Teaching method and processing system for a delivery device

Abstract

The present application provides a teaching method of a conveyance device. A teaching method of a conveyance device according to an embodiment of the present application is a teaching method of a conveyance device having a substrate holding portion that holds a substrate and a first detection portion provided to the substrate holding portion, and includes: a step of detecting a height position of a detection object with the first detection portion while moving the substrate holding portion in a vertical direction, and setting a teaching position of the substrate holding portion in the vertical direction based on the detected height position of the detection object; and a step of setting a teaching position of the substrate holding portion in a horizontal direction based on a horizontal position of the substrate holding portion when the substrate holding portion is detected by a second detection portion provided at a position different from the conveyance device while moving the substrate holding portion in the horizontal direction. According to the present application, the time required for teaching operation of the conveyance device can be shortened.

Description

TECHNICAL FIELD

[0001] The present application relates to a teaching method of a transport device and a processing system. BACKGROUND

[0002] In manufacturing a semiconductor device, a processing system having a transport device that transports a substrate to a plurality of components is used. In the processing system, in order to transport the substrate with high accuracy in each component, a teaching operation of the transport device is performed.

[0003] As the teaching operation of the transport device, a method is known in which, after a rough position alignment is performed, a substrate is transported to an aligner to measure an eccentricity amount and an eccentricity direction, and a provisional position coordinate is corrected based on the eccentricity amount and the eccentricity direction, and an accurate position coordinate is formed (for example, refer to Patent Literature 1).

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Application Laid-Open No. 2000-127069 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] The present application provides a technology capable of shortening a time required for a teaching operation of a transport device.

[0009] TECHNICAL MEANS FOR SOLVING THE PROBLEMS

[0010] A teaching method of a transport device of one embodiment of the present application is a teaching method of a transport device having a substrate holding portion that holds a substrate and a first detection portion provided to the substrate holding portion, and includes a step of detecting a height position of a detection object with the first detection portion while moving the substrate holding portion in a vertical direction, and setting a teaching position of the substrate holding portion in the vertical direction based on the detected height position of the detection object; and a step of setting a teaching position of the substrate holding portion in a horizontal direction based on a horizontal position of the substrate holding portion when the substrate holding portion is detected by a second detection portion provided at a position different from the transport device while moving the substrate holding portion in the horizontal direction.

[0011] EFFECTS OF THE INVENTION

[0012] According to the present application, a time required for a teaching operation of a transport device can be shortened. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a diagram showing a schematic configuration of a processing system of an embodiment.

[0014] Figure 2 FIG. 1 is a diagram showing an example of a cross section of a load port.

[0015] Figure 3 FIG. 2 is a diagram showing an example of a cross section of an aligner.

[0016] Figure 4 FIG. 3 is a diagram showing an example of a cross section of a load lock assembly.

[0017] Figure 5 FIG. 4 is a diagram showing an example of a hardware structure of a control device.

[0018] Figure 6 FIG. 5 is a diagram showing an example of an outline structure of a picker.

[0019] Figure 7 FIG. 6 is a flowchart showing a teaching method of a transport device according to the embodiment.

[0020] Figure 8 FIG. 7 is a flowchart showing an example of a first teaching step.

[0021] Figure 9 FIG. 8 is a diagram for explaining a step of teaching a position in a tentative vertical direction.

[0022] Figure 10 FIG. 9 is a diagram for explaining a step of determining a teaching position in a horizontal direction.

[0023] Figure 11 FIG. 10 is a flowchart for explaining a step of determining a teaching position in a vertical direction.

[0024] Figure 12 FIG. 11 is a diagram showing a relationship between a height of a picker and a suction pressure.

[0025] Figure 13 FIG. 12 is a diagram showing a positional relationship between a picker and a wafer.

[0026] Figure 14 FIG. 13 is a diagram for explaining an example of a second teaching step.

[0027] Explanation of Reference Numerals

[0028] 31 transport device

[0029] 34 picker

[0030] 81 to 83 ejection detection sensor

[0031] 84 mapping sensor

[0032] W wafer DETAILED DESCRIPTION

[0033] Hereinafter, non-limiting example embodiments of the present application will be described with reference to the accompanying drawings. In all the drawings, like parts or components are designated with like reference numerals, and repetitive explanation will be omitted.

[0034] [Processing system]

[0035] Referring to Figures 1-5 An example of a processing system to which a teaching method of the embodiments is applied will be described. Figure 1 is a diagram showing a schematic configuration of a processing system of the embodiments. Figure 2 is a diagram showing an example of a cross section of a load port. Figure 3 is a diagram showing an example of a cross section of an aligner. Figure 4 is a diagram showing an example of a cross section of a load lock assembly. Figure 5 is a diagram showing an example of a hardware configuration of a control device.

[0036] The processing system 1 includes a transfer assembly 10, process assemblies 20, a load assembly 30, load lock assemblies 40, and a control device 100. In the present embodiment, four process assemblies 20 are provided, and two load lock assemblies 40 are provided, but the number of the process assemblies 20 and the load lock assemblies 40 is not limited thereto. The transfer assembly 10, the process assemblies 20, the load assembly 30, and the load lock assemblies 40 constitute a processing device.

[0037] The transfer assembly 10 has a substantially hexagonal shape in plan view. The transfer assembly 10 is constituted by a vacuum chamber, and has a transport device 11 disposed inside. The transport device 11 is formed by a multi-joint arm that can be extended and contracted, raised and lowered, and rotated, at a position that can access the process assemblies 20 and the load lock assemblies 40. The transport device 11 has two pickers 12 that can be independently extended and contracted in opposite directions from each other, and can sequentially transport two wafers W. Furthermore, the transport device 11 is not limited to the structure shown in the drawing, as long as it can transport wafers W between the process assemblies 20 and the load lock assemblies 40. Figure 1

[0038] The process assemblies 20 are disposed in a radial manner around the transfer assembly 10 and are connected to the transfer assembly 10. The process assemblies 20 are constituted by processing chambers, and have cylindrical placement stages 21 on which wafers W are placed inside. In the process assemblies 20, various semiconductor manufacturing processes are performed on wafers W placed on the placement stages 21. The semiconductor manufacturing processes include, for example, various process treatments for manufacturing a semiconductor, such as film formation processing, etching processing, heat treatment, and the like. The transfer assembly 10 and the process assemblies 20 are divided by a gate valve 22 that can be opened and closed.

[0039] ​The load module 30 is disposed opposite to the transfer module 10. The load module 30 is a rectangular parallelepiped, and is an atmospheric transfer chamber maintained as an atmospheric atmosphere. A transfer device 31 is disposed in the load module 30. The transfer device 31 is supported so as to be slidable on a guide rail 32 disposed so as to extend along a center portion in the load module 30 in a long direction. A linear motor (not shown) having an encoder is built in the guide rail 32, for example, and the transfer device 31 is moved along the guide rail 32 by driving the linear motor.

[0040] The transfer device 31 has two multi-joint arms 33 disposed in two stages of upper and lower. A picker 34 formed in a two-fork shape is attached to a front end of each multi-joint arm 33. The wafer W can be held on each picker 34. Each multi-joint arm 33 is formed so as to be able to stretch and contract in a radial direction from a center and to be able to be raised and lowered. The stretching and contracting operation of each multi-joint arm 33 is independently controllable. Each rotation axis of the multi-joint arm 33 is coaxially rotatably coupled to a base 35, and rotates as one body with respect to the rotation direction of the base 35, for example. The guide rail 32 and the multi-joint arm 33 function as a drive mechanism that moves the picker 34. The transfer device 31 transfers the wafer W between the load lock module 40, the transfer container 51, and the aligner 60 described later. In addition, the transfer device 31 can transfer the wafer W between the load lock module 40, the transfer container 51, and the aligner 60, and is not limited to Figure 1 the structure shown.

[0041] On one side surface along the long direction of the load module 30, two load lock modules 40 are connected. On the other hand, on the other side surface along the long direction of the load module 30, one or a plurality of introduction ports 36 for introducing the wafer W are provided. In the example shown, three introduction ports 36 are provided. An openable and closable door 37 is provided in each introduction port 36. In addition, a load port 50 is provided so as to correspond to each introduction port 36. The transfer container 51 that accommodates and transfers the wafer W is placed in the load port 50. The transfer container 51 can be a FOUP (Front-Opening Unified Pod), and a plurality of (for example, 25) wafers W are held and accommodated in multiple layers with a prescribed interval. A drive mechanism 38 of the openable and closable door 37 that is able to be raised and lowered and advanced and retreated in order to open and close the transfer container 51 is provided in each load port 50. Figure 2 ).

[0042] A ejection detection sensor 81 is provided in each introduction port 36 of the load module 30. Figure 2). The out-of-position detection sensor 81 detects whether or not the wafer W placed in the transport container 51 of the load port 50 is out of position, and sends the detection result to the control device 100. In the present embodiment, the out-of-position detection sensor 81 includes a light projecting portion 81a and a light receiving portion 81b which are arranged in opposition to each other in the vertical direction with the introduction port 36 interposed therebetween. The light projecting portion 81a is provided below the introduction port 36, and projects a detection light toward the light receiving portion 81b. The light receiving portion 81b is provided above the introduction port 36, and receives the detection light projected by the light projecting portion 81a. The out-of-position detection sensor 81 judges that the wafer W is present between the light projecting portion 81a and the light receiving portion 81b in the case where the detection light projected by the light projecting portion 81a is not received by the light receiving portion 81b, and sends information indicating that the wafer W is out of position to the control device 100. Further, the positional relationship between the light projecting portion 81a and the light receiving portion 81b can be reversed.

[0043] An aligner 60 is connected to one side along the short side of the load assembly 30. The aligner 60 performs alignment of the wafer W. The aligner 60 has a rotary table 62 which is rotated by a driving motor 61 Figure 3 ). The rotary table 62 is rotated in a state where the wafer W is placed on the upper surface. The rotary table 62 has a diameter smaller than the diameter of the wafer W. On the outer periphery of the rotary table 62, an optical sensor 63 which optically detects the peripheral edge portion of the wafer W is provided. The aligner 60 detects the center position of the wafer W and the direction of the notch with respect to the center of the wafer W by the optical sensor 63, and performs alignment of the wafer W in the load lock assembly 40 in such a manner that the center position of the wafer W and the direction of the notch become a prescribed position and a prescribed direction.

[0044] An out-of-position detection sensor 82 is provided at the connection portion of the load assembly 30 with the aligner 60 Figure 3 ). The out-of-position detection sensor 82 detects whether or not the wafer W placed on the rotary table 62 in the aligner 60 is out of position, and sends the detection result to the control device 100. In the present embodiment, the out-of-position detection sensor 82 includes a light projecting portion 82a and a light receiving portion 82b which are arranged in opposition to each other in the vertical direction with the connection portion interposed therebetween. The light projecting portion 82a is provided below the connection portion, and projects a detection light toward the light receiving portion 82b. The light receiving portion 82b is provided above the connection portion, and receives the detection light projected by the light projecting portion 82a. The out-of-position detection sensor 82 judges that the wafer W is present between the light projecting portion 82a and the light receiving portion 82b in the case where the detection light projected by the light projecting portion 82a is not received by the light receiving portion 82b, and sends information indicating that the wafer W is out of position to the control device 100. Further, the positional relationship between the light projecting portion 82a and the light receiving portion 82b can be reversed.

[0045] A load lock chamber 40 is provided between the transfer chamber 10 and the load chamber 30. The load lock chamber 40 is composed of an internal pressure variable chamber capable of switching the inside between vacuum and atmospheric pressure, and has a cylindrical wafer mounting table 41 on which the wafer W is mounted. The wafer mounting table 41 has a smaller diameter than the diameter of the wafer W. The load lock chamber 40 maintains the inside at atmospheric pressure when the wafer W is fed from the load chamber 30 to the transfer chamber 10, and depressurizes the inside after receiving the wafer W from the load chamber 30 and feeds the wafer W to the transfer chamber 10. In addition, when the wafer W is fed from the transfer chamber 10 to the load chamber 30, the inside is maintained at vacuum, and the inside is pressurized to atmospheric pressure after receiving the wafer W from the transfer chamber 10 and feeds the wafer W to the load chamber 30. The load lock chamber 40 and the transfer chamber 10 are separated by a gate valve 42 which can be opened and closed. In addition, the load lock chamber 40 and the load chamber 30 are separated by a gate valve 43 which can be opened and closed.

[0046] A detachment detection sensor 83 is provided at the connection portion of the load chamber 30 and the load lock chamber 40. Figure 4 The detachment detection sensor 83 detects whether the wafer W mounted on the wafer mounting table 41 in the load lock chamber 40 is detached, and transmits the detection result to the control device 100. In the present embodiment, the detachment detection sensor 83 includes a light projecting portion 83a and a light receiving portion 83b which are disposed in opposition to each other in the vertical direction sandwiching the connection portion. The light projecting portion 83a is provided below the connection portion and irradiates the light receiving portion 83b with detection light. The light receiving portion 83b is provided above the connection portion and receives the detection light irradiated by the light projecting portion 83a. The detachment detection sensor 83 judges that the wafer W is present between the light projecting portion 83a and the light receiving portion 83b when the detection light irradiated by the light projecting portion 83a is not received by the light receiving portion 83b, and transmits information indicating detachment of the wafer W to the control device 100. In addition, the positional relationship of the light projecting portion 83a and the light receiving portion 83b can be reversed.

[0047] The control device 100 controls the operation of each constituent element of the processing system 1. The control device 100 is connected to the load lock chamber 40, the transfer chamber 10, the load chamber 30, the wafer mounting table 41, the detachment detection sensor 83, and the like, and controls the operation of each constituent element. Figure 5A computer is shown, which has a drive device 101, an auxiliary storage device 102, a memory device 103, a CPU 104, an interface device 105, and the like, which are connected to one another by a bus B. A program for realizing processing in the control device 100 is provided by a recording medium 106 such as a CD-ROM. When the recording medium 106 in which the program is stored is set to the drive device 101, the program is installed in the auxiliary storage device 102 from the recording medium 106 via the drive device 101. However, the installation of the program is not necessarily performed by the recording medium 106, but can be downloaded from another computer via a network. The auxiliary storage device 102 stores necessary data such as the installed program, a scenario, and the like. The memory device 103 reads and stores the program from the auxiliary storage device 102 in the case where there is an instruction to start the program. The CPU 104 implements the functions of the processing system 1 according to the program stored in the memory device 103. The interface device 105 is used as an interface for connecting to a network.

[0048] 〔Pickup〕

[0049] With reference to Figure 6 An example of the pickup 34 of the conveyance device 31 will be described. Figure 6 is a view showing an example of the schematic structure of the pickup 34.

[0050] The pickup 34 includes a base portion 34a, a front end portion 34b, a claw portion 34c, and an exhaust path 34d. The base portion 34a is attached to the multi-joint arm 33. The front end portion 34b extends in a substantially circular arc shape from the base portion 34a toward the advancing direction of the pickup 34 to be formed. The claw portion 34c is protrusively formed toward the center portion of the area (hereinafter referred to as "wafer holding area") surrounded by the base portion 34a and the front end portion 34b. Four claw portions 34c are arranged with intervals from one another along the circumferential direction of the wafer holding area. An attraction hole 34e is formed in the upper portion of the claw portion 34c, and the peripheral edge portion of the lower surface of the wafer W is suction-held on the claw portion 34c in a manner to close the attraction hole 34e. The exhaust path 34d is formed in the base portion 34a and the front end portion 34b to constitute an attraction path. One end of the exhaust path 34d is connected to the attraction hole 34e of each claw portion 34c, and the other end is in communication with an exhaust pipe 34f constituting an attraction path connected to the pickup 34.

[0051] A pressure sensor 34g as a pressure detecting section and a valve 34h are inserted in the exhaust pipe 34f. The pressure sensor 34g detects the pressure (hereinafter referred to as "suction pressure") in the exhaust pipe 34f and sends a signal corresponding to the detected pressure to the control device 100. The exhaust device 34i is connected to the downstream side of the valve 34h of the exhaust pipe 34f. The exhaust device 34i includes a regulator, a vacuum pump, and the like, and sucks the inside of the exhaust passage 34d and the exhaust pipe 34f while adjusting the pressure. The valve 34h is controlled to be opened and closed in the following manner, that is, it is opened during the teaching method of the transport device 31 described later, or from just before the transport device 31 receives the wafer W from one module until just after the wafer W is placed on another module, and it is closed during other periods. Thus, suction is performed from the suction hole 34e during the teaching operation of the transport device 31 and from just before the transport device 31 holds the wafer W until just after the wafer W is sent away.

[0052] A mapping sensor 84 is provided at the front end of the front end portion 34b of the picker 34. The mapping sensor 84 detects the presence or absence and the height position of the wafer W placed in the transport container 51 of the load port 50 and sends the detection result to the control device 100. In addition, the mapping sensor 84 detects the presence or absence and the height position of the wafer W placed on the stage 41 in the load lock module 40 and the wafer W placed on the rotary stage 62 in the aligner 60 and sends the detection result to the control device 100. In the present embodiment, the mapping sensor 84 includes a light projecting section 84a and a light receiving section 84b which are disposed opposite to each other in the horizontal direction. The light projecting section 84a is provided at the front end of one of the front end portions 34b of the picker 34 and irradiates the light receiving section 84b with detection light. The light receiving section 84b is provided at the front end of the other of the front end portions 34b of the picker 34 and receives the detection light irradiated from the light projecting section 84a. The mapping sensor 84 judges that there is the wafer W between the light projecting section 84a and the light receiving section 84b in the case where the detection light irradiated from the light projecting section 84a is not received by the light receiving section 84b and sends information indicating the presence of the wafer W to the control device 100. Further, the positional relationship between the light projecting section 84a and the light receiving section 84b can be reversed.

[0053] 〔Teaching method of transport device〕

[0054] Reference Figures 7-14 An example of the teaching method of the transport device 31 will be described. The teaching method of the transport device 31 of the present embodiment is a method in which the control device 100 controls the operation of each constituent element of the processing system 1 and sets the teaching position of the transport device 31. In the present embodiment, the case where the teaching position of the transport device 31 with respect to the load port 50 is set will be described, and the same applies to the case where the teaching position of the transport device 31 with respect to the load lock module 40 or the aligner 60 is set.

[0055] The teaching method for the conveying device 31 of the embodiment is, for example, performed after maintaining the object to be fed into the wafer W via the conveying device 31, following the replacement of the conveying device 31 or its components during the startup of the processing system 1. Furthermore, components of the conveying device 31 can include, for example, a multi-joint arm 33 and a pickup 34. Additionally, objects to be fed into the wafer W via the conveying device 31 can include, for example, a load locking assembly 40, a loading port 50, and an alignment device 60.

[0056] Figure 7 This is a flowchart illustrating the teaching method of the conveying device 31 according to the embodiment. The teaching method of the conveying device 31 according to the embodiment includes a first teaching step S1 and a second teaching step S2. The first teaching step S1 is a step of setting a teaching position for the conveying device 31. The second teaching step S2 is a step performed after the first teaching step S1, and is a step of correcting the teaching position of the conveying device 31 set in the first teaching step S1 to improve accuracy.

[0057] Reference Figure 8 The first teaching step S1 will be explained. Figure 8 This is a flowchart illustrating an example of the first teaching step S1. The first teaching step S1 includes: a first step S11 of tentatively determining the teaching position in the vertical direction, a second step S12 of determining the teaching position in the horizontal direction, and a third step S13 of determining the teaching position in the vertical direction.

[0058] Step S11 includes moving the pickup 34 in the vertical direction while detecting the height position of the wafer W using the mapping sensor 84, and temporarily setting a teaching position of the pickup 34 in the vertical direction based on the detected height position of the wafer W. Step S11 may also include storing the temporary teaching position in, for example, an auxiliary storage device 102.

[0059] Figure 9 This is a diagram illustrating the steps (step 1 S11) for setting a teaching position in the provisional vertical direction. Figure 9 (a) and Figure 9 (b) in the figure shows a cross-sectional view and a perspective view showing the positional relationship between the wafer W in the transport container 51 and the pickup 34, respectively.

[0060] In the present embodiment, the control device 100 controls the transport device 31 to move the pickup 34 up and down while approaching the wafer W including the height position of the wafer W. That is, the control device 100 repeatedly performs the operation of approaching the pickup 34 to the wafer W, the operation of lowering the pickup 34 including the height position of the wafer W, the operation of approaching the pickup 34 to the wafer W, and the operation of raising the pickup 34 including the height position of the wafer W. Also, the control device 100 stores the height position of the pickup 34 when the detection light irradiated from the light projecting portion 84a of the mapping sensor 84 to the light receiving portion 84b is blocked by the wafer W as the position of the wafer W (the teaching position of the pickup 34 in the height direction) in the auxiliary storage device 102. Further, in Figure 9 In (b) of FIG. 8, the pickup 34 located at the raised position is indicated by a solid line, the pickup 34 located at the lowered position is indicated by a broken line, and the detection light is indicated by a dotted line.

[0061] The second step S12 is executed after the first step Sll. However, the second step S12 can be executed before the first step Sll. The second step S12 includes the operation of determining the teaching position of the pickup 34 in the horizontal direction based on the horizontal position of the pickup 34 when the pickup 34 is detected by the ejection detection sensor 81 provided to the load port 50 while moving the pickup 34 in the horizontal direction. The second step S12 can also include the operation of storing the determined teaching position in, for example, the auxiliary storage device 102.

[0062] Figure 10 FIG. 9 is a view for explaining the step (the second step S12) of determining the teaching position in the horizontal direction. Figure 10 (a) of FIG. 10 and Figure 10 (b) of FIG. 10 are a sectional view and a perspective view, respectively, indicating the positional relationship between the ejection detection sensor 81 provided to the load port 50 and the pickup 34.

[0063] In the present embodiment, the control device 100 controls the conveyance device 31 to move the pickup 34 in the horizontal direction including the position where the detection light irradiated from the light projecting section 81a of the dropout detection sensor 81 toward the light receiving section 81b is blocked and the position where the detection light is not blocked. The position where the detection light is blocked is, for example, the base section 34a and the front end section 34b of the pickup 34. The position where the detection light is not blocked is, for example, a hole (not shown) provided through the base section 34a of the pickup 34 and the wafer holding region of the pickup 34. Also, the control device 100 determines the teaching position of the pickup 34 in the horizontal direction based on the position of the pickup 34 at which the light amount of the detection light received by the light receiving section 81b indicates a prescribed change, and stores the determined teaching position in the auxiliary storage device 102. More specifically, the control device 100 determines the teaching position of the pickup 34 in the horizontal direction based on the position of the pickup 34 at which the light amount of the detection light indicates a prescribed change and the positional relationship between the dropout detection sensor 81 and the center of the wafer W in the conveyance container 51. The positional relationship between the dropout detection sensor 81 and the center of the wafer W in the conveyance container 51 is a designed interval, which is, for example, stored in advance in the auxiliary storage device 102. Further, in (b) of FIG. 10, the pickup 34 located at the position where the detection light is not blocked is indicated by a solid line, the position of the pickup 34 when moved in the horizontal direction with respect to the position is indicated by a broken line, and the detection light is indicated by a dotted line. Figure 10

[0064] Step 3 S13 is executed after Step 2 S12. Step 3 S13 includes an action of determining the teaching position of the pickup 34 in the vertical direction tentatively determined in Step 1 S11. Step 3 S13 can also include an action of storing the determined teaching position in, for example, the auxiliary storage device 102.

[0065] Figure 11 is a flowchart for explaining Step (Step 3 S13) of determining the teaching position in the vertical direction. Step 3 S13 includes Steps S131 to S136.

[0066] In Step S131, the control device 100 places the conveyance container 51 in which the wafer W is accommodated on the load port 50. However, in the case where Step 3 S13 is executed after Step 2 S12, the conveyance container 51 placed on the load port 50 in Step 2 S12 can be used, in which case Step S131 can be omitted.

[0067] ​In step S132, the control device 100 moves the pickup 34 of the transport device 31 to a position below the wafer W, with reference to the teaching position in the vertical direction tentatively determined in the first step Sll and the teaching position in the horizontal direction determined in the second step S12. At this time, the multi-joint arm 33 of the transport device 31 becomes in an extended state.

[0068] In step S133, the control device 100 starts suction in the exhaust passage 34d and the exhaust pipe 34f by opening the valve 34h interposed in the exhaust pipe 34f. However, the timing at which suction in the exhaust passage 34d and the exhaust pipe 34f is started is not limited to this, and for example, suction in the exhaust passage 34d and the exhaust pipe 34f can be started before the pickup 34 is moved to the position below the wafer W, or during movement of the pickup 34 to the position below the wafer W.

[0069] In step S134, the control device 100 moves the pickup 34 upward by a prescribed distance (for example, 0.1 mm) and then stops, with suction in the exhaust passage 34d and the exhaust pipe 34f being continued. As a result, the distance between the upper surface of the pickup 34 and the lower surface of the wafer W becomes shorter.

[0070] In step S135, the control device 100 determines whether the wafer W is adsorbed to the pickup 34. For example, the control device 100 determines whether the wafer W is adsorbed to the pickup 34 based on whether the adsorption pressure detected by the pressure sensor 34g reaches below a prescribed threshold within a prescribed time. Specifically, in a case where the adsorption pressure reaches below the prescribed threshold within the prescribed time, the control device 100 determines that the wafer W is adsorbed to the pickup 34. On the other hand, in a case where the adsorption pressure does not reach below the prescribed threshold within the prescribed time, the control device 100 determines that the wafer W is not adsorbed to the pickup 34. The prescribed time is a time required until the adsorption pressure detected by the pressure sensor 34g becomes substantially constant, for example. Further, for example, the control device 100 can determine whether the wafer W is adsorbed to the pickup 34 based on whether the amount of change in the adsorption pressure when the pickup 34 is moved upward by a prescribed distance is above a prescribed threshold from the adsorption pressure when the pickup 34 is positioned below the wafer W. Specifically, in a case where the amount of change in the adsorption pressure is above the prescribed threshold, the control device 100 determines that the wafer W is adsorbed to the pickup 34. On the other hand, in a case where the amount of change in the adsorption pressure is below the prescribed threshold, the control device 100 determines that the wafer W is not adsorbed to the pickup 34. Further, for example, in a case where the transport device 31 has a controller capable of determining whether the wafer W is adsorbed to the pickup 34 based on the adsorption pressure, the control device 100 can determine whether the wafer W is adsorbed to the pickup 34 based on the determination result of the controller. Specifically, in a case where the controller determines that the wafer W is adsorbed to the pickup 34, the control device 100 receives the determination result of the controller and determines that the wafer W is adsorbed to the pickup 34. On the other hand, in a case where the controller determines that the wafer W is not adsorbed to the pickup 34, the control device 100 receives the determination result of the controller and determines that the wafer W is not adsorbed to the pickup 34.

[0071] In a case where it is determined in step S135 that the wafer W is not adsorbed to the pickup 34, the control device 100 determines that the lower surface of the wafer W is not in contact with the upper surface of the pickup 34, and returns the process to step S134. That is, the control device 100 intermittently moves the pickup 34 upward until the wafer W is adsorbed to the pickup 34. On the other hand, in a case where it is determined in step S135 that the wafer W is adsorbed to the pickup 34, the control device 100 determines that the lower surface of the wafer W is in contact with the upper surface of the pickup 34, and advances the process to step S136.

[0072] In step S136, the position of the pickup 34 at the time when it is determined in step S135 that the lower surface of the wafer W is in contact with the upper surface of the pickup 34 (hereinafter referred to as "current position") is stored in the auxiliary storage device 102 as the teaching position of the pickup 34 in the vertical direction, and the process ends.

[0073] The teaching position in the vertical direction of the conveying device 31 can be determined through the above steps S131 to S136.

[0074] As explained above, in step S13, the teaching position of the conveying device 31 in the vertical direction is determined based on the adsorption pressure when the pickup 34, which attracts and holds the wafer W, moves upward from below the wafer W. Therefore, since position detection based on operator visual inspection is not required, inconsistencies in the teaching accuracy of the conveying device 31 in the vertical direction due to operator skill levels can be suppressed. Furthermore, the time required for teaching the conveying device 31 can be reduced. Additionally, since no special teaching fixture is needed, operator training is easier, thus reducing teaching costs.

[0075] Furthermore, in step S13, with the articulated arm 33 extended, the vertical position of the upper surface of the pickup 34 in contact with the lower surface of the wafer W is detected. This helps to suppress the reduction in teaching accuracy caused by the bending of the pickup 34 due to its own weight when the articulated arm 33 is extended.

[0076] Next, the relationship between the height of the pickup 34 and the adsorption pressure in step S13 will be explained. Figure 12 This is a graph showing the relationship between the height of the pickup 34 and the adsorption pressure. The vertical axis represents the adsorption pressure detected by the pressure sensor 34g, and the horizontal axis represents the position of the pickup 34 in the height direction (hereinafter referred to as "Z-axis height"). Figure 13 This is a diagram showing the positional relationship between the pickup 34 and the chip W. Figure 13 In the text, (a) to (c) represent respectively Figure 12 The positional relationship between the pickup 34 and the chip W when the Z-axis height is Z1 to Z3.

[0077] like Figure 13 As shown in (a), with a Z-axis height of Z1, the pickup 34 separates from the wafer W, and the suction hole 34e of the pickup 34 opens, thus... Figure 12 The adsorption pressure shown increases.

[0078] like Figure 13 As shown in (b), when the Z-axis height is Z2, similarly to the case where the Z-axis height is Z1, the pickup 34 separates from the wafer W, and the suction hole 34e of the pickup 34 opens, therefore... Figure 12 The adsorption pressure shown is higher.

[0079] like Figure 13As shown in (c) of FIG. 6, when the Z-axis height is Z3, the upper surface of the pickup 34 comes into contact with the lower surface of the wafer W, and the suction hole 34e of the pickup 34 is closed, as shown in (d) of FIG. 6. Figure 12 The adsorption pressure is reduced as shown in (e) of FIG. 6.

[0080] In this way, the adsorption pressure detected by the pressure sensor 34g changes before and after the upper surface of the pickup 34 comes into contact with the lower surface of the wafer W.

[0081] In the present embodiment, as shown in (c) of FIG. 6, the adsorption pressure at the position Z3 at which the upper surface of the pickup 34 comes into contact with the lower surface of the wafer W is set as the threshold value, which is greater than the adsorption pressure at the positions Zl and Z2 at which the pickup 34 is separated from the wafer W. Further, when the adsorption pressure detected by the pressure sensor 34g is equal to or less than the threshold value, the control device 100 determines that the upper surface of the pickup 34 is in contact with the lower surface of the wafer W, and stores the current position as the reference position in the auxiliary storage device 102 or the like. Figure 12

[0082] Referring to Figure 14 , the second teaching step S2 will be described. Figure 14 is a view for explaining an example of the second teaching step S2.

[0083] First, the wafer W is accurately aligned and housed in a manual manner so that the center of the wafer W coincides with a prescribed position, i.e., a reference position Pl, in the transport container 51 (see (a) of FIG. 7). In the present embodiment, the first slot, which is the lowermost layer, for example, among the 25 slots of the transport container 51 is prescribed as the prescribed position, and the wafer W is accurately aligned with the first slot and housed. Figure 14 Next, the control device 100 drives the transport device 31 with the teaching position relative to the load port 50 determined in the first teaching step Sl as a reference, and causes the pickup 34 to enter the transport container 51 and hold the wafer W (see (b) of FIG. 7).

[0084] Figure 14 Next, the control device 100 controls the transport device 31 to cause the pickup 34 holding the wafer W in the state to enter the aligner 60, and places the wafer W on the rotary table 62 of the aligner 60 (see (c) of FIG. 7).

[0085] Next, the control device 100 rotates the wafer W placed on the rotary table 62, and calculates the eccentricity Dr and the eccentric direction of the wafer W based on the value detected by the optical sensor 63 while the wafer W is being rotated (see (d) of FIG. 7). Figure 14

[0086] Next, the control device 100 rotates the wafer W placed on the rotary table 62, and calculates the eccentricity Dr and the eccentric direction of the wafer W based on the value detected by the optical sensor 63 while the wafer W is being rotated (see (d) of FIG. 7). Figure 14

[0087] ​​​​Next, the control device 100 corrects the taught position (refer to) based on the calculated eccentricity Δr and eccentricity direction. Figure 14 (e)). More specifically, the control device 100 corrects the taught position setting to a new taught position in the opposite direction to the eccentricity direction by an amount corresponding to the calculated eccentricity Δr. Furthermore, in Figure 14 In (e), the teaching position before correction is represented by a dashed line, and the teaching position after correction is represented by a solid line.

[0088] Through the above second teaching step S2, the accuracy of the teaching position in the horizontal direction of the conveying device 31 is improved.

[0089] As explained above, according to the embodiment, the control device 100 moves the pickup 34 in the vertical direction while detecting the height position of the wafer W using the mapping sensor 84, and sets the teaching position of the pickup 34 in the vertical direction based on the detected height position of the wafer W. Additionally, the control device 100 moves the pickup 34 in the horizontal direction while setting the teaching position of the pickup 34 in the horizontal direction based on the horizontal position of the pickup 34 when it is detected by the ejection detection sensors 81-83 provided on the loading assembly 30. In this way, according to the embodiment, the operator does not need to visually confirm the pickup 34 while setting the teaching position of the transport device 31; instead, the control device 100 automatically performs the teaching operation. This shortens the time required for the teaching operation of the transport device 31. As a result, the startup time of the processing system 1 can be reduced. Furthermore, the downtime of the processing system 1 during the replacement of the transport device 31 or its components, or the maintenance of the wafer W being transported by the transport device 31, can be reduced. Furthermore, it can suppress inconsistencies in the teaching accuracy of the conveying device 31 due to operator skill levels. Additionally, since no special teaching fixtures are required, operator training is easier, thus reducing teaching costs.

[0090] Furthermore, in the above embodiments, the wafer W is an example of a substrate, the pickup 34 is an example of a substrate holding part, the ejection detection sensors 81-83 are an example of a second detection part, and the mapping sensor 84 is an example of a first detection part.

[0091] The embodiments disclosed herein are illustrative and should not be considered limiting. The above embodiments can be omitted, substituted, or modified in various forms as long as they do not depart from the scope and spirit of the appended claims.

[0092] Further, in the above-described embodiment, a case where the out-of-position detection sensors 81 to 83 and the mapping sensor 84 are transmissive sensors is described, but the present application is not limited thereto. For example, the out-of-position detection sensors 81 to 83 and the mapping sensor 84 can also be reflective sensors. Further, for example, the out-of-position detection sensors 81 to 83 and the mapping sensor 84 can also be sensors using a camera.

[0093] Further, in the above-described embodiment, in the first step S11, the wafer W is used as the detection object detected by the mapping sensor 84, but the present application is not limited thereto. For example, the detection object can also be a chuck installed to the load module 30, the load lock module 40, the load port 50, the aligner 60, or the like.

[0094] Further, in the above-described embodiment, a teach method of setting a teach position of the transport device 31 provided in the atmospheric transport chamber is described, but the present application is not limited thereto. For example, the teach method of setting a teach position of the transport device 11 provided in the vacuum chamber can also be similarly applied.

[0095] Further, in the above-described embodiment, a case where the transport object of the transport device 31 is the wafer W is described, but the present application is not limited thereto. For example, the transport object transported by the transport device 31 can also be a large-sized substrate for a flat panel display (FPD: Flat Panel Display), a substrate for an organic EL panel, or a substrate for a solar cell.

Claims

1. A teaching method of a conveyance device having a substrate holding section that holds a substrate and a first detection section provided to the substrate holding section, the teaching method of the conveyance device characterized by comprising: a step of detecting a height position of a detection object with the first detection section while moving the substrate holding section in a vertical direction, and setting a teaching position of the substrate holding section in the vertical direction based on the detected height position of the detection object; a step of setting a teaching position of the substrate holding section in a horizontal direction based on a horizontal position of the substrate holding section when the substrate holding section is detected by a second detection section provided at a position different from the conveyance device while moving the substrate holding section in the horizontal direction; and a step of correcting the teaching position of the substrate holding section in the vertical direction after the step of setting the teaching position of the substrate holding section in the vertical direction, the conveyance device further having: a suction hole that suctions and holds the substrate placed on an upper surface of the substrate holding section; and a pressure detection section that detects a pressure of a suction path communicating with the suction hole, the step of correcting the teaching position of the substrate holding section in the vertical direction including: a step of moving the substrate holding section below the substrate; a step of moving the substrate holding section from below the substrate to above the substrate while detecting the pressure of the suction path in a state where the suction path is suctioned; a step of judging whether the substrate holding section is in contact with the substrate based on the pressure of the suction path; and a step of correcting a position of the substrate holding section when the substrate holding section is judged to be in contact with the substrate as the teaching position of the substrate holding section in the vertical direction.

2. The teaching method of the conveyance device according to claim 1, characterized in that: the first detection section includes a light projecting section that projects a detection light to the detection object and a light receiving section that receives the detection light, the teaching position of the substrate holding section in the vertical direction is set based on a height position of the substrate holding section when the detection light is blocked by the detection object.

3. The teaching method of the conveyance device according to claim 1 or 2, characterized in that: the first detection section is provided to a front end section of the substrate holding section.

4. The teaching method of the conveyance device according to claim 1 or 2, characterized in that: the detection object is a substrate, the first detection section is a mapping sensor that detects presence or absence of the substrate.

5. The teaching method of the conveyance device according to claim 4, characterized in that: the second detection section is a ejection detection sensor that detects ejection of the substrate with respect to a conveyance container that accommodates the substrate.

6. The teaching method of the conveyance device according to claim 1 or 2, characterized in that: the second detection section includes a light projecting section that projects a detection light to the detection object and a light receiving section that receives the detection light, the teaching position of the substrate holding section in the horizontal direction is set based on a horizontal position of the substrate holding section when the substrate holding section blocks the detection light of the second detection section. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 7. A processing system having a processing device and a control device, characterized by: the processing device including: a conveyance device having a substrate holding portion that holds a substrate and a first detection portion provided to the substrate holding portion; and a second detection portion provided separately from the conveyance device, the control device configured to control the processing device to perform: a step of detecting a height position of a detection object with the first detection portion while moving the substrate holding portion in a vertical direction, and setting a teaching position of the substrate holding portion in the vertical direction based on the detected height position of the detection object; and a step of setting a teaching position of the substrate holding portion in a horizontal direction based on a horizontal position of the substrate holding portion when the substrate holding portion is detected by the second detection portion provided at a position different from the conveyance device while moving the substrate holding portion in the horizontal direction; and a step of correcting the teaching position in the vertical direction after the step of setting the teaching position of the substrate holding portion in the vertical direction, the conveyance device further including: a suction hole that suctions and holds the substrate placed on an upper surface of the substrate holding portion; and a pressure detection portion that detects a pressure of a suction path communicating with the suction hole, the step of correcting the teaching position in the vertical direction including: a step of moving the substrate holding portion below the substrate; a step of moving the substrate holding portion from below the substrate to above the substrate while detecting the pressure of the suction path in a state where the suction path is suctioned; a step of judging whether the substrate holding portion is in contact with the substrate based on the pressure of the suction path; and a step of correcting a position of the substrate holding portion when judged that the substrate holding portion is in contact with the substrate as the teaching position of the substrate holding portion in the vertical direction.

Images