An optical module

Abstract

The optical module provided in the application comprises: an optical transmitting component for generating a first wavelength signal light for realizing 50G GPON technology transmission and a second wavelength signal light for realizing XGSPON technology transmission; a first optical receiving component for receiving a third wavelength signal light from outside the optical module for realizing 50G GPON technology transmission; and a second optical receiving component for receiving a fourth wavelength signal light from outside the optical module for realizing XGSPON technology transmission. The optical transmitting component comprises a TEC, a substrate arranged on the TEC, a first laser and a second laser arranged on the substrate, and a thermistor arranged on the substrate and located between the first laser and the second laser. The temperature of the first laser and the second laser is adjusted by driving and controlling the TEC according to the collection signal of the thermistor. The compatibility and coexistence of the current 10G PON OLT and the future 50G GPON OLT are realized, and the physical layer smooth transition is provided for the upgrading and replacement of 10G PON to the future 50G GPON.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, the optical module is a tool for converting optical signals and electrical signals, and is one of the key devices in optical communication equipment. With the domestic three major operators starting to deploy 10G PON systems on a large scale, the research and development of the next generation of access network PON technology has entered an accelerated stage. Single-wave 50G PON technology significantly improves the transmission rate and is the main direction of the evolution of domestic access network technology.

[0003] A considerable part of the investment in traditional PON systems is concentrated on optical fiber infrastructure. The deployment of 50G TDM-PON will require a large amount of reuse of existing PON system ODNs, so the power budget requirement of 50G TDM-PON optical devices must ensure the ability to smoothly migrate with existing PON ODNs to fully utilize the investment in existing ODNs. From the perspective of the splitting ratio of the constructed ODN, B+ class ODNs are mainly for FTTB, and C+ class ODNs are mainly for FTTH. FTTB mode is mainly deployed in the early stage of GPON and XG(S)-PON applications, while the main deployment mode of GPON and XG(S)-PON is FTTH. In order to facilitate the deployment planning of 50G TDM-PON on C+ power level ODN, the optical power budget design for 50G TDM-PON needs to fully consider the compatibility with C+ ODN to meet the requirements of FTTH deployment and compatibility with traditional ODNs. At the same time, considering the perspective of "next-generation PON integration" for Chinese operators, 50G TDM-PON should support the migration path from 10G-EPON to 50G TDM-PON. SUMMARY

[0004] The embodiment of the present application provides an optical module, which facilitates the smooth transition of the upgrade from 10G GPON to 50G GPON.

[0005] The optical module provided by the present application comprises:

[0006] The optical transmitting assembly is configured to generate first wavelength signal light for realizing 50G GPON technology transmission and second wavelength signal light for realizing XGSPON technology transmission.

[0007] The first optical receiving assembly is configured to receive third wavelength signal light from outside the optical module for realizing 50G GPON technology transmission.

[0008] A second light receiving assembly is configured to receive fourth wavelength signal light transmitted by an XGSPON technology outside the optical module.

[0009] An optical assembly is configured to transmit the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light.

[0010] The optical transmitting assembly comprises a TEC, a substrate arranged on the TEC, a first laser and a second laser arranged on the substrate, and a thermistor arranged on the substrate and between the first laser and the second laser. The first laser is configured to generate the first wavelength signal light, and the second laser is configured to generate the second wavelength signal light. The TEC is driven and controlled according to the signal collected by the thermistor to adjust the temperature of the first laser and the second laser.

[0011] The optical module provided by the present application comprises an optical transmitting assembly, a first light receiving assembly and a second light receiving assembly. The optical transmitting assembly comprises a first laser and a second laser. The first laser and the second laser are configured to generate first wavelength signal light for implementing 50G GPON technology transmission and second wavelength signal light for implementing XGSPON technology transmission. The first light receiving assembly is configured to receive third wavelength signal light for implementing 50G GPON technology transmission from outside the optical module. The second light receiving assembly is configured to receive fourth wavelength signal light for implementing XGSPON technology transmission from outside the optical module. Thus, the optical module provided by the present application can realize the compatible coexistence of current 10G PON OLT and future 50G GPON OLT, and thus the use of the optical module provided by the present application can provide a physical layer smooth transition for the upgrade of 10G PON to future 50G GPON. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0013] Figure 1 It is a schematic diagram of optical communication terminal connection relationship;

[0014] Figure 2 It is a schematic diagram of optical network unit structure;

[0015] Figure 3 It is a schematic diagram of an optical module structure provided by the embodiments of the present application;

[0016] Figure 4 This application provides an exploded view of the optical module structure for an embodiment.

[0017] Figure 5 for Figure 4 A schematic diagram of the structure of the optical transceiver submodule;

[0018] Figure 6 This is a schematic diagram of the structure of a light emitting component provided in an embodiment of this application;

[0019] Figure 7 An optical path diagram of an optical transceiver submodule is provided in an embodiment of this application;

[0020] Figure 8 This is a schematic diagram of the internal structure of a light emitting component provided in an embodiment of this application;

[0021] Figure 9 This application provides a control circuit diagram for an optical emitting component, a first optical receiving component, and a second optical receiving component, as part of an embodiment of the present application. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a” and “the” as used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0024] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0025] One of the core aspects of fiber optic communication is the conversion between optical and electrical signals. Fiber optic communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers / waveguides. The passive transmission characteristics of light in optical fibers / waveguides enable low-cost, low-loss information transmission. In contrast, information processing equipment such as computers uses electrical signals. Therefore, in order to establish an information connection between information transmission equipment such as optical fibers / waveguides and information processing equipment such as computers, it is necessary to achieve the conversion between electrical and optical signals.

[0026] In the field of optical fiber communication technology, optical modules realize the mutual conversion between optical and electrical signals, which is the core function of optical modules. Optical modules achieve electrical connection with external host computers through gold fingers on their internal circuit boards. The main electrical connections include power supply, I2C signals, data signals, and grounding. Optical modules achieve optical connection with external optical fibers through optical interfaces. There are various connection methods for external optical fibers, resulting in various types of fiber optic connectors. Using gold fingers at the electrical interface for electrical connection has become the mainstream connection method in the optical module industry. Based on this, the pin definitions on the gold fingers have formed various industry protocols / standards. The optical connection method using optical interfaces and fiber optic connectors has also become the mainstream connection method in the optical module industry. Based on this, various industry standards for fiber optic connectors have been formed, such as LC interface, SC interface, and MPO interface. The optical interface of the optical module also has an adaptive structure design for fiber optic connectors, resulting in various types of fiber optic adapters at the optical interface. Figure 1 This is a schematic diagram illustrating the connection relationships between optical communication terminals. For example... Figure 1 As shown, the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

[0027] One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103. The connection between the optical fiber 101 and the network cable 103 is completed by the optical network terminal 100 with the optical module 200.

[0028] The optical interface of the optical module 200 is connected to the optical fiber 101, establishing a bidirectional optical signal connection with the optical fiber 101; the electrical interface of the optical module 200 is connected to the optical network terminal 100, establishing a bidirectional electrical signal connection with the optical network terminal 100; the optical module internally realizes bidirectional mutual conversion between optical signals and electrical signals, thereby realizing the establishment of an information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module and then input into the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and then input into the optical fiber 101.

[0029] The optical network terminal has an optical module interface 102 for connecting to the optical module 200 and establishing a bidirectional electrical signal connection with it. It also has a network cable interface 104 for connecting to the network cable 103 and establishing a bidirectional electrical signal connection (generally an Ethernet protocol signal, a different protocol / type from the signal used by the optical module). The optical module 200 and network cable 103 are connected via the optical network terminal 100. Specifically, the optical network terminal transmits signals from the optical module to the network cable and vice versa. The optical network terminal acts as a host computer for the optical module, monitoring its operation. The optical network terminal, acting as the host computer for the optical module, provides data signals to and receives data signals from it. Thus, the remote server establishes a bidirectional signal transmission channel with the local information processing equipment via optical fiber, optical module, optical network terminal, and network cable.

[0030] Common local information processing devices include routers, home switches, and computers; common optical network terminals include optical network units (ONUs), optical line terminals (OLTs), data center servers, and data center switches.

[0031] Figure 2 This is a schematic diagram of an optical network terminal structure. (Example) Figure 2 As shown, the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for connecting to the electrical interface (such as gold fingers) of the optical module; a heat sink 107 is provided on the cage 106, and the heat sink 107 has fins and other protrusions to increase the heat dissipation area.

[0032] The optical module 200 is inserted into the optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106, and the optical interface of the optical module is connected to the optical fiber 101.

[0033] The cage 106 is located on the circuit board and encloses the electrical connectors on the circuit board inside the cage, thus providing electrical connectors inside the cage; the optical module is inserted into the cage and fixed by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.

[0034] Currently, fifth-generation mobile communication technology (5G) meets the growing demand for high-speed wireless transmission. 5G communication uses a much larger spectrum than 4G communication, which significantly increases communication speed, but also results in a relatively greater increase in signal attenuation.

[0035] The new service characteristics and higher performance requirements of 5G pose new challenges to the bearer network architecture and technical solutions at each layer. Optical modules, as a fundamental component of the 5G network physical layer, also face technological innovation and upgrades. This is mainly reflected in the fact that optical modules used in 5G transmission need to possess two fundamental technical characteristics: high-speed transmission and low return loss. To meet the requirements of optical modules in 5G communication networks, this application provides an optical module.

[0036] Figure 3 This is a schematic diagram of an optical module structure provided in an embodiment of this application. Figure 4 This application provides an exploded view of the optical module's structure as an embodiment. Figure 3 , Figure 4 As shown, the optical module 200 provided in this application embodiment includes an upper housing 201, a lower housing 202, a circuit board 203, an optical fiber adapter 206, and an optical transceiver sub-module 300, etc.

[0037] The upper housing 201 covers the lower housing 202 to form a wrapping cavity with two openings. The outer contour of the wrapping cavity is generally square. Specifically, the lower housing includes a main board and two side plates located on both sides of the main board and perpendicular to the main board. The upper housing includes a cover plate, which covers the two side plates of the upper housing to form the wrapping cavity. The upper housing may also include two side walls located on both sides of the cover plate and perpendicular to the cover plate. The two side walls are combined with the two side plates to realize that the upper housing covers the lower housing.

[0038] The two openings can be at opposite ends in the same direction (204, 205), or they can be at two different locations in different directions. One opening is an electrical port 204, through which the gold fingers of the circuit board extend and are inserted into a host computer such as an optical network terminal. The other opening is an optical port 205, through which the fiber optic adapter 206 passes for external fiber optic access. The circuit board 203, the optical transceiver sub-module 300, and other optoelectronic devices are located in the enclosed cavity formed by the upper and lower housings.

[0039] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of components such as the circuit board 203 and the optical transceiver sub-module 300 into the housing. The upper housing 201 and the lower housing 202 form the outermost protective enclosure of the optical module. The upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial for electromagnetic shielding and heat dissipation. The housing of the optical module is generally not made into a single component, as this would prevent the installation of positioning components, heat dissipation and electromagnetic shielding components when assembling circuit boards and other components, and would also be detrimental to production automation.

[0040] Typically, the optical module 200 also includes an unlocking component located on the outer wall of the enclosure cavity / lower housing 202, used to establish a fixed connection between the optical module and the host computer, or to release the fixed connection between the optical module and the host computer.

[0041] The unlocking component has a locking component that matches the host computer cage; pulling the end of the unlocking component allows it to move relative to the surface of the outer wall; the optical module is inserted into the host computer cage, and the locking component of the unlocking component fixes the optical module in the host computer cage; by pulling the unlocking component, the locking component moves accordingly, thereby changing the connection between the locking component and the host computer, so as to release the locking relationship between the optical module and the host computer, and thus the optical module can be pulled out of the host computer cage.

[0042] Circuit board 203 is equipped with circuit traces, electronic components (such as capacitors, resistors, transistors, MOSFETs) and chips (such as MCUs, clock data recovery CDRs, power management chips, and data processing chips DSPs).

[0043] The circuit board 203 connects the electrical components in the optical module together according to the circuit design through circuit traces to realize electrical functions such as power supply, electrical signal transmission and grounding.

[0044] Circuit board 203 is generally a rigid circuit board. Due to its relatively rigid material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the chip; when the optical transceiver device is located on the circuit board, the rigid circuit board can also provide stable support; the rigid circuit board can also be inserted into the electrical connector in the host computer cage. Specifically, metal pins / gold fingers are formed on one end surface of the rigid circuit board for connection with the electrical connector; these are things that flexible circuit boards cannot easily achieve.

[0045] Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards, such as connecting rigid circuit boards to optical transceivers.

[0046] like Figure 4 As shown, in the optical module provided in this embodiment, the optical transceiver sub-module 300 is electrically connected to the circuit board 203. The circuit board 203 is used to supply power to the optical transceiver sub-module 300, transmit electrical signals, and receive electrical signals output by the optical transceiver sub-module 300.

[0047] like Figure 4As shown, in the optical module provided in this embodiment, one end of the optical transceiver sub-module 300 is connected to the fiber optic adapter 206. The optical transceiver sub-module 300 generates signal light and receives signal light from outside the optical module. When the optical module is in use, the signal light generated by the optical transceiver sub-module 300 is transmitted to outside the optical module through the fiber optic adapter 206, while the signal light received from outside the optical module is transmitted to the optical transceiver sub-module 300 through the fiber optic adapter 206.

[0048] In the optical transceiver sub-module provided in this application embodiment, the optical transceiver sub-module 300 realizes wavelength division coexistence of 50G GPON and XGSPON. That is, the optical transceiver sub-module 300 can generate a first wavelength signal light for 50G GPON technology transmission and a second wavelength signal light for XGSPON technology transmission. The optical transceiver sub-module 300 can also receive a third wavelength signal light for 50G GPON technology transmission and a fourth wavelength signal light for XGSPON technology transmission from outside the optical module. For example, downlink light with a wavelength of 1340-1344nm and uplink light with a wavelength of 1290-1310nm for 50G GPON technology transmission, and downlink light with a wavelength of 1575-1580nm and uplink light with a wavelength of 1260-1280nm for XGSPON technology transmission. Of course, in this embodiment, the wavelengths of the downlink and uplink light used for 50G GPON and XGSPON transmissions are not limited to these and can be adjusted according to technical requirements. The optical module provided in this embodiment enables compatibility and coexistence between current 10G PON OLTs and future 50G GPON OLTs, thus providing a smooth physical layer transition for upgrading from 10G PON to future 50G GPON.

[0049] Figure 5 for Figure 4 A schematic diagram of the structure of the optical transceiver submodule. Figure 5 This illustrates the structure of an optical transceiver submodule provided in an embodiment of this application. For example... Figure 5As shown, in this embodiment, the optical transceiver submodule 300 includes an optical transmitting component 310, a first optical receiving component 320, a second optical receiving component 330, and optical components. The optical transmitting component 310 generates a first wavelength signal light for 50G GPON technology transmission and a second wavelength signal light for XGSPON technology transmission. The first optical receiving component 320 receives a third wavelength signal light from outside the optical module for 50G GPON technology transmission. The second optical receiving component 330 receives a fourth wavelength signal light from outside the optical module for XGSPON technology transmission. The optical components transmit the first, second, third, and fourth wavelength signal lights and adjust their transmission directions. The optical components include collimating lenses, filters, or focusing lenses, etc., for adjusting the transmission paths of the first, second, third, and fourth wavelength signal lights.

[0050] In some embodiments of this application, such as Figure 5 As shown, the optical transceiver submodule 300 also includes a rectangular tube 340. An optical transmitting component 310, a first optical receiving component 320, and a second optical receiving component 330 are connected to the rectangular tube 340. An inner cavity is provided on the rectangular tube 340, and one end of the rectangular tube 340 is connected to a fiber optic adapter 206, which communicates with the inner cavity. The inner cavity can accommodate optical components from the optical assembly. The first and second wavelength signal lights generated by the optical transmitting component 310 are transmitted to the rectangular tube 340 and then, through the optical components within the rectangular tube 340, are transmitted to the fiber optic adapter 206. Third and fourth wavelength signal lights from outside the optical module are transmitted to the rectangular tube 340 through the fiber optic adapter 206 and then, through the optical components within the rectangular tube 340, are transmitted to the corresponding first optical receiving component 320 or second optical receiving component 330.

[0051] like Figure 5 As shown, in some embodiments of this application, the light emitting component 310, the first light receiving component 320, and the second light receiving component 330 are physically separated from the circuit board 203. Therefore, it is difficult for the light emitting component 310, the first light receiving component 320, and the second light receiving component 330 to be directly connected to the circuit board 203. Thus, in the embodiments of this application, the light emitting component 310, the first light receiving component 320, and the second light receiving component 330 are electrically connected to the circuit board 203 via a flexible circuit board or an electrical connector. However, in the embodiments of this application, the assembly structure of the light emitting component 310, the first light receiving component 320, and the second light receiving component 330 is not limited to... Figure 4 and Figure 5 The structure shown can also be other assembly and combination structures; this embodiment is just one example. Figure 4 andFigure 5 The structure shown is an example.

[0052] like Figure 5 As shown, in some embodiments of this application, the optical transmitting component 310 is coaxial with the optical fiber adapter 206, while the first optical receiving component 320 and the second optical receiving component 330 are not coaxial. Specifically, the optical fiber adapter 206 and the optical transmitting component 310 are arranged along the length direction of the round-square tube 340, the first optical receiving component 320 is arranged on one side of the length direction of the round-square tube 340, and the second optical receiving component 330 is arranged on the other side of the length direction of the round-square tube 340.

[0053] like Figure 5 As shown, in some embodiments of this application, the first optical receiving component 320 and the second optical receiving component 330 are respectively optical receiving components with a coaxial package structure, and the first optical receiving component 320 and the second optical receiving component 330 are respectively embedded in the round-square tube body 340. The first optical receiving component 320 and the second optical receiving component 330 respectively include devices such as photodetectors.

[0054] In this embodiment, the light emitting component 310 includes devices such as a laser, a TEC, and a thermistor. Figure 6 This is a schematic diagram of the structure of a light emitting component provided in an embodiment of this application. Figure 5 and 6 As shown, in some embodiments of this application, the optical emitting component 310 has an independent hermetically sealed structure. Specifically, the optical emitting component 310 includes a housing 311, and the laser, TEC, thermistor, and other devices of the optical emitting component 310 are disposed within the housing 311. The housing 311 connects to a round / square tube body 340, and the signal light generated by the optical emitting component 310 first passes through the housing 311 and then enters the round / square tube body 340. The housing 311 in the optical emitting component 310 facilitates providing a relatively sealed working environment for the laser, effectively improving the reliability of the laser and meeting the stringent requirements of the PON field. Of course, in the embodiments of this application, the optical emitting component 310 may not use a housing 311 to form a sealed structure, or it may use a housing 311 without forming a sealed structure. Correspondingly, some components in the optical assembly may also be disposed within the housing for collimation, filtering, etc., of the signal light generated by the laser of the optical emitting component 310.

[0055] like Figure 5 As shown, the light emitting component 310 is located outside the round-square tube 340. However, in this embodiment, the light emitting component 310 is not limited to being placed outside the round-square tube 340. It can also be placed inside the round-square tube 340. The specific arrangement can be selected according to the needs and the size of the optical module.

[0056] Figure 7An optical path diagram of an optical transceiver submodule provided in an embodiment of this application is shown. Figure 7 As shown, the optical emitting component 310 includes a first laser 312 and a second laser 313. The first laser 312 outputs a first wavelength signal light, and the second laser 313 outputs a second wavelength signal light. The first wavelength signal light output by the first laser 312 and the second wavelength signal light output by the second laser 313 are respectively transmitted to the fiber optic adapter 206 through optical components. The transmission path of the first wavelength signal light is shown by the solid line in the figure, and the transmission path of the second wavelength signal light is shown by the dashed line in the figure. Figure 7 As shown, the third and fourth wavelength signal lights from outside the optical module are transmitted to the first optical receiving component 320 and the second optical receiving component 330 respectively. The transmission path of the third wavelength signal light is shown by the dotted line in the figure, and the transmission path of the fourth wavelength signal light is shown by the double-dotted line in the figure. However, in this embodiment, the optical transmission paths of the optical emitting component 310, the first optical receiving component 320, and the second optical receiving component 330 are not limited to... Figure 7 As shown, other forms of transmission paths are also possible; this embodiment only uses one as an example. Figure 7 The structure shown is an example.

[0057] like Figure 7 As shown, in some embodiments, the optical component 350 includes a first filter 351, a second filter 352, a third filter 353, a fourth filter 354, and a fifth filter 355. The first filter 351 and the third filter 353 are disposed in the light-emitting direction of the first laser 312, the second filter 352 is disposed in the light-emitting direction of the second laser 313, the third filter 353 is disposed between the first filter 351 and the fiber optic adapter 206, the fourth filter 354 is disposed between the third filter 353 and the first optical receiving component 320, and the fifth filter 355 is disposed between the third filter 353 and the second optical receiving component 330. Thus, the first wavelength signal light is transmitted to the fiber optic adapter 206 through the first filter 351 and the third filter 353; the second wavelength signal light is reflected by the second filter 352 to the first filter 351, then reflected by the second filter 352 to the third filter 353, and finally transmitted to the fiber optic adapter 206 through the third filter 353; the third wavelength signal light transmitted through the fiber optic adapter 206 is transmitted to the third filter 353, reflected by the third filter 353 to the fourth filter 354, and then transmitted to the first optical receiving component 320 through the fourth filter 354; the fourth wavelength signal light transmitted through the fiber optic adapter 206 is transmitted to the third filter 353, reflected by the third filter 353 to the fourth filter 354, reflected by the fourth filter 354 to the fifth filter 355, and finally transmitted to the second optical receiving component 330 through the fifth filter 355.

[0058] In this embodiment, the first filter 351, the second filter 352, and the third filter 353 are all 45° filters, the fourth filter 354 is an 8° filter, and the fifth filter 355 is a 0° filter. Specifically: the central axis of the first filter 351 is at 45° to the optical axis of the first wavelength signal light output by the first laser 312; the central axis of the second filter 352 is at 45° to the optical axis of the second wavelength signal light output by the second laser 313; the third filter 353 is at 45° to the optical axis of the first wavelength signal light output by the first laser 312; the central axis of the fourth filter 354 is at 82° to the central axis of the first light receiving component 320; and the central axis of the fifth filter 355 is perpendicular to the central axis of the second light receiving component 330. Optionally, the first filter 351 reflects light above 1490 nm, the second filter 352 transmits light below 1360 nm and reflects light above 1380 nm, the third filter 353 transmits light above 1330 nm and reflects light below 1320 nm, the fourth filter 354 transmits light from 1290 to 1310 nm and reflects light from 1260 to 1280 nm, and the fifth filter transmits light from 1260 to 1280 nm and reflects light in other wavelengths.

[0059] Furthermore, such as Figure 7 As shown, in some embodiments, the optical component 350 further includes a first collimating lens 356 and a second collimating lens 357; the first collimating lens 356 is disposed between the first laser 312 and the first filter 351, and the second collimating lens 357 is disposed between the second laser 313 and the second filter 352. The first wavelength signal light output by the first laser 312 is transmitted to the first collimating lens 356, collimated by the first collimating lens 356, and then transmitted to the first filter 351; the second wavelength signal light output by the second laser 313 is transmitted to the second collimating lens 357, collimated by the second collimating lens 357, and then transmitted to the second filter 352.

[0060] Furthermore, such as Figure 7 As shown, in some embodiments, the optical component 350 further includes an isolator 358, which is disposed between the first filter 351 and the third filter 353 to isolate the signal light generated by the light emitting component 310 and the signal light to be received by the first light receiving component 320 and the second light receiving component 330 that partially passes through the third filter 353. Optionally, the isolator 358 is a bipolar isolator that isolates the light in two wavelength bands, the first wavelength signal light and the second wavelength signal light. It is typically composed of two polarizers and a Faraday rotator to prevent the first wavelength signal light and the second wavelength signal light from returning and affecting the laser performance.

[0061] Furthermore, such as Figure 7As shown, in some embodiments, the optical component 350 further includes a third collimating lens 359, which is disposed between the third filter 353 and the fiber optic adapter 206. The third wavelength signal light and the fourth wavelength signal light passing through the fiber optic adapter 206 are collimated by the third collimating lens 359 and transmitted to the third filter 353. At the same time, the first wavelength signal light and the second wavelength signal light passing through the third filter 353 are focused by the third collimating lens 359 and transmitted to the fiber optic adapter 206.

[0062] Figure 8 This is a schematic diagram of the internal structure of a light-emitting component provided in an embodiment of this application. Figure 8 As shown, in some embodiments of this application, the light emitting assembly 310 further includes a TEC 314 and a substrate 315. The substrate 315 is disposed on the TEC 314, and the first laser 312 and the second laser 313 are disposed on the substrate 315. A temperature sensing element is disposed between the first laser 312 and the second laser 313, and the temperature sensing element is disposed on the substrate 315. The temperature sensing element may be a thermistor, such as... Figure 8 As shown, the thermistor 316 is disposed on the substrate 315 and located between the first laser 312 and the second laser 313.

[0063] In this embodiment, since the downlink wavelength ranges of both the 50G GPON OLT and the XGSPON OLT are very narrow, a TEC314 is needed for temperature control to ensure stable wavelength adjustment within the agreed wavelength range during operation. In this embodiment, the first laser 312 and the second laser 313 are jointly mounted on a substrate 315 and share a single TEC314. This facilitates temperature control of the first laser 312 and the second laser 313, and also simplifies and optimizes the structure of the optical emitting assembly 310.

[0064] In some embodiments of this application, the first laser 312 is an EML+SOA laser, and the second laser 313 is an EML laser. Optionally, the first laser 312 is a 1342nm EML+SOA laser, and the second laser 313 is a 1577nm EML laser. The first laser 312 and the second laser 313 are jointly mounted on the same substrate 315, and then a TEC 314 is mounted under the substrate 315. A thermistor 316 is placed between the first laser 312 and the second laser 313, which can collect the common temperature feedback of the first laser 312 and the second laser 313. Through the external TEC driving circuit, the ATC closed-loop temperature control of the first laser 312 and the second laser 313 is realized. In this embodiment, the purpose of choosing a common TEC is, firstly, for the simplicity of the solution; secondly, since the range of the two downlink wavelengths is 4-5nm, which is not the high precision requirement of DWDM, although there will be thermal coupling between the two, the difference in thermal coupling is controllable after either laser is turned off.

[0065] Figure 9 This application provides a control circuit diagram for an optical emitting component, a first optical receiving component, and a second optical receiving component, as shown in the embodiments of this application. Figure 9As shown, to reduce the pressure on the gold finger side and the single board for transmitting high-speed signals, a 24.8832 GBaud PAM4 signal or 2x24.8832 Gbps NRZ signal can be used for the 49.9664 Gbps signal required by the optical module. The 50G driver inside the optical module converts the 24.8832 GBaud PAM4 signal or 2x24.8832 Gbps NRZ signal into a 49.9664 Gbps NRZ signal, which then drives the EAM for electro-optical conversion. For the first laser 312 of the 50G, the bias currents of the SOA and LD are provided by the first control circuit, which includes an IDAC. The IDAC provides IDAC1 (first bias current) and IDAC2 (second bias current) to drive the gain amplification function of the SOA and the emission of the LD. In addition to using a stable IDAC or current source to bias the LD and SOA, a VDAC-controlled current mirror method can also be selected. Then, the Mpd1 analog signal fed back from PD1 is collected and used together with IDAC1 and IDAC2 to form an APC closed-loop circuit to maintain the stability of 50G GPON downlink emission. For the 10G driving circuit, the existing mature driving method can be used. The LD driver can directly provide the modulation signal and bias current and perform APC closed-loop control. The TEC driver collects the analog signal from the thermistor 316 and controls the direction and magnitude of the current output to TEC+ / TEC- to maintain the relative stability of the dual laser temperature and thus the stability of the emitted light signal wavelength.

[0066] For the first optical receiving component 320 and the second optical receiving component 330, the second control circuit provides the high voltage necessary for the operation of the two APDs and can have a fast sample-and-hold function to detect the optical signal of the burst received optical packets at the receiving end. For example... Figure 9 As shown, the second control circuit includes a first control high voltage circuit and a second control high voltage circuit. The first control high voltage circuit includes a mirror current source 1, and the second control high voltage circuit includes a mirror current source 2. Mirror current source 1 and mirror current source 2 are controlled by the MCU respectively.

[0067] Furthermore, the second control circuit also includes a first sample-and-hold circuit and a second sample-and-hold circuit, wherein the first sample-and-hold circuit is electrically connected to the first control high-voltage circuit and the second sample-and-hold circuit is electrically connected to the second control high-voltage circuit.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An optical module characterized by comprising: include: An optical transmitting component is used to generate a first wavelength signal light for 50G GPON technology transmission and a second wavelength signal light for XGSPON technology transmission; The first optical receiving component is used to receive the third wavelength signal light from outside the optical module to realize 50G GPON technology transmission; The second optical receiving component is used to receive the fourth wavelength signal light from outside the optical module to realize XGSPON technology transmission; Optical components, including a first filter, a second filter, a third filter, and a fourth filter; An optical fiber adapter is used to output a first wavelength signal light and a second wavelength signal light, and to input a third wavelength signal light and a fourth wavelength signal light; the first optical receiving component and the second optical receiving component are located on different sides of the optical fiber adapter; The light emitting component includes a TEC, a substrate disposed on the TEC, a first laser and a second laser disposed side by side on the substrate, and a thermistor disposed on the substrate and located between the first laser and the second laser. The first laser is used to generate a first wavelength signal light, and the second laser is used to generate a second wavelength signal light. The TEC is driven and controlled by the thermistor to adjust the temperature of the first laser and the second laser based on the acquisition signal of the thermistor. The second filter is located in the output optical path of the second laser; the first filter is located in the output optical path of the first laser and in the reflected optical path of the second filter; the third filter is located between the first filter and the fiber optic adapter; the fourth filter is located between the third filter and the first optical receiving component, and the second optical receiving component is located in the reflected optical path of the fourth filter; a first wavelength signal light passes through the first filter and the third filter; a second wavelength signal light is reflected by the second filter and transmitted to the first filter, then reflected by the first filter and transmitted to the third filter and passed through the third filter; a third wavelength signal light is transmitted to the third filter, reflected by the third filter and transmitted to the fourth filter and passed through the fourth filter; a fourth wavelength light signal is transmitted to the third filter, reflected by the third filter and transmitted to the fourth filter, then reflected by the fourth filter.

2. The optical module according to claim 1, wherein The light emission direction of the first laser is parallel to that of the second laser.

3. The optical module according to claim 1, wherein The optical component further includes a fifth filter; the fifth filter is disposed between the third filter and the second light receiving component, and the fifth filter transmits the fourth wavelength signal light reflected by the fourth filter to the second light receiving component.

4. The optical module according to claim 2 or 3, wherein The optical assembly further includes a first collimating lens and a second collimating lens, wherein the first collimating lens is disposed between the first laser and the first filter, and the second collimating lens is disposed between the second laser and the second filter; And / or, the optical assembly further comprises an isolator, which is arranged between the first filter and the third filter; The optical assembly further comprises a third collimating lens, which is used for focusing the first wavelength signal light and the second wavelength signal light passing through the third filter.

5. The optical module of claim 1, wherein, The first laser is an EML+SOA laser, and the second laser is an EML laser; The optical module further comprises a 50G drive chip and a 10G drive chip arranged on the circuit board, the 50G drive chip drives the first laser, and the 10G drive chip drives the second laser.

6. The optical module according to claim 5, wherein The optical module further comprises a first control circuit, which is used for delivering a first bias current and a second bias current to the EML+SOA laser, and the first control circuit comprises a first output end and a second output end; The first output end is connected to the SOA of the EML+SOA laser, and the first bias current is delivered to the SOA through the first output end; The second output end is connected to the LD of the EML+SOA laser, and the second bias current is delivered to the LD through the second output end.

7. The optical module of claim 5, wherein the optical module further comprises a light source. The 50G drive chip drives the first laser to perform electro-optical conversion according to the received 24.8832GBaud PAM4 signal or 2x24.8832Gbps NRZ signal to 49.9664Gbps NRZ signal.

8. The optical module of claim 1, wherein, The optical module further comprises a second control circuit, which comprises a first control high-voltage circuit and a second control high-voltage circuit, the first control high-voltage circuit is electrically connected to the first optical receiving assembly, and the second control high-voltage circuit is electrically connected to the second optical receiving assembly.

9. The optical module of claim 8, wherein, The second control circuit further comprises a first sample and hold circuit and a second sample and hold circuit, the first sample and hold circuit is electrically connected to the first control high-voltage circuit, and the second sample and hold circuit is electrically connected to the second control high-voltage circuit.

10. The optical module of claim 1, wherein, The optical transmitting assembly further comprises a tube shell, the TEC, the substrate, the first laser and the second laser are hermetically sealed in the tube shell; The first optical receiving assembly and the second optical receiving assembly respectively adopt coaxial packaged optical receiving assemblies.

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