Antenna device
By using a package structure of substrate, die, redistribution layer and wire in the antenna device, and using a vacuum or inert gas-filled sealing layer, the problems of high cost and high dielectric loss in the traditional packaging structure are solved, and low cost is achieved. Efficient antenna design, suitable for high-frequency applications.
Patent Information
- Application Number
- CN202110788089.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-01-14
- Filing Date
- 2019-07-02
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2039-07-02
AI Technical Summary
The traditional packaging structure used for phase array antennas cannot meet the antenna requirements in high frequency applications due to high manufacturing costs, high dielectric losses and large area.
Using a package structure including substrate, die, redistribution layer and wire, through the redistribution layer and wire, the die and antenna unit are electrically connected, and the sealing layer filled with vacuum or inert gas reduces dielectric loss and thermal expansion coefficient, and improves the Corrosion resistance.
Low dielectric loss and corrosion resistance are achieved, reducing the manufacturing cost of antenna devices, and suitable for high-frequency applications.
Smart Images
Figure CN113410609B_ABST
Abstract
Description
[0001] This application is a divisional application of the Chinese invention patent application filed on July 2, 2019, with the invention name “Packaging structure and antenna device using the same” and application number 201910589756.7. Technical Field
[0002] The embodiments of the present application relate to a packaging structure and an antenna device using the same, and more particularly to a packaging structure for communication applications and an antenna device using the same. Background Art
[0003] Antenna devices are often used to implement wireless communications. In high-frequency applications, such as 5th generation wireless systems (5G), satellites, and automotive radars, these antennas require good, adjustable directivity. Therefore, phase array antennas are often used in high-frequency applications.
[0004] However, conventional packaging structures for phased array antennas may not be able to meet antenna requirements in current high-frequency applications due to their high manufacturing cost, high dielectric loss, and large area. Summary of the invention
[0005] According to some embodiments of the present application, an antenna device is provided, which includes a substrate, a die disposed on the substrate, a redistribution layer, and an antenna unit electrically connected to the die through the redistribution layer.
[0006] According to some other embodiments of the present application, an antenna device is provided, which includes a substrate, a tube core disposed on the substrate, a wire disposed under the tube core, and an antenna unit electrically connected to the tube core through the wire. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:
[0008] Figure 1 A partial top view of a packaging structure according to an embodiment of the present application is shown.
[0009] Figure 2 Display along Figure 1 Schematic diagram of the partial cross section cut along line AA in FIG.
[0010] Figure 3 A partial cross-sectional schematic diagram shows a package structure according to another embodiment of the present application.
[0011] Figure 4A partial cross-sectional schematic diagram shows a package structure according to yet another embodiment of the present application.
[0012] Description of component numbers in the figure:
[0013] 100, 101, 102~Packaging structure
[0014] 11~First substrate
[0015] 11-1~Inner surface
[0016] 11-2~Outer surface
[0017] 12~ Second substrate
[0018] 12-1~Inner surface
[0019] 12-2~Outer surface
[0020] 15, 15'~Remaining space
[0021] 20~Redistribution layer
[0022] 21~Wire
[0023] 22~Insulation layer
[0024] 30~Tube core
[0025] 31~I / O pad
[0026] 41, 41'~Metal layer
[0027] 43, 43'~ conductor
[0028] 45~Shielding layer
[0029] 51, 51'~Sealing layer
[0030] 52~Encapsulation compound layer
[0031] 60, 60'~Through hole
[0032] 70, 70'~ spacer
[0033] 80, 80'~Joint element
[0034] AA~Hatch Line DETAILED DESCRIPTION
[0035] Many different embodiments or examples are provided below for implementing different elements of the subject matter provided. Specific examples of each element and its configuration are described below to simplify the embodiments of the present application. Of course, these are merely examples and are not intended to limit the embodiments of the present application. For example, if the description mentions that a first element is formed on a second element, an embodiment in which the first and second elements are in direct contact may be included, and an embodiment in which an additional component is formed between the first and second elements so that the first and second elements are not in direct contact may also be included. In addition, the embodiments of the present application may repeat reference numbers and / or letters in different examples. Such repetition is for simplicity and clarity, rather than for indicating the relationship between the different embodiments and / or forms discussed.
[0036] Furthermore, spatially relative terms, such as "above," "below," "below," "lower," "above," "upper," and other similar terms may be used herein to facilitate describing the relationship of one element or feature to other elements or features illustrated in the drawings. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.
[0037] In the specification, the terms "about", "approximately" and "generally" generally mean within 20%, within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5% of a given value or range. The numbers given here are approximate numbers, that is, in the absence of specific description of "about", "approximately" and "generally", the meanings of "about", "approximately" and "generally" can still be implied.
[0038] Some variations of the embodiments are described below. In the embodiments of the different drawings and descriptions, similar reference numerals are used to indicate similar elements. It is understood that additional operations may be provided before, during, and after the following method, and some of the described operations may be replaced or deleted for other embodiments of the method.
[0039] Figure 1 A partial top view of a package structure 100 according to an embodiment of the present application is shown. Figure 2 Display along Figure 1 It should be noted that for the sake of simplicity, not all components of the package structure 100 are shown in FIG. Figure 1 , Figure 2 middle.
[0040] Reference Figure 1 , Figure 2 The package structure 100 includes a first substrate 11 (not shown in FIG. Figure 1 ) and a second substrate 12 facing the first substrate 11. The package structure 100 also includes a redistribution layer (RDL) 20, which is disposed between the first substrate 11 and the second substrate 12. The package structure 100 also includes a tube core 30, which is disposed on the redistribution layer 20. The package structure 100 further includes a metal layer 41, which is electrically connected to the redistribution layer 20. The package structure 100 includes a sealing layer 51, which is disposed between the first substrate 11 and the second substrate 12 and surrounds the tube core 30.
[0041] like Figure 2 As shown, the first substrate 11 has an inner surface 11-1 and an outer surface 11-2, and the outer surface 11-2 is opposite to the inner surface 11-1. The second substrate 12 faces the first substrate 11, and similarly, the second substrate 12 has an inner surface 12-1 and an outer surface 12-2, and the outer surface 12-2 is opposite to the inner surface 12-1. Here, the first substrate 11 and the second substrate 12 can be excluded from element semiconductor (e.g., silicon or germanium) substrates, compound semiconductor (e.g., tantalum carbide, gallium arsenide, indium arsenide or indium phosphide) substrates, alloy semiconductor (e.g., silicon germanium, silicon germanium carbide, gallium arsenic phosphide or gallium indium phosphide) substrates, etc.
[0042] In the present embodiment, the material of one of the first substrate 11 and the second substrate 12 includes glass, polyimide (PI), liquid-crystal polymer (LCP), polycarbonate (PC), polypropylene (PP), polyethylene terephthalate (PET), or other plastic or polymer materials. However, the present application is not limited thereto.
[0043] The redistribution layer 20 and the tube core 30 are both disposed between the first substrate 11 and the second substrate 12. Figure 1 , Figure 2 As shown, the redistribution layer 20 is disposed between the die 30 and the inner surface 12-1 of the second substrate 12. In other words, the die 30 is disposed between the redistribution layer 20 and the first substrate 11. The die 30 may be a bare die, and the redistribution layer 20 may include a plurality of conductive lines 21 and a plurality of insulating layers 22, which make the I / O pads 31 of the integrated circuit of the die 30 available at other locations. It should be noted that for the sake of simplicity, Figure 1 , Figure 2 Some components of the redistribution layer 20 are omitted. That is, the structure of the redistribution layer 20 is not limited to Figure 1, Figure 2 The structure shown.
[0044] In this embodiment, the metal layer 41 may be an antenna unit, and thus the package structure 100 may be an antenna device. The metal layer (or antenna unit) 41 may be electrically connected to the die 30 through the redistribution layer 20. The die 30 may receive and / or transmit electromagnetic waves through the metal layer (or antenna unit) 41. Figure 2 As shown, the metal layer (or antenna unit) 41 is disposed on the outer surface 12-2 of the second substrate 12, but the present application is not limited thereto. In some embodiments, the metal layer (or antenna unit) 41 may be disposed on the outer surface 11-2 of the first substrate 11, the inner surface 11-1 of the first substrate 11, or the inner surface 12-1 of the second substrate 12.
[0045] In this embodiment, the sealing layer 51 is disposed between the first substrate 11 and the second substrate 12, and the sealing layer 51 surrounds the die 30. The sealing layer 51 is used to keep the package structure 100 sealed. In some embodiments, the sealing layer 51 may be a conductive sealing layer.
[0046] In the present embodiment, the remaining space 15 between the first substrate 11 and the second substrate 12 inside the sealing layer 51 is a vacuum. In some embodiments, the remaining space 15 between the first substrate 11 and the second substrate 12 inside the sealing layer 51 may be filled with air, an inert gas, or a low loss-tangent material (e.g., a fluoropolymer). Compared to a conventional packaging structure using a molding compound, since the remaining space 15 between the first substrate 11 and the second substrate 12 inside the sealing layer 51 is a vacuum or filled with air or an inert gas, the influence of the coefficients of thermal expansion (CTE) between different components can be reduced. Therefore, the reliability of the packaging structure (or antenna device) 100 can be effectively improved.
[0047] Reference Figure 1 , Figure 2 In this embodiment, the package structure 100 further includes a wire 43, which is disposed between the first substrate 11 and the second substrate 12. Specifically, the wire 43 may be a transmission line, which is electrically connected to the die 30 through the redistribution layer 20, and the wire 43 is electrically connected to the metal layer 41. Figure 2 In the embodiment shown, at least one through hole 60 passes through the second substrate 12, and the wire (transmission line) 43 passes through the through hole 60 to connect to the metal layer 41. However, the present application is not limited thereto. In other embodiments, if the metal layer 41 is disposed on the outer surface 11-2 (such as the rear surface) of the first substrate 11, Figure 4As shown), the through hole 60 can pass through the first substrate 11, and the wire (transmission line) 43 passes through the through hole 60 to connect to the metal layer 41.
[0048] In other words, the second substrate 12 (or the first substrate 11 ) may include at least one through hole 60 , and the conductive line 43 may pass through the through hole 60 and electrically connect the metal layer (or antenna unit) 41 to the redistribution layer 20 and the die 30 .
[0049] Since the conductive line 43 is electrically connected to the metal layer (or antenna unit) 41 and the die 30 through the second substrate 12 (or the first substrate 11), the remaining space 15 (which is a vacuum or filled with air, an inert gas or a low dielectric loss material) and the redistribution layer 20, it can have lower dielectric loss than traditional structures (for example, antennas made by printed circuit boards (PCBs) and phased array antennas).
[0050] In addition, the die 30 is sealed inside the sealing layer 51 and between the first substrate 11 and the second substrate 12 . Therefore, the package structure 100 has better corrosion resistance than conventional packages.
[0051] Furthermore, the manufacturing cost of the antenna device using the packaging structure 100 according to the embodiment of the present application may be lower than the manufacturing cost of a traditional packaged antenna (Antenna in Package, AiP).
[0052] It should be noted that, according to the requirements, the number and position of the sealing layer 51 and the number and position of the spacers 70 may be different from Figure 1 , Figure 2 shown.
[0053] In some embodiments, the package structure 100 may further include at least one shielding layer 45, and the shielding layer 45 is disposed on at least one of the inner surface 11-1 of the first substrate 11 and the inner surface 12-1 of the second substrate 12. Figure 2 As shown, a plurality of shielding layers 45 are disposed on both the inner surface 11-1 of the first substrate 11 and the inner surface 12-1 of the second substrate 12. The shielding layer 45 may be another metal layer (eg, a ground layer) for electromagnetic shielding, which may block radio frequency electromagnetic radiation.
[0054] In some embodiments, the package structure 100 may further include at least one bonding element 80 disposed between the first substrate 11 and the second substrate 12. For example, the package structure 100 includes a plurality of solder balls disposed on the redistribution layer 20. The solder balls are used as the bonding element 80 to electrically connect the conductive component (e.g., shielding layer 45) on the inner surface 11-1 of the first substrate 11 to the conductive component (e.g., shielding layer 45) on the inner surface 12-1 of the second substrate 12.
[0055] It should be noted that the engagement element 80 is not limited to Figure 1 , Figure 2 The solder balls are in the form shown, and other suitable forms may also be applied to the package structure 100. Similarly, the number and position of the bonding elements 80 may be different from those of the bonding elements 80 as required. Figure 1 , Figure 2 shown.
[0056] In some embodiments, the package structure 100 may further include a potting compound layer 52, which is disposed outside the sealing layer 51. In detail, the potting compound layer 52 may be a second sealing layer, and the sealing layer 51 is disposed between the potting compound layer 52 and the die 30. The potting compound layer 52 may provide better protection for the die 30 located between the first substrate 11 and the second substrate 12.
[0057] Figure 3 A partial cross-sectional schematic diagram of a package structure 101 according to another embodiment of the present application is shown. In this embodiment, the package structure 101 can be used as an antenna device. The package structure (or antenna device) 101 includes a first substrate 11 and a second substrate 12 facing the first substrate 11. The package structure (or antenna device) 101 also includes a tube core 30, and the tube core 30 is arranged between the first substrate 11 and the second substrate 12. The package structure (or antenna device) 101 also includes a redistribution layer (RDL) 20, and the redistribution layer 20 is arranged between the tube core 30 and the second substrate 12. The package structure (or antenna device) 101 further includes a metal layer (or antenna unit) 41, and the metal layer 41 is electrically connected to the tube core 30 through the redistribution layer 20.
[0058] like Figure 3 As shown, the first substrate 11 has an inner surface 11-1 and an outer surface 11-2, the outer surface 11-2 is opposite to the inner surface 11-1, and the second substrate 12 has an inner surface 12-1 and an outer surface 12-2, the outer surface 12-2 is opposite to the inner surface 12-1. In this embodiment, the metal layer (or antenna unit) 41 is disposed on the outer surface 12-2 of the second substrate 12.
[0059] In this embodiment, the first substrate 11 and the second substrate 12 may be glass substrates. However, the present application is not limited thereto. In other embodiments, the first substrate 11 and the second substrate 12 may be polyimide (PI) substrates, liquid crystal polymer (LCP) substrates, polycarbonate (PC) substrates, polypropylene (PP) substrates, polyethylene terephthalate (PET) substrates, or other plastic or polymer material substrates.
[0060] like Figure 3 As shown, the redistribution layer 20 and the die 30 are both disposed between the first substrate 11 and the second substrate 12, and some portions of the redistribution layer 20 are disposed between the die 30 and the inner surface 12-1 of the second substrate 12. In other words, the die 30 is disposed between the redistribution layer 20 and the first substrate 11. The die 30 may be a bare die, and the redistribution layer 20 may include a plurality of conductive lines 21 and a plurality of insulating layers 22, which make the I / O pads 31 of the integrated circuit of the die 30 available at other locations. Similarly, for simplicity, in Figure 3 Some components of the redistribution layer 20 are omitted. That is, the structure of the redistribution layer 20 is not limited to Figure 3 The structure shown.
[0061] The metal layer (or antenna unit) 41 can be electrically connected to the die 30 through the redistribution layer 20. The die 30 can receive and / or transmit electromagnetic waves through the metal layer (or antenna unit) 41. Figure 3 As shown, the metal layer (or antenna unit) 41 is disposed on the outer surface 12 - 2 of the second substrate 12 , but the present application is not limited thereto.
[0062] In addition, the package structure (or antenna device) 101 may include a sealing layer 51', which is disposed between the first substrate 11 and the second substrate 12, and surrounds the die 30. The package structure 101 is different from the package structure 100 in that, in the package structure (or antenna device) 101, a portion of the sealing layer 51' ( Figure 3 The sealing layer 51' on the left side of the middle Figure 3 As shown, the sealing layer 51 is disposed on the redistribution layer 20, and in the packaging structure (or antenna device) 100, the sealing layer 51 is as shown in FIG. Figure 2 It is shown disposed outside the redistribution layer 20 .
[0063] In the present embodiment, the remaining space 15 between the first substrate 11 and the second substrate 12 inside the sealing layer 51' is a vacuum. In some embodiments, the remaining space 15 between the first substrate 11 and the second substrate 12 inside the sealing layer 51' may be filled with air, an inert gas, or a low dielectric loss material (e.g., a fluoropolymer). Compared to a conventional packaging structure using a molding compound, since the remaining space 15 between the first substrate 11 and the second substrate 12 inside the sealing layer 51' is a vacuum or filled with air or an inert gas, the influence caused by the coefficient of thermal expansion (CTE) between different components can be reduced. Therefore, the reliability of the packaging structure (or antenna device) 101 can be effectively improved.
[0064] Reference Figure 3 In this embodiment, the package structure 101 further includes a wire 43, which is disposed between the first substrate 11 and the second substrate 12. Specifically, the wire 43 may be a transmission line, which is electrically connected to the die 30 through the redistribution layer 20, and the wire 43 is electrically connected to the metal layer 41. Figure 3 In the illustrated embodiment, at least one through hole 60 passes through the second substrate 12, and the conductive wire (transmission line) 43 passes through the through hole 60 and is connected to the metal layer 41. However, the present application is not limited thereto.
[0065] In other words, the second substrate 12 may include at least one through hole 60 , and the conductive line 43 may pass through the through hole 60 and electrically connect the metal layer (or antenna unit) 41 to the redistribution layer 20 and the die 30 .
[0066] Since the conductive wire 43 is electrically connected to the metal layer (or antenna unit) 41 and the die 30 through the second substrate 12, the remaining space 15 (which is a vacuum or filled with air, an inert gas or a low dielectric loss material) and the redistribution layer 20, it can have lower dielectric loss compared to traditional structures (for example, antennas made by printed circuit boards (PCBs) and phased array antennas).
[0067] In addition, the die 30 is sealed inside the sealing layer 51 ′ and between the first substrate 11 and the second substrate 12 . Therefore, the package structure 101 has better corrosion resistance than conventional packages.
[0068] Furthermore, the manufacturing cost of the antenna device using the package structure 101 according to the embodiment of the present application may be lower than the manufacturing cost of a traditional packaged antenna (AiP).
[0069] In this embodiment, if Figure 3As shown, the package structure 101 may further include a plurality of spacers 70', and the spacers 70' are disposed between the first substrate 11 and the second substrate 12. The spacers 70' may be used to maintain a gap between the first substrate 11 and the second substrate 12. For example, the spacers 70' may be cell gap spacers, such as ball spacers, optical spacers, glass fibers, or other suitable spacers.
[0070] In this embodiment, the package structure 101 may further include a plurality of shielding layers 45, such as Figure 3 As shown, shielding layers 45 are disposed on both the inner surface 11-1 of the first substrate 11 and the inner surface 12-1 of the second substrate 12. Each shielding layer 45 may be another metal layer (eg, a ground layer) for electromagnetic shielding, which blocks radio frequency electromagnetic radiation.
[0071] In the present embodiment, the package structure 101 may further include at least one bonding element 80', and the bonding element 80' is disposed between the first substrate 11 and the second substrate 12. For example, the package structure 101 includes a plurality of solder balls disposed on the redistribution layer 20. The solder balls are used as the bonding element 80' to electrically connect the conductive component (e.g., shielding layer 45) on the inner surface 11-1 of the first substrate 11 to the conductive component (e.g., shielding layer 45) on the inner surface 12-1 of the second substrate 12.
[0072] In addition, if Figure 3 The number and position of the spacers 70' and the number and position of the bonding elements 80' in the package structure 101 are different from those shown in FIG. Figure 2 The number and position of the spacers 70 and the number and position of the bonding elements 80 in the package structure 100 are shown.
[0073] Similarly, the package structure 101 may further include a packaging compound layer 52, which is disposed outside the sealing layer 51'. In detail, the packaging compound layer 52 may be a second sealing layer, and the sealing layer 51' is disposed between the packaging compound layer 52 and the tube core 30. The packaging compound layer 52 can provide better protection for the tube core 30 located between the first substrate 11 and the second substrate 12.
[0074] Figure 4 A partial cross-sectional schematic diagram of a package structure 102 according to another embodiment of the present application is shown. Figure 4The package structure 102 includes a first substrate 11 and a second substrate 12 opposite to each other. The package structure 102 also includes a redistribution layer (RDL) 20, which is disposed between the first substrate 11 and the second substrate 12. The package structure 102 also includes a tube core 30, which is disposed on the redistribution layer 20. The package structure 102 further includes a metal layer 41', which is electrically connected to the redistribution layer 20. The package structure 102 includes a sealing layer 51, which is disposed between the first substrate 11 and the second substrate 12 and surrounds the tube core 30.
[0075] like Figure 4 As shown, the first substrate 11 has an inner surface 11-1 and an outer surface 11-2, and the outer surface 11-2 is opposite to the inner surface 11-1. The second substrate 12 faces the first substrate 11, and similarly, the second substrate 12 has an inner surface 12-1 and an outer surface 12-2, and the outer surface 12-2 is opposite to the inner surface 12-1.
[0076] In this embodiment, the first substrate 11 and the second substrate 12 may be glass substrates. However, the present application is not limited thereto. In other embodiments, the first substrate 11 and the second substrate 12 may be polyimide (PI) substrates, liquid crystal polymer (LCP) substrates, polycarbonate (PC) substrates, polypropylene (PP) substrates, polyethylene terephthalate (PET) substrates, or other plastic or polymer material substrates.
[0077] The redistribution layer 20 and the tube core 30 are both disposed between the first substrate 11 and the second substrate 12. Figure 4 As shown, the redistribution layer 20 is disposed between the die 30 and the inner surface 12-1 of the second substrate 12. In other words, the die 30 is disposed between the redistribution layer 20 and the first substrate 11. The die 30 may be a bare die, and the redistribution layer 20 may include a plurality of conductive lines 21 and a plurality of insulating layers 22, which make the I / O pads 31 of the integrated circuit of the die 30 available at other locations. It should be noted that for the sake of simplicity, Figure 4 Some components of the redistribution layer 20 are omitted. That is, the structure of the redistribution layer 20 is not limited to Figure 4 The structure shown.
[0078] In this embodiment, the metal layer 41' may be an antenna unit, so the package structure 102 may be an antenna device. The metal layer (or antenna unit) 41' may be electrically connected to the tube core 30 through the redistribution layer 20. The tube core 30 may receive and / or transmit electromagnetic waves through the metal layer (or antenna unit) 41'. The difference between the package structure 102 and the package structure 100 is that in the package structure 102, the metal layer 41' is as follows: Figure 4As shown, the metal layer 41 is disposed on the outer surface 11-2 of the first substrate 11, and in the packaging structure 100, the metal layer 41 is Figure 2 As shown, it is arranged on the outer surface 12 - 2 of the second substrate 12 .
[0079] In this embodiment, the sealing layer 51 is disposed between the first substrate 11 and the second substrate 12, and the sealing layer 51 surrounds the tube core 30. The sealing layer 51 is used to keep the package structure 102 sealed. In some embodiments, the sealing layer 51 can be a conductive sealing layer.
[0080] In this embodiment, the remaining space 15 ′ between the first substrate 11 and the second substrate 12 inside the sealing layer 51 is filled with a low dielectric loss material (eg, fluoropolymer).
[0081] Reference Figure 4 In this embodiment, the package structure 102 further includes a wire 43', and the wire 43' is disposed between the first substrate 11 and the second substrate 12. In detail, the wire 43' can be a transmission line, which is electrically connected to the tube core 30 through the redistribution layer 20, and the wire 43' is electrically connected to the metal layer 41'. Figure 4 In the illustrated embodiment, at least one through hole 60 ′ passes through the first substrate 11 , and the conductive line (transmission line) 43 ′ passes through the through hole 60 ′ and is connected to the metal layer 41 ′.
[0082] In other words, the first substrate 11 may include at least one through hole 60 ′, and the conductive line 43 ′ may pass through the through hole 60 ′ and electrically connect the metal layer (or antenna unit) 41 ′ to the redistribution layer 20 and the die 30 .
[0083] Since the conductive line 43' is electrically connected to the metal layer (or antenna unit) 41' and the die 30 through the first substrate 11, the remaining space 15' (which is filled with low dielectric loss material) and the redistribution layer 20, it can have lower dielectric loss compared to traditional structures (for example, antennas made by printed circuit boards (PCBs) and phased array antennas).
[0084] In addition, the die 30 is sealed inside the sealing layer 51 and between the first substrate 11 and the second substrate 12 . Therefore, the package structure 102 has better corrosion resistance than conventional packages.
[0085] Furthermore, the manufacturing cost of the antenna device using the package structure 102 according to the embodiment of the present application may be lower than the manufacturing cost of a conventional packaged antenna (AiP).
[0086] In some embodiments, the package structure 102 may further include a plurality of spacers 70, and the spacers 70 are disposed between the first substrate 11 and the second substrate 12. The spacers 70 may be used to maintain a gap between the first substrate 11 and the second substrate 12. For example, the spacers 70 may be cell gap spacers, such as ball spacers, optical spacers, glass fibers, or other suitable spacers.
[0087] In some embodiments, the package structure 102 may further include a plurality of shielding layers 45, such as Figure 4 As shown, shielding layers 45 are disposed on both the inner surface 11-1 of the first substrate 11 and the inner surface 12-1 of the second substrate 12. Each shielding layer 45 may be another metal layer (eg, a ground layer) for electromagnetic shielding, which blocks radio frequency electromagnetic radiation.
[0088] In some embodiments, the package structure 102 may further include at least one bonding element 80 disposed between the first substrate 11 and the second substrate 12. For example, the package structure 102 includes a plurality of solder balls disposed on the redistribution layer 20. The solder balls are used as bonding elements 80 to electrically connect the conductive components (e.g., shielding layer 45) on the inner surface 11-1 of the first substrate 11 to the conductive components (e.g., shielding layer 45) on the inner surface 12-1 of the second substrate 12.
[0089] In some embodiments, the package structure 102 may further include a package compound layer 52, which is disposed outside the sealing layer 51. In detail, the package compound layer 52 may be a second sealing layer, and the sealing layer 51 is disposed between the package compound layer 52 and the tube core 30. The package compound layer 52 can provide better protection for the tube core 30 located between the first substrate 11 and the second substrate 12.
[0090] It should be noted that although the antenna device is used as an example in the above embodiments, the present application is not limited thereto. In some embodiments, the package structure 100 (or 101, 102) can also be used in devices for other communication applications.
[0091] In summary, the packaging structure (or antenna device) of the embodiment of the present application includes a first substrate and a second substrate, and the remaining space inside the sealing layer and between the first substrate and the second substrate is a vacuum or filled with air or an inert gas, thereby reducing the influence of the coefficient of thermal expansion (CTE) between different components. Furthermore, in the packaging structure (or antenna device) of the embodiment of the present application, the wire (transmission line) passes through one of the first substrate and the second substrate, the remaining space (which is a vacuum or filled with air, an inert gas or a low dielectric loss material) and the redistribution layer to electrically connect the metal layer (or antenna unit) and the tube core, thereby effectively reducing the dielectric loss. Furthermore, in the packaging structure (or antenna device) of the embodiment of the present application, the tube core is sealed inside the sealing layer and between the first substrate and the second substrate (and in some embodiments, the sealing layer may be located inside the packaging compound), thereby effectively improving the corrosion resistance of the packaging structure (or antenna device).
[0092] The above summarizes the components of several embodiments so that those skilled in the art can better understand the viewpoints of the embodiments of the present application. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of the present application to achieve the same purpose and / or advantages as the embodiments introduced herein. Those skilled in the art should also understand that such equivalent structures do not deviate from the spirit and scope of the present application, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be determined by the definition of the attached claims. In addition, although the present application has been disclosed as above with several preferred embodiments, it is not intended to limit the present application.
[0093] References throughout this specification to features, advantages, or similar language do not imply that all features and advantages that can be achieved using the present application should be or are in any single embodiment of the present application. Conversely, language referring to features and advantages is understood to mean that a particular feature, advantage, or characteristic described in conjunction with an embodiment is included in at least one embodiment of the present application. Thus, discussions of features and advantages and similar language throughout the specification may, but do not necessarily, represent the same embodiment.
[0094] Furthermore, in one or more embodiments, the described features, advantages and characteristics of the present application may be combined in any suitable manner. Based on the description herein, those skilled in the relevant art will appreciate that the present application may be implemented without one or more specific features or advantages of a particular embodiment. In other cases, additional features and advantages may be identified in certain embodiments, which may not be present in all embodiments of the present application.
Claims
1. An antenna device, comprising: a substrate; a redistribution layer having a first surface; a tube core disposed on the first surface of the redistribution layer; an antenna unit electrically connected to the die through the redistribution layer; a bonding element disposed on the first surface of the redistribution layer; another substrate disposed on the substrate; as well as a shielding layer partially overlapping the redistribution layer, The bonding element, the shielding layer, the tube core and the redistribution layer are arranged between the substrate and the other substrate.
2. The antenna device as claimed in claim 1, further comprising: A sealing layer is disposed on the substrate and surrounds the tube core.
3. An antenna device, comprising: a substrate; a tube die, disposed on the substrate; A conductive line is disposed under the tube core; An antenna unit is electrically connected to the tube core through the wire; a bonding element disposed above the wire; another substrate disposed on the substrate; as well as The shielding layer partially overlaps the conductor. The joining element, the shielding layer, the tube core and the wire are arranged between the substrate and the other substrate.
4. The antenna device as claimed in claim 3, further comprising: A sealing layer is disposed on the substrate and surrounds the tube core.
5. The antenna device as claimed in claim 3, further comprising: an insulating layer; At least a portion of the insulating layer is disposed between the conductive wires.