Light emitting device

Abstract

A light emitting device has high light extraction efficiency and can suppress peeling of a lead and a resin portion. The light emitting device includes a first substrate having a first lead, a second lead at a position separate from the first lead, and a resin portion holding the first lead and the second lead; a second substrate disposed on the second lead, having a base portion and a first conductive portion on an upper surface of the base portion; at least one light emitting element disposed on the second substrate and electrically connected to the first conductive portion; a first lead wire electrically connecting the first lead and the first conductive portion; and a wall portion spanning and covering the first lead and an upper surface of the second lead, the wall portion having a height lower than a height of the second substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to a light emitting device. BACKGROUND

[0002] A light emitting device using a light emitting element such as an LED is used in various devices including a backlight and a lighting fixture for a display and the like in order to easily obtain high light emission efficiency. In Patent Literature 1, a light emitting device provided with a resin portion having a positive and negative pair of leads and a recess, and a light emitting element placed on the bottom surface of the recess of the resin portion is disclosed.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Laid-Open No. 2013-125776

[0006] A light emitting device requires further improvement in light extraction efficiency and reliability. In order to improve reliability, for example, peeling of a lead and a resin portion is required to be suppressed. SUMMARY

[0007] Therefore, an object of the present application is to provide a light emitting device having high light extraction efficiency and capable of suppressing peeling of a lead and a resin portion.

[0008] The light emitting device of one embodiment includes a first substrate including a first lead, a second lead separated from the first lead, and a resin portion holding the first lead and the second lead; a second substrate disposed on the second lead, including a base portion and a first conductive portion on an upper surface of the base portion; at least one light emitting element disposed on the second substrate and electrically connected to the first conductive portion; a first wiring electrically connecting the first lead and the first conductive portion; and a wall portion spanning and covering upper surfaces of the first lead and the second lead, the wall portion having a height lower than that of the second substrate.

[0009] According to the light emitting device of one embodiment of the present application, a light emitting device having high light extraction efficiency and capable of suppressing peeling of a lead and a resin portion can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1A FIG. 1 is a schematic plan view of a light emitting device of one embodiment.

[0011] FIG. 1B FIG. 2 is a schematic cross-sectional view taken along line IB-IB in FIG. 1. FIG. 1A

[0012] FIG. 1C FIG. 4 is a schematic cross-sectional view taken along line IC-IC in FIG. 1. FIG. 1A

[0013] ​​FIG. 2A is a schematic plan view of the first substrate of the light-emitting device of this embodiment.

[0014] FIG. 2B is a schematic bottom view of the first substrate of the light-emitting device of this embodiment.

[0015] FIG. 2C is a schematic plan view of Modification 1 of the first substrate of the light-emitting device of this embodiment.

[0016] FIG. 3 is a schematic cross-sectional view of Modification 1 of the light-emitting device of this embodiment.

[0017] FIG. 4A is a schematic plan view of Modification 2 of the light-emitting device of this embodiment.

[0018] FIG. 4B is a schematic cross-sectional view of FIG. 4A the IVB-IVB line shown in FIG. 8.

[0019] FIG. 4C is a schematic cross-sectional view of Modification 3 of the light-emitting device of this embodiment.

[0020] FIG. 5 is a schematic plan view of the first substrate and the second substrate of the light-emitting device of this embodiment.

[0021] FIG. 6 is a schematic plan view of Modification 4 of the light-emitting device of this embodiment.

[0022] FIG. 7A is a schematic plan view showing the first substrate, the second substrate, the first lead wire, the second lead wire, the light-emitting element, and the protective element in the light-emitting device of this embodiment.

[0023] FIG. 7B is a schematic plan view showing the first substrate, the second substrate, the first lead wire, the second lead wire, the light-emitting element, and the protective element in Modification 5 of the light-emitting device of this embodiment.

[0024] FIG. 7C is a schematic plan view showing the first substrate, the second substrate, the first lead wire, the second lead wire, the light-emitting element, and the protective element in Modification 6 of the light-emitting device of this embodiment.

[0025] FIG. 7D is a schematic plan view showing the first substrate, the second substrate, the first lead wire, the second lead wire, the light-emitting element, and the protective element in Modification 6A of the light-emitting device of this embodiment.

[0026] FIG. 8A is a schematic cross-sectional view of Modification 7 of the light-emitting device of this embodiment.

[0027] FIG. 8B is a schematic cross-sectional view of Modification 8 of the light-emitting device of this embodiment.

[0028] FIG. 8C is a schematic cross-sectional view of Modification 8A of the light-emitting device of this embodiment.

[0029] FIG. 9A is a schematic plan view of Modification 9 of the light-emitting device of this embodiment.

[0030] FIG. 9B is a schematic cross-sectional view of the XB-XB line shown in FIG. 9A

[0031] FIG. 10A is a schematic plan view of Modification 10 of the light-emitting device of this embodiment.

[0032] FIG. 10B is a schematic cross-sectional view of the XB-XB line shown in FIG. 10A

[0033] is a schematic cross-sectional view of the XC-XC line shown in FIG. 10C FIG. 10A

[0034] Explanation of Reference Numerals

[0035] 1000, 1000A, 1000B, 1000C, 1000D, 1000E, 1000F, 1000G: Light-emitting device

[0036] 100, 100A: First substrate

[0037] 10: Lead wire

[0038] 11: First lead wire

[0039] 12: Second lead wire

[0040] 13: Third lead wire

[0041] 15: Resin portion

[0042] 200: Second substrate

[0043] 20: Base portion

[0044] 21: First conductive portion

[0045] 22: Second conductive portion

[0046] 300: Light-emitting element

[0047] 350: Light guide member

[0048] ​​​401: first lead wire

[0049] 402: second lead wire

[0050] 500: wall portion

[0051] 600: joint member

[0052] 700: reflection member

[0053] 710: underfill

[0054] 800: light-transmissive member

[0055] 900: cover member DETAILED DESCRIPTION

[0056] The light-emitting device of the present disclosure will be described in detail below with reference to the drawings. The light-emitting device of the present disclosure is exemplary and is not limited to the light-emitting device described below. In the following description, terms indicating specific directions and positions (for example, "upper", "lower", and other terms including these terms) are sometimes used. These terms are merely used for easy understanding with reference to the relative directions and positions in the drawings. In addition, the size or positional relationship of the constituent elements shown in the drawings, and the like, are sometimes exaggerated for easy understanding, and sometimes do not reflect the size in the actual light-emitting device or the size relationship between the constituent elements in the actual light-emitting device.

[0057] (Embodiment 1)

[0058] Based on FIGS. 1A-9B A light-emitting device 1000 of Embodiment 1 of the present disclosure will be described. The light-emitting device 1000 includes a first substrate 100, a second substrate 200, a light-emitting element 300, a first lead wire 401, and a wall portion 500. The first substrate 100 has a first lead wire 11, a second lead wire 12 located at a position separate from the first lead wire 11, and a resin portion 15 holding the first lead wire 11 and the second lead wire 12. The first lead wire 11 and the second lead wire 12 are arranged in a first direction. The first lead wire 11 and the second lead wire 12 are arranged in a second direction orthogonal to the first direction. The first lead wire 11 and the second lead wire 12 are arranged in a third direction orthogonal to the first direction and the second direction. FIG. 1A In the present embodiment, the first direction is a direction along the Y direction. The second direction is a direction orthogonal to the first direction. In the present embodiment, the second direction is a direction along the X direction. The third direction is a direction orthogonal to the first direction and the second direction. FIG. 1A In the present embodiment, the first direction is a direction along the Y direction. The second direction is a direction orthogonal to the first direction. In the present embodiment, the second direction is a direction along the X direction. The third direction is a direction orthogonal to the first direction and the second direction. FIG. 1AIn the present embodiment, the third direction is a direction along the Z direction. The second substrate 200 is disposed on the second lead 12. The second substrate 200 has a base 20 and a first conductive portion 21 on an upper surface of the base 20. At least one light emitting element 300 is disposed on the second substrate 200. The light emitting element 300 is electrically connected to the first conductive portion 21. A first lead wire 401 electrically connects the first lead 11 and the first conductive portion 21. A wall portion 500 spans and covers upper surfaces of the first lead 11 and the second lead 12. A height H5 of the wall portion 500 is lower than a height H2 of the second substrate 200. In the present specification, the height of each portion refers to the maximum distance in the third direction (Z direction) from the uppermost surface of the second lead 12 to the upper surface of each portion. In addition, the uppermost surface of the second lead 12 refers to the upper surface of the second lead 12 located in the +Z direction (upper direction) in the third direction.

[0059] Because the wall portion 500 spans and covers the upper surfaces of the first lead 11 and the second lead 12, the first lead 11 and the second lead 12 of the light emitting device 1000 are held by the wall portion 500. Therefore, deformation of the first lead 11 and / or the second lead 12 caused by heat or the like from the light emitting element can be suppressed. Thus, peeling of the lead and the resin portion can be suppressed.

[0060] Because the height H5 of the wall portion 500 is lower than the height H2 of the second substrate 200, the light emitting device 1000 can suppress the case where light from the light emitting element 300 is blocked by the wall portion 500. Thus, the light extraction efficiency of the light emitting device can be improved.

[0061] The first substrate 100 has a lead 10 and a resin portion 15 that holds the lead 10. The lead 10 includes a first lead 11 and a second lead 12. For example, as shown in FIG. 1, the lead 10 can include only the first lead 11 and the second lead 12, as shown in FIG. 2, the lead 10 can include the first lead 11, the second lead 12, and a third lead 13. FIG. 2C FIG. 2A As shown in FIG. 3, the lead 10 can include the first lead 11, the second lead 12, and a third lead 13. FIG. 2A The first substrate 100 shown in FIG. 3 has the third lead 13 located at a position separate from the first lead 11 and the second lead 12. In the case where the first substrate 100 has the third lead 13, it is preferable that the wall portion 500 span and cover the upper surfaces of the second lead 12 and the third lead 13. In this way, because the second lead 12 and the third lead 13 are held by the wall portion 500, peeling of the lead 10 and the resin portion 15 can be suppressed. The wall portion 500 preferably surrounds the second substrate 200 without a gap in plan view. Thus, the strength of the wall portion 500 is improved, and therefore, the force with which the wall portion 500 holds the first lead 11 and the second lead 12 can be improved. Thus, the case where the lead and the resin portion peel can be suppressed. In addition, the lead 10 can include two or more leads, and can include four or more leads.

[0062] ​The area of ​​the first lead 11 and the second lead 12 when viewed from above is not particularly limited, but it is preferable that the area of ​​the second lead 12 is larger than the area of ​​the first lead when viewed from above. Since the second substrate 200 on which the light-emitting element 300 is disposed is arranged on the second lead 12, the heat dissipation of the light-emitting device 1000 can be improved by making the area of ​​the second lead 12 larger.

[0063] When the first substrate 100 has a first lead 11, a second lead 12, and a third lead 13, it is preferable that the area of ​​the second lead 12 is larger than the area of ​​each of the first and third leads when viewed from above. This improves the heat dissipation of the light-emitting device 1000. Furthermore, when the first substrate 100 has a first lead 11, a second lead 12, and a third lead 13, it is preferable that the area of ​​the second lead 12 is larger than the combined area of ​​the first and third leads when viewed from above. This further improves the heat dissipation of the light-emitting device 1000.

[0064] like FIG. 2A As shown, the first lead 11 and the second lead 12 are opposite each other in the first direction (Y direction). In top view, it is preferable that the second lead 12 and the third lead 13 are opposite each other in the first direction (Y direction), and the first lead 11 and the third lead 13 are opposite each other in the second direction (X direction). This arrangement of the first lead 11 and the third lead 13 in the second direction (X direction) facilitates miniaturization of the light-emitting device 1000 in the first direction (Y direction). Furthermore, since the second lead 12 is opposite to both the first lead 11 and the third lead 13 in the first direction (Y direction), it is easier to lengthen the second lead 12 in the second direction (X direction). This increases the area of ​​the second lead 12 in top view, thereby improving the heat dissipation of the light-emitting device 1000.

[0065] like FIG. 2AAs shown, in plan view, at least a part of the outer edge 11A of the opposing first lead 11 in the first direction (Y direction) is preferably parallel to at least a part of the outer edge 12A of the second lead 12. Thereby, the width of the gap of the opposing first lead 11 and second lead 12 is constant in a certain region is increased. For example, in the case where the resin portion 15 is formed by injecting the resin material before curing between the first lead 11 and the second lead 12, by increasing the width of the gap of the opposing first lead 11 and second lead 12 which is constant in a certain region, it is possible to suppress the case where the resin material before curing is not filled. In the present specification, parallel means a case where a variation within ±3° is allowed. Similarly, in plan view, at least a part of the outer edge 12A of the opposing second lead 12 in the first direction (Y direction) is preferably parallel to at least a part of the outer edge 13A of the third lead 13. Further, in plan view, at least a part of the outer edge 11B of the opposing first lead 11 in the second direction (X direction) is preferably parallel to at least a part of the outer edge 13B of the third lead 13.

[0066] In plan view, the first lead 11 and the third lead 13 are preferably left-right symmetrical with respect to the center line of the first substrate 100 parallel to the first direction (Y direction). Thereby, the design of the mounting substrate on which the light emitting device is mounted becomes easy. In the present specification, left-right symmetrical means a case where a variation within ±3% of the shape is allowed.

[0067] As shown in FIG. 1, the light emitting device 1 includes a first substrate 100, a second substrate 200, a first lead 11, a second lead 12, a third lead 13, a first light emitting element 21, a second light emitting element 22, and a resin portion 15. FIG. 2BAs shown, preferably, the lower surface of the first lead 11 and the lower surface of the second lead 12 are exposed from the resin portion 15. Thereby, it is easy to supply power from the lower surface of the first lead 11 and the lower surface of the second lead 12. In addition, heat from the light emitting device is easily transmitted from the lower surface of the first lead 11 and / or the second lead 12 to a mounting substrate on which the light emitting device is mounted. Thereby, it is possible to improve heat dissipation of the light emitting device. In the case where the lower surface of the first lead 11 and the lower surface of the second lead 12 are exposed from the resin portion 15, preferably, the lower surface of the first lead 11, the lower surface of the second lead 12, and the lower surface of the resin portion 15 are located on the same plane. Thereby, since the resin portion 15 does not extend from the lower surface of the first lead 11 and the lower surface of the second lead 12, it is easy to supply power from the lower surface of the first lead 11 and the lower surface of the second lead 12. In addition, the lower surface of the first lead 11, the lower surface of the second lead 12, and the lower surface of the resin portion 15 are located on the same plane, whereby the side surface of the first lead 11 on the lower surface side of the first lead 11 is covered with the resin portion 15, and the side surface of the second lead 12 on the lower surface side of the second lead 12 is covered with the resin portion 15. That is, the side surface of the first lead 11 on the lower surface side of the first lead 11 is inhibited from being exposed from the resin portion 15, and the side surface of the first lead 11 on the lower surface side of the first lead 11 is inhibited from being exposed from the resin portion 15. Therefore, it is possible to increase the contact area of the side surface of the first lead 11 and the side surface of the second lead 12 with the resin portion 15. By increasing the contact area of the first lead 11 and the second lead 12 with the resin portion 15, it is possible to inhibit peeling of the lead from the resin portion. In the present specification, the same plane means a case where a variation of each surface is within ± 15 μm.

[0068] In the case where the first substrate 100 has the first lead 11, the second lead 12, and the third lead 13, preferably, the second lead 12 is not electrically connected to the light emitting element 300. Since the second substrate on which the light emitting element is placed is disposed on the second lead 12, the second lead 12 requires heat dissipation property compared to the first lead 11 and the third lead 13. Since the second lead 12 is not electrically connected to the light emitting element 300, heat dissipation design of a mounting substrate on which the light emitting device 1000 is mounted becomes easy. That is, in a portion of the mounting substrate to which the second lead 12 is joined, it is also possible not to consider electrical connection to the light emitting element 300. Therefore, heat dissipation design of the mounting substrate becomes easy.

[0069] The wall portion 500 which spans and covers the upper surfaces of the first lead 11 and the second lead 12 and the resin portion 15 which holds the first lead 11 and the second lead 12 can be integrally formed as shown in FIG. 1C , or can be separately formed as shown in FIG. 3The wall portion 500 is formed separately. In the case where the wall portion 500 is integrated with the resin portion 15, the wall portion 500 is a part of the resin portion 15. In addition, in the case where the wall portion 500 is integrated with the resin portion 15, the first substrate 100 has the wall portion 500. In the case where the wall portion 500 is integrated with the resin portion 15, the wall portion 500 will be described below FIG. 1C The resin portion 15 located in the +Z direction (upper direction) from the uppermost surface of the second lead wire 12 in the Z direction (third direction) is the wall portion 500. Since the wall portion 500 is integrated with the resin portion 15, peeling of the lead wire and the resin portion is easily suppressed. In addition, even in the case where the resin portion 15 and the wall portion 500 of the first lead wire 11 and the second lead wire 12 are separate, peeling of the lead wire and the resin portion is suppressed by causing the wall portion 500 to span and cover the upper surfaces of the first lead wire 11 and the second lead wire 12. Specifically, the wall portion 500 provided on the resin portion 15 spans and covers the upper surfaces of the first lead wire 11 and the second lead wire 12, and thus the first lead wire 11 and the second lead wire 12 are held by the wall portion 500. Therefore, deformation of the first lead wire 11 and / or the second lead wire 12 due to heat or the like is suppressed. Thus, peeling of the lead wire and the resin portion is suppressed.

[0070] The width W5 of the wall portion 500 and the height H5 of the wall portion 500 in the cross section are not particularly limited, but the ratio (H5 / W5) of the height H5 of the wall portion 500 to the width W5 of the wall portion 500 in the cross section is preferably 0.2 or more and less than 1. By causing the ratio (H5 / W5) of the height H5 of the wall portion 500 to the width W5 of the wall portion 500 in the cross section to be 0.2 or more, the height H5 of the wall portion 500 is made long, and thus the strength of the wall portion 500 is improved. By causing the ratio (H5 / W5) of the height H5 of the wall portion 500 to the width W5 of the wall portion 500 in the cross section to be less than 1, the width W5 of the wall portion 500 is made long, and thus the strength of the wall portion 500 is improved. That is, it is preferable to set the width W5 of the wall portion 500 and / or the height H5 of the wall portion 500 so that the strength of the wall portion 500 is not excessively low. In addition, if the width W5 of the wall portion 500 and / or the height H5 of the wall portion 500 is made excessively long in order to improve the strength of the wall portion 500, light from the light emitting element is easily blocked by the wall portion 500. Therefore, in consideration of the strength of the wall portion 500, it is preferable to set the width W5 of the wall portion 500 and / or the height H5 of the wall portion 500 so that light from the light emitting element is difficult to be blocked by the wall portion 500. In the present specification, the width W5 of the wall portion 500 refers to the shortest distance from the inner edge of the wall portion 500 to the outer edge of the wall portion 500 in the plan view.

[0071] As FIG. 1A , FIG. 1CAs shown, the outer side surface of the resin portion 15 and the outer side surface of the wall portion 500 can also be the same plane. Since the outer side surface of the resin portion 15 and the outer side surface of the wall portion 500 are the same plane, it is easy to make the light emitting device small. For example, since the outer side surface of the resin portion 15 and the outer side surface of the wall portion 500 are the same plane, the resin portion 15 does not have an extension portion 15A extending from the outer edge of the wall portion 500 in the top view described later. Therefore, since the outer side surface of the resin portion 15 and the outer side surface of the wall portion 500 are the same plane, it is easy to make the light emitting device small. As shown in FIG. 4A , FIG. 4B As shown in the light emitting device 1000B, the resin portion 15 can have an extension portion 15A extending from the outer edge of the wall portion 500 in the top view. The height of the extension portion 15A is preferably lower than the height of the wall portion 500. Since the height of the extension portion 15A is lower than the height of the wall portion 500, it is possible to suppress the light from the light emitting element from being blocked by the extension portion 15A. For example, the upper surface of the extension portion 15A can also be in the same plane as the upper surface of the first lead 11 and the upper surface of the second lead 12. By providing the resin portion 15 with the extension portion 15A, it is possible to, for example, operate the light emitting device by gripping the extension portion 15A with tweezers. Thereby, it is possible to suppress contact with the light emitting element and the like, and thus the reliability of the light emitting device is improved. As shown in FIG. 4C In the case where the wall portion 500 and the resin portion 15 are separate, since the resin portion 15 has the extension portion 15A extending from the outer edge of the wall portion 500, it is easy to form the wall portion 500 on the resin portion 15. For example, by dripping or drawing the material of the wall portion before curing on the resin portion 15 and curing the material of the wall portion, it is possible to form the wall portion 500 on the resin portion 15.

[0072] As shown in FIG. 5As shown, the second substrate 200 is disposed on the second lead 12. The second substrate 200 has a base 20, a first conductive portion 21, and a second conductive portion 22. The first conductive portion 21 and / or the second conductive portion 22 can be a single layer or multiple layers stacked together. The first conductive portion 21 is located on the upper surface of the base 20. The second conductive portion 22 is separated from the first conductive portion 21 and is located on the upper surface of the base 20. The first conductive portion 21 and the second conductive portion 22 are preferably arranged in a second direction (X direction). This facilitates miniaturization of the light-emitting device 1000 in the first direction (Y direction). The second substrate 200 can be fixed to the second lead 12 using a known adhesive such as epoxy resin, silicone resin, or metal paste. Examples of metal pastes include silver paste, aluminum paste, and gold paste. The second substrate 200 is preferably fixed to the second lead 12 using silver paste. Since silver paste has a higher thermal conductivity than aluminum paste, heat from the second substrate 200 can be easily transferred to the second lead 12 by using silver paste as an adhesive. This improves the heat dissipation of the light-emitting device. Furthermore, since silver paste is less expensive than gold paste, using silver paste as a bonding component reduces the component costs of the light-emitting device.

[0073] Preferably, the upper surface of the base 20 is flat. By making the upper surface of the base 20 flat, it is more effective to suppress the blocking of light from the light-emitting element by the base 20 compared to having sidewalls surrounding the light-emitting element on the base 20. Therefore, by making the upper surface of the base 20 flat, the light extraction efficiency of the light-emitting device 1000 can be improved. In addition, in this specification, flat means that a variation within ±15 μm is allowed.

[0074] like FIG. 1A As shown, the light-emitting device 1000 has a first wire 401 and a second wire 402. The first wire 401 electrically connects the first lead 11 and the first conductive part 21. FIG. 1A As shown in the light-emitting device 1000, the second wire 402 can electrically connect the third wire 13 and the second conductive part 22, or as... FIG. 6 As shown in the light-emitting device 1000D, the second wire 402 electrically connects the second lead 12 and the second conductive part 22. Preferably, the first wire 401 and the second wire 402 are arranged in the second direction (X direction). This makes it easier to miniaturize the light-emitting device 1000 in the first direction (Y direction).

[0075] The first conductive wire 401 and the second conductive wire 402 can use a publicly known conductive wire. The first conductive wire 401 is preferably a band-shaped wire. The band-shaped wire is elongated in a band shape, and the cross-sectional shape of the band-shaped wire is substantially rectangular. By using a band-shaped wire as the first conductive wire 401, the strength of the first conductive wire 401 is easily increased as compared with the case where a wire having a substantially circular cross-sectional shape is used. For example, in the case where the height of the first conductive wire 401 is the same, since the cross-sectional shape of the first conductive wire 401 is substantially rectangular, the area of the first conductive wire 401 in the cross section is easily increased as compared with the case where the cross-sectional shape of the first conductive wire 401 is substantially circular. Since the area of the first conductive wire 401 in the cross section can be increased, by using a band-shaped wire as the first conductive wire 401, the strength of the first conductive wire 401 is easily increased. In addition, in the case where the area of the first conductive wire 401 in the cross section is the same, since the cross-sectional shape of the first conductive wire 401 is substantially rectangular, the height of the first conductive wire 401 is easily decreased as compared with the case where the cross-sectional shape of the first conductive wire 401 is substantially circular. Thus, the case where light from the light-emitting element is blocked by the first conductive wire 401 is easily suppressed. In addition, in the cross section of the first conductive wire, the short side of the substantially rectangular shape extends in the direction along the third direction (Z direction). In the present specification, extending along the third direction means allowing variation within ±5°. Similarly, the second conductive wire 402 is preferably a band-shaped wire. For example, a band-shaped wire having a length of the long side of 0.5 mm or more and 1 mm or less and a length of the short side of 0.05 mm or more and 0.3 mm or less in the cross section can be used for the first conductive wire 401 and / or the second conductive wire 402.

[0076] The first conductive wire 401 and / or the second conductive wire 402 can contain, for example, aluminum. In the case where the first conductive wire 401 contains aluminum, it is preferable that the outermost surface of the first conductive portion 21 contain aluminum. By causing the first conductive wire 401 and the first conductive portion 21 to contain the same metal, heterogeneous metal contact corrosion is suppressed, and thus the reliability of the light-emitting device can be increased. The outermost surface of the first conductive portion 21 containing aluminum means that, in the case where the first conductive portion 21 is a single layer, the first conductive portion 21 contains aluminum, and in the case where the first conductive portion 21 is stacked in multiple layers, the layer located at the outermost surface of the first conductive portion 21 contains aluminum. Similarly, in the case where the second conductive wire 402 contains aluminum, it is preferable that the outermost surface of the second conductive portion 22 contain aluminum.

[0077] The at least one light emitting element 300 is arranged on the second substrate 200. The light emitting element 300 is electrically connected to the first conductive portion 21. The light emitting element 300 is also electrically connected to the second conductive portion 22. The light emitting element 300 has a first surface having at least one pair of positive and negative electrodes, a second surface on the opposite side of the first surface, and a third surface between the first surface and the second surface. The light emitting element 300 can be arranged on the second substrate 200 with the first surface of the light emitting element 300 facing the second substrate 200, or the light emitting element 300 can be arranged on the second substrate 200 with the second surface of the light emitting element 300 facing the second substrate 200. It is preferable that the light emitting element 300 be arranged on the second substrate 200 with the first surface of the light emitting element 300 facing the second substrate 200. The light emitting device 1000 mainly extracts light from the light emitting element 300 in the +Z direction. By having the first surface having the positive and negative electrodes face the second substrate 200, the positive and negative electrodes can be prevented from blocking light emitted from the light emitting element in the +Z direction. Thus, the light extraction efficiency of the light emitting device can be improved. Note that the surface of the light emitting element 300 facing the second substrate 200 is sometimes referred to as the lower surface of the light emitting element, and the surface on the opposite side of the lower surface of the light emitting element 300 is sometimes referred to as the upper surface of the light emitting element. The surface between the upper surface of the light emitting element and the lower surface of the light emitting element is sometimes referred to as the side surface of the light emitting element. For example, in the case where the light emitting element 300 is arranged on the second substrate 200 with the first surface of the light emitting element 300 facing the second substrate 200, the first surface of the light emitting element 300 is sometimes referred to as the lower surface of the light emitting element 300, and the second surface of the light emitting element 300 is sometimes referred to as the upper surface of the light emitting element 300.

[0078] In the case where the first surface having the positive and negative electrodes faces the second substrate 200, the light emitting element 300 is electrically connected to the first conductive portion 21 by a known electrically conductive joining member 600 such as a metal bump or solder. In the case where the second surface of the light emitting element 300 faces the second substrate 200, the light emitting element 300 can be fixed to the second substrate 200 by a known joining member such as silicone or epoxy resin. In the case where the second surface of the light emitting element 300 faces the second substrate 200, the light emitting element 300 is electrically connected to the first conductive portion 21 by a wire or the like.

[0079] The light emitting element 300 can be one or more. For example, as shown in FIG. 6A, the light emitting element can be three, as shown in FIG. 6B, the light emitting element can be one, as shown in FIG. 6C, the light emitting element can be five. FIG. 7A FIG. 7B FIG. 7C

[0080] ​​​A part of the outer edge of the light emitting element 300 preferably extends in the second direction (X direction). Thus, the light emitting device 1000 can be easily downsized in the first direction (Y direction). In the present specification, a variation within ±5° is allowed in the case of extending in the direction along the second direction. In the case where the light emitting device 1000 has a plurality of light emitting elements 300, as shown in FIG. 3, it is preferable that the first light emitting element 310 and the second light emitting element 320 adjacent to each other are arranged in the second direction (X direction). Thus, the light emitting device 1000 can be easily downsized in the first direction (Y direction). In addition, the light emitting element 300 includes the first light emitting element 310 and the second light emitting element 320. A part of the outer edge of the first light emitting element 310 and the second light emitting element 320 preferably extends in the direction along the second direction (X direction), and a part of the outer edge of the first light emitting element 310 and the second light emitting element 320 extending in the direction along the second direction (X direction) is located on the same straight line. Thus, the light emitting device 1000 can be easily downsized in the first direction (Y direction). In the present specification, a variation within ±5° is allowed in the case of being on the same straight line. FIG. 7A

[0081] As shown in FIG. 3, the light emitting element 300 and the protection element 301 can be arranged in the first direction (Y direction), or as shown in FIG. 4, the light emitting element 300 and the protection element 301 can be arranged in the second direction (X direction). By arranging the light emitting element 300 and the protection element 301 in the first direction (Y direction), the light emitting device can be easily downsized in the second direction (X direction). By arranging the light emitting element 300 and the protection element 301 in the second direction (X direction), the light emitting device can be easily downsized in the first direction (Y direction). FIG. 7A FIG. 7B FIG. 7C As shown in FIG. 3, the light emitting element 300 and the protection element 301 can be arranged in the first direction (Y direction), or as shown in FIG. 4, the light emitting element 300 and the protection element 301 can be arranged in the second direction (X direction). By arranging the light emitting element 300 and the protection element 301 in the first direction (Y direction), the light emitting device can be easily downsized in the second direction (X direction). By arranging the light emitting element 300 and the protection element 301 in the second direction (X direction), the light emitting device can be easily downsized in the first direction (Y direction).

[0082] As shown in FIG. 3, the light emitting element 300 and the protection element 301 can be arranged in the first direction (Y direction), or as shown in FIG. 4, the light emitting element 300 and the protection element 301 can be arranged in the second direction (X direction). By arranging the light emitting element 300 and the protection element 301 in the first direction (Y direction), the light emitting device can be easily downsized in the second direction (X direction). By arranging the light emitting element 300 and the protection element 301 in the second direction (X direction), the light emitting device can be easily downsized in the first direction (Y direction). FIG. 7A FIG. 7D

[0083] As shown in FIG. 3, the light emitting element 300 and the protection element 301 can be arranged in the first direction (Y direction), or as shown in FIG. 4, the light emitting element 300 and the protection element 301 can be arranged in the second direction (X direction). By arranging the light emitting element 300 and the protection element 301 in the first direction (Y direction), the light emitting device can be easily downsized in the second direction (X direction). By arranging the light emitting element 300 and the protection element 301 in the second direction (X direction), the light emitting device can be easily downsized in the first direction (Y direction). FIG. 1B FIG. 1C ​​​​​​As shown, the light-emitting device 1000 preferably includes a reflective member 700 covering the side surface of the light-emitting element 300. This allows light from the light-emitting element 300 to be reflected by the reflective member 700, thus preventing light from the light-emitting element from being blocked by the first and / or second conductors. If light from the light-emitting element is blocked by the first and / or second conductors, the light distribution may become uneven. Since the reflective member 700 can reflect light from the light-emitting element, it is easy to design a desired light distribution. Furthermore, by covering the side surface of the light-emitting element 300 with the reflective member 700, the light-emitting element 300 can be protected from external forces. When the light-emitting device includes a protective element, it is preferable that at least a portion of the protective element is covered by the reflective member. This prevents light from the light-emitting element from being absorbed by the protective element.

[0084] Preferably, the reflective member 700 covers the entire side surface of the light-emitting element 300. This further suppresses light from the light-emitting element from being blocked by the first and / or second conductors. Furthermore, even when the side surface of the light-emitting element 300 is covered by the reflective member 700, a portion of the light from the light-emitting element may still pass through the reflective member 700. Therefore, by making the height H5 of the wall portion 500 lower than the height H2 of the second substrate 200, the light extraction efficiency of the light-emitting device can be improved.

[0085] In the case of having multiple light-emitting elements 300, it is preferable that a reflective member 700 covers the respective sides of the multiple light-emitting elements. In other words, it is preferable that the sides of the multiple light-emitting elements are covered by a single reflective member. This makes it easier to miniaturize the light-emitting device compared to the case where a single reflective member covers the side of only one light-emitting element.

[0086] like FIG. 1B As shown, the reflective component 700 is preferably located separately from the first conductor 401. Therefore, even if the reflective component 700 expands and / or contracts due to temperature changes, the force exerted by the reflective component 700 on the first conductor 401 can be suppressed. This prevents deformation of the first conductor 401. Similarly, the reflective component 700 is preferably located separately from the second conductor 402.

[0087] The reflective component 700 covering the side of the light-emitting element can also be located between the lower surface of the light-emitting element 300 and the upper surface of the second substrate 200. This allows for the suppression of light absorption from the light-emitting element by the second substrate. FIG. 1BAs shown, the underfill 710 can be located between the lower surface of the light-emitting element 300 and the upper surface of the second substrate. By forming the reflective component 700 covering the side of the light-emitting element and the underfill 710 covering the lower surface of the light-emitting element 300 from different components, for example, when the base material of the reflective component 700 and the underfill 710 is a curable resin, the viscosity of the base material of the underfill 710 before curing can be lower than the viscosity of the base material of the reflective component 700 before curing. Therefore, the underfill 710 can be easily filled between the lower surface of the light-emitting element 300 and the upper surface of the second substrate.

[0088] When the reflective component 700 and / or the underfill 710 are located between the lower surface of the light-emitting element 300 and the upper surface of the second substrate, a metal boss is preferably used as the bonding component 600. This allows for a longer distance between the lower surface of the light-emitting element 300 and the upper surface of the second substrate. Consequently, it is easier to fill the space between the lower surface of the light-emitting element 300 and the upper surface of the second substrate with the reflective component 700 and / or the underfill 710.

[0089] like FIG. 1B As shown, the light-emitting device 1000 preferably includes a light-transmitting component 800 covering the upper surface of the light-emitting element 300. This protects the light-emitting element 300 from external forces. The light-transmitting component 800 may also contain wavelength-changing particles. This facilitates color adjustment of the light-emitting device 1000. Wavelength-changing particles are components that absorb at least a portion of the primary light emitted by the light-emitting element and emit secondary light of a different wavelength than the primary light. By including wavelength-changing particles in the first light-transmitting component, the light-emitting device 1000 can emit mixed-color light resulting from the mixing of the primary light emitted by the first light-emitting element and the secondary light emitted by the wavelength-changing particles. For example, if a blue LED is used in the first light-emitting element and a phosphor such as YAG is used in the wavelength-changing particles, a light-emitting device can be constructed that outputs white light obtained by mixing the blue light from the blue LED with the yellow light emitted by the phosphor excited by the blue light.

[0090] The light-transmitting component 800 may also cover the upper surface of the light-emitting element 300 via the light guide component 350. The light guide component 350 preferably covers the side surface of the light-emitting element 300. This increases the bonding strength between the light guide component 350 and the light-emitting element 300. When the light-emitting device 1000 includes a reflective component 700 covering the side surface of the light-emitting element 300, it is preferable that the reflective component 700 covers the side surface of the light-emitting element via the light guide component 350. The light guide component 350 has a higher transmittance of light from the light-emitting element 300 than the reflective component 700. Therefore, by covering the side surface of the light-emitting element 300 with the light guide component 350, light from the side surface of the light-emitting element 300 is easily guided to the light-transmitting component 800 via the light guide component 350. This improves the light extraction efficiency of the light-emitting device.

[0091] In cases with multiple light-emitting elements, it is preferable that a light guide component 350 covers the sides of the multiple light-emitting elements. For example, such as FIG. 1C As shown, preferably, a light guide component 350 covers the side of the first light-emitting element 310 and the side of the second light-emitting element 320. Thus, light from the first light-emitting element 310 and light from the second light-emitting element 320 are guided to the light guide component 350, thereby suppressing the brightness unevenness between the first light-emitting element 310 and the second light-emitting element 320.

[0092] A light-transmitting component can cover the upper surface of one light-emitting element, or it can cover the upper surfaces of multiple light-emitting elements. In the case of multiple light-emitting elements, it is preferable that one light-transmitting component 800 covers the upper surfaces of multiple light-emitting elements 300. For example, as... FIG. 1C As shown, preferably, a light-transmitting component 800 covers the upper surface of the first light-emitting element 310 and the upper surface of the second light-emitting element 320. Thus, light from the first light-emitting element 310 and light from the second light-emitting element 320 are guided to the light-transmitting component 800, thereby suppressing the brightness unevenness between the first light-emitting element 310 and the second light-emitting element 320.

[0093] It can also be like FIG. 8A As shown in the light-emitting device 1000E, the height H8 of the light-transmitting component 800 is higher than the height H4 of the first wire 401, or it can be like... FIG. 1B As shown in the light-emitting device 1000, the height of the light-transmitting component 800 is lower than the height of the first conductor 401. Preferably, the height H8 of the light-transmitting component 800 is higher than the height H4 of the first conductor 401. Because the height H8 of the light-transmitting component 800 is higher than the height H4 of the first conductor 401, it is possible to suppress the blocking of light emitted from the light-transmitting component 800 by the first conductor 401. Similarly, it is preferable that the height of the light-transmitting component 800 is higher than the height of the second conductor 402.

[0094] like FIG. 8B As shown in the light-emitting device 1000F, when the wall portion 500 and the resin portion 15 are separate, it is preferable that a portion of the first conductive wire 401 is covered by the wall portion 500. This facilitates miniaturization of the light-emitting device. Furthermore, when the wall portion 500 and the resin portion 15 are separate, it is preferable that the junction between the first conductive wire 401 and the first lead wire 11 is covered by the wall portion 500. This helps to prevent peeling between the first lead wire 11 and the first conductive wire 401.

[0095] like FIG. 8CAs shown in the light-emitting device 1000F1, the first conductor 401 has: a first portion 401A, which extends from the portion connected to the first conductive part 21 to a first point P1 where the height of the first conductor 401 is highest; and a second portion 401B, which extends from the portion connected to the first lead 11 to the first point P1. The first portion 401A includes the portion connected to the first conductive part 21, and the second portion 401B includes the portion connected to the first lead 11. When viewed from the second direction (X direction), it is preferable that a portion of the first portion 401A and a portion of the second portion 401B are left-right symmetrical with respect to a line L1 passing through the first point P1 and parallel to a third direction (Z direction). In particular, when viewed from the second direction (X direction), it is preferable that a portion of the first portion 401A located in the upper half of the first portion 401A and a portion of the second portion 401B located in the upper half of the first portion 401A are left-right symmetrical with respect to line L1. The region of the upper half of the first part 401A refers to the region in the +Z direction (upward direction) of the line L2 extending in the first direction (Y direction), which is half the length L4 of the first part 401A in the third direction (Z direction). This makes it easier to suppress deformation of the first conductor 401. For example, when a downward force is applied to the first point P1 of the first conductor 401, since a portion of the first part 401A and a portion of the second part 401B are symmetrical about the line L1, the forces applied to the first part 401A and the second part 401B are likely to be the same. Therefore, it is easier to suppress deformation of the first conductor 401 compared to cases where the forces applied to the first part 401A and the second part 401B are different.

[0096] like FIG. 8C As shown, when viewed from the second direction (X direction), the portion closest to the first lead 11 in the connection between the first conductor 401 and the first conductive part 21 is designated as the second point P2. When viewed from the second direction (X direction), the angle θ1 formed by the line L3 connecting the first point P1 and the second point P2 with the first direction (Y direction) is preferably 0° or more and 60° or less, more preferably 5° or more and 40° or less. By making the angle θ1 smaller, it is easier to reduce the height of the first conductor 401. As a result, it is easier to suppress the light from the light-emitting element 300 from being blocked by the first conductor 401. In addition, by making the angle θ1 larger, it is easier to increase the length of the first conductor 401. As a result, even if the first lead 11 and the second lead 12 expand or contract due to heat, it is possible to suppress the first conductor 401 from breaking. In addition, θ1 represents the acute angle of the angle formed by the line L3 with the first direction (Y direction).

[0097] It can also be like FIG. 9A , FIG. 9BLike the light-emitting device 1000G shown, it includes a covering member 900 that covers the first lead 11 and the first wire 401. By covering the first lead 11 and the first wire 401 with the covering member 900, the first lead 11 and / or the first wire 401 can be protected from moisture, external forces, etc. It is particularly preferable that the covering member 900 covers the joint portion of the first lead 11 and the first wire 401. This can suppress the peeling of the first lead 11 and the first wire 401. The covering member 900 preferably covers the first lead 11, the second lead 12, the first wire 401, and the second wire 402. This can protect the first lead 11, the second lead 12, the first wire 401, and the second wire 402 from moisture, external forces, etc.

[0098] A portion of the first conductor 401 may be exposed from the covering member 900, or the first conductor 401 may not be exposed from the covering member 900. Preferably, a portion of the first conductor 401 is exposed from the covering member 900. This reduces the volume of the covering member 900, thus preventing some of the light from the light-emitting element from being blocked by the covering member 900. Furthermore, even if the covering member 900 is a translucent member, some of the light from the light-emitting element will still be absorbed by the covering member 900. Therefore, by exposing a portion of the first conductor 401 from the covering member 900, the light extraction efficiency of the light-emitting device can be improved. Alternatively, it is preferable that a portion of the first conductor 401 is exposed to the outside. This way, since the member covering the first conductor 401 may not be provided, and the first conductor 401 is not exposed to the outside at all, it is possible to prevent light from the light-emitting element from being blocked. This improves the light extraction efficiency of the light-emitting device.

[0099] like FIG. 10A , FIG. 10B , FIG. 10CAs shown, the resin portion 15 may also include a covering resin portion 150 that is surrounded by the wall portion 500 and covers the upper surface of the first lead 11 when viewed from above. By covering the upper surface of the first lead 11 with the covering resin portion 150, the adhesion between the resin portion 15 and the first lead 11 is improved. The covering resin portion 150 is surrounded by the wall portion 500 when viewed from above, and is part of the resin portion 15 located in the +Z direction (upward direction) further than the upper surface of the first lead 11. The height of the covering resin portion 150 is preferably lower than the height of the wall portion 500. By making the height of the covering resin portion 150 lower than the height of the wall portion 500, the light-emitting device 1000H can be easily miniaturized in the third direction (Z direction). The resin portion 15 of the light-emitting device 1000H is integral with the wall portion 500. The resin portion 15 of the light-emitting device 1000H includes the wall portion 500 and the covering resin portion 150. The covering resin portion 150 preferably extends from the inner side of the wall portion 500. This makes it easier to increase the area of ​​the upper surface of the first lead 11 covered by the resin covering portion 150. When the resin portion 15 and the wall portion 500 are integral, the resin covering portion 150 extends from the inner side of the wall portion 500, thereby connecting the wall portion 500 and the resin covering portion 150, thus increasing the strength of the resin portion 15. This helps to suppress cracking of the wall portion 500 and / or the resin covering portion 150. When the resin portion 15 and the wall portion 500 are integral, and the inner side of the wall portion 500 is approximately rectangular in shape when viewed from above, the resin covering portion 150 preferably extends from at least one corner of the inner side of the wall portion 500. This increases the strength of the corner of the wall portion 500, thus helping to suppress cracking of the wall portion 500. Furthermore, in this specification, "approximately rectangular shape" simply means that two opposite sides of one side are parallel, and two opposite sides of the other side are parallel. The corner is not limited to right angles; it also includes shapes where the corner is chamfered. Chamfered corner shapes include shapes where two orthogonal sides are connected to a curve, shapes where two orthogonal sides are connected to a straight line, etc. Additionally, the corners of the inner surface of the wall portion 500 include lines connecting to two orthogonal sides of a generally rectangular shape when the corners are chamfered. Similarly, the resin portion 15 may also include a covering resin portion 150, which, when viewed from above, is surrounded by the wall portion 500 and covers the upper surface of the second lead 12 and / or the upper surface of the third lead 13. For example, as... FIG. 10A As shown, the resin covering portion 150 covering the upper surface of the third lead 13 extends from the corner of the wall portion 500, which is approximately rectangular in shape when viewed from above.

[0100] like FIG. 10B As shown, the first lead 11 may also have a recess 10A on its lower surface. The recess 10A is recessed in the +Z direction. The recess 10A can be formed by known methods such as stamping or semi-etching. The recess 10A is covered by the resin portion 15. This improves the adhesion between the first lead 11 and the resin portion 15. FIG. 10BAs shown, in the cross-section, the upper surface of the first lead 11 is preferably covered by the resin portion 150, and the recess 10A is covered by the resin portion 15. This improves the adhesion between the first lead 11 and the resin portion 15. Similarly, the lower surface of the second lead 12 and / or the lower surface of the third lead 13 may also have the recess 10A.

[0101] like FIG. 10C As shown, when the side of the first lead 11 in the cross-section is along the third direction (Z direction), it is preferable that a portion of the upper surface of the first lead 11, which is connected to the side of the first lead 11 along the third direction, is covered by the resin portion 150. In the cross-section, when the side of the first lead 11 is along the third direction (Z direction), as... FIG. 10B As shown, the length of the resin portion 15 in contact with the first lead 11 is more likely to be shorter than that of the first lead 11 where the recess 10A is located. However, by covering a portion of the upper surface of the first lead 11, which is connected to the side of the first lead 11 along a third direction, with the covering resin portion 150, the length of the resin portion 15 in contact with the first lead 11 can be increased. This suppresses the wetting and spreading of flux and the like on the upper surface of the first lead 11. For example, when the light-emitting device 1000H is powered from the lower surface of the first lead 11, the lower surface of the first lead 11 is connected to a conductive bonding component such as solder. When the lower surface of the first lead 11 is connected to solder, flux and the like contained in the solder may climb from the lower surface of the first lead 11 to the upper surface of the first lead 11. The light-emitting device 1000H extends the length of the resin portion 15 connected to the first lead 11, which is connected to the side of the first lead 11 along the third direction, by covering a portion of the upper surface of the first lead 11 with a resin portion 150. This allows the resin portion 15 in contact with the first lead 11 to block flux and the like, thus suppressing the wetting and spreading of flux and the like on the upper surface of the first lead 11 exposed from the resin portion 15. Similarly, when the side of the second lead 12 in the cross-section is along the third direction (Z direction), it is preferable that a portion of the upper surface of the second lead 12 connected to the side of the second lead 12 along the third direction is covered by the resin portion 150. Furthermore, when the side of the third lead 13 in the cross-section is along the third direction (Z direction), it is preferable that a portion of the upper surface of the third lead 13 connected to the side of the third lead 13 along the third direction is covered by the resin portion 150.

[0102] Hereinafter, the constituent elements of the light-emitting device according to the embodiments of the present invention will be described.

[0103] (First substrate 100)

[0104] The first substrate 100 is a component for mounting the second substrate. The first substrate 100 includes at least leads 10 and resin portions 15.

[0105] (Leader 10)

[0106] Lead 10 is conductive and is a component used to supply power to the light-emitting element. As the base material of lead 10, metals such as copper, aluminum, gold, silver, iron, nickel, or their alloys, phosphor bronze, and iron-containing copper can be used. These can be single-layered or multi-layered (e.g., composite materials). Copper, which is inexpensive and has high heat dissipation, is particularly preferred as the base material. Additionally, lead 10 may have a metal layer on the surface of the base material. The metal layer may contain, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or their alloys. Furthermore, the metal layer may be provided on the entire surface of lead 10 or only partially. Additionally, the metal layer may be formed as different layers in the region formed on the upper surface of the lead and in the region formed on the lower surface of the lead. For example, the metal layer formed on the upper surface of the lead may be a multi-layered metal layer containing nickel and silver, while the metal layer formed on the lower surface of the lead may be a metal layer without nickel. Furthermore, for example, the metal layer such as silver formed on the upper surface of the lead may be thicker than the metal layer such as silver formed on the lower surface of the lead.

[0107] When a silver-containing metal layer is formed on the outermost surface of the lead 10, it is preferable to provide a protective layer such as silicon oxide on the surface of the silver-containing metal layer. This prevents the silver-containing metal layer from discoloring due to sulfur or other atmospheric components. The protective layer can be formed using a vacuum process such as sputtering, or other known methods.

[0108] Lead 10 has at least a first lead 11 and a second lead 12. The number of leads 10 can be two or more, or it can be three or four.

[0109] (Resin Section 15)

[0110] The resin section 15 is a component that holds the first lead 11 and the second lead 12. The resin section 15 can use known materials such as thermosetting resins and thermoplastic resins as the resin material. In the case of thermoplastic resins, for example, polyphthalamide resin (PPA), polybutylene terephthalate (PBT), unsaturated polyester, etc., can be used. In the case of thermosetting resins, for example, epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, etc., can be used. The resin section 15 may also contain a light-reflecting component in the resin material. Examples of light-reflecting components include known components such as titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, etc.

[0111] (Second substrate 200)

[0112] The second substrate 200 is a component for mounting light-emitting elements. The second substrate 200 includes a base 20, a first conductive portion 21, and a second conductive portion 22.

[0113] (Base 20)

[0114] The base 20 is an insulating component. Materials for the base 20 may include ceramics such as alumina and aluminum nitride, resins, glass, or composites thereof. The base 20 is preferably formed of a material with high thermal conductivity for heat dissipation. Specifically, the base 20 preferably contains a ceramic material. Particularly preferred is the base 20 containing aluminum nitride, which has excellent heat dissipation properties.

[0115] (First conductive part 21, second conductive part 22)

[0116] The first conductive portion 21 and the second conductive portion 22 can be formed from known conductive components. For example, the first conductive portion 21 and the second conductive portion 22 are conductive foils (conductor layers) disposed on the base 20 and electrically connected to the light-emitting element 300. The first conductive portion 21 and the second conductive portion 22 can be formed by electroplating, applying conductive paste, printing, etc. The thickness of each of the first conductive portion 21 and the second conductive portion 22 is, for example, 5 μm or more and 50 μm or less. The first conductive portion 21 and / or the second conductive portion 22 can be a single layer or multiple layers.

[0117] (Light-emitting element 300)

[0118] The light-emitting element 300 is a semiconductor element that emits light by applying a voltage. Known semiconductor elements made of materials such as nitride semiconductors can be used. An LED chip can be cited as an example of a light-emitting element. The light-emitting element has at least a semiconductor layer and, in most cases, a substrate. In top view, the light-emitting element can be rectangular, hexagonal, or other polygonal shapes. The light-emitting element has positive and negative electrodes. The positive and negative electrodes can be made of gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel, or alloys thereof. As the semiconductor material, nitride semiconductors are preferred. Nitride semiconductors are mainly composed of materials of the general formula In... x Al y Ga 1-x-yN(0≤x, 0≤y, x+y≤1) represents the semiconductor. In addition, InAlGaAs-based semiconductors, InAlGaP-based semiconductors, zinc sulfide, zinc selenide, silicon carbide, etc., can also be used. The substrate for the light-emitting element is primarily a crystal growth substrate capable of growing crystals of semiconductors constituting a semiconductor stack, but it can also be a bonding substrate for bonding to a semiconductor element structure separated from the crystal growth substrate. Examples of substrate materials include sapphire, gallium nitride, aluminum nitride, silicon, silicon carbide, gallium arsenide, gallium phosphide, indium phosphide, zinc sulfide, zinc oxide, zinc selenide, and diamond. Sapphire is preferred. The thickness of the substrate can be appropriately selected, for example, 0.02 mm or more and 1 mm or less; from the viewpoint of substrate strength, 0.05 mm or more and 0.3 mm or less is preferred.

[0119] (Protection Component 301)

[0120] Protection element 301 is a component used to improve electrostatic discharge withstand voltage. Various protection elements mounted on general lighting devices can be used. For example, a Zener diode can be used as a protection element.

[0121] (First conductor 401, second conductor 402)

[0122] The first conductor 401 is a component that electrically connects the first lead and the first conductive part. The second conductor 402 is a component that electrically connects the second lead and the second conductive part. Known materials such as gold, silver, copper, platinum, aluminum, and their alloys can be used as materials for the first conductor 401 and the second conductor 402.

[0123] (Wall section 500)

[0124] The wall portion 500 is a component that spans and covers the upper surfaces of the first lead 11 and the second lead 12. The wall portion 500 can use the same component as the resin portion 15.

[0125] (Reflective component 700)

[0126] The reflective component 700 is a component that covers the side of the light-emitting element 300. The reflective component 700 can use thermosetting resin, thermoplastic resin, or the like as the base resin material. Silicone resin and modified silicone resin, which have excellent heat resistance and light resistance, are particularly preferred as the base material for the reflective component 700. The reflective component 700 contains a light-reflecting element within the base resin material. Examples of light-reflecting elements include known materials such as titanium dioxide, silicon dioxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, and mullite.

[0127] (Bottom packing 710)

[0128] The bottom filler 710 is a component that absorbs the stress caused by the difference in the thermal expansion rates of the light-emitting element 300 and the second substrate and improves heat dissipation. The bottom filler 710 is formed in the gap between the light-emitting element 300 and the second substrate 200. As the material of the bottom filler 710, resin materials such as thermosetting resins and thermoplastic resins can be used. The bottom filler 710 may also contain a light-reflecting component in the resin material. Examples of the light-reflecting component include known materials such as titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, and mullite. Since the bottom filler 710 contains a light-reflecting component, light from the light-emitting element can be suppressed from being absorbed by the second substrate.

[0129] (Light-transmitting component 800)

[0130] The light-transmitting component 800 is a light-transmitting component that covers the upper surface of the light-emitting element and protects the light-emitting element. As the material of the light-transmitting component, for example, resin materials such as thermosetting resins and thermoplastic resins can be used. As the resin material of the light-transmitting component, silicone resins and modified silicone resins with excellent heat resistance and light resistance are particularly preferably used. The light-transmitting component 800 may also contain wavelength-converting particles and / or diffusing particles.

[0131] (Wavelength-converting particles)

[0132] The wavelength-converting particles absorb at least a part of the primary light emitted by the light-emitting element and emit secondary light having a wavelength different from that of the primary light. As the wavelength-converting particles, known wavelength-converting particles can be used. As the wavelength-converting particles, for example, one of the specific examples shown below can be used alone or two or more thereof can be used in combination.

[0133] The wavelength-converting particles that emit green light are yttrium aluminum garnet-based phosphors (e.g., Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce)-based phosphors, silicate-based phosphors (e.g., (Ba,Sr)2SiO4:Eu), chlorosilicate-based phosphors (e.g., Ca8Mg(SiO4)4CL2:Eu), β-sialon-based phosphors (e.g., Si 6-z Al z O z N 8-z :Eu(0<z<4.2)), SGS-based phosphors (e.g., SrGa2S4:Eu), alkaline earth aluminate-based phosphors (e.g., (Ba,Sr,Ca)Mg x Al 10 O 16+x: Eu, Mn (where 0 ≤ X ≤ 1), etc. As wavelength conversion particles that emit yellow light, α-sialon-based phosphors (e.g., M z (Si, Al) 12 (O, N) 16 (where 0 < z ≤ 2, and M is Li, Mg, Ca, Y, and lanthanide elements other than La and Ce), etc. In addition, among the above wavelength conversion particles that emit green light, there are also wavelength conversion particles that emit yellow light. Also, for example, yttrium aluminum garnet-based phosphors can shift the emission peak wavelength to the long wavelength side by replacing a part of Y with Gd and can emit yellow light. In addition, there are also wavelength conversion particles that can emit orange light. As wavelength conversion particles that emit red light, calcium aluminum silicon oxynitride (CASN or SCASN)-based phosphors (e.g., (Sr, Ca)AlSiN3:Eu), SLAN phosphors (SrLiAL3N4:Eu), etc. can be cited. In addition, it is a manganese-activated fluoride-based phosphor (phosphor represented by the general formula (I) A2[M 1-a Mn a F6]) (where in the above general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs, and NH4, M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0 < a < 0.2). As a representative example of this manganese-activated fluoride-based phosphor, a phosphor of manganese-activated potassium fluorosilicate (e.g., K2SiF6:Mn) can be cited.

[0134] (Diffusion particles)

[0135] As diffusion particles, known components such as silicon oxide, aluminum oxide, zirconium oxide, and zinc oxide can be used. The diffusion particles can be used alone or in combination of two or more of them. Silicon oxide with a small thermal expansion coefficient is particularly preferred. In addition, by using nanoparticles as diffusion particles, the scattering of light emitted by the light-emitting element can be increased, and the amount of wavelength conversion particles used can be reduced. In addition, the nanoparticles are particles with a particle size of 1 nm or more and 100 nm or less. In addition, the "particle size" in this specification is a value defined by D50.

[0136] (Covering member 900)

[0137] The covering member 900 is a member that covers the first lead and the first wire. The covering member 900 can use the same member as the resin part 15. As the matrix of the covering member 900, a thermosetting resin such as an epoxy resin or a silicone resin with excellent heat resistance is particularly preferably used. In addition, the covering member 900 can also contain a light reflection member in the resin material as the matrix.

[0138] The light-emitting device according to one embodiment of the present invention can be used in vehicle headlights, backlight devices for liquid crystal displays, various lighting fixtures, large displays, advertising or destination guidance and other display devices, projection devices, as well as image reading devices in digital cameras, fax machines, copiers, scanners and the like.

Claims

1. A light emitting device, characterized by, Possessing: a first substrate having a first lead, a second lead located at a position separate from the first lead, a resin portion holding the first lead and the second lead; a second substrate disposed on the second lead, having a base portion and a first conductive portion located on an upper surface of the base portion; at least one light emitting element disposed on the second substrate and electrically connected to the first conductive portion; a first lead wire electrically connecting the first lead and the first conductive portion; a wall portion spanning and covering upper surfaces of the first lead and the second lead, the wall portion having a height lower than a height of the second substrate, the resin portion having a covering resin portion surrounded by the wall portion and covering the upper surface of the first lead in plan view, the covering resin portion having a height lower than the wall portion, the covering resin portion extending from an inner side surface of the wall portion.

2. The light emitting device according to claim 1, wherein the wall portion is a part of the resin portion.

3. The light emitting device according to claim 1 or 2, wherein the light emitting device possesses a second lead wire, the first substrate has a third lead located at a position separate from the first lead and the second lead, has a second conductive portion separate from the first conductive portion and located on an upper surface of the base portion, the second lead wire electrically connects the third lead and the second conductive portion.

4. The light emitting device according to claim 3, wherein in plan view, the first lead and the second lead are opposite to each other in a first direction, the second lead and the third lead are opposite to each other in the first direction, and the first lead and the third lead are opposite to each other in a second direction orthogonal to the first direction.

5. The light emitting device according to claim 3, wherein the wall portion spans and covers upper surfaces of the second lead and the third lead.

6. The light emitting device according to claim 3, wherein the wall portion spans and covers upper surfaces of the first lead and the third lead.

7. The light emitting device according to claim 1, wherein the light emitting device possesses a second lead wire, has a second conductive portion separate from the first conductive portion and located on an upper surface of the base portion, the second lead wire electrically connects the second lead and the second conductive portion.

8. The light emitting device according to claim 1 or 2, wherein the wall portion surrounds the second substrate without a gap in plan view.

9. The light emitting device according to claim 1 or 2, wherein in cross section, a ratio of the height of the wall portion to a width of the wall portion is 0.2 or more and less than 1.

10. The light emitting device according to claim 1 or 2, wherein a reflection member covering a side surface of the light emitting element is possessed.

11. The light emitting device according to claim 10, wherein the reflection member is located at a position separate from the first lead wire.

12. The light emitting device according to claim 1 or 2, wherein a light-transmissive member covering an upper surface of the light emitting element is possessed.

13. The light emitting device according to claim 12, wherein The height of the light-transmissive member is higher than the height of the first lead wire.

14. The light-emitting device according to claim 12, wherein The light-emitting element has a plurality of One light-transmissive member covers the upper surfaces of a plurality of the light-emitting elements.

15. The light-emitting device according to claim 1 or 2, wherein The first lead wire is a belt-shaped lead wire.

16. The light-emitting device according to claim 1 or 2, wherein The base portion contains aluminum nitride.

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