Joining apparatus

Abstract

Disclosed is a bonding apparatus including a bonding head configured to move in a vertical direction, a stage disposed below the bonding head and including a first portion having a first planar surface facing the bonding head and a first support surface opposite the first planar surface, and a support disposed below the stage and including a second support surface facing the first support surface, wherein the second support surface of the support has a recessed portion having a first radius of curvature.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0030675, filed on March 12, 2020, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary implementations of the present invention generally relate to bonding devices, and more specifically, to bonding devices for bonding a driver to a side surface of a display panel. Background Technology

[0004] Typically, a display device includes a display panel, a scan driver, and a data driver. The display panel includes pixels for displaying images, the scan driver provides scan signals to the pixels, and the data driver provides data voltages to the pixels. The scan driver and data driver are connected to the display panel.

[0005] The scan driver generates a scan signal and provides it to the pixels. The data driver generates a data voltage and provides it to the pixels. The pixels receive the data voltage in response to the scan signal and display the image.

[0006] The area containing the scan driver and data driver is called the bezel area. In recent years, techniques have been developed to attach the drivers to the side surface of the display panel to reduce the bezel area.

[0007] The information disclosed in this background section is only for understanding the background technology of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0008] The applicant has discovered that when the driver is attached to the side surface of the display panel via a bonding device, it is difficult to adjust or control the level of the side surface of the display panel.

[0009] The bonding apparatus constructed according to the principles and exemplary implementations of the present invention can precisely adjust and control the horizontal level of the side surface of the display panel, such that the side surface of the display panel is substantially parallel to the lower surface of the bonding head of the bonding apparatus. Therefore, the bonding apparatus can uniformly perform the bonding process on the side surface of the display panel and the driver, thereby improving the bonding quality between the side surface of the display panel and the driver, and reducing defects in the display device.

[0010] Other features of the inventive concept will be set forth in the following description and will be apparent in part from the description or may be learned by practice of the inventive concept.

[0011] According to an aspect of the invention, the joining device includes: a joining head configured to move in a vertical direction; a platform disposed below the joining head and including a first portion having a first planar surface facing the joining head and a first support surface opposite to the first planar surface; and a support member disposed below the platform and including a second support surface facing the first support surface, wherein the second support surface of the support member has a recessed portion having a first radius of curvature.

[0012] The first support surface of the first part of the platform may include a curved surface that protrudes in a downward direction, and the curved surface may have a second radius of curvature.

[0013] The first radius of curvature of the recessed portion of the second support surface of the support member can be equal to the second radius of curvature of the curved surface of the first part of the platform.

[0014] When viewed in a plane, the recessed portion of the second support surface of the support member can have an area larger than that of the first support surface of the first part of the platform.

[0015] The platform may also include a second portion extending vertically from one side of the first portion of the platform, and the second portion of the platform may include a second planar surface substantially perpendicular to the first planar surface of the first portion of the platform.

[0016] The joining device may also include a clamp arranged to be spaced apart from a second portion of the table in a horizontal direction substantially perpendicular to the vertical direction.

[0017] The clamp can be configured to move horizontally toward or away from the second planar surface of the second part of the stage.

[0018] The joint can be configured to apply heat and pressure to the target object.

[0019] The connector can be configured to apply ultrasonic waves to a target object.

[0020] The joint can be configured to direct a laser beam onto the target object.

[0021] The engagement device may also include at least one ball caster rotatably coupled to the first support surface.

[0022] The first support surface of the first part of the platform can be substantially parallel to the first planar surface of the first part of the platform.

[0023] When using a joining device, a target object can be placed on a table, wherein one side surface of the target object can be placed on a first planar surface of a first part of the table, and the other side surface of the target object can face the joining head, the other side surface of the target object being opposite to the one side surface of the target object.

[0024] According to another aspect of the invention, the bonding device includes: a platform including a first portion having a first planar surface and a first support surface opposite to the first planar surface, wherein a first side surface of a display panel is disposed on the first planar surface; a bonding head disposed on the platform and configured to move toward or away from a second side surface of the display panel opposite to the first side surface of the display panel; and a support member disposed below the platform and including a second support surface facing the first support surface and having a curved surface region.

[0025] The second support surface of the support member may have a curved surface that is concave in the downward direction, and the first support surface of the first portion of the platform may have a curved surface that is convex in the downward direction.

[0026] The first support surface of the first part of the platform may have a radius of curvature equal to that of the second support surface of the support member.

[0027] The joint can be configured to bond a flexible circuit board disposed on a second side surface to the second side surface using at least one of a thermo-press bonding method, an ultrasonic bonding method, and a laser bonding method.

[0028] The coupling device may also include one or more ball casters disposed between a first support surface of the first portion of the table and a second support surface of the support member, wherein the first support surface of the first portion of the table is substantially parallel to a first planar surface of the first portion of the table.

[0029] The bonding device may also include a clamp, wherein: the stage includes a second portion having a second planar surface substantially perpendicular to a first planar surface of a first portion of the stage, a second surface of a display panel is placed on the second planar surface, and the clamp may include a third planar surface selectively contacting a first surface of the display panel opposite to the second surface of the display panel.

[0030] It should be understood that both the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0031] The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the invention and, together with the specification, serve to explain the inventive concept.

[0032] Figure 1 This is a perspective view of an exemplary embodiment of a display device constructed according to the principles of the present invention.

[0033] Figure 2 yes Figure 1 A cross-sectional view of the display device.

[0034] Figure 3 yes Figure 2 A perspective view of the display panel of the display device and the driver disposed on the side surface of the display panel.

[0035] Figure 4 and Figure 5 This is a view of an exemplary embodiment of a joining device constructed according to the principles of the present invention, viewed in the corresponding direction.

[0036] Figure 6 and Figure 7 It is shown Figure 4 The view of the connection between the platform and the support of the joining device when viewed in the corresponding direction.

[0037] Figure 8 , Figure 9 , Figure 10 and Figure 11 It is shown by using Figure 4 Manufacturing of joining equipment Figure 1 The view of the display device when viewed in the corresponding direction.

[0038] Figure 12 and Figure 13 This is a view of another exemplary embodiment of the joining device constructed according to the principles of the present invention when viewed in the corresponding direction. Detailed Implementation

[0039] In the following description, numerous specific details are set forth for purposes of explanation in order to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of apparatus or methods employing one or more of the inventive concepts disclosed herein. However, it will be apparent that various exemplary embodiments may be practiced without these specific details or using one or more equivalent arrangements. In other instances, well-known structures and apparatuses are illustrated in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, a particular shape, configuration, and characteristic of one exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0040] Unless otherwise stated, the exemplary embodiments shown should be understood as exemplary features providing details of variations in some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects of various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged and / or rearranged in other ways without departing from the inventive concept.

[0041] Crosshairs and / or shading are typically used in the accompanying drawings to clarify the boundaries between adjacent elements. Therefore, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for particular materials, material properties, dimensions, scale, commonalities between illustrated elements, and / or any other characteristics, properties, etc., of the elements, unless otherwise stated. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. A particular process sequence may be performed differently than the described sequence when exemplary embodiments can be implemented differently. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description. Similarly, the same reference numerals denote the same elements.

[0042] When an element (such as a layer) is referred to as being "on," "connected to," or "attached to" another element or layer, it may be directly on, directly connected to, or directly attached to that other element or layer, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly" on, directly connected to, or directly attached to another element or layer, there is no intervening element or layer. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection, with or without an intervening element. Furthermore, the DR1, DR2, and DR3 axes are not limited to the three axes of a rectangular coordinate system (such as the x-axis, y-axis, and z-axis) and can be interpreted in a broader sense. For example, the DR1, DR2, and DR3 axes may be perpendicular to each other, or they may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0043] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0044] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “lower,” “above,” “upper,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein to describe the relationship between one element and another(s) shown in the figures. In addition to the orientations depicted in the figures, spatial relative terms are intended to also include different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is flipped, an element described as “below” or “below” other elements or features will be oriented “above” those other elements or features. Thus, the exemplary term “below” can include both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore, the spatial relative descriptive terms used herein should be interpreted accordingly.

[0045] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when used in this specification, the terms “comprises,” “comprising,” “includes,” and / or “including” specify the presence of stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than terms of degree, and therefore, to explain the inherent biases in the measurements, calculations, and / or provided values ​​that will be recognized by those skilled in the art.

[0046] Various exemplary embodiments are described herein with reference to cross-sectional and / or exploded views as schematic illustrations of idealized exemplary embodiments and / or intermediate structures. Therefore, variations in the shapes illustrated due to, for example, manufacturing techniques and / or tolerances are to be expected. Consequently, the exemplary embodiments disclosed herein are not necessarily to be construed as limited to the specific shapes shown for a particular region, but rather include deviations in shape due to, for example, manufacturing processes. In this way, the regions shown in the figures may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0047] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms such as those defined in common dictionaries should be interpreted as having the same meaning as they have in the context of the relevant field and should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0048] The inventive concept will be explained in detail below with reference to the accompanying drawings.

[0049] Figure 1 This is a perspective view of an exemplary embodiment of a display device DD constructed according to the principles of the present invention.

[0050] refer to Figure 1 The display device DD according to an exemplary embodiment may have a plate shape defined by a short side extending in a first direction D1 and a long side extending in a second direction D2 intersecting the first direction D1. Hereinafter, the expression "when viewed in a plane" means the state viewed in a third direction D3 perpendicular to the plane defined by the first direction D1 and the second direction D2. When viewed in a plane, the display device DD may have a rectangular shape; however, the exemplary embodiment is not limited to or restricted by this. The display device DD may have various shapes, such as circular or polygonal shapes.

[0051] The upper surface of the display device DD can be defined as the display surface DS, and can be a plane defined by a first direction D1 and a second direction D2. The image IM generated by the display device DD can be provided to the user through the display surface DS.

[0052] The display surface DS may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may display an image, and the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and may define a border area of ​​the display device DD.

[0053] Figure 2 yes Figure 1 A cross-sectional view of the display device DD.

[0054] refer to Figure 2 The display device DD may include a display panel DP, an input sensing unit ISP disposed on the display panel DP, an anti-reflective layer POL disposed on the input sensing unit ISP, a window WIN disposed on the anti-reflective layer POL, and a cover panel CV disposed below the display panel DP.

[0055] The display panel DP can be a light-emitting display panel; however, the exemplary embodiments are not limited thereto. For example, the display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots or quantum rods. Alternatively, the display panel DP can be a liquid crystal display panel including a liquid crystal layer. In the exemplary embodiments shown, an organic light-emitting display panel will be described as the display panel DP.

[0056] The display panel DP may include a first substrate SUB1, a second substrate SUB2, a circuit element layer CL, a display element layer OL, and a sealing layer SL.

[0057] The first substrate SUB1 may be a rigid substrate. For example, the first substrate SUB1 may be a glass substrate. The first substrate SUB1 may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA and the non-display area NDA of the first substrate SUB1 may be respectively connected to... Figure 1 The display area DA and the non-display area NDA of the display surface DS shown in the figure are basically corresponding.

[0058] A second substrate SUB2 may be disposed on a first substrate SUB1. The lower surface of the second substrate SUB2 may face the upper surface of the first substrate SUB1. In the illustrated exemplary embodiment, the second substrate SUB2 may be a packaging substrate. For example, the second substrate SUB2 may include a glass substrate.

[0059] A circuit element layer CL and a display element layer OL can be disposed between a first substrate SUB1 and a second substrate SUB2. The circuit element layer CL may include an insulating layer, semiconductor patterns, conductive patterns, and signal lines. Regarding the formation process of the circuit element layer CL, the insulating layer, semiconductor layer, and conductive layer can be formed on the first substrate SUB1 by coating and deposition processes, and then the insulating layer, semiconductor layer, and conductive layer can be selectively patterned by multiple photolithography processes. Then, the semiconductor patterns, conductive patterns, and signal lines of the circuit element layer CL can be formed. For example, the signal lines can be data lines or scan lines.

[0060] The display element layer OL can be disposed in the display area DA. The display element layer OL may include light-emitting elements. For example, the display element layer OL may include organic light-emitting materials, quantum dots, quantum rods, or micro LEDs.

[0061] A sealing layer SL may be disposed between the first substrate SUB1 and the second substrate SUB2. The sealing layer SL may be disposed outside the display element layer OL and the circuit element layer CL. The sealing layer SL may overlap with the non-display area NDA in a third direction D3. For example, the sealing layer SL may extend along the edges of the first substrate SUB1 and the second substrate SUB2. The sealing layer SL may include an insulating material. For example, the sealing layer SL may include a glass material.

[0062] The second substrate SUB2 and the sealing layer SL can protect the display element layer OL disposed on the first substrate SUB1. For example, the second substrate SUB2 and the sealing layer SL can prevent external moisture or foreign matter from entering the display element layer OL disposed on the first substrate SUB1, and can prevent defects in the light-emitting element.

[0063] However, exemplary embodiments are not limited thereto. For example, the second substrate SUB2 and the sealing layer SL can be omitted from the display panel DP. For example, the display panel DP may include a thin-film encapsulation layer instead of the second substrate SUB2 and the sealing layer SL. For example, the thin-film encapsulation layer may be disposed on the circuit element layer CL to cover the display element layer OL. The thin-film encapsulation layer may include an inorganic layer, an organic layer, and an inorganic layer stacked sequentially. The inorganic layer may include inorganic materials and may protect the display element layer OL from external moisture and oxygen. The organic layer may include organic materials and may protect the display element layer OL from foreign matter such as dust particles.

[0064] An input sensing unit (ISP) can be disposed on a display panel (DP). The ISP can sense external input (e.g., a user's touch or proximity), convert the external input into a predetermined input signal, and provide the input signal to the display panel (DP). The ISP may include multiple sensing electrodes to sense the external input. The sensing electrodes can sense the external input using a capacitive method. The display panel (DP) can receive the input signal from the ISP and can generate an image corresponding to the input signal.

[0065] An anti-reflective layer (POL) can be disposed on the input sensing unit (ISP). The anti-reflective layer (POL) reduces the reflectance of external light incident from outside the display device (DD) onto the display panel (DP). As an example, the anti-reflective layer (POL) may include a retarder and / or a polarizer.

[0066] The Window WIN protects the Display Panel (DP) and Input Sensor Unit (ISP) from external scratches and impacts. The Window WIN can be attached to the ISP using an adhesive. The adhesive may include an optically clear adhesive. The image generated by the Display Panel (DP) can be displayed to the user through the Window WIN.

[0067] A cover panel (CV) can be disposed beneath the display panel (DP). The cover panel (CV) may include one or more functional layers. For example, the cover panel (CV) may include a buffer layer. The buffer layer may be a synthetic resin foam comprising a matrix component and multiple voids. The voids can absorb impacts applied to the display panel (DP).

[0068] Figure 3 This is a perspective view of a display panel DP of a display device DD according to an exemplary embodiment and a driver DDR disposed on a side surface of the display panel DP. For ease of explanation, Figure 3 The stacked structure of the display panel (DP) is illustrated schematically.

[0069] refer to Figure 3 The display panel DP may include a first surface S1, a second surface S2, a first side surface SF1, and a second side surface SF2. The first surface S1 may define the upper surface of the display panel DP. The first surface S1 may be the area through which an image is displayed in the display panel DP. The second surface S2 may define the lower surface of the display panel DP. In the display panel DP, the second surface S2 may be opposite to the first surface S1.

[0070] The first side surface SF1 can be substantially parallel to the plane defined by the first direction D1 and the third direction D3. Multiple pads PD can be provided on the first side surface SF1. The pads PD can be spaced apart from each other in the first direction D1.

[0071] The pad PD can be set on the first substrate SUB1. The pad PD can be connected to the circuit element layer CL (reference). Figure 2 Signal lines. For example, each pad in PD can be connected to a corresponding signal line in the circuit element layer CL. For example, a signal line can be a data line.

[0072] Figure 3 Five pads PD are shown disposed on the first side surface SF1; however, the exemplary embodiment is not limited thereto. For example, the number of pads PD disposed on the first side surface SF1 may be greater than 5. The second side surface SF2 may be opposite the first side surface SF1.

[0073] The driver DDR can be disposed on the first side surface SF1 of the display panel DP. The driver DDR can generate signals and can apply the generated signals to the pad PD. For example, the driver DDR can generate data signals and apply the data signals to the circuit element layer CL (reference) via the pad PD. Figure 2 (Data cable)

[0074] The driver DDR may include connection pads (CPD), a flexible printed circuit board (FPC), and a driver chip IC. The connection pads (CPD) may be disposed on one surface of the flexible printed circuit board (FPC). The one surface of the flexible printed circuit board (FPC) may face the first side surface (SF1) of the display panel (DP).

[0075] The connection pads (CPDs) can be configured to correspond to the pads (PDs). Specifically, the connection pads (CPDs) can be spaced apart from each other in the first direction (D1). The connection pads (CPDs) can be electrically connected to the pads (PDs) individually.

[0076] The flexible printed circuit board (FPC) can be a flexible substrate. For example, a portion of the flexible printed circuit board (FPC) can be bent to be positioned below the second surface S2 of the display panel DP.

[0077] The driver chip IC can be disposed on the opposite surface of the flexible printed circuit board (FPC). The opposite surface of the flexible printed circuit board (FPC) can be opposite to one of the aforementioned surfaces on which the connection pads CPD are disposed.

[0078] According to an exemplary embodiment, the driver DDR connected to the signal line via the pad PD can be connected to the first side surface SF1 of the display panel DP, and thus the size of the bezel portion of the display device DD can be reduced.

[0079] Figure 4 and Figure 5 This is a view of an exemplary embodiment of the bonding device BD constructed according to the principles of the present invention, viewed in the corresponding direction. Figure 5 It shows when from Figure 4 The bonding device BD is shown when the third planar surface FL3 is observed.

[0080] refer to Figure 4 and Figure 5 The BD coupling device can be used to... Figure 3 The driver DDR shown is fixed to the first side surface SF1 of the display panel DP. The bonding device BD may include a stage ST, a bonding head BH, a clamp CLP, and a support SU. A target object can be placed on the stage ST. For example, the target object could be... Figure 3 The display panel DP is shown. The stage ST can be rigid. For example, the stage ST can include a metallic material.

[0081] The stage ST may include a first portion PP1 and a second portion PP2. The first portion PP1 and the second portion PP2 may be integrally formed with each other, or they may be formed separately and then joined together. The first portion PP1 may include a first planar surface FL1 and a first support surface SUF1. The first planar surface FL1 may be substantially perpendicular to a third direction DR3. In other words, the first planar surface FL1 may be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2.

[0082] The second side surface SF2 of the display panel DP can be placed on the first planar surface FL1. The width of the first planar surface FL1 in the first direction DR1 can be equal to or greater than 1 / 2 the width of the first planar surface FL1. Figure 3 The thickness of the second side surface SF2 of the display panel DP shown (i.e., the width of the second side surface SF2 in the third direction D3).

[0083] The first support surface SUF1 may be opposite to the first planar surface FL1. The first support surface SUF1 may define the lower surface of the first portion PP1. In the illustrated exemplary embodiment, the first support surface SUF1 may be a curved surface. For example, the first support surface SUF1 may have a downwardly convex shape.

[0084] The second portion PP2 may extend from one side of the first portion PP1 in a vertical direction (e.g., in the third direction DR3). When viewed in a plane (e.g., in the third direction DR3), the first portion PP1 and the second portion PP2 may not overlap each other. The second portion PP2 may include a second planar surface FL2.

[0085] The second planar surface FL2 may be substantially parallel to the plane defined by the second direction DR2 and the third direction DR3. The second planar surface FL2 may be substantially perpendicular to the first planar surface FL1. For example, a plurality of suction holes may be defined in the second planar surface FL2. The suction holes can draw in air between the second planar surface FL2 and the target object disposed on the second planar surface FL2, thereby fixing the target object to the second planar surface FL2.

[0086] The second surface S2 of the display panel DP can be disposed on the second planar surface FL2. The width of the second planar surface FL2 on the third direction DR3 can be less than Figure 3 The width of the second surface S2 of the display panel DP shown in the second direction D2. For example, when the display panel DP is disposed on the second planar surface FL2, one end of the display panel DP may protrude beyond the second planar surface FL2 in the third direction DR3.

[0087] The lower surface of the second part PP2 can be an inclined surface IF. For example, as... Figure 4As shown, the lower surface of the second part PP2 can be tilted upward toward the right side of the first direction DR1.

[0088] The joint BH can be mounted on the stage ST. When viewed in a plane (e.g., in the third direction DR3), the joint BH can overlap with the first planar surface FL1 of the first portion PP1, but can not overlap with the second portion PP2. The lower surface BF of the joint BH can face the first planar surface FL1. The lower surface BF of the joint BH can be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2. The joint BH can be moved in the vertical direction (e.g., in the third direction DR3). For example, the joint BH can be moved in the third direction DR3 to approach or move away from the first planar surface FL1.

[0089] The BH connector can Figure 3 The pads PD of the display panel DP shown are... Figure 3 The driver DDR shown is electrically connected to the connection pad CPD. For example, the connector BH can be used to fix the driver DDR to the first side surface SF1 of the display panel DP using at least one of the following methods: thermoforming, ultrasonic bonding, and laser bonding.

[0090] Specifically, the connector BH may include a pressure tip and a heater to apply predetermined pressure and heat to the flexible circuit board (e.g., reference). Figure 3 (as in "FPC"). Alternatively, the connector BH may include an ultrasonic generator and an ultrasonic irradiation unit to apply ultrasonic waves of a predetermined wavelength between the connection pad CPD and the pad PD. Alternatively, the connector BH may include a laser irradiation unit to irradiate a laser beam between the connection pad CPD and the pad PD. However, exemplary embodiments are not limited to or restricted by these provisions.

[0091] The fixture CLP may be spaced apart from the second portion PP2 of the stage ST in the first direction DR1. The fixture CLP may include a third planar surface FL3. The third planar surface FL3 may face the second planar surface FL2. For example, the first planar surface FL1 may not overlap with the second planar surface FL2 or the third planar surface FL3 in the first direction DR1. Alternatively, the first planar surface FL1 may partially overlap with the second planar surface FL2 in the first direction DR1.

[0092] The clamp CLP can move in the first direction DR1. The clamp CLP can selectively contact the target object set on the stage ST. For example, the clamp CLP can move closer to or further away from the second part PP2. In other words, the distance between the third planar surface FL3 and the second planar surface FL2 can vary.

[0093] A support member SU can be disposed below the stage ST. The support member SU may include a second support surface SUF2. The second support surface SUF2 of the support member SU may face the first support surface SUF1 of the first portion PP1 of the stage ST. A recessed portion RE may be defined in the second support surface SUF2 of the support member SU. For example, the recessed portion RE may have a curved shape that is recessed from the upper surface of the support member SU toward the lower surface of the support member SU. The first support surface SUF1 may contact the upper surface of the recessed portion RE of the second support surface SUF2. Therefore, the support member SU can support the stage ST.

[0094] Figure 6 and Figure 7 It is shown Figure 4 The view showing the connection between the platform ST and the support SU when viewed in the corresponding direction. Figure 6 and Figure 7 In the diagram, the first support surface SUF1 and the second support surface SUF2 are spaced apart; however, the first support surface SUF1 and the second support surface SUF2 are essentially in contact. For ease of explanation, Figure 6 and Figure 7 Only the lower part of the platform ST and the support SU located below the platform ST are shown.

[0095] refer to Figure 6 In the first direction DR1, the center of curvature of the recessed portion RE can be a first virtual point CP1. The recessed portion RE can have a first radius of curvature R1. The center of curvature of the first support surface SUF1 can be the same as the center of curvature of the recessed portion RE. For example, the center of curvature of the first support surface SUF1 can be the first virtual point CP1. The first support surface SUF1 can have a second radius of curvature R2. In the exemplary embodiment shown, the first radius of curvature R1 can be the same as the second radius of curvature R2. Therefore, in the first direction DR1, the first support surface SUF1 can have the same curvature as the recessed portion RE.

[0096] However, the exemplary embodiments are not limited thereto. For example, the second radius of curvature R2 may be different from the first radius of curvature R1. For example, the second radius of curvature R2 may be smaller than the first radius of curvature R1. In this case, in the first direction DR1, the curvature of the first support surface SUF1 may be greater than the curvature of the recessed portion RE.

[0097] In the first direction DR1, the width of the recessed portion RE of the support member SU can be greater than the width of the first support surface SUF1 of the stage ST. The first support surface SUF1 of the stage ST can move on the upper surface of the recessed portion RE of the support member SU in the first direction DR1. Since the first support surface SUF1 of the stage ST can move on the recessed portion RE of the support member SU, the horizontal level of the first planar surface FL1 of the stage ST relative to the first direction DR1 can vary.

[0098] refer to Figure 7 In the second direction DR2, the center of curvature of the recessed portion RE of the support member SU can be a second virtual point CP2. The recessed portion RE of the support member SU can have a third radius of curvature R3. In the second direction DR2, the center of curvature of the first support surface SUF1 of the stage ST can be the second virtual point CP2. The first support surface SUF1 of the stage ST can have a fourth radius of curvature R4. In the exemplary embodiment shown, the third radius of curvature R3 of the recessed portion RE of the support member SU can be the same as the fourth radius of curvature R4 of the first support surface SUF1 of the stage ST. Therefore, in the second direction DR2, the first support surface SUF1 of the stage ST can have the same curvature as the recessed portion RE of the support member SU.

[0099] However, the exemplary embodiments are not limited thereto. For example, the fourth radius of curvature R4 of the first support surface SUF1 of the stage ST may be different from the third radius of curvature R3 of the recessed portion RE of the support member SU. For example, the fourth radius of curvature R4 may be smaller than the third radius of curvature R3. In this case, in the second direction DR2, the curvature of the first support surface SUF1 of the stage ST may be greater than the curvature of the recessed portion RE of the support member SU.

[0100] In the second direction DR2, the width of the recessed portion RE of the support member SU can be greater than the width of the first support surface SUF1 of the stage ST. The first support surface SUF1 of the stage ST can move in the second direction DR2 on the recessed portion RE of the second support surface SUF2 of the support member SU. Since the first support surface SUF1 of the stage ST can move on the recessed portion RE of the support member SU, the horizontal level of the first planar surface FL1 relative to the second direction DR2 can change.

[0101] However, the exemplary embodiments are not limited thereto. For example, the width of the recessed portion RE of the support member SU in the first direction DR1 and the width in the second direction DR2 may each be equal to or less than one of the corresponding widths of the first support surface SUF1 of the stage ST in the first direction DR1 and the first support surface SUF1 of the stage ST in the second direction DR2.

[0102] Therefore, when the first support surface SUF1 of the stage ST moves on the recessed portion RE of the support SU, the angle between the first planar surface FL1 of the stage ST and each of the first direction DR1 and the second direction DR2 can change.

[0103] Figures 8 to 11 It is shown by using Figure 4 BD is used to manufacture the bonding equipment. Figure 1 The view of the display device DD process when viewed in the corresponding direction. Figure 9 and Figure 11 They respectively show from Figure 8 and Figure 10 The bonding device BD is observed when viewing the third planar surface FL3.

[0104] refer to Figure 3 , Figure 8 and Figure 9 The display panel DP can be placed on the stage ST. Specifically, the second side surface SF2 of the display panel DP can be disposed on the first planar surface FL1 of the first part PP1.

[0105] The second surface S2 of the display panel DP can be disposed on the second planar surface FL2 of the stage ST. The second surface S2 of the display panel DP can be fixed to the second planar surface FL2 of the stage ST. For example, the display panel DP can be vacuum-adsorbed onto the second planar surface FL2 of the stage ST through suction holes defined in the second planar surface FL2. The first side surface SF1 of the display panel DP can protrude beyond the second portion PP2 of the stage ST on the third direction DR3.

[0106] The first side surface SF1 of the display panel DP may be tilted relative to the first direction DR1 or the second direction DR2. The tilting of the first side surface SF1 of the display panel DP may occur during the process of cutting the mother substrate.

[0107] Sensor SS can measure the horizontal level of the first side surface SF1 of the display panel DP. For example, sensor SS can measure the angle between the first side surface SF1 and the first direction DR1, and the angle between the first side surface SF1 of the display panel DP and the second direction DR2. In the illustrated exemplary embodiment, it is assumed that the first side surface SF1 of the display panel DP forms a first angle A1 relative to the first direction DR1, and the first side surface SF1 of the display panel DP forms a second angle A2 relative to the second direction DR2. In this case, the first planar surface FL1 can be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2.

[0108] refer to Figure 3 , Figure 10 and Figure 11The display panel ST can control the first side surface SF1 of the display panel DP to be substantially parallel to the first direction DR1 and the second direction DR2. Specifically, the first support surface SUF1 of the first portion PP1 of the display panel ST can move to the left on the recessed portion RE of the support member SU in the first direction DR1. Therefore, the first planar surface FL1 of the display panel ST can form a third angle A3 relative to the first direction DR1. The third angle A3 can be substantially the same as the first angle A1. Therefore, when the first planar surface FL1 of the display panel ST is tilted relative to the first direction DR1 at the third angle A3, the first side surface SF1 of the display panel DP can be substantially parallel to the first direction DR1.

[0109] The first support surface SUF1 of the first portion PP1 of the stage ST can move to the left of the recessed portion RE of the support SU in the second direction DR2. Therefore, the first planar surface FL1 of the stage ST can form a fourth angle A4 relative to the second direction DR2. The fourth angle A4 can be substantially the same as the second angle A2. Therefore, when the first planar surface FL1 of the stage ST is tilted at the fourth angle A4 relative to the second direction DR2, the first side surface SF1 of the display panel DP can be substantially parallel to the second direction DR2.

[0110] Therefore, as the first part PP1 of the stage ST moves on the recessed part RE of the support SU, the first side surface SF1 can be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2.

[0111] The clamp CLP can move to approach the second part PP2 of the stage ST. The third planar surface FL3 of the clamp CLP can contact the first surface S1 of the display panel DP. The clamp CLP can secure the display panel DP to the stage ST.

[0112] The flexible circuit board (FPC) for the driver DDR can be mounted on the first side surface SF1 of the display panel DP. For example, the flexible circuit board (FPC) can be provided by a separate processing unit.

[0113] The connector BH is movable in a downward direction (e.g., in the opposite direction to the third direction DR3). The connector BH can contact the upper surface of the flexible circuit board FPC. The connector BH can be used to fix the flexible circuit board FPC to the first side surface SF1 of the display panel DP using at least one of thermoforming, ultrasonic, and laser bonding methods. The lower surface BF of the connector BH can be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2. The lower surface BF of the connector BH and the first side surface SF1 of the display panel DP can be substantially parallel to each other.

[0114] According to an exemplary embodiment, the horizontal level of the first side surface SF1 of the display panel DP can be controlled such that the bonding process is performed when the first side surface SF1 of the display panel DP and the lower surface BF of the bonding head BH are parallel to each other. Therefore, the bonding process can be performed uniformly between the first side surface SF1 of the display panel DP and the flexible circuit board FPC of the driver DDR. Thus, the bonding quality can be improved by the bonding equipment BD, and the display device (e.g., reference) can be reduced. Figure 1 The defects of “DD”).

[0115] Figure 12 and Figure 13 This is a view of another exemplary embodiment of the joining device BD-1 constructed according to the principles of the present invention, viewed in the corresponding direction.

[0116] The joining device BD-1 according to an exemplary embodiment will be described below. Figure 12 and Figure 13 In this drawing, the same reference numerals denote the same elements in the above-described joining device BD, and therefore, detailed descriptions of the same elements will be omitted, and the different features will be described primarily.

[0117] refer to Figure 12 and Figure 13 The joining device BD-1 may include at least one rotator RO disposed between the support SU and the first portion PP1 of the stage ST. In the illustrated exemplary embodiment, the first support surface SUF1-1 may be a plane. Specifically, the first support surface SUF1-1 may be substantially parallel to the plane defined by the first direction DR1 and the second direction DR2. The first support surface SUF1-1 may be substantially parallel to the first planar surface FL1.

[0118] The rotator RO can be located below the first support surface SUF1-1. The rotator RO can be rotatably fixed to the first support surface SUF1-1. For example, the rotator RO can be a ball caster.

[0119] In the illustrated exemplary embodiment, multiple rotators RO can be provided, and the rotators RO can be positioned below the first support surface SUF1-1 of the stage ST. For example, four rotators RO can be provided below the first support surface SUF1-1 of the stage ST, and thus, when viewed in the first direction DR1, two rotators RO can be shown, and when viewed in the second direction DR2, two rotators RO can be shown. For example, the four rotators RO can be arranged in a 2x2 matrix below the first support surface SUF1-1. However, the number of rotators RO provided below the first support surface SUF1-1 can vary.

[0120] According to an exemplary embodiment, when the rotator RO moves on the recessed portion RE of the second support surface SUF2 of the support member SU, the horizontal level of the first planar surface FL1 relative to the first direction DR1 and the second direction DR2 can change. For example, the engagement device BD-1 may include a member for maintaining the tilt of the first planar surface FL1.

[0121] Therefore, the bonding device BD-1 can control the target object (e.g., display panel DP, reference) set on the stage ST. Figure 3 The horizontal level of the side surface facing the joint head BH.

[0122] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. A coupling device, comprising: The joint is configured to move in the vertical direction; A platform is disposed below the joint and includes a first portion having a first planar surface facing the joint and a first support surface opposite to the first planar surface. as well as A support member is disposed below the platform and includes a second support surface facing the first support surface. The second support surface of the support member has a recessed portion, the recessed portion has a first radius of curvature, and when viewed in a plane, the area of ​​the recessed portion is larger than the area of ​​the first support surface.

2. The joining device according to claim 1, wherein, The first support surface of the first portion of the platform includes a curved surface that protrudes in a downward direction, and the curved surface has a second radius of curvature.

3. The joining device according to claim 2, wherein, The first radius of curvature of the recessed portion of the second support surface of the support member is equal to the second radius of curvature of the curved surface of the first portion of the platform.

4. The joining device according to claim 1, wherein, The platform further includes a second portion extending from one side of the first portion of the platform in the vertical direction, and the second portion of the platform includes a second planar surface perpendicular to the first planar surface of the first portion of the platform.

5. The joining device according to claim 4, further comprising a clamp arranged to be spaced apart from the second portion of the stage in a horizontal direction perpendicular to the vertical direction.

6. The joining device of claim 5, wherein the clamp is configured to move in the horizontal direction toward or away from the second planar surface of the second portion of the stage.

7. The joining device according to claim 1, further comprising at least one ball caster rotatably coupled to the first support surface.

8. The joining device according to claim 7, wherein, The first support surface of the first portion of the platform is parallel to the first planar surface of the first portion of the platform.

9. The joining device according to claim 1, wherein, When the joining device is used, a target object is placed on the platform. Wherein, one side surface of the target object is disposed on the first planar surface of the first portion of the platform, and the other side surface of the target object faces the joint head, and the other side surface of the target object is opposite to the one side surface of the target object.

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