Detection device and method

Abstract

The present invention relates to detection devices and methods. A method for manufacturing a detector for sensing, detecting, and monitoring environmental hazards and conditions, the method comprising: printing an electronic circuit on at least a first side of a printable flexible substrate; coupling at least two electronic components to the electronic circuit on the at least a first side of the printable flexible substrate; thermoforming the printable flexible substrate to form at least one detection zone from: (i) at least one side of the printable flexible substrate having an angle for emitting one of light or a signal from the at least two electronic components; and (ii) at least one side of the printable flexible substrate having an angle for receiving one of light or a signal by the at least two electronic components; and encapsulating the printable flexible substrate, thereby forming the detector.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of U.S. Provisional Application No. 62 / 968234, filed on January 31, 2020, the contents of which are hereby incorporated in their entirety. Technical Field

[0003] This disclosure relates to a method for manufacturing a detection device, and more particularly to a detector using electronic circuitry in a mold and an additive manufacturing method. This disclosure further relates to a detector for sensing, detecting, and monitoring hazardous and environmental conditions. Background Technology

[0004] Detectors are used to sense, detect, and monitor a variety of hazards and conditions, such as smoke, fire, particulate matter (e.g., microbial particles including mold or pollen), air quality, and the presence of gases or volatile organic compounds (VOCs). These detectors typically include: a printed circuit board; various component parts, including optical devices (e.g., photodiode sensors and light-emitting diodes (LEDs)); and a housing, which typically consists of two or more parts. Assembling conventional detectors requires human intervention (such as selecting and positioning parts, testing, or other processing), all of which can increase manufacturing costs and reduce production efficiency.

[0005] Additionally, conventional detectors typically have a arguably "tall" profile, meaning they protrude noticeably from the ceiling into the occupied space (such as a home or office). In some cases, a tall detector may be less aesthetically pleasing compared to detectors with a low or no profile. In other cases, "tall" detectors may be unsuitable for use in small spaces (such as duct systems) because they can obstruct airflow.

[0006] What is needed is a method for manufacturing detectors that reduces human intervention by replacing multiple parts with a single part or by combining multiple parts into a single or fewer parts, has a reduced profile for greater aesthetic appeal, and / or requires a detector device that is useful in small spaces without obstructing airflow. Summary of the Invention

[0007] According to another non-limiting embodiment, a method for manufacturing a detector, the method comprising: printing an electronic circuit on at least a first side of a printable flexible substrate; coupling at least two electronic components to the electronic circuit on the at least a first side of the printable flexible substrate; thermoforming the printable flexible substrate to form at least one detection zone from: (i) at least one side of the printable flexible substrate having an angle for emitting one of light or a signal from the at least two electronic components; and (ii) at least one side of the printable flexible substrate having an angle for receiving one of light or a signal by the at least two electronic components; encapsulating the printable flexible substrate, thereby forming the detector.

[0008] In addition to one or more of the features described above, or as an alternative, in further embodiments the method includes: stacking an additional layer on the at least a first side of the printable flexible substrate having the printed electronic circuit; thermoforming the additional layer and the printable flexible substrate.

[0009] In addition to one or more of the features described above, or as an alternative, in further embodiments the method includes depositing a coating on at least one of the printed electronic circuit and the detector device.

[0010] In addition to one or more of the features described above, or as an alternative, in further embodiments the method, wherein the at least one electronic component for emitting light is a light emitting diode, and the at least one electronic component for receiving light is a photodiode.

[0011] In addition to one or more of the features described above, or as an alternative, in further embodiments the method, wherein the additional layer is a polymer film.

[0012] In addition to one or more of the features described above, or as an alternative, in further embodiments the method, wherein the additional layer is a polycarbonate film.

[0013] In addition to one or more of the features described above, or as an alternative, in further embodiments the method, wherein the printable flexible substrate is fully or partially encapsulated.

[0014] In addition to one or more of the features described above, or as an alternative, in further embodiments the method, wherein the printable flexible substrate is encapsulated by one or more of thermoforming, injection molding, additive printing.

[0015] In addition to one or more of the features described above, or as an alternative, in further embodiments the method, wherein the emission angle is 180 degrees or less.

[0016] In addition to one or more of the features described above, or as an alternative, in further embodiments the method wherein the receiving angle is 180 degrees or less.

[0017] In addition to one or more of the features described above, or as an alternative, in further embodiments the method wherein the mold has at least one cavity for receiving the electronic component, wherein the electronic component emits or receives light or signals at an angle of 180 degrees or less.

[0018] In addition to one or more of the features described above, or as an alternative, in further embodiments the method further comprising the printable flexible substrate has a light guide for: (i) directing emitted light or signals from the at least one electronic component to a detectable space; and (ii) receiving light signals by the at least one electronic component.

[0019] According to another non-limiting embodiment, a detector system comprising: an electronic circuit printed on a printable flexible substrate, wherein the electronic circuit is conformal to a shape forming at least one detection zone; a detector body, wherein the conformal electronic circuit is encapsulated, thereby forming a detector.

[0020] In addition to one or more of the features described above, or as an alternative, in further embodiments the system wherein the electronic circuit is conformal to the shape for forming the at least one detection zone by a thermoforming process.

[0021] In addition to one or more of the features described above, or as an alternative, in further embodiments the system wherein the conformal electronic circuit is fully or partially encapsulated during a manufacturing process.

[0022] In addition to one or more of the features described above, or as an alternative, in further embodiments the system wherein the manufacturing process is at least one of an additive printing, a multi-shot, or an insert injection molding process.

[0023] According to another non-limiting embodiment, a detector device comprising: an electronic circuit printed on a printable flexible substrate; wherein: (i) at least one electronic component of the electronic circuit is conformal to an angle for emitting light; and (ii) at least one electronic component of the electronic circuit is conformal to an angle for receiving reflected light; a detector body component formed integral with the conformal electronic circuit.

[0024] In addition to one or more of the features described above, or as an alternative, in further embodiments the detector device further comprising depositing a coating on at least one of the conformal electronic circuit and the detector device.

[0025] In addition to one or more of the features described above, or as an alternative. In further embodiments, the detector device, wherein the at least one electronic component is a light emitting diode.

[0026] In addition to one or more of the features described above, or as an alternative. In further embodiments, the detector device, wherein the at least one electronic component is a photodiode.

[0027] In addition to one or more of the features described above, or as an alternative. In further embodiments, the detector device, wherein an angle of the electronic component for emitting light is 180 degrees or less.

[0028] In addition to one or more of the features described above, or as an alternative. In further embodiments, the detector device, wherein an angle of the electronic component for receiving reflected light is 180 degrees or less. BRIEF DESCRIPTION OF DRAWINGS

[0029] The accompanying drawings form part of the specification. Together with the present specification, the drawings illustrate aspects of the present disclosure.

[0030] Figure 1 Perspective view of a portion of a detector according to embodiments of the present disclosure.

[0031] Figure 2 Perspective view of a portion of a detector according to embodiments of the present disclosure.

[0032] Figure 3 Side view of a portion of a detector according to embodiments of the present disclosure.

[0033] Figure 4A Side view of a portion of a detector according to embodiments of the present disclosure.

[0034] Figure 4B Top side view of a portion of a detector according to embodiments of the present disclosure.

[0035] Figure 5 Flowchart illustrating a method for manufacturing a detector according to embodiments of the present disclosure.

[0036] The detailed description set forth below, in connection with the appended drawings and specification, explains embodiments of the present disclosure and serves as an exemplification of the presently disclosed aspects. DETAILED DESCRIPTION

[0037] As described further below, Figures 1-4BDisclosed is a detector having a printed electronic circuit on a flexible substrate that is conformed to have at least one detection zone for sensing, detecting, and monitoring hazardous and environmental conditions. In some embodiments, a detector body component can be formed integral with the printed electronic circuit for sensing, detecting, and monitoring hazardous and environmental conditions. Figure 5 Disclosed is a method for manufacturing a detector.

[0038] Reference is made to Figure 1 The printable flexible substrate 102 is initially substantially flat, has no discernable angles and no other characteristics other than being a medium for printing the electronic circuit 104 by a variety of methods. The electronic circuit 104 is printed onto the flat, printable flexible substrate 102 and in some embodiments, at least one electronic component is also printed on the printable flexible substrate 102.

[0039] Reference is made to Figure 2 The mold 210 is in a form that provides support for the electronic circuit 104 and provides a geometry to the printable flexible substrate for forming at least one detection zone (as discussed below). The mold 210 includes at least one of a surface angle, a recess, or a cavity for forming a detection zone on the printable flexible substrate. By thermoforming the printable flexible substrate including the electronic circuit 104 to the mold, the electronic circuit 104 conforms to the shape of the mold, thereby forming at least one detection zone for sensing, detecting, and monitoring hazardous and environmental conditions.

[0040] In one non-limiting embodiment, the circuit 104, which can include sensors such as photodiode 206 and LEDs 208a, 208b, is printed on the printable flexible substrate 102 and then the printable flexible substrate 102 is thermoformed to the mold 210. In some embodiments, the electronic circuit 104 is printed and then conformed to the mold 210 by a manufacturing process such as thermoforming; and then at least one electronic component is added to the electronic circuit 104 after thermoforming by hand or by machine coupling the electronic component to the electronic circuit 104. In an alternative embodiment, at least one electronic component is coupled to the printed electronic circuit and then the electronic circuit with the electronic component is thermoformed to the mold 210, thereby conforming the electronic circuit to the shape of the mold 210. The electronic circuit 104 can include sensors such as photodiode 206 and LEDs 208a, 208b and is printed on the printable flexible substrate 102.

[0041] In another non-limiting embodiment, the electronic circuit 104 is printed and then conformed to the mold 210 by a manufacturing process, such as thermoforming. The printed electronic circuit 104 can then be removed from the mold 210 and at least one electronic component is added to the electronic circuit 104 after thermoforming by hand or by machine coupling the electronic component to the electronic circuit 104. In this embodiment, the printable flexible substrate 102 and / or any optional added film(s), deposit(s) or coating(s) discussed below are rigid enough to allow coupling of the electronic component to the printable flexible substrate 102 without any additional under support.

[0042] In another non-limiting embodiment, after printing the electronic circuit 104 and coupling at least one electronic circuit to the electronic circuit 104, and adding any optional film(s) or coating(s), the printed electronic circuit 104 can be integrated with a component, such as a base (not shown). The base, which can be formed by additive printing, multi-jet or insert injection molding processes, can provide structure or shape to the detector device, and / or can provide support for detector components, such as connectors, or communication or memory devices. The films discussed below can be stacked on the electronic circuit 104 and then both the films and the electronic circuit 104 can be conformed to form at least one detection zone by thermoforming or other similar processes.

[0043] The printable flexible substrate 102 can include a variety of suitable materials, including but not limited to polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), polyvinyl chloride (PVC), and other substrates that allow for uniformity, high resolution, accuracy and little or no deformation when a stressor, such as pressure, temperature or force (e.g., stretch) is applied. The substrate can include a coating or additive to control scratch resistance, accumulation of dust and moisture, and passive optical filtering.

[0044] The single or multi-layer film can be stacked on the electronic circuit 104 and can be transparent, clear, translucent or opaque. For example, the film can be a polycarbonate single layer film for protecting a sensor, such as an optical device, from interference from dust or insects. The film can also be used to measure reflected light between the printable flexible substrate 102 and the film as a means for detecting the presence of accumulation of dust or moisture on the electronic component. The film can also magnify or minimize the input or output of a sensor. Alternatively, one or more devices (e.g., lenses, apertures) can be positioned between the printable flexible substrate and the film to magnify or minimize the input or output of one or more sensors, or to modify sensor sensitivity or focus. In another non-limiting embodiment, one or more lenses or apertures can be incorporated into the detector body (400) for the same or similar purposes. Figure 4A ​

[0045] In one non-limiting embodiment, at least one coating can be deposited on one or both sides of the electronic circuit 104. The coating can help protect any additional elements or component parts of the electronic circuit 104 or can be deposited to add properties, features, or textures to the detector. The coating can include, but is not limited to, paint, resin, plastic, polycarbonate film or laminate (e.g., combining different plastics and composites). The one or more coatings can be applied at any point after the electronic circuit 104 is formed, including after the electronic circuit 104 is thermoformed to the mold 210, after the electronic circuit 104 is removed from the mold 210, after an optional film is applied over the electronic circuit 104, after the electronic circuit 104 is integrated with the detector body (FIG. 4, 402) (with or without an optional base). In some embodiments, other components or elements can be added during the coating deposition process. For example, a coating can be applied over the electronic circuit 104 to protect the optical devices. Wires or processing components can then be added to the detector, followed by another coating to secure the wires or components in place.

[0046] The electronic circuit 104 can be printed on the printable flexible substrate 102 by a variety of methods, including non-impact printing (e.g., inkjet printing and hot melt printing), impact printing (e.g., screen printing, flexographic printing, offset printing, pad printing, gravure printing), and direct writing printing (e.g., nScrypt). Inks useful for printing the electronic circuit 104, semiconductors, and interconnecting components such as the LEDs 208a, 208b and photodiode 206 can include any one or more inks, including, by way of example, silver- or copper-based inks, metal nanoparticle inks, carbon-based inks, and organometallic inks.

[0047] The printed electronic circuit 104 can include components such as integrated circuits, conductors, transducers, optical devices, sensors, audio devices (e.g., speakers or sound emitters), devices for supplying power, microcontrollers, microprocessors, and memory (volatile and / or non-volatile), components for one-way or two-way wired or wireless communication (e.g., transmitters / receivers, antennas, RFID technology). In some embodiments, in addition to sensing and detection capabilities, the electronic circuit 104 can include components that allow the detector to be used as a communication device (e.g., a Bluetooth® or ZigBee® device). Figure 4AThe device (400) communicates and shares information with one or more of the following: other detectors and other fire protection system components, or with control panels, computers (e.g., desktop computers, laptop computers, or tablets), portable electronic devices (e.g., smartphones, tablets, watches), or central servers or cloud computing systems, or devices with network connectivity anywhere in the world. Data communication may be performed using any of a variety of custom or standard wired or wireless protocols (Wi-Fi, ZigBee, 6LoWPAN, CAT6 Ethernet, HomePlug, etc.) used for commercial or residential purposes.

[0048] refer to Figure 2 The electronic circuitry 104 on the printable flexible substrate 102 may include optical devices such as light-emitting diodes (LEDs) 208a, 208b, which may emit visible or invisible light (such as blue light 208a or infrared light 208b) of different wavelengths useful for detecting a variety of hazards and conditions. The electronic circuitry 104 may also include one or more detection sensors, such as photodiodes (PDs) 206 (e.g., sensing ambient light, ultraviolet (UV) light). The electronic circuitry 104 may also include accelerometers (e.g., vibration, seismic sensing), or sensors for detecting explosive gases (such as propane, hydrogen, or methane), or sensors for detecting motion (e.g., infrared motion sensors).

[0049] The sensor can be positioned anywhere on the printable flexible substrate 102. For example, the photodiode 206 can be in the recess 212, or on the slopes 214a, 214b, or in the cavity ( Figure 3 In another example, sensors (such as LEDs 208a, 208b) can be positioned anywhere on a printable flexible substrate (such as ramp 214a) to serve as indicators of operational status (e.g., on / off, alarm status, required service), provided that the LED indicators do not interfere with (e.g., avoid or enhance) particle detection.

[0050] Transfer to Figure 3 When one or more optical devices are active, light 308, 310 is emitted from or received by the optical devices at an angle consistent with the position and placement of the optical devices on the printable flexible substrate 102 and based on other factors such as the presence or absence of one or more light guides 302. Light 308 and light 310 are each generally depicted as a light cone for illustrative purposes only. Detectable particles or substances are detected when they are located within the detection area 306 formed at the intersection of light 308, 310. For example, when light 310 from LED 208 intersects the surface of the detectable particle or substance, some of the light 308 is reflected from the surface and received by photodiode 206.

[0051] The detection zone 306 can enable a processor, such as a microprocessor, microcontroller, or other suitable device, to distinguish between a variety of particle sizes by comparing the intensity of forward scattered light to the intensity of back scattered light. Specifically, a first ratio of the intensity of light that is forward scattered from a particle at an angle less than ninety (90) degrees relative to the original direction of the light at the LED 208 is compared to a second ratio of the intensity of light that is back scattered at an angle greater than ninety (90) degrees relative to the original direction of the light at the LED 208. To further distinguish between particulate matter, a plurality of light wavelengths and detection zones can be employed, which enables greater particle identification specificity and / or detection of a variety of particle types. It should be appreciated that a plurality of detection zones for detecting a variety of environmental conditions, indoor pollutants, explosive gases, and open flames can be formed using, for example, a plurality of sensing and detection electronics. In another non-limiting embodiment, one or more LEDs 208 can be used as an indicator of operational status (e.g., on / off, alarm status, required service) so long as the LED indicator 208 does not disrupt (e.g., avoid or enhance) the operation of the sensor LED 208. In one example, referring to Figure 2 , the printable flexible substrate 102 can have two or more bevels 214a, 214b that direct inward from the top side 216 to the recessed floor 212. In another example, the photodiode 206, an LED 208a that emits infrared light (IR), and an LED 208b that emits blue light (BL) can be positioned on the bevel 214a. In yet another example, the photodiode 206 can be positioned on the bevel 214b for detecting reflected light 208 from particles (not shown). In another non-limiting embodiment, one or more photodiodes 206 can be positioned on the floor 212 as additional sensors.

[0052] The mold 210 can have at least one cavity 304 for receiving an electronic component, such as the photodiode 206, as the printable flexible substrate 102 is conformed to the mold 210 during a manufacturing process, such as thermoforming. It can be appreciated that any one or more photodiodes 206 or LEDs 208 can be received into one or more cavities (see 304, and 304a, 304b, 304c) in the mold 210 during thermoforming. For example, the thermoforming process secures the electronic component, such as the photodiode 206, in place and at an angle suitable for detecting reflected light 308 from particles. Alternatively, the mold 210 can have at least one cavity 304 such that the substrate 102 includes the cavity 204 after the printable flexible substrate 102 is conformed to the mold 210 during a manufacturing process, such as thermoforming, and the electronic component, such as the photodiode 206, can be added to the substrate 102 after thermoforming. Figure 4B

[0053] ​In one non-limiting embodiment, the light guide 302 can be formed on the printable flexible substrate 102 using one or more processes, such as thermoforming, multi-jet, insert injection molding, or additive printing, which can be performed before or after thermoforming the printable flexible substrate 102 to the mold 210. A light guide or optical waveguide is a structure used to spatially confine and direct light to an intended target. By way of example and not limitation, the light guide 302 can be used to direct reflected light 308 into the photodiode 206, or to direct emitted light 310 from the LED 208 to a space that needs to be detected. The light guide 302 can direct the light 308, 310 to form at least one detection zone 306 for detecting at least one particulate matter, environmental condition, or indoor pollutant.

[0054] In one non-limiting embodiment, the photodiode 206 is partially shielded by the light guide 302 to prevent the photodiode 206 from receiving all of the emitted light 310 from the LED 208. For example, the light guide 302 repels light that can be reflected from the interior surface of the detector, thereby avoiding interference from the interior reflected light. In some embodiments, one or more light guides 302 can also be present on the exterior surface of the detector body 402 to direct light or to control interference from ambient light. Figure 4A

[0055] Figure 3 The generally triangular shape, orientation, and placement of the light guide 302 shown in FIG. 4 is illustrative only, in practice, the light guide 302 can have any shape and can have any orientation or position on the printable flexible substrate 102 where the light guide 302 can be necessary for reliable operation of the detector 400, i.e., to block or direct light as needed to prevent interference and / or to enhance detection.

[0056] Turning to FIG. 5, a side view of the detector 400 is shown. The detector 400 can use emitted and received signals or light to sense or detect a variety of environmental conditions and indoor pollutants (e.g., biological pollutants, chemical pollutants, and particulates). The environmental conditions that can be detected can include temperature, heat, and humidity; the presence of biological pollutants such as bacteria, viruses, mold, fungi, dust mites, animal dander, and pollen; and the presence of chemical pollutants such as cleaning agents, solvents, fuels, propane, methane, carbon monoxide, carbon dioxide, formaldehyde, nitrogen dioxide, and other VOCs. The particulates that can be detected can include dust, smoke, dirt, or other particles that can be dispersed, such as water (e.g., mist) or oil. Figure 4A The detector body 402 can be formed using one or more processes, such as injection molding, stamping, or additive printing. The detector body 402 fully or partially encloses the printable flexible substrate 102, the electronic circuit 404, and the light guide 302.

[0057] Figure 2 The detector body 402 can be formed using one or more processes, such as injection molding, stamping, or additive printing. The detector body 402 fully or partially encloses the printable flexible substrate 102, the electronic circuit 404, and the light guide 302.​​Figure 2 , a photodiode (104), and an LED (108), and optionally a structure (not shown) that provides a base. The detector body 402 or the base can be formed to have one or more internal baffles, spaces, or chambers (not shown) within the detector body 402, or one or more holes or openings (not shown) along a surface of the detector body 402. The baffles or internal chambers can be useful in detecting certain environmental conditions or hazards, by way of example and not limitation, heat or smoke or other particulates of light having specific target size and / or having specific wavelength characteristics. Figure 2 Figure 2 Turning to , a detector 400 is shown having a surface 416 oriented toward a space to be detected.

[0058] An example of light 310 emitted from at least one LED within the detector body 402 is illustrated. Also illustrated is light 308 that is generally reflected from an object in the space to be detected back into the photodiode within the detector body 402. A detection zone 306 is formed where the light 308, 310 intersects with a detectable particle or substance. Figure 4A Figure 4A Now turning to , a portion of the surface 416 of the detector is shown. In one non-limiting embodiment, the surface 416 of the detector has a through hole or opening for allowing light to enter and exit the detector. The opening can have any shape or orientation that allows at least one detection zone 306 to be formed. In one non-limiting embodiment, light 310 from the LED in the cavity 304b passes through the opening to reach the space to be detected. Similarly, light 308 reflected from a detectable particle or substance within the detection zone 306 passes through the at least one opening to be detected by the at least one photodiode within the cavities 304a, 304c.

[0059] Figure 4B In one non-limiting embodiment, a method for manufacturing a detector includes printing electronic circuitry on at least a first side of a printable flexible substrate; coupling at least two electronic components to the electronic circuitry on the at least a first side of the printable flexible substrate; thermoforming the printable flexible substrate to form at least one detection zone from (i) at least one side of the printable flexible substrate having an angle for emitting one of light or a signal from the at least two electronic components and (ii) at least one side of the printable flexible substrate having an angle for receiving one of light or a signal by the at least two electronic components; and, in some embodiments, encapsulating the printable flexible substrate, thereby forming a detector.

[0060]

[0061] Figure 5 ​​A flowchart showing an embodiment of a method of manufacturing a detector is shown. At the start of the method for manufacturing, a start-up phase 502 can be performed. During the start-up 502, necessary tasks such as selection, acquisition, calibration, and other set-up of materials, electronic components, equipment, and tools can be performed. If needed, equipment for printing electronic circuits, such as a printer, to thermoform electronic assemblies can be brought to an operational state at this stage or later.

[0062] At least one printable flexible substrate is obtained, on which an electronic circuit is printed. At 504, an electronic circuit is printed on a printable flexible substrate, as contemplated in one or more of the disclosed embodiments. In some embodiments, one or more electronic components, such as photodiodes and / or LEDs, are also printed. However, in one non-limiting embodiment, at least two electronic components are coupled to the electronic circuit by hand or by machine at step 506. The electronic circuit can be printed on one or both sides of the printable flexible substrate. Additionally, the electronic components can be printed or placed on one or both sides of the printable flexible substrate.

[0063] At the next step 508, the printable flexible substrate with the electronic circuit is prepared for a thermoforming process. Preparing the electronic circuit for thermoforming can include coupling electronic components, and / or stacking a film over the electronic circuit (with or without any added electronic components). Once the electronic circuit is prepared, the electronic circuit and the printable flexible substrate are conformed to a mold by a thermoforming process.

[0064] In a separate manufacturing process 510, the conformed electronic circuit is fully or partially encapsulated, forming a detector according to the disclosed embodiments.

[0065] In some embodiments, the conformed electronic circuit is coupled to an optional base. As discussed above, the optional base, which can be formed in a separate manufacturing process, can provide support for detector components such as connectors, or communication or memory device structures, and provide a shape to the detector device. In this example, the optional base is formed, and then the conformed electronic circuit and base can be encapsulated in a detector body according to the disclosed embodiments.

[0066] Potential post-manufacturing tasks 512 can include adding properties, features, or textures to the detector by depositing one or more coatings. As discussed above, at least one coating can be deposited on: the electronic circuit (after thermoforming), and / or the detector (if the electronic circuit is encapsulated (with or without an optional base)). For example, one or more layers of protective, indicative, haptic, and / or aesthetic value (graphics, color, figures, text, digital data, surface contours, etc.) can be added to the detector. Other materials (such as wiring, rubber materials, and / or plastics) can be added between the coatings. Additionally, other elements can be added to the detector, for example, electrical connectors or wiring can be installed, or external lenses or apertures can be added to the exterior, or capacitive sensors or materials that hold an electrical charge that can be useful for touch screen applications. Shaping or cutting can also be performed.

[0067] The method ends at 514. It should be recognized that the order of the steps disclosed above can vary depending on manufacturing variables (such as material flexibility) and construction variations (such as layout and component differences). Additionally, other steps of the manufacturing method can be introduced at any point in the process of creating the detector. Furthermore, any one or more steps of the method can be repeated. For example, the method can include a lamination step, or can include more than one thermoforming step. By way of example and not limitation, the method can include printing the electronic circuit on a printable flexible substrate. The printed electronic circuit can then be laminated. The lamination step can preserve the integrity of the printed circuit as the printed circuit continues through the manufacturing process. The method can then include coupling at least two electronic components to the circuit on one or both sides of the printable flexible substrate, followed by at least one thermoforming step to shape the electronic circuit. In an alternative method, the printable electronic circuit can then be laminated. Thereafter, one or more electronic components can be coupled to the electronic circuit by hand and / or machine, followed by a second lamination and / or thermoforming process.

[0068] While the present disclosure has been described with reference to one or more example embodiments, it will be understood by those skilled in the art that various changes can be made and equivalents can be substituted for elements thereof without departing from the scope of the present disclosure. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the central scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this present disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.

Claims

1. A method for manufacturing a detector, the method comprising: printing an electronic circuit on at least a first side of a printable flexible substrate; coupling a first electronic component and a second electronic component to the electronic circuit on at least the first side of the printable flexible substrate; thermoforming the printable flexible substrate to form at least one detection zone from: (i) at least one side of the printable flexible substrate having an angle for emitting light from the first electronic component; and (ii) at least one side of the printable flexible substrate having an angle for receiving light by the second electronic component; encapsulating the printable flexible substrate, thereby forming a detector; wherein the first electronic component is a light emitter and the second electronic component is a light receiver, the second electronic component configured to receive light from the first electronic component scattered by a particle in the detection zone. The method further comprises the steps of:

2. The method of claim 1, wherein, stacking an additional layer on at least the first side of the printable flexible substrate having the electronic circuit; thermoforming the additional layer and the printable flexible substrate. The method further comprises the step of depositing a coating on at least one of the electronic circuit and the detector device.

3. The method of claim 1, wherein, The first electronic component for emitting light is a light emitting diode and the second electronic component for receiving light is a photodiode.

4. The method of claim 1, wherein, The additional layer is at least one of: a polymer film and a polycarbonate film.

5. The method of claim 2, wherein, At least one of the printable flexible substrate and base is fully or partially encapsulated.

6. The method of claim 1, wherein, At least one of the printable flexible substrate and base is encapsulated by one or more of: thermoforming, injection molding, additive printing.

7. The method of claim 6, wherein, At least one of the emission angle and the reception angle is 180 degrees or less.

8. The method of claim 1, wherein, The printable flexible substrate has at least one cavity for receiving an electronic component, wherein the electronic component emits or receives the light at an angle of 180 degrees or less.

9. The method of claim 1, wherein, The method further comprises the printable flexible substrate having a light guide for: (i) directing emitted light from the first electronic component to the detection zone; and (ii) receiving the light by the second electronic component.

10. The method of claim 1, wherein, 11. A detector system comprising: an electronic circuit printed on a printable flexible substrate, wherein the electronic circuit is conformed to a shape forming at least one detection zone, wherein the at least one detection zone is formed from: (i) at least one side of the printable flexible substrate having an angle for emitting light from a first electronic component; and (ii) at least one side of the printable flexible substrate having an angle for receiving light by a second electronic component; a detector body, wherein the conformed electronic circuit is encapsulated, thereby forming a detector, wherein the first electronic component is a light emitter and the second electronic component is a light receiver, the second electronic component configured to receive light from the first electronic component scattered by a particle in the detection zone. The electronic circuit is conformed to the shape for forming at least one detection zone by a thermoforming process.

12. The system of claim 11, wherein, ​ 13. The system of claim 11, wherein, The conformal electronic circuit is fully or partially encapsulated during the manufacturing process.

14. The system of claim 13, wherein, The manufacturing process is at least one of additive printing, multi-jet or insert injection molding processes.

15. A detector device comprising: an electronic circuit printed on a printable flexible substrate, wherein: (i) a first electronic component of the electronic circuit is conformal to an angle for emitting light; and (ii) a second electronic component of the electronic circuit is conformal to an angle for receiving reflected light; a detector body component formed integral with the conformal electronic circuit, wherein the first electronic component is a light emitter and the second electronic component is a light receiver, the second electronic component configured to receive light scattered by a particle in a detection zone from the first electronic component.

16. The apparatus of claim 15, wherein, The device further comprises depositing a coating on at least one of the conformal electronic circuit and the detector device.

17. The apparatus of claim 15, wherein, The first electronic component is a light emitting diode.

18. The apparatus of claim 15, wherein, The second electronic component is a photodiode.

19. The apparatus of claim 15, wherein, The angle for emitting light by the first electronic component is 180 degrees or less.

20. The apparatus of claim 15, wherein, The angle for receiving reflected light by the second electronic component is 180 degrees or less.

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