Light-emitting substrate, display device, and method for manufacturing a light-emitting substrate

Abstract

Embodiments of the present application provide a light-emitting substrate, a display device, and a manufacturing method of the light-emitting substrate. The light-emitting substrate specifically includes: a flexible substrate, a plurality of light-emitting diode chips, and a sealing layer that are stacked; wherein, at least one target light-emitting diode chip is included in the plurality of light-emitting diode chips; a first microstructure is provided at a position corresponding to the target light-emitting diode chip on the flexible substrate. In the embodiments of the present application, the first microstructure can adjust the height of the target light-emitting diode, avoid the problem of color deviation under a large viewing angle, and thus, the light-emitting effect of the light-emitting substrate is better.

Description

Technical Field

[0001] This application belongs to the field of display technology, and particularly relates to a light-emitting substrate, a display device, and a method for manufacturing a light-emitting substrate. Background Art

[0002] With the continuous development of display technology, light-emitting diode (LED) display technology, as a new type of display technology, has gradually become one of the research hotspots. LED display technology uses an array composed of LED (Light Emitting Diode) chips for display.

[0003] In the existing technology, the light-emitting substrate of a display substrate usually includes light-emitting chips of different colors such as red LED chips, blue LED chips, and green LED chips. Due to the different light-emitting patterns of light-emitting diodes of different colors, the display substrate is prone to color deviation problems at large viewing angles. Summary of the Invention

[0004] This application aims to provide a light-emitting substrate, a display device, and a method for manufacturing a light-emitting substrate to solve the problem of color deviation that easily occurs in the existing light-emitting substrate at large viewing angles.

[0005] To solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, this application discloses a light-emitting substrate, which includes: a flexible substrate, a plurality of light-emitting diode chips, and a sealing layer arranged in a stacked manner; wherein,

[0007] at least one target light-emitting diode chip is included in the plurality of light-emitting diode chips;

[0008] a first microstructure is provided at a position of the flexible substrate corresponding to the target light-emitting diode chip.

[0009] Optionally, the first microstructure is a convex portion facing the target light-emitting diode chip, and the target light-emitting diode chip is fixed on the convex portion.

[0010] Optionally, among the plurality of light-emitting diode chips, the height of the top of the target light-emitting diode chip relative to the plane of the flexible substrate is a first height, and the height of the top of the light-emitting diode chip other than the target light-emitting diode chip relative to the plane of the flexible substrate is a second height, and the first height is higher than the second height.

[0011] Optionally, the height of the top of the convex portion relative to the plane of the flexible substrate is 20 - 30 um.

[0012] Optionally, the convex portion is selected from at least one of a hemispherical convex portion, a frustum-shaped convex portion, a prism-shaped convex portion, and an ellipsoidal convex portion.

[0013] Optionally, a recessed portion is provided on a side of the flexible substrate facing away from the light-emitting diode chip, and one recessed portion corresponds to one convex portion.

[0014] Optionally, a leveling adhesive layer is further provided on a side of the flexible substrate facing away from the light-emitting diode chip, and the leveling adhesive layer at least fills the recessed portion.

[0015] Optionally, the target light-emitting diode chip includes at least one of a blue light-emitting diode chip and a green light-emitting diode chip.

[0016] Optionally, a surface of the encapsulating adhesive layer away from the flexible substrate is a mirror surface or a matte surface.

[0017] Optionally, the flexible substrate includes an organic material substrate or a flexible circuit board.

[0018] In a second aspect, the present application further discloses a display device, and the display device includes: the light-emitting substrate according to any one of the above.

[0019] In a third aspect, the present application further discloses a method for manufacturing a light-emitting substrate, including:

[0020] Placing a flexible substrate connected with a plurality of light-emitting diode chips in a forming cavity of a jig, so that a side of the flexible substrate facing away from the plurality of light-emitting diode chips is attached to a second microstructure in the forming cavity, wherein the second microstructure corresponds to a position of a target light-emitting diode chip among the plurality of light-emitting diode chips;

[0021] Injecting an encapsulating adhesive into the forming cavity;

[0022] Pressing the encapsulating adhesive to transfer the second microstructure in the forming cavity onto the flexible substrate to form a first microstructure, and form an encapsulating adhesive layer.

[0023] Optionally, the method further includes:

[0024] Forming a leveling adhesive layer on a side of the flexible substrate facing away from the light-emitting diode chip.

[0025] In an embodiment of the present application, since at least one target light-emitting diode chip is included in the plurality of light-emitting diode chips, a first microstructure is provided at a position of the flexible substrate corresponding to the target light-emitting diode chip. The first microstructure can be configured to adjust the height of the target light-emitting diode, avoid the problem of color deviation under a large viewing angle, and thus, the light-emitting effect of the light-emitting substrate is better.

[0026] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0028] Figure 1 is a schematic structural diagram of a light-emitting substrate according to an embodiment of the present application;

[0029] Figure 2 is a schematic structural diagram of another light-emitting substrate according to an embodiment of the present application;

[0030] Figure 3 is a flowchart of steps of a manufacturing method of a light-emitting substrate according to an embodiment of the present application;

[0031] Figure 4 is a schematic structural diagram of a flexible substrate according to an embodiment of the present application;

[0032] Figure 5 is a schematic structural diagram of a jig according to an embodiment of the present application;

[0033] Figure 6 is one of the state diagrams of the manufacturing process of the light-emitting substrate according to an embodiment of the present application;

[0034] Figure 7 is another state diagram of the manufacturing process of the light-emitting substrate according to an embodiment of the present application;

[0035] Figure 8 is yet another state diagram of the manufacturing process of the light-emitting substrate according to an embodiment of the present application;

[0036] Reference numerals: 10 - flexible substrate, 101 - first micro-structure, 102 - recessed portion, 11 - encapsulant layer, 12 - red light-emitting diode chip, 13 - blue light-emitting diode chip, 14 - green light-emitting diode chip, 15 - leveling glue layer, 20 - molding cavity, 21 - second micro-structure, 22 - glue injection port, 23 - pressing plate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts belong to the scope of protection of this application.

[0038] The terms "first" and "second" in the description and claims of this application may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects. The character " / " generally means that the related objects before and after are in an "or" relationship.

[0039] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0041] Refer to Figure 1 , a schematic structural diagram of a light-emitting substrate according to an embodiment of the present application is shown. As Figure 1 shown, the light-emitting substrate may specifically include: a flexible substrate 10, a plurality of light-emitting diode chips, and a sealing layer 11 which are stacked; wherein, at least one target light-emitting diode chip is included in the plurality of light-emitting diode chips; a first microstructure 101 is provided at a position corresponding to the target light-emitting diode chip on the flexible substrate 10.

[0042] In the embodiments of the present application, since at least one target light-emitting diode chip is included in the plurality of light-emitting diode chips, a first microstructure 101 is provided at a position corresponding to the target light-emitting diode chip on the flexible substrate 10. The first microstructure 101 can be configured to adjust the height of the target light-emitting diode, avoiding the problem of color shift at a large viewing angle, thereby enabling the flexible substrate to have a better light-emitting effect.

[0043] Specifically, the light-emitting diode chips may include a red light-emitting diode chip 12, a blue light-emitting diode chip 13, and a green light-emitting diode chip 14. The light-emitting diode chips can be soldered on the flexible substrate 10, and a driving circuit is provided on the flexible substrate 10. Under the driving of the driving circuit, the red light-emitting diode chip 12, the blue light-emitting diode chip 13, and the green light-emitting diode chip 14 can achieve uniform light mixing.

[0044] Specifically, the target light-emitting diode chip is the light-emitting diode chip that needs to be height-adjusted among the plurality of light-emitting diode chips. Due to the differences in the internal structures of the light-emitting diode chips, the light-emitting patterns of different light-emitting diode chips are also different, which easily leads to the problem of color shift at a large viewing angle. Relevant experimental data show that the light-emitting patterns of the blue light-emitting diode chip 13 and the green light-emitting diode chip 14 are basically the same, while the light-emitting pattern of the red light-emitting diode chip 12 is different from those of the blue light-emitting diode chip 13 and the green light-emitting diode chip 14.

[0045] In the embodiments of the present application, the target light-emitting diode chip can be the red light-emitting diode chip 12, or the target light-emitting chip can be the blue light-emitting diode chip 13 and the green light-emitting diode chip 14. The first microstructure 101 can be used to adjust the height of the target light-emitting diode chip, so as to reduce the influence of the different light-emitting types of the plurality of light-emitting diode chips on the light-emitting effect, and further, the problem of color shift at a large viewing angle can be avoided.

[0046] Exemplarily, the first microstructure 101 can be a convex structure or a concave structure. When the target light-emitting diode chip is the red light-emitting diode chip 12, the first microstructure 101 can be a concave structure, and the concave structure can be used to reduce the height of the top of the red light-emitting diode chip 12 relative to the plane of the flexible substrate, so as to reduce the influence of the different light-emitting patterns of the red light-emitting diode chip 12 and the blue light-emitting diode chip 13 and the green light-emitting diode chip 14 on the light-emitting effect and avoid the problem of color shift at a large viewing angle.

[0047] Alternatively, when the target light-emitting diode chip structure is a blue light-emitting diode chip 13 and a green light-emitting diode chip 14, the first microstructure 101 can be a convex structure, and the convex structure can be used to increase the height of the tops of the blue light-emitting diode chip 13 and the green light-emitting diode chip 14 relative to the plane of the flexible substrate, so as to reduce the influence on the light-emitting effect caused by the different light-emitting patterns of the blue light-emitting diode chip 13 and the green light-emitting diode chip 14 from that of the red light-emitting diode chip 12, and avoid the problem of color deviation at large viewing angles.

[0048] In the light-emitting substrate according to the embodiment of the present application, since the first microstructure 101 can be used to adjust the height of the target light-emitting diode chip to avoid the problem of color deviation at large viewing angles caused by light-emitting diode chips of different light-emitting types. Therefore, the heights of the multiple light-emitting diode chips themselves can be set to be the same, which is beneficial to the standardized production and production management of the light-emitting diode chips, and reduces the structural cost and production cost of the light-emitting diode chips.

[0049] In the embodiment of the present application, the flexible substrate 10 has the characteristic of being bendable and deformable. By locally deforming the flexible substrate 10 at the position corresponding to the target light-emitting diode chip, the first microstructure 101 can be formed on the flexible substrate 10. That is, during the processing of the light-emitting substrate, the first microstructure 101 can be formed by locally deforming the flexible substrate 10 at the position corresponding to the target light-emitting diode chip, avoiding the process of additionally manufacturing the first microstructure 101, reducing the manufacturing cost of the light-emitting substrate, and simplifying the manufacturing process of the light-emitting substrate.

[0050] Specifically, the encapsulation layer 11 can cover the multiple light-emitting diode chips and is used to encapsulate the light-emitting diode chips. In the embodiment of the present application, since the first microstructure 101 can be formed by deforming the flexible substrate 10 during the manufacturing process of the light-emitting substrate, the encapsulation layer 11 can also be used to encapsulate the flexible substrate 10 to maintain the deformed state of the first microstructure 101 and obtain a first microstructure 101 with a stable structure.

[0051] Optionally, the flexible substrate 10 can be an organic material substrate or a flexible circuit board, and the specific type of the flexible substrate 10 in the embodiment of the present application can be not limited.

[0052] In an alternative embodiment of the present application, the first microstructure 101 can be a convex portion facing the target light-emitting diode chip, and the target light-emitting diode chip is fixed on the convex portion. The convex portion can be used to raise the position of the target light-emitting diode to reduce the influence on the light-emitting effect caused by the different light-emitting patterns of the target light-emitting diode chip and the non-target light-emitting diode chip, and avoid the problem of color deviation at large viewing angles.

[0053] Specifically, the convex portion can be formed by deforming the flexible substrate 10 during the manufacturing process of the light-emitting substrate. That is, the convex portion and the flexible substrate 10 can be an integrally formed structure.

[0054] Optionally, among the multiple light-emitting diode chips, the height of the top of the target light-emitting diode chip relative to the plane of the flexible substrate is a first height, and the height of the top of the light-emitting diode chips other than the target light-emitting diode chip relative to the plane of the flexible substrate is a second height, and the first height is higher than the second height.

[0055] It should be noted that the plane of the flexible substrate can be the plane where the upper surface of the undeformed part of the flexible substrate 10 is located.

[0056] Specifically, since the first height of the target light-emitting diode chip is higher than the second height of the non-target light-emitting diode chip, the influence on the light-emitting effect caused by the different light-emitting patterns of the target light-emitting diode chip and the non-target light-emitting diode chip can be reduced, and the problem of color deviation at a large viewing angle can be avoided.

[0057] Optionally, the height of the top of the convex portion relative to the plane of the flexible substrate is 20 - 30 um. In this way, it is convenient for the flexible substrate 10 to form the convex portion by deformation, and the height adjustment range of the convex portion for the target light-emitting diode chip is relatively reasonable.

[0058] In the embodiment of the present application, the height of the top of the convex portion relative to the plane of the flexible substrate can be set according to the height that the target light-emitting diode chip needs to be adjusted. For example, the height of the top of the convex portion relative to the plane of the flexible substrate can be 20 um, 24 um, or 30 um, etc. The specific value of the height of the top of the convex portion relative to the plane of the flexible substrate in the embodiment of the present application may not be limited.

[0059] Specifically, the convex portion can be selected from at least one of a hemispherical convex portion, a frustum-shaped convex portion, a prism-shaped convex portion, and an ellipsoidal convex portion. The specific shape of the convex portion in the embodiment of the present application may not be limited.

[0060] In the embodiment of the present application, the convex portion can protrude toward the side of the light-emitting diode chip. Since the convex portion is formed by deforming the flexible substrate 10, a concave portion 102 is correspondingly formed on the side of the flexible substrate 10 away from the encapsulation layer 11, and one concave portion 102 corresponds to one convex portion.

[0061] In practical applications, the shape of the recessed portion 102 may be similar to that of the protruding portion, but they do not necessarily need to be completely complementary. The shape difference between the recessed portion 102 and the protruding portion may be determined by the material, thickness, and degree of deformation of the flexible substrate 10.

[0062] Referring to Figure 2 , a schematic structural diagram of another light-emitting substrate according to an embodiment of the present application is shown. As Figure 2 shown, a leveling glue layer 15 is further provided on the side of the flexible substrate 10 facing away from the light-emitting diode chip. The leveling glue layer 15 at least fills the recessed portion 102, so that the surface of the side of the flexible substrate 10 facing away from the light-emitting diode chip is relatively flat, facilitating the assembly of the flexible substrate 10 to other electronic devices and improving the installation convenience of the light-emitting substrate.

[0063] Exemplarily, by forming the leveling glue layer 15 on the side of the flexible substrate 10 facing away from the light-emitting diode chip, the stiffness of the flexible substrate 10 can also be improved to form a rigid substrate. In this way, when the light-emitting substrate is used in a display device, the rigid substrate can provide good support for the display device.

[0064] Exemplarily, the flexible substrate 10 and the leveling glue layer 15 may also form a flexible substrate, and the embodiments of the present application do not limit this.

[0065] Optionally, when the first micro-structure 101 is a protruding portion, the target light-emitting diode chip may include at least one of a blue light-emitting diode chip 13 and a green light-emitting diode chip 14, and the embodiments of the present application may not limit the specific content of the target light-emitting diode chip.

[0066] Optionally, the surface of the encapsulation layer 11 away from the flexible substrate 10 may be a mirror surface or a matte surface to enrich the light-emitting effect of the light-emitting substrate.

[0067] In practical applications, when the surface of the encapsulation layer 11 away from the flexible substrate 10 is a mirror surface, the brightness of the light-emitting substrate can be relatively high. When the surface of the encapsulation layer 11 away from the flexible substrate 10 is a matte surface, the light-emitting substrate can exhibit a matte light-emitting effect.

[0068] In summary, the light-emitting substrate according to the embodiments of the present application may at least have the following advantages:

[0069] In the embodiment of the present application, since the plurality of light-emitting diode chips include at least one target light-emitting diode chip, a first microstructure is provided at a position of the flexible substrate corresponding to the target light-emitting diode chip. The first microstructure can be configured to adjust the height of the target light-emitting diode to avoid the problem of color shift at a wide viewing angle, thereby making the light-emitting substrate have a better light-emitting effect.

[0070] An embodiment of the present application further provides a display device, which may specifically include the above-mentioned light-emitting substrate.

[0071] It should be noted that in the embodiment of the present application, the structure of the light-emitting substrate is the same as the structure of the light-emitting substrate in the aforementioned embodiments, and will not be described in detail here.

[0072] In the embodiment of the present application, since the plurality of LED chips of the light-emitting substrate include at least one target LED chip, a first microstructure is provided at a position of the flexible substrate corresponding to the target LED chip. The first microstructure can be configured to adjust the height of the target LED to avoid the problem of color shift at a wide viewing angle, thereby making the light-emitting substrate have a better light-emitting effect, and further, making the display effect of the display device better.

[0073] The embodiments of the present application also provide a method for manufacturing a light-emitting substrate, which can be used to manufacture the light-emitting substrates in the above embodiments.

[0074] Reference Figure 3 , shows a flowchart of the steps of a method for manufacturing a light-emitting substrate according to an embodiment of the present application, such as Figure 3 As shown, the method may specifically include the following steps:

[0075] Step 301: placing a flexible substrate connected with a plurality of light-emitting diode chips in a molding cavity of a jig so that a side of the flexible substrate facing away from the plurality of light-emitting diode chips is in contact with a second microstructure in the molding cavity, wherein the second microstructure corresponds to a position of a target light-emitting diode chip among the plurality of light-emitting diode chips.

[0076] In the embodiment of the present application, a plurality of light emitting diodes may be connected to the flexible substrate 10 to obtain Figure 4The flexible substrate 10 shown. Specifically, the flexible substrate 10 can be an organic material substrate or a flexible circuit board. The light-emitting diode chips can include a red light-emitting diode chip 12, a blue light-emitting diode chip 13, and a green light-emitting diode chip 14. The target light-emitting diode chip is the light-emitting diode chip that needs to be height-adjusted among the multiple light-emitting diode chips. For example, the target light-emitting diode chip can include at least one of the blue light-emitting diode chip 13 and the green light-emitting diode chip 14.

[0077] Referring to Figure 5 , a schematic structural diagram of a fixture according to an embodiment of the present application is shown. The fixture can be used to fabricate the light-emitting substrate. As Figure 5 shown, a molding cavity 20 is provided in the fixture, and a second microstructure 21 is provided in the molding cavity 20. A glue injection port 22 is further provided on the fixture, and the glue injection port 22 can be used to inject encapsulating glue into the molding cavity 20.

[0078] Referring to Figure 6 , a diagram showing one of the states of the manufacturing process of the light-emitting substrate according to an embodiment of the present application is shown. As Figure 6 shown, the flexible substrate 10 connected with multiple light-emitting diode chips can be placed in the molding cavity 20 of the fixture, and the side of the flexible substrate 10 facing away from the multiple light-emitting diode chips is attached to the second microstructure 21 in the molding cavity 20, and the second microstructure 21 corresponds to the position of the target light-emitting diode.

[0079] Step 302: Inject encapsulating glue into the molding cavity.

[0080] In the embodiment of the present application, after the flexible substrate 10 connected with multiple light-emitting diode chips is placed in the fixture, encapsulating glue can be injected into the molding cavity 20 through the glue injection port 22. The encapsulating glue can be silicone glue or epoxy glue, and the specific type of the encapsulating glue is not limited in the embodiment of the present application.

[0081] Specifically, by injecting encapsulating glue into the molding cavity 20, after the encapsulating glue is cured, a glue sealing layer 11 can be formed on the side of the flexible substrate 10 facing the light-emitting diode chips.

[0082] Step 303: Press the encapsulating glue to transfer the second microstructure in the molding cavity to the flexible substrate to form a first microstructure and form a glue sealing layer.

[0083] In the embodiment of the present application, as Figure 7As shown, after injecting encapsulation glue into the molding cavity 20 of the fixture, a pressing plate 23 can be used to press the encapsulation glue, so as to transfer the second micro-structure 21 in the molding cavity 20 onto the flexible substrate 10 to form a first micro-structure 101, and a glue sealing layer 11 is formed.

[0084] Specifically, the glue sealing layer 11 can cover the plurality of light-emitting diode chips for encapsulating the light-emitting diode chips. Moreover, the glue sealing layer 11 can also be used to encapsulate the flexible substrate 10, maintain the deformation state of the first micro-structure 101, and obtain a first micro-structure 101 with a stable structure.

[0085] In the embodiment of the present application, the side of the pressing plate 23 close to the light-emitting diode chip can also be used to perform surface treatment on the side of the glue sealing layer 11 away from the light-emitting diode chip. In practical applications, when the surface of the side of the pressing plate 23 close to the light-emitting diode chip is a mirror surface, the side of the glue sealing layer 11 away from the light-emitting diode chip can be correspondingly made into a mirror surface. When the surface of the side of the pressing plate 23 close to the light-emitting diode chip is a matte surface, the side of the glue sealing layer 11 away from the light-emitting diode chip can be correspondingly made into a matte surface.

[0086] Optionally, after forming the glue sealing layer 11, a leveling glue layer 15 can also be formed on the side of the flexible substrate 10 facing away from the light-emitting diode chip.

[0087] In practical applications, the convex portion can protrude toward the side of the light-emitting diode chip. Since the convex portion is formed by the deformation of the flexible substrate 10, a concave portion 102 is correspondingly formed on the side of the flexible substrate 10 facing away from the glue sealing layer 11, and one concave portion 102 corresponds to one convex portion. Since the concave portion 102 may affect the assembly of the light-emitting substrate, leveling glue can be applied to the side of the flexible substrate 10 facing away from the light-emitting diode chip. The leveling glue can be used to level the concave portion 102 to form a leveling glue layer 15.

[0088] Specifically, the leveling glue layer 15 at least fills the concave portion 102, so that the surface of the side of the flexible substrate 10 facing away from the light-emitting diode chip is relatively flat, facilitating the assembly of the flexible substrate 10 to other electronic devices and improving the installation convenience of the light-emitting substrate.

[0089] As Figure 8 shown, the side of the flexible substrate 10 facing away from the light-emitting diode chip can be set upward, and leveling glue is applied and cured on the side of the flexible substrate 10 facing away from the light-emitting diode chip to form a leveling glue layer 15 that can level the concave portion 102.

[0090] In summary, the method for manufacturing the light-emitting substrate according to the embodiments of the present application may at least have the following advantages:

[0091] In the embodiments of the present application, since at least one target light-emitting diode chip is included in the plurality of light-emitting diode chips, a first microstructure is provided at a position corresponding to the target light-emitting diode chip on the flexible substrate. The first microstructure can be configured to adjust the height of the target light-emitting diode, avoid the problem of color deviation under a large viewing angle, and thus, the light-emitting effect of the light-emitting substrate is better.

[0092] In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In the present specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0093] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A light-emitting substrate, characterized in that, the light-emitting substrate comprises: a flexible substrate, a plurality of light-emitting diode chips and a sealing glue layer which are stacked; wherein, at least one target light-emitting diode chip is included in the plurality of light-emitting diode chips; a first microstructure is provided at a position of the flexible substrate corresponding to the target light-emitting diode chip; the first microstructure is a convex portion facing the target light-emitting diode chip, and the target light-emitting diode chip is fixed on the convex portion; among the plurality of light-emitting diode chips, the height of the top of the target light-emitting diode chip relative to the plane of the flexible substrate is a first height, and the height of the top of the light-emitting diode chip other than the target light-emitting diode chip relative to the plane of the flexible substrate is a second height, and the first height is higher than the second height; wherein, the target light-emitting diode chip includes at least one of a blue light-emitting diode chip and a green light-emitting diode chip, and the light-emitting diode chip other than the target light-emitting diode chip includes a red light-emitting diode chip.

2. The light-emitting substrate according to claim 1, characterized in that, the height of the top of the convex portion relative to the plane of the flexible substrate is 20-30 um.

3. The light-emitting substrate according to claim 1, characterized in that, the convex portion is selected from at least one of: a hemispherical convex portion, a frustum-shaped convex portion, a prism-shaped convex portion and an ellipsoidal convex portion.

4. The light-emitting substrate according to claim 1, characterized in that, a concave portion is provided on a side of the flexible substrate facing away from the light-emitting diode chip, and one concave portion corresponds to one convex portion.

5. The light-emitting substrate according to claim 4, characterized in that, a leveling glue layer is further provided on a side of the flexible substrate facing away from the light-emitting diode chip, and the leveling glue layer at least fills the concave portion.

6. The light-emitting substrate according to claim 1, and characterized in that the surface of the sealing glue layer away from the flexible substrate is a mirror surface or a matte surface.

7. The light-emitting substrate according to any one of claims 1 to 6, characterized in that, the flexible substrate includes an organic material substrate or a flexible circuit board.

8. A display device, characterized in that, the display device includes: the light-emitting substrate according to any one of claims 1 to 7.

9. A manufacturing method of a light-emitting substrate, characterized in that, comprises: placing a flexible substrate connected with a plurality of light-emitting diode chips in a forming cavity of a jig, so that a side of the flexible substrate facing away from the plurality of light-emitting diode chips is attached to a second microstructure in the forming cavity, wherein the second microstructure corresponds to the position of a target light-emitting diode chip among the plurality of light-emitting diode chips; injecting a packaging glue into the forming cavity; pressing the packaging glue to transfer the second microstructure in the forming cavity to the flexible substrate to form a first microstructure and form a sealing glue layer; Wherein, the first microstructure is a convex portion facing the target light-emitting diode chip, and the target light-emitting diode chip is fixed on the convex portion; among the plurality of light-emitting diode chips, the height of the top of the target light-emitting diode chip relative to the plane of the flexible substrate is a first height, and the height of the top of the light-emitting diode chip other than the target light-emitting diode chip relative to the plane of the flexible substrate is a second height, and the first height is higher than the second height; wherein, the target light-emitting diode chip includes at least one of a blue light-emitting diode chip and a green light-emitting diode chip, and the light-emitting diode chip other than the target light-emitting diode chip includes a red light-emitting diode chip.

10. The method according to claim 9, characterized in that, the method further includes: forming a leveling glue layer on a side of the flexible substrate facing away from the light-emitting diode chip.

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