Display device, LED package and manufacturing method thereof

Abstract

The present invention provides a display device, an LED package and a manufacturing method thereof. A colloidal dam is formed around each crystal bonding area on a circuit board to enclose each crystal bonding area, and then the crystal bonding of an LED chip is completed on the crystal bonding area within each colloidal dam. A sealing material covering the LED chip is arranged in each colloidal dam to obtain an LED package. The obtained LED package has the advantages of more uniform light emission, higher light emission efficiency, good integrity, low cost, less influence by thermal expansion, stronger ability to resist thermal stress, etc.; thereby, the display device including the LED package has a good display effect, as well as better product quality and product competitiveness.

Description

Technical Field

[0001] The present invention relates to the field of LED (Light Emitting Diode), and in particular to a display device, an LED package and a manufacturing method thereof. Background Art

[0002] The "Ultra-High Definition Video Industry Development Action Plan (2019-2022)" proposes to implement the overall technical route of "4K first, taking 8K into consideration" to vigorously promote the development of the ultra-high definition video industry and its application in related fields. Using flip-chip small-pitch COB as the backlight of smart screens (LCD TVs) is one of the effective ways to improve video display quality.

[0003] At present, the backlight manufacturing method of COB LED module is to first print solder paste on the substrate and then place the LED chip, test it after reflow soldering, and after the test is OK, mold a transparent resin glue layer with a thickness of about 0.2-0.4mm on the substrate, and then dry it to make a COB LED module. For example, a COB LED module is made. Figure 1 As shown, the finished product includes a substrate 11, an LED chip directly arranged on the substrate 11, and a transparent resin adhesive layer formed by molding and drying above the substrate, namely, an encapsulation adhesive layer 13. This encapsulation adhesive layer 13 is a whole, and its size is close to that of the substrate 11, and its length and width are generally several tens of centimeters; in actual work, the COB LED module with this structure is prone to the situation that the colloid is separated from the substrate or the colloid is cracked, thereby losing the backlight function; at the same time, the LED chip is directly arranged on the circuit board, and there is no reflective cup at the position of the LED chip. The brightness in the linear direction of the LED chip is high, and the brightness between the LED chips is low. There will be differences in brightness and color when emitting light, and the loss of the emitted light is also relatively large; that is, this COB LED module also has the problems of low luminous efficiency, and uneven brightness and color. Summary of the invention

[0004] The present invention provides a display device, an LED package and a manufacturing method thereof, which solve the problems that the packaging glue of the existing LED module is prone to falling off or cracking, resulting in poor reliability, low luminous efficiency, and uneven luminous brightness and color.

[0005] In order to solve the above technical problems, an embodiment of the present invention provides a method for manufacturing an LED package, comprising:

[0006] Prepare a circuit board, wherein a plurality of bonding areas for placing LED chips are distributed on the front of the circuit board, and the plurality of bonding areas are electrically connected through a connecting circuit included in the circuit board, and the LED chip is a mini LED chip or a Micro LED chip;

[0007] Forming a colloidal dam around each of the crystal-bonding areas by printing to enclose the respective crystal-bonding areas, the colloidal dam forming a bowl of an LED wafer to be arranged in the crystal-bonding area, and adjacent crystal-bonding areas are isolated by the colloidal dam;

[0008] Complete the LED wafer bonding in the bonding area within each of the colloid dams;

[0009] A sealing material covering the LED wafer is arranged in each of the colloid dams.

[0010] In one embodiment of the present invention, on the circuit board, in the area around each solid crystal area for forming the colloidal dam, a guide hole for guiding the flow of the colloidal is provided, and when the colloidal forming the colloidal dam is printed around each solid crystal area, part of the colloidal flows into the guide hole and combines with the inner wall of the guide hole after curing.

[0011] In one embodiment of the present invention, forming a colloidal dam around each of the crystal-bonding regions to enclose each of the crystal-bonding regions comprises:

[0012] Printing a colloid around each of the solid crystal areas, wherein the colloid is white glue or transparent glue;

[0013] The printed colloid is solidified to form a colloid dam surrounding each of the crystal-fixing areas.

[0014] In one embodiment of the present invention, forming a colloidal dam around each of the crystal-bonding regions to enclose each of the crystal-bonding regions comprises:

[0015] A colloidal dam is formed around each of the crystal-bonding regions and surrounds each of the crystal-bonding regions with a height of 0.1 mm to 1 mm.

[0016] In one embodiment of the present invention, forming a colloidal dam around each of the crystal-bonding regions to enclose each of the crystal-bonding regions comprises:

[0017] A colloidal dam is formed corresponding to each of the crystal-bonding regions to enclose the crystal-bonding region, and the colloidal dams of adjacent crystal-bonding regions are separated from each other.

[0018] In one embodiment of the present invention, the sealing material may be, but is not limited to, a packaging glue, and the packaging glue provided in each of the colloid dams to cover the LED chip includes:

[0019] Transparent glue, semi-transparent glue or luminescence conversion glue is arranged in each of the glue dams to cover the LED chip, and the height of the packaging glue is less than or equal to the height of the glue dam.

[0020] In one embodiment of the present invention, the sealing material may be, but is not limited to, a packaging glue, and the packaging glue provided in each of the colloid dams to cover the LED chip includes:

[0021] Disposing packaging glue covering the LED chip in each of the glue dams;

[0022] The packaging glue is cured, and the top surface of the packaging glue after curing is a concave or convex arc surface.

[0023] In one embodiment of the present invention, the LED chip is a flip-chip mini LED chip or a flip-chip Micro LED chip.

[0024] In order to solve the above technical problems, an embodiment of the present invention further provides an LED package, and the LED package is manufactured by the LED package manufacturing method as described above.

[0025] In order to solve the above technical problem, an embodiment of the present invention further provides a display device, which includes the LED package as described above.

[0026] Beneficial Effects

[0027] The present invention provides a display device, an LED package and a manufacturing method thereof, comprising preparing a circuit board, wherein a plurality of crystal bonding areas for placing LED chips are distributed on the front of the prepared circuit board, wherein the plurality of crystal bonding areas are electrically connected through a connecting circuit included in the circuit board, and the LED chip may be, but is not limited to, a mini LED chip or a Micro LED chip; a colloid dam is formed around each crystal bonding area on the circuit board by printing to enclose each crystal bonding area, and then the crystal bonding of the LED chip is completed on the crystal bonding area within each colloid dam, and a sealing material covering the LED chip is arranged in each colloid dam. The LED package manufactured by the LED package manufacturing method has at least the following advantages:

[0028] Each die-bonding area can be directly electrically connected through the connection circuit included in the circuit board, so that the LED chips in each die-bonding area are electrically connected to form a backlight source or an illumination source, which has a simple structure and high integration, and better product reliability;

[0029] The colloidal dam formed around each crystal-bonding area can form a cup for the LED chip located in the crystal-bonding area, which can not only protect the LED chip, but also form more uniform light after the light emitted by the LED chip is reflected and mixed through the side wall of the cup, thereby improving the uniformity and brightness of the light (that is, improving the light output efficiency);

[0030] By directly setting a colloidal dam around the die-bonding area on the circuit board, a conductive metal layer (such as a copper layer) on the circuit board and the colloidal dam are used to form a similar LED bracket structure, thereby avoiding the use of a separate LED bracket, which can reduce material costs and manufacturing costs, improve manufacturing efficiency, improve the integrity of the LED package and reduce its thickness;

[0031] Through the printing process, a colloid dam is formed around each solid crystal area to enclose each solid crystal area. The implementation method is simple, the production efficiency is high, the cost is low, and the accuracy can fully meet the needs. The printed colloid has strong coverage and adhesion, and good consistency.

[0032] Since adjacent solid crystal areas on the circuit board are isolated by the colloidal dam, the sealing material (such as but not limited to packaging glue) arranged in the colloidal dam is also isolated by the colloidal dam into multiple small sealing units, so that the manufactured LED package is less affected by thermal expansion and has a stronger ability to resist thermal stress, thereby greatly reducing the occurrence of dead lamps caused by colloidal shedding or cracking, thereby improving the quality and reliability of the product.

[0033] In addition, during the manufacturing process, since the colloid dams surrounding each crystal bonding area on the circuit board are first formed, and then the LED chip is bonded on the crystal bonding area within each colloid dam, compared with the method of first bonding the LED chip on the circuit board and then forming the colloid dams around each crystal bonding area, the LED chip and the circuit connection between the LED chip and the circuit board can be prevented from being damaged during the setting of the colloid dams, so the yield rate and reliability of the obtained product are higher;

[0034] The advantages of the LED package mentioned above enable the display device including the LED package to have a good display effect, as well as better product quality and product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of an existing LED package;

[0036] Figure 2 Schematic diagram of the process of manufacturing the LED package provided by the embodiment of the present invention Figure 1 ;

[0037] Figure 3 Schematic diagram of the process of manufacturing the LED package provided by the embodiment of the present invention Figure 2 ;

[0038] Figure 4 Schematic diagram of an LED package provided by an embodiment of the present invention Figure 2 ;

[0039] Figure 5Schematic diagram of an LED package provided by an embodiment of the present invention Figure 3 ;

[0040] Figure 6 Schematic diagram of an LED package provided by an embodiment of the present invention Figure 4 ;

[0041] Figure 7 for Figures 4 to 6 A three-dimensional schematic diagram of an LED package;

[0042] Figure 8 Schematic diagram of an LED package provided by an embodiment of the present invention Figure 5 ;

[0043] Fig. 9 Schematic diagram of an LED package provided by an embodiment of the present invention Figure 6 ;

[0044] Fig.10 Schematic diagram of an LED package provided by an embodiment of the present invention Figure 7 . DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the following is a further detailed description of the embodiments of the present invention through specific implementation methods combined with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0046] This embodiment provides a method for producing an LED package. Compared with existing LED packages, the produced LED package has at least the advantages of more uniform light output, higher light output efficiency, good integrity, low cost, less impact of thermal expansion, stronger resistance to thermal stress, and better product quality and reliability.

[0047] For ease of understanding, this embodiment is described below in conjunction with Figure 2 The LED package manufacturing method shown is described as an example.

[0048] See also Figure 2 The LED package manufacturing method shown includes:

[0049] S201: Prepare a circuit board.

[0050] It should be understood that the type of circuit board in this embodiment can be flexibly selected, and it can be a flexible circuit board or a non-flexible circuit board, and the material of the circuit board can be flexibly selected, for example, it can be but not limited to epoxy glass fiber board FR-4, FR-1, CEM-1, CEM-3, thick copper foil, high TG circuit board, aluminum-based circuit board, copper-based board, halogen-free board, Rogers high-frequency board, PTFE polytetrafluoroethylene, Teflon Teflon, ceramic board, polyimide (PI), BT material, etc.

[0051] The front of the circuit board in this embodiment is provided with a plurality of solid crystal areas for placing LED chips, and each solid crystal area can be directly electrically connected through the connection circuit included in the circuit board, so that the LED chips in each solid crystal area are electrically connected to form a backlight source or an illumination source, which has a simple structure and high integration, and the product reliability is better. Correspondingly, the solid crystal area is provided with an electrode connection area that is electrically connected to the connection circuit on the circuit board and is used to electrically connect the positive and negative electrodes of the LED chip. In this embodiment, one solid crystal area can be used to set one LED chip, or more than two LED chips can be set according to demand, and when more than two LED chips are set, the electrical connection mode between the LED chips can be series connection, parallel connection, or a combination of series and parallel connection, etc. And the number, type, luminous color of the LED chips set in each solid crystal area and the electrical connection mode between the LED chips can be the same, or different or partially different according to the setting. And the LED chips between each solid crystal area (that is, between each solid crystal area) can be electrically connected according to demand, and the electrical connection mode can be series connection, parallel connection, or a combination of series and parallel connection; of course, in some application scenarios, it can also be set that the LED chips between some solid crystal areas are not electrically connected. The specific settings can be flexibly set according to application requirements.

[0052] In this embodiment, the LED chip disposed in the die bonding area may be, but is not limited to, a mini LED chip or a Micro LED chip. In some application scenarios, the mini LED chip or Micro LED chip disposed may be a flip-chip mini LED chip or a flip-chip Micro LED chip, or may be a normal-mount mini LED chip or a normal-mount Micro LED chip, and the specific configuration may also be flexibly set according to the needs.

[0053] S202: forming a colloidal dam around each die-bonding area on the circuit board to enclose each die-bonding area.

[0054] The colloidal dam formed in this step constitutes a bowl cup of the LED chip to be set in the solid crystal area, so that the light emitted by the LED chip in the solid crystal area can be emitted and refracted through the side wall of the bowl cup and then emitted after mixing, which can not only improve the brightness of the light, but also improve the uniformity of the light; at the same time, the bowl cup can also form physical protection for the LED chip in the solid crystal area, thereby improving the safety of the LED chip.

[0055] In this step, after a colloidal dam is formed around each of the crystal bonding areas on the circuit board to enclose each of the crystal bonding areas, adjacent crystal bonding areas on the front side of the circuit board are isolated by the colloidal dam.

[0056] In addition, it should be understood that the manner in which the colloid dams enclosing each solid crystal area on the circuit board in this embodiment are formed can also be flexibly set. For example, in one example, a colloid can be printed around each solid crystal area on the circuit board by a printing process, and then the colloid is cured to form a colloid dam. By forming a colloid dam enclosing each solid crystal area around each solid crystal area by a printing process, the process is simple, the production efficiency is high, the cost is low, the precision is good, and the printed colloid has strong coverage and adhesion, and good consistency.

[0057] In this embodiment, the type of colloid forming the dam can also be flexibly set according to needs, for example, white glue or transparent glue can be used but not limited to, and the selected white glue or transparent glue can be thermosetting or UV type. One example of setting method may include:

[0058] A steel mesh or a silk screen with a corresponding pattern is arranged on the front side of the circuit board, and the area for forming the colloid dam around each solid crystal area on the circuit board is exposed outside the steel mesh or the silk screen, and other areas on the front side of the circuit board are closely covered by the steel mesh or the silk screen, and then the colloid is printed on the steel mesh or the silk screen so that the colloid for forming the colloid dam is arranged around each solid crystal area;

[0059] The printed colloid is cured (when the colloid is a thermosetting type, it can be cured by high temperature baking, and when it is a UV type, it can be cured by UV irradiation) to form a colloid dam surrounding each of the solid crystal areas.

[0060] It should be understood that in some application scenarios, a colloid dam can also be formed around each solid crystal area on the circuit board by molding; in this case, a steel male mold and a female mold of corresponding structure need to be customized, and the male mold and the female mold clamp the circuit board in the middle, and the corresponding cavity is formed around each solid crystal area on the circuit board for forming a colloid dam. The cavity is connected to the corresponding injection port on the male mold and the female mold, and the other areas on the front of the circuit board are tightly covered by the male mold or the female mold, and then the colloid is injected into the above cavities through the injection port. Compared with the above printing method, this molding method has the disadvantages of complex process, low efficiency, weak colloid coverage and adhesion, and high cost.

[0061] In this embodiment, the height of the formed colloidal dam can be flexibly set according to needs, and the height can be greater than the height of the LED chip; of course, in some application scenarios, it can also be set to be less than or equal to the height of the LED chip according to needs.

[0062] In this embodiment, the height of the colloidal dam is preferably formed to be greater than the height of the LED chip. For example, in one example, the colloidal dam formed around each crystal bonding area on the circuit board to enclose each crystal bonding area may include: forming a colloidal dam around each crystal bonding area on the front side of the circuit board to enclose each crystal bonding area and with a height of 0.1mm to 1mm, wherein the colloidal dam may be 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.7mm, 0.8mm, 0.9mm or 1mm, etc.

[0063] In this example, the shape enclosed by the colloidal dam, that is, the shape of the formed bowl cup, can also be flexibly set according to needs. For example, in one example, considering the light output angles of the side and front of the LED chip, in order to further improve the light output brightness and mixed light effect of the LED chip, the inner side surface of each colloidal dam located in the corresponding solid crystal area can be set as an inclined surface, that is, the inner side surface of the formed bowl cup is an inclined surface, and the inclination angle of the inclined surface (that is, the angle between the inner side surface and the front of the substrate) can also be flexibly set according to needs, for example, it can be set to any angle between 15° and 75° (for example, it can be but not limited to 30°, 45°, 60°), so that the opening size of the bowl cup formed is larger than the size of the bottom of the bowl cup.

[0064] In an example of this embodiment, the colloidal dams surrounding each crystal bonding area on the front side of the circuit board can be connected as one with the colloidal dams between adjacent crystal bonding areas, that is, the colloidal layer forming the colloidal dam on the front side of the circuit board can be an integrally formed colloidal layer.

[0065] In another example of the present embodiment, the colloidal dams formed around each solid crystal area on the front of the circuit board to enclose each solid crystal area are separated from each other, that is, the colloidal layer forming the colloidal dam on the front of the circuit board does not completely cover the circuit board area between the adjacent solid crystal areas. In this way, the colloidal layer forming the colloidal dam is also divided into multiple small units, which can further make the manufactured LED package less affected by thermal expansion and more resistant to thermal stress, thereby further reducing the occurrence of dead light caused by colloidal shedding or cracking, and improving the quality and reliability of the product; at the same time, the circuit board area not covered by the colloidal layer can be directly used to dissipate heat directly to the outside, thereby improving the heat dissipation efficiency.

[0066] Optionally, in this embodiment, a guide hole for guiding the flow of colloid may be provided in the area corresponding to the colloid dam around each solid crystal area on the front of the circuit board; in this way, when colloid is provided around each solid crystal area on the front of the circuit board to form a colloid dam, the provided colloid may flow into the guide hole, and after the colloid is solidified, for example, the colloid in the guide hole is combined with the inner wall of the guide hole to improve the connection strength of the colloid on the circuit board, which can further improve the reliability of the product. It should be understood that the shape (regular or irregular), size and number of the guide holes in this embodiment can be flexibly set as long as the above purpose can be achieved. And the guide hole may or may not penetrate the back of the circuit board, that is, the specific depth of the guide hole can also be flexibly set according to demand. Of course, the area corresponding to the colloid dam around each solid crystal area on the front of the circuit board can also be set as a rough surface to improve the bonding strength between the colloid and the circuit board.

[0067] This embodiment directly sets a colloidal dam around the solid crystal area on the circuit board, and uses the conductive metal layer (such as a copper layer) on the circuit board and the colloidal dam to form a similar LED bracket structure, thereby avoiding the use of a separate LED bracket, which can not only reduce material costs and manufacturing costs, but also improve manufacturing efficiency, improve the integrity of the LED package and reduce its thickness.

[0068] S203: completing the LED wafer bonding in the bonding area within each colloid dam.

[0069] In this embodiment, the LED chip can be placed on the die-bonding area by, but not limited to, a die-bonding machine or a mass transfer machine, and the electrodes of each LED chip are electrically connected to the corresponding electrode connection area in the die-bonding area.

[0070] In some application scenarios, conductive connection materials such as silver glue or solder paste can be printed on the electrode connection area in the die-bonding area, and then the LED chip can be placed in the die-bonding area using the die-bonding machine or mass transfer machine. In other application scenarios, if LED chips with their own solder are used, it is not necessary to print conductive connection materials such as silver glue or solder paste on the electrode connection area in the die-bonding area.

[0071] In this embodiment, since colloidal dams are first formed around each crystal bonding area on the circuit board to enclose each crystal bonding area, and then the crystal bonding of the LED chip is completed on the crystal bonding area within each colloidal dam, compared with the method of first completing the crystal bonding of the LED chip on the circuit board and then forming colloidal dams around each crystal bonding area, it can avoid the LED chip and the connection between the LED chip and the circuit board from being damaged during the setting of the colloidal dams, so the yield rate and reliability of the obtained product are higher.

[0072] S204: a sealing material covering the LED chip is arranged in each colloid dam on the circuit board.

[0073] In this embodiment, the sealing material covering the LED chip in each colloid dam can provide reliable physical protection for the LED chip; and it should be understood that the material selected for the sealing material can be flexibly selected. For example, in one example, the sealing material can be but not limited to packaging glue.

[0074] In this embodiment, when the sealing material is a packaging glue, the packaging glue can be arranged in each colloid dam by, but not limited to, dispensing, spraying, printing, molding, etc. The selected packaging glue can be transparent glue or translucent glue, or can be luminescent conversion glue or other types of packaging glue. The colloid can be, but not limited to, epoxy resin, resin, silicone or UV glue. The specific arrangement of the packaging glue in this embodiment can be flexibly arranged according to, but not limited to, the color of the light emitted by the LED package.

[0075] Optionally, in some application examples, a quantum dot film (QD film) can be set on the LED chip according to needs. The quantum dot film is located between the LED chip and the packaging adhesive layer. At this time, the packaging adhesive layer can be set to but not limited to a transparent adhesive layer or a translucent adhesive layer.

[0076] In some examples of the present embodiment, the height of the packaging glue arranged in the colloidal dam is preferably set to be less than or equal to the height of the colloidal dam. In this way, since adjacent solid crystal areas on the circuit board are isolated by the colloidal dam, the packaging glue arranged in the colloidal dam is also isolated by the colloidal dam into multiple small packaging glue units. This makes the manufactured LED package less affected by thermal expansion and has a stronger ability to resist thermal stress, thereby greatly reducing the occurrence of dead lamps due to colloid shedding or cracking, thereby improving product quality and reliability.

[0077] In this example, the shape of the top surface of the encapsulant disposed in each colloid dam can also be flexibly set according to demand. For example, in one example, the top surface of the encapsulant can be a concave arc surface to form a concave lens, or the top surface of the encapsulant can be a convex arc surface to form a convex lens similar to a slightly convex shape; wherein the specific curvature of the top surface can be flexibly selected according to the specific application scenario, thereby further improving the light uniformity and light brightness.

[0078] This embodiment also provides a display device, which may include the LED package as exemplified above. The display device in this embodiment may include but is not limited to COB lighting devices (such as COB light bars, COB lamps, etc.), display light source devices (such as backlight light sources, or direct display light source devices).

[0079] For ease of understanding, this embodiment hereinafter combines some specific process steps to exemplarily illustrate the manufacturing process of the LED package. Figure 3 As shown, including:

[0080] S301: Prepare PCB301. There are multiple crystal bonding areas for placing LED chips on the front of the PCB. Correspondingly, the crystal bonding areas are provided with electrode connection areas that are electrically connected to the circuits on the PCB and are respectively electrically connected to the positive and negative electrodes of the LED chips. Around each crystal bonding area on the front of the PCB, in the area corresponding to the colloid dam, guide holes for guiding the colloid to flow in can also be provided to improve the bonding strength.

[0081] S302 : Print white glue (such as white oil) or transparent glue (such as thermosetting resin) around each die-bonding area on the front side of the PCB, and bake or UV-irradiate the printed white glue or transparent glue to form a glue dam 32 .

[0082] S303: placing silver glue or solder paste on the electrode connection area of ​​each die-bonding area.

[0083] S304: placing the flip-chip LED chip 33 in each die-bonding area, and connecting the positive and negative electrodes of the LED chip to the corresponding electrode connection areas through silver glue or solder paste, and completing the die-bonding by baking or reflow soldering.

[0084] S305: After the test, each colloid dam 32 is filled with packaging glue 34 (which may be UV type or thermosetting resin, of course, other sealing materials may also be provided in this step) through the glue injection device 4 or the glue spraying device or the glue printing device.

[0085] S306: After the encapsulation glue 34 is filled, the encapsulation glue is dried by UV irradiation or high temperature baking to obtain the LED encapsulation body in S307; and the obtained LED encapsulation body can be further tested.

[0086] Figure 3 In the LED package obtained in step S307, one LED chip is set in one colloid dam 32. It should be understood that multiple LED chips can be set according to the needs. The vertical cross-section of the cavity formed by the colloid dam 32 on the PCB 31 is an inverted trapezoid, that is, the inner wall of the colloid dam 32 is an inclined surface. The top surface of the packaging glue 34 on the colloid dam 32 is a concave arc surface, forming a similar concave lens. Of course, by Figure 3 The manufacturing process shown can also produce Figures 4 to 10 The LED package shown, wherein:

[0087] Figure 4 The LED package shown is relatively Figure 3 In the LED package obtained in S307 , the height of the encapsulation glue 34 is higher, and is substantially flush with the top surface of the gel dam 32 , that is, the specific height of the encapsulation glue 34 can be flexibly set.

[0088] Figure 5 The LED package shown is relatively Figure 4 In the LED package shown, the top surface of the encapsulation glue 34 on the glue dam 32 is an upwardly convex arc surface, forming a similar convex lens, so as to further improve the brightness and uniformity of the light output.

[0089] Figure 6 The LED package shown is relatively Figure 4 and Figure 5 In the LED package shown, the encapsulation glue 34 is flat on the top surface of the glue dam 32 and is flush with the top surface of the glue dam 32. Of course, the top surface of the glue dam 32 can also be lower than the top surface of the glue dam 32, or higher than the top surface of the glue dam 32 according to needs.

[0090] Figure 7 The LED package shown is Figure 4-Figure 6 The three-dimensional effect diagram of the LED package shown.

[0091] Figure 8 , Fig. 9 and Fig.10 The LED packages shown are Figure 4 , Figure 5 and Figure 6 In the LED package shown, adjacent colloid dams 32 are separated from each other, so that the thermal expansion effect between the PCB 31 and the colloid dam 32 is smaller, the ability to resist thermal stress is strong, and the heat dissipation effect is better.

[0092] It should be understood that Figures 4 to 10 The LED package shown is not limited to the one manufactured by the manufacturing method illustrated in this embodiment. Figures 4 to 10 The LED package shown is relatively Figure 1 In the LED package shown, the colloid dam 32 formed around each solid crystal area on the PCB 31 can not only protect the LED chip, but also the light emitted by the LED chip can be reflected and mixed by the side wall of the bowl to form a more uniform light, thereby improving the uniformity and brightness of the light (i.e., improving the light output efficiency); at the same time, it can avoid the use of a separate LED bracket, thereby reducing the material cost and manufacturing cost, improving the manufacturing efficiency, improving the integrity of the LED package and reducing its thickness; since the adjacent solid crystal areas on the PCB 31 are isolated by the colloid dam, the encapsulation glue 34 set in the colloid dam 32 is also isolated by the colloid dam into a plurality of small encapsulation glue units, thereby making the prepared LED package less affected by thermal expansion, and having a stronger ability to resist thermal stress, greatly reducing the occurrence of dead lights caused by the colloid shedding or cracking. Moreover, the LED package is not only suitable for blue light chip backlight (matching the QD film to produce white light), but also suitable for fluorescent glue to emit white light backlight, thereby improving the comprehensive product competitiveness of the LED package.

[0093] The above contents are further detailed descriptions of the embodiments of the present invention in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A method for manufacturing an LED package, characterized in that: include: Prepare a circuit board, wherein a plurality of bonding areas for placing LED chips are distributed on the front of the circuit board, and the plurality of bonding areas are electrically connected through a connecting circuit included in the circuit board, and the LED chip is a mini LED chip or a Micro LED chip; Forming a colloidal dam around each of the crystal-bonding areas by printing to enclose the respective crystal-bonding areas, the colloidal dam forming a bowl of an LED wafer to be arranged in the crystal-bonding area, and adjacent crystal-bonding areas are isolated by the colloidal dam; Complete the LED wafer bonding in the bonding area within each of the colloid dams; Disposing a sealing material covering the LED chip in each of the colloid dams; On the circuit board, in the area around each solid crystal area for forming the colloidal dam, a guide hole for guiding the flow of colloidal material is provided. When the colloidal material for forming the colloidal dam is printed around each solid crystal area, part of the colloidal material flows into the guide hole and combines with the inner wall of the guide hole after solidification.

2. The method for manufacturing an LED package according to claim 1, wherein: Forming a colloidal dam around each of the crystal-bonding regions to enclose each of the crystal-bonding regions comprises: Printing a colloid around each of the solid crystal areas, wherein the colloid is white glue or transparent glue; The printed colloid is solidified to form a colloid dam surrounding each of the crystal-fixing areas.

3. The method for manufacturing an LED package according to claim 1 or 2, wherein: The forming of a colloidal dam around each of the crystal-bonding regions to enclose each of the crystal-bonding regions comprises: A colloidal dam is formed around each of the crystal-bonding regions and surrounds each of the crystal-bonding regions with a height of 0.1 mm to 1 mm.

4. The method for manufacturing an LED package according to claim 1 or 2, characterized in that: The forming of a colloidal dam around each of the crystal-bonding regions to enclose each of the crystal-bonding regions comprises: A colloidal dam is formed corresponding to each of the crystal-bonding regions to enclose the crystal-bonding region, and the colloidal dams of adjacent crystal-bonding regions are separated from each other.

5. The method for manufacturing an LED package according to claim 1 or 2, wherein: The sealing material is a packaging glue, and the packaging glue provided in each of the colloid dams to cover the LED chip includes: Transparent glue, semi-transparent glue or luminescence conversion glue is arranged in each of the glue dams to cover the LED chip, and the height of the packaging glue is less than or equal to the height of the glue dam.

6. The method for manufacturing an LED package according to claim 1 or 2, wherein: The sealing material is a packaging glue, and the packaging glue provided in each of the colloid dams to cover the LED chip includes: Disposing packaging glue covering the LED chip in each of the glue dams; The packaging glue is cured, and the top surface of the packaging glue after curing is a concave or convex arc surface.

7. The method for manufacturing an LED package according to claim 1 or 2, wherein: The LED chip is a flip-chip mini LED chip or a flip-chip Micro LED chip.

8. An LED package, characterized in that: The LED package is manufactured by the LED package manufacturing method according to any one of claims 1 to 7, and the inner side surface of each colloid dam in the LED package located in the corresponding crystal bonding area is an inclined surface.

9. A display device, characterized in that: The display device comprises the LED package according to claim 8.

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