A high-power semiconductor device with fail-open characteristics

Abstract

The invention discloses a high-power semiconductor device with a fail-open feature, the structure of which includes a mainboard, a chip, a heat sink, and a fixing screw. The upper end of the mainboard is fitted and connected with the chip contact, the heat conduction plate of the heat sink is locked on the mainboard by the fixing screw, the water pump and the water cooling mechanism form a closed circulation channel, when the equipment is running, the heat sink and the cooling pipe inside the filter housing, and the heat conduction plate absorb the heat generated when the chip is working, the water pump and the cooling component form a closed circulation water channel, the water pump transports the circulating fluid through the cooling component to ensure that the circulating fluid does not leak out and cause failure of the electrical appliance, when the cooling component is working, the transmission mechanism drives the fan blades inside the dust removal mechanism to absorb air, the air contains dust and lint, when the air passes through the filter, the dust and lint are adsorbed on the filter surface, the dust removal brush mechanism will brush the foreign matter adsorbed on the filter surface, so that the air can enter the cooling component more smoothly for synchronous heat dissipation treatment.

Description

Technical Field

[0001] The present invention relates to the field of high-power semiconductor devices, and in particular to a high-power semiconductor device with a fail-open feature. Background Art

[0002] Power semiconductor devices, also known as power electronic devices, are high-power electronic devices mainly used in power conversion and control circuits of power equipment. Power devices include power diodes, thyristors, GTRs, GTOs, power MOSFETs, and IGBTs.

[0003] Nowadays, with the rapid development of science and technology, electronic devices have been applied to all walks of life, and the core component of electronic devices is the chip. The chip will emit a lot of heat when it is in operation. In the existing technology, the chips are covered with cooling fans for the heat dissipation of the chips. The surface of the chip heat sink is prone to absorb dust after long-term use, resulting in poor heat dissipation ability of the chip, which in turn leads to poor heat dissipation effect, directly affecting the performance of semiconductor devices, and even causing semiconductor devices to fail and open circuit. Summary of the invention

[0004] The technical solution adopted by the present invention to achieve the technical purpose is: a high-power semiconductor device with a fail-open feature, whose structure includes a mainboard, a chip, a heat sink, and a fixing screw. The upper end of the mainboard is fitted and connected with the chip contacts, and the fixing screw is arranged at the bottom end of the heat sink. The heat sink is composed of a water pump, a cooling assembly, and a heat conduction plate. The water pipe above the water pump is welded to the cooling assembly, and the bottom of the cooling assembly is bolted to the heat conduction plate.

[0005] As a further improvement of the present invention, the cooling assembly consists of a water cooling mechanism, a transmission mechanism, and a dust removal mechanism. The right side of the transmission mechanism is bolted to the left side of the water cooling mechanism, and the right side of the water cooling mechanism is mechanically connected to the back of the dust removal mechanism.

[0006] As a further improvement of the present invention, the water cooling mechanism consists of a cooling pipe, a water inlet, a water outlet, a filter shell, and a heat sink. The bottom of the water inlet is snap-connected with the cooling pipe, the bottom of the water outlet is snap-connected with the cooling pipe, the surface of the cooling pipe body is welded to the heat sink, the heat sink is mechanically connected to the inner side of the filter shell, the filter shell is bolted to the transmission mechanism, and the heat sink is a rectangular sheet of copper plate with good heat conduction capability.

[0007] As a further improvement of the present invention, the transmission mechanism is composed of a transmission motor, a fixed bracket, a shell, a reinforcement rod, and a transmission rod. The transmission motor is mechanically connected to the fixed bracket, the upper and lower ends of the fixed bracket are welded to the shell, the left and right sides of the reinforcement rod are welded to the shell, the front end of the transmission rod is arranged inside the transmission motor, the shell is bolted to the water cooling mechanism, and a motor fixing plate is provided in the middle of the reinforcement rod, which is a non-regular octagon and is used to position and fix the transmission motor.

[0008] As a further improvement of the present invention, the dust removal mechanism is composed of a fan housing, a filter, and a dust removal brush mechanism. The filter is snap-connected to the fan housing, the dust removal brush mechanism is gap-matched with the filter, the fan housing is mechanically connected to the water cooling mechanism, the filter is made of stainless steel and is round in shape, and has good filtering, dust removal, ventilation and other characteristics.

[0009] As a further improvement of the present invention, the dust removal brush mechanism is composed of a brush rod, a rotating block, a snap-fit ​​groove, and bristles. The back of the bristles is adhesively connected to the brush rod, the lower end of the brush rod is welded to the rotating block, the snap-fit ​​groove is embedded in the lower end of the rotating block, the lower end of the rotating block is matched with the gap between the filter screen, and the bristles are nylon brush filaments, which have the characteristics of high temperature resistance, acid and alkali resistance, good elasticity, etc., and are used to brush away dust adsorbed on the filter screen.

[0010] Beneficial Effects

[0011] The present invention discloses a high-power semiconductor device with a failure open circuit feature, wherein the upper end of a mainboard is fitted and connected with chip contacts, a heat conducting plate at the bottom of a heat dissipation device is locked on the mainboard by a fixing screw, a water pump and a water cooling mechanism form a closed circulation channel, when the device is running, the heat sink and the cooling tube inside the filter housing of the cooling component absorb the heat generated when the chip is working through the heat conducting plate, the water pump delivers circulating fluid through the water inlet of the water cooling mechanism, the circulating fluid in the cooling tube absorbs the heat absorbed by the heat sink and the cooling tube body, and is delivered to the inside of the water pump again through the water outlet, forming a closed circulation water channel, thereby ensuring that the circulating fluid does not leak out and cause failure of the electrical appliance, and when the cooling component is working, the transmission mechanism drives the fan blades inside the dust removal mechanism to perform synchronous heat dissipation treatment.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] The fixed bracket is welded on the shell. The transmission motor is fixed by the fixed bracket and drives the transmission rod engaged in the middle of the reinforcement rod. The transmission block is engaged and connected with the engagement groove inside the rotating block. The transmission rod drives the fan inside the fan housing to absorb air. The air contains dust and lint. When the air passes through the filter, the dust and lint are adsorbed on the surface of the filter. The dust removal brush mechanism is driven by the transmission rod, and the rotating block drives the brush rod to rotate. The bristles will brush the foreign matter adsorbed on the surface of the filter, allowing the air to enter the cooling component more smoothly. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The schematic diagram of the structure of a high-power semiconductor device with a fail-open feature according to the present invention.

[0015] Figure 2 It is a schematic diagram of the structure of the heat dissipation device of the present invention.

[0016] Figure 3 It is a schematic diagram of the cooling assembly structure of the present invention.

[0017] Figure 4 It is a schematic diagram of the water cooling mechanism structure of the present invention.

[0018] Figure 5 It is a schematic diagram of the transmission mechanism structure of the present invention.

[0019] Figure 6 It is a schematic diagram of the dust removal mechanism structure of the present invention.

[0020] Figure 7 It is a schematic diagram of the dust removal brush mechanism structure of the present invention.

[0021] In the figure: mainboard-1, chip-2, heat dissipation device-3, fixing screw-4, water pump-31, cooling assembly-32, heat conduction plate-33, water cooling mechanism-21, transmission mechanism-22, dust removal mechanism-23, cooling pipe-1a, water inlet-1b, water outlet-1c, filter housing-1d, heat sink-1e, transmission motor-221, fixing bracket-222, housing-223, reinforcement rod-224, transmission rod-225, fan housing-23a, filter-23b, dust removal brush mechanism-23c, brush rod-c1, rotating block-c2, engaging groove-c3, bristles-c4. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the preferred embodiments of the present invention are further described below in conjunction with specific implementation methods and accompanying drawings.

[0023] Example 1

[0024] As attached Figure 1 To Attachment Figure 4 Shown:

[0025] The present invention provides a high-power semiconductor device with a fail-open feature, which structure includes a mainboard 1, a chip 2, a heat sink 3, and a fixing screw 4. The upper end of the mainboard 1 is fitted and connected with the chip 2 contact point, and the fixing screw 4 is arranged at the bottom of the heat sink 3. The heat sink 3 is composed of a water pump 31, a cooling component 32, and a heat conducting plate 33. The water pipe above the water pump 31 is welded to the cooling component 32, and the bottom of the cooling component 32 is bolted to the heat conducting plate 33.

[0026] The cooling assembly 32 is composed of a water cooling mechanism 21 , a transmission mechanism 22 , and a dust removal mechanism 23 . The right side of the transmission mechanism 22 is bolted to the left side of the water cooling mechanism 21 , and the right side of the water cooling mechanism 21 is mechanically connected to the back side of the dust removal mechanism 23 .

[0027] Among them, the water cooling mechanism 21 is composed of a cooling pipe 1a, a water inlet 1b, a water outlet 1c, a filter housing 1d, and a heat sink 1e. The bottom of the water inlet 1b is snap-connected with the cooling pipe 1a, the bottom of the water outlet 1c is snap-connected with the cooling pipe 1a, the surface of the cooling pipe 1a is welded to the heat sink 1e, the heat sink 1e is mechanically connected to the inner side of the filter housing 1d, the filter housing 1d is bolted to the transmission mechanism 22, and the heat sink 1e is a rectangular copper plate with good heat conduction capability, which cooperates with the cooling pipe 1a to dissipate heat.

[0028] The specific usage and function of this embodiment are as follows:

[0029] In the present invention, the upper end of the mainboard 1 is fitted and connected with the contact points of the chip 2, the heat conducting plate 33 at the bottom of the heat dissipation device 3 is locked on the mainboard 1 by the fixing screw 4, the water pump 31 and the water cooling mechanism 21 form a closed circulation channel, when the equipment is running, the heat sink 1e and the cooling tube 1a inside the filter shell 1d of the cooling component 32 absorb the heat generated by the chip 2 during operation through the heat conducting plate 33, the water pump 31 delivers the circulating liquid through the water inlet 1b of the water cooling mechanism 21, the circulating liquid in the cooling tube 1a absorbs the heat absorbed by the heat sink 1e and the cooling tube 1a, and is transported to the inside of the water pump 31 again through the water outlet 1c, forming a closed circulation waterway, so as to ensure that the circulating liquid does not leak out and cause failure of the electrical appliance, while the cooling component 32 is working, the transmission mechanism 22 drives the fan blades inside the dust removal mechanism 23 to perform synchronous heat dissipation treatment.

[0030] Example 2

[0031] As attached Figure 5 To Attachment Figure 7 Shown:

[0032] Among them, the transmission mechanism 22 is composed of a transmission motor 221, a fixed bracket 222, a shell 223, a reinforcement rod 224, and a transmission rod 225. The transmission motor 221 is mechanically connected to the fixed bracket 222. The upper and lower ends of the fixed bracket 222 are welded to the shell 223. The left and right sides of the reinforcement rod 224 are welded to the shell 223. The front end of the transmission rod 225 is arranged inside the transmission motor 221. The shell 223 is bolted to the water cooling mechanism 21. A motor fixing plate is provided in the middle of the reinforcement rod 224, which is a non-regular octagon and is used to position and fix the transmission motor 221 so that the transmission motor 221 can operate better.

[0033] Among them, the dust removal mechanism 23 is composed of a fan housing 23a, a filter 23b, and a dust removal brush mechanism 23c. The filter 23b is snap-connected to the fan housing 23a, and the dust removal brush mechanism 23c is gap-fitted with the filter 23b. The fan housing 23a is mechanically connected to the water cooling mechanism 21. The filter 23b is made of stainless steel and is round in shape. It has good filtering, dust removal, ventilation and other characteristics, so that dust and hair in the air will not enter the filter.

[0034] Among them, the dust removal brush mechanism 23c is composed of a brush rod c1, a rotating block c2, a snap-fit ​​groove c3, and bristles c4. The back of the bristles c4 is adhesively connected to the brush rod c1, and the lower end of the brush rod c1 is welded to the rotating block c2. The snap-fit ​​groove c3 is embedded in the lower end of the rotating block c2. The lower end of the rotating block c2 is gap-fitted with the filter 23b. The bristles c4 are nylon brush filaments, which have the characteristics of high temperature resistance, acid and alkali resistance, good elasticity, etc., and are used to brush away dust adsorbed on the filter 23b, so that the transmission mechanism 22 can operate in a better working environment.

[0035] The specific usage and function of this embodiment are as follows:

[0036] In the present invention, the fixed bracket 222 is welded on the shell 223. The transmission motor 221 drives the transmission rod 225 engaged in the middle of the reinforcement rod 224 under the fixation of the fixed bracket 222. The transmission block 225 is engaged with the engagement groove c3 inside the rotating block c2. The transmission rod 225 drives the fan inside the fan housing 23a to absorb air. The air contains dust and fluff. When the air passes through the filter 23b, the dust and fluff are adsorbed on the surface of the filter 23b. The dust removal brush mechanism 23c is driven by the transmission rod 225, and the rotating block c2 drives the brush rod c1 to rotate. The bristles c4 will brush the foreign matter adsorbed on the surface of the filter 23b, so that the air can enter the cooling component 32 more smoothly.

[0037] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrating the principles of the present invention. Without departing from the spirit or basic features of the present invention, the present invention can be implemented in other specific forms and various changes and improvements can be made. These changes and improvements all fall within the scope of the present invention to be protected. Therefore, the scope of protection of the present invention is defined by the attached claims and their equivalents, rather than the above description.

[0038] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A high-power semiconductor device with a fail-open feature, the structure of which comprises a mainboard (1), a chip (2), a heat sink (3), and a fixing screw (4), wherein the upper end of the mainboard (1) is in contact with the chip (2), and the fixing screw (4) is arranged at the bottom end of the heat sink (3), and the characteristics are: The heat dissipation device (3) is composed of a water pump (31), a cooling assembly (32), and a heat conduction plate (33); the water pipe above the water pump (31) is welded to the cooling assembly (32), and the bottom of the cooling assembly (32) is bolted to the heat conduction plate (33); The cooling assembly (32) is composed of a water cooling mechanism (21), a transmission mechanism (22), and a dust removal mechanism (23); the right side of the transmission mechanism (22) is bolted to the left side of the water cooling mechanism (21), and the right side of the water cooling mechanism (21) is mechanically connected to the back side of the dust removal mechanism (23); The water cooling mechanism (21) is composed of a cooling pipe (1a), a water inlet (1b), a water outlet (1c), a filter housing (1d), and a heat sink (1e); the bottom of the water inlet (1b) is snap-connected to the cooling pipe (1a); the bottom of the water outlet (1c) is snap-connected to the cooling pipe (1a); the surface of the cooling pipe (1a) is welded to the heat sink (1e); the heat sink (1e) is mechanically connected to the inner side of the filter housing (1d); and the filter housing (1d) is bolted to the transmission mechanism (22); The transmission mechanism (22) is composed of a transmission motor (221), a fixed bracket (222), a shell (223), a reinforcement rod (224), and a transmission rod (225); the transmission motor (221) is mechanically connected to the fixed bracket (222); the upper and lower ends of the fixed bracket (222) are welded to the shell (223); the left and right sides of the reinforcement rod (224) are welded to the shell (223); the front end of the transmission rod (225) is arranged inside the transmission motor (221); and the shell (223) is bolted to the water cooling mechanism (21); The dust removal mechanism (23) is composed of a fan housing (23a), a filter screen (23b), and a dust removal brush mechanism (23c); the filter screen (23b) is snap-connected to the fan housing (23a); the dust removal brush mechanism (23c) is gap-matched with the filter screen (23b); and the fan housing (23a) is mechanically connected to the water cooling mechanism (21); The dust removal brush mechanism (23c) is composed of a brush rod (c1), a rotating block (c2), a snap-fit ​​groove (c3), and bristles (c4); the back of the bristles (c4) is bonded to the brush rod (c1); the lower end of the brush rod (c1) is welded to the rotating block (c2); the snap-fit ​​groove (c3) is embedded in the lower end of the rotating block (c2); and the lower end of the rotating block (c2) is gap-matched with the filter screen (23b).

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