Frame with attached heat sink

Abstract

A transceiver assembly includes a housing and a heat sink. The housing includes first and second spaced-apart walls and a third wall spanning the first wall and the second wall. The third wall defines an opening, and the third wall includes two spring arms, each of which extends into the opening. The heat sink includes a heat sink body, the heat sink body including a first surface and a protrusion extending from the first surface of the heat sink body, and a pair of spring arm receiving members positioned on the first surface of the heat sink body. Each of the pair of spring arm engagement portions is configured to engage with a corresponding one of the two spring arms of the housing when the heat sink is attached to the housing.

Description

[0001] This application is a divisional application of the PCT invention patent application entitled "Frame with Attached Radiator" with international application number PCT / US2018 / 013109 filed by the applicant Shentai Company on January 10, 2018. The PCT invention patent application entered the Chinese national phase on June 27, 2019, and its Chinese patent application number is 201880005530.1. Technical Field

[0002] The present invention relates to a cage (cage-like structure) for a pluggable transceiver. More particularly, the present invention relates to such a cage with an attached heat sink. Background Art

[0003] When multiple cages are stacked next to each other on a printed circuit board (PCB), it is known to attach the heat sink to the cage using a separate spring clip. The spring clip is either attached to the rear cage of the cage or to the side wall of the cage extending parallel to the transceiver insertion direction. When the spring clip is attached to the side wall, the PCB density is reduced because two adjacent spring clips abut each other, creating space between adjacent cages. The cage-to-cage spacing can be eliminated by a single spring clip that traverses all adjacent cages, but a different spring clip must be provided for each different array. Summary of the invention

[0004] To overcome the above problems, preferred embodiments of the present invention provide a housing that includes an integral biasing mechanism that urges the heat sink against the transceiver and eliminates the need for a separate biasing spring clip.

[0005] The housing according to a preferred embodiment of the present invention comprises first and second spaced-apart walls and a third wall spanning the first and second walls, wherein the third wall comprises an opening and the third wall comprises two spring arms, each of which extends into the opening.

[0006] Preferably, the two spring arms are each attached to the third wall and are cantilever spring arms. The two spring arms and the opening preferably receive a portion of a heat sink. The frame also preferably includes a heat sink, the heat sink including a column, wherein one of the two spring arms includes a slot to receive the column. At least one of the two spring arms preferably includes a slot.

[0007] The housing frame also preferably includes a heat sink attached to the two spring arms. The projection defined by the heat sink preferably floats within the housing frame. The heat sink preferably is movable up and down within the housing frame in a direction toward and away from the third wall.

[0008] Preferably, the first wall includes a first edge and an opposite second edge, the second wall includes a third edge and an opposite fourth edge, and the third wall includes a fifth edge and an opposite sixth edge, the first wall and the second wall of the first and second spaced-apart walls are parallel or substantially parallel to each other, the fifth edge of the third wall is attached to the first edge of the first wall, and the opposite sixth edge of the third wall is attached to the third edge of the second wall, an opening is defined by the third wall, two spring arms extend into the opening, and the opposite second edge of the first wall and the opposite fourth edge of the second wall are configured to be positioned adjacent to a mounting substrate.

[0009] The housing also preferably includes two additional spring arms. The two spring arms preferably extend from the third wall in the first direction.

[0010] A heat sink according to a preferred embodiment of the present invention comprises a heat sink body, the heat sink body comprising a first surface and a protrusion extending from the first surface of the heat sink body and a pair of spring arm receiving members positioned on the first surface of the heat sink body. Each of the pair of spring arm receiving members is configured to engage with a corresponding one of the two spring arms of the housing when the heat sink is attached to the housing.

[0011] The pair of spring arm receivers are preferably spaced apart retaining pins, or spaced apart recesses defined by the first surface of the heat sink body, with each retaining pin extending from the first surface of the heat sink body.

[0012] The heat sink also preferably includes an insertion key defined by the first surface of the heat sink body. The heat sink also preferably includes a retention key defined by the first surface of the heat sink body, wherein the retention key engages with the frame to prevent the heat sink from being disengaged from the frame after the heat sink has been attached to the frame.

[0013] The heat sink also preferably includes additional pairs of spring arm receiving members. The pairs of spring arm receiving members are pairs of recesses, each recess extending in a first direction.

[0014] A transceiver assembly according to a preferred embodiment of the present invention includes a housing and a heat sink. The housing includes first and second spaced-apart walls and a third wall spanning the first wall and the second wall. The third wall defines an opening, and the third wall includes two spring arms, each of which extends into the opening. The heat sink includes a heat sink body, the heat sink body including a first surface and a protrusion extending from the first surface of the heat sink body, and a pair of spring arm receiving members positioned on the first surface of the heat sink body. Each of the pair of spring arm engagement portions is configured to engage with a corresponding one of the two spring arms of the housing when the heat sink is attached to the housing.

[0015] The transceiver assembly also preferably includes a transceiver plugged into the housing such that the transceiver engages the protrusion. Preferably, the heat sink body also includes a second surface opposite the first surface, and the housing and heat sink are free of any springs that exert a force on the second surface of the heat sink body. When the transceiver is positioned between the first and second spaced-apart walls of the housing, the third wall of the housing preferably does not flex.

[0016] Preferably, the housing further comprises two additional spring arms, and the heat sink further comprises additional paired spring arm receivers. Preferably, the two spring arms extend from the third wall in the first direction, and the paired spring arm receivers are paired recesses, each recess extending in the first direction.

[0017] The above and other features, elements, characteristics, steps and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 and 2 A housing frame with a heat sink according to a first preferred embodiment of the present invention is shown, wherein a transceiver is plugged into the housing frame.

[0019] Figure 3 and 4 yes Figure 1 A three-dimensional view of the shell frame.

[0020] Figure 5 yes Figure 1 Top view of the shell frame.

[0021] Figure 6 yes Figure 1 Side view of the shell frame.

[0022] Figure 7 yes Figure 1 An enlarged view of the locking guide portion of the housing.

[0023] Figure 8 and 9 yes Figure 1 A three-dimensional diagram of the radiator.

[0024] Fig.10 yes Figure 1 Side view of the radiator.

[0025] Fig.11 yes Figure 1 Bottom view of the radiator.

[0026] Figure 12-18 shows the heat sink being attached to Figure 1 The first step of the shell frame.

[0027] Figure 19-23shows the heat sink being attached to Figure 1 The second step of the shell frame.

[0028] Fig.24 and 25 Shown with heat sink Figure 1 Array of shells.

[0029] Fig.26 is a magnified view of an alternative arm having a single hole.

[0030] Fig. 27 is an enlarged view of an alternative column having a single diameter.

[0031] Fig.28 is an enlarged view of a heat sink with an alternative column attached to a frame with an alternative arm.

[0032] Fig.29 It is a three-dimensional view of a housing frame with a heat sink according to a second preferred embodiment of the present invention.

[0033] Fig.30 and 31 Is with Fig.29 A side cross-sectional view of a radiator frame.

[0034] Fig.32 and 33 yes Fig.29 A three-dimensional view of the shell frame.

[0035] Fig.34 yes Fig.29 Bottom view of the shell frame.

[0036] Fig.35 yes Fig.29 Side view of the shell frame.

[0037] Fig.36 yes Fig.29 Magnified view of the locking latch of the housing.

[0038] Fig.37 and 38 yes Fig.29 A three-dimensional diagram of the radiator.

[0039] Fig.39 yes Fig.29 Side view of the radiator.

[0040] Fig.40 yes Fig.29 Bottom view of the radiator.

[0041] Fig.41 Shown with alternative heat sink Fig.29 The shell frame.

[0042] Fig.42 Comes with a replacement heat sink Fig.29 A side cross-sectional view of the shell.

[0043] Fig.43 and 44 yes Fig.41 A perspective view of an alternative radiator.

[0044] Fig.45 is a front view of a heat radiator that replaces the heat sink.

[0045] Figures 46-48 is a perspective view of a heat spreader that replaces a heat sink.

[0046] Fig.49 is a front view of a heat spreader that replaces the heat sink.

[0047] Fig.50 is a side view of a heat spreader that replaces a heat sink.

[0048] Fig.51 It is a three-dimensional diagram of the insert of the heat diffuser.

[0049] Figure 52-55 1 is a three-dimensional view of a housing with different heat sinks according to a preferred embodiment of the present invention.

[0050] Fig.56 1 is a side sectional view of a housing according to a preferred embodiment of the present invention.

[0051] Fig.57 A housing array according to a preferred embodiment of the present invention is shown.

[0052] Fig.58 yes Fig.57 A perspective view of the bottom of a heat sink.

[0053] Fig.59 is a perspective view of a housing with attached heat pipes according to a preferred embodiment of the present invention.

[0054] Fig.60 and 61 yes Fig.59 A perspective view of a heat pipe.

[0055] Fig.62 and 63 1 are perspective and front views of a housing with an attached heat sink according to a preferred embodiment of the present invention.

[0056] Fig.64 and 65 yes Fig.62 A three-dimensional diagram of the radiator.

[0057] Fig.66is a perspective view of a housing with an attached heat sink according to a preferred embodiment of the present invention.

[0058] Fig.67 FIG. 1 is an exploded view showing a housing frame and an electrical connector according to a preferred embodiment of the present invention.

[0059] Fig.68 and 69 yes Fig.67 A side sectional view of a housing and an electrical connector. DETAILED DESCRIPTION

[0060] Figure 1 and 2 FIG. 2 shows a transceiver 30 according to a first preferred embodiment of the present invention, which is plugged into a housing 10 having an attached heat sink 20, and FIG. Fig.29 and 30 A housing 10 with an attached heat sink 20 is shown according to a second preferred embodiment of the present invention.

[0061] although Fig.29 and 30 The transceiver 30 is not shown in the figure, but the transceiver 30 can also be plugged into the housing 10 of the second preferred embodiment of the present invention. The transceiver 30 may include any suitable transceiver, including, for example, a transceiver suitable for QSFP+, CXP or SFP+ standards. The transceiver 30 can be electrical and / or optical. Although the transceiver 30 usually sends and receives signals, the transceiver 30 can also only send signals or only receive signals.

[0062] The housing 10 of the preferred embodiment is preferably made of stamped metal, but other suitable materials may also be used, and the housing 10 may include spring arms. The spring arms may transmit forces on the heat sink 20, may constrain the movement of the heat sink 20 in at least one direction in the plane defined by the opening 13, and may allow the heat sink 20 to move in a direction perpendicular to or substantially perpendicular to the plane defined by the opening 13. Examples of spring arms include the arm 12 of the first preferred embodiment and the spring 11 of the second preferred embodiment. The spring arm may extend into the opening 13 of the housing 10 and may extend into the housing 10, that is, extend below the plane defined by the opening 13. The spring arm may extend from the housing 10 in the same substantially first direction to allow the heat sink 20 to slide onto the housing 10 in a direction opposite to the first direction to attach the heat sink 20 to the housing 10. Once the heat sink 20 is attached to the housing 10, the spring arm may either prevent the heat sink 20 from moving in any direction in the plane defined by the opening 13, or may prevent the heat sink 20 from moving except in the first direction. If the spring arms allow the heat sink 20 to move in a first direction, the heat sink 20 can be releasably attached to the housing 10. For example, the heat sink 20 can be detached from the housing 10 by sliding the heat sink in the first direction.

[0063] When manufacturing the housing 10, the arm 12 or the spring 11 is preferably stamped and formed so that the housing 10 and the arm 12 or the housing 10 and the spring 11 define a unitary body, that is, define a single integral structure. Other possible arrangements of the spring arm are also possible. For example, the housing 10 can be stamped and then the spring arm can be attached to the housing 10. Different housings 10 can be used for transceivers 30 of different standards. Within a single standard, the housing 10 can accept transceivers of different heights. For example, the housing 10 can accept QSFP+ transceivers of different heights. The different heights in each transceiver 30 can be caused by manufacturing tolerances or deliberate design decisions. Each housing 10 of the preferred embodiment of the present invention includes a first wall and a second wall connected by a third wall, and the third wall includes an opening 13 that can accommodate a portion of the heat sink 30. As shown Fig.56 As shown, the housing 10 may include a fourth rear wall and a fifth wall, which is opposite to the third wall. When the transceiver 30 is inserted into the housing 10, the spring 18 may extend from the fifth wall to push the transceiver 30 toward the third wall. Any number of springs 18 may extend from the fifth wall. The spring 18 on the fifth wall may have a similar spring force within a similar deflection range as the cantilever 12 on the third wall of the first preferred embodiment of the present invention or the spring 11 on the third wall of the second preferred embodiment of the present invention.

[0064] Spring arms such as spring 11 and arm 12 press against heat sink 20 so that when transceiver 30 is inserted into housing 10, heat sink 20 is automatically biased against transceiver 30. No external force needs to be applied to housing 10 or heat sink 20 to ensure that heat sink 20 engages with transceiver 30. Fig.68 and 69 The housing 10 and the electrical connector 60 are shown. Fig.68 The transceiver 30 is shown inserted into the housing 10, and Fig.69 The housing 10 is shown without the transceiver 30. Fig.68 and 69 In the embodiment of the present invention, the spring 11 pushes the heat sink 20 toward the bottom of the housing 10, which causes the transceiver 30 to be pushed toward the bottom of the housing 10, while the spring 18 pushes the transceiver 30 toward the top of the housing 10. Similar spring forces allow the transceiver PCB to align with the opening of the connector in the housing regardless of the transceiver size, and similar spring forces reduce the asymmetric loading force of the transceiver PCB on the contacts inside the electrical connector 60, which reduces or eliminates excessive forces on the lower row of contacts, thereby improving the wear characteristics of the electrical connector 60. Because the arm 12 and the spring 11 engage the surface of the heat sink 20 that contacts the transceiver 30, i.e., the bottom surface of the heat sink 20, no spring or strip engaging the top, side, or rear surfaces of the heat sink 20 is required.

[0065] Although any size opening 13 may be used in the housing of the preferred embodiment of the present invention, a larger opening allows for a larger area of ​​direct contact between the heat sink 20 and the transceiver 30. In applications where heat is generated only in a localized area of ​​the transceiver 30, a single smaller opening may be provided that includes the localized heat generating area. Figure 3 and 32 In the embodiment of the present invention, the opening 13 in the housing 10 is usually bounded, i.e. completely closed, and defined by four sides. However, other opening arrangements are also possible. The opening 13 may be unbounded, i.e. not completely closed, or may be defined by two, three or more than four sides. For example, the opening may be a bounded triangle with three sides, or may be an unbounded V-shape located along the edge of the housing 10, so that the opening 13 is not completely closed and so that the V-shape is defined by only two sides.

[0066] The heat sink 20 of the preferred embodiment of the present invention is preferably made of a thermally conductive material including, for example, metal. The heat sink 20 may have any suitable shape, including, for example, a substantially rectangular shape, such as Figure 8 and 38. In some applications, where the length of the housing extending in the transceiver insertion direction is longer than the width of the housing perpendicular or substantially perpendicular to the transceiver insertion direction, the heat sink 20 preferably does not have a circular or substantially circular shape. The heat sink 20 includes a spring arm receiver that engages with the spring arm of the housing 10. In a first preferred embodiment, the spring arm receiver is a retaining pin 22 or 26 that engages with the arm 12, and in a second preferred embodiment, the spring arm receiver is a recess 41 that engages with the spring 11. If the spring arm receiver is a recess 41, the spring arm receivers can each extend in the first direction to allow the heat sink 20 to slide relative to the housing 10 when the heat sink 20 is attached to the housing 10.

[0067] like Figure 1 , 29 , 53 and 55, the heat sink 20 may include fins 21 that extend perpendicular or approximately perpendicular (within manufacturing tolerances) to the transceiver insertion direction or extend parallel or approximately parallel (within manufacturing tolerances) to the transceiver insertion direction. The fins 21 can also be oriented in other directions. Any number of fins 21 can be used. Heat dissipation structures other than fins 21 can be used. For example, heat dissipation pins or posts 63 can be used instead of fins 21 or in addition to fins 21, such as Fig.66 As shown in FIG. Instead of fin 21, as Fig.52 As shown, as disclosed in U.S. Application No. 15 / 261,295, which is incorporated herein by reference in its entirety, the heat sink 20 may include air flow channels extending parallel or substantially parallel (within manufacturing tolerances) to the transceiver insertion direction of the housing 10. These air flow channels may include a hexagonal cross-section, for example, as disclosed in U.S. Application No. 15 / 261,295. Figure 3 As shown in, or including any other suitable cross-sectional shape. Fig.54 As shown, the air flow channel can also extend perpendicularly or approximately perpendicularly (within manufacturing tolerances) to the transceiver insertion direction. The air flow channel in the heat sink 20 is preferably arranged so that when the housing 10 with the heat sink 20 is installed, for example, Fig.24 and 25 When arranged in an array as shown, the air flow channels extend between the front and rear of the frame array, or between the sides of the frame array. As disclosed in U.S. Application No. 15 / 261,295, a blower can be used to force air through the air flow channels to increase the amount of cooling.

[0068] like Figure 62-65 As shown, a heat sink 20 having a zipper-like structure 72 and a base 73 may be used. The zipper-like structure 72 may be attached to the base 73 in any suitable manner, including, for example, welding or bonding. Fig.64 and 65As shown, the heat sink 20 may include a hole 43 through which a tool may be used to disengage the retaining latch 19. Fig.64 and 65 If the heat sink 20 is used with the housing 10 of the first preferred embodiment, the holes 43 are not required. The zipper-like structure 72 provides a high density structure for heat dissipation. The zipper-like structure 72 can be made by joining individually stamped fins together. Because each fin is stamped individually, each fin can have any suitable shape and can include other stamped features. The zipper-like structure 72 can also be used with Fig.60 and 61 The heat pipe 70 is used together. Fig.62 and 63 As shown, the width of the zipper-like structure 72 and the base 73 may be greater than the width of the housing 10 , which increases the heat dissipation of the heat sink 20 compared to structures with the same width, but increases the PCB area required for the housing 10 .

[0069] like Figures 67-69 As shown, the housing 10 of the preferred embodiment of the present invention may include an electrical connector 60, into which the transceiver 30 is plugged. The electrical connector 60 provides a mechanical connection to fix the transceiver 30 to the mounting substrate 61 and an electrical connection between the transceiver 30 and the mounting substrate 61. Any suitable substrate may be used as the mounting substrate 61, including, for example, a PCB. The housing 10 of the preferred embodiment of the present invention may include, for example, a device such as that disclosed in U.S. Application No. 15 / 261,295. Fig.11 The electrical connector 60 may include electrical contacts and be directly connected to the mounting substrate 61 in a fixed arrangement, such as disclosed in U.S. Application No. 15 / 261,295. Figure 5 A, or the electrical connector may include a cable 62, which may be a high speed and / or low speed cable, and may be connected to the mounting substrate 61 in a floating arrangement via the cable 62, such as by U.S. Application No. 15 / 261,295. Figure 5 A is shown on the upper connector. Although not in Fig.69 , but if desired, a thermal path can be provided between the block 42 and the electrical connector 60. For example, the block 42 can extend further into the housing 10m, and a thermally conductive material can be provided on the electrical connector 60 to establish a thermal path between the electrical connector 60 and the heat sink 20.

[0070] According to a preferred embodiment of the present invention, the heat sink 20 floats relative to the housing 10 and moves up and down within the housing. The floating heat sink 20 that moves up and down can accommodate transceivers 30 of different heights. The floating heat sink 20 can self-level relative to the transceiver 30 to ensure proper mechanical connection between the transceiver 30 or a connector inserted into the housing 10 and the heat sink 20.

[0071] The heat sink 20 of the preferred embodiment of the present invention may include a ramp 28a near the front of the housing 10 where the transceiver 30 is inserted into the housing 10. When the transceiver 30 is inserted into the housing 10, the front of the transceiver 30 engages with the ramp 28a to push the floating heat sink 20 upward. When the transceiver 30 is fully inserted into the housing 10, the arm 12 in the first preferred embodiment or the spring 11 in the second preferred embodiment pushes the heat sink 20 downward to contact the transceiver 30, thereby establishing a thermal conductive path between the transceiver 30 and the heat sink 20.

[0072] like Figure 59-61 As shown, a heat pipe 70 may be used instead of the heat sink 20 . Fig.57 The housing frame 10 shown in the figure can accommodate a heat sink 20 or a heat pipe 70. The heat pipe 70 includes a base 71 connected to the housing frame 10 by a spring 11. Although not shown in the drawings, liquid cooling can also be used instead of the heat sink 20 or the heat pipe 70. The liquid cooler can be attached to the housing frame 10 in a similar manner to the heat sink 20 and the heat pipe 70, so that the liquid cooler floats within the housing frame 10.

[0073] The housings 10 may be arranged in an array, for example, as in Fig.24 , 25 and 57. Each heat sink 20 floats independently relative to the housing 10 to which it is attached, ie, each heat sink 20 is independently biased. Fig.24 and 25 Five housing frames 10 are shown arranged in a straight line adjacent to each other. Fig.57 Three housing frames 10 are shown arranged adjacent to each other in a straight line. However, any number of housing frames 10 may be aligned adjacent to each other. Fig.24 and 25 In the embodiment, each housing frame 10 includes a heat sink 20, and in Fig.57 In the embodiment, two of the housings 10 include the heat sink 20, and one of the housings 10 does not include the heat sink 20. Fig.24 , 25 In 57, because the housing 10 or the heat sink 20 has no structure extending laterally outward, the housings 10 can be directly adjacent to each other, which reduces the amount of PCB area required for the housing 10. Fig.62 and 63 As shown, the heat sink 20 may also be extended laterally outward from the housing frame 10 to increase the heat dissipation of the heat sink 20 .

[0074] For example, a 1U (1.752 inch) rack unit may include an array of 1×32 racks arranged side by side. When operating at a temperature of 70°C or less, the heat sink 20 of the preferred embodiment of the present invention can dissipate up to approximately 14 W / rack. Therefore, in a rack unit with 32 channels, the heat sink 20 of the preferred embodiment of the present invention can dissipate sufficient heat to ensure proper operation of the transceiver 30 when each channel generates up to 14 W / channel at an operating temperature of 70°C or less. These thermal requirements can be met using only the heat sink 20 of the preferred embodiment of the present invention. No other heat dissipation structure is required to ensure proper operation of the transceiver 30 and other electronic components within the rack unit. To meet these thermal requirements, for example, Fig.62 and 63 A heat sink 20 is shown extending laterally outward and increasing the amount of heat dissipated.

[0075] The first preferred embodiment of the present invention

[0076] Figure 1 and 2 A transceiver 30 according to a first preferred embodiment of the present invention is shown plugged into a housing 10 with a heat sink 20 attached. Figure 3-7 A housing 10 of a first preferred embodiment of the present invention is shown. The housing 10 includes an arm 12 extending into an opening 13 in the housing 10. The arm 12 is used to secure the heat sink 20 to the housing 10 so as to allow the heat sink 20 to float when the transceiver 30 is not inserted into the housing 10, and to allow the heat sink 20 to be pushed into contact with the transceiver 30 when the transceiver 30 is inserted into the housing 10 through the opening 14.

[0077] When manufacturing the housing 10, the arms 12 are preferably stamped and formed so that the housing 10 and the arms 12 define a unitary body, i.e., a single one-piece structure. Other possible arrangements are also possible. For example, the housing 10 can be stamped, and then the arms 12 can be attached to the housing 10 so that each arm 12 extends into the opening 13 of the housing 10.

[0078] Each arm 12 may extend from the housing 10 in the same general direction. Figure 5 In the embodiment of the present invention, each arm 12 extends from the housing 10 towards the top of the housing. Figure 3-5 Four arms 12 are shown, but any number of arms may be used, including, for example, two arms. Each arm 12 may include a slot 17 with an insertion hole 15 at one end of the slot 17 and a locking hole 16 at the other end of the slot 17. Figure 7As shown, the insertion hole 15 is larger than the locking hole 16. The insertion hole 15 is a hole into which the retaining pin 22 of the heat sink 20 can be inserted. Once the retaining pin 22 is inserted into the insertion hole 15, the heat sink 20 can slide along the narrow slot 17 until the retaining pin 22 is locked into the locking hole 16. The locking hole 16 locks the heat sink 20 to the housing frame 10, preventing the heat sink 20 from moving in the plane defined by the opening 13 and preventing the heat sink 20 from being disengaged from the housing frame 10.

[0079] Alternatively, if Fig.26 As shown, one or more of the arms 12 may include a slot 17 having a single hole, namely the insertion hole 15 located at one end of the slot 17. Without the locking hole 16, the arm 12 prevents the heat sink 20 from moving in the plane defined by the opening 13 except along the direction defined by the slot 17, thereby allowing the heat sink 20 to slide back and forth along the slot 17 and disengage from the housing 10. Fig. 27 An alternative retaining pin 26 is shown which includes a post 27 having a single diameter. Fig. 27 The preferred embodiment shown does not have locking holes 16, so the post 27 replacing the retaining pin 26 does not need a second diameter. Fig.28 As shown, an alternative retaining pin 26 is placed through the insertion hole 15, and when the heat sink 20 slides forward, a retaining key 23 on the body of the heat sink 20 can be used to engage the housing 10 to prevent the alternative retaining pin 26 from sliding backward to the insertion hole 15, thereby retaining the heat sink 20.

[0080] like Figure 3-5 As shown in Figures 26, the arm 12 is cantilevered so that the arm 12 extends into the housing 10, that is, below the plane defined by the opening 13. The arm 12 provides a downward force on the heat sink 20 so that when the transceiver 30 is plugged into the housing 10, the heat sink 20 will contact the transceiver 30. The arm 12 automatically biases the heat sink 20 against the transceiver 30. The arm 12 allows the heat sink 20 to float and move up and down. The floating heat sink 20 that moves up and down can accommodate transceivers of different heights. The heat sink 20 does not require springs or bands that apply force on the top surface, side surfaces, or rear surface of the heat sink 20. ... Fig.56 As shown, the housing 10 may include springs 18 on the bottom that will float the heat sink 20 ( Fig.56 The spring 18 on the bottom can have a similar spring force to the arm 12 within a similar deflection range, which allows the transceiver PCB to be connected to the electrical connector 60 ( Fig.56 The openings (not shown) are aligned and reduce the asymmetric loading forces of the transceiver PCB on the cage connector contacts.

[0081] although Figure 3-7The housing 10 in FIG. 1 is preferably rectangular, but the housing 10 may have any suitable shape. Figure 3-7 Only a basic outline of the housing 10 is shown, but the housing 10 may have additional structure. For example, the housing 10 may include additional openings, including, for example, for thermal management. As described above, the housing 10 may also have different mounting structures. For example, the housing 10 may include press-fit pins that may be inserted into holes in the PCB, or may include through-hole pins or SMT tabs that may be soldered to the PCB.

[0082] Figure 8-11 A heat sink 20 is shown. The heat sink 20 includes a retaining pin 22 extending from a body of the heat sink 20. Fig. 9 and 11 Four retaining pins 22 are shown, but any number of retaining pins may be used. The number of arms 12 and the number of retaining pins 22 are typically the same. Each retaining pin 22 includes a post 25 and a cap 24. Fig.10 As shown, preferably, the distance that the retaining pin 22 extends from the bottom of the heat sink 20 is less than the distance that the protrusion 28 extends from the bottom of the heat sink 20, which ensures that the protrusion 28 engages with the transceiver 30 without the retaining pin 22 interfering with the transceiver 30. The diameter of the post 25 is less than the width of the slot 17, while the diameter of the cap 24 is greater than the width of the slot 17, greater than the diameter of the locking hole 16, and less than the diameter of the insertion hole 15. The dimensions of the post 25 and the cap 24 allow the retaining pin 22 to be inserted into the insertion hole 15, slide along the slot 17, and be locked in place by the locking hole 16. As shown in FIG. Fig.17 As shown, the post 25 may include a second diameter that is the same or substantially the same as the diameter of the locking hole 16 within manufacturing tolerances, which ensures that the retaining pin 22 is locked in the arm 12 .

[0083] The heat sink 20 includes a protrusion 28 that extends from the body of the heat sink 20 and into the opening 13 when the heat sink 20 is attached to the housing 10. The protrusion 28 extends into the opening 13 to contact the transceiver 30 and other components located inside the housing 10 or only the transceiver 30. Figure 5 and 9 As can be seen, the profile of the protrusion 28 can match the profile of the opening 13 including the arm 12. The profiles of the protrusion 28 and the opening 13 may not match, but allow the protrusion 28 to match the largest area, which provides the most heat conduction. The profile can define any shape. Fig.11 As shown, the protrusion 28 defines two superimposed quadrilaterals in a plan view, i.e., a rectangular perimeter superimposed on a square perimeter. This shape can maximize surface area contact between a transceiver or other connector inserted into the cage 10, and can provide a keying feature to align the heat sink 20 with the opening 13 in the cage 10. Profiles or perimeters other than rectangular shapes can be used.

[0084] The heat sink 20 may also include an insertion key 29 and a retention key 23. The insertion key 29 helps orient the heat sink 20 relative to the housing 10, while the retention key 23 prevents the heat sink 20 from being disengaged from the housing 10.

[0085] Figure 12-18 A first step of attaching the heat sink 20 to the housing 10 is shown. Figure 12-16 1 and 2 are various views showing the retaining pin 22 inserted into the insertion hole 15. If the heat sink 20 includes an insertion key 29, the insertion key 29 may help orient the heat sink 20 relative to the housing 10. Fig.16 FIG. 2 is an enlarged view of the arrangement of the retaining key 23 and the inserting key 29 relative to the housing frame 10. Fig.16 In this position shown, the insertion key 29 is inside the opening 13 and the retention key 23 is outside the opening 13. The retention key 23 may include a ramp 23a that engages the cage 10 as the retention pin 22 slides in the slot 17. The retention key ramp 23a pushes the cage 10 away from the heat sink 20. Fig.17 and 18 1 is an enlarged view of the housing 10 and heat sink 20 after the retaining pin 22 slides along the slot 17 and engages the locking hole 16. The bottom of the retaining key 23 engages the top of the housing 10 so that the arm 12 extends out of the opening 13. Figure 1 and 2 This same location is also shown.

[0086] Figure 19-23 1 are various views showing the heat sink 20 attached to the housing 10. The heat sink 20 is in its final position relative to the housing 10. The retention key 23 and the insertion key 29 are both within the opening 13, and the arm 12 extends into the housing 10. The surface of the retention key 23 opposite the ramp 23a prevents the heat sink 20 from being disengaged from the housing 10. When the transceiver 30 is inserted into the housing 10, the arm 12 acts as a spring to push the protrusion 28 against the transceiver 30. The protrusion 28 may include a ramp 28a that engages the front of the transceiver 30 as the transceiver 30 is pushed into the housing 10.

[0087] Using the housing 10 of the first preferred embodiment, the following can be used: Figure 59-61 The heat pipe 70 shown or Fig.64 and 65 The zipper-like structure 72 and base 73 are shown, rather than a heat sink. Cap 24 and retaining pins 22 or 26 may be attached to base 71 of heat pipe 70 or base 73 of zipper-like structure 72 so that arm 12 may secure base 71 or 73 to housing 10 of the first preferred embodiment.

[0088] Fig.24 and 25An array of housings 10 with heat sinks 20 is shown. Fig.24 and 25 In the embodiment, five frames 10 are arranged adjacent to each other in a straight line. However, any number of frames 10 can be aligned adjacent to each other. Because there is no structure extending laterally outward from the frames 10 or the heat sink 20, the frames 10 can be directly adjacent to each other, which reduces the amount of PCB area required for the frames 10.

[0089] The housing frame 10 of the first preferred embodiment may include a first wall and a second wall spaced apart from each other and a third wall spanning the first wall and the second wall. The first wall, the second wall or the third wall may include or define an opening 13, and two or more arms 12 may each extend into the opening 13. The housing frame 10 may also include a fourth rear wall perpendicular to the third wall, a fifth bottom wall (not shown) parallel to the third wall, and an opening 14, the opening 14 being configured to receive a module, a transceiver or some other electrical or optical interconnect. The first wall may include a first edge and an opposite second edge. The second wall may include a third edge and an opposite fourth edge, and the third wall may include a fifth edge and an opposite sixth edge. The first wall and the second wall may be parallel or substantially parallel to each other. The fifth edge of the third wall may be attached to the first edge of the first wall, and the opposite sixth edge of the third wall may be attached to the third edge of the second wall. The opposite second edge of the first wall and the opposite fourth edge of the second wall are configured to be positioned adjacent to a mounting substrate (not shown) such as a PCB. The second and fourth edges of the first and second walls may further define a board or substrate mounting tail, such as a press fit, eye of needle (EON) flex pin, or surface mount technology (SMT) tail. The EON flex pin is shown on the housing 10 of the second preferred embodiment of the present invention, for example, as Fig.29 The two or more arms 12 may each extend into the opening 13 in a plane having the first wall, the second wall, or the third wall, in a direction away from the third wall or the top wall and toward an opposite second edge of the first wall or an opposite fourth edge of the second wall, or in a direction away from the fins 21 of the heat sink 20.

[0090] The second preferred embodiment of the present invention

[0091] Fig.29 and 30 A housing 10 with an attached heat sink 20 is shown according to a second preferred embodiment of the present invention. Fig.29 and 30 The frame 10 and the heat sink 20 in the Figure 1 and 2 The housing 10 and heat sink 20 in FIG. 1 share some similarities, but there are some differences, including how the heat sink 20 is attached to the housing 10 and how the heat sink 20 and housing 10 are prevented from detaching from each other.

[0092] exist Figure 1 and 2 In the embodiment, the heat sink 20 is attached to the frame 10 using the pins 22 or 26 on the heat sink 20 and the arms 12 on the frame 10, while in Fig.29 and 30 In the embodiment shown in FIG. 1 , the heat sink 20 is not provided with pins but is attached to the housing frame 10 using springs 11 on the housing frame 10 that engage with recesses 41 in the heat sink 20 . Fig.30 4 is a side cross-sectional view showing the spring 11 engaged with the recess 41 in the heat sink 20. The spring 11 is preferably a leaf spring having an S-shape, such as Fig.30 As shown, however other suitable springs and shapes may be used.

[0093] like Fig.10 As shown, the heat sink 20 of the first preferred embodiment is prevented from being separated from the housing 10 by the retaining key 22 in the heat sink 20, and as shown in FIG. Fig.31 As shown, the heat sink 20 of the second preferred embodiment is prevented from being separated from the housing 10 by a retaining latch 19 on the housing 10 engaging with a block 42 on the heat sink 20 . Fig.32 and 57 Different possible arrangements of the retaining latch 19 relative to the opening 13 are shown. Fig.32 The retaining latch 19 is shown in the opening 13 in the rear of the housing 10 further away from the opening 14 . Fig.57 The retaining latch 19 is shown in the opening 13 in the front of the housing 10 closer to the opening 14. Fig.57 As shown, the retaining latch 19 can be laterally displaced.

[0094] When the frame is manufactured, the springs 11 are preferably stamped and formed so that the frame 10 and the springs 11 define a unitary body, i.e., a single one-piece structure. Other possible arrangements are also possible. For example, the frame 10 can be stamped, and then the springs 11 can be attached to the frame 10 so that each spring 11 extends into the opening 13 of the frame 10.

[0095] Each spring 11 may extend from the housing 10 in the same general direction. Fig.30 In the embodiment, each spring 11 extends from the housing frame 10 toward the bottom of the housing frame. Fig.32 As shown, the housing 10 may include two openings 13 , and two springs 11 may extend into each opening 13 . Figure 32-34Four springs 11 are shown, but any number of springs may be used, including, for example, two springs, and any arrangement of the springs may be used, including, for example, two springs in one opening 13 and no springs in the other opening 13, or one spring in each opening. Any suitable number and arrangement of openings 13 may also be used. The heat sink 20 is slid onto the housing 10 in a first direction so that the springs 11 engage the recesses 41 of the heat sink 20. The springs 11 then prevent the heat sink 20 from moving in the plane defined by the openings 13, except in a direction opposite to the first direction.

[0096] like Fig.32 As shown, the spring 11 extends into the opening 13 of the housing 10 and as shown in FIG. Fig.35 As shown, the end frame of the spring 11 at the distal end of the spring 11 opposite to the portion of the spring 11 attached to the frame 10 includes a joint located within the plane defined by the opening 13, and the remaining portion of the spring 11 is located above the plane defined by the opening 13. Fig.35 As shown, the spring 11 can have a generally S-shape, wherein the spring 11 is folded back onto itself and the engagement portion extends from the top of the S-shape downwardly toward the housing 10. Other suitable shapes and arrangements are also possible, including, for example, the end of the spring 11 and the engagement portion being located above or below the plane defined by the opening 13, depending on the size and location of the recess 41 in the heat sink 30.

[0097] Each spring 11 is inserted into a corresponding recess 41 in the heat sink 20 to engage the heat sink 20. The spring 11 provides a downward force on the heat sink 20 so that when the transceiver 30 is plugged into the housing 10, the heat sink 20 will contact the transceiver 30. The spring 11 automatically biases the heat sink 20 against the transceiver 30. The spring 11 allows the heat sink 20 to float and move up and down. The floating heat sink 20 that moves up and down can accommodate transceivers of different heights. The heat sink 20 does not require springs or belts that apply force on the top surface, side surface, or rear surface of the heat sink 20. The springs 11 on the housing 10 apply a downward force on the recess 41 in the heat sink 20. As Fig.56 As shown, the cage 10 may include a spring 18 on the bottom that pushes the floating heat sink 20 upward toward the top of the cage 10. The spring 18 on the bottom may have a similar spring force within a similar deflection range as the spring 11 on the top, which allows the transceiver PCB to align with the opening of the electrical connector 60 and reduces asymmetric loading forces of the transceiver PCB on the cage connector contacts.

[0098] although Figure 32-36The housing 10 in the embodiment is preferably rectangular, but the housing may have any suitable shape. Instead of the EON flex pins, the housing 10 may have a different mounting structure. For example, the housing 10 may include press-fit pins that may be inserted into holes in a PCB, or may include through-hole pins or SMT tabs that may be soldered to a mounting structure such as a PCB.

[0099] Figure 37-40 1 shows a heat sink 20 according to a second preferred embodiment of the present invention. The heat sink 20 includes a recess 41 that receives the spring 11 on the housing 10. Any number of recesses 41 may be used, including, for example, two recesses. The number of recesses 41 in the heat sink 20 preferably corresponds to the number of springs 11 on the housing 10. The recesses 41 may each extend in the same general direction opposite to the direction in which the springs 11 extend to allow the heat sink 20 to slide relative to the housing 10. The recesses 41 may be open, with holes in the heat sink 20 above the recesses 41, such as Figure 52-55 As shown, or the recess 41 can be closed, without a hole in the heat sink 20 above the recess 41, as shown in FIG. Fig.38 and 44 The hole on the top of the heat sink 20 allows the heat sink 20 to be manufactured as a single part by extrusion and then using secondary machining to create the spring contact area of ​​the pocket 41 .

[0100] The heat sink 20 includes a block 42 that extends into one of the openings 13 of the frame 10 when the heat sink 20 is attached to the frame 10, and the block 42 engages with the retaining latch 19 of the frame 10, which prevents the heat sink 20 from being detached from the frame 10. The heat sink 20 can be releasably attached to the frame 10. For example, the heat sink 20 can include a hole 43, through which a tool can be inserted to disengage the retaining latch 19 from the block 42, so that the heat sink 20 can be detached from the frame 10. The hole 43 can have any suitable shape and can be located at any position so that the tool can disengage the retaining latch 19 from the block 42. The tool can be, for example, a pin, but other suitable tools can also be used. The hole 43 is optional, but without the hole 43, the heat sink 20 cannot be easily detached from the frame 10 without damaging the frame 10. As shown in FIG. Figure 59-61 As shown, the hole 43 can be Fig.57 The retaining latch 19 is offset in a similar manner.

[0101] Fig.58 Shows the suitability with Fig.57 The housing frame 10 is used together with the bottom of the heat sink 20 . Fig.69 The retention latch 19 is shown engaged with the insert key 29 of the heat sink 20, while Fig.31 The retention latch 19 is shown engaged with the block 42 of the heat sink 20 . Fig.58 The insert key 29 can be used with Fig.57The retaining latch 19 is offset in a similar manner.

[0102] The heat sink 20 includes a protrusion 28 that extends from the body of the heat sink 20 and into the opening 13 when the heat sink 20 is attached to the housing 10. The protrusion 28 extends into the opening 13 to contact the transceiver 30 and other components located inside the first wall, the second wall, and the third wall of the housing 10 or only the transceiver 30. Fig.32 and 38 As can be seen, the profile of the protrusion 28 can match the profile of the opening 13 including the spring 11. The profiles of the protrusion 28 and the opening 13 may not match, but allow the protrusion 28 to match the largest area, which provides the most heat conduction. The profile can define any shape. Fig.40 As shown, the protrusion 28 defines two superimposed quadrilaterals in a plan view, i.e., a rectangular perimeter superimposed with a square perimeter. The profile of the protrusion 28 can maximize the surface area contact between a transceiver or other connector inserted into the cage 10, and can provide a keying feature to align the heat sink 20 with the opening 13 in the cage 10. Profiles or perimeters other than rectangular shapes can be used.

[0103] The protrusion 28 may include an insertion key 29 and may be configured so that only certain types of transceivers can be fully inserted into the housing 10. For example, Fig.40 As shown, the insertion key 29 can be offset to one side in a direction perpendicular or substantially perpendicular to the transceiver insertion direction. The offset insertion key 29 allows only QSFP and QSFP double density transceivers to be inserted into the cage 10.

[0104] Using the housing frame 10 of the second preferred embodiment of the present invention, the following can be used: Figure 59-61 The heat pipe 70 shown or Fig.64 and 65 The zipper-like structure 72 and the base 73 are shown instead of the heat sink 20. Fig.60 As shown, the base 70, 73 may include a recess 41 that engages the spring 11 on the housing 10 of the second preferred embodiment.

[0105] In the second preferred embodiment of the present invention, the components of the housing 10 and the heat sink 20 are Figure 12-23 The assembly of the frame 10 and heat sink 20 of the first preferred embodiment shown in FIG. 1 is similar in that the heat sink 20 is placed on top of the frame 10 and slid forward to attach the heat sink 20 to the frame 10 with the retention latches 19 engaging with the blocks 42 on the underside of the heat sink 20. If the heat sink 20 includes holes 43, the heat sink 20 can be removed from the frame 10 by inserting a tool into the holes 43 on the top of the heat sink 20 to deflect the retention latches 19 and slide the heat sink 20 backward.

[0106] Figures 41-48 An alternative heat sink 20 is shown which may be used with Figure 32-36 The heat sink 20 is similar to the heat sink 20 shown in FIG. 2 except that the alternative heat sink 20 includes a heat spreader 45 and a heat radiator 46 that can be connected to each other. Figure 37-40 The heat spreader 45 includes a groove 47 that engages with an arm 48 on the heat radiator 46. Fig.41 and 42 An alternative heat sink 20 is shown, in which the heat spreader 45 and the heat radiator 46 are connected to each other, and the alternative heat sink 20 is connected to the heat spreader 45 and the heat radiator 46 by the spring 11 (in Fig.41 and 42 ) and retaining latch 19 (as shown Fig.42 sectional view) is connected to the housing frame 10.

[0107] Fig.43 and 44 An alternative heat sink 20 is shown in which the heat spreader and the heat radiator are connected to each other. Fig.37 and 38 Like the heat sink shown in , the alternative heat sink includes a block that engages a retention latch on the housing, a hole that can be used to disengage the retention latch from the block, and a projection having a ramp.

[0108] Fig.45 A front view of a heat radiator is shown. The heat radiator comprises arms that engage corresponding grooves in the heat diffuser and comprises fins that extend away from the heat diffuser. The heat radiator may comprise aluminum or other suitable material.

[0109] Figures 46-50 A heat diffuser 45 is shown. The heat diffuser 45 includes a groove 47 that engages with an arm 48 of a heat radiator 46. The heat diffuser 45 and the heat radiator 46 can be attached in any suitable manner, including, for example, riveting, screwing, fixing with a thermally conductive adhesive, welding, thermal bonding using an exothermic reactive foil such as Nanofoil from Indium Corporation, vibration welding, etc. When the transceiver or connector is plugged into the housing 10, the bottom of the heat diffuser 45 contacts the transceiver or connector. The heat diffuser 45 can be made of copper or other suitable thermally conductive material. The heat diffuser 45 can also include an opening 49, which defines a recess 41 when the heat diffuser 45 is connected to the heat radiator 46. As shown Fig.46 and 47 As shown, the heat spreader 45 may further include an insert 50 . Fig.46 A heat spreader 45 with an insert 50 is shown, and Fig.47 The heat spreader 45 is shown without the insert 50. The insert 50 is Fig.514. The insert 50 is shown in FIG. The insert 50 may be a thermally conductive material that bonds the heat diffuser 45 to the heat radiator 46. For example, the insert 50 may be a thermally conductive silicone adhesive or may be solder. The insert 50 preferably eliminates any gaps between the heat diffuser 45 and the heat radiator 46, which will reduce thermal resistance.

[0110] Figure 32-36 The housing 10 of the second preferred embodiment of the present invention is shown. The housing 10 may include first and second spaced-apart walls and a third wall spanning the first and second walls. The first wall, the second wall, or the third wall may include or define one or more openings, and two or more springs 11 may each extend into the opening. The housing 10 may also include a fourth rear wall perpendicular to the third wall, a fifth bottom wall parallel to the third wall, and an opening 14 configured to receive a module, a transceiver, or some other electrical or optical interconnect. The first wall may include a first edge and an opposite second edge. The second wall may include a third edge and an opposite fourth edge, and the third wall may include a fifth edge and an opposite sixth edge. The first and second spaced-apart walls may be parallel or substantially parallel to each other. The fifth edge of the third wall may be attached to the first edge of the first wall, and the opposite sixth edge of the third wall may be attached to the third edge of the second wall. The opposite second edge of the first wall and the opposite fourth edge of the second wall are configured to be positioned adjacent to a mounting substrate such as a PCB. The opposing second and fourth edges of the first and second walls further define an EON flex pin, but other board or substrate mounting tails, such as press fit or SMT tails, may also be used. The two or more springs 11 may each extend generally into the opening 13 in a plane with the first, second or third wall, in a direction away from the third wall or top wall and toward the opposing second edge of the first wall or the opposing fourth edge of the second wall, or in a direction away from the fins 21 of the heat sink 20.

[0111] It should be understood that the foregoing description is only an illustration of the present invention. Without departing from the present invention, those skilled in the art may conceive of various substitutions and modifications. Therefore, the present invention is intended to encompass all of these substitutions, modifications and variations that fall within the scope of the appended claims.

Claims

1. A heat sink configured to be attached to a housing frame, the heat sink comprising: a heat sink body, the heat sink body comprising a first surface and a protrusion extending from the first surface of the heat sink body; a pair of spring arm receivers positioned on the first surface of the heat sink body; a pair of holes in the heat sink body, the pair of holes being spaced apart and each disposed over a respective one of the pair of spring arm receivers; as well as block; among them, When the heat sink is attached to the housing, each of the pair of spring arm receivers is configured to engage a corresponding one of the two spring arms of the housing, and When the heat sink is attached to the frame, the protrusion is configured to extend into a first opening in the frame, and the block is configured to extend into a second opening in the frame.

2. A radiator assembly, comprising: A heat sink configured to be attached to a housing frame, the heat sink comprising: a heat sink body, the heat sink body comprising a first surface and a protrusion extending from the first surface of the heat sink body; a pair of spring arm receivers positioned on the first surface of the heat sink body; a pair of holes in the heat sink body, the pair of holes being spaced apart and each disposed over a respective one of the pair of spring arm receivers; and a block extending from the first surface of the heat sink body; and A frame is attached to the heat sink and includes a first opening and a second opening, wherein each of the pair of spring arm receivers is configured to engage a corresponding one of the two spring arms of the frame when the heat sink is attached to the frame.

3. The heat sink assembly according to claim 2, wherein: Also included is a retention key defined by the first surface of the heat sink body, wherein the retention key is configured to engage the housing to prevent the heat sink from being disengaged from the housing after the heat sink has been attached to the housing.

4. The heat sink assembly according to claim 2, wherein: The heat sink also includes an additional pair of spring arm receivers.

5. The radiator assembly according to any one of claims 2 to 4, characterized in that: The housing comprises: first and second walls spaced apart; and a third wall spanning the first wall and the second wall; and The third wall defines the first opening that receives the protrusion and the second opening that receives the block.

6. The radiator assembly according to any one of claims 2 to 4, characterized in that: The housing also includes a retention latch extending into the first opening.

7. The radiator assembly according to any one of claims 2 to 4, characterized in that: The housing also includes two spring arms extending into the first opening.

8. The radiator assembly according to any one of claims 2 to 4, characterized in that: The housing also includes two spring arms extending into the second opening.

9. The radiator assembly according to any one of claims 2 to 4, characterized in that: The housing also includes two spring arms extending into the first opening and two spring arms extending into the second opening.

10. The radiator assembly according to any one of claims 2 to 4, characterized in that: The heat sink moves up and down in the housing frame.

11. A heat sink configured to be attached to a housing frame, the heat sink comprising: a heat sink body comprising a first surface, a protrusion extending from the first surface of the heat sink body, and a block extending from the first surface of the heat sink body; as well as a pair of spring arm receivers positioned on the first surface of the heat sink body; wherein, When the heat sink is attached to the frame: Each of the pair of spring arm receivers is configured to engage with a respective one of the two spring arms of the housing; and The protrusion is configured to extend into a first opening in the housing, and the block is configured to extend into a second opening in the housing.

12. The heat sink according to claim 11, characterized in that Also included is an insert key defined by the first surface of the heat sink body.

13. The heat sink according to claim 11, characterized in that Also included is a retention key defined by the first surface of the heat sink body, wherein the retention key is configured to engage the housing to prevent the heat sink from being disengaged from the housing after the heat sink has been attached to the housing.

14. The heat sink according to claim 11, characterized in that The heat sink also includes an additional pair of spring arm receivers.

15. The heat sink according to one of claims 1 and 11-14, characterized in that The heat sink body also includes discontinuous fins and is configured to dissipate 14W per chassis at a temperature of 70°C.

16. The heat sink according to one of claims 1 and 11-14, characterized in that Also included is an air flow path extending perpendicular or substantially perpendicular to the transceiver insertion direction.

17. A heat sink assembly, comprising: The radiator according to any one of claims 11 to 14; as well as A frame is attached to the heat sink and includes a first opening and a second opening.

18. The heat sink assembly of claim 17, wherein: The housing comprises: first and second walls spaced apart; and a third wall spanning the first wall and the second wall; and The third wall defines the first opening that receives the protrusion and the second opening that receives the block.

19. The heat sink assembly of claim 17, wherein: The housing also includes a retention latch extending into the first opening.

20. The heat sink assembly of claim 17, wherein: The housing also includes two spring arms extending into the first opening.

21. The heat sink assembly of claim 17, wherein: The housing also includes two spring arms extending into the second opening.

22. The heat sink assembly of claim 17, wherein: The housing also includes two spring arms extending into the first opening and two spring arms extending into the second opening.

23. The heat sink assembly of claim 17, wherein: The heat sink moves up and down in the housing frame.

24. A heat pipe configured to be attached to a housing frame, the heat pipe comprising: a heat pipe body, the heat pipe body comprising a first surface and a protrusion extending from the first surface of the heat pipe body; a pair of spring arm receivers positioned on the first surface of the heat pipe body; as well as a pair of holes in the heat pipe body, the pair of holes being spaced apart and each disposed on a respective one of the pair of spring arm receivers; wherein, Each of the pair of spring arm receivers is configured to engage a corresponding one of the two spring arms of the housing when the heat pipe is attached to the housing.

25. The heat pipe according to claim 24, characterized in that Also included is a retention key defined by the first surface of the heat pipe body, wherein the retention key is configured to engage the frame to prevent the heat pipe from being disengaged from the frame after the heat pipe has been attached to the frame.

26. The heat pipe according to claim 24, characterized in that The heat pipe also includes an additional pair of spring arm receivers.

27. The heat pipe according to claim 24, characterized in that Also included are blocks; wherein, When the heat pipe is attached to the frame, the protrusion is configured to extend into a first opening in the frame, and the block is configured to extend into a second opening of the frame.

28. A heat pipe assembly comprising: The heat pipe of any one of claims 24-27, further comprising a block extending from the first surface of the heat pipe body; as well as A frame is attached to the heat pipe and includes a first opening and a second opening.

29. The heat pipe assembly of claim 28, wherein: The housing comprises: first and second walls spaced apart; and a third wall spanning the first wall and the second wall; and The third wall defines the first opening that receives the protrusion and the second opening that receives the block.

30. The heat pipe assembly of claim 28, wherein: The housing also includes a retention latch extending into the first opening.

31. The heat pipe assembly of claim 28, wherein: The housing also includes two spring arms extending into the first opening.

32. The heat pipe assembly of claim 28, wherein: The housing also includes two spring arms extending into the second opening.

33. The heat pipe assembly of claim 28, wherein: The housing also includes two spring arms extending into the first opening and two spring arms extending into the second opening.

34. A heat pipe configured to be attached to a housing frame, the heat pipe comprising: a heat pipe body comprising a first surface, a protrusion extending from the first surface of the heat pipe body, and a block extending from the first surface of the heat pipe body; as well as a pair of spring arm receivers positioned on the first surface of the heat pipe body; in When the heat pipe is attached to the frame: Each of the pair of spring arm receivers is configured to engage with a respective one of the two spring arms of the housing; and The protrusion is configured to extend into a first opening in the housing, and the block is configured to extend into a second opening in the housing.

35. The heat pipe according to claim 34, characterized in that Also included is an insert key defined by the first surface of the heat pipe body.

36. The heat pipe of claim 34, wherein: Also included is a retention key defined by the first surface of the heat pipe body, wherein the retention key engages the housing to prevent the heat pipe from being disengaged from the housing after the heat pipe has been attached to the housing.

37. The heat pipe according to claim 34, characterized in that The heat pipe also includes an additional pair of spring arm receivers.

38. A heat pipe assembly comprising: A heat pipe as claimed in any one of claims 34 to 37; as well as A frame is attached to the heat pipe and includes a first opening and a second opening.

39. The heat pipe assembly of claim 38, wherein: The housing comprises: first and second walls spaced apart; and a third wall spanning the first wall and the second wall; and The third wall defines the first opening that receives the protrusion and the second opening that receives the block.

40. The heat pipe assembly of claim 38, wherein: The housing also includes a retention latch extending into the first opening.

41. The heat pipe assembly of claim 39, wherein: The housing also includes two spring arms extending into the first opening.

42. The heat pipe assembly of claim 39, wherein: The housing also includes two spring arms extending into the second opening.

43. The heat pipe assembly of claim 39, wherein: The housing also includes two spring arms extending into the first opening and two spring arms extending into the second opening.

44. A shell frame, comprising: a first wall and a second wall spaced apart; a third wall spanning the first wall and the second wall and including a first opening and a second opening configured to receive a heat sink extending into the first opening and the second opening, and a spring arm configured to receive the heat sink and to urge the heat sink against the single transceiver when the single transceiver is inserted into the housing in an insertion direction, wherein The housing is configured to receive only the single transceiver, and A portion of the third wall: including a first end directly connected to the first wall and a second end directly connected to the second wall; extending between the first end and the second end to span the first wall and the second wall; and separating the first opening from the second opening, and The first opening and the second opening are in line with each other in the insertion direction of the single transceiver.

45. A shell frame, comprising: a first wall and a second wall spaced apart; a third wall spanning the first wall and the second wall and including a first opening and a second opening configured to receive a heat sink extending into the first opening and the second opening, and a spring arm configured to receive the heat sink and to push the heat sink against the single transceiver when the single transceiver is inserted into the housing in a transceiver insertion direction, wherein A portion of the third wall: including a first end directly connected to the first wall and a second end directly connected to the second wall; extending between the first end and the second end in a direction perpendicular or substantially perpendicular to the transceiver insertion direction; and separating the first opening from the second opening, and The first opening and the second opening are in line with each other in an insertion direction of a single transceiver.

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