A device that mixes or multiplies frequencies

Abstract

Disclosed is a device for mixing or multiplying frequencies, comprising: a metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body being buckled together to define a metal cavity; at least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel, and a signal output channel, which respectively pass through the metal shell and are coupled with the microstrip line, the signal output channel being led out at an angle to the plane where the microstrip line is located. The device changes the direction of leading out the signal output channel from being parallel to the plane where the microstrip line is located to being led out at an angle, so as to avoid the problem of poor integration caused by the radio frequency signal input channel, the local oscillator signal input channel, and the signal output channel existing in the same plane.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to a device for mixing or multiplying frequencies. Background Art

[0002] In recent years, terahertz wave technology, as an important research field, has received more and more attention at home and abroad. However, no matter in which aspect and in which frequency band terahertz waves are applied, they are inseparable from the reception of terahertz waves. For the most commonly used receiver based on superheterodyne system, the mixer that realizes frequency down-conversion is one of the key components. In solid-state terahertz radar and communication systems, since the low-noise amplifier is difficult to realize, the mixer becomes the first stage of the receiving end, so the performance of the mixer is directly related to the performance of the entire receiver system. At the same time, since it is difficult to realize a high-performance local oscillator source in the same frequency band, the use of subharmonic mixing technology is an effective way to solve this problem.

[0003] As system performance requirements increase, the requirements for receiver indicators are also increasing. In order to improve integration or imaging resolution, multi-channel integration of receivers is a key issue. Since the current mainstream terahertz mixers use metal cavity materials such as copper or aluminum, which can achieve a good channel spacing distance, they are still spliced ​​in a single-channel independent form. However, due to the limitations of metal cavity machining requirements, it is difficult to reduce the multi-channel spacing to improve the overall integration. Summary of the invention

[0004] An object of the present disclosure is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0005] According to an embodiment of the present disclosure, a device for mixing or multiplying frequencies is provided, comprising:

[0006] A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity;

[0007] At least one frequency conversion unit, the at least one frequency conversion unit comprising:

[0008] a microstrip line, the microstrip line being located in the metal cavity; and

[0009] A channel structure, the channel structure includes a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel, which respectively pass through the metal shell and are coupled to the microstrip line, and the signal output channel is led out at an angle to the plane where the microstrip line is located.

[0010] According to an exemplary embodiment of the present disclosure, the signal output channel is perpendicular to the plane where the microstrip line is located.

[0011] According to an exemplary embodiment of the present disclosure, the signal output channel is led out in one of the following ways: a. SMA connector; b. glass insulator; c. coaxial metal column structure.

[0012] According to an exemplary embodiment of the present disclosure, the SMA connector is connected to the frequency output port of the microstrip line by gold wire binding.

[0013] According to an exemplary embodiment of the device of the present disclosure, the glass insulator is connected to the frequency output port of the microstrip line by gold wire binding.

[0014] According to an exemplary embodiment of the present disclosure, the coaxial metal column structure includes a metal needle and a plurality of second columnar portions spaced apart and sleeved on the metal needle along the axial direction of the metal needle, one of the second columnar portions is connected to the metal shell, and the metal needle is connected to the frequency output port of the microstrip line by gold wire binding.

[0015] According to an exemplary embodiment of the present disclosure, the diameters of two adjacent second columnar portions are different.

[0016] According to an exemplary embodiment of the present disclosure, the radio frequency signal input channel and the local oscillator signal input channel of the frequency conversion unit are both introduced perpendicularly to the length direction of the microstrip line and coupled to the microstrip line.

[0017] According to an exemplary embodiment of the present disclosure, the introduction directions of the radio frequency signal input channel and the local oscillator signal input channel of the frequency conversion unit are opposite.

[0018] According to an exemplary embodiment of the present disclosure, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along the length direction of the microstrip line.

[0019] According to an exemplary embodiment of the present disclosure, when the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively disposed in the box body and the cover body, and are arranged in a mirror-symmetrical manner.

[0020] According to an exemplary embodiment of the present disclosure, the RF signal input channels of each row of the frequency conversion units are parallel to each other and their ports are aligned, and the local oscillator signal input channels of each row of the frequency conversion units are parallel to each other and their ports are aligned.

[0021] According to an exemplary embodiment of the present disclosure, the signal output channels of the frequency conversion units in each row are parallel to each other, and the lead-out directions of two adjacent signal output channels in the frequency conversion units in each row are opposite.

[0022] According to an exemplary embodiment of the present disclosure, when there are multiple frequency conversion units, local oscillator signal input channels of the multiple frequency conversion units are aggregated into one port through a power divider.

[0023] According to the device for mixing or doubling frequencies described in the above various embodiments of the present disclosure, by changing the lead-out direction of the signal output channel from a direction parallel to the plane where the microstrip line is located to a direction forming an angle with the plane where the microstrip line is located, the problem of poor integration caused by the RF signal input channel, the local oscillator signal input channel and the signal output channel existing in the same plane is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown.

[0025] Figure 2 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to another exemplary embodiment of the present disclosure is shown.

[0026] Figure 3 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure.

[0027] Figure 4 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0028] Figure 5 A schematic diagram of a glass insulator according to an exemplary embodiment of the present disclosure.

[0029] Figure 6 A schematic diagram of a terahertz mixer having a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure is shown.

[0030] Figure 7 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown.

[0031] Figure 8 Schematic diagram of a coaxial metal pillar structure according to an exemplary embodiment of the present disclosure.

[0032] Fig. 9 A schematic diagram showing the distribution of multiple frequency conversion units of a terahertz mixer on a box body according to yet another exemplary embodiment of the present disclosure is shown.

[0033] Fig.10 A schematic diagram showing the distribution of multiple frequency conversion units of a terahertz mixer on a cover according to yet another exemplary embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0034] Although the present disclosure will be fully described with reference to the accompanying drawings containing preferred embodiments of the present disclosure, it should be understood before this description that a person of ordinary skill in the art can modify the invention described herein while obtaining the technical effects of the present disclosure. Therefore, it should be understood that the above description is a broad disclosure to a person of ordinary skill in the art, and its content is not intended to limit the exemplary embodiments described in the present disclosure.

[0035] In addition, in the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments may be implemented without these specific details. In other cases, known structures and devices are embodied in a schematic manner to simplify the accompanying drawings.

[0036] According to the overall inventive concept of the present disclosure, there is provided a device for mixing or multiplying frequencies, comprising a metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body being buckled together to define a metal cavity; at least one frequency conversion unit, the at least one frequency conversion unit comprising a microstrip line, the microstrip line being located in the metal cavity; and a channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel, which pass through the metal shell and are respectively coupled to the microstrip line, the signal output channel being led out at an angle to the plane where the microstrip line is located.

[0037] The terahertz mixer according to the present disclosure is a radio frequency transition microstrip line mixer, which mainly includes a metal shell and at least one frequency conversion unit located in the metal shell, wherein the metal shell includes a box body and a cover body that is buckled with the box body, for example, by screws, and when the box body and the cover body are buckled together, a metal cavity can be defined in the metal shell. In addition, a band port standard flange structure is also provided on the metal shell. In order to facilitate the connection between the cover body and the box body, the terahertz mixer is also provided with alignment pins, etc.

[0038] Figure 1 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to an exemplary embodiment of the present disclosure is shown. Figure 2 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to another exemplary embodiment of the present disclosure is shown.

[0039] like Figure 1 and Figure 2As shown, the frequency conversion unit of the terahertz mixer includes a microstrip line 107 and a channel structure, and the microstrip line 107 is located in a metal cavity. The channel structure includes a radio frequency signal input channel 101, a local oscillator signal input channel 102 and a signal output channel that pass through the metal shell and are respectively coupled to the microstrip line 107. A portion of the microstrip line 107 extends into the metal cavity where the radio frequency signal input channel 101 and the local oscillator signal input channel 102 are located, so as to form an antenna 104 for receiving the radio frequency input signal and the local oscillator input signal. Among them, the composition and size parameters of other parts in the mixer can refer to the prior art, or other documents or patents.

[0040] The specific contents of this solution are described below in conjunction with more specific examples. It should be understood that the dimensions and proportions in the figures are only for illustration and have nothing to do with the actual structure.

[0041] like Figure 1 and Figure 2 As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the mixer according to the present disclosure are respectively formed in a box body (or cover body) defining a metal cavity, and are parallel to the plane where the microstrip line 107 is located, while the signal output channel (in this embodiment, the intermediate frequency signal output channel) is perpendicular to the plane where the microstrip line 107 is located, and is led out from the cover body or the box body through the SMA connector 112. The terahertz mixer changes the direction of the intermediate frequency signal lead-out of the mixer from a direction parallel to the plane where the microstrip line 107 is located to a direction perpendicular to the plane where the microstrip line 107 is located through the SMA connector, thereby avoiding the problem of poor integration caused by the RF signal input channel, the local oscillator signal input channel and the signal output channel existing in the same plane, and while ensuring the basic high-frequency characteristics of the mixer, reduces the complexity and processing cost of multi-channel integration, improves the flexibility of the mixer integration method, and provides favorable conditions for further system integration.

[0042] like Figure 1 and Figure 2 As shown, the SMA connector 112 is a through-wall structure and has a metal needle, which points outward perpendicular to the paper plane, and one end of which is flush with the microstrip line 107 and is connected to the intermediate frequency signal output port 103 of the microstrip line 107 through gold wire binding, thereby realizing the vertical extraction of the intermediate frequency signal. It should be noted that those skilled in the art should understand that the SMA connector 112 can also use other connectors, such as a 2.92mm connector.

[0043] Figure 3 A schematic diagram showing a terahertz mixer with a single frequency conversion unit according to yet another exemplary embodiment of the present disclosure. Figure 4 A schematic diagram showing a terahertz mixer with multiple frequency conversion units according to yet another exemplary embodiment of the present disclosure is shown. Figure 5A schematic diagram of a glass insulator according to an exemplary embodiment of the present disclosure.

[0044] In some embodiments of the present disclosure, Figure 3 and Figure 4 As shown, the signal output channel is led out vertically through the glass insulator. Figure 5 As shown, the glass insulator includes a metal needle 212 and a first columnar portion 213 sleeved on the middle of the metal needle 212. The metal needle 212 points outward perpendicular to the paper plane, and its first end is flush with the microstrip line 107 and connected to the intermediate frequency signal output port 103 of the microstrip line 107 through gold wire binding. The first columnar portion 213 is made of insulating glass medium, and a metal layer 214 is provided on the outer surface of the first columnar portion 213. The first columnar portion 213 is connected to a cover or box body defining a metal shell, for example, located in a hole formed in the cover or box body.

[0045] In some embodiments of the present disclosure, a second end of the metal pin 212 of the glass insulator, which is opposite to the first end, is connected with an SMA connector so as to be connected with an external component.

[0046] Figure 6 It is an intention to illustrate a terahertz mixer having a single frequency conversion unit according to still another exemplary embodiment of the present disclosure. Figure 7 is a schematic diagram showing a terahertz mixer having a plurality of frequency conversion units according to yet another exemplary embodiment of the present disclosure. Figure 8 is a schematic diagram of a coaxial metal pillar structure according to an exemplary embodiment of the present disclosure.

[0047] In some embodiments of the present disclosure, Figure 6 and Figure 7 As shown, the signal output channel is led out vertically through the coaxial metal column. Figure 8 As shown, the coaxial metal column includes a metal needle 312 and a plurality of second columnar portions 313A, 313B, and 313C spaced apart and sleeved on the metal needle 312 along the axial direction of the metal needle 312. One of the second columnar portions 313A, 313B, and 313C (preferably the one away from the intermediate frequency signal output port 103) is connected to the metal shell. The metal needle 312 points outward perpendicular to the paper plane, and its first end is flush with the microstrip line 107, and is connected to the intermediate frequency signal output port 103 of the microstrip line by gold wire binding.

[0048] In an exemplary embodiment of the present disclosure, Figure 8As shown, the diameters of two adjacent second columnar portions 313A, 313B, and 313C are different. The coaxial metal column uses second columnar portions of different thicknesses to form effective filter characteristics, thereby filtering the radio frequency signal and the local oscillator signal to ensure the output of the intermediate frequency signal. Since the coaxial metal column integrates a low-pass filter, the overall length of the quartz microstrip line is shortened, thereby improving the integration of the multi-channel mixer.

[0049] In some embodiments of the present disclosure, a second end of the metal needle 312 of the coaxial metal column opposite to the first end is connected to an SMA connector for connection with an external component.

[0050] It should be noted that, although in the above-mentioned embodiments, the direction of the intermediate frequency signal lead-out of the mixer is changed from a direction parallel to the plane where the microstrip line 107 is located to a direction perpendicular to the plane where the microstrip line 107 is located through an SMA connector or a glass insulator or a coaxial metal column, however, those skilled in the art should understand that in some other embodiments of the present disclosure, the direction of the intermediate frequency signal lead-out may also be at an angle to the plane where the microstrip line 107 is located, and the angle is not equal to zero.

[0051] In some exemplary embodiments of the present disclosure, Figure 1-4 , Figure 6 and Figure 7 As shown, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are both introduced perpendicular to the length direction of the microstrip line 107 and directly coupled to the microstrip line. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit can also be introduced in other directions, for example, the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are both introduced parallel to the length direction of the microstrip line 107 and coupled to the microstrip line through a 90° turn.

[0052] In an exemplary embodiment of the present disclosure, Figure 1-4 , Figure 6 and Figure 7As shown, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are opposite to each other, so as to avoid interference between the RF signal input channel 101 and the local oscillator signal input channel 102 and the components associated therewith in spatial position, and at the same time, the overall length of the microstrip line 104 can be shortened to further improve the integration of the mixer. However, it should be noted that in some other embodiments of the present disclosure, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit may also be the same. In addition, in some other embodiments of the present disclosure, the introduction directions of the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit may also be non-parallel.

[0053] In an exemplary embodiment, Figure 2 , Figure 4 and Figure 7 As shown, when there are multiple frequency conversion units, the multiple frequency conversion units are arranged in a row along the length direction of the microstrip line 107. However, it should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, other arrangements may also be adopted, and the specific arrangement may be adjusted according to requirements.

[0054] In the case where the RF signal input channel 101 and the local oscillator signal input channel 102 of the frequency conversion unit are both introduced in parallel to the length direction of the microstrip line 107 and coupled to the microstrip line 107 through a 90° turn, when there are multiple frequency conversion units, the multiple frequency conversion units can be arranged in a row along a direction perpendicular to the length direction of the microstrip line 107. However, it should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, other arrangements may also be adopted, and the specific arrangement may be adjusted according to requirements.

[0055] In an exemplary embodiment, Figure 2 , Figure 4 and Figure 7 As shown, the RF signal input channels 101 of each row of frequency conversion units are parallel to each other and their ports are aligned, and the local oscillator signal input channels 102 are parallel to each other and their ports are aligned, so as to ensure the consistency of signal reception and input local oscillator signals of the multi-channel receiver.

[0056] The working process of the above mixer includes: the terahertz signal to be received is transmitted to the antenna 104 of the microstrip line 107 through the radio frequency signal input channel 101 in the waveguide-transition-microstrip line structure of the E-plane probe; the local oscillator signal entering from the local oscillator signal input channel 102 is mixed with the radio frequency signal in the gallium arsenide Schottky diode 109 after passing through the microstrip transition structure 107 of the duplexer and the local oscillator low-pass filter 106, and the radio frequency signal is mixed with the second harmonic of the local oscillator, and the intermediate frequency signal after difference is reached through the intermediate frequency filter 108. The intermediate frequency signal output port 103 is then transmitted to the load through the SMA connector or glass insulator or coaxial metal column. In order to avoid the DC bias caused by the inconsistency of the Schottky diode 109 pair, the ground wire 105 connected to the metal cavity is led out from the microstrip line 107, which can be applied to the nearest metal cavity through conductive silver glue, or can be welded to the nearest metal cavity through gold wire binding.

[0057] Fig. 9 A schematic diagram showing the distribution of multiple frequency conversion units of a terahertz mixer on a box body according to yet another exemplary embodiment of the present disclosure is shown. Fig.10 A schematic diagram showing the distribution of multiple frequency conversion units of a terahertz mixer on a cover according to yet another exemplary embodiment of the present disclosure is shown.

[0058] In an exemplary embodiment, Fig. 9 and Fig.10 As shown, when there are multiple frequency conversion units, the multiple frequency conversion units are divided into two groups, and the two groups of frequency conversion units are respectively arranged in the box body (see Fig. 9 ) and cover (see Fig.10 ), and are mirror-symmetrical. Specifically, the microstrip line assembly position I of the frequency conversion unit located in the cover body corresponds to the air cavity position II on the microstrip line of the frequency conversion unit located in the box body; the air cavity position II on the microstrip line of the frequency conversion unit located in the cover body corresponds to the microstrip line assembly position I of the frequency conversion unit located in the box body. In this way, the intermediate frequency signals of the upper and lower adjacent channels are led out in opposite directions, so as to be led out from the box body and the cover body respectively, thereby reserving a large space for the SMA connector or glass insulator or coaxial metal column. If the maximum outer diameter of the SMA connector or glass insulator or coaxial metal column is a, it is sufficient to ensure that the spacing between channels is not less than a / 2. If you want to further reduce the spacing between channels, you can use a customized small-size connector at the intermediate frequency output end.

[0059] In an exemplary embodiment, Fig. 9 and Fig.10 As shown, the signal output channels 103 of each row of frequency conversion units are parallel to each other and the lead-out directions of two adjacent signal output channels are opposite, so as to further reserve a larger space for the SMA connector or glass insulator or coaxial metal column.

[0060] In an exemplary embodiment, Fig. 9 and Fig.10 As shown, the corresponding positions of the box body and the cover body are marked A-A'-B'-B to avoid incorrect fastening.

[0061] It should be noted that, when there are multiple frequency conversion units, the multiple frequency conversion units may form a group, and the frequency conversion units in the group may all be arranged on the box body, or may all be arranged on the cover body.

[0062] In an exemplary embodiment, the local oscillator signal input channels 102 of multiple frequency conversion units can be gathered into one port through a power divider (one to four, one to eight, etc.), and then the signal is input through the local oscillator source to achieve simultaneous operation of the mixer.

[0063] It should be noted that the microstrip line 107 can be a microstrip line structure based on a quartz substrate, a microstrip line structure based on sapphire, a common microstrip line structure, a suspended microstrip line structure, a monolithic integrated microstrip line circuit based on gallium arsenide (GaAs), or a monolithic integrated microstrip line circuit based on indium phosphide (InP). In addition, the material of the metal shell includes but is not limited to alloy metals such as aluminum or brass, and semiconductor materials such as silicon, gallium arsenide, and indium phosphide. The metal cavity defined by the metal shell can be a shielded cavity structure with a metal inner wall processed by a micro-machining (MEMS) process, or a shielded cavity structure with a metal inner wall processed by a micro-coaxial process.

[0064] In addition, in an exemplary embodiment of the present disclosure, the antenna 104 can be integrated with the RF signal input channel 101 and processed together, and the size of the antenna 104 can be optimized according to the channel spacing to ensure the system's requirements for receiver parameters.

[0065] In addition, those skilled in the art should understand that the harmonic type of the mixer is not limited, and can be a single-ended, single-balanced, double-balanced, triple-balanced or I / Q passive mixer. Multiple local oscillator signal input channels of the mixer can be collected into one channel through a power divider (one to four, or one to eight, etc.), and then through the local oscillator source input signal, the mixer can work simultaneously.

[0066] The terahertz mixer changes the direction of the intermediate frequency signal of the mixer from being parallel to the plane where the microstrip line 107 is located to being perpendicular to the plane where the microstrip line 107 is located, thereby avoiding the problem of poor integration caused by the existence of the RF signal input channel, the local oscillator signal input channel and the signal output channel in the same plane, and while ensuring the basic high-frequency characteristics of the mixer, reduces the complexity and processing cost of multi-channel integration, improves the flexibility of the mixer integration method, and provides favorable conditions for further system integration. In addition, although the above embodiments are all described by taking the mixer as an example, those skilled in the art should understand that in some other embodiments of the present disclosure, the device can also be applied to the frequency multiplier.

[0067] Those skilled in the art can understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing conflicts in structure or principle.

[0068] After describing the preferred embodiments of the present disclosure in detail, those skilled in the art can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the appended claims, and the present disclosure is not limited to the implementation methods of the exemplary embodiments listed in the specification.

Claims

1. A device for mixing or multiplying frequencies, comprising: A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity; At least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and A channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel respectively passing through the metal shell and coupled to the microstrip line, the signal output channel being led out at an angle to the plane where the microstrip line is located, Among them, the signal output channel is led out through an SMA connector, the SMA connector is a through-wall structure and has a metal needle, the metal needle points outward perpendicular to the main plane, one end of the SMA connector is flush with the microstrip line, and is connected to the intermediate frequency signal output port of the microstrip line through gold wire binding.

2. The device according to claim 1, wherein: The signal output channel is perpendicular to the plane where the microstrip line is located.

3. The device according to claim 1 or 2, wherein: The radio frequency signal input channel and the local oscillator signal input channel of the frequency conversion unit are both introduced perpendicularly to the length direction of the microstrip line and coupled to the microstrip line.

4. The device according to claim 3, wherein: The introduction directions of the radio frequency signal input channel and the local oscillator signal input channel of the frequency conversion unit are opposite.

5. The device according to claim 4, wherein: When there are multiple frequency conversion units, the multiple frequency conversion units are divided into one group or two groups, and the frequency conversion units in each group are arranged in a row along the length direction of the microstrip line.

6. The device according to claim 5, wherein: When the plurality of frequency conversion units are divided into two groups, the two groups of frequency conversion units are respectively arranged in the box body and the cover body, and are arranged in a mirror-symmetrical manner.

7. The device according to claim 6, wherein: The radio frequency signal input channels of each row of the frequency conversion units are parallel to each other and the ports are aligned, and the local oscillator signal input channels of each row of the frequency conversion units are parallel to each other and the ports are aligned.

8. The device according to claim 7, wherein: The signal output channels of the frequency conversion units in each row are parallel to each other, and the lead-out directions of two adjacent signal output channels in the frequency conversion units in each row are opposite.

9. The device according to claim 1 or 2, wherein: When there are multiple frequency conversion units, the local oscillator signal input channels of the multiple frequency conversion units are collected into one port through a power divider.

10. A device for mixing or multiplying frequencies, comprising: A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity; At least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and A channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel respectively passing through the metal shell and coupled to the microstrip line, the signal output channel being led out at an angle to the plane where the microstrip line is located, Wherein, the signal output channel is led out through a glass insulator, and the glass insulator includes a metal needle and a first columnar portion sleeved on the middle part of the metal needle, and the metal needle points outward perpendicular to the main plane, wherein the first end of the metal needle is flush with the microstrip line and is connected to the intermediate frequency signal output port of the microstrip line through gold wire binding.

11. A device for mixing or multiplying frequencies, comprising: A metal shell, the metal shell comprising a box body and a cover body, the box body and the cover body are buckled together to define a metal cavity; At least one frequency conversion unit, the at least one frequency conversion unit comprising: a microstrip line, the microstrip line being located in the metal cavity; and A channel structure, the channel structure comprising a radio frequency signal input channel, a local oscillator signal input channel and a signal output channel respectively passing through the metal shell and coupled to the microstrip line, the signal output channel being led out at an angle to the plane where the microstrip line is located, Wherein, the signal output channel is led out through a coaxial metal column, and the coaxial metal column includes a metal needle and a plurality of second columnar portions spaced apart and sleeved on the metal needle along the axial direction of the metal needle, one of the second columnar portions is connected to the metal shell, and the metal needle points outward perpendicular to the main plane, wherein the first end of the metal needle is flush with the microstrip line and is connected to the intermediate frequency signal output port of the microstrip line by gold wire binding.

12. The device according to claim 11, wherein: The diameters of two adjacent second columnar portions are different.

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