Integrated device packages with passive device components

Abstract

An integrated device package is disclosed. The package may include a package substrate and an integrated device die having active electronic circuits. The integrated device die may have a first side and a second side opposite the first side. The first side may have a pad electrically connected to the package substrate via a wire bond. A redistribution layer (RDL) stack may be disposed on the first side of the integrated device die. The RDL stack may include an insulating layer and a conductive redistribution layer. The package may include a passive electronic device component mounted and electrically connected to the RDL stack.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 776,342, filed on December 6, 2018, the entire contents of which are hereby incorporated by reference in their entirety and for all purposes. Technical Field

[0003] The field relates to integrated device packages having passive device components. Background Art

[0004] Various types of electronic systems may include passive electronic components, such as capacitors, resistors, inductors, etc. Passive electronic components may be used to condition or filter electrical signals before or after being processed by other components of the electronic system. Incorporating passive electronic components into electronic systems may take up valuable circuit board space and, therefore, increase the footprint of the electronic system. Furthermore, connecting passive electronic components to other devices in the system may introduce electrical losses. Therefore, there remains a need for improvements in incorporating passive electronic components into electronic systems. Summary of the invention

[0005] In one embodiment, an integrated device package is disclosed. The integrated device package may include a package substrate and an integrated device die having active electronic circuits. The integrated device die may have a first side and a second side opposite the first side, the first side including pads electrically connected to the package substrate by wirebonds. The package may include a redistribution layer (RDL) stack disposed on the first side of the integrated device die, the RDL stack including an insulating layer and a conductive redistribution layer. The package may include passive electronic device components mounted and electrically connected to the RDL stack.

[0006] In another embodiment, a sensor module is disclosed. The sensor module may include an electronic device. The electronic device may include an element and a redistribution layer (RDL) stack disposed on a first side of the element. The RDL stack may include an insulating layer and a conductive redistribution layer. The electronic device may include a passive electronic device component mounted and electrically connected to the RDL stack. The sensor module may also include an imaging sensor component to which the electronic device is mounted. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Embodiments of the present disclosure will now be described by way of non-limiting examples with reference to the accompanying drawings.

[0008] Figure 1 is a schematic side cross-sectional view of an electronic device according to one embodiment.

[0009] Figure 2A is a schematic side cross-sectional view of an integrated device package including an electronic device according to another embodiment.

[0010] Figure 2B is a schematic side cross-sectional view of an integrated device package including an electronic device according to another embodiment.

[0011] Figure 3 is a schematic side cross-sectional view of a sensor module according to one embodiment. DETAILED DESCRIPTION

[0012] Various embodiments disclosed herein relate to an integrated device package that includes an electronic device having a passive device assembly mounted to a redistribution layer (RDL) stack disposed above a surface of an integrated device die. In some packages, the passive electronic devices may be mounted to a substrate adjacent to the integrated device die, such as a system board or a package substrate. In such a package, the occupied space may be larger than desired due to the laterally adjacent mounting arrangement of the passive electronic devices. In addition, mounting the passive electronic devices near the integrated device die and electrically connecting them through the substrate may increase the length of the electronic signal path between the passive electronic devices and the integrated device die, which may result in electrical losses, noise, and performance degradation.

[0013] In embodiments disclosed herein, the performance of the package can be improved by mounting the passive electronic components closer to the active electronic circuitry of the integrated device die, such as by mounting the passive electronic components to the RDL stack located above the die. In some embodiments, the passive electronic components can be mounted above the die within the lateral footprint of the die, which can also beneficially reduce the overall footprint of the package.

[0014] In addition, in some embodiments, a package (including passive devices mounted to the RDL stack) can be mounted to an imaging sensor assembly and can be configured to process signals converted by the sensor assembly. For example, as explained herein, a sensor assembly can include a sensor chip mounted to a sensor substrate. The sensor chip (e.g., a photodiode array or a PDA) can convert electromagnetic radiation into an electrical signal. The signal can be transmitted to the package via the sensor substrate. Advantageously, a package with passive electronic devices can provide a reduced footprint, which can be important for various types of sensor assemblies.

[0015] Figure 1 is a schematic side cross-sectional view of an electronic device 1 according to one embodiment. The device 1 may include a component including an integrated device die 2 having active components (eg, active circuits) formed therein. Figure 1 The element is an integrated device die; however, in other embodiments, such as the following combination Figure 3As explained, the element may include another suitable device, such as an interposer. The integrated device die 2 may include a semiconductor die, such as a die formed of a combination of silicon, germanium, or other III-IV semiconductor materials. The integrated device die 2 may include any suitable type of device die, such as a processor die, a memory die, a micro-electromechanical system (MEMS) die, a sensor chip, etc. As described herein in conjunction with Figure 3 As explained, for example, the die 2 may include a processor die configured to process signals converted by the sensor assembly. The upper surface 18 of the die 2 may include a plurality of conductive pads 4 exposed through the insulating passivation layer 5. In some arrangements, the passivation layer 5 may overlap a portion of the bonding pad 4 to define a bonding area. In various embodiments, for example, during wafer fabrication, the pads 4 and the passivation layer 5 may be patterned on the die 2. The conductive pads 4 may include any suitable type of conductive material, such as copper. The passivation layer 5 may include an insulating or dielectric material, such as silicon oxide, silicon nitride, and the like. In some arrangements, the RDL stack 3 may be disposed above the active circuit. In some embodiments, the active circuit of the die 2 may be disposed at or near the upper surface 18 of the die 2. In other embodiments, the active circuit of the die 2 may be disposed at or near the relative lower surface 19 of the die 2, wherein the pads 4 are connected by semiconductor through vias (TSVs). In other embodiments, active circuitry of die 2 may be disposed between upper surface 18 and lower surface 19 in die 2 .

[0016] A redistribution layer (RDL) stack 3 may be provided on the upper surface 18 of the component, the component being Figure 1 The die 2 in the embodiment. The passive device assembly 12 can be mounted to the RDL stack 3 of the component. The RDL stack 3 may include one or more layers of insulating and conductive materials to provide electrical connectivity between the pads 4 of the die 2 and other devices. RDLs are typically used to provide connection points to other devices (e.g., via solder bumps or wire bonds) with a different geometry than that provided by the pads 4 in the die 2. For example, the RDL stack 3 can be configured as a lateral fan-out or fan-in signal input / output (I / O) pad for connection to external devices.

[0017] In the illustrated embodiment, the passive device assembly 12 includes one or more passive electronic devices 11a, 11b, which are mounted to the RDL stack 3 by a conductive adhesive 10 (e.g., solder paste, conductive epoxy, anisotropic conductive film, or any other suitable adhesive). The passive electronic devices 11a, 11b may include any suitable type of passive devices, such as any suitable surface mount technology (SMT) components. For example, the passive electronic devices 11a, 11b may include one or more of capacitors, inductors, resistors, etc. The passive devices 11a, 11b may be used for isolation, noise filtering, regulation, etc. In some arrangements, a metal cover may be provided in a local area of ​​the package 2 for electromagnetic interference shielding. However, in the illustrated embodiment, it may be preferred to use a molding compound for sensor component applications to protect the overmolded components. In addition, some devices that use a cover to define a cavity may do so to shield the entire integrated device die. In some embodiments, such as imaging sensor applications, only one side of the die and / or passive components may be subject to harmful radiation, so that the passive device and / or die may be overmolded. Thus, advantageously, embodiments disclosed herein may utilize a molding compound that may be more cost effective than incorporating a metal cover for additional shielding. Figure 1 Two devices 11a, 11b are shown in FIG, but it will be appreciated that any suitable number of passive devices may be provided, including one, three, four or more than four passive electronic components.

[0018] Figure 1 The RDL stack 3 shown may include multiple insulating and conductive layers. Figure 1 As shown, the RDL stack 3 may include a first insulating repassivation layer 6 and a conductive redistribution layer (RDL) 7. In some embodiments, the repassivation layer 6 and the conductive RDL 7 may be provided in separate manufacturing facilities, for example, in a back-end of line (BEOL) facility. In some embodiments, the RDL stack 3 may be formed before dicing the wafer (e.g., during wafer-level processing) or after dicing the wafer (e.g., on a reconstructed wafer with an insulating material (e.g., a polymer) between sliced ​​chips). In some embodiments, the repassivation layer 6 may be deposited on the upper surface 18 of the die 2 and may be patterned to expose the pads 4 below. The conductive RDL 7 may be deposited on the repassivation layer 6 and may extend into holes defined in the repassivation layer 6 to provide mechanical and electrical connections to the pads 4.

[0019] A second insulating repassivation layer 9 may be provided over the conductive RDL 7 and over a portion of the first repassivation layer 6 in a gap provided in the conductive RDL 7. As with the first repassivation layer 6, the second repassivation layer 9 may be patterned to expose a portion of the conductive RDL 7. An under bump metallization (UBM) layer 8 may be disposed over the second repassivation layer 9 and over the exposed portion of the conductive RDL 7. As shown, the UBM layer 8 may be electrically connected to the exposed portion of the conductive RDL 7. As shown, the RDL stack 3 includes two insulating layers (layers 6, 9) and two conductive layers (layers 7, 8), but it should be understood that any suitable number of insulating and conductive layers may be used for the RDL stack 3.

[0020] The first and second insulating repassivation layers 6, 9 may include any suitable type of insulating or dielectric material. For example, in some embodiments, the repassivation layers 6, 9 may include an inorganic dielectric, such as silicon oxide, silicon nitride, silicon oxynitride, etc., or may include an organic dielectric such as a polymer (e.g., epoxy, polyimide, benzocyclobutene (BCB), polybenzoxazole (PBO), or any other suitable dielectric material). The conductive RDL 7 and UBM layer 8 include conductive materials, such as any suitable metal, such as copper, aluminum, etc. The passive electronic devices 11a, 11b may be electrically connected to the UBM layer 8 via the conductive adhesive 10. Therefore, the RDL stack 3 may provide electrical communication between the passive devices 11a, 11b and the active circuits in the die 2 via the UBM layer 8, the conductive RDL 7, and the pads 4 of the die 2.

[0021] In the illustrated embodiment, the passive devices 11a, 11b are positioned to cover the integrated device die 2, for example, so as to be arranged in the lateral footprint of the die 2. In such an arrangement, the overall lateral footprint of the package can be reduced compared to a package in which a passive device adjacent to the die 2 is provided on a package substrate. In addition, positioning the passive devices 11a, 11b near the active circuit can beneficially reduce electrical noise and loss. For example, in some embodiments, an active circuit can be provided at or near the upper surface 18 near the RDL stack 3 to reduce signal transmission distance and loss. In other embodiments, the passive devices 11a, 11b and the RDL stack 3 can be provided on the back side of the die, and a through-substrate via (TSV) can provide electrical communication between the active circuit and the RDL stack 3 and the devices 11a, 11b. In some arrangements, the passive devices 11a, 11b can cover the active circuit in the die. In other embodiments, the passive devices 11a, 11b may not cover the active circuit. In the illustrated embodiment, the RDL stack 3 provides a fan-in electrical connection, wherein signals from the pads 4 are transmitted laterally inward to corresponding contacts or leads of the passive devices 11a, 11b. However, as explained below, in other embodiments, the RDL stack 3 can provide a fan-out electrical connection to a passive device that can be at least partially laterally offset from the die 2.

[0022] Although not in Figure 1 , the device 1 can be mounted to any suitable type of packaging substrate, such as a printed circuit board (PCB), a lead frame, a ceramic substrate, etc. In some embodiments, the passive device assembly 12 can be mounted to the die 2 before the die 2 is mounted to the packaging substrate. In other embodiments, the die 2 can be mounted to the substrate before the passive device assembly 12 is mounted to the die 2. In some embodiments, a molding compound or encapsulant can be provided over the die 2 and the RDL stack 3. For example, the die 2 and the passive devices 11a, 11b can be mounted in a manner similar to Figure 2A The arrangement shown in the embodiment of the present invention is packaged as described below. In other embodiments, a package cover can be provided over the die 2 and the RDL stack 3, and a gas (e.g., air) cavity is provided between the package cover and the die 2. Still other packaging arrangements may be suitable. In some embodiments, the RDL stack 3 can be arranged to provide a fan-out electrical configuration. In such an embodiment, a molding compound can be provided over a portion of the die 2, and the RDL stack 3 can be provided over the die 2 and over a portion of the molding compound that extends laterally outward from the die 2. In some embodiments, the UBM layer 8 can extend laterally outward from the die, and one or more passive devices 11a, 11b can be mounted to the UBM layer 8 so that portions of the passive devices 11a, 11b are laterally offset from the die 2.

[0023] Figure 2A is a schematic side cross-sectional view of an integrated device package 20 including an electronic device 1 according to another embodiment. Figure 2A The components can be used with Figure 1 The components with the same number are the same or substantially similar. Figure 1 Same, Figure 2A The embodiment includes an RDL stack 3 mounted on the surface of the integrated device die 2 (see Figure 1 ) passive device assembly 12. Figure 2A In the embodiment of the present invention, the die 2 can be mounted to the package substrate 16 by an adhesive (not shown). As described above, the package substrate may include any suitable type of substrate, such as a PCB, a lead frame, a ceramic substrate, etc. In various embodiments, for example Figure 3 The packaging substrate 16 may have pads configured to be in electrical communication with corresponding pads of the sensor assembly. The packaging substrate 16 may include an insulating substrate having conductive traces therein.

[0024] and Figure 1 As in the embodiment of FIG. 1 , the RDL stack 3 may be formed on the upper surface 18 of the die 2. However, Figure 1 The embodiments are different. Figure 2A In an embodiment of the present invention, the passive device assembly 12 includes an interposer 13 mounted to the RDL stack 3 by a conductive adhesive (e.g., by solder balls or bumps 14). In some embodiments, the interposer 13 may include a dummy interposer having traces and vias for routing signals but without active processing circuitry. In other embodiments, the interposer 13 may include an electrically active interposer having active processing circuitry. The passive electronic devices 11a, 11b may be mounted to the RDL stack 3 by a conductive adhesive (e.g., by solder balls or bumps 14). Figure 2A 15a) is mounted to the interposer 13. The interposer 13 may include any suitable type of interposer, such as a laminate structure, a PCB substrate, a ceramic interposer, a semiconductor (e.g., silicon) interposer, etc. The interposer 13 may be electrically connected to the package substrate 16 via wire bonding 15a. Therefore, in some embodiments, the passive device assembly 12 can advantageously communicate with both the package substrate 16 (e.g., via wire bonding 15a) and the die 2 (e.g., via a flip chip arrangement with solder balls 14). Alternatively, the interposer may be connected to the package substrate 16 alone, such as via solder bumps 14, via the die 2. The die 2 may be electrically connected to the package substrate 16 via wire bonding 15b. Alternatively, the die 2 may include TSVs with the active side facing up or down. Although not shown, it should be understood that the package substrate 16 also includes leads on the outer surface for electrically connecting to a larger system, such as a system board. Depending on the structure of the package substrate 16, the external leads may take various forms, such as lead frame leads, solder balls, etc.

[0025] It should also be understood that Figure 1 The electronic device 1 and the passive device assembly 12 may be used in the package 20 instead of Figure 2A 1. In such an embodiment, the passive device assembly 12 (including, for example, passive devices 11a, 11b) can be mounted directly to the RDL stack 3 of the die 2 without an interposer. A molding compound 17 can be provided over the exposed upper portions of the passive devices 11a, 11b, the die 2, and the packaging substrate 16.

[0026] A molding compound 17 or encapsulant may be provided over the passive devices 11a, 11b, interposer 13, wire bonds 15a, 15b, and die 2 to protect the packaged components from the external environment. Figure 1 The same as the example, Figure 2A The package 20 can advantageously reduce the overall package footprint while improving the electrical performance of the package 20. Figure 1 Likewise, passive component assembly 12 (eg, passive components 11a, 11b and interposer 13) may be located within the lateral footprint of die 2. However, in other embodiments, at least a portion of passive component assembly 12 may be located outside of the lateral footprint of die 2.

[0027] As described above, various embodiments disclosed herein relate to a sensor module configured for use in an imaging system, such as a digital X-ray imaging system, a computed tomography (CT) imaging system, an ultrasound imaging system, or any other suitable imaging system. Figure 1 and 2A Passive integrated device components may be provided in the sensor assembly to condition or otherwise manipulate the signals converted by the sensor assembly. Advantageously, the reduced footprint provided by the electronic device 1 and the package 20 may result in a sensor module also having a reduced footprint.

[0028] Figure 2B Another embodiment of an integrated device package 20 is illustrated. Figure 2B Roughly similar to Figure 2A The package shown in Figure 20. Unless otherwise specified, Figure 2B The reference numerals in the figure represent Figure 2A Components with the same number in the same or substantially similar components. Figure 2B In the embodiment of FIG. 1 , the interposer 13 may be laterally larger than a corresponding lateral footprint of the integrated device die 2 . Figure 2BThe larger interposer 13 can advantageously accommodate multiple electronic components that can improve the functionality of package 20. For example, one or more additional active device dies 42 can be mounted to interposer 13 via a suitable conductive adhesive. Device dies 42 can process and / or test components of package 20, including signals from die 2 and / or components mounted to interposer 13.

[0029] Figure 3 is a schematic side cross-sectional view of a sensor module 30 according to one embodiment. The sensor module 30 may include an imaging sensor assembly 33 and an integrated device package 20 mounted to the sensor assembly 3. The integrated device package 20 may be the same as or different from the package 20 described above. The package 20 may include any suitable type of passive device assembly 12. For example, the passive device assembly 12 may include passive electronic devices 11a, 11b mounted to the RDL stack 3 of the component via an adhesive. In other embodiments, the passive device assembly 12 may include passive devices 11a, 11b mounted to an interposer 13, which is mounted to the RDL stack 3 of the component. For example, in some embodiments, the component may include Figure 1 and the integrated device die 2 in 2, and the passive device assembly 12 can be mounted to the integrated device die 2. In other embodiments, the element can include another suitable structure, such as an interposer, a substrate, other types of devices, etc.

[0030] An illumination source 34, such as an x-ray source or any other suitable source of electromagnetic radiation, may be provided, and the electromagnetic radiation may be directed to the sensor assembly 33. In various embodiments, although not shown here, an object (e.g., a human patient or any other suitable target object) may be provided between the illumination source 34 and the sensor assembly 33. Additional details regarding the sensor assembly and components provided therefor may be found in U.S. Patent Nos. 8,829,454, 9,116,022, and 10,340,302; the entire contents of each are hereby incorporated by reference in their entirety and for all purposes.

[0031] The sensor assembly 33 may include a sensor substrate 31 and one or more sensor chips 32 mounted to the front side of the sensor substrate 31. The sensor substrate 31 may include any suitable type of substrate, such as a laminate substrate, a printed circuit board (PCB) substrate, a semiconductor interposer, a flexible substrate containing a polymer with embedded traces, or any other suitable substrate with a non-conductive substrate with embedded conductive traces or interconnects. The sensor chip 32 may include a photodiode array (PDA) having a plurality of photosensitive elements that convert electromagnetic radiation into electric current. Although not shown, a radiation conditioner, such as a filter or a scintillator, may be provided on the front side of the sensor assembly 33. The sensor chip 32 may accordingly convert the light irradiated on the PDA into an electrical signal, which may be transmitted to the sensor substrate 31. In some embodiments, the sensor chip 32 may be electrically connected to the sensor substrate 31 by a conductive adhesive such as a solder bump, an anisotropic conductive film (ACF), a conductive epoxy, or the like.

[0032] The package 20 may be mounted to the sensor assembly 33 by a conductive adhesive, such as a plurality of solder balls 37, a conductive epoxy, etc. In addition to the passive device assembly 12, the package 20 may also be one or more active integrated device dies, as described above. The die 2 may include active processing circuitry configured to process electrical signals (e.g., analog signals) converted by the sensor chip 32 and transmitted to the package 20 via the sensor substrate 31. The devices of the package 20 may process these signals in any suitable manner, including, for example, signal filtering, analog-to-digital conversion, etc. The signals processed by the devices of the package 20 may be transferred from the package 20 (e.g., via a system motherboard) to a larger electronic system for presentation on a display or further processing in other ways to analyze the imaged object.

[0033] Additionally, package 20 or sensor assembly 33 may include one or more radiation shields 38 to shield sensitive circuitry from harmful electromagnetic radiation. Shields 38 may include any suitable material selected to prevent harmful radiation (e.g., x-rays) from striking sensitive circuitry (e.g., sensitive circuitry of die 2). In some embodiments, shields 38 may include tungsten. For example, in Figure 3, radiation shield 38 may be attached to package substrate 16 by an adhesive. Die 2 may be mounted to shield 38 and positioned so that the sensitive circuitry of die 2 is within the lateral footprint of shield 38. Although shield 38 is shown as part of package 20 and mounted to substrate 16, in other embodiments, shield 38 may be placed elsewhere within sensor module 30 between sensor chip 32 and sensitive circuitry (e.g., sensitive circuitry of chip 2). For example, shield 38 may be placed between sensor assembly 33 and package 20, within sensor assembly 33, elsewhere in package 20, etc. Additional examples of components used in sensor module 30, including radiation shields and other components, may be found in U.S. Patent Nos. 8,829,454, 9,116,022, and 10,340,302, the entire contents of each of which are hereby incorporated by reference in their entirety and for all purposes.

[0034] Although the present invention has been described according to certain embodiments, other embodiments that are apparent to those of ordinary skill in the art, including embodiments that do not provide all of the features and advantages set forth herein, are also within the scope of the present invention. In addition, the various embodiments described above may be combined to provide further embodiments. In addition, certain features shown in the context of one embodiment may also be incorporated into other embodiments. Therefore, the scope of the present invention is limited only by reference to the appended claims.

Claims

1. An integrated device package, comprising: Package substrate; an integrated device die having active electronic circuitry, the integrated device die having a first side and a second side opposite the first side, the first side including pads electrically connected to the package substrate by bonding wires; A redistribution layer (RDL) stack disposed on a first side of the integrated device die, the RDL stack comprising an insulating layer and a conductive redistribution layer; and Passive electronic components, mounted and electrically connected to the RDL stack, wherein the passive electronic device assembly includes an interposer mounted to the RDL stack and one or more passive electronic devices mounted to the interposer, and Wherein, the one or more passive electronic components are located within a lateral footprint of the integrated device die and within a lateral footprint of the packaging substrate. 2 . The integrated device package of claim 1 , wherein the one or more passive electronic devices include one or more of a capacitor, an inductor, and a resistor. 3 . The integrated device package of claim 2 , wherein the one or more passive electronic devices include capacitors.

4. The integrated device package of any one of claims 2 to 3, wherein the passive electronic device components are mounted to the RDL stack by a conductive adhesive. 5 . The integrated device package of claim 1 , wherein the interposer comprises a first side and a second side opposite the first side, the first side being electrically connected to the package substrate through bonding wires. 6 . The integrated device package of claim 1 , further comprising a plurality of solder balls located between the interposer and the RDL stack to electrically connect the interposer and the RDL stack.

7. The integrated device package of claim 1 further comprising an active device die mounted to the interposer.

8. The integrated device package of claim 1 wherein a lateral footprint of the interposer is larger than a corresponding lateral footprint of the integrated device die.

9. The integrated device package according to claim 1, wherein: The RDL stack includes a first insulating repassivation layer disposed on the die and a conductive redistribution layer RDL disposed in a gap in the first insulating repassivation layer. 10 . The integrated device package of claim 9 , further comprising a second insulating repassivation layer disposed on the conductive RDL and an under bump metallization (UBM) layer disposed in a gap of the second insulating repassivation layer, the passive electronic device component being electrically connected to the UBM layer. 11 . The integrated device package of claim 10 , further comprising an insulating passivation layer and a plurality of conductive pads at a first side of the integrated device die, the plurality of conductive pads connected to the conductive RDL.

12. The integrated device package of claim 1, wherein the passive electronic device components are disposed over the integrated device die to be within a lateral footprint of the integrated device die.

13. The integrated device package of claim 1, wherein at least a portion of the passive electronic device components are disposed outside of a lateral footprint of the integrated device die.

14. The integrated device package of claim 1, wherein the second side of the integrated device die is mounted to the package substrate by an adhesive.

15. The integrated device package of claim 14, further comprising a molding compound disposed over the integrated device die and the passive electronic device components.

16. A sensor module comprising an imaging sensor assembly and an integrated device package as claimed in any one of claims 1 to 15, the integrated device package being mounted to the imaging sensor assembly.

17. The sensor module of claim 16, further comprising a radiation shield positioned between a sensor die of the imaging sensor assembly and the integrated device die.

18. A sensor module, comprising: Electronic devices, including: A component and a redistribution layer (RDL) stack disposed on a first side of the component, the RDL stack comprising an insulating layer and a conductive redistribution layer, the first side of the component comprising a pad electrically connected to a package substrate through a bonding wire, and Passive electronic device components mounted on and electrically connected to the RDL stack; wherein the passive electronic device assembly comprises an interposer mounted to the RDL stack and one or more passive electronic devices mounted to the interposer, wherein the one or more passive electronic devices are located within a lateral footprint of the RDL stack and within a lateral footprint of the packaging substrate; and An imaging sensor assembly to which the electronics are mounted.

19. The sensor module of claim 18, wherein the imaging sensor assembly comprises a sensor substrate and a sensor die mounted to the sensor substrate.

20. The sensor module of claim 19, wherein the element comprises an integrated device die.

21. The sensor module of claim 20, further comprising a radiation shield between the sensor die and the integrated device die.

22. The sensor module of claim 20 or 21, wherein the integrated device die is mounted to a packaging substrate, the integrated device die being electrically connected to the packaging substrate by wire bonds.

23. The sensor module of claim 20 or 21, further comprising a molding compound disposed over the integrated device die and the passive electronic device components.

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