Display device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SAMSUNG DISPLAY CO LTD
- Filing Date
- 2021-02-18
- Publication Date
- 2026-07-03
Smart Images
Figure CN113345935B_ABST
Abstract
Description
[0001] Cross-reference to related applications
[0002] This application claims priority to Korean Patent Application No. 10-2020-0019363, filed on February 18, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field
[0003] The present invention relates to a display device with crack detection function. Background Technology
[0004] A display device is an output device used to present information in a visual form. A display device may include various electronic components, such as electronic modules, a display panel for displaying images, and input sensors for detecting external input. The electronic components can be electrically connected to each other via signal lines. The electronic module may include a camera, an infrared detection sensor, or a proximity sensor. The electronic module may be disposed below the display panel and the input sensor. Holes for exposing the electronic module may be provided in the display panel and the input sensor. However, during the process of forming the holes for exposing the electronic module, cracks may appear in the display panel. Summary of the Invention
[0005] An exemplary embodiment of the present invention provides a display device comprising: a display panel including a base layer, a circuit layer, a display element layer, and a packaging layer, wherein a through-hole passes through the base layer, the circuit layer, the display element layer, and the packaging layer; a compensation layer disposed on the packaging layer, wherein the compensation layer is adjacent to the through-hole; and a crack detection pattern disposed in a groove located on the top surface of the compensation layer.
[0006] A portion of the compensation layer can be placed between the crack detection pattern and the base layer.
[0007] When viewed from the top surface of the compensation layer, the crack detection pattern may not overlap with the compensation layer.
[0008] The base layer may include multiple base grooves located on the top surface of the base layer adjacent to the through-hole, and the crack detection pattern overlaps with one of the multiple base grooves.
[0009] The crack detection pattern can be set in a basic groove.
[0010] The through hole may include a first sidewall and a second sidewall adjacent to the first sidewall, and the crack detection pattern may include a first pattern portion disposed around the first sidewall, a second pattern portion connected to the first pattern portion and disposed around the first and second sidewalls, and a third pattern portion connected to the second pattern portion and disposed around the second sidewall, wherein the second pattern portion may be disposed between the first pattern portion and the first sidewall and between the third pattern portion and the second sidewall.
[0011] The first pattern portion, the second pattern portion, and the third pattern portion can be set in the groove.
[0012] The groove may include a first groove portion disposed around a first sidewall, a second groove portion connected to the first groove portion and disposed around the first and second sidewalls, and a third groove portion connected to the second groove portion and disposed around the second sidewall, wherein a first pattern portion may be disposed in the first groove portion, a second pattern portion may be disposed in the second groove portion, and a third pattern portion may be disposed in the third groove portion.
[0013] The groove can surround the entire through hole.
[0014] The groove can surround only a portion of the through hole.
[0015] The display panel can be provided with an active area configured to display an image and an adjacent peripheral area, and the via can be surrounded by the active area.
[0016] The display device may further include: a first crack detection line connected to a crack detection pattern; a second crack detection line connected to the crack detection pattern; a first connecting line connected to the crack detection pattern and the first crack detection line; and a second connecting line connected to the crack detection pattern and the second crack detection line.
[0017] The display device may further include: a first sensing electrode disposed on the display panel and including a first sensing pattern and a first connection pattern connected to the first sensing pattern; and a second sensing electrode disposed on the display panel and including a second sensing pattern and a second connection pattern, the second connection pattern being disposed on a different layer from the first connection pattern and connected to the second sensing pattern, wherein the crack detection pattern is disposed on the same layer as the first connection pattern or the second connection pattern.
[0018] An exemplary embodiment of the present invention provides a display device comprising: a display panel including a base layer, a circuit layer, a display element layer, and a packaging layer, wherein a through-hole passes through the base layer, the circuit layer, the display element layer, and the packaging layer; a compensation layer disposed on the display panel and surrounding the through-hole; and an input sensor including a plurality of sensing electrodes and a crack detection pattern disposed in a groove located on the top surface of the compensation layer.
[0019] The plurality of sensing electrodes may include a first sensing electrode and a second sensing electrode. The first sensing electrode includes a first sensing pattern and a first connection pattern connected to the first sensing pattern. The second sensing electrode includes a second sensing pattern and a second connection pattern. The second connection pattern is disposed on a different layer from the first connection pattern and is connected to the second sensing pattern. The crack detection pattern is disposed on the same layer as the first connection pattern or the second connection pattern.
[0020] In the direction from the top surface of the compensation layer to the base layer, the groove may overlap with the compensation layer or may not overlap with the compensation layer.
[0021] The base layer may include a plurality of base grooves on the top surface of the base layer, wherein the plurality of base grooves surround the through hole, and the crack detection pattern overlaps with one of the base grooves.
[0022] The crack detection pattern can be set in a basic groove.
[0023] An exemplary embodiment of the present invention provides a display device comprising: a base layer including a hole; a compensation layer disposed on the base layer and surrounding a peripheral portion of the hole, wherein the compensation layer includes a groove recessed from a top surface of the compensation layer; a crack detection pattern disposed in the groove; a first crack detection line connected to a first end of the crack detection pattern; and a second crack detection line connected to a second end of the crack detection pattern.
[0024] The groove may or may not overlap with the compensation layer.
[0025] An exemplary embodiment of the present invention provides a display device, which includes: a display panel including a base layer and an encapsulation layer; a compensation layer disposed on the encapsulation layer, the compensation layer including a groove; an input sensor disposed on the compensation layer and in the groove; and a crack detection pattern disposed in the groove.
[0026] Crack detection patterns can be conductive.
[0027] The recess can be adjacent to the sidewall of the through-hole that passes through the display panel, compensation layer, and input sensor.
[0028] The compensation layer can be placed between the sidewall and the groove.
[0029] The groove can overlap with the base groove located in the base layer. Attached Figure Description
[0030] The above and other features of the present invention will become clearer from the detailed description of exemplary embodiments of the invention with reference to the accompanying drawings. In the drawings:
[0031] Figure 1This is a perspective view illustrating an exemplary embodiment of a display device according to a concept of the present invention;
[0032] Figure 2 This is a schematic cross-sectional view illustrating an exemplary embodiment of a display device according to a concept of the present invention;
[0033] Figure 3 This is a plan view illustrating an exemplary embodiment of a display panel according to a concept of the present invention;
[0034] Figure 4 This is a plan view illustrating an input sensor according to an exemplary embodiment of the concept of the present invention;
[0035] Figure 5 This is a cross-sectional view illustrating an exemplary embodiment of a display device according to a concept of the present invention;
[0036] Figure 6 This illustrates an exemplary embodiment of the concept according to the present invention. Figure 4 An enlarged plan view of region XX' in the diagram;
[0037] Figure 7 This illustrates another exemplary embodiment of the concept according to the present invention. Figure 4 An enlarged plan view of region XX' in the diagram;
[0038] Figure 8 This illustrates another exemplary embodiment of the concept according to the present invention. Figure 4 An enlarged plan view of region XX' in the diagram;
[0039] Figure 9 This is a cross-sectional view illustrating an exemplary embodiment of a display device according to a concept of the present invention;
[0040] Figure 10 This illustrates another exemplary embodiment of the concept according to the present invention. Figure 4 A magnified plan view of region XX' in the diagram; and
[0041] Figure 11 This is a cross-sectional view illustrating an exemplary embodiment of a display device according to a concept of the present invention. Detailed Implementation
[0042] In this specification, it should also be understood that when a component (or area, layer, part) is referred to as being "on", "connected to", or "linked to" another component (or area, layer, part), it may be directly disposed on / directly connected to / directly linked to the other component (or area, layer, part), or there may be an intervening component (or area, layer, part).
[0043] Throughout this disclosure, the same reference numerals may refer to the same elements. Furthermore, in the drawings, for clarity, the thickness, proportions, and dimensions of parts may be exaggerated.
[0044] The term “and / or” includes any and all combinations of one or more of the relevant listed items.
[0045] It should be understood that although terms such as “first” and “second” are used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one component from others. For example, an element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims.
[0046] Unless otherwise stated, a singular term may include a plural term.
[0047] In addition, terms such as "below," "under," "above," and "upper" are used to explain the relationships between the components shown in the accompanying drawings. These terms can be relative concepts and are described based on the directions expressed in the drawings.
[0048] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. Terms defined in common dictionaries shall be interpreted as having the same meaning as in the context of the relevant art, and are not to be ideally or excessively interpreted as having a formal meaning unless expressly defined in the specification.
[0049] The meaning of "include" or "comprise" specifies a property, fixed number, step, operation, element, component, or combination thereof, but does not exclude other properties, fixed numbers, steps, operations, elements, components, or combinations thereof.
[0050] In the following description, exemplary embodiments of the inventive concept will be described with reference to the accompanying drawings.
[0051] Figure 1 This is a perspective view illustrating an exemplary embodiment of a display device according to a concept of the present invention.
[0052] refer to Figure 1 The display device 1000 can be activated based on the electrical signal. Figure 1 A mobile phone is shown as an example of a display device 1000. However, the inventive concept is not limited thereto, and the display device 1000 may be a mobile phone, a tablet computer, a navigation unit for a vehicle, a game console, or a wearable device.
[0053] Display device 1000 can display images through active region 1000A. Active region 1000A may include a plane formed along a first direction DR1 and a second direction DR2. Active region 1000A may also include curved surfaces that bend from at least two sides of the plane, respectively. For example, the curved surfaces may be located on opposite long sides of the plane. However, the inventive concept is not limited to the above-described shape of active region 1000A. For example, active region 1000A may include only a plane without curved surfaces, or it may include at least two curved surfaces, such as four curved surfaces that bend from four sides of the plane, respectively. The area surrounding or adjacent to active region 1000A may be referred to as the peripheral area in which no image is displayed.
[0054] The display device 1000 may have a thickness direction parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. The front surface (or top surface) and rear surface (or bottom surface) of each component of the display device 1000 may be described relative to the third direction DR3.
[0055] Figure 2 This is a schematic cross-sectional view illustrating a partial configuration of a display device according to an exemplary embodiment of the concept of the present invention.
[0056] refer to Figure 2 The display device 1000 may include a display panel 100 and an input sensor 200.
[0057] The display panel 100 can be a component that generates images. The display panel 100 can be a light-emitting display panel. For example, the display panel 100 can be an organic light-emitting display panel or a quantum dot light-emitting display panel. Alternatively, the display panel 100 can be a light-receiving display panel. For example, the display panel 100 can be a liquid crystal display panel that receives light from a backlight section.
[0058] Input sensor 200 can be disposed on display panel 100. For example, input sensor 200 can overlap display panel 100. Input sensor 200 can detect external input applied from the outside. External input can be user input. For example, user input can include various types of external input, such as a part of the user's body, light, heat, pen, or pressure. Input sensor 200 can sense user input when, for example, a part of the user's body touches or approaches input sensor 200.
[0059] The input sensor 200 may be disposed on the display panel 100. Alternatively, the input sensor 200 may be attached to the display panel 100 via an adhesive member. In other words, the adhesive member may be located between the input sensor 200 and the display panel 100. The adhesive member may include a general adhesive or bonding agent. For example, the adhesive member may be a transparent adhesive member, such as a pressure-sensitive adhesive film (PSA), an optically clear adhesive film (OCA), or an optically clear resin (OCR).
[0060] The display device 1000 may also include a window disposed on the input sensor 200. The window may include an optically transparent insulating material, such as glass or plastic. The window may have a multi-layered structure or a single-layered structure. The window can protect the input sensor 200 and the display panel 100.
[0061] Figure 3 This is a plan view illustrating an exemplary embodiment of a display panel according to a concept of the present invention.
[0062] refer to Figure 3 The display panel 100 provides an active region 100A and a peripheral region 100N. The active region 100A can be activated according to an electrical signal. For example, the active region 100A can display an image. The peripheral region 100N may surround the active region 100A. A drive circuit or drive line for driving the active region 100A may be provided in the peripheral region 100N.
[0063] A through-hole 100T may be provided in the active region 100A of the display panel 100. The through-hole 100T may be surrounded by the active region 100A. However, the inventive concept is not limited thereto. For example, a portion of the through-hole 100T may contact the active region 100A, and another portion may contact the peripheral region 100N. In another example, the through-hole 100T may be entirely located in the peripheral region 100N.
[0064] The through-hole 100T can be a space through which external signals input to or output from the electronic module are transmitted. For example, the electronic module can be a camera module.
[0065] The through-hole 100T can be formed by removing all or at least some of the components of the display panel 100. The through-hole 100T can have a circular, elliptical, polygonal, or polygonal shape with at least one curved edge. However, the inventive concept is not limited thereto.
[0066] The display panel 100 may include a base layer 100-1, multiple pixels 110, multiple signal lines 120, 130 and 140, multiple display pads 150 and multiple sensing pads 160. Pixels 110 may be located in an active region 100A, signal lines 120, 130 and 140 may be located in both the active region 100A and the peripheral region 100N, and display pads 150 and sensing pads 160 may be located in the peripheral region 100N.
[0067] The base layer 100-1 may include a glass substrate, an organic / inorganic composite substrate, or a synthetic resin film. The synthetic resin film may include a thermosetting resin. The base layer 100-1 may have a multilayer structure. For example, the base layer 100-1 may have a three-layer structure consisting of a synthetic resin layer, an adhesive layer, and a synthetic resin layer. The synthetic resin layer may include a polyimide-based resin layer; however, the inventive concept is not limited to the material of the synthetic resin layer. The synthetic resin layer may include at least one of acrylic acid-based resins, methacrylic acid-based resins, polyisoprene-based resins, ethylene-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and dinoflagellated resins.
[0068] Signal lines 120, 130 and 140 are connected to pixel 110 and transmit electrical signals to pixel 110. Figure 3 The signal lines 120, 130, and 140 are illustrated exemplarily as including a data line 120, a scan line 130, and a power line 140. However, this is merely illustrative. The signal lines 120, 130, and 140 may also include at least one of an initialization voltage line and an illumination control line. However, the inventive concept is not limited thereto.
[0069] Pixel 110 may be disposed in the active region 100A. In this embodiment, an exemplary amplifier circuit diagram of one of the plurality of pixels 110 is shown.
[0070] Pixel 110 may include a first transistor 111, a second transistor 112, a capacitor 113, and a light-emitting element 114. The first transistor 111 may be a switching element for controlling the on / off state of pixel 110. The first transistor 111 may transmit or block data signals transmitted via data line 120 in response to a scan signal transmitted via scan line 130. The first transistor 111 may be an N-type metal-oxide-semiconductor (NMOS) transistor or a P-type metal-oxide-semiconductor (PMOS) transistor.
[0071] Capacitor 113 can be connected to the first transistor 111 and the power line 140. For example, a first terminal of capacitor 113 can be connected to the first transistor 111, and a second terminal of capacitor 113 can be connected to the power line 140. Capacitor 113 stores the amount of charge corresponding to the difference between the data signal transmitted from the first transistor 111 and the first power signal applied to the power line 140.
[0072] The second transistor 112 can be connected to the first transistor 111, the capacitor 113, and the light-emitting element 114. For example, the second transistor 112 can be connected to the first and second terminals of the capacitor 113. The second transistor 112 controls the drive current flowing through the light-emitting element 114 in accordance with the amount of charge stored in the capacitor 113. The on-time of the second transistor 112 can be determined based on the amount of charge stored in the capacitor 113. During the on-time, the second transistor 112 can provide a first power signal transmitted through the power line 140 to the light-emitting element 114.
[0073] The light-emitting element 114 can generate light or control the amount of light according to an electrical signal. For example, the light-emitting element 114 may include an organic light-emitting element, a quantum dot light-emitting element, a micro light-emitting diode (LED) light-emitting element, or a nano LED light-emitting element.
[0074] The light-emitting element 114 can be connected to the power supply terminal 115 and receive a power signal (hereinafter referred to as the second power signal or ground voltage) that is different from the first power signal and is provided by the power supply line 140. When a drive current corresponding to the difference between the second power signal and the electrical signal provided from the second transistor 112 flows through the light-emitting element 114, the light-emitting element 114 can generate light corresponding to the drive current.
[0075] The configuration of pixel 110 is merely illustrative. For example, pixel 110 may include electronic components with various other configurations and arrangements, and therefore, the inventive concept is not limited to this. Figure 3 The pixel circuit shown is illustrated. For example, pixel 110 may have an equivalent circuit including seven transistors and a capacitor, and the equivalent circuit of pixel 110 may be varied.
[0076] Display pads 150 may include first pads 151 and second pads 152. Multiple first pads 151 may be provided, and multiple first pads 151 may be connected to data lines 120. Second pads 152 may be electrically connected to power lines 140 via power pattern 141. Second pads 152 may be positioned adjacent to one of the first pads 151. In an exemplary embodiment of the inventive concept, power pattern 141 may be omitted.
[0077] The display panel 100 can provide the pixels 110 with electrical signals supplied from the outside via the display pads 150. In addition to the first pad 151 and the second pad 152, the display pads 150 may also include pads for receiving other electrical signals.
[0078] A driver chip 170 may be mounted in the peripheral area 100N of the display panel 100. The driver chip 170 may be a chip-type timing control circuit. In this case, the data line 120 can be electrically connected to the first pad 151 through the driver chip 170. However, this is merely illustrative. Alternatively, the driver chip 170 may be mounted on a film separate from the display panel 100. In this case, the driver chip 170 can be electrically connected to the display pad 150 through this film.
[0079] Multiple sensing pads 160 can be electrically connected to the sensing electrodes of the sensor, which will be described later. Among the multiple sensing pads 160, a first portion of the sensing pad 160 (e.g., the sensing pad 160 on the left side of the driver chip 170) and a second portion of the sensing pad 160 (e.g., the sensing pad 160 on the right side of the driver chip 170) can be spaced apart from each other, with a display pad 150 located between them. However, the inventive concept is not limited thereto. For example, the arrangement relationship between the sensing pads 160 and the display pads 150 can be varied. For example, the sensing pads 160 can be located on only one side of the display pads 150.
[0080] Figure 4 This is a plan view illustrating an input sensor according to an exemplary embodiment of the concept of the present invention.
[0081] refer to Figure 4 The input sensor 200 can provide an active region 200A and a peripheral region 200N. The active region 200A can be activated according to an electrical signal. For example, the active region 200A can detect external input. The peripheral region 200N can surround the active region 200A.
[0082] An through-hole 200T may be provided in the active area 200A of the input sensor 200. The through-hole 200T may be on a plane and connected to the display panel 100 (reference). Figure 3 The aforementioned through hole 100T (reference) Figure 3 Overlap. The through-hole 200T can be set by removing all components of the input sensor 200.
[0083] The input sensor 200 may include a basic insulating layer 200-1, a first sensing electrode 210, a second sensing electrode 220, a first sensing line 231, a second sensing line 232, a crack detection pattern 310, a first connecting line 321, a second connecting line 322, a first crack detection line 331, and a second crack detection line 332.
[0084] The first sensing electrode 210 and the second sensing electrode 220 can be disposed in the active region 200A, and the first sensing line 231, the second sensing line 232, the first crack detection line 331, and the second crack detection line 332 can be disposed in the peripheral region 200N. The crack detection pattern 310 can be disposed in the hole region HA (reference). Figure 5 The first sensing line 231, the second sensing line 232, the first crack detection line 331, and the second crack detection line 332 are disposed around the through-hole 200T. They can be electrically connected to multiple sensing pads 160 (see reference) via contact holes. Figure 3 The first connecting line 321 and the second connecting line 322 can be located in the active region 200A and extend to the peripheral region 200N.
[0085] The input sensor 200 can obtain information about external inputs by measuring the change in mutual capacitance between the first sensing electrode 210 and the second sensing electrode 220. The first sensing electrodes 210 can be arranged in a first direction DR1, and each of the first sensing electrodes 210 can extend in a second direction DR2. Each first sensing electrode 210 may include a first sensing pattern 211 and a first connection pattern 212. The first connection pattern 212 can electrically connect two adjacent first sensing patterns 211 to each other. For example, in... Figure 4 In this invention, two first connecting patterns 212 can connect two rhomboid first sensing patterns 211 to each other. Although two adjacent first sensing patterns 211 can be connected to each other by two first connecting patterns 212, the inventive concept is not limited thereto. For example, a single first connecting pattern 212 can connect two adjacent first sensing patterns 211 to each other.
[0086] Each of the second sensing electrodes 220 may extend in a first direction DR1, and each of the second sensing electrodes 220 may be arranged in a second direction DR2. The second sensing electrode 220 may include a second sensing pattern 221 and a second connecting pattern 222. The second connecting pattern 222 may electrically connect two adjacent second sensing patterns 221 to each other. The two first connecting patterns 212 and the second connecting pattern 222 may intersect each other in an insulated manner.
[0087] Despite Figure 4 The shape and arrangement of the first sensing electrode 210 and the second sensing electrode 220 are illustrated in the figure, but the inventive concept is not limited thereto.
[0088] The first sensing lines 231 can be electrically connected to the first sensing electrodes 210 respectively. For example, two first sensing lines 231 can be connected to one end and the other end of a first sensing electrode 210 respectively. The second sensing lines 232 can be electrically connected to the second sensing electrodes 220 respectively. Although in Figure 4 The connection between the first sensing line 231 and the first sensing electrode 210 and the connection between the second sensing line 232 and the second sensing electrode 220 are illustrated by way of example, but the inventive concept is not limited thereto.
[0089] A crack detection pattern 310 may be disposed around the through-hole 200T. The crack detection pattern 310 may have a shape that surrounds at least a portion of the through-hole 200T. As an example, the crack detection pattern 310 may have a first portion located on a first side of the through-hole 200T and a second portion located on a second side of the through-hole 200T, separated from the first portion, the second side opposite to the first side. The crack detection pattern 310 may include a conductive material and is therefore conductive.
[0090] The crack detection pattern 310 may have one end connected to the first connecting line 321 and the other end connected to the second connecting line 322. In other words, the crack detection pattern 310 may have a first end connected to the first connecting line 321 and a second end connected to the second connecting line 322. The first connecting line 321 may electrically connect the crack detection pattern 310 and the first crack detection line 331, and the second connecting line 322 may electrically connect the crack detection pattern 310 and the second crack detection line 332.
[0091] According to an exemplary embodiment of the present invention, whether cracks have occurred around the through hole 200T and the peripheral region 200N can be determined by using crack detection pattern 310, first connecting line 321, second connecting line 322, first crack detection line 331 and second crack detection line 332.
[0092] Figure 5 This is a cross-sectional view illustrating an exemplary embodiment of a display device according to a concept of the present invention.
[0093] refer to Figure 3 , Figure 4 and Figure 5 The display device 1000 may include a display panel 100 and an input sensor 200. Through-holes 100T in the display panel 100 and 200T in the input sensor 200 may overlap each other. Through-holes 100T and 200T may have sidewalls SW, and the sidewalls SW may be formed by removing a portion of each of the display panel 100 and the input sensor 200.
[0094] The display panel 100 may include a base layer 100-1, a circuit layer 100-2, a display element layer 100-3, and a package layer 100-4. Each of the circuit layer 100-2 and the display element layer 100-3 may include multiple insulating layers, semiconductor patterns, conductive patterns, signal lines, etc. The insulating layers, semiconductor layers, and conductive layers are provided by methods such as coating and deposition. Subsequently, the insulating layers, semiconductor layers, and conductive layers can be selectively patterned by photolithography. The semiconductor patterns, conductive patterns, and signal lines contained in the circuit layer 100-2 and the display element layer 100-3 are set using the methods described above. Subsequently, a package layer 100-4 covering the display element layer 100-3 can be formed.
[0095] Multiple base recesses GV1, GV2, and GV3 can be provided in the base layer 100-1. Although Figure 5 The plurality of basic grooves GV1, GV2 and GV3 in the invention exemplarily include a first basic groove GV1, a second basic groove GV2 and a third basic groove GV3, but the inventive concept is not limited to the number of basic grooves GV1, GV2 and GV3.
[0096] Each of the plurality of foundation recesses GV1, GV2, and GV3 may have a shape that is recessed from the top surface of the foundation layer 100-1. When viewed from a planar perspective, each of the plurality of foundation recesses GV1, GV2, and GV3 may have a shape that surrounds the sidewall SW of the through-hole 100T. The first foundation recess GV1, the second foundation recess GV2, and the third foundation recess GV3 may block the penetration path of oxygen or external moisture to prevent it from being located in the active region 100A (reference). Figure 3 The components in the document are damaged.
[0097] At least one inorganic layer is disposed on the top surface of the base layer 100-1. The inorganic layer may include at least one selected from aluminum oxide, titanium oxide, silicon oxide, silicon nitride, zirconium oxide, and hafnium oxide. Multiple inorganic layers may be present. Multiple inorganic layers may provide barrier layers and / or buffer layers. In this embodiment, the display panel 100 includes a buffer layer BFL.
[0098] The buffer layer (BFL) increases the bonding strength between the base layer 100-1 and the semiconductor pattern. The buffer layer (BFL) may include a silicon oxide layer and a silicon nitride layer. Here, the silicon oxide layer and the silicon nitride layer may be stacked alternately on top of each other.
[0099] A semiconductor pattern is disposed on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, the inventive concept is not limited thereto. For example, the semiconductor pattern may include amorphous silicon, low-temperature polycrystalline silicon, or oxide semiconductor.
[0100] Figure 5A portion of a semiconductor pattern is shown. The semiconductor pattern can also be disposed in another region. For example, the semiconductor pattern can be arranged throughout pixel 110. The semiconductor pattern can have different electrical properties depending on whether it is entirely doped, partially doped, or undoped. The semiconductor pattern can include doped and undoped regions. The doped regions can be doped with n-type or p-type dopant. A p-type (e.g., PMOS) transistor can include a doped region doped with p-type dopant, and an n-type (e.g., NMOS) transistor can include a doped region doped with n-type dopant.
[0101] Doped regions can have a higher conductivity than undoped regions and can be used as electrodes or signal lines. Undoped regions can correspond to the active portion (or channel) of a transistor. In other words, a portion of the semiconductor pattern can be the active portion of a transistor, another portion of the semiconductor pattern can be the source or drain of a transistor, and yet another portion of the semiconductor pattern can be a connecting electrode or a connecting signal line.
[0102] like Figure 5 As shown, the source S2, active portion A2, and drain D2 of the second transistor 112 can be provided from a semiconductor pattern. The source S2 and drain D2 can extend from the active portion A2 in opposite directions in cross-section. Figure 5 A portion of the connection signal line SCL provided from the semiconductor pattern is shown. The connection signal line SCL can be connected on a plane to the drain D2 of the second transistor 112.
[0103] A first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may commonly overlap with a plurality of pixels 110 and cover a semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and has a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. In addition to the first insulating layer 10, the insulating layer of the circuit layer 100-2 may be an inorganic layer and / or an organic layer, and has a single-layer structure or a multi-layer structure. Although the inorganic layer may include at least one of the above materials, the inventive concept is not limited thereto.
[0104] A gate G2 is disposed on the first insulating layer 10. The gate G2 may be part of a metal pattern. The gate G2 overlaps with the active portion A2. The gate G2 may be used as a mask in the process of doping semiconductor patterns.
[0105] A second insulating layer 20 may be disposed on the first insulating layer 10 to cover the gate G2. The second insulating layer 20 may overlap with the pixel 110 in common. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer structure or a multi-layer structure. In this embodiment, the second insulating layer 20 may be a single-layer silicon oxide layer.
[0106] An upper electrode UE may be disposed on the second insulating layer 20. The upper electrode UE may overlap with the gate G2 of the second transistor 112. The upper electrode UE may be part of a metal pattern. The gate G2 and a portion of the upper electrode UE overlapping the gate G2 may form a capacitor 113. In an exemplary embodiment of the present invention, the upper electrode UE may be omitted.
[0107] A third insulating layer 30 may be disposed on the second insulating layer 20 to cover the upper electrode UE. In this embodiment, the third insulating layer 30 may be a single layer of silicon oxide.
[0108] A first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal line SCL through the contact hole CNT-1 passing through the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.
[0109] A fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single-layer silicon oxide layer. A fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.
[0110] A second connecting electrode CNE2 may be disposed on the fifth insulating layer 50. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through the contact hole CNT-2 passing through the fourth insulating layer 40 and the fifth insulating layer 50.
[0111] A sixth insulating layer 60 may be disposed on the fifth insulating layer 50 to cover the second connecting electrode CNE2. The sixth insulating layer 60 may be an organic layer.
[0112] A protruding portion DMP may be provided between the first base groove GV1 and the second base groove GV2. The protruding portion DMP may be referred to as a dam portion. The protruding portion DMP may include multiple insulating layers. The protruding portion DMP can prevent the expansion of the organic layer, which will be described later. Furthermore, although in Figure 5 An example of a protruding portion DMP is shown, but the inventive concept is not limited to only one protruding portion DMP.
[0113] The display element layer 100-3, including the light-emitting element 114, can be disposed on the circuit layer 100-2. The light-emitting element 114 may include a first electrode AE, a hole control layer HCL, a light-emitting layer EML, an electronic control layer ECL, and a second electrode CE.
[0114] The first electrode AE can be disposed on the sixth insulating layer 60. The first electrode AE can be connected to the second connecting electrode CNE2 through the contact hole CNT-3 passing through the sixth insulating layer 60. The first electrode AE can be the anode.
[0115] A pixel defining layer 70 may be disposed on the sixth insulating layer 60 to cover a portion of the first electrode AE. An opening 70-OP is provided in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.
[0116] like Figure 5 As shown, the active region 100A may include a pixel region PXA and a non-pixel region NPXA disposed adjacent to the pixel region PXA. The non-pixel region NPXA may surround the pixel region PXA. In this embodiment, the pixel region PXA may correspond to the portion of the first electrode AE exposed by the opening 70-OP.
[0117] The hole control layer HCL can be disposed on the first electrode AE. The hole control layer HCL can be commonly disposed in the pixel region PXA and the non-pixel region NPXA. In other words, the hole control layer HCL can extend from the pixel region PXA to the non-pixel region NPXA. The hole control layer HCL may also include a hole transport layer and a hole injection layer.
[0118] The emissive layer EML can be disposed on the hole control layer HCL. The emissive layer EML can be disposed in the region corresponding to the aperture 70-OP. In other words, the emissive layer EML can be disposed independently on pixel 110 (reference). Figure 3 On each of the pixels 110. However, the inventive concept is not limited thereto. For example, the light-emitting layer EML can be commonly disposed in the pixel region PXA and the non-pixel region NPXA. When the light-emitting layer EML is individually disposed on each of the pixels 110, the light-emitting layer EML can emit light having at least one color of blue, red, and green. When the light-emitting layer EML is commonly disposed on the pixels 110 (see reference 110), the light-emitting layer EML can emit light having at least one color of blue, red, and green. Figure 3 When the light-emitting layer EML is applied, it can provide blue or white light.
[0119] An electronic control layer (ECL) can be disposed on an emissive layer (EML). The ECL may include an electron transport layer and an electron injection layer. A hole control layer (HCL) and an ECL can be publicly provided to multiple pixels 110 using an aperture mask.
[0120] The second electrode CE can be disposed on the electronic control layer ECL. The second electrode CE can have an integrated shape and be commonly disposed on multiple pixels 110 (reference). Figure 3 In the process, the second electrode CE can be the cathode.
[0121] A capping layer 80 may be disposed on the second electrode CE to contact the second electrode CE. The capping layer 80 may include an organic material. The capping layer 80 can protect the second electrode CE from the effects of subsequent processes (e.g., sputtering processes) and improve the luminous efficiency of the light-emitting element 114. Although the refractive index of the capping layer 80 may be greater than the refractive index of the first inorganic layer 91, which will be described later, the inventive concept is not limited thereto. In exemplary embodiments of the inventive concept, the capping layer 80 may be omitted.
[0122] An encapsulation layer 100-4 may be disposed on the display element layer 100-3. The encapsulation layer 100-4 may extend from the pixel region PXA to the aperture region HA. The encapsulation layer 100-4 may include a first inorganic layer 91, an organic layer 92, and a second inorganic layer 93. The first inorganic layer 91, organic layer 92, and second inorganic layer 93 may be disposed in the pixel region PXA, and simultaneously in the aperture region HA. The first inorganic layer 91 and second inorganic layer 93 protect the display element layer 100-3 from oxygen and moisture, and the organic layer 92 protects the display element layer 100-3 from impurities such as dust particles. Each of the first inorganic layer 91 and second inorganic layer 93 may include a silicon nitride layer, a silicon oxide nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. Although the organic layer 92 may include an acrylic-based organic layer, the inventive concept is not limited thereto.
[0123] In an exemplary embodiment of the present invention, an inorganic layer, such as a LiF layer, may be disposed between the cover layer 80 and the first inorganic layer 91. The LiF layer can improve the luminous efficiency of the light-emitting element 114.
[0124] A compensation layer 400 may be provided on the encapsulation layer 100-4. For example, the compensation layer 400 may be provided in the hole region HA surrounding the peripheral portion of each of the through holes 100T and 200T, and the compensation layer 400 may surround the peripheral portion of each of the through holes 100T and 200T. The compensation layer 400 may include an organic material. The compensation layer 400 may cover the non-planar surface defined by the protrusion DMP or the first base recess GV1, the second base recess GV2, and the third base recess GV3 to provide a flat surface thereon. For example, the compensation layer 400 may cover the first inorganic layer 91 and the second inorganic layer 93 located on the protrusion DMP and in the second base recess GV2 and the third base recess GV3. The compensation layer 400 may also cover the element of the encapsulation layer 100-4 located above the first base recess GV1. Therefore, a flat surface can be provided in the region adjacent to the through holes 100T and 200T and where no organic layer 92 is provided.
[0125] A groove 400H may be provided in the compensation layer 400. The groove 400H can be provided by removing a portion of the compensation layer 400 in the thickness direction (e.g., third direction DR3). In the process of patterning the compensation layer 400, the groove 400H can be provided using a half-mask or a slit mask. The groove 400H may have a shape that is recessed from the top surface 400U of the compensation layer 400. When viewed from a planar perspective, the groove 400H may have a shape that surrounds at least a portion of the sidewall SW. For example, the groove 400H may be provided in the region corresponding to the second basic groove GV2, and the region corresponding to the third basic groove GV3 may be located between the groove 400H and the sidewall SW.
[0126] The input sensor 200 can be disposed on the display panel 100 and the compensation layer 400. The input sensor 200 may include a base insulating layer 200-1, a first conductive layer 200-2, a sensing insulating layer 200-3, a second conductive layer 200-4, and a cover insulating layer 200-5. The input sensor 200 can be disposed via a continuous process following the placement of the display panel 100. However, the inventive concept is not limited thereto.
[0127] The base insulating layer 200-1 can be directly disposed on the display panel 100. For example, the base insulating layer 200-1 can directly contact the second inorganic layer 93. The base insulating layer 200-1 can have a single-layer structure or a multi-layer structure.
[0128] Each of the first conductive layer 200-2 and the second conductive layer 200-4 may have a single-layer structure or a multi-layer structure stacked on the third-direction DR3. The single-layer conductive layer may include a metal layer or a transparent conductive layer. When each of the first conductive layer 200-2 and the second conductive layer 200-4 includes an opaque metal layer, each of the first sensing pattern 211, the second sensing pattern 221, the second connection pattern 222, the first connection line 321, and the second connection line 322 may have a mesh structure.
[0129] The metal layer may include molybdenum, silver, titanium, copper, aluminum, and their alloys. The transparent conductive layer may include transparent conductive oxides, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). The transparent conductive layer may also include conductive polymers, such as PEDOT, metal nanowires, or graphene.
[0130] The multilayer conductive layer may include multiple metal layers. The multilayer metal layer may have a three-layer structure, such as titanium / aluminum / titanium. The multilayer metal layer may include at least one metal layer and at least one transparent conductive layer.
[0131] The first conductive layer 200-2 and the second conductive layer 200-4 may include a first sensing pattern 211, a first connection pattern 212, a second sensing pattern 221, and a second connection pattern 222 (see reference). Figure 4 The first conductive layer 200-2 may include a first connection pattern 212, and the second conductive layer 200-4 may include a first sensing pattern 211, a second sensing pattern 221, a second connection pattern 222, and a crack detection pattern 310.
[0132] Included in a second sensing electrode 220 (reference) Figure 4 The second sensing pattern 221 and the second connecting pattern 222 in the second sensing pattern 221 can have an integrated shape that is connected to each other. Therefore, each of the second sensing patterns 221 can be referred to as a first part, and each of the second connecting patterns 222 can be referred to as a second part.
[0133] However, this is merely illustrative. For example, although each of the first conductive layer 200-2 and the second conductive layer 200-4 may include the aforementioned components, the inventive concept is not limited thereto. For example, the crack detection pattern 310 may be included in the first conductive layer 200-2, rather than in the second conductive layer 200-4 as described above. Alternatively, the first conductive layer 200-2 may include a first sensing pattern 211, a second sensing pattern 221, a second connection pattern 222, and the crack detection pattern 310, and the second conductive layer 200-4 may include the first connection pattern 212.
[0134] A sensing insulating layer 200-3 may be disposed between the first conductive layer 200-2 and the second conductive layer 200-4 to cover the first conductive layer 200-2. Some components of the second conductive layer 200-4 may be electrically connected to some components of the first conductive layer 200-2 through contact holes in the sensing insulating layer 200-3. A cover insulating layer 200-5 may be disposed on the sensing insulating layer 200-3 to cover the second conductive layer 200-4.
[0135] At least one of the sensing insulating layer 200-3 and the cover insulating layer 200-5 may include an inorganic layer. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, zirconium oxide, and hafnium oxide.
[0136] At least one of the sensing insulating layer 200-3 and the cover insulating layer 200-5 may include an organic layer. The organic layer may include at least one of the following: acrylic acid-based resin, methacrylic acid-based resin, polyisoprene-based resin, ethylene-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and dinoflagellate-based resin.
[0137] A crack detection pattern 310 can be disposed in a groove 400H of the compensation layer 400. The groove 400H can be formed by removing a portion of the compensation layer 400 in the thickness direction (e.g., the third direction DR3). Therefore, a portion of the compensation layer 400 can be disposed between the crack detection pattern 310 and the base layer 100-1, and the crack detection pattern 310 can be disposed on a portion of the compensation layer 400. The portion of the compensation layer 400 disposed between the crack detection pattern 310 and the base layer 100-1 can overlap with the second base groove GV2.
[0138] When viewed in cross-section, the crack detection pattern 310 can be positioned lower than the top surface 400U of the compensation layer 400. When the crack detection pattern 310 is positioned in the groove 400H, it can be located near points with a high probability of crack occurrence. For example, the crack detection pattern 310 can be positioned near the sidewalls SW of the through holes 100T and 200T. Therefore, the probability of crack propagation to the crack detection pattern 310 can be increased, and the crack detection sensitivity around the through holes 100T and 200T can be increased by the crack detection pattern 310 positioned in the groove 400H.
[0139] For example, in the process of forming vias 100T and 200T, cracks may appear in the layer adjacent to the sidewall SW, and the resulting cracks may propagate to the peripheral area of the sidewall SW. When the resulting crack reaches the crack detection pattern 310, the crack detection pattern 310 may be short-circuited or have increased resistance, and this feature can be used to detect the crack.
[0140] According to an exemplary embodiment of the present invention, since the crack detection pattern 310 is disposed in the groove 400H, the distance between the crack detection pattern 310 and the second inorganic layer 93 can be reduced. Therefore, the probability of a crack appearing in the second inorganic layer 93 propagating to the crack detection pattern 310 can be increased. Furthermore, since the crack detection pattern 310 is disposed lower than the top surface 400U of the compensation layer 400, the probability of a crack propagating in the first direction DR1 in the compensation layer 400 propagating to the crack detection pattern 310 can be increased. Therefore, the crack detection sensitivity of the crack detection pattern 310 can be increased. Thus, the reliability of the product can be improved.
[0141] according to Figures 1 to 5 The exemplary embodiment of the inventive concept shown herein includes a display device 1000 comprising: a display panel 100, comprising a base layer 100-1, a circuit layer 100-2, a display element layer 100-3, and an encapsulation layer 100-4, wherein through-holes 100T / 200T pass through the base layer 100-1, the circuit layer 100-2, the display element layer 100-3, and the encapsulation layer 100-4; a compensation layer 400 disposed on the encapsulation layer 100-4, wherein the compensation layer 400 is adjacent to the through-holes 100T / 200T; and a crack detection pattern 310 disposed in a groove 400H located on the top surface 400U of the compensation layer 400.
[0142] Figure 6 This illustrates an exemplary embodiment of the concept according to the present invention. Figure 4 A magnified plan view of region XX' in the diagram.
[0143] refer to Figure 6 The through-hole 200T may be defined by a sidewall SW. The sidewall SW may include a first sidewall SW1 and a second sidewall SW2, and the boundary between the first sidewall SW1 and the second sidewall SW2 is shown by a dashed line on the second direction DR2. The first sidewall SW1 and the second sidewall SW2 may be adjacent to each other and connected to each other.
[0144] The crack detection pattern 310 may include a first pattern portion 310-1, a second pattern portion 310-2, and a third pattern portion 310-3. The first pattern portion 310-1 may surround a portion of a first sidewall SW1. The second pattern portion 310-2 may bend from the first pattern portion 310-1 and surround the first sidewall SW1 and the second sidewall SW2. For example, the second pattern portion 310-2 may be connected to the first pattern portion 310-1 near the fracture in the groove 400H, and the second pattern portion 310-2 may be closer to the first sidewall SW1 than the first pattern portion 310-1. The third pattern portion 310-3 may bend from the second pattern portion 310-2 and surround the second sidewall SW2. A portion of the second pattern portion 310-2 may be disposed between the first pattern portion 310-1 and the first sidewall SW1, and another portion of the second pattern portion 310-2 may be disposed between the third pattern portion 310-3 and the second sidewall SW2.
[0145] In the crack detection pattern 310, a first end 310e1 connected to the first connecting line 321, a second end 310e2 connected to the second connecting line 322, a first curved portion 310c1 located between the first pattern portion 310-1 and the second pattern portion 310-2, and a second curved portion 310c2 located between the second pattern portion 310-2 and the third pattern portion 310-3 can be provided. The first curved portion 310c1 and the second curved portion 310c2 can face each other while being spaced apart from each other.
[0146] The first pattern portion 310-1 extends counterclockwise from the first end 310e1 to the first curved portion 310c1 along the perimeter of the first sidewall SW1. The second pattern portion 310-2 extends clockwise from the first curved portion 310c1 to the second curved portion 310c2 along the perimeter of each of the first sidewall SW1 and the second sidewall SW2. The third pattern portion 310-3 extends counterclockwise from the second curved portion 310c2 to the second end 310e2 along the perimeter of the second sidewall SW2.
[0147] Crack detection pattern 310, first connecting line 321, first crack detection line 331 and second crack detection line 332 may be included in the second conductive layer 200-4 (reference). Figure 5 The second connection line 322 may be included in the first conductive layer 200-2 (reference). Figure 5In the first conductive layer 200-2 and the second conductive layer 200-4, they can contact each other through contact holes. Therefore, for example, the second connecting line 322 and the second crack detection line 332 can be electrically connected through contact holes passing through the sensing insulating layer 200-3, and the second connecting line 322 and the crack detection pattern 310 can be electrically connected through contact holes passing through the sensing insulating layer 200-3.
[0148] A crack detection pattern 310 can be disposed within a groove 400H. Therefore, when viewed from a plane, the crack detection pattern 310 can overlap with the groove 400H. The groove 400H can have a shape that surrounds a portion of the sidewall SW. For example, the groove 400H may not be disposed in the region between the first curved portion 310c1 and the second curved portion 310c2. Alternatively, the groove 400H can be disposed between the first curved portion 310c1 and the second curved portion 310c2.
[0149] The width of the groove 400H can be greater than the sum of the widths of the first pattern portion 310-1, the second pattern portion 310-2, and the distance between the first pattern portion 310-1 and the second pattern portion 310-2. For example, the width of each of the first pattern portion 310-1, the second pattern portion 310-2, and the third pattern portion 310-3 can be approximately 4 μm, and the distance between the first pattern portion 310-1 and the second pattern portion 310-2 can be approximately 6 μm. Furthermore, the distance between the second pattern portion 310-2 and the third pattern portion 310-3 can also be approximately 6 μm.
[0150] Figure 7 This illustrates an exemplary embodiment of the concept according to the present invention. Figure 4 A magnified plan view of region XX' in the diagram.
[0151] refer to Figure 7 The crack detection pattern 310 can be set in the groove 400Ha. The groove 400Ha can have a shape that surrounds the entire sidewall SW. In other words, the groove 400Ha can have a closed curved shape.
[0152] Figure 8 This illustrates an exemplary embodiment of the concept according to the present invention. Figure 4 A magnified plan view of region XX' in the diagram.
[0153] The crack detection pattern 310a can have various deformed shapes, and Figure 8 An example of it is shown in the figure.
[0154] refer to Figure 8The crack detection pattern 310a can extend from the first end 310e1 to the second end 310e2 in a counterclockwise direction along the perimeter of each of the first sidewall SW1 and the second sidewall SW2. Figure 9 This is a cross-sectional view illustrating an exemplary embodiment of a display device according to a concept of the present invention. Figure 10 This illustrates an exemplary embodiment of the concept according to the present invention. Figure 4 A magnified plan view of region XX' in the diagram.
[0155] refer to Figure 9 and Figure 10 The crack detection pattern 310 can be set in the groove 400Hb. When viewed from a plane, the groove 400Hb has a shape corresponding to the shape of the crack detection pattern 310.
[0156] The groove 400Hb may include a first groove portion 400Hb-1, a second groove portion 400Hb-2, and a third groove portion 400Hb-3. The first groove portion 400Hb-1 may surround a portion of a first sidewall SW1. The second groove portion 400Hb-2 may bend from the first groove portion 400Hb-1 and surround the first sidewall SW1 and a second sidewall SW2. The third groove portion 400Hb-3 may bend from the second groove portion 400Hb-2 and surround the second sidewall SW2. A portion of the second groove portion 400Hb-2 may be disposed between the first groove portion 400Hb-1 and the first sidewall SW1, and another portion of the second groove portion 400Hb-2 may be disposed between the third groove portion 400Hb-3 and the second sidewall SW2.
[0157] A first pattern portion 310-1 can be disposed in a first groove portion 400Hb-1, a second pattern portion 310-2 can be disposed in a second groove portion 400Hb-2, and a third pattern portion 310-3 can be disposed in a third groove portion 400Hb-3. Protrusions can be provided between the first pattern portion 310-1 and the second pattern portion 310-2, and between the second pattern portion 310-2 and the third pattern portion 310-3.
[0158] Figure 11 This is a cross-sectional view illustrating an exemplary embodiment of a display device according to a concept of the present invention.
[0159] refer to Figure 11 A groove 400Hc may be provided in the compensation layer 400. The groove 400Hc can be provided by removing a portion of the compensation layer 400 in the thickness direction (e.g., third direction DR3).
[0160] The groove 400Hc can be formed by using a binary mask in the process of patterning the compensation layer 400. The groove 400Hc can have a shape that is recessed from the top surface 400U of the compensation layer 400.
[0161] When viewed from a planar perspective, the groove 400Hc can overlap with the second base groove GV2. The groove 400Hc can extend inside the second base groove GV2, and the crack detection pattern 310b can be disposed within the second base groove GV2. For example, in the second base groove GV2, the base insulating layer 200-1 can be in direct contact with the second inorganic layer 93, and there is no compensation layer 400 between them.
[0162] Since the crack detection pattern 310b is positioned in the area obtained by removing a complete portion of the compensation layer 400, the crack detection pattern 310b and the compensation layer 400 can be non-overlapping when viewed from a plane. Furthermore, the crack detection pattern 310b can be spaced apart from the compensation layer 400 when viewed from a plane.
[0163] According to an exemplary embodiment of the present invention, a groove (e.g., 400H) may be provided in a compensation layer (e.g., 400), which is disposed around the through-holes (e.g., 100T and 200T) to provide a flat top surface. A crack detection pattern (e.g., 310) for detecting cracks around the through-holes may be provided in the groove of the compensation layer. Since the groove is provided by removing part or all of the compensation layer from the top surface of the compensation layer in the thickness direction, the crack detection pattern can be set lower than the top surface of the compensation layer. When the crack detection pattern is provided in the groove, the probability of crack propagation to the crack detection pattern can be increased. Therefore, the crack detection sensitivity around the through-holes can be increased.
[0164] Although the inventive concept has been described with reference to exemplary embodiments thereof, it should be understood that various changes and modifications may be made thereto without departing from the spirit and scope of the inventive concept as claimed in the appended claims.
Claims
1. A display device, including: The display panel includes a base layer, a circuit layer, a display element layer, and a packaging layer, wherein through-holes pass through the base layer, the circuit layer, the display element layer, and the packaging layer; A compensation layer is disposed on the encapsulation layer, wherein the compensation layer is adjacent to the via; and The crack detection pattern is set in a groove located on the top surface of the compensation layer. The base layer includes a plurality of base grooves located on the top surface of the base layer adjacent to the through hole, and the crack detection pattern overlaps with one of the plurality of base grooves.
2. The display device according to claim 1, wherein, A portion of the compensation layer is disposed between the crack detection pattern and the base layer.
3. The display device according to claim 1, wherein, When viewed from the top surface of the compensation layer, the crack detection pattern does not overlap with the compensation layer.
4. The display device according to claim 1, wherein, The crack detection pattern is set in the basic groove.
5. The display device according to claim 1, wherein, The through hole includes a first sidewall and a second sidewall adjacent to the first sidewall, and The crack detection pattern includes a first pattern portion disposed around the first sidewall, a second pattern portion connected to the first pattern portion and disposed around the first sidewall and the second sidewall, and a third pattern portion connected to the second pattern portion and disposed around the second sidewall. The second pattern portion is disposed between the first pattern portion and the first sidewall, and between the third pattern portion and the second sidewall.
6. The display device according to claim 5, wherein, The first pattern portion, the second pattern portion, and the third pattern portion are disposed in the groove located on the top surface of the compensation layer.
7. The display device according to claim 5, wherein, The groove located on the top surface of the compensation layer includes a first groove portion disposed around the first sidewall, a second groove portion connected to the first groove portion and disposed around the first sidewall and the second sidewall, and a third groove portion connected to the second groove portion and disposed around the second sidewall. The first pattern portion is disposed in the first groove portion, the second pattern portion is disposed in the second groove portion, and the third pattern portion is disposed in the third groove portion.
8. The display device according to claim 1, wherein, The groove located on the top surface of the compensation layer surrounds the entire through hole.
9. The display device according to claim 1, wherein, The groove located on the top surface of the compensation layer surrounds only a portion of the through hole.
10. The display device according to claim 1, wherein, The display panel has an active area configured to display an image and a peripheral area adjacent to the active area, and the through hole is surrounded by the active area.
11. The display device according to claim 10, further comprising: A first crack detection line is connected to the crack detection pattern; A second crack detection line is connected to the crack detection pattern; A first connecting line is connected to the crack detection pattern and the first crack detection line; as well as The second connecting line is connected to the crack detection pattern and the second crack detection line.
12. The display device according to claim 1, further comprising: A first sensing electrode is disposed on the display panel and includes a first sensing pattern and a first connection pattern connected to the first sensing pattern; as well as The second sensing electrode is disposed on the display panel and includes a second sensing pattern and a second connection pattern disposed on a different layer from the first connection pattern and connected to the second sensing pattern. The crack detection pattern is set on the same layer as the first connection pattern or the second connection pattern.
13. A display device, including: The display panel includes a base layer, a circuit layer, a display element layer, and a packaging layer, wherein through-holes pass through the base layer, the circuit layer, the display element layer, and the packaging layer; A compensation layer is disposed on the display panel and surrounds the through-hole; and The input sensor includes multiple sensing electrodes and a crack detection pattern disposed in a groove located on the top surface of the compensation layer. The base layer includes a plurality of base grooves on the top surface of the base layer, and the crack detection pattern overlaps with one of the base grooves.
14. The display device according to claim 13, wherein, The plurality of sensing electrodes includes a first sensing electrode and a second sensing electrode. The first sensing electrode includes a first sensing pattern and a first connection pattern connected to the first sensing pattern. The second sensing electrode includes a second sensing pattern and a second connection pattern disposed on a different layer from the first connection pattern and connected to the second sensing pattern. The crack detection pattern is set on the same layer as the first connection pattern or the second connection pattern.
15. The display device according to claim 13, wherein, In the direction from the top surface of the compensation layer to the base layer, the groove located on the top surface of the compensation layer may or may not overlap with the compensation layer.
16. The display device of claim 13, wherein the plurality of basic recesses surround the through hole.
17. The display device according to claim 16, wherein, The crack detection pattern is set in the basic groove.
18. A display device, including: The base layer includes holes; A compensation layer is disposed on the base layer and surrounding the periphery of the hole, wherein the compensation layer includes a groove recessed from the top surface of the compensation layer; A crack detection pattern is provided in the groove recessed from the top surface of the compensation layer; The first crack detection line is connected to the first end of the crack detection pattern; as well as The second crack detection line is connected to the second end of the crack detection pattern. The groove recessed from the top surface of the compensation layer overlaps with the base groove in the base layer.
19. The display device according to claim 18, wherein, The groove recessed from the top surface of the compensation layer may or may not overlap with the compensation layer.