Substrate processing apparatus including light receiving device and method of calibrating light receiving device

Abstract

An example of a substrate processing apparatus includes a chamber configured to contain a platform, a light receiving device configured to receive light within the chamber, and a substrate transport apparatus including a shaft and a rotating arm configured to rotate with rotation of the shaft and configured to provide a plurality of light beams having different light amounts to the light receiving device.

Description

Technical Field

[0001] Examples involving substrate processing equipment and calibration methods are described. Background Technology

[0002] For example, in the ALD process, plasma emission can be detected using Si photodiode sensors to monitor the synchronization between the RF-ON command output and plasma emission, or to monitor the intensity of plasma emission. However, due to the lack of a defense system for diagnosing the state of the photodiode sensor and the individual variability in the output of the photodiode sensor, it is impossible to determine the level based on the output value of the photodiode sensor. Summary of the Invention

[0003] Some examples described herein can solve the above problems. These examples can provide substrate processing equipment and calibration methods for optical receivers, which can determine the output level of the optical receiver.

[0004] In some examples, a substrate processing apparatus includes: a chamber configured to contain a platform; a light receiving device configured to receive light within the chamber; and a substrate conveying device including a shaft and a rotating arm configured to rotate with the shaft, and configured to provide a plurality of light beams with different light amounts to the light receiving device. Attached Figure Description

[0005] Figure 1 An example configuration of the substrate processing equipment is shown;

[0006] Figure 2 An example of the characteristics of an optical receiving device is shown;

[0007] Figure 3 A partial cross-sectional view of the substrate processing equipment is shown;

[0008] Figure 4A It is along Figure 3 A sectional view of line AA;

[0009] Figure 4B This is a sectional view of the axis based on another example;

[0010] Figure 5 This is a flowchart illustrating an example of a correction method;

[0011] Figure 6A This is an example of the output of a light receiving device;

[0012] Figure 6B This is an example of the output of a light receiving device;

[0013] Figure 6C This is an example of the output of a light receiving device;

[0014] Figure 7A The outputs of multiple optical receiving devices before calibration are shown;

[0015] Figure 7B The outputs of multiple calibrated optical receivers are shown;

[0016] Figure 8 This illustrates providing light from a rotating arm to a light receiving device;

[0017] Figure 9 The light-emitting chip is shown; and

[0018] Figure 10 The dual-chamber module and the light-emitting chip are shown. Detailed Implementation

[0019] The substrate processing apparatus and calibration method will be described with reference to the accompanying drawings. Identical or corresponding parts are indicated by the same reference numerals and their descriptions may be omitted.

[0020] Figure 1 This is a diagram illustrating an example configuration of a substrate processing apparatus. The substrate processing apparatus forms a four-chamber module (QCM), wherein four chamber modules are provided in chamber 10. The number of chamber modules is not particularly limited. According to one example, four chambers 12, 14, 16, and 18 are provided in chamber 10. For example, chambers 12, 14, 16, and 18 can be configured as reactor chambers. According to one example, each chamber is a plasma processing device.

[0021] Platforms 12a, 14a, 16a, and 18a are respectively disposed inside chambers 12, 14, 16, and 18. These platforms are, for example, sensors. Light receiving devices 12b, 14b, 16b, and 18b are respectively disposed outside chambers 12, 14, 16, and 18. According to one example, multiple light receiving devices are arranged in a one-to-one correspondence with multiple chambers. For example, light receiving devices 12b, 14b, 16b, and 18b can receive light within chambers 12, 14, 16, and 18 respectively through viewports of the chambers. According to one example, light receiving devices 12b, 14b, 16b, and 18b are silicon photodiode sensors.

[0022] A substrate transport device 20 is disposed within a chamber 10. According to one example, the substrate transport device 20 includes a shaft 20a and a rotating arm 20b that rotates with the shaft 20a. Figure 1 In the example, four rotating arms 20b fixed to the shaft 20a rotate with the rotation of the shaft 20a, which extends in a direction perpendicular to the paper. The substrate can be moved between the platforms by the substrate transfer device 20.

[0023] A wafer processing chamber (WHC) 30 is connected to chamber 10. A wafer transfer arm present in WHC 30 provides or removes a substrate from platforms 12a and 14a.

[0024] According to one example, the Processing Module Controller (PMC) 40 receives the outputs of optical receiving devices 12b, 14b, 16b, and 18b, controls the optical receiving devices 12b, 14b, 16b, and 18b, and controls the substrate transfer device 20. In this example, the Unique Platform Controller (UPC) 42 instructs the PMC 40 to operate each module, and the PMC 40 controls each module based on this instruction. According to another example, each module may be controlled by a controller different from the UPC 42 and the PMC 40.

[0025] Figure 2 This is a diagram illustrating an example of the relationship between the amount of light incident on a light receiver and its output voltage. According to this example, when the amount of incident light is 160 nW, the output of the light receiver varies by approximately 20% due to individual differences. Additionally, a linearity error of approximately 5% also occurs in one light receiver. Therefore, when light receivers 12b, 14b, 16b, and 18b are used without intervention, their outputs are practically unusable for level determination or for understanding the differences between the individual chambers.

[0026] Figure 3 yes Figure 1 A partial cross-sectional view of the substrate processing apparatus. Shaft 20a is a rotational shaft extending in the z-direction. The substrate transfer apparatus 20 can be moved in the positive z-direction and the negative z-direction by a drive mechanism provided inside or outside the chamber 10. For example, shaft 20a is formed with holes 20c and 20d. Hole 20c is a hole extending in shaft 20a substantially parallel to the z-axis. Hole 20d is a hole extending in shaft 20a substantially perpendicular to the z-axis and connected to hole 20c. According to one example, multiple holes 20d can be provided on the side of shaft 20a.

[0027] In this example, the light source 50 is located outside the chamber 12. The light source 50 can also be located inside the chamber 12. However, placing the light source 50 outside the chamber 12 facilitates its maintenance. For example, the light source 50 can be turned on and off under the control of the PMC 40. The light source 50 provides light to the holes 20c and 20d. According to one example, the light source 50 is connected to the shaft 20a via an optical fiber, thus providing light to the holes 20c and 20d. According to another example, a portion of the shaft has a cavity through which the light source can be inserted and removed; the light source is located within this cavity, thus also providing light to the holes 20c and 20d. According to yet another example, the light source can be positioned arbitrarily.

[0028] When the light source 50 is turned on, light is incident on the light receiving device through holes 20c and 20d. By rotating the light source 50 with the shaft 20a to emit light, or by repeatedly rotating the shaft 20a and emitting light from the light source 50, light can be incident on the light receiving devices 12b, 14b, 16b, and 18b.

[0029] Figure 4A It is along Figure 3 The image shows a cross-sectional view taken along line AA. Multiple holes 20d are provided on the side of shaft 20a, through which light from the light source passes. In this example, multiple holes 20d with different cross-sectional areas are provided. High-intensity light is emitted from the hole with the larger cross-sectional area, and low-intensity light is emitted from the hole with the smaller cross-sectional area. Figure 4A In the diagram, the light emitted from the four apertures 20d, namely La, Lb, Lc, and Ld, are represented by arrows. The thickness of the arrows indicates the magnitude of the light intensity. Since the cross-sectional areas of the light paths of La, Lb, Lc, and Ld increase in this order, the light intensities satisfy the relationship: La < Lb < Lc < Ld.

[0030] Figure 4B This is a cross-sectional view of the shaft based on another example. In this example, the four holes 20d have substantially the same cross-sectional area. The four holes 20d are provided with light-transmitting materials 20e, 20f, 20g, and 20h, each with different transmittances. The light-transmitting materials 20e, 20f, 20g, and 20h are, for example, ceramics. Light-transmitting material 20e has the lowest transmittance, followed by light-transmitting materials 20f, 20g, and 20h in that order. As a result, the light intensity satisfies the relationship La < Lb < Lc < Ld.

[0031] exist Figure 4A and 4B In the example, light emitted from a light source passes through the interior of axis 20a and is split into multiple beams of different intensities, which are then provided to a light receiving device. This is achieved by... Figure 4A and 4B By adjusting the shape or material of the shaft in different ways, multiple beams with different light intensities can be provided.

[0032] According to one example, a calibration method for multiple optical receivers includes: allowing light to be incident from a light source onto the multiple optical receivers; and subsequently performing system calibration such that when the multiple optical receivers receive light of the same quantity from a light source, the outputs of the multiple optical receivers are identical to each other. System calibration may also be referred to as scaling.

[0033] Figure 5This is a flowchart illustrating an example of a calibration method for an optical receiving device. First, in step S1, multiple light beams of different quantities or intensities are incident on optical receiving devices 12b, 14b, 16b, and 18b from the side of axis 20a in the manner described above. According to one example, light is provided continuously or intermittently as axis 20a rotates, thus multiple light beams of different intensities are sequentially incident on all optical receiving devices. For example, light beams La, Lb, Lc, and Ld are sequentially incident on optical receiving device 12b, on optical receiving device 14b, on optical receiving device 16b, and on optical receiving device 18b.

[0034] Then, as described above, even if light of the same intensity, La, Lb, Lc, and Ld, is incident on all optical receiving devices, the output of the optical receiving devices will vary due to the error of the optical receiving devices. Figure 6A This is a diagram illustrating examples of the outputs of the optical receiving devices 12b, 14b, 16b, and 18b obtained in step S1. It is clearly visible from this diagram that the outputs change relative to the same optical input due to variations in the characteristics of the optical receiving devices.

[0035] When such an output change is detected in step S1, the process proceeds to step S2. In step S2, the controllers, taking PMC40 and UPC42 as examples, perform system calibration so that the outputs of multiple light receiving devices that receive the same amount of light from a light source are identical to each other. Figure 6B This diagram illustrates how system calibration can make the outputs of multiple optical receiving devices identical. Through calibration in step S2, the outputs of multiple optical receiving devices receiving light with the same intensity can be made identical.

[0036] On the other hand, for example, when obtained in step S1 Figure 6B When the relationship is shown, such system calibration is naturally not required.

[0037] Subsequently, in step S3, the relationship between the optical input and output of the optical receiving device, whether calibrated or not, is stored as an initial log in, for example, in a controller or external storage device.

[0038] Subsequently, for example, after a certain period of time has elapsed since the substrate processing equipment was used to process or transport the substrate, the process proceeds to step S4. In step S4, light with the same intensity as during system calibration is incident from a light source onto multiple light receiving devices. For example, light La, Lb, Lc, and Ld are received sequentially by all the light receiving devices. Then, it is verified that the outputs of the multiple light receiving devices remain identical to each other. This verification can be performed by comparing the obtained outputs of the light receiving devices with the initial log stored in step S3.

[0039] When at least one of the outputs of the optical receiving device obtained in step S4 does not match the initial log, the process proceeds to step S5. Figure 6C This diagram illustrates an example of this mismatch. In this example, when light with the same amount of light as during system calibration is received, the outputs of optical receivers 12b, 14b, and 16b match the initial log, but the output of optical receiver 18b does not match the initial log. The optical receiver whose output does not match the initial log is called an output variation device. When an output variation device is present, it is determined whether the difference between the output of the output variation device and the initial log exceeds a threshold. In other words, it is determined whether the amount of output variation of the output variation device exceeds a threshold. For example, in... Figure 6C In the example, it is determined whether the output of the output changing device is within the range of the upper limit UL and the lower limit LL. When the output of the output changing device is within the range of the upper limit UL and the lower limit LL, the process proceeds to step S6, and the system is recalibrated so that the outputs of the multiple optical receiving devices are identical to each other. For example, calibration is performed to make the output of the output changing device match the initial log.

[0040] On the other hand, when the output change of the output changing device exceeds the threshold, an alarm is issued in step S7. Figure 6C In the example, an alarm is issued because the output of the optical receiver 18b, which is an output change device, is below the lower limit value LL.

[0041] The process ends without recalibration when the latest output value of the multiple optical receivers matches the initial log in step S4. Steps S4 through S7 can be performed periodically or after the end of a specific process. Confirmation of the necessity for periodic recalibration or alarms prevents the output of the optical receivers from changing over time relative to a constant input. The calibration and recalibration processes can be performed automatically by the controller.

[0042] By calibrating the outputs of multiple optical receivers in this way, the output level of the optical receivers can be determined, for example, in substrate processing involving plasma emission. For instance, it can be studied whether substantially identical plasmas are generated in multiple chambers, and whether plasmas with a predetermined range of emission intensities are generated in multiple chambers. When plasma with the expected emission intensity is not generated in a particular chamber, the processing conditions of the chamber can be changed to achieve plasma with the expected emission intensity. As an example, the high-frequency power can be adjusted, or the gas supplied to the chamber can be adjusted. According to another example, the output of the optical receivers can be fed back to the processing conditions of the substrate.

[0043] Figure 7A and 7BThis is a simple diagram illustrating how the outputs of multiple optical receivers are unified through calibration or recalibration. The symbol RC# indicates the reaction chamber number.

[0044] exist Figure 3 In one example, the light from the light source 50 is split into multiple beams by axis 20a. However, according to another example, the light from the light source is split at any part of the substrate conveying device, and multiple beams with different light intensities can be provided to the light receiving device. For example, the light from the light source can be provided to the light receiving device from a rotating arm.

[0045] Figure 8 This diagram illustrates the supply of light from rotating arms to a light receiving device. Multiple rotating arms 20b are formed of a light-transmitting material. Examples of light-transmitting materials include quartz or translucent ceramic.

[0046] Shaft 20a is provided with a hole 20c extending in a direction generally parallel to the z-axis and a plurality of holes 20d extending from the side of shaft 20a to the hole 20c. For example... Figure 4A As shown, the plurality of holes 20d disposed on the side of shaft 20a can be holes with different cross-sectional areas. According to another example, the plurality of holes 20d can also be disposed of with light-transmitting materials having different transmittances, such as… Figure 4B As shown.

[0047] Multiple rotating arms 20b can be arranged in a one-to-one correspondence with multiple holes 20d. For example, a rotating arm can be arranged near the outlet of one hole 20d. Light from the light source passes through the hole 20c and multiple holes 20d, and the multiple rotating arms emit light, thus providing light to multiple light receiving devices.

[0048] According to another example, light used for calibration or recalibration can be supplied from the light-emitting chip to the light-receiving device. Figure 9 This is a cross-sectional view of the light-emitting chip 60 and other components. According to one example, the light-emitting chip 60 includes fluorescent material, a battery, and a light-emitting device, or includes an LED to emit light. According to another example, the light-emitting chip 60 can be a teach pendant chip with LEDs mounted, used in an automated teach pendant system provided by CyberOpticals. According to one example, the light-emitting chip 60 provides multiple beams of light with different light quantities to multiple light receiving devices. The light-emitting chip 60 can be provided into or removed from a chamber using a transfer system for product chips.

[0049] The light-emitting chip 60 is placed on a platform in a specific chamber, and light is supplied to a light-receiving device inside the monitoring chamber. Then, the light-emitting chip 60 is placed on a platform in another chamber, and light is supplied to a light-receiving device inside the monitoring chamber. Thus, the movement of the light-emitting chip and the supply of reference light to the light-receiving devices are repeated in this manner, providing reference light from one light-emitting chip 60 to all light-receiving devices.

[0050] According to another example, a light-emitting chip 60 is placed on a rotating arm, and light is incident from the light-emitting chip onto multiple light-receiving devices by rotating the arm.

[0051] Figure 10 This diagram illustrates a dual-chamber module (DCM) 51 and a light-emitting chip 60. In the case of the DCM 51, the light-emitting chip 60 is placed on a platform 52a in chamber 52, and reference light is provided from the light-emitting chip 60 to a light-receiving device 52b. Alternatively, the light-emitting chip 60 is placed on a platform 54a in chamber 54, and reference light is provided from the light-emitting chip 60 to the light-receiving device 54b.

[0052] For example, Figure 5 The process for calibrating or recalibrating the optical receiving device is applied in the same way to the cases where reference light is provided from the substrate transmission device to the optical receiving device and to the cases where reference light is provided from the light-emitting wafer to the optical receiving device.

Claims

1. A substrate processing apparatus, comprising: Multiple chambers, each configured to contain a platform; A plurality of optical receiving devices are provided one-to-one with the cavity, and the optical receiving devices are configured to receive light from the cavity; The substrate conveying device disposed inside the cavity includes a shaft and a rotating arm configured to rotate with the shaft, and is configured to provide multiple light beams with different light amounts to the light receiving device. as well as The light source has multiple holes on the side of the shaft, the holes being configured to allow light from the light source to pass through. The plurality of holes each have a different cross-sectional area.

2. A substrate processing apparatus, comprising: Multiple chambers, each configured to contain a platform; A plurality of optical receiving devices are provided one-to-one with the cavity, and the optical receiving devices are configured to receive light from the cavity; The substrate conveying device disposed inside the cavity includes a shaft and a rotating arm configured to rotate with the shaft, and is configured to provide multiple light beams with different light amounts to the light receiving device. as well as The light source has multiple holes on the side of the shaft, the holes being configured to allow light from the light source to pass through. The plurality of holes are each provided with a light-transmitting material with a different light transmittance.

3. The substrate processing apparatus according to claim 1 or 2, wherein, The light source is located outside the chamber.

4. The substrate processing apparatus according to claim 1 or 2, further comprising: light source; as well as Multiple rotating arms, among which, The plurality of rotating arms are formed of a light-transmitting material. A plurality of holes are provided on the side surface of the shaft, the plurality of holes being configured to allow light from the light source to pass through, and The plurality of rotating arms are arranged in a one-to-one correspondence with the plurality of holes.

5. The substrate processing apparatus according to claim 4, wherein the plurality of holes have different cross-sectional areas.

6. The substrate processing apparatus according to claim 4, wherein the plurality of holes are provided with light-transmitting materials having different light transmittances.

7. The substrate processing apparatus according to claim 4, wherein the light source is disposed outside the chamber.

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