controller, or computer, which may include any existing programmable electronic control unit or dedicated electronic control unit. Similarly, the processes, methods, or algorithms can be stored in various forms as data and instructions executable by a controller or computer, including but not limited to information permanently stored on non-writable storage media (such as ROM devices) and information variablely stored on writable storage media (such as floppy disks, magnetic tapes, CDs, RAM devices, other magnetic media, and optical media). The processes, methods, or algorithms can also be implemented in a software executable object. Alternatively, the processes, methods, or algorithms can be embodied, wholly or partially, using suitable hardware components (such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), state machines, controllers, or other hardware components or devices), or using a combination of hardware, software, and firmware components.

[0044] While exemplary embodiments have been described above, these embodiments are not intended to describe all possible forms covered by the claims. The vocabulary used in this specification is descriptive rather than limiting, and it should be understood that various changes may be made without departing from the spirit and scope of this disclosure. As previously described, features of various embodiments may be combined to form other embodiments of the invention that may not be explicitly described or illustrated. Although various embodiments may have been described as providing an advantage or being preferred over other embodiments or prior art implementations with respect to one or more desired features, those skilled in the art will recognize that compromises may be made to one or more features to obtain desired overall system properties, depending on the specific application and implementation. These properties may include, but are not limited to, cost, strength, durability, lifecycle cost, merchantability, appearance, packaging, size, maintainability, weight, manufacturability, ease of assembly, etc. Thus, to the extent that any embodiment described with respect to one or more features is less desirable compared to other embodiments or prior art implementations, these embodiments are not outside the scope of this disclosure and may be desired for a particular application.

Claims

1. A transducer, comprising: One or more actuator components configured to be surrounded by cavities of a frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement relative to the frame, and are configured to generate tactile feedback during in-plane and out-of-plane movement relative to the frame; One or more sensing layers configured to detect changes in displacement within the frame, wherein the sensing layers are connected to the one or more actuator components.

2. The transducer according to claim 1, wherein, The one or more actuator components are piezoelectric actuators.

3. The transducer according to claim 1, wherein, The one or more actuator components are electromagnetic actuators or electrostatic actuators.

4. The transducer according to claim 1, wherein, The one or more actuator components are electromechanical actuators, including three-dimensional actuators mounted with proximity sensing.

5. The transducer according to claim 1, wherein, The one or more actuator components include non-stretchable material located in the cavity of the frame.

6. The transducer according to claim 5, wherein, The one or more actuator components include a first side and a second side connected by a top side; wherein the non-stretchable material located in the cavity of the frame is between the first side and the second side.

7. The transducer according to claim 6, wherein, The first side and the second side are generally parallel to each other.

8. The transducer according to claim 1, wherein, The transducer includes a gap defined by an open space between the cavity and the actuator component.

9. The transducer according to claim 1, wherein, The cavity is at least partially or entirely filled with polymer or adhesive material.

10. The transducer according to claim 1, wherein, The transducer is connected to a printed circuit board, which is connected to the one or more actuator components via the sensing layer, wherein the printed circuit board is configured to initiate a signal in response to the sensing layer detecting a change in displacement in the frame.

11. The transducer according to claim 1, wherein, The transducer is connected to a microcontroller via the sensing layer, the microcontroller being connected to the one or more actuator components, the microcontroller being configured to generate a signal in response to the sensing layer detecting a change in displacement within the frame and induced vibration of the transducer.

12. The transducer according to claim 1, wherein, The one or more actuator components are configured to generate tactile feedback during in-plane or out-of-plane movement relative to the frame.

13. The transducer according to claim 1, wherein, The frame includes a touch panel.

14. A mobile device, comprising: A frame defining the outer edge of a telephone, wherein the frame includes a cavity; One or more actuator components configured to be surrounded by the cavity of the frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement relative to the frame, and are configured to generate tactile feedback in response to an input at the frame during in-plane and out-of-plane movement relative to the frame; and One or more sensing layers configured to detect changes in displacement within the frame, wherein the sensing layers are connected to the one or more actuator components.

15. The mobile device according to claim 14, wherein, The one or more actuator components are electromagnetic actuators.

16. The mobile device according to claim 14, wherein, The one or more actuator components are electromechanical actuators, including a three-dimensional actuator mounted between the sensing layer and the printed circuit board.

17. The mobile device according to claim 14, wherein, The frame includes a first part and a second part, wherein the first part includes the cavity, and the second part is connected to the second part via a flexible material.

18. The mobile device of claim 14, wherein the one or more actuator components are configured to generate haptic feedback during in-plane or out-of-plane movement relative to the frame in response to a signal initiated by the microcontroller of the mobile phone.

19. A transducer comprising: One or more actuator components are configured to protrude into a cavity of a frame, wherein the one or more actuator components are configured to allow in-plane and out-of-plane movement relative to the frame, and are configured to generate tactile feedback in response to an input at the frame during in-plane and out-of-plane movement relative to the frame; One or more sensing layers configured to detect changes in displacement within the frame, wherein the sensing layers are connected to the one or more actuator components; and A printed circuit board connected to the one or more actuator components via the sensing layer, the printed circuit board being configured to initiate a signal in response to the sensing layer detecting a change in displacement within the frame.

20. The transducer according to claim 19, wherein, The transducer includes a three-dimensional actuator mounted between the sensing layer and the printed circuit board.

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