Voltage supply circuit device with charge pump mode and boost converter mode
By designing a voltage supply circuit device that can switch between charge pump mode and boost converter mode, the problem of inefficient switching in the prior art is solved, and performance and cost optimization in different voltage systems are achieved.
Patent Information
- Application Number
- CN202110189871.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-03-04
- Filing Date
- 2021-02-18
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2041-02-18
AI Technical Summary
Existing voltage supply circuit devices cannot simultaneously achieve efficient switching between boost converter and charge pump modes in different applications, resulting in performance and cost issues.
A voltage supply circuit device is designed that can switch between charge pump mode and boost converter mode. Different control signals are generated by a driver circuit to control high-side and low-side switching elements, thereby optimizing the number of external components and cost.
It optimizes the number and price of external components in 12V and 48V automotive systems, while improving performance and reducing costs, and is suitable for multiple voltage systems.
Smart Images

Figure CN113364273B_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to techniques for voltage supply circuitry. Background Art
[0002] The voltage supply circuit arrangement can be used to output a voltage different from the received voltage. In some applications, a boost converter can convert a received voltage of 3V to an output voltage of at least 13V. In other applications, a charge pump can convert a received voltage of 20V to an output voltage of at least 30V. To support different applications, a designer can select a first circuit to implement a boost converter for some applications and a second circuit to implement a charge pump for other applications. Summary of the Invention
[0003] Generally, the present disclosure relates to techniques for implementing a voltage supply circuit arrangement configured to operate in both a charge pump mode and a boost converter mode. For example, the voltage supply circuit arrangement may include a driver circuit arrangement configured to generate a high-side control signal and a low-side control signal for operating in the charge pump mode when a storage element is arranged in a charge pump configuration, and to generate a high-side control signal and a low-side control signal for operating in the boost converter mode when the storage element is arranged in a boost converter configuration. In this way, a single voltage supply circuit arrangement can be used in applications where a boost converter has improved performance and / or lower cost compared to a charge pump, and where a boost converter has improved performance and / or lower cost compared to a charge pump.
[0004] In one example, a voltage supply circuit device includes: a positive power supply pin and a reference power supply pin, configured to be coupled to a power supply; a high-side pin and a low-side pin, configured to be coupled to a storage element; an output pin; a high-side switching element, configured to electrically couple the positive power supply pin and the low-side pin based on a high-side control signal; a low-side switching element, configured to electrically couple the reference power supply pin and the low-side pin based on a low-side control signal; a first switching element, configured to electrically couple the positive power supply pin and the high-side pin; a second switching element, configured to electrically couple the high-side pin and the output pin; a third switching element, configured to electrically couple the output pin and the low-side pin; and a driver circuit device, configured to: generate a high-side control signal and a low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit device, and generate a high-side control signal and a low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit device.
[0005] In another example, a voltage supply circuit device includes: a positive power supply pin and a reference power supply pin configured to be coupled to a power supply; a high-side pin and a low-side pin configured to be coupled to a storage element; an output pin; a high-side switching element configured to electrically couple the positive power supply pin and the high-side node based on a high-side control signal; a low-side switching element configured to electrically couple the reference power supply pin and the low-side pin based on a low-side control signal; a first switching element configured to electrically couple the positive power supply pin and the high-side pin; a second switching element configured to electrically couple the high-side pin and the output pin; a third switching element configured to electrically couple the output pin and the low-side pin; a fourth switching element configured to electrically couple the high-side node and the low-side pin; and a driver circuit device configured to: generate a high-side control signal and a low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit device, and generate a high-side control signal and a low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit device.
[0006] In one example, a voltage supply circuit device includes: a positive power supply pin and a reference power supply pin configured to be coupled to a power supply; a high-side pin and a low-side pin configured to be coupled to a storage element; an output pin; a high-side switching element configured to electrically couple the positive power supply pin and the high-side node based on a high-side control signal; a low-side switching element configured to electrically couple the reference power supply pin and the low-side pin based on a low-side control signal; a first diode including an anode coupled to the positive power supply pin and a cathode coupled to the high-side pin; a second diode including an anode coupled to the high-side pin and a cathode coupled to the output pin; a cathode of the output pin; a third diode including an anode coupled to the low-side pin and a cathode coupled to the output pin; a fourth diode including an anode coupled to the high-side node and a cathode coupled to the low-side pin; and a driver circuit device configured to generate a high-side control signal and a low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit device, and to generate a high-side control signal and a low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit device.
[0007] The details of these and other examples are set forth in the drawings and description below.Other features, objects, and advantages will be apparent from the description and drawings, and from the claims. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Figure 1 is a block diagram illustrating an example system for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0009] Figure 2Ais a conceptual diagram illustrating operation of a first circuit for providing charge pump mode and boost converter mode functionality in a first stage of charge pump mode, in accordance with one or more techniques of this disclosure.
[0010] Figure 2B is a conceptual diagram illustrating operation of a first circuit for providing charge pump mode and boost converter mode functionality in a second phase of charge pump mode, in accordance with one or more techniques of this disclosure.
[0011] Figure 3A is a conceptual diagram illustrating operation of a second circuit for providing charge pump mode and boost converter mode functionality in a first phase of boost converter mode, in accordance with one or more techniques of this disclosure.
[0012] Figure 3B is a conceptual diagram illustrating operation of a second circuit for providing charge pump mode and boost converter mode functionality in a second phase of boost converter mode, in accordance with one or more techniques of this disclosure.
[0013] Figure 4A is a conceptual diagram illustrating operation of a third circuit for providing charge pump mode and boost converter mode functionality in a first phase of boost converter mode, in accordance with one or more techniques of this disclosure.
[0014] Figure 4B is a conceptual diagram illustrating operation of a third circuit for providing charge pump mode and boost converter mode functionality in a second phase of boost converter mode, in accordance with one or more techniques of this disclosure.
[0015] Figure 5 is a conceptual diagram illustrating a fourth circuit having a first current limiting circuit arrangement for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0016] Figure 6 is a conceptual diagram illustrating a fifth circuit with second current limiting circuitry for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0017] Figure 7 is a conceptual diagram illustrating a sixth circuit having first mode detection circuitry for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0018] Figure 8 is a conceptual diagram illustrating a seventh circuit with second mode detection circuitry for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0019] Figure 9is a conceptual diagram illustrating an eighth circuit having third mode detection circuitry for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0020] Figure 10 is a conceptual diagram illustrating a ninth circuit having fourth mode detection circuitry for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0021] Figure 11 is a conceptual diagram illustrating a tenth circuit having fifth mode detection circuitry for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0022] Figure 12 is a conceptual diagram illustrating an eleventh circuit with a capacitor disposed at an output pin for providing charge pump mode and boost converter mode functionality, according to one or more techniques of this disclosure.
[0023] Figure 13 is a conceptual diagram illustrating a twelfth circuit using a diode for providing charge pump mode and boost converter mode functionality, in accordance with one or more techniques of this disclosure.
[0024] The details of one or more examples are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description, drawings, and claims. DETAILED DESCRIPTION
[0025] In general, the present disclosure relates to techniques for implementing a voltage supply circuit arrangement configured to operate in both a charge pump mode and a boost converter mode. For example, a single voltage supply circuit can be used in applications where a boost converter has improved performance and / or lower cost compared to a charge pump, and where a boost converter has improved performance and / or lower cost compared to a charge pump. While the foregoing discussion discusses automotive applications, the techniques described herein for a voltage supply circuit arrangement configured to operate in both a charge pump mode and a boost converter mode can be used in other applications.
[0026] In an exemplary automotive application, when a metal oxide semiconductor field effect transistor (MOSFET) transistor, or simply a "transistor," is turned on, a voltage of at least 10 V is placed between the gate and source of the transistor. This voltage of at least 10 V is greater than the battery voltage and can be generated by a gate driver.
[0027] However, generating a voltage at least 10V greater than the battery voltage in a 12V system can be difficult because the minimum allowable battery voltage can be as low as 3V for tens of milliseconds (which, for an integrated circuit device (IC), implies continuous operation). A multi-stage charge pump or a DC / DC boost converter can be used to generate a voltage at least 10V greater than the battery voltage under these conditions. However, compared to a boost converter, a multi-stage charge pump may have several implementation issues, including greater control difficulty, larger IC size, and a higher number of external components. Therefore, for some 12V automotive systems, a boost converter may be more preferable than a multi-stage charge pump. For example, for some 12V automotive systems, a boost converter may be easier to implement and have a higher speed than a multi-stage charge pump.
[0028] In a 48V automotive system, since the minimum allowed voltage is approximately 20V, a single-stage charge pump can generate a voltage 10V higher than the battery voltage using only two capacitors. In comparison, a boost converter can use capacitors and inductors that are more expensive than several capacitors. In this way, the charge pump can have a reduced cost compared to using a boost converter for a 48V automotive system. In this way, a gate driver using a boost converter can use semiconductor components (e.g., transistors) that are too expensive or unnecessary in a 48V automotive system, while a gate driver using a single-stage charge pump may not meet the requirements of a 12V automotive system. According to the technology disclosed in the present invention, a voltage supply circuit device can be configured to be usable in both 12V and 48V automotive systems while optimizing the number and price of the external components used. Again, the technology described herein for providing charge pump mode and boost converter mode functionality can be used in applications other than automotive applications and can be used in voltage systems other than 12V and 48V systems.
[0029] Figure 1 is a block diagram illustrating an example system 100 for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. Figure 1 System 100 may include a power supply 102 , a voltage supply circuit 104 , a capacitor 106 , and a storage element 108 .
[0030] Power supply 102 can be configured to provide power to one or more other components of system 100. For example, power supply 102 can be configured to supply power to capacitor 106 and / or storage element 108. In some examples, power supply 102 can be a battery configured to store electrical energy. Examples of batteries can include, but are not limited to, nickel-cadmium, lead-acid, nickel-metal hydride, nickel-zinc, silver oxide, lithium-ion, lithium polymer, any other type of rechargeable battery, or any combination thereof. In some examples, power supply 102 can be the output of a power converter or power inverter. For example, power supply 102 can be the output of a direct current (DC) to DC power converter, an alternating current (AC) to DC power converter, a DC to AC power inverter, etc. In some examples, power supply 102 can represent a connection to a power grid. In some examples, the input power signal provided by power supply 102 can be a DC input power signal. For example, power supply 102 can be configured to provide a DC input power signal in the range of ~3 VDC to ~50 VDC (e.g., 3-5 V, 20-50 V, etc.).
[0031] The voltage supply circuit device 104 can represent a circuit device for operating in a charge pump mode and for operating in a boost converter mode. In some examples, the voltage supply circuit device 104 can represent an integrated circuit (IC). The voltage supply circuit device 104 may include a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122, and a driver circuit device 112. In some examples, the voltage supply circuit device 104 may include a fourth switching element (e.g., a voltage-controlled switch, a diode, etc.) arranged in series and between the high-side switching element 114 and the low-side pin 134.
[0032] Examples of switching elements may include, but are not limited to, a 2-terminal device, a 3-terminal device, a 4-terminal device, and another switching element. Examples of 3-terminal and / or 4-terminal devices may include, but are not limited to, a silicon-controlled rectifier (SCR), a field-effect transistor (FET), and a bipolar junction transistor (BJT). Examples of FETs may include, but are not limited to, a junction field-effect transistor (JFET), a metal-oxide semiconductor FET (MOSFET), a dual-gate MOSFET, a fin-type FET (FinFET), an insulated-gate bipolar transistor (IGBT), any other type of FET, or any combination thereof. Examples of MOSFETs may include, but are not limited to, PMOS, NMOS, DMOS, or any other type of MOSFET, or any combination thereof. Examples of BJTs may include, but are not limited to, PNP, NPN, heterojunction, or any other type of BJT, or any combination thereof. The switching device may be voltage-controlled and / or current-controlled. Examples of current-controlled switching devices may include, but are not limited to, gallium nitride (GaN) MOSFETs, BJTs, or other current-controlled elements. Examples of 2-terminal devices may include, but are not limited to, a diode, a Schottky diode, an avalanche diode, a Zener diode, or another 2-terminal device.
[0033] The first switching element 119 may include a first voltage-controlled switch including a first node coupled to the positive power supply pin 101 and a second node coupled to the high-side pin 130. In some examples, the first switching element 119 may include a first diode including an anode coupled to the positive power supply pin 101 and a cathode coupled to the high-side pin 130. The second switching element 120 may include a second voltage-controlled switch including a first node coupled to the high-side pin 130 and a second node coupled to the output pin 132. In some examples, the second switching element 120 may include a second diode including an anode coupled to the high-side pin 130 and a cathode coupled to the output pin 132. The third switching element 122 may include a third voltage-controlled switch including a first node coupled to the low-side pin 134 and a second node coupled to the output pin 132. In some examples, the third switching element 122 may include a third diode including an anode coupled to the low-side pin 134 and a cathode coupled to the output pin 132.
[0034] The storage element 108 may include a capacitor. As used herein, a capacitor may include an electrical component configured to store electrical energy in an electric field. Examples of capacitors may include, but are not limited to, a ceramic capacitor, a film capacitor, an electrolytic capacitor (e.g., aluminum, tantalum, niobium, etc.), a supercapacitor (e.g., double layer, pseudocapacitor, hybrid capacitor), a mica capacitor, or another capacitor. Although a capacitor may be described as a single capacitor, a capacitor may include an array of capacitive elements. For example, a capacitor may be an array of capacitive elements coupled in parallel and / or in series. In some examples, each capacitive element may be a discrete element, while in other examples, each capacitive element may be contained within a single package (e.g., a capacitor array).
[0035] The storage element 108 may include an inductor. As used herein, an inductor may include an electrical element configured to store electrical energy in a magnetic field. Although the inductor may be described as a single inductor, the inductor may include an array of inductive elements. For example, the inductor may be an array of inductive elements coupled in parallel and / or in series.
[0036] As shown, the memory element 108 can have a first node coupled to the low side pin 134. In some examples, a second node of the memory element 108 can be coupled to the high side pin 130 (see Figure 2A 、 Figure 2B 、 Figure 4A 、 Figure 4B The second node of the storage element 108 may be coupled to the positive power supply pin 101 (see Figure 3A 、 Figure 3B In some examples, the second node of storage element 108 can be coupled to output pin 132 .
[0037] The driver circuit device 112 can be configured to generate a high-side control signal at the high-side switching element 114 and a low-side control signal at the low-side switching element 118. For example, in response to determining that the storage element 108 is arranged in a charge pump configuration with the voltage supply circuit device 104, the driver circuit device 112 can be configured to generate the high-side control signal for turning off the high-side switching element 114 and the low-side control signal for turning on the low-side switching element 118 during a first phase of the charge pump configuration mode. In this example, the driver circuit device 112 can be configured to generate the high-side control signal for turning on the high-side switching element 114 and the low-side control signal for turning off the low-side switching element 118 during a second phase of the charge pump configuration mode.
[0038] However, in response to determining that the storage element 108 is arranged in a boost converter configuration with the voltage supply circuitry 104, the driver circuitry 112 may be configured to, during the first phase of the boost converter configuration mode, generate a high-side control signal for turning off the high-side switching element 114 and a low-side control signal for turning on the low-side switching element 118. In this example, the driver circuitry 112 may be configured to, during the second phase of the boost converter configuration mode, generate a high-side control signal for turning off the high-side switching element 114 and a low-side control signal for turning off the low-side switching element 118.
[0039] The driver circuitry 112 may be configured to receive an indication of when the storage element 108 is arranged in a charge pump configuration with the power supply 102. For example, the driver circuitry 112 may be configured to be programmed to indicate that the storage element 108 is arranged in a charge pump configuration with the power supply 102. Similarly, the driver circuitry 112 may be configured to receive an indication of when the storage element 108 is arranged in a boost converter configuration with the power supply 102. For example, the driver circuitry 112 may be configured to be programmed to indicate that the storage element 108 is arranged in a boost converter configuration with the power supply 102.
[0040] The driver circuitry 112 may be configured to automatically determine when the storage element 108 is arranged in a charge pump configuration with the power supply 102. For example, the driver circuitry 112 may be configured to determine that the storage element 108 is arranged in a charge pump configuration with the power supply 102 based on the voltage and / or current at the system 100 (see Figures 7 to 11 Similarly, the driver circuitry 112 may be configured to determine when the storage element 108 is arranged in a boost converter configuration with the power supply 102. For example, the driver circuitry 112 may be configured to determine that the storage element 108 is arranged in a boost converter configuration with the power supply 102 based on the voltage and / or current at the system 100 (see Figures 7 to 11 ).
[0041] According to the technology disclosed in this disclosure, Figure 1 1 shows an example of a voltage supply circuit device including a positive power supply pin 101 and a reference power supply pin 103 configured to be coupled to a power supply 102. In this example, a high-side pin 130 and a low-side pin 134 are configured to be coupled to a storage element 108. In this example, a high-side switching element 114 is configured to electrically couple the positive power supply pin 101 and the low-side pin 134 based on a high-side control signal. In this example, a low-side switching element 118 is configured to electrically couple the reference power supply pin 103 and the low-side pin 134 based on a low-side control signal. In this example, a first switching element 119 is configured to electrically couple the positive power supply pin 101 and the high-side pin 130.
[0042] In this example, the second switching element 120 is configured to electrically couple a high-side pin 130 and an output pin 132. In this example, the third switching element 122 is configured to electrically couple an output pin 132 and a low-side pin 134. In this example, the driver circuit device 112 is configured to: when the storage element 108 is arranged to be configured as a charge pump with the voltage supply circuit device 104, a high-side control signal and a low-side control signal are generated for operating in charge pump mode, and when the storage element 108 is arranged to be configured as a boost converter with the voltage supply circuit device 104, a high-side control signal and a low-side control signal are generated for operating in boost converter mode. In this way, the voltage supply circuit device 104 can be configured to operate in charge pump mode and boost converter mode. In this way, the voltage supply circuit device 104 can be independent of any additional pins selected for mode. In some examples, the voltage supply circuit device 104 can be configured to automatically adjust internal parameters (e.g., frequency, peak current, current limit, etc.).
[0043] Figure 2A 2 is a conceptual diagram illustrating the operation of a first circuit device 200 in a first stage of charge pump mode for providing charge pump mode and boost converter mode functionality according to one or more techniques of the present disclosure. As shown in the figure, the circuit device 200 includes a power supply 202, a voltage supply circuit device 204, a capacitor 206, and a capacitor 208, which may be respectively Figure 1 1 , a power supply 102, a voltage supply circuit 104, a capacitor 106, and a storage element 108 are shown. For example, the voltage supply circuit 204 may include: a positive power supply pin 201, a reference power supply pin 203, a high-side pin 230, a low-side pin 234, an output pin 232, a high-side switching element 214, a low-side switching element 218, a first switching element 219, a second switching element 220, a third switching element 222, and a driver circuit 212, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 2A and Figure 2B Examples include the fourth switching element 216 , however, in some examples, the fourth switching element 216 can be omitted (eg, the high-side node 215 is directly coupled to the low-side pin 234 ).
[0044] exist Figure 2A and Figure 2BIn the example shown, the storage element includes capacitor 208. As shown, capacitor 208 includes a first node coupled to high-side pin 230 and a second node coupled to low-side pin 234. In this example, capacitor 206 includes a first node coupled to positive power supply pin 201 and a second node coupled to output pin 232. However, in other examples, capacitor 206 may be connected differently to voltage supply circuitry 204. For example, capacitor 206 may include a first node coupled to output pin 232 and a second node coupled to reference power supply pin 203.
[0045] In a charge pump configuration, switching element 216 and switching element 222 may help allow circuit arrangement 200 to operate in a charge pump mode. Figure 2A An example is shown when circuit device 200 operates in charge pump mode and capacitor 208 is charged by power source 202. For example, driver circuit device 212 can be configured to turn off high-side switching element 214 and turn on low-side switching element 218 so that capacitor 208 is charged by power source 202. Because high-side switching element 214 is off, no current flows through switching element 216, and switching element 222 (e.g., a diode) is disconnected (e.g., reverse biased). As such, switching element 216 and switching element 222 may not have an undesirable effect on the behavior of charge pump mode.
[0046] Figure 2B is a conceptual diagram illustrating operation of a first circuit device 200 in a second phase of charge pump mode for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. Figure 2B In the example shown, high-side switching element 214 is turned on and switching element 216 (e.g., a diode) is turned on (e.g., forward biased), thereby allowing capacitor 206 to be charged by power supply 202 through charge redistribution between capacitor 206 and capacitor 208, while switching element 222 (e.g., a diode) is turned off (e.g., reverse biased), which may not adversely affect the behavior of voltage supply circuitry 204. For example, driver circuitry 212 can be configured to turn on high-side switching element 214 and turn off low-side switching element 218 when operating in the second stage of the charge pump mode, so that capacitor 208 charges capacitor 206.
[0047] Figure 3A 3 is a conceptual diagram illustrating a second circuit arrangement 300 for providing charge pump mode and boost converter mode functionality in accordance with one or more techniques of this disclosure, operating in a first phase of boost converter mode. As shown, circuit arrangement 300 includes a power supply 302, a voltage supply circuit arrangement 304, a capacitor 306, and an inductor 308, which may be Figure 11 , a power supply 102, a voltage supply circuit 104, a capacitor 106, and a storage element 108. For example, the voltage supply circuit 304 may include a positive power supply pin 301, a reference power supply pin 303, a high-side pin 330, a low-side pin 334, an output pin 332, a high-side switching element 314, a low-side switching element 318, a first switching element 319, a second switching element 320, a third switching element 322, and a driver circuit 312, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 3A and Figure 3B Examples include the fourth switching element 316 , however, in some examples, the fourth switching element 316 can be omitted (eg, the high-side node 315 is coupled directly to the low-side pin 334 ).
[0048] exist Figure 3A and Figure 3B In the example of FIG, the storage element includes an inductor 308. As shown, the inductor 308 includes: a first node coupled to the positive power supply pin 301; and a second node coupled to the low-side pin 334. However, in other examples, the inductor 308 can be connected to the voltage supply circuit device 304 differently. For example, the inductor 308 can include: a first node coupled to the high-side pin 330; and a second node coupled to the low-side pin 334 (see FIG. Figure 4A and Figure 4B ).
[0049] Driver circuit device 312 can be configured to, when operating in the first phase of the boost converter mode, turn off high-side switching element 314 and turn on low-side switching element 318 so that inductor 308 is charged by power supply 302. For example, in the first phase of the boost converter mode (e.g., the coil charging phase), driver circuit device 312 can be configured to turn on low-side switching element 318, thereby connecting inductor 308 between a first terminal (e.g., a positive terminal) of power supply 302 and a second terminal (e.g., a negative terminal, a reference node, ground, etc.) of power supply 302. In this example, fourth switching element 316 is floating because high-side switching element 314 is turned off, while first switching element 319, second switching element 320, and third switching element 322 are turned off (e.g., reverse biased). In some examples, driver circuit device 312 can be configured to generate a third control signal for operating third switching element 322 in the boost converter mode. For example, the driver circuit 312 may be configured to generate a third control signal at a control node of the third switching element 322 , which causes the third switching element 322 to be opened when operating in the first phase of the boost converter mode.
[0050] Figure 3B FIG2 is a conceptual diagram illustrating a second circuit device 300 for providing charge pump mode and boost converter mode functionality operating in a second phase of boost converter mode, according to one or more techniques of this disclosure. Driver circuit device 312 can be configured to disconnect high-side switching element 314 when operating in the second phase of boost converter mode, and disconnect low-side switching element 318 when operating in the second phase of boost converter mode, so that inductor 308 charges capacitor 306. For example, during the second phase of boost converter operation, inductor 308 charges capacitor 306. Driver circuit device 312 can disconnect high-side switching element 314 and low-side switching element 318. In this example, fourth switching element 316 is floating, first switching element 319 and second switching element 320 are disconnected (e.g., reverse biased), and third switching element 322 is connected (e.g., conducting). In some examples, driver circuit device 312 can be configured to generate a third control signal for operating third switching element 322 in boost converter mode. For example, the driver circuit 312 may be configured to generate a third control signal at a control node of the third switching element 322 , which causes the third switching element 322 to switch on when operating in the second phase of the boost converter mode.
[0051] Figure 4A4 is a conceptual diagram illustrating a third circuit arrangement 400 for providing charge pump mode and boost converter mode functionality in accordance with one or more techniques of this disclosure, operating in a first phase of boost converter mode. As shown, circuit arrangement 400 includes a power supply 402, a voltage supply circuit arrangement 404, a capacitor 406, and an inductor 408, which may be Figure 1 102, a voltage supply circuit device 104, a capacitor 106, and a storage element 108. For example, the voltage supply circuit device 404 may include: a positive power supply pin 401, a reference power supply pin 403, a high-side pin 430, a low-side pin 434, an output pin 432, a high-side switching element 414, a low-side switching element 418, a first switching element 419, a second switching element 420, a third switching element 422, and a driver circuit device 412, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 4A and Figure 4B Examples include a fourth switching element 416 , however, in some examples, the fourth switching element 416 can be omitted (eg, the high-side node 415 is coupled directly to the low-side pin 434 ).
[0052] exist Figure 4A and Figure 4B In the example of FIG, the storage element includes an inductor 408. As shown, the inductor 408 includes a first node coupled to the high-side pin 430 and a second node coupled to the low-side pin 434. However, in other examples, the inductor 408 can be connected to the voltage supply circuit device 404 differently. For example, the inductor 408 can include a first node coupled to the positive power supply pin 401 and a second node coupled to the low-side pin 434 (see FIG. Figure 3A and Figure 3B ). The driver circuit device 412 can be configured to, when operating in the first stage of the boost converter mode, turn off the high-side switching element 414 and turn on the low-side switching element 418, so that the inductor 408 is charged by the power source 302. In some examples, the driver circuit device 412 can be configured to generate a third control signal for operating the third switching element 422 in the boost converter mode. For example, the driver circuit device 412 can be configured to generate a third control signal at the control node of the third switching element 422, and when operating in the first stage of the boost converter mode, the third control signal causes the third switching element 422 to turn off.
[0053] Figure 4Bis a conceptual diagram illustrating a third circuit device for providing charge pump mode and boost converter mode functionality operating in a second phase of boost converter mode, according to one or more techniques of this disclosure. During the second phase of boost converter operation, inductor 408 charges capacitor 406. Driver circuit device 412 can be configured to disconnect high-side switching element 414 when operating in the second phase of boost converter mode, and disconnect low-side switching element 418 when operating in the second phase of boost converter mode, so that inductor 408 charges capacitor 406. In some examples, driver circuit device 412 can be configured to generate a third control signal for operating third switching element 422 in boost converter mode. For example, driver circuit device 412 can be configured to generate a third control signal at a control node of third switching element 422 that causes third switching element 422 to turn on when operating in the second phase of boost converter mode.
[0054] Figure 5 5 is a conceptual diagram illustrating a fourth circuit 500 having a first current limiting circuit arrangement for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, the circuit arrangement 500 includes a power supply 502, a voltage supply circuit arrangement 504, a capacitor 506, and a storage element 508, which may be respectively Figure 1 102, a voltage supply circuit device 104, a capacitor 106, and a storage element 108. For example, the voltage supply circuit device 504 may include a positive power supply pin 501, a reference power supply pin 503, a high-side pin 530, a low-side pin 534, an output pin 532, a high-side switching element 514, a low-side switching element 518, a first switching element 519, a second switching element 520, a third switching element 522, and a driver circuit device 512, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 5 Examples include a fourth switching element 516 , however, in some examples, the fourth switching element 516 can be omitted (eg, the high-side node 515 is coupled directly to the low-side pin 534 ).
[0055] As shown, the voltage supply circuitry 504 can include a first current limiting circuitry 540 configured to regulate the current flowing from the positive power supply pin 501 into the high-side switching element 514. In some examples, the voltage supply circuitry 504 can include a second current limiting circuitry 542 configured to regulate the current flowing from the voltage supply circuitry 504 to the reference power supply pin 503. In this manner, the first current limiting circuitry 540 and / or the second current limiting circuitry 542 can help limit the peak current to a predetermined current value. Furthermore, in some examples, the first current limiting circuitry 540 and / or the second current limiting circuitry 542 can help reduce fault conditions caused by external short circuits (e.g., a shorted capacitor), which can help improve the reliability of the circuitry 500.
[0056] Figure 6 6 is a conceptual diagram illustrating a fifth circuit 600 having a second current limiting circuit arrangement for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, circuit 600 includes a power supply 602, a voltage supply circuit arrangement 604, a capacitor 606, and a storage element 608, which may be respectively Figure 1 1 , a power supply 102, a voltage supply circuit 104, a capacitor 106, and a storage element 108. For example, the voltage supply circuit 604 may include a positive power supply pin 601, a reference power supply pin 603, a high-side pin 630, a low-side pin 634, an output pin 632, a high-side switching element 614, a low-side switching element 618, a first switching element 619, a second switching element 620, a third switching element 622, and a driver circuit 612, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 6 Examples include a fourth switching element 616 , however, in some examples, the fourth switching element 616 can be omitted (eg, the high-side node 615 is directly coupled to the low-side pin 634 ).
[0057] As shown, the voltage supply circuitry 604 may include a first current limiting circuitry 640 configured to regulate the current flowing from the positive power supply pin 601 into the high-side switching element 614. As shown, the voltage supply circuitry 604 may include a second current sensing circuitry 644 configured to sense the current output from the voltage supply circuitry 604 to the reference power supply pin 603. In this example, the driver circuitry 612 may be configured to generate a high-side control signal and / or a low-side control signal based on the current output to the reference power supply pin 603. For example, the driver circuitry 612 may be configured to disconnect the low-side switching element 618 based on the current output to the reference power supply pin 613. In some examples, the high-side switching element 614 and / or the low-side switching element 618 may be used to directly limit current (e.g., as the output of a current mirror). In some examples, the voltage supply circuitry 612 may use a voltage drop across the high-side switching element 614 to sense the current across the high-side switching element 614. Similarly, in some examples, the voltage supply circuit device can use the voltage drop at the low-side switch element 618 to sense the current at the low-side switch element 618. In some examples, the driver circuit device 612 can use the sensed current at the high-side switch element 614 and / or the sensed current at the low-side switch element 618 to generate a high-side control signal and / or a low-side control signal. In some examples, when the first switch element 619 includes a transistor (e.g., a MOSFET), the storage element 608 can include: an inductor connected between the first switch element 619 and the second switch element 620. In this example, the voltage supply circuit device 604 can perform current sensing directly via the first switch element 619. In some examples, the voltage supply circuit device 604 can perform current sensing (e.g., using a Hall effect sensor) at the inductor of the storage element 608. In some examples, the capacitor 606 can be connected to the reference power pin 603 instead of the positive power pin 601.
[0058] Figure 7 7 is a conceptual diagram illustrating a sixth circuit 700 having a first mode detection circuit arrangement for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, circuit 700 includes a power supply 702, a voltage supply circuit arrangement 704, a capacitor 706, and a storage element 708, which may be, respectively, Figure 1102, a voltage supply circuit device 104, a capacitor 106, and a storage element 108. For example, the voltage supply circuit device 704 may include: a positive power supply pin 701, a reference power supply pin 703, a high-side pin 730, a low-side pin 734, an output pin 732, a high-side switching element 714, a low-side switching element 718, a first switching element 719, a second switching element 720, a third switching element 722, and a driver circuit device 712, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 7 Examples include a fourth switching element 716 , however, in some examples, the fourth switching element 716 can be omitted (eg, the high-side node 715 is directly coupled to the low-side pin 734 ).
[0059] The voltage supply circuitry 704 also includes a mode detection circuitry 713. The mode detection circuitry 713 can be configured to determine when the storage element 708 is arranged in a charge pump configuration with the voltage supply circuitry 704. In some examples, the mode detection circuitry 713 can be configured to determine when the storage element 708 is arranged in a boost converter configuration with the voltage supply circuitry 704. The mode detection circuitry 713 can be configured to output an indication to the driver circuitry 712 indicating whether the storage element 708 is arranged in the charge pump configuration or the boost converter configuration.
[0060] exist Figure 7 In the example of , the mode detection circuit device 713 may include a rate of change module 748, a comparator module 750 and a resistor 744. As shown, the resistor 744 is arranged in series with the low-side switch element 718. The rate of change module 748 can be configured to determine the rate of change of the current output from the voltage supply circuit device 704 to the reference power pin 703. For example, the rate of change module 748 uses the voltage at the resistor 744 to determine the rate of change of the current through the low-side switch element 718. The comparator module 750 determines whether the rate of change of the current through the low-side switch element 718 exceeds a predetermined threshold value (e.g., 0) to determine the slope direction (e.g., positive, negative, etc.) of the current through the low-side switch element 718.
[0061] The mode detection circuit device 713 can be configured to determine that the storage element 708 is arranged in a charge pump configuration with the voltage supply circuit device 704 when the rate of change is less than or equal to zero (e.g., non-positive), and to determine that the storage element 708 is arranged in a boost converter configuration with the voltage supply circuit device 704 when the rate of change is greater than zero (e.g., positive).
[0062] For example, when the storage element 708 is arranged in a boost converter configuration with the voltage supply circuit arrangement 704, the comparator module 750 can generate an indication (e.g., a logic 1, a logic 0, etc.) of the positive slope direction (e.g., dv / dt>0) of the current flowing through the low-side switch element 718. Specifically, when the storage element 708 is arranged in a boost converter configuration with the voltage supply circuit arrangement 704, the current flowing through the resistor 744 (and the low-side switch element 718) can increase over time after the low-side switch element 718 is closed, due in part to the inductance of the storage element 708. Thus, the rate-of-change module 748 can be configured to generate an output indicating an increase in the current flowing through the resistor 744 (and the low-side switch element 718), and the comparator module 750 can be configured to generate an indication of the positive slope direction of the current flowing through the low-side switch element 718 in response to the output from the rate-of-change module 748.
[0063] When the storage element 708 is arranged in a charge pump configuration with the voltage supply circuit arrangement 704, the comparator module 750 can generate an indication (e.g., a logic 0, a logic 1, etc.) of the negative slope direction (e.g., dv / dt < 0) of the current flowing through the low-side switching element 718. Specifically, when the storage element 708 is arranged in a charge pump converter configuration with the voltage supply circuit arrangement 704, due in part to the capacitor of the storage element 708, the current flowing through the resistor 744 (and the low-side switching element 718) may be relatively high immediately after turning on the low-side switching element 718, and will decrease in response to turning on the low-side switching element 718. Thus, the rate-of-change module 748 can be configured to generate an output indicating a decrease in the current flowing through the resistor 744 (and the low-side switching element 718), and the comparator module 750 can be configured to generate an indication of a negative slope direction (or non-positive slope direction) of the current flowing through the low-side switching element 718 in response to the output from the rate-of-change module 748. In some examples, the slope direction in response to turning on the low-side switching element 718 may correspond to zero in the case of current limiting or when the capacitor is fully charged.
[0064] Figure 88 is a conceptual diagram illustrating a seventh circuit 800 having a second mode detection circuit arrangement for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, circuit 800 includes a power supply 802, a voltage supply circuit arrangement 804, a capacitor 806, and a storage element 808, which may be, respectively, Figure 1 102, a voltage supply circuit device 104, a capacitor 106, and a storage element 108. For example, the voltage supply circuit device 804 may include a positive power supply pin 801, a reference power supply pin 803, a high-side pin 830, a low-side pin 834, an output pin 832, a high-side switching element 814, a low-side switching element 818, a first switching element 819, a second switching element 820, a third switching element 822, and a driver circuit device 812, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 8 Examples include a fourth switching element 816 , however, in some examples, the fourth switching element 816 can be omitted (eg, the high-side node 815 is coupled directly to the low-side pin 834 ).
[0065] The voltage supply circuitry 804 also includes a mode detection circuitry 813. The mode detection circuitry 813 can be configured to determine when the storage element 808 is arranged in a charge pump configuration with the voltage supply circuitry 804. In some examples, the mode detection circuitry 813 can be configured to determine when the storage element 808 is arranged in a boost converter configuration with the voltage supply circuitry 804. The mode detection circuitry 813 can be configured to output an indication to the driver circuitry 812 indicating whether the storage element 808 is arranged in the charge pump configuration or the boost converter configuration.
[0066] exist Figure 8 In an example, mode detection circuitry 813 may include a comparator module 850 and a resistor 844. In this example, mode detection circuitry 813 omits a rate-of-change module. In this example, comparator module 850 may directly measure the voltage across resistor 844. In some examples, comparator module 850 may include a Schmitt trigger. For example, comparator module 850 may include hysteresis control.
[0067] Comparator module 850 can be configured to compare the magnitude of the current output from voltage supply circuitry 804 to reference power supply pin 803 with a threshold value. In this example, mode detection circuitry 813 can be configured to determine that storage element 808 is arranged in a charge pump configuration with voltage supply circuitry 804 in response to an indication from comparator module 850 that the magnitude of the output current is greater than the threshold value. In some examples, mode detection circuitry 813 can be configured to determine that storage element 808 is arranged in a boost converter configuration with voltage supply circuitry 804 in response to an indication from comparator module 850 that the magnitude of the output current is less than the threshold value.
[0068] Figure 9 is a conceptual diagram illustrating an eighth circuit having a third mode detection circuit arrangement for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, circuit 900 includes a power supply 902, a voltage supply circuit arrangement 904, a capacitor 906, and a storage element 908, which may be, respectively, Figure 1 102, a voltage supply circuit device 104, a capacitor 106, and a storage element 108. For example, the voltage supply circuit device 904 may include a positive power supply pin 901, a reference power supply pin 903, a high-side pin 930, a low-side pin 934, an output pin 932, a high-side switching element 914, a low-side switching element 918, a first switching element 919, a second switching element 920, a third switching element 922, and a driver circuit device 912, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 9 Examples include a fourth switching element 916 , however, in some examples, the fourth switching element 916 can be omitted (eg, the high-side node 915 is directly coupled to the low-side pin 934 ).
[0069] The voltage supply circuitry 904 also includes a mode detection circuitry 913. The mode detection circuitry 913 may be configured to determine when the storage element 908 is arranged in a charge pump configuration with the voltage supply circuitry 904. In some examples, the mode detection circuitry 913 may be configured to determine when the storage element 908 is arranged in a boost converter configuration with the voltage supply circuitry 904. The mode detection circuitry 913 may be configured to output an indication to the driver circuitry 912 indicating whether the storage element 908 is arranged in the charge pump configuration or the boost converter configuration.
[0070] exist Figure 9 In an example of the present invention, the mode detection circuit device 913 may include a rate of change module 948 and a comparator module 950. The rate of change module 948 can be configured to determine the rate of change of the current output from the voltage supply circuit device 904 to the reference power supply pin 903. For example, the rate of change module 948 uses the voltage at the low-side switching element 918 to determine the rate of change of the current through the low-side switching element 918. The comparator module 950 determines whether the rate of change of the current through the low-side switching element 918 exceeds a predetermined threshold (e.g., 0) to determine the slope direction of the current through the low-side switching element 918.
[0071] The mode detection circuit device 913 can be configured to: when the rate of change is less than or equal to zero (e.g., non-positive), determine that the storage element 908 is arranged in a charge pump configuration with the voltage supply circuit device 904, and when the rate of change is greater than zero (e.g., positive), determine that the storage element 908 is arranged in a boost converter configuration with the voltage supply circuit device 904.
[0072] Figure 10 1 is a conceptual diagram illustrating a ninth circuit 1000 having a fourth mode detection circuit arrangement for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, circuit 1000 includes a power supply 1002, a voltage supply circuit arrangement 1004, a capacitor 1006, and a storage element 1008, which may be respectively Figure 1 10. The power supply 102, the voltage supply circuit 104, the capacitor 106, and the storage element 108 are examples of the power supply 102, the voltage supply circuit 104, the capacitor 106, and the storage element 108. For example, the voltage supply circuit 1004 may include a positive power supply pin 1001, a reference power supply pin 1003, a high-side pin 1030, a low-side pin 1034, an output pin 1032, a high-side switching element 1014, a low-side switching element 1018, a first switching element 1019, a second switching element 1020, a third switching element 1022, and a driver circuit 1012, which may be respectively Figure 1 An example of a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 10 Examples include a fourth switching element 1016 , however, in some examples, the fourth switching element 1016 can be omitted (eg, the high-side node 1015 is directly coupled to the low-side pin 1034 ).
[0073] The voltage supply circuitry 1004 also includes a mode detection circuitry 1013. The mode detection circuitry 1013 can be configured to determine when the storage element 1008 is arranged in a charge pump configuration with the voltage supply circuitry 1004. In some examples, the mode detection circuitry 1013 can be configured to determine when the storage element 1008 is arranged in a boost converter configuration with the voltage supply circuitry 1004. The mode detection circuitry 1013 can be configured to output an indication to the driver circuitry 1012 indicating whether the storage element 1008 is arranged in the charge pump configuration or the boost converter configuration.
[0074] exist Figure 10 In an example, mode detection circuitry 1013 can include a comparator module 1050. In this example, mode detection circuitry 1013 omits the rate-of-change module and the resistor. In this example, comparator module 1050 can directly measure the voltage at low-side switching element 1018. In some examples, comparator module 1050 can include a Schmitt trigger. For example, comparator module 1050 can include hysteresis control.
[0075] Comparator module 1050 can be configured to compare the magnitude of the current output from voltage supply circuitry 1004 to reference power supply pin 1003 with a threshold value. In this example, mode detection circuitry 1013 can be configured to determine that storage element 1008 is arranged in a charge pump configuration with voltage supply circuitry 1004 in response to comparator module 1050 outputting an indication that the magnitude of the current indicated by the voltage at low-side switching element 1018 is greater than the threshold value. In some examples, mode detection circuitry 1013 can be configured to determine that storage element 1008 is arranged in a boost converter configuration with voltage supply circuitry 1004 in response to comparator module 1050 outputting an indication that the magnitude of the current indicated by the voltage at low-side switching element 1018 is less than the threshold value.
[0076] Figure 11 1 is a conceptual diagram illustrating a tenth circuit 1100 having a fifth mode detection circuit arrangement for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, circuit 1100 includes a power supply 1102, a voltage supply circuit arrangement 1104, a capacitor 1106, and a storage element 1108, which may be, respectively, Figure 110. The power supply 102, the voltage supply circuit 104, the capacitor 106, and the storage element 108 are examples of the power supply 102, the voltage supply circuit 104, the capacitor 106, and the storage element 108. For example, the voltage supply circuit 1104 may include a positive power supply pin 1101, a reference power supply pin 1103, a high-side pin 1130, a low-side pin 1134, an output pin 1132, a high-side switching element 1114, a low-side switching element 1118, a first switching element 1119, a second switching element 1120, a third switching element 1122, and a driver circuit 1112, which may be respectively Figure 1 An example of a positive power supply pin 111, a reference power supply pin 113, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122 and a driver circuit device 112. Figure 11 Examples include a fourth switching element 1116 , however, in some examples, the fourth switching element 1116 can be omitted (eg, the high-side node 1115 is directly coupled to the low-side pin 1134 ).
[0077] The voltage supply circuitry 1104 also includes a mode detection circuitry 1113. The mode detection circuitry 1113 may be configured to determine when the storage element 1108 is arranged in a charge pump configuration with the voltage supply circuitry 1104. In some examples, the mode detection circuitry 1113 may be configured to determine when the storage element 1108 is arranged in a boost converter configuration with the voltage supply circuitry 1104. The mode detection circuitry 1113 may be configured to output an indication to the driver circuitry 1112 indicating whether the storage element 1108 is arranged in the charge pump configuration or the boost converter configuration.
[0078] exist Figure 11 In an example, mode detection circuitry 1113 may include a comparator module 1150. In this example, comparator module 1150 may measure the current at first switching element 1119. In some examples, comparator module 1150 may include a Schmitt trigger. For example, comparator module 1150 may include hysteresis control.
[0079] Comparator module 1150 can be configured to compare the magnitude of the current at first switching element 1119 to a threshold value. In this example, mode detection circuitry 1113 can be configured to determine that storage element 1108 is arranged in a charge pump configuration with voltage supply circuitry 1104 in response to comparator module 1150 outputting an indication that the magnitude of the current indicated by the voltage at first switching element 1119 is greater than a threshold value (e.g., zero). For example, when storage element 1108 is arranged in a charge pump configuration with voltage supply circuitry 1104, current pulses can flow through capacitor 1106. In some examples, mode detection circuitry 1113 can be configured to determine that storage element 1108 is arranged in a boost converter configuration with voltage supply circuitry 1104 in response to comparator module 1150 outputting an indication that the magnitude of the current indicated by the voltage at first switching element 1119 is less than a threshold value (e.g., zero). When the storage element 1108 is arranged in a boost converter configuration with the voltage supply circuitry 1104 , no current pulses may flow through the capacitor 1106 .
[0080] For example, the mode detection circuit device 1113 can be configured to: determine that the storage element 1108 and the voltage supply circuit device 1104 are arranged as a charge pump in response to an indication that the comparator module 1150 outputs a current amplitude greater than zero, and determine that the storage element 1108 and the voltage supply circuit device 1104 are arranged as a boost converter in response to an indication that the comparator module 1150 outputs a current amplitude less than or equal to zero.
[0081] Figure 12 1 is a conceptual diagram illustrating an eleventh circuit 1200 with a capacitor 1206 disposed at an output pin for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, circuit 1200 includes a power supply 1202, a voltage supply circuit device 1204, a capacitor 1206, and a capacitor 1208, which may be respectively Figure 1 102, a voltage supply circuit device 104, a capacitor 106, and a storage element 108. For example, the voltage supply circuit device 1204 may include a positive power supply pin 1201, a reference power supply pin 1203, a high-side pin 1230, a low-side pin 1234, an output pin 1232, a high-side switching element 1214, a low-side switching element 1218, a first switching element 1219, a second switching element 1220, a third switching element 1222, and a driver circuit device 1212, which may be respectively Figure 11 , a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122, and a driver circuit device 112. Figure 12 In the example of , capacitor 1206 includes a first node coupled to output pin 1232 and a second node coupled to reference supply pin 1203 . Figure 12 Examples include a fourth switching element 1216 , however, in some examples, the fourth switching element 1216 can be omitted (eg, the high-side node 1215 is directly coupled to the low-side pin 1234 ).
[0082] Figure 13 13 is a conceptual diagram illustrating a twelfth circuit using diodes for providing charge pump mode and boost converter mode functionality according to one or more techniques of this disclosure. As shown, circuit 1300 includes a power supply 1302, a voltage supply circuit device 1304, a capacitor 1306, and a capacitor 1308, which may be, respectively, Figure 1 13. The power supply 102, the voltage supply circuit 104, the capacitor 106, and the storage element 108 are examples of the power supply 102, the voltage supply circuit 104, the capacitor 106, and the storage element 108. For example, the voltage supply circuit 1304 may include a positive power supply pin 1301, a reference power supply pin 1303, a high-side pin 1330, a low-side pin 1334, an output pin 1332, a high-side switching element 1314, a low-side switching element 1318, a first diode 1319, a second diode 1320, a third diode 1322, and a driver circuit 1312, which may be respectively Figure 1 1 , a positive power supply pin 101, a reference power supply pin 103, a high-side pin 130, a low-side pin 134, an output pin 132, a high-side switching element 114, a low-side switching element 118, a first switching element 119, a second switching element 120, a third switching element 122, and a driver circuit device 112. Figure 13 In the example of FIG, capacitor 1306 includes a first node coupled to positive power supply pin 1301 and a second node coupled to output pin 1332. In some examples, capacitor 1306 can include a first node coupled to output pin 1332 and a second node coupled to reference power supply pin 1303. Figure 13 Examples include a fourth switching element 1316 , however, in some examples, the fourth switching element 1316 can be omitted (eg, the high-side node 1315 is directly coupled to the low-side pin 1334 ).
[0083] As shown, first diode 1319 may include an anode coupled to positive power supply pin 1301 and a cathode coupled to high-side pin 1330. Second diode 1320 may include an anode coupled to high-side pin 1330 and a cathode coupled to output pin 1332. Third diode 1322 may include an anode coupled to low-side pin 1334 and a cathode coupled to output pin 1332. Fourth diode 1316 may include an anode coupled to high-side node 1315 and a cathode coupled to low-side pin 1334.
[0084] The following examples may illustrate one or more aspects of the present disclosure.
[0085] Example 1. A voltage supply circuit device comprises: a positive power supply pin and a reference power supply pin, configured to be coupled to a power supply; a high-side pin and a low-side pin, configured to be coupled to a storage element; an output pin; a high-side switching element, configured to electrically couple the positive power supply pin and the low-side pin based on a high-side control signal; a low-side switching element, configured to electrically couple the reference power supply pin and the low-side pin based on a low-side control signal; a first switching element, configured to electrically couple the positive power supply pin and the high-side pin; a second switching element, configured to electrically couple the high-side pin and the output pin; a third switching element, configured to electrically couple the output pin and the low-side pin; and a driver circuit device, configured to generate a high-side control signal and a low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit device, and to generate a high-side control signal and a low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit device.
[0086] Example 2. The voltage supply circuit arrangement of Example 1, wherein, in a charge pump configuration, the storage element comprises a capacitor comprising: a first node coupled to the high-side pin; and a second node coupled to the low-side pin.
[0087] Example 3. The voltage supply circuit arrangement according to any combination of Examples 1-2, wherein, when operating in the first phase of the charge pump mode, the driver circuit arrangement is configured to turn off the high-side switching element and turn on the low-side switching element so that the capacitor is charged by the power supply.
[0088] Example 4. A controller circuit device according to any combination of Examples 1-3, wherein the capacitor is a first capacitor; and wherein, when operating in a second phase of the charge pump mode, the driver circuit device is configured to turn on the high-side switching element and turn off the low-side switching element so that the first capacitor charges the second capacitor.
[0089] Example 5. A voltage supply circuit device according to any combination of Examples 1-4, wherein the second capacitor includes: a first node coupled to the positive power supply pin; and a second node coupled to the output pin; or wherein the second capacitor includes: a first node coupled to the output pin; and coupled to the reference power supply pin.
[0090] Example 6. The voltage supply circuit arrangement of any combination of Examples 1-5, wherein, in the boost converter configuration, the storage element comprises an inductor.
[0091] Example 7. The voltage supply circuit device of any combination of Examples 1-6, wherein, when operating in the first phase of the boost converter mode, the driver circuit device is configured to turn off the high-side switching element and turn on the low-side switching element so that the inductor is charged by the power supply.
[0092] Example 8. The voltage supply circuit arrangement of any combination of Examples 1-7, wherein, when operating in the second phase of the boost converter mode, the driver circuit arrangement is configured to turn off the high-side switching element and turn off the low-side switching element such that the inductor charges the capacitor.
[0093] Example 9. A voltage supply circuit device according to any combination of Examples 1-8, wherein the inductor includes: a first node coupled to the positive power supply pin; and a second node coupled to the low-side pin; or wherein the inductor includes: a first node coupled to the high-side pin; and a second node coupled to the low-side pin.
[0094] Example 10. A voltage supply circuit device according to any combination of Examples 1-9, comprising one or more of the following: a first current limiting circuit device configured to regulate the current entering the high-side switching element from the positive power supply pin; and a second current limiting circuit device configured to regulate the current output from the voltage supply circuit device to the reference power supply pin.
[0095] Example 11. A voltage supply circuit device according to any combination of Examples 1-10, comprising a current sensing circuit device configured to sense a current output from the voltage supply circuit device to a reference power pin, wherein the driver circuit device is configured to generate a low-side control signal based on the current output to the reference power pin.
[0096] Example 12. A voltage supply circuit device according to any combination of Examples 1-11, comprising: a mode detection circuit device configured to determine when the storage element is arranged in a charge pump configuration with the voltage supply circuit device and when the storage element is arranged in a boost converter configuration with the voltage supply circuit device, and output an indication to the driver circuit device indicating whether the storage element is arranged in the charge pump configuration or the boost converter configuration.
[0097] Example 13. A voltage supply circuit device according to any combination of 1-12, wherein the mode detection circuit device includes: a rate of change module, configured to determine the rate of change of the current output from the voltage supply circuit device to the reference power supply pin, wherein the mode detection circuit device is configured to determine that the storage element is arranged in a charge pump configuration with the voltage supply circuit device when the rate of change is less than or equal to zero, and to determine that the storage element is arranged in a boost converter configuration with the voltage supply circuit device when the rate of change is greater than zero.
[0098] Example 14. A voltage supply circuit device according to any combination of Examples 1-13, wherein the mode detection circuit device includes: a comparator module configured to compare the current amplitude output from the voltage supply circuit device to the reference power supply pin with a threshold value, wherein the mode detection circuit device is configured to: in response to an indication that the comparator module outputs a current amplitude greater than the threshold value, determine that the storage element is arranged in a charge pump configuration with the voltage supply circuit device, and in response to an indication that the comparator module outputs a current amplitude less than the threshold value, determine that the storage element is arranged in a boost converter configuration with the voltage supply circuit device.
[0099] Example 15. A voltage supply circuit device according to any combination of Examples 1-14, wherein the mode detection circuit device includes: a rate of change module configured to determine the rate of change of current at the low-side switching element, wherein the mode detection circuit device is configured to: when the rate of change is less than or equal to zero, determine that the storage element is arranged in a charge pump configuration with the voltage supply circuit device, and when the rate of change is greater than zero, determine that the storage element is arranged in a charge pump configuration with the voltage supply circuit device.
[0100] Example 16. A voltage supply circuit device according to any combination of Examples 1-15, wherein the mode detection circuit device includes: a comparator module configured to compare the current amplitude at the low-side switching element with a threshold value, wherein the mode detection circuit device is configured to determine that the storage element is arranged in a charge pump configuration with the voltage supply circuit device in response to an indication that the comparator module outputs a current amplitude greater than the threshold value, and to determine that the storage element is arranged in a boost converter configuration with the voltage supply circuit device in response to an indication that the comparator module outputs a current amplitude less than the threshold value.
[0101] Example 17. A voltage supply circuit device according to any combination of Examples 1-16, wherein the mode detection circuit device includes: a comparator module configured to determine whether the current amplitude at the first switching element is greater than a threshold value, wherein the mode detection circuit device is configured to determine that the storage element and the voltage supply circuit device are arranged as a charge pump in response to an indication that the comparator module outputs the current amplitude greater than the threshold value, and to determine that the storage element and the voltage supply circuit device are arranged as a boost converter in response to an indication that the comparator module outputs the current amplitude less than or equal to the threshold value.
[0102] Example 18. A voltage supply circuit device according to any combination of Examples 1-17, wherein one or more of the following: the first switching element includes a first diode, the first diode including: an anode coupled to the positive power supply pin and a cathode coupled to the high-side pin; the second switching element includes a second diode, the second diode including: an anode coupled to the high-side pin and a cathode coupled to the output pin; and the third switching element includes a third diode, the third diode including: an anode coupled to the low-side pin and a cathode coupled to the output pin.
[0103] Example 19. A voltage supply circuit device comprising: a positive power supply pin and a reference power supply pin, configured to be coupled to a power supply; a high-side pin and a low-side pin, configured to be coupled to a storage element; an output pin; a high-side switching element, configured to electrically couple the positive power supply pin and the high-side node based on a high-side control signal; a low-side switching element, configured to electrically couple the reference power supply pin and the low-side pin based on a low-side control signal; a first switching element, configured to electrically couple the positive power supply pin and the high-side pin; a second switching element, configured to electrically couple the high-side pin and the output pin; a third switching element, configured to electrically couple the output pin and the low-side pin; a fourth switching element, configured to electrically couple the high-side node and the low-side pin; and a driver circuit device, configured to generate a high-side control signal and a low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit device, and to generate a high-side control signal and a low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit device.
[0104] Example 20. A voltage supply circuit device, comprising: a positive power supply pin and a reference power supply pin, configured to be coupled to a power supply; a high-side pin and a low-side pin, configured to be coupled to a storage element; an output pin; a high-side switching element, configured to electrically couple the positive power supply pin and the high-side node based on a high-side control signal; a low-side switching element, configured to electrically couple the reference power supply pin and the low-side pin based on a low-side control signal; a first diode, comprising an anode coupled to the positive power supply pin and a cathode coupled to the high-side pin; a second diode, comprising an anode coupled to the high-side pin and a cathode coupled to the output pin; a cathode coupled to the output pin; a third diode including an anode coupled to the low-side pin and a cathode coupled to the output pin; a fourth diode including an anode coupled to the high-side node and a cathode coupled to the low-side pin; and a driver circuit device configured to generate a high-side control signal and a low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit device, and to generate a high-side control signal and a low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit device.
[0105] Various aspects have been described in this disclosure. These and other aspects are within the scope of the following claims.
Claims
1. A voltage supply circuit device, comprising: a positive power supply pin and a reference power supply pin, the positive power supply pin and the reference power supply pin being configured to be coupled to a power supply; a high-side pin and a low-side pin, the high-side pin and the low-side pin configured to be coupled to a storage element; Output pins; a high-side switching element configured to electrically couple the positive power supply pin and the low-side pin based on a high-side control signal; a low-side switching element configured to electrically couple the reference power pin and the low-side pin based on a low-side control signal; a first switching element configured to electrically couple the positive power pin and the high-side pin; a second switching element configured to electrically couple the high-side pin and the output pin; a third switching element configured to electrically couple the output pin and the low-side pin; as well as a driver circuit arrangement configured to generate the high-side control signal and the low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit arrangement, and to generate the high-side control signal and the low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit arrangement; The third switching element is configured to be turned on during the second stage operation in the boost converter mode, and to be turned off during the charge pump mode operation.
2. The voltage supply circuit arrangement according to claim 1 , wherein in the charge pump configuration, the storage element comprises a capacitor, the capacitor comprising: a first node coupled to the high-side pin; and a second node coupled to the low-side pin. 3 . The voltage supply circuit arrangement according to claim 2 , wherein when operating in the first phase of the charge pump mode, the driver circuit arrangement is configured to turn off the high-side switching element and turn on the low-side switching element so that the capacitor is charged by the power supply.
4. The voltage supply circuit device according to claim 3, wherein the capacitor is a first capacitor; and in, When operating in a second phase of the charge pump mode, the driver circuit arrangement is configured to switch on the high-side switching element and switch off the low-side switching element such that the first capacitor charges a second capacitor.
5. The voltage supply circuit device according to claim 4, The second capacitor comprises: a first node coupled to the positive power supply pin; and a second node coupled to the output pin; or The second capacitor includes: a first node coupled to the output pin; and a second node coupled to the reference power supply pin.
6. The voltage supply circuit device according to claim 1, wherein: In the boost converter configuration, the storage element comprises an inductor.
7. The voltage supply circuit arrangement according to claim 6, wherein: When operating in a first phase of the boost converter mode, the driver circuit arrangement is configured to turn off the high-side switching element and turn on the low-side switching element such that the inductor is charged by the power supply.
8. The voltage supply circuit arrangement according to claim 7, wherein: When operating in the second phase of the boost converter mode, the driver circuit arrangement is configured to turn off the high-side switching element and turn off the low-side switching element such that the inductor charges the capacitor.
9. The voltage supply circuit device according to claim 6, The inductor comprises: a first node coupled to the positive power supply pin; and a second node coupled to the low-side pin; or The inductor includes: a first node coupled to the high-side pin; and a second node coupled to the low-side pin.
10. The voltage supply circuit arrangement according to claim 1, comprising one or more of the following: a first current limiting circuit device configured to regulate current flowing from the positive power supply pin into the high-side switching element; and The second current limiting circuit device is configured to regulate a current output from the voltage supply circuit device to the reference power supply pin.
11. The voltage supply circuit device according to claim 1, comprising: The current sensing circuit device is configured to sense a current output from the voltage supply circuit device to the reference power pin, wherein the driver circuit device is configured to generate the low-side control signal based on the current output to the reference power pin.
12. The voltage supply circuit device according to claim 1, comprising: A mode detection circuit device is configured to: determine when the storage element is arranged in the charge pump configuration with the voltage supply circuit device, and when the storage element is arranged in the boost converter configuration with the voltage supply circuit device, and output an indication to the driver circuit device, indicating whether the storage element is arranged in the charge pump configuration or the boost converter configuration.
13. The voltage supply circuit arrangement according to claim 12, wherein the mode detection circuit arrangement comprises: a rate of change module configured to determine a rate of change of current output from the voltage supply circuit device to the reference power pin, wherein the mode detection circuit device is configured to: determine that the storage element is arranged in the charge pump configuration with the voltage supply circuit device when the rate of change is less than or equal to zero, and determine that the storage element is arranged in the boost converter configuration with the voltage supply circuit device when the rate of change is greater than zero.
14. The voltage supply circuit arrangement according to claim 12, wherein the mode detection circuit arrangement comprises: a comparator module configured to compare the magnitude of the current output from the voltage supply circuit device to the reference power supply pin with a threshold value, wherein the mode detection circuit device is configured to: determine that the storage element is arranged to form the charge pump configuration with the voltage supply circuit device in response to the comparator module outputting an indication that the magnitude of the current is greater than the threshold value, and determine that the storage element is arranged to form the boost converter configuration with the voltage supply circuit device in response to the comparator module outputting an indication that the magnitude of the current is less than the threshold value.
15. The voltage supply circuit arrangement according to claim 12, wherein the mode detection circuit arrangement comprises: A rate of change module is configured to determine a rate of change of current at the low-side switching element, wherein the mode detection circuit device is configured to: determine that the storage element is arranged in the charge pump configuration with the voltage supply circuit device when the rate of change is less than or equal to zero, and determine that the storage element is arranged in the boost converter configuration with the voltage supply circuit device when the rate of change is greater than zero.
16. The voltage supply circuit arrangement according to claim 12, wherein the mode detection circuit arrangement comprises: a comparator module configured to compare the magnitude of the current at the low-side switching element with a threshold value, wherein the mode detection circuit device is configured to: determine that the storage element is arranged to form the charge pump configuration with the voltage supply circuit device in response to the comparator module outputting an indication that the magnitude of the current is greater than the threshold value, and determine that the storage element is arranged to form the boost converter configuration with the voltage supply circuit device in response to the comparator module outputting an indication that the magnitude of the current is less than the threshold value.
17. The voltage supply circuit arrangement according to claim 12, wherein the mode detection circuit arrangement comprises: a comparator module configured to determine whether the amplitude of the current at the first switching element is greater than a threshold value, wherein the mode detection circuit device is configured to: in response to the comparator module outputting an indication that the amplitude of the current is greater than the threshold value, determine that the storage element and the voltage supply circuit device are arranged as the charge pump; and in response to the comparator module outputting an indication that the amplitude of the current is less than or equal to the threshold value, determine that the storage element and the voltage supply circuit device are arranged as the boost converter.
18. The voltage supply circuit arrangement according to claim 1, wherein one or more of the following: The first switching element includes a first diode, and the first diode includes: an anode coupled to the positive power pin and a cathode coupled to the high-side pin; The second switching element includes a second diode including: an anode coupled to the high-side pin and a cathode coupled to the output pin; and The third switching element includes a third diode including an anode coupled to the low-side pin and a cathode coupled to the output pin.
19. A voltage supply circuit device comprising: a positive power supply pin and a reference power supply pin, the positive power supply pin and the reference power supply pin being configured to be coupled to a power supply; a high-side pin and a low-side pin, the high-side pin and the low-side pin configured to be coupled to a storage element; Output pins; a high-side switching element configured to electrically couple the positive power supply pin and a high-side node based on a high-side control signal; a low-side switching element configured to electrically couple the reference power pin and the low-side pin based on a low-side control signal; a first switching element configured to electrically couple the positive power pin and the high-side pin; a second switching element configured to electrically couple the high-side pin and the output pin; a third switching element configured to electrically couple the output pin and the low-side pin; a fourth switching element configured to electrically couple the high-side node and the low-side pin; as well as a driver circuit arrangement configured to generate the high-side control signal and the low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit arrangement, and to generate the high-side control signal and the low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit arrangement; The third switching element is configured to be turned on during the second stage operation in the boost converter mode, and to be turned off during the charge pump mode operation.
20. A voltage supply circuit device, comprising: a positive power supply pin and a reference power supply pin, the positive power supply pin and the reference power supply pin being configured to be coupled to a power supply; a high-side pin and a low-side pin, the high-side pin and the low-side pin configured to be coupled to a storage element; Output pins; a high-side switching element configured to electrically couple the positive power supply pin and a high-side node based on a high-side control signal; a low-side switching element configured to electrically couple the reference power pin and the low-side pin based on a low-side control signal; a first diode comprising an anode coupled to the positive power pin and a cathode coupled to the high-side pin; a second diode comprising an anode coupled to the high-side pin and a cathode coupled to the output pin; a third diode comprising an anode coupled to the low-side pin and a cathode coupled to the output pin; a fourth diode comprising an anode coupled to the high-side node and a cathode coupled to the low-side pin; as well as a driver circuit arrangement configured to generate the high-side control signal and the low-side control signal for operating in a charge pump mode when the storage element is arranged in a charge pump configuration with the voltage supply circuit arrangement, and to generate the high-side control signal and the low-side control signal for operating in a boost converter mode when the storage element is arranged in a boost converter configuration with the voltage supply circuit arrangement; The third diode is configured to be turned on during the second stage operation in the boost converter mode and to be turned off during the charge pump mode operation.
Citation Information
Patent Citations
Boost converter
US20070018614A1
Efficient buck-boost charge pump and method therefor
US20190312514A1