Portable medical refrigerated storage cup

Abstract

The invention discloses a portable medical refrigeration storage cup, comprising: an outer shell, comprising a bottom shell and a cup body detachably buckled on the bottom shell, the cup body being a double-layer vacuum structure; a refrigeration assembly, installed in the bottom shell, the refrigeration assembly comprising a semiconductor refrigeration chip, a cooling member and a heat sink respectively connected to the cold and hot ends of the semiconductor refrigeration chip, the cooling member facing the inside of the cup body, the cooling member and the inside of the cup body forming a sealed storage cavity, a hollow heat sink cavity being horizontally arranged in the middle of the heat sink, the heat sink cavity having openings at both ends, and a plurality of fins being connected in the heat sink cavity; a fan being installed at one of the openings of the heat sink cavity, and two convection ports respectively corresponding to the openings at both ends of the heat sink cavity being arranged on the side wall of the bottom shell; a power supply module, used for controlling the start and stop of the semiconductor refrigeration chip and the fan; the cup body of the refrigeration storage cup has good refrigeration and heat preservation effect, the heat dissipation efficiency of the refrigeration assembly is high, and a relatively long low-temperature storage time can be guaranteed for medicines, meeting the needs of users for carrying out.

Description

Technical Field

[0001] The invention relates to a refrigerated cup, in particular to a portable medical refrigerated storage cup. Background Art

[0002] In daily life, some people need to use refrigerated cups to carry medicines that need to be stored at low temperatures, such as insulin, when they go out. Some portable refrigerated cups on the market currently use semiconductor refrigeration devices to cool the inside of the cup, and their outer shells use foaming technology to keep the temperature. It is found in use that the refrigeration effect of these refrigerated cups is not ideal; therefore, it is necessary to optimize the structure of the refrigerated cup to ensure that users can store medicines for a longer period of time when carrying them out. Summary of the invention

[0003] The present invention aims to solve at least one of the above-mentioned technical problems in the related art to a certain extent. To this end, the present invention provides a portable medical refrigerated storage cup.

[0004] To achieve the above object, the technical solution of the present invention is as follows:

[0005] A portable medical refrigerated storage cup according to a first aspect of the present invention comprises:

[0006] The outer shell comprises a bottom shell and a cup body detachably buckled on the bottom shell, wherein the cup body is a double-layer vacuum structure;

[0007] A refrigeration assembly is installed in the bottom shell, the refrigeration assembly includes a semiconductor refrigeration chip, a cooling member and a heat sink connected to the cold and hot ends of the semiconductor refrigeration chip respectively, the cooling member faces the inside of the cup body, the cooling member and the inside of the cup body form a sealed storage cavity, a hollow heat sink cavity is horizontally arranged in the middle of the heat sink, the two ends of the heat sink cavity are open, and a plurality of fins are connected to the heat sink cavity;

[0008] A fan is installed at one of the openings of the heat dissipation cavity, and the side wall of the bottom shell is provided with two convection ports corresponding to the opening positions at both ends of the heat dissipation cavity respectively;

[0009] A power supply module is used to control the start and stop of the semiconductor refrigeration chip and the fan.

[0010] The portable medical refrigerated storage cup according to the embodiment of the present invention has at least the following beneficial effects: the cup body of the refrigerated storage cup has good refrigeration and heat preservation effects, the heat dissipation efficiency of the refrigeration assembly is high, and the medicine can be guaranteed to have a long low-temperature storage time, meeting the needs of users to carry it out.

[0011] According to some embodiments of the present invention, the fin extends from an opening at one end of the heat dissipation cavity toward an opening at the other end, and two side edges of the fin are connected to an inner wall of the heat dissipation cavity.

[0012] According to some embodiments of the present invention, each of the fins is integrally formed with the heat dissipation cavity.

[0013] According to some embodiments of the present invention, a support is installed in the bottom shell, the support is provided with a first installation cavity and a second installation cavity distributed up and down, and the refrigeration assembly is installed on the first installation cavity; the power supply module includes a battery and a circuit board, the battery is installed in the second installation cavity, and the circuit board is fixed on the outer wall of the support.

[0014] According to some embodiments of the present invention, a storage container is provided in the storage cavity, and the bottom of the storage container is plugged into the cooling member.

[0015] According to some embodiments of the present invention, a heat insulating member is covered on the cooling member, and the heat insulating member insulates the outer wall of the cooling member and the inner wall of the bottom shell.

[0016] According to some embodiments of the present invention, the bottom of the thermal insulation member is fixed to the upper end of the support, and the heat dissipation member is fixed to the bottom of the thermal insulation member.

[0017] According to some embodiments of the present invention, a first heat insulation layer is provided between the cooling member and the heat dissipation member, and the first heat insulation layer is provided around the semiconductor refrigeration chip.

[0018] According to some embodiments of the present invention, the outer shell is in a capsule shape as a whole, and the bottom shell and the cup body are buckled with each other.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 It is a schematic diagram of the structural decomposition of the present invention;

[0022] Figure 2 is a cross-sectional view of the internal structure of the present invention;

[0023] Figure 3 It is a schematic diagram of the heat sink structure of the present invention;

[0024] Figure 4 It is a partial structural decomposition schematic diagram of the present invention.

[0025] Figure numerals: bottom shell 110; cup body 120; semiconductor refrigeration chip 210; cooling member 220; heat dissipation member 230; storage cavity 121; heat dissipation cavity 231; fin 232; fan 300; convection port 111; power supply module 400; support 500; first installation cavity 510; second installation cavity 520; battery 410; circuit board 420; storage container 130; insertion rod 131; slot 221; first thermal insulation layer 600; thermal insulation member 700; second thermal insulation layer 710; support platform 530. DETAILED DESCRIPTION

[0026] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0027] like Figure 1 As shown, a portable medical refrigeration storage cup includes a shell, a refrigeration assembly, a fan 300 and a power supply module 400.

[0028] The outer shell includes a bottom shell 110 and a cup body 120. The cup body 120 is detachably buckled on the bottom shell 110. The shell of the cup body 120 is a double-layer vacuum structure, that is, the cup body 120 includes an inner and outer shell, and a vacuum layer is between the two shells. The refrigeration assembly is installed in the bottom shell 110. The refrigeration assembly includes a semiconductor refrigeration chip 210, a cooling member 220 and a heat sink 230. The cooling member 220 is connected to the cold end of the semiconductor refrigeration chip 210, and the heat sink 230 is connected to the hot end of the semiconductor refrigeration chip 210. Figure 1 and Figure 2As shown, the semiconductor refrigeration chip 210 can be horizontally arranged in the bottom shell 110, and the upper and lower end surfaces of the semiconductor refrigeration chip 210 are its cold and hot ends respectively. The cooling member 220 is connected to the top of the semiconductor refrigeration chip 210, and the upper end surface of the cooling member 220 faces the inner direction of the cup body 120. When the cup body 120 is buckled on the bottom shell 110, a sealed storage cavity 121 is formed between the cooling member 220 and the cup body 120. Medicines such as insulin injections are stored in the storage cavity 121, and the cold end of the semiconductor refrigeration chip 210 cools the storage cavity 121 through the cooling member 220. The double-layer vacuum structure of the cup body 120 replaces the traditional foaming process, which can effectively reduce costs, reduce weight, and effectively insulate the storage cavity 121. The heat sink 230 is connected to the bottom of the semiconductor refrigeration chip 210, and a hollow heat sink 231 is provided inside the heat sink 230, and the heat sink 231 is open at both ends. Two convection ports 111 are provided on the side wall of the bottom shell 110, and the positions of the two convection ports 111 correspond to the opening positions of the two ends of the heat dissipation cavity 231. The fan 300 is installed at one of the openings of the heat dissipation cavity 231, and the fan 300 is used to evacuate the heat dissipation cavity 231. Under the action of the fan 300, the gas enters the bottom shell 110 from one convection port 111 and flows to the heat dissipation cavity 231. The airflow flows through the heat dissipation cavity 231 to the other convection port 111 and is discharged, and the gas flow speed is accelerated through the heat dissipation cavity 231. A plurality of fins 232 are provided on the inner wall of the heat dissipation cavity 231. The heat dissipation element 230 absorbs the heat energy of the semiconductor refrigeration chip 210 and then disperses it to each fin 232. The heat energy on the fin 232 is dissipated with the airflow, that is, the fin 232 is used to effectively increase the heat dissipation area. The power supply module 400 is connected to the semiconductor refrigeration chip 210 and the fan 300 to control the start and stop of the semiconductor refrigeration chip 210 and the fan 300.

[0029] In some specific embodiments of the present invention, the fin 232 extends from the opening at one end of the heat dissipation cavity 231 to the opening at the other end, and both sides of the fin 232 are connected to the inner wall of the heat dissipation cavity 231. Figure 3 As shown, the heat dissipation cavity 231 may be in the shape of a hollow cylinder, and the fins 232 may be in the shape of flat sheets, and each fin 232 extends parallel to the axial direction of the heat dissipation cavity 231 from one end opening of the heat dissipation cavity 231 to the other end opening. The upper and lower sides of the fins 232 are connected to the inner wall of the heat dissipation cavity 231. The heat energy absorbed by the heat dissipation element 230 is directly transferred to the fins 232, and then the heat on the fins 232 is taken away and dissipated by the airflow. Preferably, the heat dissipation element 230 is connected below the semiconductor refrigeration chip 210, and each fin 232 is perpendicular to the lower end surface of the semiconductor refrigeration chip 210 in space, that is, after the heat dissipation element 230 absorbs the heat of the semiconductor refrigeration chip 210, it can be transferred to each fin 232 in the shortest path to achieve heat dissipation.

[0030] Furthermore, each fin 232 is integrally formed with the heat dissipation cavity 231. During the production process, each fin 232 does not need to be processed separately. The integral forming is conducive to improving production efficiency and ensuring the stability of the connection of the fin 232 in the heat dissipation cavity 231 to ensure the heat conduction effect.

[0031] In some embodiments of the present invention, a support 500 is installed in the bottom shell 110, and the support 500 is provided with a first installation cavity 510 and a second installation cavity 520 distributed up and down, and the refrigeration assembly is installed on the first installation cavity 510; the power supply module 400 includes a battery 410 and a circuit board 420, the battery 410 is installed in the second installation cavity 520, and the circuit board 420 is fixed on the outer wall of the support 500. Figure 1 and Figure 4 As shown, the first installation cavity 510 can be open on both sides and the upper side, and the opening positions at both ends of the heat dissipation cavity 231 correspond to the opening positions on both sides of the first installation cavity 510. The cooling member 220 is connected to the storage cavity 121 from the upper end opening of the first installation cavity 510. The second installation cavity 520 is located below the first installation cavity 510, and the second installation cavity 520 is used to separate the battery 410 from the refrigeration assembly. The circuit board 420 is installed on the outer wall of the support 500 and is connected to the semiconductor refrigeration chip 210, the fan 300 and the battery 410 through wires. The overall structural installation layout is reasonable, and the internal space of the bottom shell 110 is fully utilized.

[0032] Among them, the battery 410 is preferably a rechargeable lithium battery. The user can carry three insulin injections when going out. The lithium battery can be charged at any time to ensure the battery life of the refrigerated storage cup.

[0033] In some embodiments of the present invention, a storage container 130 is provided in the storage cavity 121, and the bottom of the storage container 130 is plugged into the cooling member 220. Figure 1 and Figure 4 As shown, the storage container 130 may be cylindrical, and medicines such as insulin are placed in the storage container 130. Two downwardly extending insertion rods 131 may be provided at the bottom of the storage container 130. A slot 221 corresponding to the insertion rod 131 is provided on the cooling member 220. The storage container 130 is detachably fixed to the cooling member 220 through the cooperation between the insertion rod 131 and the slot 221. The bottom of the storage container 130 contacts the upper end surface of the cooling member 220, and the cooling member 220 cools the bottom of the storage container 130.

[0034] In some embodiments of the present invention, the cooling member 220 is covered with a heat insulating member 700, and the heat insulating member 700 insulates the outer wall of the cooling member 220 and the inner wall of the bottom shell 110. Figure 1 and Figure 3As shown, the cooling member 220 may be a cylindrical block structure, and the heat insulating member 700 may be a hollow ring with upper and lower openings, which is sleeved on the cooling member 220. The heat insulating member 700 may be made of EPS material, and the inside of the heat insulating member 700 may be filled with a second heat insulating layer 710 of EPS material. The heat insulating member 700 is used to insulate the cooling member 220 and the bottom shell 110, thereby reducing consumption and ensuring the battery life of the refrigerated cup.

[0035] In some specific embodiments of the present invention, the bottom of the heat insulating member 700 is fixed to the upper end of the support 500, and the heat dissipating member 230 is fixed to the bottom of the heat insulating member 700. Figure 4 As shown, a support platform 530 is provided at the upper edge of the support 500, and the bottom of the heat insulating member 700 and the support platform 530 are fixed by screws. The heat sink 230 can be fixed to the bottom of the heat insulating member 700 by screws, that is, the heat sink 230 and the cooling member 220 do not need to be connected by other connecting members, so as to avoid heat conduction between the heat sink 230 and the cooling member 220 through the connecting members, thereby effectively improving the cooling effect of the cooling member 220 and reducing the cooling loss. After fixing the heat insulating member 700, the heat sink 230 supports the semiconductor refrigeration chip 210, the cooling member 220, etc. located above it, which is equivalent to fixing the positions of the cooling member 220, the semiconductor refrigeration chip 210, the heat sink 230 and other components by using the heat insulating member 700, so as to realize the rapid assembly of each component and improve the assembly production efficiency.

[0036] In some specific embodiments of the present invention, a first heat insulation layer 600 is provided between the cooling member 220 and the heat sink 230, and the first heat insulation layer 600 is provided around the semiconductor cooling chip 210. The material of the first heat insulation layer 600 can be selected from heat insulation cotton, and the first heat insulation layer 600 is used to insulate the cooling member 220 and the heat sink 230 to prevent heat from affecting the cooling effect, further reduce the cooling loss of the cooling member 220, and improve the battery life of the whole machine.

[0037] In some embodiments of the present invention, the outer shell is in the shape of a capsule, and the bottom shell 110 and the cup body 120 are buckled together. Figure 1 and Figure 2 As shown, the bottom shell 110 is the lower part of the capsule, and the cup body 120 is the upper part of the capsule. The outer shell is arranged in a capsule shape for easy carrying and is compatible with its purpose of storing medicine.

[0038] In the description of this specification, the description of reference terms such as "some specific embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0039] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A portable medical refrigerated storage cup, characterized in that: include: The outer shell comprises a bottom shell (110) and a cup body (120) detachably buckled on the bottom shell (110), wherein the cup body (120) is a double-layer vacuum structure; A refrigeration assembly is installed in the bottom shell (110), the refrigeration assembly comprises a semiconductor refrigeration chip (210), a cooling member (220) and a heat sink (230) respectively connected to the cold and hot ends of the semiconductor refrigeration chip (210), the cooling member (220) faces the inside of the cup body (120), the cooling member (220) and the inside of the cup body (120) form a sealed storage cavity (121), a hollow heat sink cavity (231) is transversely arranged in the middle of the heat sink (230), the heat sink cavity (231) is open at both ends, and a plurality of fins (232) are connected in the heat sink cavity (231); A fan (300) is installed at one of the openings of the heat dissipation cavity (231), and two convection ports (111) are provided on the side wall of the bottom shell (110) and correspond to the opening positions at both ends of the heat dissipation cavity (231); A power supply module (400) for controlling the start and stop of the semiconductor refrigeration chip (210) and the fan (300); The fins (232) extend along the opening at one end of the heat dissipation cavity (231) toward the opening at the other end, and two sides of the fins (232) are connected to the inner wall of the heat dissipation cavity (231), and each of the fins (232) and the heat dissipation cavity (231) are integrally formed; A support (500) is installed in the bottom shell (110), the support (500) is provided with a first installation cavity (510) and a second installation cavity (520) which are distributed up and down, and the refrigeration assembly is installed in the first installation cavity (510); the power supply module (400) comprises a battery (410) and a circuit board (420), the battery (410) is installed in the second installation cavity (520), and the circuit board (420) is fixed on the outer side wall of the support (500); The cooling member (220) is covered with a heat insulating member (700), and the heat insulating member (700) insulates the outer wall of the cooling member (220) and the inner wall of the bottom shell (110); The bottom of the heat insulating member (700) is fixed to the upper end of the support (500), and the heat dissipation member (230) is fixed to the bottom of the heat insulating member (700); A first heat insulation layer (600) is provided between the cooling element (220) and the heat dissipation element (230), and the first heat insulation layer (600) is arranged around the periphery of the semiconductor refrigeration chip (210).

2. The portable medical refrigerated storage cup according to claim 1, characterized in that: A storage container (130) is provided in the storage cavity (121), and the bottom of the storage container (130) is plugged into the cooling member (220).

3. The portable medical refrigeration storage cup according to any one of claims 1 to 2, characterized in that: The outer shell is in the shape of a capsule as a whole, and the bottom shell (110) and the cup body (120) are buckled with each other.

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