Component and connecting carrier

Abstract

Component comprising: a connector carrier (1), a frame (2) and an enclosure body (3), wherein the connector carrier (1), the enclosure body (3) and / or the frame (2) have different coefficients of thermal expansion; a semiconductor chip (4) which is mechanically and electrically connected to the connector carrier (1); and a metal layer (5) which is arranged between the connector carrier (1) and the frame (2), wherein the enclosure body (3) surrounds the semiconductor chip (4) and borders the connector carrier (1) and the frame (2); the metal layer (5) is not electrically connected; and the metal layer (5) extends beyond the frame (2) in a lateral direction.

Description

A component and a connecting carrier are specified. The documents WO 2011 / 026786 A1 , DE 11 2005 003 652 T5 , US 2013 / 0 328 070 A1 and US 2014 / 0 021 493 A1 each describe a component. One task to be solved is to specify a component that exhibits improved mechanical stability. Another task to be solved is to specify a component with improved optical properties. A further task to be solved is to specify a mounting bracket for such a component. According to at least one embodiment of the component, the component includes a connection carrier. The connection carrier is a component of the component that enables the electrical connection of another component of the component. Furthermore, the connection carrier is a mechanically supporting component of the component, which mechanically supports and carries other components, in particular all other components of the component. The connection carrier comprises, for example, a base body formed from an electrically insulating material. Contacts and / or conductive traces are applied to or incorporated into the base body, enabling electrical contact with other components of the component. The connection carrier can, for example, be a printed circuit board or a ceramic substrate with contacts. According to at least one embodiment of the component, the component includes a frame. The frame is a component of the component that partially or completely surrounds an area on the connecting beam. The frame projects beyond the connecting beam on its upper surface along a vertical direction. This vertical direction is perpendicular or transverse to any lateral directions. The lateral directions are parallel to a principal extension plane of the connecting beam. For example, the frame is designed like a wall or a border that completely surrounds a section on the upper surface of the connecting beam in the lateral directions. According to at least one embodiment of the component, the component comprises an enclosing body. The enclosing body is, for example, a body that is electrically insulating and that encloses at least one component of the component, either partially or completely. The enclosing body can be formed from a plastic material, which is applied to the top of the connector carrier, for example, by potting, injection molding, or compression molding. For example, the frame, together with the connector carrier, defines a cavity on the top of the connector carrier, which is completely surrounded by the frame in lateral directions. This cavity can then be at least partially filled with the enclosing body. According to at least one embodiment of the component, the enclosing body, the connecting support, and / or the frame have different coefficients of thermal expansion. This can be achieved, for example, by using a base material that differs from the base material used to form the base body of the connecting support and / or the frame and / or the enclosing body. Here and in the following, a base material is defined as the material from which a component of the component largely consists. For example, the component of the component consists of at least 80% by weight, in particular at least 90% by weight, or entirely of the base material. For example, the connector carrier can be an FR4 printed circuit board whose base body is made of a plastic material such as a glass fiber-reinforced epoxy material. The frame can then be made of another plastic material such as a liquid crystal polymer (LCP) or polyphthalamide (PPA). The encapsulation body can, in turn, be made of an epoxy material and / or a silicone. For example, the difference in the coefficients of thermal expansion between the connector carrier and the frame in a lateral spatial direction is at least 1%, in particular at least 25% or at least 50%.For example, the difference in the coefficients of thermal expansion between the frame and the enclosing body in a lateral spatial direction is at least 1%, in particular at least 25% or at least 50%. For example, the coefficient of thermal expansion of epoxy resin is 185 ppm, the coefficient of thermal expansion of PPA is 100 ppm, and the coefficient of thermal expansion of LCP is 40-60 ppm. It is possible that the enclosing body also has a coefficient of thermal expansion that differs from the coefficients of thermal expansion of the connecting beam and the frame. In particular, at least two of the following components have coefficients of thermal expansion that differ from each other in at least one spatial direction: connecting beam, frame, enclosing body. For example, the difference in the coefficients of thermal expansion in a lateral spatial direction is then at least 1%, in particular at least 5% or at least 10%. According to at least one embodiment of the component, the component comprises a semiconductor chip that is mechanically and electrically connected to the terminal carrier. For example, the semiconductor chip can be electrically connected to contacts of the terminal carrier, allowing the semiconductor chip to be powered via the terminal carrier and thus be operable through it. The semiconductor chip can be, for example, an electronic and / or optoelectronic component. For example, the semiconductor chip could be a diode, an integrated circuit, a transistor, a light-emitting diode, or a laser diode. The semiconductor chip is mechanically and / or electrically connected to the terminal carrier, for example, by a solder material or an adhesive. According to at least one embodiment of the component, the component comprises a metal layer arranged between the terminal carrier and the frame. The metal layer has an extent in at least one lateral direction that is greater than the thickness of the metal layer in the vertical direction. For example, the extent in the lateral direction is at least 10 times, and in particular at least 100 times, greater than the extent in the vertical direction. The metal layer is preferably formed with a metal that exhibits high ductility. For example, the metal layer can contain or consist of one of the following metals: chromium, nickel, copper, gold, palladium. It is particularly possible that the metal layer consists of the same metal or the same metal combination as the contacts and / or the conductor tracks of the terminal carrier. According to at least one embodiment of the component, the encapsulation surrounds the semiconductor chip and abuts the connector carrier and the frame. In other words, the encapsulation is arranged such that the semiconductor chip abuts the encapsulation at its outer surface not covered by the connector carrier, for example, at its top and side surfaces. The semiconductor chip can, in particular, abut directly against the encapsulation. In this way, the encapsulation provides mechanical and chemical protection for the semiconductor chip. If the semiconductor chip is an optoelectronic component, the encapsulation can include further materials such as luminescence conversion materials and / or radiation-scattering materials and / or a filter material. According to at least one embodiment of the component, the metal layer is not electrically connected. The metal layer is therefore not a contact or conductor of the terminal carrier, but rather performs no electrical function within the component. In particular, the metal layer is not connected to any electrical or electronic component of the component and / or is electrically isolated from the electrical or electronic components of the component. This can be achieved, for example, by completely surrounding the metal layer with electrically insulating materials of the component, such as plastic materials. For example, the metal layer is positioned, at least in sections, between the connector and the frame. This means that the metal layer is located between the frame and the connector, at least in certain pre-selected areas. The metal layer can be in direct contact with at least one of the two components. For example, the metal layer is in direct contact with the base body of the connector. Between the metal layer and the frame, it is possible that other components of the part, such as an electrically insulating layer and / or an adhesive used for mechanically fastening the frame to the connector, are located. According to at least one embodiment, a component is specified comprising: a connector carrier, a frame and an enclosure body, wherein the connector carrier, the enclosure body and / or the frame have different coefficients of thermal expansion; a semiconductor chip that is mechanically and electrically connected to the connector carrier; and a metal layer that is arranged between the connector carrier and the frame, wherein the enclosure body surrounds the semiconductor chip and borders the connector carrier and the frame; and the metal layer is not electrically connected. The following considerations, among others, underlie the component described here. A component is a composite material consisting of different materials. In particular, the connecting carrier, the frame, the encapsulation body, and bonding materials such as adhesives and / or solder can be made of different materials with different coefficients of thermal expansion. If such a composite material is subjected to thermal stress, especially cyclic thermal stress, such as that which can occur during soldering and / or operation of the component, mechanical stresses arise at the interfaces of the different materials. This can result in the aforementioned components of the component delaminating from one another.If, for example, the outer shell separates from the frame, the mechanical stress can become so high that the delamination continues into the connecting carrier, resulting in a crack in the connecting carrier, for example in the base body of the connecting carrier. To protect the surface of the connector, epoxy-based coatings can be used, for example. Depending on the mechanical stress, this can ensure improved mechanical stability and prevent cracking. However, it has been found that the mechanical stress can be so high that even such a coating can crack, potentially damaging the connector. Another way to prevent damage to the mounting bracket is to use thick layers of adhesive between the different components, for example, between the mounting bracket and the frame. Such an adhesive should have high mechanical flexibility to compensate for the mechanical stress between the components. However, this has the disadvantage that the adhesive must be applied very thickly, making a defined adhesive structure impossible and / or incompatible with other design requirements of the component. The component described here is based, among other things, on the finding that inserting the metal layer between the mounting bracket and the frame is particularly effective at absorbing the mechanical stresses that occur. This protects the mounting bracket from damage. It has been found that even very thin metal layers are sufficient to adequately protect the mounting bracket. This has the advantage that the overall thickness of the component in the vertical direction is only minimally increased by the metal layer, and therefore this change in thickness is not visually perceptible to the end user. The component could, for example, be an optical sensor comprising at least two semiconductor chips. One of the semiconductor chips could be configured as a transmitter emitting electromagnetic radiation. This electromagnetic radiation could be, for example, infrared light or colored light, such as red or green light. Another of the semiconductor chips can be configured as a receiver, designed to detect a reflected portion of the electromagnetic radiation. This receiver could be, for example, a photodiode. With such a component, optical crosstalk can occur between the semiconductor chips. For example, the frame is attached to the connector carrier using an adhesive. Due to unwanted reflections from cover lenses or insufficient radiation shielding of the frame or the adhesive, electromagnetic radiation from the transmitter can reach the receiver. When this happens, the receiver detects a signal that should not be present given the sensor's intended application. During signal processing, this signal is then superimposed with a high level of background noise, negatively impacting the accuracy of the evaluation. It has been found that optical crosstalk through the adhesive, in particular, represents a significant source of interference. If the application of the component requires high signal detection accuracy, crosstalk, particularly through the adhesive, is considered critical. One way to reduce crosstalk would be to lengthen the path for light through the adhesive. This can be achieved, for example, by applying the adhesive in a minimum width. However, this increases the surface area required for the adhesive and thus the size of the component. Another possibility would be to recess the frame into the base body of the connector carrier, so that the adhesive is located within the base body of the connector carrier and thus no coupling of electromagnetic radiation into the adhesive is possible. However, this complicates the manufacturing of the component. Another option is to use a colored adhesive, for example, a black one. However, measurements have shown that such blackening of the adhesive is not sufficient to reduce the background noise to the desired extent. The component described here utilizes the idea that the metal layer positioned between the connector carrier and the frame prevents electromagnetic radiation from penetrating the adhesive and thus eliminates crosstalk. Alternatively, or in addition to the metal layer, a cover layer, such as a solder lacquer layer, can be used. According to at least one embodiment of the component, the metal layer projects beyond the frame in a lateral direction. The metal layer can then be partially covered by the enclosing body. This means, for example, that the metal layer can project into the section enclosed by the frame, which is at least partially filled with the enclosing body. In this way, the metal layer is partially covered by the enclosing body and partially by the frame. This makes it possible, in particular, for the metal layer to compensate for mechanical stresses transmitted from the enclosing body to the terminal carrier and / or the frame, thereby further improving the protection of the terminal carrier against damage. It is possible for the metal layer to be in direct contact with the enclosing body, or at least for a further electrically insulating layer to be arranged between the metal layer and the enclosing body.According to at least one embodiment of the component, the metal layer has at least two laterally separated areas. For example, the metal layer can be configured as two separate strips that extend at least partially between the frame and the connector carrier. In this way, for example, an electrically insulating layer and / or an adhesive can be located directly adjacent to the frame and the connector carrier in certain areas. The frame then adheres particularly well to the connector carrier. Furthermore, this embodiment is particularly advantageous if the frame portion of the frame, beneath which the metal layer is located, separates two sections on the connector carrier, with at least one semiconductor chip being applied to each of these sections.The metal layer with its two laterally separated areas ensures that no electrically conductive connection can form between the two sections. This significantly increases the component's ESD resistance, as voltage spikes and / or electrical charges cannot jump from one section of the connector to another via the metal layer. According to at least one embodiment of the component, the metal layer, running in a plane parallel to the main extension plane of the connecting support, partially or completely follows the path of the frame in a plane parallel to the main extension plane of the connecting support. That is, the metal layer can be located along the entire length of the frame between the frame and the connecting support, so that its path completely follows the path of the frame. Alternatively, the metal layer may be arranged only between adjacent sections of the connecting support, which are separated from each other by a frame member. In such sections separated by the frame member, the mechanical stress can be particularly high due to the fact that the encapsulation body, for example, exerts thermal stress on the frame and the connecting support from two lateral sides.The protection provided by the metal layer is therefore particularly effective in this area. According to at least one embodiment, the metal layer is covered on its exposed outer surfaces by an electrically insulating coating. This coating can be, for example, a lacquer layer, which may be epoxy-based. For instance, the lacquer layer could be a solder lacquer layer, which, for example, may be white on its upper surface facing away from the terminal carrier to increase reflectivity. Such an electrically insulating coating ensures, firstly, that the metal layer is isolated from other electrical and / or electronic components of the component. Secondly, the insulating coating can provide additional mechanical protection for the terminal carrier against damage.If the component is an optoelectronic component, the covering layer can also perform optical tasks, such as reflection or absorption of electromagnetic radiation. According to at least one embodiment of the component, the covering layer partially covers a base body and contacts of the terminal carrier. This means that, in this case, the covering layer is not only intended to electrically insulate the metal layer from other components of the component, but the covering layer can also cover a large portion of the surface of the terminal carrier not covered by the frame, for example, at least 60%, and in particular at least 75%. The covering layer is then, for example, a layer of solder resist that partially covers the base body and contacts of the terminal carrier. According to at least one embodiment of the component, the metal layer has a thickness, measured in the vertical direction, of at least 8 µm and at most 50 µm. For the mechanical protection of the terminal carrier against damage, a thickness of at least 12 µm, typically 30 µm, proves particularly advantageous. By using a metal instead of an electrically insulating material, even these small layer thicknesses are sufficient to provide adequate protection against mechanical damage. According to at least one embodiment of the component, the component comprises at least two sections, each section being separated from the other by a frame part of the frame, and each section comprising at least one semiconductor chip. In other words, the connector carrier is divided into two or more sections, each separated from the other by a frame part of the frame. For example, each section can be completely enclosed by the frame, with a frame part of the frame separating adjacent sections. The sections can thus have cavities separated from one another by the frame, with each cavity accommodating at least one semiconductor chip. The semiconductor chips in the cavities can then each be surrounded by the encapsulation material, which in the sections borders the connector carrier and the enclosing frame. The metal layer described here is then arranged at least between each frame section and the connector carrier. In this way, the component can be, for example, an optoelectronic component in which different sections contain different semiconductor chips. For instance, it could be a component in which light-emitting diode (LED) chips emitting light of different colors are arranged in different sections. Furthermore, it is possible that one of the sections contains a radiation-emitting semiconductor chip, such as an LED chip or a laser diode chip, and at least one other section contains a radiation-detecting semiconductor chip, such as a photodiode. In this way, the component could be designed for distance measurement. For example, the component could be used in a gesture control system. According to at least one embodiment of the component, the base area of ​​at least two of the sections differs from each other by at least 10%. This means that the component can, for example, have one section with a larger area and at least one with a smaller area. Due to the different dimensions of the sections, the thermal stresses on the two sides of the frame section, which separates the larger from the smaller section, can differ. In this case, too, the protective metal layer proves particularly advantageous, as it can compensate for the different mechanical stresses without cracking – unlike, for example, a layer of paint. According to at least one embodiment, each section is bounded laterally by a frame. That is, the frame completely surrounds each section, so that each section is assigned a cavity which is bounded by the connecting support and the frame on its underside and its side surfaces. According to at least one embodiment of the component, the adhesive directly borders the areas of the metal layer, the base body, and the frame. In this way, the adhesive can provide a particularly good mechanical connection between the connecting carrier and the frame. According to at least one embodiment, the metal layer has an opening offset from the semiconductor chip, which is at least partially filled with adhesive. This prevents air inclusions in the adhesive, which would otherwise lead to an interruption of the connection between the connector carrier and the frame. The opening ensures the escape of excess adhesive and air. The opening is positioned offset from the semiconductor chips so that electromagnetic radiation cannot pass through the opening and the adhesive within it from one semiconductor chip of the component to another. Several, or at least two, openings can be arranged spatially offset from each other in the different areas of the metal layer, so that a leak path for electromagnetic radiation can also be excluded. Furthermore, a connecting element is specified. This connecting element can be used, in particular, in a component described herein. This means that all features described in connection with the component are also disclosed for the connecting element, and vice versa. According to at least one embodiment of the terminal carrier, the terminal carrier comprises a base body formed with an electrically insulating material. For example, the terminal carrier is an FR4 printed circuit board in which the base body is formed by a filled epoxy material. According to at least one embodiment of the connector carrier, the connector carrier comprises at least one contact attached to a top surface of the base body. The contact is, for example, designed as a metal layer and can be configured to electrically connect and, if necessary, mechanically connect a semiconductor chip to the contact. In particular, the connector carrier comprises at least two contacts, such that a semiconductor chip can be electrically connected via the contacts. According to at least one embodiment, the terminal carrier comprises at least one metal layer attached to the top of the base body, wherein the metal layer is not intended for electrical contact and / or current supply. That is, unlike the contacts, the metal layer is positioned on the terminal carrier in such a way that electrical connection of the metal layer is not possible, or the metal layer is not electrically connected to any other components of the terminal carrier that would allow electrical connection of the metal layer during operation. For example, the terminal carrier may have contact points for external contacting of the terminal carrier, which are connected to the contacts of the terminal carrier by conductive traces. The metal layer is then not electrically connected to the contact points. According to at least one embodiment, a terminal carrier is specified, comprising: a base body formed with an electrically insulating material; at least one contact attached to a top surface of the base body; and at least one metal layer attached to the top surface of the base body, wherein the metal layer is not intended for electrical contacting and / or current supply. In the case of the terminal carrier, it is particularly possible that the contacts and the metal layer are formed with the same material, i.e., the same metal or the same metal compound. Furthermore, it is possible that the contacts and the metal layer are attached to the base body of the terminal carrier in the same manufacturing step, for example, by vapor deposition. It is also possible that the contacts and the metal layer have different thicknesses. In particular, the metal layer can be thicker than the contacts. According to at least one embodiment of the terminal carrier, an electrically insulating cover layer covers the base body on its upper surface, wherein each of the at least one contact is partially free of the cover layer and the metal layer is completely covered by the cover layer in areas of its outer surface not covered by the base body. In other words, the electrically insulating cover layer can ensure that the metal layer cannot be electrically connected. The electrically insulating cover layer can then be, for example, a lacquer layer, in particular a solder resist layer. The following section provides a more detailed explanation of the component and connecting carrier described here, using exemplary embodiments and the associated figures. Fig. 1 shows a schematic perspective view of an exemplary embodiment of a component described here. Figures 2 and 3 show schematic side views of a section of the component shown in Figure 1. Figure 4 provides a more detailed explanation of the operating principle of a component described here. Figures 5, 6 to 7 show schematic representations of exemplary embodiments of the components described here. Identical, similar, or similarly effective elements in the figures are marked with the same reference symbols. The figures and the relative sizes of the elements depicted within them are not to be considered to scale. Rather, individual elements may be exaggerated for clarity and / or to improve representation. The component shown in the figures comprises a connecting carrier 1 according to an embodiment of a connecting carrier described here. Fig. 1 shows a schematic perspective view of an embodiment of a component described herein. A section through the component along one of its principal extension directions is shown. The component comprises an embodiment of a terminal carrier 1 described herein. The terminal carrier 1 includes a base body 10. The base body 10 is formed from an electrically insulating material. The electrically insulating material is, for example, a filled epoxy material. Alternatively, the electrically insulating material may be a ceramic material. Furthermore, the terminal carrier 1 includes contacts 12, 13, which are provided for electrically connecting electrical components of the component, such as semiconductor chips 4. For example, a semiconductor chip 4 can be arranged on one of the contacts 12 and connected to another contact 13 of the terminal carrier 1 via a contact wire 6. The terminal carrier 1 further comprises an electrically insulating cover layer 11, which is, for example, a solder mask layer. The electrically insulating cover layer 11 can completely cover an exposed top surface of the base body 10, and parts of the contacts 12, 13 may also be covered by the electrically insulating cover layer 11. The terminal carrier 1 further comprises a metal layer 5. The metal layer 5 is not intended for the electrical connection of any other component of the terminal carrier 1 or of the entire component. The metal layer 5 is, for example, made of the same material as the contacts 12, 13 of the terminal carrier. For example, the contacts 12, 13 and the metal layer 5 contain or consist of copper. The component further comprises a frame 2, which, for example, is flush with the outer side surfaces of the connecting beam 1. The frame 2 projects beyond the connecting beam at its upper side in a vertical direction that is perpendicular to lateral directions running parallel to the main extension plane of the connecting beam 1. Figure 1 shows a crack 9 in the base body 10 of the connecting carrier 1, which can occur if the protective metal layer 5 is absent. In particular, separation between the encapsulation body 3 and the frame 2 under thermal stress creates mechanical stress that can cause the crack 9. This means that a defect originating in the assembly of the frame 2 and the encapsulation body 3 can propagate into the connecting carrier 1, and especially into the base body 10, without the metal layer 5, ultimately leading to a fracture of the component at that point. The component in question has sections 7a, 7b, and 7c, each of which is completely enclosed by the frame 2 in the lateral directions. The frame parts 21 separate adjacent sections 7a, 7b, and 7c from one another. The metal layer 5 is located, at least in the area of ​​the frame parts 21, between the base body 10 of the connecting carrier 1 and the frame 21. If mechanical stresses occur during heating or cooling of the component due to the different coefficients of thermal expansion between the frame 2, the connecting carrier 1, and the enclosure body 3, the metal layer 5 prevents cracks 9 from propagating into the connecting carrier 1. In this way, the component described here is particularly mechanically stable. The metal layer 5 has, for example, a thickness of 30 µm and can be thicker than the contacts 12 and 13. Due to the small thickness of the metal layer 5, the overall thickness of the component hardly increases. In sections 7a, 7b, and 7c, the cavities bounded by the frame 2 are each filled with an enclosure 3. If the semiconductor chips 4 are, for example, optoelectronic semiconductor chips, the enclosures 3 are at least radiolucent or even transparent. Contrary to what is shown in Fig. 1, it is also possible for the metal layer 5 to be arranged along the entire frame between the frame 2 and the connecting support 1. In this case, the metal layer 5 does not only run section by section, but completely along the frame 2 between the frame 2 and the connecting support 1. In conjunction with Fig. 2 and Fig. 3, two different embodiments of the metal layer 5 are indicated. Figure 2 shows that the metal layer 5 is designed as a single, continuous metal layer with a width in a lateral direction perpendicular to the main extension direction of the frame that is greater than the width of the frame. The metal layer 5 therefore projects beyond the frame in the lateral direction and is located partially within the cavity enclosed by the frame in sections 7a, 7b, and 7c. That is, the enclosing body 3 partially covers the metal layer 5. Additional materials, such as the electrically insulating cover layer 11 and / or an adhesive, can be arranged between the metal layer 5, the frame 2, and the enclosing body 3. It is also possible that the metal layer 5 and the frame 2 are in direct contact with each other, at least partially. In contrast to the embodiment shown in Fig. 2, the metal layer 5 in the embodiment shown in Fig. 3 has two laterally separated regions 51, 52, so that along a central axis of the frame 2, no material of the metal layer 5 is arranged between the frame 2 and the connecting carrier. In other words, the metal layer is divided into two electrically isolated regions. The metal layer is deliberately placed only where the mechanical stress is greatest during thermal cycling. This is at the point where the enclosure 3, the frame 2, and the connecting carrier 3 meet. The different coefficients of thermal expansion, which arise due to the different materials of the connecting carrier 1, frame 2, and enclosure 3, have the greatest effect at these points. Furthermore, separating the metal layer 2 into at least two separate areas 51, 52 increases the ESD resistance, as there is no risk of electrical charges jumping between the different sections 7a, 7b, 7c of the component. In conjunction with Figures 1, 2, and 3, a component is described that has three sections 7a, 7b, and 7c, each separated from the others by a frame section 21. However, unlike the figures, the component described here can also have more or fewer sections. In particular, it is also possible that the component has exactly one section that is completely surrounded laterally by the frame 2. In this case, it is especially possible that the metal layer 5 completely follows the path of the frame, so that the metal layer 5 completely surrounds the semiconductor chip 4 in a frame-like manner. Figure 4 illustrates the operation of a component described here. The component in Figure 4 comprises a terminal carrier 1 with a base body 10 on which contacts 12 and 13 are arranged for contacting the semiconductor chips 4. The semiconductor chips 4 include, for example, a first semiconductor chip 4a, which is configured as a transmitter. For example, this first semiconductor chip 4a is formed by a light-emitting diode chip that emits electromagnetic radiation 8 during operation. A second semiconductor chip 4b of the semiconductor chips 4 can be configured as a receiver, which is, for example, a photodiode designed to detect the electromagnetic radiation 8 generated by the first semiconductor chip 4a during operation. In the component shown in Fig. 4, the frame 2 is attached to the connector carrier by means of an adhesive 7. For example, the adhesive 7 borders directly on the base body 10 and the frame 2. As can be seen in Fig. 4, crosstalk of electromagnetic radiation 8 is possible through the adhesive 7 from one section 7b of the component with the first semiconductor chip 4a to another section 7c of the component with the second semiconductor chip 4b. In this way, a background noise is introduced into the detected signal of the second semiconductor chip 4b, which is disruptive for the evaluation of the signal. In contrast to Fig. 4, Fig. 5 shows an embodiment of a component described herein, in which the laterally separated areas 51, 52 of the metal layer 5 described above extend along a central axis of the frame 2 at its edge. The adhesive 7 is arranged between the areas 51, 52, thus shielding it from the electromagnetic radiation 8 and preventing crosstalk of the electromagnetic radiation 8 between sections 7b, 7c. Figure 6 shows a top view of an embodiment of such a component. In this view, the areas 51 and 52 of the metal layer are located exclusively along the frame part 21, which separates the adjacent sections. Offset from the semiconductor chips 4a and 4b, openings 5a can be provided in the metal layer, which are partially filled with adhesive 7. These openings 5a serve to prevent air inclusions in the adhesive 7, which would reduce the adhesive surface area between the adhesive and the frame on the one hand, and between the adhesive 7 and the connector 1 on the other. The top view in Fig. 7 shows that the metal layer 5 can be formed around the entire circumference. It can then also be used as a spacer. Furthermore, Fig. 7 shows that the openings 5a can be positioned not only offset from the semiconductor chips 4a, 4b, but also offset from each other. In this way, a leakage path for electromagnetic radiation is effectively prevented. Priority is claimed for the German patent application DE 102016125909.8. Reference symbol list 1 Connector carrier 10 Base body 11 Cover layer 12 Contact 13 Contact 2 Frame 21 Frame part 3 Enclosure body 4 Semiconductor chip 4a First semiconductor chip 4b Second semiconductor chip 5 Metal layer 5a Opening 51 Area 52 Area 6 Contact wire 7 Adhesive 7a Section 7b Section 7c Section 8 Electromagnetic radiation

Claims

Component comprising: a connector carrier (1), a frame (2) and an enclosure body (3), wherein the connector carrier (1), the enclosure body (3) and / or the frame (2) have different coefficients of thermal expansion; a semiconductor chip (4) which is mechanically and electrically connected to the connector carrier (1); and a metal layer (5) which is arranged between the connector carrier (1) and the frame (2), wherein the enclosure body (3) surrounds the semiconductor chip (4) and borders the connector carrier (1) and the frame (2); the metal layer (5) is not electrically connected; and the metal layer (5) extends beyond the frame (2) in a lateral direction. Component according to the previous claim, wherein the metal layer (5) is partially covered by the encasing body (3). Component according to one of the preceding claims, wherein the metal layer (5) has at least two laterally separated areas (51, 52). Component according to one of the preceding claims, wherein the metal layer (5) follows the profile of the frame (2) in a plane parallel to a principal extension plane of the connecting support in sections or completely. Component according to one of the preceding claims, wherein the metal layer (5) is covered on its exposed outer surface by an electrically insulating cover layer (11). Component according to the previous claim, wherein the cover layer (11) partially covers a base body (10) and contacts (12, 13) of the connecting carrier (10). Component according to one of the preceding claims, wherein the metal layer (5) has a thickness between at least 8 µm and at most 50 µm. Component according to one of the preceding claims comprising at least two sections (7a, 7b, 7c), wherein the sections (7a, 7b, 7c) are each separated from each other by a frame part (21) of the frame (2) and each section (7a, 7b, 7c) comprises at least one semiconductor chip (4). Component according to the previous claim, wherein the base areas of at least two of the sections (7a, 7b, 7c) differ from each other by at least 10%. Component according to one of the two preceding claims, wherein each section (7a, 7b, 7c) is bounded in lateral directions by the frame (2). Component according to one of the preceding claims, wherein the metal layer (5) has at least two laterally separated areas (51, 52), and an adhesive (7) is arranged between the areas (51, 52), wherein the adhesive (7) mechanically connects a base body (10) of the connecting carrier (1) to the frame (2). Component according to the previous claim, wherein the adhesive (7) is directly adjacent to the areas (51, 52) of the metal layer (5), the base body (10) and the frame (2). Component according to one of the preceding claims, wherein the metal layer (5) has an opening (5a) offset from the semiconductor chip (4), which is at least partially filled with adhesive (7). Connecting carrier (1) comprising: - a base body (10) formed with an electrically insulating material, - at least one contact (12, 13) attached to a top surface of the base body (10), - at least one metal layer (5) attached to the top surface of the base body (10), wherein the metal layer (5) is not intended for electrical contacting and / or current supply, and - an electrically insulating cover layer (11) covering the base body (10) on the top surface, wherein each of the at least one contact (12, 13) is partially free of the cover layer (11) and the metal layer (5) is completely covered by the cover layer (11) in areas of its outer surface not covered by the base body (10).

Images