A glue dipping device for optical device chip mounting

Abstract

A glue dipping device for optical device patching, belonging to the field of dispensing technology for optical communication devices during patching, includes a frame module. A pick-and-place module arranged along the length direction of the frame module is connected to the frame module. An automatic feeding module perpendicular to the pick-and-place module is provided below the pick-and-place module. A horizontal rotation module and a planar rotation module arranged side by side and parallel to the pick-and-place module are provided in front of the pick-and-place module. A camera module and a glue dipping module are respectively provided above and in front of the horizontal rotation module and the planar rotation module. A glue tray module perpendicular to the pick-and-place module is provided outside the glue dipping module. The present invention can eliminate the accuracy influence caused by the machining error and assembly error of the fixture, and the positional accuracy of the glue dots can reach ±0.01 mm. By using the glue dipping method for dispensing, the size of the glue dots can be controlled and adjusted by changing the size of the glue dipping needle, which is flexible and variable. It can also perform dispensing at multiple positions on the same product to meet the requirements of different products, and has a wide range of applications.

Description

Technical Field

[0001] The present invention belongs to the technical field of dispensing technology for optical communication devices during chip mounting, and relates to a dipping device, in particular to a dipping device for chip mounting of optical devices. Background Art

[0002] An optical module is an optoelectronic device for optoelectronic and electro-optical conversion. The LD optical device is an important component of the optical module and is responsible for converting electricity into light when emitting a laser signal. The LD optical device mainly consists of components such as a header 1, pins 2, a cap 3, a heat sink 4, and a chip 5, as Figure 1 .

[0003] In the industry, the chips of some LD optical devices are encapsulated by being adhesively bonded to a substrate through a special adhesive, which we call die bonding. The chip position distribution of LD optical devices generally falls into two cases: one is encapsulated on a substrate perpendicular to the plane of the header, and the other is encapsulated on a substrate parallel to the plane of the header.

[0004] Currently, the method of dispensing glue for LD optical devices mainly relies on traditional manual dispensing under a microscope. Manual dispensing is inefficient, labor-intensive, and costly. The main reason is that the chip size of LD optical devices is very small. After dispensing, the chips need to be completely and evenly pasted, and the overflow glue range around the chips needs to be ensured. Different types of chips have very high requirements for parameters such as the size of the glue volume, the size of the glue dot contour, the position accuracy of the glue dots, the number and distribution of the glue dots. Traditional dispensing equipment is difficult to achieve this. Summary of the Invention

[0005] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide a dipping device for chip mounting of optical devices, which is used to solve the technical problems of low efficiency, high labor intensity, and high labor cost of manual dispensing in the prior art.

[0006] To achieve the above purpose and other related purposes, the present invention provides a dipping device for chip mounting of optical devices, including a frame module. A pick-and-place module is connected to the frame module along the length direction of the frame module. An automatic feeding module perpendicular to the pick-and-place module is provided below the pick-and-place module. A horizontal rotation module and a planar rotation module are arranged side by side and parallel to the pick-and-place module in front of the pick-and-place module. A camera module is provided above the horizontal rotation module and the planar rotation module. A dipping module parallel to the pick-and-place module is provided in front of the horizontal rotation module and the planar rotation module. A glue tray module perpendicular to the pick-and-place module is provided outside the dipping module.

[0007] Preferably, the frame module includes an upper frame and a lower frame which are connected to each other. An air-operated combined component for providing power to the equipment and a main power switch for controlling the total power supply of the equipment are provided inside the lower frame. An upper frame shield is provided on the upper frame. A grating opening is formed in the upper frame shield along its width direction. A safety grating is installed on the inner wall of the grating opening. A start / reset / stop button and an emergency stop button are installed on the upper frame shield. An alarm lamp is installed on the top of the upper frame shield.

[0008] Preferably, the automatic feeding module includes a feeding single-axis electric slide table. A slide table connecting plate is installed on the feeding single-axis electric slide table. A fixture placing plate is connected to the slide table connecting plate. Rotating grooves are respectively formed in the middle parts of two adjacent sides of the fixture placing plate. A fixture pressing block is rotatably connected in the rotating grooves. Two sides of the bottom of the fixture pressing block are respectively connected with a pressing block support block. The pressing block support block is connected to the bottom of the fixture placing plate. The fixture pressing block and the pressing block support block are connected by a pressing block rotating shaft. A spring is arranged between the fixture pressing block and the pressing block support block. A ball plunger is connected to the middle part of the inner side of the fixture pressing block.

[0009] Preferably, the picking and placing module includes a picking and placing single-axis electric slide table. A guide rail mounting plate is installed on the picking and placing single-axis electric slide table. A picking and placing motor and a vacuum generator are connected to the upper surface of the guide rail mounting plate. The output shaft of the picking and placing motor is connected with a gear. Two symmetrically arranged picking and placing linear guide rails are connected to the side wall of the guide rail mounting plate along its height direction. A rack mounting plate which can move up and down along its height direction is connected to the picking and placing linear guide rails. Racks which are meshed with the gear are respectively connected to the opposite surfaces of the two rack mounting plates. The lower end of the rack mounting plate is connected with a suction head mounting plate. A picking and placing suction head is connected to the suction head mounting plate through a buffer. The upper end of the buffer is communicated with the vacuum generator through an air pipe.

[0010] Preferably, the horizontal rotation module includes a horizontal rotation module mounting plate. A horizontal rotary joint is connected to one end of the horizontal rotation module mounting plate. Two groups of horizontal rotary micro-joints are provided on the horizontal rotary joint. A horizontal rotation driving component is connected to the other end of the horizontal rotation module mounting plate. The output end of the horizontal rotation driving component is connected with a material transfer disk. A proximity sensing block is installed on the material transfer disk. Four horizontal suction heads are communicated with the side wall of the material transfer disk along its circumferential direction. Four horizontal joints which are communicated with the horizontal suction heads are provided on the end face of the material transfer disk opposite to the horizontal rotary joint along its circumferential direction. The two groups of horizontal rotary micro-joints are respectively communicated with a vacuum source and the horizontal joints.

[0011] Preferably, the planar rotation module includes a planar rotation module mounting base, a centripetal bearing mounting seat is connected to the planar rotation module mounting base, a planar rotation proximity sensor is connected to the centripetal bearing mounting seat, a planar rotation drive assembly is provided on the planar rotation module mounting base, the output end of the planar rotation drive assembly is connected to a turntable, and four jigs with planar joints are evenly arranged along the circumferential direction of the turntable. An air-driven rotary joint is provided directly above the turntable. The air-driven rotary joint is connected to the planar rotation module mounting base through a rotary joint mounting plate. Two groups of planar rotation micro-joints are provided on the air-driven rotary joint, and the two groups of planar rotation micro-joints are respectively communicated with a vacuum source and a planar joint.

[0012] Preferably, the glue tray module includes a glue tray support seat, a relatively arranged bearing mounting plate and a crossed roller slide are connected to the glue tray support seat, a glued disc pillow block bearing is connected to the bearing mounting plate, a glue tray is provided on the glued disc pillow block bearing, a glue tray motor is connected to the lower surface of the glue tray support seat, the output shaft of the glue tray motor passes through the glue tray support seat and is connected to the glue tray through a glue tray coupling, a rotating shaft mounting plate is connected to the crossed roller slide, and a scraper is connected to the end of the rotating shaft mounting plate through a glue tray rotating shaft. The bottom of the scraper is located inside the glue tray.

[0013] Preferably, the dipping glue module includes a relatively arranged single-axis Y-direction electric slide and a dipping glue linear guide rail. A movable single-axis slide horizontal mounting plate is connected between the single-axis Y-direction electric slide and the dipping glue linear guide rail. A single-axis X-direction electric slide is connected along the length direction of the single-axis slide horizontal mounting plate. A DD motor is connected to the single-axis X-direction electric slide. The output end of the DD motor is connected to an electric cylinder through an electric cylinder mounting plate. The output end of the electric cylinder is connected to a dipping glue needle through an electric cylinder connecting plate.

[0014] Preferably, the camera module includes a camera module mounting bracket, and two groups of cameras are connected to the camera module mounting bracket through two groups of simple adjustment components. The two groups of cameras are respectively located above the horizontal rotation module and the planar rotation module.

[0015] As described above, a dipping glue device for optical device chip bonding of the present invention has the following beneficial effects:

[0016] 1. In the present invention, single-axis electric slides with an accuracy of ±0.01 mm in both the X and Y directions are used in the dipping glue module, and a DD motor is used for the rotating component. After the camera takes a picture of the product placed on the jig and feeds back the position to the single-axis slide and the DD motor to adjust the position, the accuracy influence caused by the machining error and assembly error of the jig can be eliminated. Therefore, the positional accuracy of the glue dots can reach ±0.01 mm.

[0017] 2. In the present invention, the method of dipping glue is used for dispensing. The size requirement of the glue dots can be controlled and adjusted by replacing the size of the dipping glue needle, which is flexible and variable.

[0018] 3. In the present invention, the automatic glue dipping method can be used to perform dispensing at multiple positions on the same product to meet the requirements of different products, and it has a wide range of applications. Description of the Drawings

[0019] Figure 1 It shows a schematic structural diagram of an LD optical device in the prior art.

[0020] Figure 2 It shows a three-dimensional schematic diagram of the present invention.

[0021] Figure 3 It shows a front view of the present invention.

[0022] Figure 4 It shows a side view of the present invention.

[0023] Figure 5 It shows a top view of the present invention.

[0024] Figure 6 It shows a schematic structural diagram of the frame module.

[0025] Figure 7 It shows a schematic structural diagram of the automatic feeding module.

[0026] Figure 8 It shows a schematic structural diagram of the pick-and-place module.

[0027] Figure 9 It shows a schematic structural diagram of the horizontal rotation module.

[0028] Figure 10 It shows a three-dimensional schematic diagram of the horizontal rotation module.

[0029] Figure 11 It shows a schematic structural diagram of the planar rotation module.

[0030] Figure 12 It shows a schematic structural diagram of the glue tray module.

[0031] Figure 13 It shows a schematic structural diagram of the glue dipping module.

[0032] Figure 14 It shows a schematic structural diagram of the camera module.

[0033] Description of the Component Labels

[0034] 1 - Frame module, 1.1 - Lower frame framework, 1.2 - Pneumatic combination components, 1.3 - Main power switch, 1.4 - Lower frame door assembly, 1.5 - Floor feet, 1.6 - Upper frame framework, 1.7 - Upper frame door assembly, 1.8 - Hinge, 1.9 - Lower frame bottom plate, 1.10 - Upper frame shield, 1.11 - Safety grating mounting plate, 1.12 - Safety grating, 1.13 - Start / Reset / Stop button, 1.14 - Emergency stop button, 1.15 - Alarm light, 1.16 - Upper frame top plate, 2 - Automatic feeding module, 2.1 - Feeding single-axis electric slide, 2.2 - Slide mounting plate, 2.3 - Slide connecting plate, 2.4 - Fixture support vertical plate, 2.5 - Feeding proximity sensor, 2.6 - Fixture placement plate, 2.7 - Ball head plunger, 2.8 - Fixture pressing block, 2.9 - Pressing block support block, 2.10 - Spring, 2.11 - Pressing block rotating shaft, 3 - Pick-and-place module, 3.1 - Column, 3.2 - Pick-and-place single-axis slide mounting plate, 3.3 - Drag chain mounting sheet metal, 3.4 - Pick-and-place single-axis electric slide, 3.5 - Drag chain support sheet metal, 3.6 - Pick-and-place motor, 3.7 - Vacuum generator, 3.8 - Pick-and-place linear guide, 3.9 - Photoelectric sensor, 3.10 - Upper limit block, 3.11 - Rack mounting plate, 3.12 - Inductive piece, 3.13 - Rack, 3.14 - Gear, 3.15 - Suction cup mounting plate, 3.16 - Buffer, 3.17 - Pick-and-place suction cup, 3.18 - Lower limit block, 3.19 - Pick-and-place cable protection chain, 3.20 - Guide rail mounting plate, 4 - Horizontal rotation module, 4.1 - Horizontal rotation module mounting plate, 4.2 - Horizontal rotary joint mounting plate, 4.3 - Horizontal rotary joint, 4.4 - Horizontal rotary micro joint, 4.5 - Horizontal rotation motor, 4.6 - Horizontal rotation reducer, 4.7 - Reducer mounting seat, 4.8 - Horizontal rotation coupling, 4.9 - Proximity induction block, 4.10 - Horizontal rotation pedestal bearing, 4.11 - Transfer disk, 4.12 - Horizontal suction cup, 4.13 - Horizontal joint, 4.14 - Slide cylinder mounting plate, 4.15 - Pneumatic slide, 4.16 - Slide cylinder connecting plate, 4.17 - Follower, 4.18 - Micro guide rail connecting plate, 4.19 - Clip, 4.20 - Horizontal rotation linear guide, 4.21 - Horizontal rotation proximity sensor, 5 - Glue tray module, 5.1 - Glue tray support seat, 5.2 - Glue tray motor, 5.3 - Bearing mounting plate, 5.4 - Glue tray pedestal bearing, 5.5 - Glue tray, 5.6 - Scraper, 5.7 - Glue tray rotating shaft, 5.8 - Rotating shaft mounting plate, 5.9 - Cross roller slide, 5.10 - Glue tray coupling, 6 - Dipping glue module, 6.1 - Single-axis slide mounting plate, 6.2 - Single-axis Y-direction electric slide, 6.3 - Linear guide mounting block, 6.4 - Dipping glue linear guide, 6.5 - Single-axis slide horizontal mounting plate, 6.6 - Single-axis X-direction electric slide, 6.7 - DD motor mounting plate, 6.8 - DD motor, 6.9 - Electric cylinder mounting plate, 6.10 - Electric cylinder, 6.11 - Electric cylinder connecting plate, 6.12 - Glue dipping needle installation sleeve, 6.13 - Glue dipping needle, 6.14 - Glue dipping cable protection chain, 7 - Camera module, 7.1 - Camera module mounting bracket, 7.2 - Simple adjustment component, 7.3 - Camera, 7.4 - Lens, 7.5 - Camera mounting plate, 8 - Planar rotation module, 8.1 - Planar rotation module mounting base, 8.2 - Planar rotation motor, 8.3 - Planar rotation speed reducer, 8.4 - Planar rotation coupling, 8.5 - Centripetal bearing mounting seat, 8.6 - Proximity sensor mounting block, 8.7 - Planar rotation proximity sensor, 8.8 - Centripetal bearing, 8.9 - Turntable, 8.10 - Fixture, 8.11 - Planar rotation joint mounting plate, 8.12 - Planar joint, 8.13 - Pneumatic rotary joint, 8.14 - Planar rotation micro joint. Detailed implementation manners

[0035] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0036] Please refer to Figures 2 to 14 Note that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have technical essential meanings. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle", and "one" cited in this specification are only for the convenience of clear narration, and are not used to limit the scope for the implementation of the present invention. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present invention can be implemented.

[0037] Please refer to Figures 2 - 5 , the present invention provides a glue dipping device for optical device chip mounting, including a frame module 1, a pick - and - place module 3 arranged along the length direction of the frame module 1 is connected to the frame module 1. An automatic feeding module 2 perpendicular to the pick - and - place module 3 is arranged below the pick - and - place module 3. A horizontal rotation module 4 and a planar rotation module 8 arranged side by side and parallel to the pick - and - place module 3 are arranged in front of the pick - and - place module 3. A camera module 7 is arranged above the horizontal rotation module 4 and the planar rotation module 8. A glue dipping module 6 parallel to the pick - and - place module 3 is arranged in front of the horizontal rotation module 4 and the planar rotation module 8. A glue pan module 5 perpendicular to the pick - and - place module 3 is arranged outside the glue dipping module 6.

[0038] When this embodiment is in use, the frame module 1 is used for the installation and support of the entire device. The automatic feeding module 2 is used for the installation and automatic transfer of the unglued products. The picking and placing module 3 is used to pick up the unglued products and place them into the horizontal rotation module 4 or the planar rotation module 8. The glue tray module 5 is used for storing the glue material. The glue dipping module 6 is used to dip the glue from the glue tray module 5 and apply glue to the unglued products. The camera module 7 is used to take pictures of the products on the fixture 8.10 and provide feedback for position adjustment to eliminate the accuracy impact caused by the processing error and assembly error of the fixture 8.10.

[0039] The working process of this device is as follows: a. The operator places the fixture tray with the products installed into the automatic feeding module 2 → b. Click the start button → c. The fixture tray moves to the picking position → d. The feeding suction head on the picking and placing module 3 picks up the product and places it into the horizontal rotation module 4 or the planar rotation module 8 → e. The glue dipping module 6 dips the glue from the glue tray module 5 → f. The glue dipping module 6 applies glue to the product → g. Glue application is completed → h. The receiving suction head on the picking and placing module 3 takes away the completed product while the feeding suction head places a new product → Repeat steps e - h to achieve automatic continuous production.

[0040] As a further description of the above - mentioned embodiment, as Figure 6 shown, the frame module 1 includes an upper frame and a lower frame that are connected to each other. Inside the lower frame, there are pneumatic combination components 1.2 that provide power for the device and a main power switch 1.3 that controls the total power supply of the device. On the upper frame, there is an upper frame shield 1.10. Along the width direction of the upper frame shield 1.10, there is a grating opening. Inside the grating opening, there is a safety grating 1.12 installed. On the upper frame shield 1.10, there are start / reset / stop buttons 1.13 and an emergency stop button 1.14 installed. On the top of the upper frame shield 1.10, there is an alarm light 1.15 installed.

[0041] When this embodiment is in use, the lower frame is composed of a lower frame framework 1.1. The lower frame framework 1.1 is welded with 40 * 40 square pipe. At the four corners of the bottom of the lower frame framework 1.1, there are floor feet 1.5 connected. The floor feet 1.5 are connected to the bottom of the lower frame framework 1.1 by screws. On the four sides of the lower frame framework 1.1, there are lower frame door assemblies 1.4 installed through rotary pins for easy maintenance and observation. The pneumatic combination components 1.2 and the main power switch 1.3 are installed on the lower frame door assembly 1.4 on the front side. The top of the lower frame framework 1.1 is connected with a lower frame bottom plate 1.9.

[0042] The upper frame is composed of the upper frame framework 1.6. The upper frame framework 1.6 is assembled using 40*40 aluminum profiles connected by corner fittings and is installed on the upper surface of the lower frame bottom plate 1.9. An upper frame shield 1.10 is installed on the upper frame framework 1.6. The upper frame shield 1.10 is installed on the lower frame bottom plate 1.9. A grating opening is provided along the width direction of the upper frame shield 1.10. The grating opening is provided above the automatic feeding module 2. Safety grating mounting plates 1.11 are connected to two opposite surfaces of the grating opening, and a safety grating 1.12 is installed on the safety grating mounting plates 1.11. A start / reset / stop button 1.13 and an emergency stop button 1.14 are provided on the upper frame shield 1.10. The top of the upper frame framework 1.6 is connected to an upper frame top plate 1.16, and an alarm lamp 1.15 is provided on the upper frame top plate 1.16. An upper frame door assembly 1.7 for easy maintenance and observation is also connected to the upper frame framework 1.6 through a hinge 1.8.

[0043] As a further description of the above embodiment, as Figure 7 shown, the automatic feeding module 2 includes a feeding single-axis electric slide 2.1. A slide connecting plate 2.3 is installed on the feeding single-axis electric slide 2.1. A fixture placement plate 2.6 is connected to the slide connecting plate 2.3. Rotation grooves are respectively provided in the middle parts of two adjacent sides of the fixture placement plate 2.6. A fixture pressing block 2.8 is rotatably connected in the rotation grooves. Two sides of the bottom of the fixture pressing block 2.8 are respectively connected to a pressing block support block 2.9. The pressing block support block 2.9 is connected to the bottom of the fixture placement plate 2.6. The fixture pressing block 2.8 and the pressing block support block 2.9 are connected by a pressing block rotating shaft 2.11. A spring 2.10 is provided between the fixture pressing block 2.8 and the pressing block support block 2.9. A ball plunger 2.7 is connected to the middle part of the inner side of the fixture pressing block 2.8.

[0044] When this embodiment is in use, the automatic feeding module 2 is a self-locking fixture for fixing the product and transporting it to the pick-and-place module 3 for pick-and-place operations. The automatic feeding module 2 includes a feeding single-axis electric slide 2.1 that provides horizontal movement. The feeding single-axis electric slide 2.1 is installed on the lower frame bottom plate 1.9 through a slide mounting plate 2.2. A slide connecting plate 2.3 is installed on the feeding single-axis electric slide 2.1. Fixture support vertical plates 2.4 are connected to both sides of the slide connecting plate 2.3. The top of the fixture support vertical plates 2.4 is connected to a fixture placement plate 2.6 for placing the fixture 8.10.

[0045] The fixture placement plate 2.6 includes a bottom plate and vertical baffles arranged around the bottom plate, and the bottom plate and the vertical baffles are integrally formed. Among them, a rotation groove is formed in the middle of any group of adjacent vertical baffles, and a rotatable fixture pressing block 2.8 is arranged in the rotation groove. Both sides of the bottom of the fixture pressing block 2.8 are connected with a pressing block support block 2.9 through a pressing block rotating shaft 2.11. The pressing block support block 2.9 is connected to the bottom of the fixture placement plate 2.6. A spring 2.10 is arranged between the fixture pressing block 2.8 and the pressing block support block 2.9, which facilitates the automatic return of the fixture pressing block 2.8 after removing the fixture 8.10, so as to facilitate the self-locking fixation of the fixture 8.10 next time. The inner side of the fixture pressing block 2.8 is connected with a ball head plunger 2.7, and the ball head plunger 2.7 is arranged in the rotation groove.

[0046] In this embodiment, a feeding proximity sensor 2.5 is arranged at any corner of the fixture placement plate 2.6, which is used to detect whether the fixture 8.10 is placed flat on the fixture placement plate 2.6, so as to ensure the horizontality of the installation of the fixture 8.10 and facilitate the subsequent material taking and placing operations.

[0047] When the fixture tray is placed on the fixture placement plate 2.6, when the gravity of the fixture tray itself presses on the two ball head plungers 2.7, the two fixture pressing blocks 2.8 tilt towards the fixture 8.10 through the pressing block rotating shafts 2.11 to tightly press the fixture tray. The fixture tray slides within the fixture placement plate 2.6 to the other two fixed edges and then realizes positioning and locking without sliding, thereby realizing the self-locking of the fixture 8.10.

[0048] As a further description of the above embodiment, as Figure 8 shown, the material taking and placing module 3 includes a material taking and placing single-axis electric sliding table 3.4. A guide rail mounting plate 3.20 is installed on the material taking and placing single-axis electric sliding table 3.4. The upper surface of the guide rail mounting plate 3.20 is connected with a material taking and placing motor 3.6 and a vacuum generator 3.7. The output shaft of the material taking and placing motor 3.6 is connected with a gear 3.14. Two symmetrically arranged material taking and placing linear guide rails 3.8 are connected to the side wall of the guide rail mounting plate 3.20 along its height direction. A rack mounting plate 3.11 that can move up and down along its height direction is connected to the material taking and placing linear guide rails 3.8. Racks 3.13 that are respectively meshed with the gear 3.14 are connected to the opposite surfaces of the two rack mounting plates 3.11. The lower end of the rack mounting plate 3.11 is connected with a suction head mounting plate 3.15. A material taking and placing suction head 3.17 is connected to the suction head mounting plate 3.15 through a buffer 3.16. The upper end of the buffer 3.16 is communicated with the vacuum generator 3.7 through an air pipe.

[0049] When this embodiment is in use, the pick-and-place module 3 includes a pick-and-place single-axis slide table mounting plate 3.2, which is mounted on the column 3.1, and the column 3.1 is mounted on the lower frame bottom plate 1.9. The pick-and-place single-axis electric slide table 3.4 is mounted on the pick-and-place single-axis slide table mounting plate 3.2 for horizontal movement during the optical device chip placement. A guide rail mounting plate 3.20 is mounted on the pick-and-place single-axis electric slide table 3.4. The guide rail mounting plate 3.20 includes a horizontal plate fixedly connected to the upper surface of the pick-and-place single-axis electric slide table 3.4 and a vertical plate integrally formed with and perpendicular to one end of the horizontal plate. A pick-and-place motor 3.6 and a vacuum generator 3.7 arranged side by side are connected to the upper surface of the horizontal plate of the guide rail mounting plate 3.20. The output shaft of the pick-and-place motor 3.6 is connected with a gear 3.14, and the axis of the gear 3.14 is perpendicular to the linear direction of the pick-and-place single-axis electric slide table 3.4. Two pick-and-place linear guide rails 3.8 arranged along the height direction of the vertical plate are symmetrically connected to the vertical plate of the guide rail mounting plate 3.20. A rack mounting plate 3.11 that can move up and down along the height direction of the pick-and-place linear guide rail 3.8 is connected to each pick-and-place linear guide rail 3.8. Racks 3.13 are respectively connected to the opposite surfaces of the two rack mounting plates 3.11, and the two racks 3.13 are respectively engaged with both sides of the gear 3.14. The lower ends of the two rack mounting plates 3.11 are both connected with a suction head mounting plate 3.15. The suction head mounting plate 3.15 is an L-shaped plate. The vertical side of the L-shaped plate is detachably connected to the rack mounting plate 3.11. Mounting holes are formed in the horizontal side of the L-shaped plate, and a buffer 3.16 for preventing the suction head from damaging the product when sucking the product is connected in the mounting holes. The upper end of the buffer 3.16 is communicated with the vacuum port of the vacuum generator 3.7 through an air pipe, and the bottom of the buffer 3.16 is communicated with a pick-and-place suction head 3.17.

[0050] In this embodiment, upper and lower limit blocks 3.10 and 3.18 for limiting the stroke of the rack mounting plate 3.11 and preventing the rack mounting plate 3.11 from moving out of the pick-and-place linear guide rail 3.8 are respectively connected to the upper and lower ends of the guide rail mounting plate 3.20.

[0051] In this embodiment, an induction sheet 3.12 is connected to the rack mounting plate 3.11, and a photoelectric sensor 3.9 is mounted on the top of the guide rail mounting plate 3.20 to set the upper and lower limit strokes of the pick-and-place suction head 3.17 through the photoelectric sensor 3.9.

[0052] In this embodiment, a drag chain mounting sheet metal 3.3 is connected to the side wall of the pick-and-place single-axis slide table mounting plate 3.2. The fixed end of the pick-and-place cable protection chain 3.19 is mounted on the drag chain mounting sheet metal 3.3 through a drag chain support sheet metal 3.5, which is used to neatly arrange messy cables, air pipes, etc. together, so that there is no knotting or entanglement phenomenon, protecting the cables themselves and increasing the neatness of the equipment.

[0053] As a further description of the above embodiments, as Figures 9 - 10 shown, the horizontal rotation module 4 includes a horizontal rotation module mounting plate 4.1. At both ends of the upper surface of the horizontal rotation module mounting plate 4.1, a horizontal rotary joint mounting plate 4.2 and a reducer mounting seat 4.7 are respectively connected. A horizontal rotary joint 4.3 is connected to the horizontal rotary joint mounting plate 4.2. Two groups of horizontal rotary micro-joints 4.4 are connected to the horizontal rotary joint 4.3. A horizontal rotation drive assembly is connected to the reducer mounting seat 4.7. The horizontal rotation drive assembly includes a horizontal rotation reducer 4.6. The horizontal rotation reducer 4.6 is mounted on the reducer mounting seat 4.7. A horizontal rotation motor 4.5 is connected to the horizontal rotation reducer 4.6. The output shaft of the horizontal rotation reducer 4.6 is connected to a transfer tray 4.11 through a horizontal rotation coupling 4.8. A proximity sensing block 4.9 is mounted on the transfer tray 4.11. Four horizontal suction heads 4.12 are communicated along the circumferential direction of the side wall of the transfer tray 4.11. Four horizontal joints 4.13 communicated with the horizontal suction heads 4.12 are provided along the circumferential direction of one end face of the transfer tray 4.11 opposite to the horizontal rotary joint 4.3. One group of horizontal rotary micro-joints 4.4 is communicated with a vacuum source, and the other group of horizontal rotary micro-joints 4.4 is communicated with the horizontal joint 4.13..

[0054] During the use of this embodiment, the horizontal rotation module mounting plate 4.1 is mounted on the lower frame bottom plate 1.9. A horizontal rotary block bearing 4.10 is provided between the horizontal rotary joint mounting plate 4.2 and the reducer mounting seat 4.7. The horizontal rotary block bearing 4.10 is mounted on the horizontal rotation module mounting plate 4.1. The transfer tray 4.11 is supported on the horizontal rotary block bearing 4.10 to realize the fixation of the transfer tray 4.11 and its connection with the horizontal rotation reducer 4.6, so as to facilitate driving the transfer tray 4.11 to rotate through the horizontal rotation motor 4.5. The proximity sensing block 4.9 is provided to detect the working condition of the transfer tray 4.11. The horizontal suction heads 4.12 are uniformly mounted on the side wall of the transfer tray 4.11 along the circumferential direction of the transfer tray 4.11 for sucking the products on the pick-and-place suction head 3.17. The horizontal rotary joint 4.3 is connected to the vacuum source through the horizontal rotary micro-joint 4.4. The horizontal joint 4.13 is communicated with the horizontal rotary micro-joint 4.4 through a vacuum tube to transfer the vacuum to the horizontal suction heads 4.12 to realize the suction and positioning of the products.

[0055] In this embodiment, a slide table cylinder mounting plate 4.14 is connected to the bottom plate 1.9 of the lower frame. An air slide table 4.15 is connected to the slide table cylinder mounting plate 4.14, and a slide table cylinder connecting plate 4.16 is connected to the air slide table 4.15. The upper end of the slide table cylinder mounting plate 4.14 extends beyond the upper surface of the horizontal rotation module mounting plate 4.1 and is connected to a horizontally arranged horizontal rotation linear guide 4.20. A micro guide connecting plate 4.18 that can move along its length direction is connected to the horizontal rotation linear guide 4.20. A follower 4.17 and a clip 4.19 are connected to the micro guide connecting plate 4.18. When the horizontal suction head 4.12 sucks the material and rotates to the dispensing position and waits for dispensing, the air slide table 4.15 extends to drive the clip 4.19 to clamp the product and then performs dispensing, so as to prevent the product position from changing after the dipping needle contacts the product when a product needs to be dispensed multiple times, thereby ensuring the accuracy of each dispensing position.

[0056] In this embodiment, a horizontal rotation proximity sensor 4.21 is provided below the proximity sensing block 4.9, and the horizontal rotation proximity sensor 4.21 is installed on the mounting plate of the horizontal rotation module 4.

[0057] The working principle of the horizontal rotation module 4 is as follows: The horizontal rotation module 4 is mainly for products with a vertical dispensing surface. The horizontal rotation motor 4.5 drives the horizontal rotation reducer 4.6 to rotate. The horizontal rotation reducer 4.6 transmits power to the turntable 4.11 through the horizontal rotation coupling 4.8, thereby realizing the material conversion of the 4 horizontal suction heads 4.12 on the turntable 4.11 and achieving 4-station feeding; the horizontal rotation joint 4.3 is connected to the vacuum source through the horizontal rotation micro joint 4.4, and the horizontal joint 4.13 is connected to the horizontal rotation micro joint 4.4 through a vacuum tube to transfer the vacuum to the horizontal suction head 4.12 to realize the suction and positioning of the product.

[0058] As a further description of the above embodiment, as Figure 11 shown, the planar rotation module 8 includes a planar rotation module mounting base 8.1. A centripetal bearing mounting seat 8.5 is connected to the planar rotation module mounting base 8.1. A planar rotation proximity sensor 8.7 is connected to the centripetal bearing mounting seat 8.5. A planar rotation drive assembly is provided on the planar rotation module mounting base 8.1. The output end of the planar rotation drive assembly is connected to a turntable 8.9. Four fixtures 8.10 with planar joints 8.12 are evenly arranged along the circumference of the turntable 8.9 on the turntable 8.9. An air rotary joint 8.13 is provided directly above the turntable 8.9. The air rotary joint 8.13 is connected to the planar rotation module mounting base 8.1 through a planar rotation joint mounting plate 8.11. Two groups of planar rotation micro joints 8.14 are provided on the air rotary joint 8.13, and the two groups of planar rotation micro joints 8.14 are respectively communicated with the vacuum source and the planar joint 8.12.

[0059] When this embodiment is in use, the mounting base 8.1 of the planar rotation module is mounted on the bottom plate 1.9 of the lower frame. The planar rotation proximity sensor 8.7 is mounted on the outer side of the centripetal bearing mounting seat 8.5 through the proximity sensor mounting block 8.6.

[0060] Among them, the planar rotation drive assembly includes a planar rotation motor 8.2. The output shaft of the planar rotation motor 8.2 is connected to a planar rotation speed reducer 8.3. The planar rotation speed reducer 8.3 is mounted at the center of the lower surface of the mounting base 8.1 of the planar rotation module. The output shaft of the planar rotation speed reducer 8.3 penetrates through the mounting base 8.1 of the planar rotation module and is connected to a centripetal bearing 8.8 through a planar rotation coupling 8.4. The turntable 8.9 is connected to the centripetal bearing 8.8. By rotating the planar rotation motor 8.2, the turntable 8.9 is driven to rotate, thereby driving the rotation of the products on the turntable 8.9, and realizing the operations of sucking, dispensing, and picking products at different positions.

[0061] In this embodiment, each group of planar rotation micro-joints 8.14 has 4, and the 4 planar rotation micro-joints 8.14 are evenly distributed on the pneumatic rotation joint 8.13. The pneumatic rotation joint 8.13 mainly functions to deliver the vacuum source to the planar joint 8.12 through the planar rotation micro-joints 8.14 and its own rotation pipeline, and finally enables the fixture 8.10 to complete the sucking of products. One end of the planar rotation micro-joint 8.14 is mounted on the pneumatic rotation joint 8.13. The other ends of the 4 upper planar rotation micro-joints 8.14 are connected to the vacuum source, and the other ends of the 4 lower planar rotation micro-joints 8.14 are connected to the planar joint 8.12.

[0062] The working principle of the planar rotation module 8 is as follows: The planar rotation module 8 is mainly for products with a horizontal dispensing surface. The planar rotation motor 8.2 drives the planar rotation speed reducer 8.3 to rotate. The planar rotation speed reducer 8.3 transmits power to the turntable 8.9 through the planar rotation coupling 8.4, thereby realizing the material conversion of the 4 planar joints 8.12 on the turntable 8.9 and achieving 4-station feeding; the planar joint 8.12 is connected to the vacuum source through the planar rotation micro-joint 8.14, and the planar joint 8.12 is connected to the planar rotation micro-joint 8.14 through a vacuum tube to transfer the vacuum to the planar joint 8.12 to realize the sucking and positioning of products.

[0063] As a further description of the above embodiment, such as Figure 12As shown in the figure, the glue disk module 5 includes a glue disk support base 5.1. Symmetrically arranged bearing mounting plates 5.3 and crossed roller slides 5.9 are connected to the glue disk support base 5.1. A flanged bearing 5.4 is connected to the bearing mounting plate 5.3, and a glue disk 5.5 is provided on the flanged bearing 5.4. A glue disk motor 5.2 is connected to the lower surface of the glue disk support base 5.1. The output shaft of the glue disk motor 5.2 passes through the glue disk support base 5.1 and is connected to the glue disk 5.5 through a glue disk coupling 5.10. A rotating shaft mounting plate 5.8 is connected to the crossed roller slide 5.9. The end of the rotating shaft mounting plate 5.8 is connected to a scraper 5.6 through a glue disk rotating shaft 5.7. The bottom of the scraper 5.6 is located inside the glue disk 5.5.

[0064] In the use of this embodiment, the glue disk 5.5 is used to store glue. During the working process, the glue disk motor 5.2 drives the glue disk 5.5 to rotate through the glue disk coupling 5.10. During the rotation of the glue disk 5.5, a relative movement is formed between the glue disk 5.5 and the scraper 5.6. The relative movement between the scraper 5.6 and the glue disk 5.5 can ensure that the glue can be quickly leveled after each dipping of the dipping needle 6.13.

[0065] In this embodiment, the glue disk support base 5.1 includes two symmetrically arranged L-shaped support plates. The tops of the two L-shaped support plates are connected by a horizontal support plate, and the L-shaped support plate and the horizontal support plate are integrally formed. The bearing mounting plate 5.3 and the crossed roller slide 5.9 are respectively arranged at both ends of the horizontal support plate, and the glue disk motor 5.2 is installed on the lower surface of the horizontal support plate. Connecting holes are respectively formed in the bottom horizontal parts of the L-shaped support plates. After the connecting bolts pass through the connecting holes, the glue disk support base 5.1 is connected to the lower frame bottom plate 1.9.

[0066] In this embodiment, a glue storage groove is formed between the edge of the glue disk 5.5 and the glue disk rotating shaft 5.7. The outer diameter of the scraper 5.6 is equal to the inner diameter of the glue storage groove, so as to ensure the flatness of the glue in the glue storage groove.

[0067] As a further description of the above embodiment, as Figure 13 shown, the dipping module 6 includes a relatively arranged single-axis Y-direction electric slide 6.2 and a dipping linear guide 6.4. A movable single-axis slide horizontal mounting plate 6.5 is connected between the single-axis Y-direction electric slide 6.2 and the dipping linear guide 6.4. A single-axis X-direction electric slide 6.6 is connected to the single-axis slide horizontal mounting plate 6.5 along its length direction. A DD motor 6.8 is connected to the single-axis X-direction electric slide 6.6. The output end of the DD motor 6.8 is connected to an electric cylinder 6.10 through an electric cylinder mounting plate 6.9. The output end of the electric cylinder 6.10 is connected to a dipping needle 6.13 through an electric cylinder connecting plate 6.11.

[0068] When this embodiment is in use, the single-axis Y-direction electric slide table 6.2 is installed on the lower frame bottom plate 1.9 through the single-axis slide table mounting plate 6.1. The glue dipping linear guide rail 6.4 is installed on the lower frame bottom plate 1.9 through the linear guide rail mounting block 6.3. The single-axis Y-direction electric slide table 6.2 and the glue dipping linear guide rail 6.4 are arranged in parallel and opposite to each other. The single-axis slide table transverse mounting plate 6.5 is installed on the single-axis Y-direction electric slide table 6.2 and the glue dipping linear guide rail 6.4 and can move horizontally along the length directions of the single-axis Y-direction electric slide table 6.2 and the glue dipping linear guide rail 6.4 under the action of the single-axis Y-direction electric slide table 6.2, so as to move the position of the glue dipping needle 6.13 in the Y direction and realize glue dispensing for products at different positions. The settings of the single-axis slide table mounting plate 6.1 and the linear guide rail mounting block 6.3 can adjust the heights of the single-axis Y-direction electric slide table 6.2 and the glue dipping linear guide rail 6.4, so that the heights of the single-axis Y-direction electric slide table 6.2 and the glue dipping linear guide rail 6.4 are on the same horizontal plane, thus ensuring that the single-axis slide table transverse mounting plate 6.5 can move in the Y direction without jamming and ensuring the normal operation of the glue dipping module 6.

[0069] In this embodiment, a single-axis X-direction electric slide table 6.6 is connected along the length direction of the single-axis slide table transverse mounting plate 6.5. The glue dipping needle 6.13 is connected to the single-axis X-direction electric slide table 6.6 and can move the position of the glue dipping needle 6.13 in the X direction, so as to meet different glue dipping and glue dispensing requirements.

[0070] In this embodiment, a DD motor mounting plate 6.7 is connected to the single-axis X-direction electric slide table 6.6. The DD motor 6.8 is installed on the DD motor mounting plate 6.7. The output end of the DD motor 6.8 is connected to an electric cylinder mounting plate 6.9. The electric cylinder 6.10 is installed on the electric cylinder mounting plate 6.9. The output end of the electric cylinder 6.10 is connected to an electric cylinder connecting plate 6.11. A glue dipping needle mounting sleeve 6.12 is provided at the lower end of the electric cylinder connecting plate 6.11. The glue dipping needle 6.13 is arranged in the glue dipping mounting sleeve 6.12. Among them, the setting of the DD motor 6.8 can realize the rotation of the glue dipping needle 6.13, so as to adjust the position of the glue dipping needle 6.13 and improve the position accuracy of the glue dots. The setting of the electric cylinder 6.10 can adjust the height of the glue dipping needle 6.13 to meet the glue dipping and glue dispensing requirements.

[0071] In this embodiment, the single-axis slide table and the DD motor 6.8 can adjust the position of the glue dipping needle 6.13 according to the position photo of the product placed on the fixture 8.10 by the camera 7.3, eliminating the accuracy influence caused by the machining error and assembly error of the fixture 8.10. Therefore, the position accuracy of the glue dots can reach ±0.01 mm.

[0072] In this embodiment, the electric cylinder connecting plate 6.11 is an L-shaped plate. The vertical end of the L-shaped plate is connected to the electric cylinder 6.10, and the glue dipping needle 6.13 mounting sleeve 6.12 is connected to the center of the end of the horizontal end of the L-shaped plate.

[0073] In this embodiment, a glue dipping cable protection chain 6.14 is connected to the end of the single-axis slide horizontal mounting plate 6.5 close to one end of the single-axis Y-direction electric slide 6.2. The arrangement of the glue dipping cable protection chain 6.14 can be used to neatly arrange messy cables, air pipes, etc. together, so that there is no knotting or entanglement phenomenon, protecting the cables themselves and increasing the neatness of the equipment.

[0074] As a further description of the above embodiment, as Figure 14 shown, the camera module 7 includes a camera module mounting bracket 7.1. Two cameras 7.3 are connected to the camera module mounting bracket 7.1 through two groups of simple adjustment components 7.2. The two cameras 7.3 are respectively located above the horizontal rotation module 4 and the planar rotation module 8.

[0075] When this embodiment is used, the camera module mounting bracket 7.1 is mounted on the lower frame bottom plate 1.9. The camera module mounting bracket 7.1 is an L-shaped bracket. The bottom of the L-shaped bracket is connected to the lower frame bottom plate 1.9. The two groups of simple adjustment components 7.2 are mounted in parallel on the horizontal end of the L-shaped bracket. The simple adjustment component 7.2 is used to adjust the height of the camera 7.3. The structure and working principle of the simple adjustment module belong to the prior art. As long as the height of the camera 7.3 can be adjusted, therefore, the structure and working principle of the simple adjustment module will not be further described in this embodiment. A camera mounting plate 7.5 is connected to the simple adjustment module. The camera 7.3 is mounted on the camera mounting plate 7.5, and the lens 7.4 is mounted on the camera 7.3, which is used to take pictures of the position of the product placed on the fixture 8.10 and then feedback to the single-axis slide and the DD motor 6.8 to adjust the position, which can eliminate the accuracy influence caused by the processing error and assembly error of the fixture 8.10. Therefore, the positional accuracy of the glue dots can reach ±0.01 mm.

[0076] In this application, the structure and working principle of the single-axis electric slide, the structure and installation of the cable protection chain, etc. all belong to the prior art. Those skilled in the art can know according to the prior art, so they will not be further described in this application.

[0077] In this application, the control of each module and the control program of the working states between each module all belong to the prior art. Those skilled in the art can write accordingly according to the actual usage position situation, and the specific program will not be further described in this application.

[0078] In summary, the working principle of the dipping equipment is as follows: The fixture tray is manually placed into the automatic feeding module 2. Since the feeding module has a self-locking function, the fixtures 8 and 10 are locked and fixed to play a positioning role. There are two suction heads on the pick-and-place module 3. One is responsible for picking up the un-dotted product during feeding, and the other is responsible for picking up the dotted product during discharging. The division of labor of the two suction heads can effectively ensure the working efficiency of the equipment. The horizontal rotation module 4 and the planar rotation module 8 both use a 4-station turntable 8 and 9 to ensure the continuity of product dotting. The glue tray module 5 keeps running when the start button is pressed with the glue tray full. The squeegee 5.6 on the glue tray module 5 has a glue storage port, which can ensure that the glue is quickly leveled after each dip of the dipping needle 6.13. During the dipping process in the dipping module 6, the pick-and-place module 3 can pick and place products on the fixture tray simultaneously, ensuring that the equipment is always dotting.

[0079] In summary, for the dipping module of the present invention, single-axis electric slides with an accuracy of ±0.01 mm are used in both the X and Y directions, and the rotating components use DD motors. After the camera takes pictures of the products placed on the fixture and feeds back the positions to the single-axis slides and DD motors to adjust the positions, the accuracy impact caused by the machining errors and assembly errors of the fixture can be eliminated. Therefore, the positional accuracy of the glue dots can reach ±0.01 mm. At the same time, this equipment uses the dipping method for dotting. The size requirements of the glue dots can be controlled and adjusted by changing the size of the dipping needle, which is flexible and variable. This equipment uses the automatic dipping method, which can perform dotting at multiple positions on the same product to meet the requirements of different products, and has a wide range of applications. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0080] The above embodiments are only illustrative of the principles and effects of the present invention, and are not used to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A glue dipping device for optical device chip mounting, characterized in that: It includes a frame module (1), on which a pick - and - place module (3) is connected and arranged along the length direction of the frame module (1). Below the pick - and - place module (3), there is an automatic feeding module (2) perpendicular to the pick - and - place module (3). In front of the pick - and - place module (3), there are a horizontal rotation module (4) and a planar rotation module (8) arranged side by side and parallel to the pick - and - place module (3). Above the horizontal rotation module (4) and the planar rotation module (8), there is a camera module (7). In front of the horizontal rotation module (4) and the planar rotation module (8), there is a glue - dipping module (6) arranged parallel to the pick - and - place module (3). Outside the glue - dipping module (6), there is a glue - pan module (5) perpendicular to the pick - and - place module (3). The pick - and - place module (3) is used to suck and place the un - glued products into the horizontal rotation module (4) or the planar rotation module (8). The horizontal rotation module (4) is used for products with a vertical glue - applying surface. The horizontal rotation motor (4.5) drives the horizontal rotation speed reducer (4.6) to rotate. The horizontal rotation speed reducer (4.6) transmits the power to the transfer disk (4.11) through the horizontal rotation coupling (4.8), thereby realizing the material conversion of the 4 horizontal suction heads (4.12) on the transfer disk (4.11). The planar rotation module (8) is used for products with a horizontal glue - applying surface. The planar rotation motor (8.2) drives the planar rotation speed reducer (8.3) to rotate. The planar rotation speed reducer (8.3) transmits the power to the turntable (8.9) through the planar rotation coupling (8.4), thereby realizing the material conversion of the 4 planar connectors (8.12) on the turntable (8.9).

2. The glue dipping device for optical device patch according to claim 1, characterized in that: The frame module (1) includes an upper frame and a lower frame connected to each other. Inside the lower frame, there are pneumatic combination components (1.2) and a main power switch (1.3). On the upper frame, there is an upper - frame shield (1.10). Along its width direction, a grating opening is provided on the upper - frame shield (1.10). Inside the grating opening, a safety grating (1.12) is installed. On the upper - frame shield (1.10), a start / reset / stop button (1.13) and an emergency stop button (1.14) are installed. On the top of the upper - frame shield (1.10), an alarm lamp (1.15) is installed.

3. The glue dipping device for optical device patching according to claim 1, characterized in that: The automatic feeding module (2) includes a feeding single - axis electric slide (2.1). A fixture placement plate (2.6) is connected to the feeding single - axis electric slide (2.1). Rotation grooves are respectively opened in the middle parts of two adjacent sides of the fixture placement plate (2.6). In the rotation grooves, fixture pressing blocks (2.8) are rotatably connected. On both sides of the bottom of the fixture pressing block (2.8), pressing - block support blocks (2.9) are respectively connected. The fixture pressing block (2.8) and the pressing - block support block (2.9) are connected through a pressing - block rotating shaft (2.11). A spring (2.10) is arranged between the fixture pressing block (2.8) and the pressing - block support block (2.9). In the middle of the inner side of the fixture pressing block (2.8), a ball - head plunger (2.7) is connected.

4. The dipping glue device for optical device patching according to claim 1, characterized in that: The pick-and-place module (3) includes a pick-and-place single-axis electric slide (3.4). A guide rail mounting plate (3.20) is installed on the pick-and-place single-axis electric slide (3.4). A pick-and-place motor (3.6) and a vacuum generator (3.7) are connected to the guide rail mounting plate (3.20). The output shaft of the pick-and-place motor (3.6) is connected to a gear (3.14). Two symmetrically arranged pick-and-place linear guide rails (3.8) are connected to the side wall of the guide rail mounting plate (3.20) along its height direction. A rack mounting plate (3.11) that can move up and down along its height direction is connected to the pick-and-place linear guide rail (3.8). Racks (3.13) meshing with the gear (3.14) are respectively connected to the opposite surfaces of the two rack mounting plates (3.11). The lower end of the rack mounting plate (3.11) is connected to a suction head mounting plate (3.15). A pick-and-place suction head (3.17) is connected to the suction head mounting plate (3.15) through a buffer (3.16). The upper end of the buffer (3.16) is communicated with the vacuum generator (3.7) through an air pipe.

5. The glue dipping device for optical device patching according to claim 1, characterized in that: The horizontal rotation module (4) includes a horizontal rotation module mounting plate (4.1). One end of the horizontal rotation module mounting plate (4.1) is connected to a horizontal rotary joint (4.3). Two groups of horizontal rotary micro-joints (4.4) are provided on the horizontal rotary joint (4.3). The other end of the horizontal rotation module mounting plate (4.1) is connected to a horizontal rotation drive assembly. The output end of the horizontal rotation drive assembly is connected to a transfer disk (4.11). A proximity sensing block (4.9) is installed on the transfer disk (4.11). Four horizontal suction heads (4.12) are communicated with the side wall of the transfer disk (4.11) along its circumferential direction. Four horizontal joints (4.13) communicated with the horizontal suction heads (4.12) are provided along the circumferential direction on the end face of the transfer disk (4.11) opposite to the horizontal rotary joint (4.3). The two groups of horizontal rotary micro-joints (4.4) are respectively communicated with the vacuum source and the horizontal joint (4.13).

6. The dip-coating device for optical device chips according to claim 1, wherein: The planar rotation module (8) includes a planar rotation module mounting base (8.1). A centripetal bearing mounting seat (8.5) is connected to the planar rotation module mounting base (8.1). A planar rotation proximity sensor (8.7) is connected to the centripetal bearing mounting seat (8.5). A drive assembly is provided on the planar rotation module mounting base (8.1). The output end of the drive assembly is connected to a turntable (8.9). Four fixtures (8.10) with planar joints (8.12) are evenly arranged along the circumferential direction of the turntable (8.9). An air-driven rotary joint (8.13) is provided directly above the turntable (8.9). The air-driven rotary joint (8.13) is connected to the planar rotation module mounting base (8.1) through a rotary joint mounting plate (8.11). Two groups of planar rotation micro-joints (8.14) are provided on the air-driven rotary joint (8.13). The two groups of planar rotation micro-joints (8.14) are respectively communicated with the vacuum source and the planar joint (8.12).

7. The glue dipping device for optical device patches according to claim 1, characterized in that: The glue disk module (5) includes a glue disk support base (5.1). Oppositely arranged bearing mounting plates (5.3) and crossed roller slides (5.9) are connected to the glue disk support base (5.1). A glue disk pillow block bearing (5.4) is connected to the bearing mounting plate (5.3). A glue disk (5.5) is arranged on the glue disk pillow block bearing (5.4). A glue disk motor (5.2) is connected to the lower surface of the glue disk support base (5.1). The output shaft of the glue disk motor (5.2) penetrates through the glue disk support base (5.1) and is connected to the glue disk (5.5) through a glue disk coupling (5.10). A rotating shaft mounting plate (5.8) is connected to the crossed roller slide (5.9). A scraper (5.6) is connected to the end of the rotating shaft mounting plate (5.8) through a glue disk rotating shaft (5.7). The bottom of the scraper (5.6) is located inside the glue disk (5.5).

8. The dipping glue device for optical device patch according to claim 1, characterized in that: The glue dipping module (6) includes oppositely arranged single-axis Y-direction electric slides (6.2) and glue dipping linear guides (6.4). A movable single-axis slide transverse mounting plate (6.5) is connected between the single-axis Y-direction electric slide (6.2) and the glue dipping linear guide (6.4). A single-axis X-direction electric slide (6.6) is connected to the single-axis slide transverse mounting plate (6.5) along its length direction. A DD motor (6.8) is connected to the single-axis X-direction electric slide (6.6). An electric cylinder (6.10) is connected to the output end of the DD motor (6.8) through an electric cylinder mounting plate (6.9). The output end of the electric cylinder (6.10) is connected to a glue dipping needle (6.13) through an electric cylinder connecting plate (6.11).

9. The glue dipping device for optical device patching according to claim 1, characterized in that: The camera module (7) includes a camera module mounting bracket (7.1). Two groups of cameras (7.3) are connected to the camera module mounting bracket (7.1) through two groups of simple adjustment components (7.2). The two groups of cameras (7.3) are respectively located above the horizontal rotation module (4) and the planar rotation module (8).

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