Optical module

Abstract

The utility model provides a kind of optical module, comprising: circuit board, with opposite first surface, second surface;Light emitting component, with circuit board electric connection;Silicon optical chip is located on the first surface, and silicon optical chip is used to accept light emitted by light emitting component;Light receiving component, the light receiving component includes photoelectric chip, optical element electrically connected with the photoelectric chip on the second surface and the circuit board electric connection;First reinforcing plate, the first reinforcing plate is connected to the opposite side of the circuit board with the first surface, the position of the first reinforcing plate and the circuit board connection corresponds with the position of silicon optical chip on the circuit board, the first reinforcing plate is exposed from the second surface, and the optical element is supported on the first reinforcing plate;The thermal expansion coefficient of the first reinforcing plate is less than the circuit board, and the Young's modulus of the first reinforcing plate is greater than the circuit board;Reduce the warping of silicon optical chip.

Description

Technical Field

[0001] This utility model relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of emerging businesses such as 5G, cloud computing, big data, and AI, internet services and data computing volume are growing exponentially. Data centers are gradually evolving from single-unit to large-scale operations, giving rise to the data center internet. The speed of optical modules used for data center connections is also increasing, gradually evolving towards 800G / 1.6T speeds.

[0003] Traditionally, silicon photonic chips in optical modules are electrically interconnected via gold wire bonding. However, the length tolerance of the gold wires leads to difficulties in impedance matching, lower bandwidth, and degraded module performance. Therefore, to ensure the transmission rate of optical modules, current optical modules increasingly favor flip-chip bonding packaging technology for the electrical interconnection design of silicon photonic chips.

[0004] In flip-chip bonding packaging, there is a significant difference in the coefficients of thermal expansion between the chip and the circuit board. Furthermore, the adhesive used to fill the gap between the chip and the circuit board during packaging cures and shrinks, making the chip prone to warping. This warping varies across three temperature environments (room temperature around 20°C, high temperature within the operating temperature range, and low temperature), causing significant variations in the coupling efficiency between the chip and the light source or optical fiber with temperature. Utility Model Content

[0005] The purpose of this invention is to provide an optical module that can reduce the warpage of silicon photonic chips, while simplifying the structure and fabrication process of the optical module.

[0006] One embodiment of this utility model provides an optical module, comprising:

[0007] A circuit board having opposing first and second surfaces;

[0008] A light-emitting component is electrically connected to the circuit board;

[0009] A silicon photonic chip disposed on the first surface is used to receive light emitted by the light emitting component;

[0010] A light receiving component, the light receiving component including a photoelectric chip disposed on the second surface and electrically connected to the circuit board, and an optical element optically coupled to the photoelectric chip;

[0011] A first reinforcing plate is connected to the side of the circuit board opposite to the first surface. The position where the first reinforcing plate is connected to the circuit board corresponds to the position of the silicon photonic chip on the circuit board. The first reinforcing plate is exposed from the second surface, and the optical element is supported on the first reinforcing plate.

[0012] The coefficient of thermal expansion of the first reinforcing plate is smaller than that of the circuit board, and the Young's modulus of the first reinforcing plate is greater than that of the circuit board.

[0013] As a further improvement of one embodiment of the present invention, the first reinforcing plate is connected to the second surface;

[0014] Alternatively, the circuit board has a first receiving groove recessed from the second surface, the first reinforcing plate being connected within the first receiving groove, and the thickness of the first reinforcing plate being not less than the groove depth of the first receiving groove.

[0015] As a further improvement of one embodiment of the present invention, the protrusion height of the first reinforcing plate protruding from the second surface is not less than the protrusion height of the photoelectric chip protruding from the second surface.

[0016] As a further improvement of one embodiment of the present invention, the protrusion height of the first reinforcing plate protruding from the second surface is lower than the protrusion height of the photoelectric chip protruding from the second surface; the optical module further includes a support block disposed on the first reinforcing plate, and the optical element is supported on the support block.

[0017] As a further improvement of one embodiment of the present invention, the first reinforcing plate is connected to the second surface;

[0018] An adhesive layer is provided between the first reinforcing plate and the second surface, and the first reinforcing plate is connected to the second surface through the adhesive layer; or a welding layer is provided between the first reinforcing plate and the second surface, and the first reinforcing plate is connected to the second surface through the welding layer.

[0019] As a further improvement of one embodiment of the present invention, the optical module further includes a second reinforcement plate disposed inside the circuit board. The second reinforcement plate is located between the first reinforcement plate and the silicon photonic chip, and the second reinforcement plate is spaced apart from the first reinforcement plate and the silicon photonic chip.

[0020] As a further improvement of one embodiment of the present invention, the optical module further includes a substrate connected to the first surface, the light emitting component is located on the substrate, and the substrate covers the area where the silicon photonic chip is located.

[0021] As a further improvement of one embodiment of the present invention, the circuit board has a through-hole connecting the first surface and the second surface, and the silicon photonics chip is disposed close to the through-hole;

[0022] The substrate includes a first connecting portion and a second connecting portion connected to a first surface. The first connecting portion and the second connecting portion are respectively located on opposite sides of the through opening, and the first connecting portion and the second connecting portion are also respectively located on opposite sides of the silicon photonic chip.

[0023] As a further improvement of one embodiment of the present invention, the coefficient of thermal expansion of the first reinforcing plate is less than 7.2 ppm / ℃, and the Young's modulus of the first reinforcing plate is greater than 50 GPa.

[0024] As a further improvement of one embodiment of the present invention, the circuit board has a through-hole connecting the first surface and the second surface, and the silicon photonic chip includes a light port portion located in the through-hole and a mounting portion attached to the circuit board; the first reinforcement plate is located between the through-hole and the photonic chip.

[0025] As a further improvement of one embodiment of the present invention, the first reinforcing plate is an AlN plate, a silicon plate or an Al2O3 plate.

[0026] The optical module provided by this invention features a first reinforcing plate exposed from a second surface at a position on the circuit board corresponding to the silicon photonic chip. On one hand, the first reinforcing plate enhances the strength of the circuit board at the position corresponding to the silicon photonic chip, reducing the expansion or contraction of the corresponding circuit board portion during subsequent flip-chip bonding of the silicon photonic chip, thereby reducing warpage after bonding. On the other hand, the first reinforcing plate also serves as a support plate for optical components, eliminating the need for additional support blocks on the circuit board, thus simplifying the structure and fabrication process of the optical module. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the optical module in Embodiment 1 of this utility model from one angle;

[0028] Figure 2 for Figure 1 The diagram shows another angle of the optical module.

[0029] Figure 3 for Figure 2 Sectional view along line AA;

[0030] Figure 4 This is a cross-sectional view along line AA corresponding to the optical module in Embodiment 2 of this utility model;

[0031] Figure 5This is a cross-sectional view along line AA corresponding to the optical module in Embodiment 3 of this utility model;

[0032] Figure 6 This is a cross-sectional view along line AA corresponding to the optical module in Embodiment 4 of this utility model;

[0033] Figure 7 This is a schematic diagram of the optical module in Embodiment 5 of this utility model from one angle;

[0034] Figure 8 for Figure 7 Another angle diagram of the optical module shown;

[0035] Figure 9 for Figure 7 The diagram shows the structure of the substrate in the optical module, and the optical emitting component and silicon photonic chip located in the groove of the substrate in cooperation with it.

[0036] Figure 10 for Figure 7 Another angle diagram of the optical module shown;

[0037] Figure 11 for Figure 10 Sectional view along the BB direction. Detailed Implementation

[0038] The following detailed description incorporates the accompanying drawings, which form part of this specification. The illustrative embodiments mentioned in the specification and drawings are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art will understand, based on the teachings of this application, that many other embodiments can be employed and various changes can be made to the described embodiments without departing from the spirit and scope of this utility model. It should be understood that the various aspects of this application illustrated herein can be arranged, substituted, combined, separated, and designed in many different configurations, all of which are within the scope of this application.

[0039] Example 1:

[0040] See Figures 1-3 This embodiment provides an optical module 10, which is used to realize photoelectric conversion.

[0041] The optical module 10 includes a circuit board 1, a light emitting component (not shown) electrically connected to the circuit board 1, a silicon photonic chip 2 for receiving light emitted by the light emitting component, and a light receiving component 3. The circuit board 1 electrically connects the various components in the optical module 10 to realize power supply and transmission of electrical signals. The optical module 10 may also include a housing (not shown), in which the circuit board 1, light emitting component, silicon photonic chip 2, light receiving component 3, and other components can be encapsulated. The housing can be made of a material with high thermal conductivity.

[0042] Circuit board 1 has a first surface 1a and a second surface 1b. A silicon photonic chip 2 is fixed to the first surface 1a and electrically connected to circuit board 1. A light receiving component 3 is fixed to the second surface 1b and electrically connected to circuit board 1. In this embodiment, the first surface 1a is the back side of circuit board 1, and the second surface 1b is the front side of circuit board 1. However, this is not a limitation; in other embodiments, the first surface 1a may also be the front side of circuit board 1, in which case the second surface 1b is the back side of circuit board 1.

[0043] In one specific embodiment, the silicon photonic chip 2 is mounted on the first surface 1a of the circuit board 1 using a flip-chip bonding process to improve the transmission rate and signal quality of the optical module 10. At this time, the silicon photonic chip 2 can be pre-set with metal bumps, which can be solder balls or copper pillars, etc. The first surface 1a of the circuit board 1 has pads corresponding to the metal bumps. During assembly, the silicon photonic chip 2 can be inverted on the first surface 1a so that the metal bumps correspond one-to-one with the pads on the first surface 1a. Then, a reflow soldering process is performed, that is, the metal bumps are melted by heating to achieve soldering connection with the pads on the first surface 1a. After soldering, underfill adhesive is filled in the gap between the circuit board 1 and the silicon photonic chip 2, especially around the metal bumps, to reinforce the solder joints and enhance the mechanical strength of the structure.

[0044] The optical receiving component 3 includes a photoelectric chip 31 disposed on the second surface 1b and electrically connected to the circuit board 1, and an optical element 32 optically coupled to the photoelectric chip 31. In one specific embodiment, the photoelectric chip 31 includes a transimpedance amplifier 311 disposed on the second surface 1b and electrically connected to the circuit board 1, and a photodetector 312 disposed on and electrically connected to the transimpedance amplifier 311. The optical element 32 includes, but is not limited to, an optical fiber array at the receiving end, a wavelength division multiplexer, etc.

[0045] On the plane of circuit board 1, the silicon photonics chip 2 and the photoelectric chip 31 are staggered, meaning that the projection of the silicon photonics chip 2 onto the second surface 1b does not overlap with the photoelectric chip 31. Specifically, circuit board 1 has an electrical interface terminal 11, and the photoelectric chip 31 is located between the silicon photonics chip 2 and the electrical interface terminal 11.

[0046] The optical module 10 also includes a reinforcement structure. The reinforcement structure includes a first reinforcement plate 4, which is connected to the side of the circuit board 1 opposite to the first surface 1a. The position where the first reinforcement plate 4 is connected to the circuit board 1 corresponds to the position of the silicon photonic chip 2 on the circuit board 1. The first reinforcement plate 4 is exposed from the second surface 1b. The optical element 32 is supported on the first reinforcement plate 4. The coefficient of thermal expansion of the reinforcement structure is less than that of the circuit board 1, and the Young's modulus of the reinforcement structure is greater than that of the circuit board 1. Correspondingly, the coefficient of thermal expansion of the first reinforcement plate 4 is less than that of the circuit board 1, and the Young's modulus of the first reinforcement plate 4 is greater than that of the circuit board 1.

[0047] In this embodiment, a first reinforcing plate 4 exposed from the second surface 1b is provided at the position corresponding to the silicon photonic chip 2 on the circuit board 1. On the one hand, the provision of the first reinforcing plate 4 can enhance the strength of the circuit board 1 at the position corresponding to the silicon photonic chip 2, reduce the expansion or contraction of the corresponding part of the circuit board 1 during the subsequent flip-chip bonding process of the silicon photonic chip 2, thereby reducing the warpage of the silicon photonic chip 2 after bonding, and also reducing the warpage or deformation of the silicon photonic chip 2 during the subsequent application of the optical module 10; on the other hand, the first reinforcing plate 4 can also serve as a carrier plate for supporting the optical element 32, eliminating the need to provide a separate carrier block for supporting the optical element 32 on the circuit board 1, simplifying the structure and manufacturing process of the optical module 10.

[0048] Specifically, the Young's modulus of the reinforcing structure is greater than 50 GPa, and the coefficient of thermal expansion of the reinforcing structure is less than 7.2 ppm / ℃ between 40 and 400℃. Correspondingly, the Young's modulus of the first reinforcing plate 4 is greater than 50 GPa, and the coefficient of thermal expansion of the first reinforcing plate 4 is less than 7.2 ppm / ℃ between 40 and 400℃, which can enhance the strength of the circuit board 1 at the position corresponding to the silicon photonic chip 2 and reduce the warpage of the silicon photonic chip 2.

[0049] In one specific embodiment, the first reinforcing plate 4 can be an AlN plate, a silicon plate, an Al2O3 plate, etc.

[0050] Combination Figure 3 As shown, in this embodiment, the first reinforcing plate 4 is connected to the second surface 1b. That is, the first reinforcing plate 4 is directly attached to the second surface 1b. This structure simplifies the fabrication process of the circuit board 1 and the optical module 10.

[0051] In one specific embodiment, the first reinforcing plate 4 is connected to the second surface 1b of the circuit board 1. Specifically, pads are provided on the first reinforcing plate 4, and solder is pre-applied on the second surface 1b and / or the pads of the first reinforcing plate 4; during the mounting process of the second surface 1b of the circuit board 1, the first reinforcing plate 4 is simultaneously soldered to the second surface 1b of the circuit board 1. At this time, a solder layer is formed between the first reinforcing plate 4 and the second surface 1b. After the first reinforcing plate 4 is soldered to the circuit board 1, the flip-chip bonding process of the silicon photonic chip 2 is performed. Thus, the degree of expansion or contraction of the circuit board at the corresponding position during the flip-chip bonding process of the silicon photonic chip 2 can be reduced, the warpage of the silicon photonic chip 2 caused by the expansion or contraction of the circuit board 1 can be reduced, and the warpage change of the silicon photonic chip 2 during the subsequent application of the optical module 10 can also be reduced.

[0052] In another specific embodiment, the first reinforcing plate 4 is connected to the second surface 1b of the circuit board 1 during the processing of the optical module 10. If the silicon photonic chip 2 has already been connected to the first surface 1a of the circuit board 1 via flip-chip bonding during the fabrication process of the circuit board 1, the first reinforcing plate 4 can be directly bonded to the second surface 1b of the circuit board 1 at the position corresponding to the silicon photonic chip 2 using thermosetting adhesive. In this case, an adhesive layer is formed between the first reinforcing plate 4 and the second surface 1b to achieve the connection between the first reinforcing plate 4 and the second surface 1b. If the silicon photonic chip 2 has not been mounted to the first surface 1a of the circuit board 1 during the fabrication process of the circuit board 1, the silicon photonic chip 2 is first mounted to the first surface 1a, and then the first reinforcing plate 4 is bonded to the second surface 1b of the circuit board 1 at the position corresponding to the silicon photonic chip 2 using thermosetting adhesive to avoid affecting the adhesion between the first reinforcing plate 4 and the circuit board 1 during the mounting of the silicon photonic chip 2. In this case, an adhesive layer is formed between the first reinforcing plate 4 and the second surface 1b to achieve the connection between the first reinforcing plate 4 and the second surface 1b.

[0053] In some optional embodiments, the protrusion height of the first reinforcing plate 4 over the second surface 1b is not less than the protrusion height of the photoelectric chip 31 over the second surface 1b. In this embodiment, the thickness of the first reinforcing plate 4 is not less than the protrusion height of the photoelectric chip 31. This further improves the strength of the circuit board 1 and reduces the warpage of the silicon photonic chip 2. At the same time, the optical element 32, which is optically coupled to the photoelectric chip 31, can be directly supported on the first reinforcing plate 4. For example, the optical element 32 can be directly connected to the first reinforcing plate 4 by adhesive. This simplifies the structure and processing steps of the optical module 10. Of course, this is not a limitation. In other embodiments, the protrusion height of the first reinforcing plate 4 over the second surface 1b can also be set to be lower than the protrusion height of the photoelectric chip 31 over the second surface 1b. In this case, a support block connected to the first reinforcing plate 4 is needed to raise the optical element 32, and the optical element 32 is subsequently indirectly supported on the first reinforcing plate 4 through the support block 5.

[0054] In one specific embodiment, the protrusion height h of the first reinforcing plate 4 protruding from the second surface 1b satisfies: 0.3mm≤h≤2mm. In this embodiment, the thickness of the first reinforcing plate 4 is between 0.3mm and 2mm, which can avoid the first reinforcing plate 4 protruding too high and affecting the subsequent assembly of other components such as the shell.

[0055] In this embodiment, the circuit board 1 has a through-hole 12 connecting the first surface 1a and the second surface 1b. The silicon photonic chip 2 includes an optical port for docking with the fiber array of the transmitting end and a mounting portion for mounting on the circuit board 1. After the silicon photonic chip 2 is mounted on the circuit board 1, the optical port is located within the through-hole 12. It is known that the optical emitting assembly generally includes a fiber array docked with the silicon photonic chip 2 and a light source assembly coupled to the silicon photonic chip 2. By providing the through-hole 12 on the circuit board 1, clearance space can be provided for the fiber array, light source assembly, etc. in the optical emitting assembly.

[0056] Specifically, the length of the first reinforcing plate 4 protruding into the through-hole 12 is limited to not obstructing the optical aperture of the silicon photonic chip 2. In this embodiment, the first reinforcing plate 4 is located between the through-hole 12 and the photoelectric chip 31, that is, the first reinforcing plate 4 will not extend beyond the photoelectric chip 31, avoiding interference between the first reinforcing plate 4 and the photoelectric chip 31; at the same time, the first reinforcing plate 4 will not cover the through-hole 12, avoiding obstructing the optical aperture of the silicon photonic chip 2 and affecting the docking between the fiber array and the silicon photonic chip 2.

[0057] Example 2:

[0058] Combination Figure 4 As shown, this embodiment provides an optical module 10.

[0059] The optical module 10 in this embodiment 2 is basically the same as the optical module 10 in the previous embodiment 1. The only difference between the two is the specific connection structure between the first reinforcing plate 4 and the circuit board 1. The following description focuses only on the technical content related to the difference. The other technical content is exactly the same as in embodiment 1, and will not be repeated here.

[0060] Specifically, in embodiment 1, the first reinforcing plate 4 is directly connected to the second surface 1b. In contrast, in embodiment 2, the circuit board 1 has a first receiving groove recessed from the second surface 1b. The first reinforcing plate 4 is connected within the first receiving groove. The thickness of the first reinforcing plate 4 is not less than the depth of the first receiving groove. That is, the first receiving groove is formed on the second surface 1b of the circuit board 1, and the first reinforcing plate 4 is embedded within the first receiving groove.

[0061] Specifically, after bonding the layers of circuit board 1 together to form a complete circuit board 1, a groove is cut into circuit board 1 to form a first receiving groove, and then the first reinforcing plate 4 is bonded to the first receiving groove with adhesive. In this process, epoxy adhesive can be used to bond the first reinforcing plate 4 to the first receiving groove. This arrangement can reduce the expansion and / or contraction of the corresponding part of circuit board 1 during the subsequent flip-chip soldering of silicon photonics chip 2, thereby reducing the warpage of silicon photonics chip 2 after soldering, and also reducing the warpage changes of silicon photonics chip 2 during the subsequent application of optical module 10.

[0062] In this embodiment 2, the thickness of the first reinforcing plate 4 is greater than the depth of the first receiving groove. That is, after the first reinforcing plate 4 is connected to the first receiving groove, a portion of the first reinforcing plate 4 protrudes from the second surface 1b of the circuit board 1. When the protrusion height is not lower than the protrusion height of the photoelectric chip 31 protruding from the second surface 1b, the optical element 32 is directly supported on the first reinforcing plate 4. When the protrusion height is lower than the protrusion height of the photoelectric chip 31 protruding from the second surface 1b, a support block is provided on the first reinforcing plate 4 to elevate the optical element 32, and the optical element 32 is indirectly supported on the first reinforcing plate 4 through the support block.

[0063] Example 3:

[0064] Combination Figure 5 As shown, this embodiment provides an optical module 10.

[0065] The optical module 10 in this embodiment 3 is basically the same as the optical module 10 in the previous embodiment 2. The only difference is that the thickness of the first reinforcing plate 4 in embodiment 2 is greater than the depth of the first receiving groove, while the thickness of the first reinforcing plate 4 in this embodiment is equal to the depth of the first receiving groove. After the first reinforcing plate 4 is located in the first receiving groove, the supporting surface of the first reinforcing plate 4 used to support the optical element 32 is flush with the second surface 1b, that is, the first reinforcing plate 4 will not protrude from the second surface 1b. At this time, a support block 5 is required on the supporting surface of the first reinforcing plate 4 to raise the optical element 32. The optical element 32 is indirectly supported by the first reinforcing plate 4 through the support block 5.

[0066] Except for the differences mentioned above, the technical content of this embodiment 3 is exactly the same as that of embodiment 2 above, and will not be repeated here.

[0067] Example 4:

[0068] Combination Figure 6 As shown, this embodiment provides an optical module 10.

[0069] The optical module 10 in this embodiment 4 is basically the same as the optical modules 10 in the previous embodiments 1-3, except that the reinforcement structure also includes a second reinforcement plate 6 disposed inside the circuit board 1. The second reinforcement plate 6 is located between the first reinforcement plate 4 and the silicon photonic chip 2. The second reinforcement plate 6 is spaced apart from the first reinforcement plate 4, and spaced apart from the silicon photonic chip 2. That is, the second reinforcement plate 6 is embedded in the middle layer of the circuit board 1 at the position corresponding to the silicon photonic chip 2, further enhancing the strength of the circuit board 1 at the corresponding position of the silicon photonic chip 2 and reducing the warpage of the silicon photonic chip 2.

[0070] Specifically, the circuit board 1 includes a core layer, circuit layers alternately stacked on opposite sides of the core layer, and an insulating layer. In one specific embodiment, the second reinforcing plate 6 is embedded within the core layer. Of course, this is not a limitation; in other embodiments, the second reinforcing plate 6 may also be embedded within the circuit layers and / or the insulating layer.

[0071] The coefficient of thermal expansion of the second reinforcing plate 6 is less than that of the circuit board 1, and the Young's modulus of the second reinforcing plate 6 is greater than that of the circuit board 1. In one specific embodiment, the Young's modulus of the second reinforcing plate 6 is greater than 50 GPa, and the coefficient of thermal expansion of the second reinforcing plate 6 is less than 7.2 ppm / ℃ between 40 and 400℃. Specifically, the second reinforcing plate 6 can be an AlN plate, a silicon plate, an Al2O3 plate, etc.

[0072] In the fabrication process of circuit board 1, slots are pre-cut in the layers corresponding to the second reinforcing plate 6 in circuit board 1. After the second reinforcing plate 6 is embedded in these slots, other layers of circuit board 1, such as circuit layers and insulating layers, are then stacked. This arrangement reduces the expansion / contraction of the corresponding portion of circuit board 1 during the subsequent flip-chip bonding process of silicon photonics chip 2, thereby reducing the warpage of silicon photonics chip 2 after bonding. It also reduces the warpage variation of silicon photonics chip 2 during the subsequent application of optical module 10.

[0073] It is understood that the optical module 10 in this embodiment 4 is not limited to... Figure 6 The optical module 10 shown can be formed in this embodiment 4 by adding a second reinforcing plate 6 to the optical module 10 in any one of the embodiments 1 to 3.

[0074] Except for the differences mentioned above, the technical content of this embodiment 4 is exactly the same as that of embodiments 1-3, and will not be repeated here.

[0075] Example 5:

[0076] Combination Figures 7-11 As shown, this embodiment provides an optical module 10.

[0077] The optical module 10 in this embodiment 5 is basically the same as the optical modules 10 in the previous embodiments 1-4, except that the optical module 10 also includes a substrate 7, which is connected to the first surface 1a. The light emitting component 8 is located on the substrate 7, and the substrate 7 covers the area where the silicon photonic chip 2 is located. The coefficient of thermal expansion of the substrate 7 is less than that of the circuit board 1, and the Young's modulus of the substrate 7 is greater than that of the circuit board 1. In a specific embodiment, the Young's modulus of the substrate 7 is greater than 50 GPa, and the coefficient of thermal expansion of the substrate 7 is less than 7.2 ppm / ℃ between 40 and 400℃. Specifically, the substrate 7 can be an AlN plate, a silicon plate, an Al2O3 plate, etc.

[0078] In this embodiment, by setting a substrate 7 connected to the circuit board 1 on the same side of the silicon photonic chip 2, the stress received by the first surface 1a and the second surface 1b of the circuit board 1 is consistent, which further reduces the degree of expansion or contraction of the corresponding part of the circuit board 1 during the subsequent flip-chip bonding process of the silicon photonic chip 2. This reduces the warpage of the silicon photonic chip 2 after bonding and also reduces the warpage change of the silicon photonic chip 2 during the subsequent application of the optical module 10.

[0079] Specifically, the substrate 7 can be fixed to the circuit board 1 using thermosetting adhesive.

[0080] In one specific embodiment, the substrate 7 has a groove 71, the silicon photonic chip 2 is located in the groove 71, and the light emitting component 8 is connected to the groove 71.

[0081] Specifically, the substrate 7 includes a first connecting portion 72 and a second connecting portion 73 connected to the first surface 1a. The first connecting portion 72 and the second connecting portion 73 are located on opposite sides of the through-hole 12, and also on opposite sides of the silicon photonics chip 2. This further reduces the expansion or contraction of the corresponding portion of the circuit board 1 during the subsequent flip-chip bonding process of the silicon photonics chip 2, thereby reducing the warpage of the silicon photonics chip 2 after bonding. Simultaneously, it also reduces the warpage variation of the silicon photonics chip 2 during the subsequent application of the optical module 10.

[0082] The first connecting part 72 and the second connecting part 73 are the sidewalls of the groove 71, and both the first connecting part 72 and the second connecting part 73 extend along the arrangement direction of the through opening 12 and the silicon photonic chip 2.

[0083] Specifically, the groove 71 has an open end 711 and a bearing surface 712 opposite to the open end 711. The light emitting assembly 8 is mounted on the bearing surface 712.

[0084] Combination Figure 9 As shown, the optical emitting component 8 includes an optical fiber array 81 and a light source component 82. The light emitted by the light source component 82 can be transmitted to the silicon photonic chip 120, thereby generating an optical signal. The light source component 82 includes, but is not limited to, a laser, a lens, and an isolator. The optical fiber array 81 can be coupled to the silicon photonic chip 2 to transmit the optical signal in the silicon photonic chip 2 to the outside.

[0085] Except for the differences mentioned above, the technical content of this embodiment 5 is exactly the same as that of embodiments 1-4, and will not be repeated here.

[0086] In summary, the optical module 10 of this invention features a first reinforcing plate 4 exposed from the second surface 1b at the corresponding position of the circuit board 1 and the silicon photonic chip 2. On one hand, the first reinforcing plate 4 enhances the strength of the circuit board 1 at the position corresponding to the silicon photonic chip 2, reducing the expansion or contraction of the corresponding portion of the circuit board 1 during the subsequent flip-chip bonding process of the silicon photonic chip 2, thereby reducing warping of the photonic chip 2 after bonding. On the other hand, the first reinforcing plate 4 can also serve as a support plate for the optical element 32, eliminating the need for a separate support block on the circuit board 1 to support the optical element 32, thus simplifying the structure and manufacturing process of the optical module 10.

[0087] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0088] The detailed descriptions listed above are merely specific descriptions of feasible implementations of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementations or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

Claims

1. An optical module, characterized in that, include: A circuit board having opposing first and second surfaces; A light-emitting component is electrically connected to the circuit board; A silicon photonic chip disposed on the first surface is used to receive light emitted by the light emitting component; A light receiving component, the light receiving component including a photoelectric chip disposed on the second surface and electrically connected to the circuit board, and an optical element optically coupled to the photoelectric chip; A first reinforcing plate is connected to the side of the circuit board opposite to the first surface. The position where the first reinforcing plate is connected to the circuit board corresponds to the position of the silicon photonic chip on the circuit board. The first reinforcing plate is exposed from the second surface, and the optical element is supported on the first reinforcing plate. The coefficient of thermal expansion of the first reinforcing plate is smaller than that of the circuit board, and the Young's modulus of the first reinforcing plate is greater than that of the circuit board.

2. The optical module as described in claim 1, characterized in that, The first reinforcing plate is connected to the second surface; Alternatively, the circuit board has a first receiving groove recessed from the second surface, the first reinforcing plate being connected within the first receiving groove, and the thickness of the first reinforcing plate being not less than the groove depth of the first receiving groove.

3. The optical module as described in claim 2, characterized in that, The protrusion height of the first reinforcing plate protruding from the second surface is not less than the protrusion height of the optoelectronic chip protruding from the second surface.

4. The optical module as described in claim 2, characterized in that, The protrusion height of the first reinforcing plate over the second surface is lower than the protrusion height of the optoelectronic chip over the second surface; the optical module also includes a support block disposed on the first reinforcing plate, and the optical element is supported on the support block.

5. The optical module as described in claim 2, characterized in that, The first reinforcing plate is connected to the second surface; An adhesive layer is provided between the first reinforcing plate and the second surface, and the first reinforcing plate is connected to the second surface through the adhesive layer; or a welding layer is provided between the first reinforcing plate and the second surface, and the first reinforcing plate is connected to the second surface through the welding layer.

6. The optical module as described in claim 1, characterized in that, The optical module further includes a second reinforcement plate disposed inside the circuit board. The second reinforcement plate is located between the first reinforcement plate and the silicon photonic chip. The second reinforcement plate and the first reinforcement plate are spaced apart. The second reinforcement plate and the silicon photonic chip are also spaced apart.

7. The optical module as described in claim 1, characterized in that, The optical module further includes a substrate connected to the first surface, the light emitting component is located on the substrate, and the substrate covers the area where the silicon photonic chip is located.

8. The optical module as described in claim 7, characterized in that, The circuit board has a through-hole connecting the first surface and the second surface, and the silicon photonics chip is disposed close to the through-hole; The substrate includes a first connecting portion and a second connecting portion connected to a first surface. The first connecting portion and the second connecting portion are respectively located on opposite sides of the through opening, and the first connecting portion and the second connecting portion are also respectively located on opposite sides of the silicon photonic chip.

9. The optical module as described in claim 1, characterized in that, The coefficient of thermal expansion of the first reinforcing plate is less than 7.2 ppm / ℃, and the Young's modulus of the first reinforcing plate is greater than 50 GPa.

10. The optical module as described in claim 1, characterized in that, The circuit board has a through-hole connecting the first surface and the second surface. The silicon photonic chip includes an optical port portion located within the through-hole and a mounting portion that is attached to the circuit board. The first reinforcement plate is located between the through-hole and the photonic chip.

11. The optical module as described in claim 1, characterized in that, The first reinforcing plate is an AlN plate, a silicon plate, or an Al2O3 plate.

Images