Actuators for bond heads
By using the passive tilt correction method of multi-motion axis and bonding members during the installation of semiconductor chips, the chip tilt control problem is solved, the installation accuracy and stability are improved, and the equipment complexity and cost are reduced.
Patent Information
- Application Number
- CN201980055452.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2018-06-23
- Filing Date
- 2019-06-23
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2039-06-23
AI Technical Summary
The prior art is difficult to effectively control the tilt of the chip during the installation of semiconductor chips, resulting in reduced retention force, insufficient or loss of electrical contact, irregular heat transfer, and chip damage. The traditional tilt adjustment method is complex and costly.
By configuring multiple motion axes and engaging members on the bonding head, passive tilt correction is achieved using mechanical principles, reducing the complexity and weight of the equipment, and using a combination of rotating contact surfaces and adjustment members, simplifying the tilt adjustment process and reducing the tilt adjustment process Operating time and cost.
It realizes effective control of chip tilt during the semiconductor chip installation process, improves installation accuracy and stability, reduces the complexity and cost of the equipment, and shortens the operating time.
Smart Images
Figure CN113169091B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method of mounting a device on a substrate arranged at a substrate position, and an apparatus for mounting a device on a substrate arranged at a substrate position. Background Art
[0002] A wide range of advanced methods and apparatus for mounting components on substrates are known, all of which enable or simplify the mounting of components for a wide variety of applications.
[0003] The term "device" as used in the patent claims refers to an electronic device and / or an optical device, specifically a semiconductor chip (also referred to as a die) on a substrate.
[0004] The installation of components in the semiconductor industry is carried out with the aid of semiconductor assembly machines, which are referred to by technicians as "die bonders" or pick and place machines. The devices are usually semiconductor chips that can be placed and bonded on different substrates at predefined substrate locations.
[0005] The component is picked up by a pick-up member (such as a clamping gripper or a suction element). The pick-up member moves over the substrate and places the component at a predefined position on the substrate. The pick-up member can be mounted on a bonding head so that it can rotate around its longitudinal axis. The bonding head is attached to a pick-up and placement system that allows the required movement in three spatial directions X, Y and Z. The bonding head is attached to the bonding head with the aid of a special mounting bracket. In practice, the Z direction corresponds to the vertical direction and the XY plane corresponds to the horizontal plane. In addition to positioning the component with high precision on the XY plane, it is also very important to place the component on the substrate in a plane-parallel manner and without shear force. The tilted placement of the component may lead to undesirable properties, such as reduced holding force, insufficient or lost electrical contact, irregular heat transfer between the component and the substrate, or damage to the component. Shear force may cause the semiconductor chip to slide. Summary of the invention
[0006] Many different configurations are known for controlling the tilt of a pickup member.It is an object of the present invention to enable an improved control of the tilt during positioning of the assembly relative to a substrate.
[0007] Furthermore, it is an object of the invention to provide a simple and inexpensive tilt control possibility during production which, while maintaining simple handling, has a tilt mechanism for the bond head which is longest possible and virtually wear-free during use.
[0008] In a first aspect of the invention, there is provided a process for mounting a device on a substrate, the process providing a substrate at a substrate location on a substrate support. The procedure includes the following steps: providing a bonding head, which can be displaced along a first movement axis and a second movement axis relative to the substrate, and the second movement axis is substantially perpendicular to the first movement axis; providing a picking piece as a receiving element, the picking piece having a contact surface, wherein the picking piece is disposed on the bonding head, and wherein the contact surface is configured and arranged to be releasably or releasably attached to a component, and the contact surface is further configured and arranged to be rotatable around the first movement axis; providing a first engaging member, which is disposed on the bonding head; providing a first adjustment member, which is in a first adjustment position for rigidly engaging with the first adjustment member; moving the bonding head to the first adjustment position; rigidly engaging the first adjustment member with the first adjustment member; displacing the bonding head along the first movement axis or along the second movement axis relative to the first adjustment member, and the contact surface rotates around the second movement axis; releasing the first engaging member from the first adjustment member; and displacing the bonding head to the substrate position, and the bonding head maintains the rotation of the contact surface around the second movement axis.
[0009] By providing tilt correction using conventional drives and / or actuators and their movement along the corresponding axis of motion, the assembly of the components can be greatly simplified. In particular, the complexity of the bond head (and any parts or elements attached to the bond head) can be reduced - this can especially reduce the cost of the device itself. In addition, the weight can be reduced so that the bond head (and any parts or elements attached to the bond head) can be moved at a much faster speed than is possible with conventional equipment. Rotational correction can only be performed according to mechanical principles - such passive embodiments ensure a significant reduction in complexity and / or weight.
[0010] In another aspect of the present invention, a method for mounting a device on a substrate is provided, the method further comprising the following steps: configuring and arranging a bonding head to be displaceable relative to the substrate along a third movement axis, the third movement axis being substantially perpendicular to the first movement axis and substantially perpendicular to the second movement axis; configuring and arranging a contact surface to be rotatable around the third movement axis; after rigidly engaging a first joining member with a first adjustment member, displacing the bonding head relative to the first adjustment member along the first movement axis or along the second movement axis or along the third movement axis, the contact surface rotating around the third movement axis; and after releasing the first joining member from the first adjustment member, displacing the bonding head to a substrate position, the bonding head maintaining the rotation of the contact surface around the third movement axis.
[0011] After positioning, the assembly is preferably mounted in a plane-parallel manner to the substrate at the substrate location - by providing the required degrees of rotation about two axes of movement, the risk of tilting problems during operation can be significantly reduced.
[0012] In another aspect of the present invention, a method for mounting a device on a substrate is provided, the method further comprising the following steps provided: configuring and arranging a bonding head to be displaceable relative to the substrate along a third movement axis, the third movement axis being substantially perpendicular to the first movement axis and substantially perpendicular to the second movement axis; configuring and arranging a contact surface to be rotatable around the third movement axis; providing a second engaging member, the second engaging member being disposed on the bonding head; providing a second adjustment member, the second adjustment member being in a second adjustment position, the second adjustment member being configured and arranged to rigidly engage the second engaging member; moving the bonding head to the second adjustment position; rigidly engaging the second engaging member with the second adjustment member; moving the bonding head relative to the second adjustment member along the first movement axis or along the second movement axis or along the third movement axis, the contact surface rotating around the third movement axis; releasing the second engaging member from the second adjustment member; and moving the bonding head to a substrate position, the bonding head maintaining the rotation of the contact surface around the third movement axis.
[0013] By providing two engagement members, two adjustment members and two adjustment positions, a preferred embodiment of the invention can be achieved in such a way that even the time required to move from setting the first inclination to setting the second inclination can be significantly reduced.
[0014] This is also due to the fact that the mass to be moved (bonding head) is smaller, since an additional servomotor at the bonding head is avoided.
[0015] In a preferred method, the bonding head is configured and arranged to maintain the rotation of the contact surface using elastic members, spring members, magnetic members, electrical members, electromagnetic members, vacuum members, air-driven members, friction members, hydraulic members, inductive members or any combination thereof.
[0016] In another aspect of the present invention, a preferred method for inputting project data still involves the following steps: providing a tilt sensor, the tilt measuring device is configured and arranged to measure the rotation of the contact surface around a first motion axis and / or a second motion axis and / or around a third motion axis; providing a processor, the processor is configured and arranged to determine the extent of displacement along the first motion axis to obtain the desired rotation around the first motion axis and / or the second motion axis and / or around the third motion axis; and the processor is further configured and arranged to stop the displacement along the first motion axis when the desired tilt of the contact surface is reached.
[0017] In another aspect of the present invention, a preferred method for inputting project data still involves the following steps: providing a tilt sensor, which is configured and arranged to measure the tilt of a substrate; and providing a processor, which is configured and arranged to use the measured tilt of the substrate to determine the degree of displacement along a first motion axis to obtain a desired rotation around the first motion axis and / or the second motion axis and / or around a third motion axis.
[0018] In another aspect of the invention, a preferred method for temperature sensing, preferably also in a machine environment, continues to include the following steps: providing a temperature sensor, which is configured and arranged to measure the temperature and / or corresponding temperature of a bond head support carrier and / or a bond head support and / or a bond head and / or a tilt sensor and / or a contact surface; and providing a processor, which is configured and arranged to use the measured temperature of the contact surface to determine the degree of displacement along a first axis of motion to obtain a desired rotation around a second axis of motion and / or around a third axis of motion.
[0019] In another aspect of the present invention, a preferred method, which preferably also performs temperature sensing in a machine environment, continues to include the following steps: providing a temperature sensor, which is configured and arranged to measure the temperature of a substrate (160) and / or a substrate base and / or a corresponding temperature; and providing a processor, which is configured and arranged to use the measured temperature of the substrate to determine the degree of displacement along a first motion axis to obtain a desired rotation around the first motion axis and / or the second motion axis and / or the third motion axis.
[0020] The invention relates to temperature measurement by means of a temperature sensor and / or to contactless temperature measurement by means of radiation, such as laser-based temperature measurement or infrared-based temperature measurement.
[0021] In another aspect of the present invention, a preferred method for controlling the rotation of the contact surface of a picking member continues to include the following steps provided: measuring the tilt and / or rotation of a bonding head and / or a contact surface and / or a bonding assembly relative to a substrate, wherein at least the position of the bonding head can be optically detected with the aid of a reference mark; determining a first and a second compensation variable for compensating for the tilt and / or rotation based on the measurement results; moving the bonding head to a first position to be compensated with the compensation variable; rigidly engaging the first engaging member with the first adjustment member; performing a first compensation; moving the bonding head to a second position to be compensated with the compensation dimension; rigidly engaging the second engaging member with the first adjustment member; performing a second compensation.
[0022] Furthermore, it may be advantageous to remeasure the tilt of the bond head relative to the surface of the substrate or relative to the surface of a substrate manipulator and use it for further compensation.
[0023] The measurement of the tilt, i.e. the tilting and / or rotation of the bond head relative to the substrate is preferably performed using optical image recognition methods, whereby preferably optical reference marks, e.g. so-called fiducials attached to the bond head, are detected by a camera and used for reference. In this way, advantageous continuous monitoring can also be performed during the movement sequence during installation. Thus, situation-dependent compensations can be obtained, e.g. compensations caused by mechanical play or simple error propagation of mechanical deviations.
[0024] In another aspect of the present invention, there is provided an apparatus for mounting a device on a substrate. The apparatus is configured and arranged to perform the procedures described herein.
[0025] A preferred configuration of an apparatus for mounting an apparatus on a substrate disposed at a substrate position comprises: a bonding head, which can be displaced relative to the substrate along a first movement axis and a second movement axis, the second movement axis being substantially perpendicular to the first movement axis; a picking member, the picking member having a contact surface, the picking member being disposed on the bonding head, the contact surface being configured and arranged to be releasably or re-releasably attached to a component, the contact surface being further configured and arranged to be rotatable around the first movement axis; a first engaging member, the first engaging member being disposed on the bonding head; and a first adjustment member, the first adjustment member being in a first adjustment position for rigidly engaging with the first engaging member.
[0026] In addition, a preferred configuration of the device for mounting a device on a substrate includes a bonding head, which can be shifted to a first displacement position, and a first engaging member is rigidly engaged with the first displacement member; wherein, during engagement, the bonding head can be shifted along a first movement axis or along a second movement axis relative to the first displacement member, and the contact surface rotates around the first movement axis.
[0027] Furthermore, a preferred embodiment of the device comprises a first engagement member which can be released or re-released from the first adjustment member.
[0028] Furthermore, a preferred implementation of the device comprises a bond head which is displaceable to the substrate, the contact surface being configured and arranged to sustain a rotation about a first axis of movement.
[0029] In a preferred configuration of the device for mounting a device on a substrate, the bond head is further configured and arranged to be displaceable relative to the substrate along a third axis of motion, which is substantially perpendicular to the first axis of motion and substantially perpendicular to the second axis of motion.
[0030] In a preferred embodiment of the device for mounting a device on a substrate, the contact surface is further configured and arranged to be rotatable about a third axis of movement.
[0031] In a preferred configuration of the device for mounting a device on a substrate, the first engagement member is further configured and arranged to slide the bond head relative to the second adjustment member along the first movement axis or along the second movement axis or along a third movement axis, and the contact surface rotates about the third movement axis.
[0032] In a preferred embodiment of the device for mounting a device on a substrate, the bond head is further configured and arranged to maintain a rotation of the contact surface about the third axis of motion after release from the first adjustment member.
[0033] In a preferred configuration of the device for mounting a device on a substrate, the bond head is further configured and arranged to be displaceable relative to the substrate along a third axis of motion, which is substantially perpendicular to the first axis of motion and substantially perpendicular to the second axis of motion.
[0034] In a preferred configuration of an apparatus for mounting an apparatus on a substrate, the contact surface is further configured to be rotatable about a third axis of motion, the apparatus further comprises a second engaging member disposed on a bonding head and a second adjustment member in a second adjustment position, the second adjustment member being configured and arranged to rigidly engage the second engaging member, the bonding head being further displaceable to the second adjustment position, the second engaging member being rigidly engaged with the second adjustment member, and the bonding head being displaceable relative to the second adjustment member along the first axis of motion or along the second axis of motion or along the third axis of motion, the contact surface being rotatable about the third axis of motion, and the second engaging member being releasable from the second adjustment member, and the bonding head being further configured and arranged to maintain the rotation of the contact surface about the third axis of motion after being released from the second adjustment member. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] Further advantages and properties of a preferred method for mounting a device on a substrate and a preferred device for mounting a device on a substrate are shown in the following figures:
[0036] Figure 1 An embodiment of a device for mounting a component in the sense of the present invention is shown;
[0037] Figure 2 An example of a bond head configured and arranged to rotate about a second axis of motion is shown;
[0038] Figures 3A to 3D Shows the use of Figure 2 configuration and arrangement to mount the device on a substrate;
[0039] Figure 4A and 4B express Figure 2 A modified version of the embodiment shown in;
[0040] Figure 5 A method for mounting a component on a substrate in the sense of the invention is presented;
[0041] Figure 6 A further embodiment is shown which utilizes a rack and pinion combination as the engagement and adjustment member for tilt adjustment; and
[0042] Figure 7 Another version of the invention is shown with a rack and pinion combination as the engaging and adjusting member in two adjustment positions. DETAILED DESCRIPTION
[0043] Figure 1A preferred embodiment of an apparatus 100 for assembling a component 150 is shown in the form of an assembly apparatus 100 (such as a die bonder or assembly machine) as required for understanding the method 200 according to the present invention. The method 200 is used to mount an electronic or optical component 150 (not shown), in particular a semiconductor chip, on a substrate 160. The assembly apparatus 100 comprises a movable bonding head 110, to which a pick-up member 180 (such as a suction element or a clamping gripper) as a receiving element is attached. The assembly apparatus 100 also includes a substrate base 190 on which the substrate 160 rests and is held.
[0044] The assembly apparatus 100 is configured and arranged to displace the bond head 110 and / or the pick-up member 180 relative to the substrate 160 along a first axis of motion 170, which is represented here as a substantially vertical direction or Z-direction. Typically, the apparatus is configured and arranged such that the longitudinal axis 140 of the bond head 110 and / or the pick-up member 180 substantially coincides with the substantially vertical direction or Z-direction 170.
[0045] The assembly apparatus 100 is further configured and arranged such that the bond head 110 and / or the pickup member 180 can be displaced relative to the substrate 160 along a second motion axis 175 , shown here in a substantially horizontal direction or X direction. The second motion axis 175 is substantially perpendicular to the first motion axis 170 .
[0046] The assembly apparatus 100 is further configured and arranged so that the bond head 110 and / or the pick-up member 180 can be displaced relative to the substrate 160 along a third axis of motion 177, which is shown here in a substantially horizontal direction or Y direction. The third axis of motion 177 extends substantially perpendicular to the first axis of motion 170 and also substantially perpendicular to the second axis of motion 175. In the illustrated apparatus 100, an XY plane is spanned by the second axis of motion 175 and the third axis of motion 177.
[0047] The configuration of the apparatus 100 typically utilizes electrically and / or pneumatically driven axes of motion to provide relative motion, wherein the pick-up member 180 and / or substrate 160 are configured and arranged to move along one or more axes of motion 170, 175, 177. Since relative motion is desired, motion may be configured for the substrate base 190, the pick-up member 180, the contact surface 185, the bond head 110, the point at which the bond head 110 is mounted to the rest of the apparatus 100, or any combination thereof.
[0048] These axes of motion 170, 175, 177 can be composed of guides (not shown) and movable components (e.g., a slide that can move in the guides). The slide can be supported in different ways, for example, by air bearings or ball bearings. There can be a certain degree of elasticity between the guides and the movable slide, typically a little more elasticity in air bearings than in ball bearings. For each axis of motion, one or more guide slide combinations can be provided at different points in the device 100. Each axis of motion can also be composed of one or more drives (not shown) that are used to move the associated slide along the associated guide.
[0049] A relative displacement between the bond head 110 and the pick-up member 180 as a receiving element may also be provided in one or more axes of motion 170, 175, 177. Additionally or alternatively, the apparatus 100 may be configured to allow a relative rotation between the pick-up member 180 and the bond head 110 about its longitudinal axis 140. The bearing of the pick-up member 180 may be provided at the bond head 110 as an air bearing.
[0050] The pick-up member 180 consists of a contact surface 185 (not shown) for releasably or re-releasably attaching to the component 150 during positioning of the component on the substrate 160 at the substrate position 165 (not shown).
[0051] After the component 150 has been positioned (or placed) on the substrate 160, the contact area 185 is generally used to limit the movement of the device during one or more bonding operations. The force exerted by the contact surface 185 on the substrate 160 is generally referred to as the retention force. Typically, each step of the bonding process uses the same contact area 185, with each step using additional contact areas 185 depending on the type of bonding.
[0052] Since the bond head 110 and the pick-up member 180 are connected to each other and the pick-up member 180 includes the contact surface 185 , it is obvious to the skilled person that the position of the contact surface 185 can be derived from the position of the bond head 110 and / or the pick-up member 180 , or vice versa, using corresponding transformation rules.
[0053] Preferably, the component 150 is positioned substantially parallel to the substrate 160 at its corresponding substrate location 165. This means that the component 150 is preferably positioned in an XY plane that is substantially plane-parallel to the XY plane in which the substrate location 165 is located. Deviations from the plane-parallel condition are referred to as inclination or tilting or skewing - an inclined, skewing or tilted positioning of the component 150 may result in undesirable properties such as reduced retention and / or retention force, insufficient or lost electrical contact, irregular heat transfer between the component 150 and the substrate 160, or damage to the component 150. Shear forces may cause the component 150 to slide, which may result in positioning errors. In extreme cases, the component may not function properly, be defective, or have reduced reliability.
[0054] To achieve tilt adjustment, the device 100 is further configured and arranged so that the bond head 110 and / or the pick-up member 180 can be rotated relative to the substrate 160 about at least one horizontal axis, the second axis of motion 175 and / or the third axis of motion 177. Generally speaking, the highest degree of control is achieved through many degrees of motion and rotation (degrees of freedom), but this usually increases the complexity of the device 100.
[0055] With conventional placement machines, the tilt of contact surface 185 is adjusted manually by an operator - after a problem is detected (eg, component 150 and / or substrate 160 breakage), device operation is interrupted and the tilt is manually adjusted, for example, using an adjustment screw.
[0056] With appropriate control and / or measurement, such one or more rotation angles can be used to control the orientation of the contact surface 185 relative to the substrate 160 to minimize tilt errors. Each degree of rotation requires one or more drive members or actuators. In addition, a measurement system, such as one or more measuring instruments, may be required to ensure the required accuracy and control. Since relative motion is required, rotation can be configured for the substrate base 190, the pickup member 180, the bond head 110, the contact surface 185, the point at which the bond head 110 is attached to the rest of the device 100, or any combination thereof.
[0057] Such additional drives and measurement systems may increase the weight of the bond head 110 and / or the pick-up member 180, which may limit the maximum speed (usually measured in UPH (units per hour)) or require a more powerful drive to compensate for the increased inertia. As components are added, the size of the bond head 110 and / or the pick-up member 180 may also increase.
[0058] For example, US Pat. No. 8,387,851 B1 describes tilt adjustment using an active actuator mounted directly on the bond head. Figure 5 As shown in , the tilt adjustment is implemented using several actuators and encoders.
[0059] According to the present invention, improved tilt adjustment is provided in the apparatus 100, which allows automatic adjustment while minimizing the increase in weight and / or size of the bond head 110 and / or the pick-up member 180. In addition, the setup time can be shortened, which increases the operating time of the apparatus 100.
[0060] Figure 2 An example of a bond head 110 configured to rotate about a second axis of motion 175 is shown.
[0061] Figure 2 The left middle figure schematically shows the bond head 110 and the pick-up member 180 - the longitudinal axes 140 of the bond head and the pick-up member are also shown to illustrate possible relative rotations. The right side shows a coordinate system - the first axis of motion 170 (Z) is shown vertically and the third axis of motion 177 (Y) is shown horizontally. In this example, the bond head 110 is viewed along the second axis of motion 175 (X), i.e., the second axis of motion 175 (X) is toward the inside of the page (paper plane).
[0062] In this example, the bond head 110 is configured and arranged to rotate about a second axis of motion 175 (X)—in this example, the bond head 110 is pivotally connected to the remainder of the apparatus 100 via the bond head attachment 105 , thereby allowing rotation about the pivot 115 .
[0063] The device 100 further includes a first engagement member 120 and a first adjustment member 130 ( Figure 1 ), the first engagement member is attached to the bonding head 110, and the first adjustment member is located in a first adjustment position 132 (shown in FIG. 1 ) for rigidly engaging the first engagement member 120. Figure 1 ) as shown in the figure.
[0064] The first adjustment position 132 may be located anywhere that the bond head 110 can reach with available axes of motion or degrees of freedom.
[0065] The apparatus 100 is further configured and arranged such that the bond head 110 can be moved to a first adjustment position 132 , wherein the first engagement member 120 rigidly engages the first adjustment member 130 .
[0066] This means that when the bonding head 110 moves to the first adjustment position 132, the first engagement member 120 and the first adjustment member 130 are configured and arranged so that the first engagement member and the first adjustment member can be rigidly connected and disconnected. The first engagement member 120 and the first adjustment member 130 form a first pair of engagement members. The first engagement member and the first adjustment member can be designed as, for example, a rack and pinion pair, a spherical member and a sleeve, a hook and a guide, a bolt and a nut, a protrusion and a recess, a bolt and a hole pair, a north and south magnetic pole, or a protrusion and a clamping pair. More than one pair of engagement members can also be used.
[0067] Optionally, each pair of engagement members may be configured to use only mechanical principles.Such passive embodiments may avoid the additional weight and complexity caused by electrical or pneumatic supplies and / or drives.
[0068] The skilled person will appreciate that the members of the engagement pair may have their mechanical configurations interchanged without affecting the functionality of the pair. For example, a rack may be included as an engagement member in combination with a pinion as an adjustment member, or a rack may be included as an adjustment member in combination with a pinion as an engagement member.
[0069] A rigid bond means that the bond has sufficient rigidity and duration to perform the desired tilt adjustment and depends, among other things, on the mechanical configuration selected for the bonded pair, the selected tilt adjustment mechanism (see below), the desired adjustment speed, the desired adjustment accuracy and the quality of the bond head 110 .
[0070] Figure 2 The first engagement member 120 shown in FIG. 1 is a cylindrical pin selected to positively engage in a groove (not shown).
[0071] The device 100 is further configured and arranged so that during bonding, the bonding head 110 can be displaced along the first motion axis 170 relative to the first adjustment position, wherein the contact surface 185 rotates around the second motion axis 175; and after the first bonding member 120 is released from the first adjustment member 130, the bonding head 110 can be displaced to the substrate position 165 and the contact surface 185 is configured and arranged so that the rotation around the second motion axis 175 is maintained.
[0072] like Figure 2 As shown in the example in FIG. 1 , a tilt position block 117 is provided to maintain rotation about the second motion axis 175, ie, tilt adjustment about the second motion axis 175. The tilt position block 117 can also be considered to block unwanted tilt movement about the second motion axis 175.
[0073] Any standard motion lock may be used, such as friction brakes, hydraulic brakes, pneumatic brakes, threads, electromagnetic brakes, electric brakes, induction brakes, screwdrivers, magnetic brakes, or any combination thereof. Resilient members may also be used to create an appropriate preload.
[0074] Optionally, the tilt position block 117 can be configured to use only mechanical principles. Such a passive embodiment can avoid the additional weight and complexity caused by electrical or pneumatic supplies and / or drives.
[0075] exist Figure 2 In the example, the apparatus 100 is configured and arranged such that the bond head 110 can rotate about the pivot 115 (and about the second motion axis 175 ) when a corresponding force is applied to the tip (distal end) of the first engagement member 120 along the third motion axis 177 .
[0076] For the present invention, the inclination of the contact surface 185 is advantageously adjusted before the assembly 150 is mounted on the substrate 160 so that the inclination of the contact surface 185 is substantially equal to the inclination of the substrate 160 at the corresponding substrate position 165. Figure 2 The examples in show configurations and arrangements for controlling the tilt of the bond head 110 , but the tilt set and / or setting is selected to achieve the desired tilt of the contact surface 185 . Figure 2 A pick-up member 180 is shown attached to the end of the bond head 110 and working closest to the substrate 160. The pick-up member 180 consists of a contact surface 185 located at the end of the pick-up member 180 farthest from the bond head 110. Thus, the skilled person will recognize that the tilt value of the bond head 110 can be easily converted based on the known relevant dimensions of the device 100, and vice versa. Alternatively or additionally, such converted values can be measured with a suitable calibration procedure.
[0077] exist Figure 2 In the example of FIG. 1 , the tilt adjustment and the tilt stop are implemented in the bond head 110 , since in practice this provides sufficient space for further components and generally has sufficient mass to enable a robust and reliable implementation.
[0078] Alternatively or additionally, tilt adjustment and tilt locking may be provided in the pick-up member 180 or even in the contact surface 185. The use of multiple tilt adjustment and tilt locking functions is also provided, allowing for coarse and / or fine adjustment.
[0079] FIG. 3 shows a method 200 according to the present invention using Figure 2 The configuration and arrangement of the components to be assembled on the substrate. Possible steps of the procedure are also shown in Figure 5 middle.
[0080] Figure 3A Shown with Figure 2 3. The same view and the same coordinate system of the bond head 110 shown in FIG. 3 are not included in order to improve the clarity of FIG. Figure 2 The elements shown in are the same.
[0081] exist Figure 3B In the embodiment of the present invention, the bonding head 110 is moved 250 to the first adjustment position 132. At this time, the first bonding member 120 and the first adjustment member 130 are close together.
[0082] The first engagement member 120 then rigidly engages with the first adjustment member 130. The desired action depends on the configuration and arrangement of the first pair of engagement members 120, 130, etc. The apparatus 100 may be configured and arranged for rigid engagement 260 as a direct result of the bond head 110 being moved to the first adjustment position 132.
[0083] Alternatively or in addition, a series of movements along the available motion axes 170, 175, 177 can be made until the first pair of engagement members 120, 130 are close to each other. For example, the embodiment of FIG. 3 requires a pin in the first engagement member 120 to penetrate the groove in the adjustment member 130. As shown, both the pin 120 and the groove 130 extend into the plane of the paper along the second motion axis 175. Therefore, engagement can be made by moving the bond head 110 to the first adjustment position 132, which is defined so that the pin 120 is positioned just above the groove 130, thereby allowing freedom of movement along the first motion axis 170 and the third motion axis 177. The bond head 110 can then be moved into the paper along the second motion axis 175, thereby allowing the pin 120 to enter the groove 130. Therefore, a rigid engagement 260 can be achieved by appropriately selecting the mechanical tolerances of the pin 120 and the groove 130 and maintaining a fixed position along the second motion axis 175 when setting the tilt 270 (see below).
[0084] Additionally or alternatively, clamps may be used to ensure that the rigidity of the joint is sufficient.
[0085] The arrangement of the first pair of engagement members 120, 130 is a pin 120 in a groove 130 arranged at an angle of about 20 degrees relative to a first axis of motion 170 (Z) in the YZ plane. In this example, a third axis of motion 177 is defined as Y. Movement of the bond head 110 along the first axis of motion 170 provides a force along the third axis of motion 177 on the first engagement member 120. As shown, upward movement 170 provides a force to the left 177, and downward movement 170 provides a force to the right 177. Grooves with larger angles (e.g., between 30 and 60 degrees) may also be used.
[0086] The apparatus 100 is configured and arranged such that a force on the first engagement member 120 along the third axis of motion 177 causes the bond head 110 to rotate about the pivot 115 (about the second axis of motion 175 ).
[0087] The apparatus 100 is configured and arranged such that rotation of the bond head 110 about the pivot 115 (about the second axis of motion 175 ) causes rotation (or tilting) of the contact surface 185 about the second axis of motion 175 .
[0088] Advantageously, the invention provides for tilting of the contact surface 185 using already existing drives and actuators for displacement of the bond head along the movement axis 170, 175, 177. No additional drives and / or actuators are required for this tilting.
[0089] Figure 3C The bond head 110 is shown being rotated counterclockwise about the second axis of motion 175 by moving the bond head 110 upward 270 along the first axis of motion 170 .
[0090] The first engagement member 120 is then decoupled from the first adjustment member 130. The tilt (rotation about the second axis of motion 175) is maintained by the tilt position block 117. If a friction brake providing sufficient friction is used, the bond head 110 can be adjusted to any tilt value in the tilt mechanism by simply applying an appropriate force on the first engagement member 120 - no further action is required to block the tilt. If the tilt position block 117 provides multiple degrees of blocking, it may be advantageous to provide less blocking during rotation of the bond head 110 and to provide more blocking before releasing the first engagement member 120 and the first adjustment member 130. Alternatively or in addition, the tilt position block 117 can be configured and arranged to have a higher degree of blocking during each movement of the bond head 110 after release 280.
[0091] After release 280, the bond head 110 moves to a corresponding substrate position 165 on the substrate 160. Figure 3D , the bond head 110 maintains a rotation about the second axis of movement 175 and thus maintains a tilt of the contact surface 185 about the second axis of movement 175. The bond head 110 reaches the corresponding substrate position 165 when the contact surface 185 is directly above the position on the substrate to which the corresponding component 150 is to be mounted. Depending on the tilt setting, the expected position can therefore be corrected.
[0092] like Figure 3D As shown in FIG. 1 , the component 150 is attached to the contact surface 185 , wherein a tilting of the component about the second axis of movement 175 substantially corresponds to a tilting 160 of the substrate about the second axis of movement 175 .
[0093] In the tilt adjustment ( Figure 3B and Figure 3C ) there is no need to pick up component 150 - when component 150 is attached to contact surface 185, device 100 can be configured to perform a tilt adjustment.
[0094] Many variations of this embodiment are possible if both aspects are implemented - the device 100 is configured in such a way that
[0095] The displacement along at least one axis of movement 170 , 175 , 177 results in a tilting of the contact surface 185 ; and
[0096] The desired tilt is maintained when the component 150 is mounted on the substrate 160 .
[0097] The above describes the use of movement of the bond head 110 along the first axis of motion 170 (denoted as Z or substantially vertical) to rotate the second axis of motion 175 (denoted as X or substantially horizontal).
[0098] The invention is based on the knowledge that tilt correction is possible with existing drives and / or actuators that allow movement along at least one of these axes of motion 170, 175, 177. In general, the device 100 may be configured and arranged to use movement along one axis of motion to allow rotation about another axis of motion, wherein the axes are substantially perpendicular to each other:
[0099]
[0100] Therefore, when interpreting a "first", "second" and "third" axis of motion, all combinations of axes that are substantially perpendicular to each other fall within the scope of protection of the present claims and not just the examples labeled X, Y and Z in the description.
[0101] In particular, the axes of movement X and Y may be functionally interchanged.
[0102] According to the present invention, the device 100 may also be configured and arranged to provide more than one tilt.
[0103] FIG. 4 shows another version of the present invention, which is Figure 2 A modified version of the embodiment depicted in .
[0104] Figure 4AThe left figure schematically shows the bond head 110 and the pick-up member 180. The right side shows the coordinate system - the first axis of motion 170 (Z) is shown vertically and the third axis of motion 177 (Y) is shown horizontally. In this example, the bond head 110 is a view along the second axis of motion 175 (X), that is, the second axis of motion 175 (X) is facing into the page. From this perspective, the device 100 and the bond head 110 are as shown in FIG. Figure 2 . The rotatability about the pivot 115 and thus about the second axis of movement 175 is the same. The differences are:
[0105] Another bonding head attachment 106 and Figure 2 The bond head attachment shown in FIG. 1 is modified—here, the bond head 110 can also be moved about a third axis of motion (see below). Figure 4B ) rotates; and
[0106] The second engagement member 122 and Figure 2 The second engagement member 122 is modified to achieve a rigid engagement that allows rotation about two axes. In this simple example, the second engagement member 122 consists of a spherical piece (or a part of a spherical shape) at its distal end.
[0107] The associated third adjustment member 131 is disposed at the first adjustment position 132 and may be, for example, a sleeve, a depression or a groove of appropriate size. A sleeve is shown here, which is arranged along the third axis of motion 177. The rigid engagement may be achieved by moving the key head 110 to the first adjustment position 132 so that the ball is aligned along the first axis of motion 170 and the second axis of motion 175 at the distal end of the second engagement member 122 and then displaced along the third axis of motion 177, thereby allowing rotation about the pivot 115 and thus allowing rotation (tilting) of the contact surface 185 about the second axis 175.
[0108] Figure 4BThe left-center figure schematically shows the bond head 110 and the pick-up member 180. The right side shows a coordinate system - the first axis of motion 170 (Z) is shown vertically and the second axis of motion 175 (X) is shown horizontally. In this example, the bond head 110 is viewed along a third axis of motion 177 (Y) - in other words, the third axis of motion 177 (X) is facing out of the page (paper plane). In this example, the bond head 110 is also configured and arranged to rotate about the third axis of motion 177 (Y) - the bond head 110 is pivotally connected to the rest of the device 100 via an additional bond head attachment 106, which also facilitates rotation about an additional pivot 116 and about the third axis of motion 177. Another additional bond head attachment 106 is installed between the remaining part of the device 100. The additional tilt position block 118 is provided to maintain the rotation about the third movement axis 177 - i.e. the tilt adjustment about the third movement axis 177. The additional tilt position block 118 can also be considered to block an undesired tilt movement about the third movement axis 177. Optionally, the additional tilt position block 118 can also be configured to use only mechanical principles (passive version). The associated third adjustment member 131 in the first adjustment position 132 is shown in the third movement axis 177 - the sleeve 131 is not visible here and is therefore marked with a dotted line. Rigid engagement with Figure 4A The process is performed in the same manner as in the embodiment of the present invention - moving the keying head 110 so that the spherical member 122 is aligned along the first movement axis 170 and the second movement axis 175, and then moving along the third movement axis 177, and the subsequent movement along the second movement axis 175 at a substantially unchanged position along the first movement axis 170 and the third movement axis 177 facilitates rotation about the further pivot 116 and thereby facilitates rotation (tilting) of the contact surface 185 about the third movement axis 177.
[0109] In summary, in the example of FIG. 4 , the apparatus 100 is configured and arranged such that the bond head 110 can:
[0110] When a corresponding force is applied to the tip (distal end) of the additional engagement member 121 along the third movement axis 177, the additional engagement member 121 rotates about the pivot 115 (and about the second movement axis 175); and
[0111] When a corresponding force is exerted on the tip (distal end) of the further engagement member 121 along the second axis of movement 175 , a rotation takes place about the further pivot 116 (and about the third axis of movement 177 ).
[0112] An advantage is that the assembly 150 for the mounting process is preferably parallel to the substrate 160 at the substrate position 165 - the required tilting of the two axes of motion reduces the risk of tilting problems interrupting the operation of the device 100.
[0113] It will be apparent to the skilled person that different configurations and movements may be used to ensure the same rotation.
[0114] exist Figure 4A In the embodiment, for example, after latching to the sleeve 131 along the third axis of motion 177, movement of the key head 110 causes the contact surface 185 to rotate about the second axis of motion 175. In the illustrated configuration, movement from the sleeve 131 along the third axis of motion 177 may cause release. However, by providing different types of mesh pairs, such as a pinion and rack arranged in two directions, these may also be provided.
[0115] A single engagement member may also be used with more than one adjustment member at each of more than one engagement position. For example, in the case of a spherical engagement member, additional sleeves may be provided at additional adjustment positions.
[0116] If the bond head 110 moves between these latch positions (for Figure 4A and 4B If the rigid engagement cannot be maintained due to the adjustment position not being considered different, the adjusted position is considered different. The device 100 can be configured to provide: rotation about the same axis of motion, different degrees of rotation about the same axis of motion, rotation about different axes of motion, different directions of rotation about the same axis of motion, and any combination thereof at these different positions.
[0117] A single adjustment member can also be used with more than one engagement member at each of more than one adjustment positions. If, for example, the bond head 110 is equipped with two spherical engagement members, a sleeve can be provided in the device 100. Since a rigid engagement is not possible, the present invention has two adjustment positions because the bond head 110 moves between two adjustment positions. The device 100 can be configured so that it is in these different positions: rotation around the same axis of motion, different degrees of rotation around the same axis of motion, rotation around different axes of motion, different directions of rotation around the same axis of motion, and any combination thereof.
[0118] One or more engagement members may also be used in conjunction with one or more adjustment members, thereby providing increased flexibility.
[0119] Figure 5 An overview of a method 200 for mounting a component on a substrate according to the present invention is given.
[0120] Programs can include:
[0121] - providing 210 a bond head 110 , which is displaceable relative to the substrate 160 along a first movement axis 170 and a second movement axis 175 , the second movement axis 175 being substantially perpendicular to the first movement axis 170 ;
[0122] providing 220 a pick-up member 180 as a receiving element, the pick-up member having a contact surface 185, the pick-up member 180 being attached to the bond head 110, the contact surface 185 being configured and arranged to be releasably attached to or releasable to the component 150 and being further configured and arranged to be rotatable about the second movement axis 175;
[0123] - providing 230 a first bonding member 120 , which is attached to the bonding head 110 ;
[0124] - providing 240 the first adjustment member 130 in a first adjustment position 132 for rigid engagement with the first engagement member 120;
[0125] - moving 250 the bonding head 110 to the first adjustment position 132;
[0126] - rigidly engaging 260 the first engagement member 120 with the first adjustment member 130 ;
[0127] - moving 270 the bond head 110 relative to the first adjustment member 130 along the first movement axis 170 , wherein the contact surface 185 is rotated about the second movement axis 175 ;
[0128] - releasing 280 the first engagement member 120 from the first adjustment member 130 ; and
[0129] The bond head 110 is moved 290 to the substrate position 165 , wherein the bond head 110 maintains 203 a rotation of the contact surface 185 about the second axis of movement 175 .
[0130] Figure 6 An alternative tilt adjustment embodiment of a pair of rack and pinion engagement members that can be used with any of the embodiments of the present invention is shown. The keying head 110 is arranged to rotate about the second axis of motion 175, similar to Figure 2 .
[0131] Figure 6 The middle left figure schematically shows the bond head 110 and the pick-up member 180. The right side shows the coordinate system - the first motion axis 170 (Z) is shown vertically and the third motion axis 177 (Y) is shown horizontally. In this example, the bond head 110 is a view along the second motion axis 175 (X), that is, the second motion axis 175 (X) is toward the inside of the page.
[0132] The bond head 110 is attached to the rest of the device 100 by means of a bond head attachment 105 so that it can rotate about a pivot 115 .
[0133] The further engagement member 121 consists of a pinion arranged at the distal end. Internally, a conventional spindle screw drive (not shown) is attached to the pinion 121 so that the rotation of the pinion causes the rotation of the spindle screw drive. The spindle screw drive is also attached to the keying head 110 in such a way that the rotation of the spindle screw drive promotes the rotation of the keying head 110 around the pivot axis 115 and around the second axis of motion. This causes the rotation (tilting) of the contact surface 185 around the second axis of motion 175. The tilt adjustment mechanism is further composed of an elastic member 119 mounted between the keying head 110 and the keying head attachment 105. This provides a corresponding preload so that the keying head 110 is preloaded on the alternative mechanism spindle screw drive for blocking the tilted position. In this example, the rotation around the second axis of motion 175 is locked.
[0134] A further adjustment member provided in the first adjustment position 132 is a rack 133 which is configured and arranged to interact with the pinion 121 so that a rotation of the pinion 121 can be achieved. In this example, the rack 133 extends along a first axis of movement 170 .
[0135] Engagement can be accomplished by moving the key head 110 to the first adjustment position 132 such that the pinion 121 is aligned distally along the first axis of motion 170, the second axis of motion 175, and the third axis of motion 177 so that the pinion 121 and the rack 133 are brought close together. The displacement along the second axis of motion 175 to the rack 133 ensures a rigid engagement. Subsequent movement along the first axis of motion 170 at a substantially unchanged position along the second axis of motion 175 and the third axis of motion 177 causes rotation of the pinion 121, thereby causing rotation of the spindle screw drive (not shown) and rotation of the key head 110 about the pivot 115. Rotation (tilting) of the contact surface 185 about the second axis of motion 175 is thus also provided.
[0136] The available rotational range depends on the engagement position of the pinion 121 in the first axis of motion 170. If the approach is insufficient because the pinion reaches the end of the rack 133, the pinion 121 may release, move to the other end of the rack 133 and engage rigidly again.
[0137] The rotation (tilting) of the contact surface 185 about the second axis of motion 175 is maintained by preloading the bond head 110 on the spindle screw drive by means of the resilient member 119 .
[0138] Suitable elastic members 119 may be, for example, springs, rubber bands, elastic bands.
[0139] Although the rack 133 extends along the first axis of motion 170 in this example, it will be apparent to the skilled person that the apparatus 100 may be configured to allow the pinion 121 to rotate with the rack 133 extending along the second axis of motion 175 .
[0140] Figure 7 A further embodiment of the present invention is shown. A bonding head 110 is provided which can rotate about a second axis of motion 175 and about a third axis of motion 177. A tilt adjustment and holding mechanism and Figure 6 Same as shown in .
[0141] The keying head consists of two pinions 121 a , 121 b —one pinion 121 a is configured and arranged so as to rotate about a second axis of motion 175 , and the other pinion 121 b is configured and arranged so as to rotate about a third axis of motion 177 .
[0142] The device 100 is configured and arranged to provide two racks 133a , 133b —one rack 133a being in a first adjustment position 132 and the other rack 133b being in a second adjustment position 137 .
[0143] The positive engagement in the first adjustment position 132 is achieved by moving the key head 110 to the first adjustment position 132 such that the pinion is aligned at the distal end of the pinion 121a along the first movement axis 170, the second movement axis 175 and the third movement axis 177 so that the pinion 121a and the rack 133a are brought together. The displacement along the first movement axis 170 to the rack 133a ensures the positive engagement. The subsequent movement along the second movement axis 175 at a substantially unchanged position along the first movement axis 170 and the third movement axis 177 causes a rotation of the pinion 121a, thereby causing a rotation of the spindle screw drive (not shown) and a rotation of the key head 110 about the second movement axis 175. A rotation (tilting) of the contact surface 185 (not shown) about the second movement axis 175 is thus also provided.
[0144] The positive engagement in the second adjustment position 137 is achieved by moving the key head 110 to the second adjustment position 137 (as depicted) such that the pinion is aligned along the first motion axis 170, the second motion axis 175 and the third motion axis 177 at the distal end of the pinion 121b so that the pinion 121b and the rack 133b are brought together. The displacement along the first motion axis 170 to the rack 133b ensures the positive engagement. The subsequent movement along the third motion axis 177 at a substantially unchanged position along the first motion axis 170 and the second motion axis 175 causes a rotation of the pinion 121b, thereby causing a rotation of the spindle screw drive (not shown) and a rotation of the key head 110 about the third motion axis 177. A rotation (tilting) of the contact surface 185 (not shown) about the third motion axis 177 is thus also provided.
[0145] The rack 133a in the first adjustment position 132 extends along the second movement axis 175. The rack 133b in the second adjustment position 137 extends along the third movement axis 177. Figure 6 As mentioned above, different orientations of each rack 133a, 133b may be used.
[0146] In another aspect of the invention, the device 100 may be configured and arranged to use motion along an axis of motion to allow rotation (tilt) about the same axis of motion:
[0147]
[0148] exist Figure 7 In the configuration shown in FIG. 1 , the apparatus 100 is further configured such that the bond head 110 can be moved between a first 132 adjustment position and a second 137 adjustment position by moving substantially along a first axis of motion 170. Since both rotations must be adjusted to achieve a high plane parallelism between the assembly 150 and the substrate, the time for tilt adjustment can be reduced when the adjustment positions are close together. Limiting the movement to one axis of motion can further reduce the time required. Further reductions can also be achieved by ensuring that the release direction of one adjustment position substantially corresponds to the engagement direction of another adjustment position.
[0149] In general, two types of tilt errors may occur - static tilt due to mechanical and angular tolerances in the apparatus 100 and (specifically) in the bond head 110, the pick-up member 180 and the contact surface 185. Other causes of tilt errors are dynamic factors such as thermal expansion and wear of mechanical parts. With conventional equipment, the tilt can only be checked after one hundred to five hundred substrates 160. The present invention provides a relatively inexpensive and relatively fast adjustment option, so that the tilt can be checked and adjusted after each substrate or during operation on a substrate.
[0150] Additionally, it may be advantageous to provide a measuring and / or monitoring mechanism for one or more of the contact surface 185 slopes, as this would allow for some automatic monitoring.
[0151] A high degree of automation can be provided by providing a processor that is configured and arranged to determine the extent of displacement along the first axis of motion 170 to obtain a desired rotation about the second axis of motion 175 and / or the third axis of motion 177; and by further configuring and arranging the processor to stop the displacement along the first axis 170 when the desired inclination of the contact surface 185 is reached.
[0152] It may also be beneficial to provide a tilt sensor configured and arranged to measure the tilt of the substrate 160, and to provide a processor (or further configure an existing processor) to determine the extent of displacement along the first axis 170 to use the measured tilt of the substrate to obtain the desired rotation about the second axis of motion 175 and / or the third axis of motion 177. A high degree of accuracy and reliability may be achieved by monitoring the tilt of the substrate 160.
[0153] Additionally or alternatively, measurement of one or more forces on contact surface 185 during operation, particularly during assembly of component 150 on substrate 160, may provide information regarding any tilting issues that may occur.
[0154] Additionally or alternatively, the temperature of the component 150 and / or substrate 160 and / or contact area 185 may be measured and / or monitored. By providing a processor (or further configuring an existing processor) to determine the extent of displacement along the first axis 170 to use the measured temperature to achieve a desired rotation about the second axis of motion 175 and / or the third axis of motion 177, a high degree of compensation for dynamic tilt errors occurring during operation may be achieved.
[0155] In summary, it can be said that the present invention relates to an apparatus and a method for mounting a component on a substrate. Since the component is not provided for mounting parallel to the substrate, the process is often interrupted during operation. In some cases this may lead to cracking of the component and the substrate. The tilt control solution will increase the cost, weight and complexity of the bond head 110.
[0156] By using existing drive members and / or actuators to tilt contact surfaces 185, a simplified tilt correction providing high throughput and high reliability can be achieved. The tilt correction mechanism consists of one or more engagement members 120, one or more adjustment members 130, and one or more tilt position blocks 117. In some cases, passive components and mechanisms can be used.
[0157] Reference numerals list
[0158]
[0159]
[0160]
Claims
1. A method (200) of mounting a component (150) on a substrate (160) on a substrate support (190), the substrate being disposed at a substrate position (165), the method comprising: ● providing a bonding head (110) displaceable relative to the substrate (160) along a first axis of motion (170) and a second axis of motion (175), the second axis of motion (175) being substantially perpendicular to the first axis of motion (170); providing a pick-up member (180) having a contact surface (185), wherein the pick-up member (180) is disposed on the bond head (110), and wherein the contact surface (185) is configured and arranged to be releasably attachable to the component (150), and wherein the contact surface (185) is further configured and arranged to be rotatable about the second axis of motion (175); ● providing a first engagement member (120, 121, 121a, 122), the first engagement member being disposed on the bond head (110) and being configured and arranged to apply a force to the bond head (110) along a third motion axis (177) so that the contact surface (185) rotates about the second motion axis (175), the third motion axis (177) being substantially perpendicular to the first motion axis (170) and substantially perpendicular to the second motion axis (175); • providing a first adjustment member (130, 131, 133, 133a) in a first adjustment position (132) for rigid engagement with the first engagement member (120, 121, 121a, 122); ● moving (250) the bonding head (110) to the first adjustment position (132); • rigidly engaging (260) the first engaging member (120, 121, 121a, 122) with the first adjusting member (130, 131, 133, 133a); Displacing (270) the bonding head (110) along the first movement axis (170) relative to the first adjustment member (130, 131, 133, 133a), thereby applying a force along the third movement axis (177) to rotate the contact surface (185) about the second movement axis (175); • releasing (280) the first engagement member (120, 121, 121a, 122) from the first adjustment member (130, 131, 133, 133a); and • Displacing (290) the bond head (110) towards the substrate position (165), the bond head (110) maintaining (203) the rotation of the contact surface (185) about the second axis of motion (175).
2. The method according to claim 1, further comprising: ● configuring and arranging the bonding head (110) to be displaceable relative to the substrate (160) along the third axis of motion (177); The contact surface (185) is configured and arranged to be rotatable about the third axis of motion (177); ● providing a second engagement member (121b) disposed on the bond head (110) and configured and arranged to apply a force to the bond head (110) along the second axis of motion (175) so that the contact surface (185) rotates about the third axis of motion (177); • providing a second adjustment member (133b), the second adjustment member being in a second adjustment position (137), the second adjustment member (133b) being configured and arranged to rigidly engage the second engagement member (121b); ● moving the bonding head (110) into the second adjustment position (137); ● rigidly engaging the second engaging member (121b) with the second adjusting member (133b); Displacing (270) the bonding head (110) along the first movement axis (170) relative to the second adjustment member (133b), thereby applying a force along the second movement axis (175) to rotate the contact surface (185) about the third movement axis (177); ● releasing the second engagement member (121b) from the second adjustment member (133b); as well as • Shifting (290) the bond head (110) to the substrate position (165), the bond head (110) maintaining rotation of the contact surface (185) about a third axis of motion (177).
3. The method according to claim 1 or 2, wherein the bonding head (110) is configured and arranged to maintain (203) the rotation of the contact surface (185) using elastic members (119), magnetic members, electrical members, vacuum members, air-driven members, friction members, hydraulic members, inductive members or any combination thereof.
4. The method according to claim 1 or 2, further comprising: • providing a tilt sensor configured and arranged to measure a rotation of the contact surface (185) about the first axis of motion (170) and / or the second axis of motion (175) and / or the third axis of motion (177); ● providing a processor configured and arranged to determine the extent of displacement along the first axis of motion (170) to obtain a desired rotation about the first axis of motion (170) and / or the second axis of motion (175) and / or the third axis of motion (177); and The processor is further configured and arranged to stop displacement along the first axis of movement (170) when a desired tilt of the contact surface (185) is reached.
5. The method according to claim 1 or 2, further comprising: • providing a tilt sensor configured and arranged to measure the tilt of the substrate (160); as well as ●Providing a processor configured and arranged to use the measured tilt of the substrate (160) to determine the extent of displacement along the first motion axis (170) to obtain a desired rotation around the first motion axis (170) and / or the second motion axis (175) and / or the third motion axis (177).
6. The method according to claim 1 or 2, further comprising: ● providing a temperature sensor and providing a tilt sensor, the temperature sensor being configured and arranged to measure the temperature and / or relative temperature of the bond head support carrier (101) and / or the bond head mount (102) and / or the bond head (110) and / or the tilt sensor and / or the contact surface (185), the tilt sensor being configured and arranged to measure the rotation of the contact surface (185) around the first movement axis (170) and / or the second movement axis (175) and / or the third movement axis (177); as well as ● Providing a processor configured and arranged to use the measured temperature of the contact surface (185) to determine the extent of displacement along the first motion axis (170) to obtain a desired rotation around the first motion axis (170) and / or the second motion axis (175) and / or the third motion axis (177).
7. The method according to claim 1 or 2, further comprising: • providing a temperature sensor configured and arranged to measure the temperature and / or relative temperature of the substrate (160) and / or the substrate pedestal, and ● Providing a processor configured and arranged to use the measured temperature of the substrate (160) to determine the extent of displacement along the first motion axis (170) to obtain a desired rotation around the first motion axis (170) and / or the second motion axis (175) and / or the third motion axis (177).
8. The method according to claim 1 or 2, further comprising a method of controlling the rotation of a contact surface (185) of a pickup member (180), the method comprising: ● measuring a tilt and / or rotation of the bond head (110) relative to the substrate (160) and / or relative to the contact surface (185) and / or a tilt and / or rotation of the mounted component (150) relative to the substrate (160), wherein at least the position of the bond head can be detected optically by means of reference marks; ● determining a compensation degree for the first compensation and the second compensation for the tilt and / or rotation according to the measurement results; ● moving the bonding head (110) to a first position to be compensated with the compensation degree; ● rigidly engaging (260) the first engaging member (120) and the first adjusting member (130); ● applying said first compensation; ● moving the bonding head (110) to a second position to be compensated with the compensation degree; ● rigidly engaging the second engagement member (122) with the first adjustment member (130); ● applying the second compensation; Reference marks are used therein to determine the first and second compensation degrees.
9. The method according to claim 3, wherein the elastic member (119) is a spring member.
10. The method of claim 3, wherein the magnetic member is an electromagnetic member.
11. A device (100) for mounting a component (150) on a substrate (160), the substrate being arranged on a substrate position (165), the device comprising: a bonding head (110) which is displaceable relative to the substrate (160) along a first axis of motion (170) and a second axis of motion (175), the second axis of motion (175) being substantially perpendicular to the first axis of motion (170); a pick-up member (180) having a contact surface (185), the pick-up member (180) being disposed on the bond head (110), the contact surface (185) being configured and arranged to be releasably attachable to the component (150), and the contact surface (185) being further configured and arranged to be rotatable about the second axis of motion (175); a first engagement member (121, 121a) disposed on the bonding head (110) and configured and arranged to apply a force to the bonding head (110) along a third motion axis (177) so that the contact surface (185) rotates about the second motion axis (175), the third motion axis (177) being substantially perpendicular to the first motion axis (170) and substantially perpendicular to the second motion axis (175); A first adjustment member (133, 133a), the first adjustment member being in a first adjustment position (132) for rigidly engaging with the first engagement member (121, 121a); Further thereto: The bonding head (110) is displaceable into the first adjustment position (132), wherein the first engagement member (121, 121a) is rigidly engaged with the first adjustment member (133, 133a); During engagement, the bond head (110) is displaceable relative to the first adjustment member (133, 133a) along the first movement axis (170), thereby applying a force along the third movement axis (177) to rotate the contact surface (185) about the second movement axis (175); The first engagement member (121, 121a) is capable of or can be repeatedly disengaged from the first adjustment member (133, 133a); and The bond head (110) is displaceable towards the substrate position (165), the contact surface (185) being configured and arranged to maintain (203) a rotation about the second axis of movement (175).
12. The apparatus of claim 11, wherein: The bonding head (110) is further configured and arranged to be displaceable relative to the substrate (160) along the third axis of motion (177); The contact surface (185) is further arranged to be rotatable about the third axis of motion (177); The device (100) further comprises: a second engagement member (121b) disposed on the bond head (110) and configured and arranged to apply a force to the bond head (110) along the second movement axis (175) so that the contact surface (185) rotates about the third movement axis (177); A second adjustment member (133b), the second adjustment member being in a second adjustment position (137), the second adjustment member (133b) being configured and arranged to rigidly engage the second engagement member (121b); Further thereto: The bonding head (110) is displaceable into the second adjustment position (137), the second engagement member (122) being rigidly engaged with the second adjustment member (133b); The bonding head (110) is displaceable relative to the second adjustment member (133b) along the first movement axis (170), thereby applying a force along the second movement axis (175) to rotate the contact surface (185) about the third movement axis (177); The second engagement member (122) is releasable or re-releasable from the second adjustment member (133b); and The bond head (110) is further configured and arranged to maintain (203) rotation of the contact surface (185) about the third axis of motion (177) after release from the second adjustment member (133b).