Electronic devices

By setting up support components and anti-film printing in electronic equipment, the film printing problems caused by battery expansion and deformation of flexible circuit boards are solved, the deformation control of flexible circuit boards and the reduction of the thickness of the whole machine are realized, and the lightness and thinness of the product is promoted. change.

CN113452812BActive Publication Date: 2025-02-25HUAWEI TECH CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202010225789.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-03-26
Publication Date
2025-02-25
Estimated Expiration
2040-03-26

AI Technical Summary

Technical Problem

In electronic devices, due to battery expansion and deformation of flexible circuit boards, film printing is easily generated, which increases the thickness of the entire machine, affecting the lightweight design of the product.

Method used

By providing support components in the electronic device, the second part of the flexible circuit board is supported, and its bending and deformation is prevented from being pushed to the diaphragm, and in combination with the use of anti-film printing, the diaphragm is ensured.

Benefits of technology

The deformation control of the flexible circuit board is realized, which avoids the occurrence of film printing, and reduces the thickness of the entire machine, promoting the lightweight design of the product.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN113452812B_ABST
    Figure CN113452812B_ABST
Patent Text Reader

Abstract

The present application relates to the technical field of electronic products, and in particular to an electronic device, including a battery cover, a membrane, a flexible circuit board, a battery and a main board, wherein the membrane is arranged on the battery cover, and the battery and the main board are arranged side by side; along the extension direction L of the flexible circuit board, the flexible circuit board includes a first part and a second part; the first part is located between the membrane and the battery, and the second part is located between the membrane and the main board, and the distance from the membrane to the main board is greater than the distance from the membrane to the battery; the electronic device also includes a supporting component, the supporting component is arranged on the main board, and the second part is located between the supporting component and the membrane; the second part includes a bending part, and along the extension direction L of the flexible circuit board, at least part of the supporting component is located between the battery and the bending part. By using the electronic device provided by the present application, the deformation of the flexible circuit board can be controlled when the battery cover is assembled, thereby preventing the occurrence of membrane printing while reducing the thickness requirement of the whole machine, so as to achieve a light and thin product.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device. Background Art

[0002] In the market of mobile communication equipment, the glass battery cover and the membrane inside the cover provide a good hand feel for users and are widely used. However, the membrane attached to the inside of the battery cover is relatively fragile due to its own texture structure. When squeezed by external force, it is easy to produce slight deformation, which is usually called membrane print. In electronic equipment, a battery is correspondingly arranged inside the battery cover, and a flexible circuit board is arranged inside the electronic equipment to provide support through the battery. In this matching structure, the battery is easy to expand and deform when heated or repeatedly used, and then the connected flexible circuit board is driven to move and deform accordingly. In order to avoid the battery expansion touching other components and causing damage to the battery, there are strict requirements on the space in the thickness direction of the battery installed in the electronic equipment. At the same time, when the battery cover is assembled, the battery cover will generate a force in the direction of the battery in the matching part with the battery, and the corresponding flexible circuit board is under the action of the battery support force. The flexible circuit board partially suspended above the mainboard is hard supported by the edge of the battery, which is easy to bend to the top of the membrane, causing membrane print. This requires leaving enough space inside the mating part to avoid the production of film printing, which increases the thickness of the entire machine and affects the lightweight design requirements of the product. Summary of the invention

[0003] The purpose of the present application is to provide an electronic device, which can control the deformation of the flexible circuit board when assembling the battery cover, thereby preventing the film printing from occurring while reducing the thickness requirement of the whole device and making the product lighter and thinner.

[0004] The present application provides a circuit board, comprising a battery cover, a membrane, a flexible circuit board, a battery and a main board, wherein the membrane is arranged on the battery cover, the battery and the main board are arranged side by side, wherein the projection of the battery on the membrane does not overlap with the projection of the main board on the membrane; along the extension direction L of the flexible circuit board, the flexible circuit board comprises a first part and a second part;

[0005] The first part is located between the diaphragm and the battery, the second part is located between the diaphragm and the main board, and the distance from the diaphragm to the main board is greater than the distance from the diaphragm to the battery;

[0006] The electronic device further comprises a supporting component, wherein the supporting component is arranged on the main board, and the second portion is located between the supporting component and the diaphragm;

[0007] The second part includes a bending portion, and along the extension direction L of the flexible circuit board, at least part of the supporting component is located between the battery and the bending portion, and the supporting component is used to support the second part.

[0008] The second part is supported by the support component, so that the flexible circuit board is not subjected to force, and the second part is not bent at this position due to the support of the battery side edge part, so that the second part is raised toward the membrane and hits the membrane. While ensuring that the membrane does not produce film marks, the thickness of the whole device can be reduced.

[0009] In a possible design, the distance from the diaphragm to the supporting component is greater than the distance from the diaphragm to the battery.

[0010] It is prevented that the supporting member 6 is set too high so as to lift up the second portion 42 and protrude toward the diaphragm 7, thereby causing film marks on the diaphragm 7.

[0011] In a possible design, the distance from the support member to the second portion is less than or equal to 1 mm; or,

[0012] The support member is at least partially in contact with the second portion.

[0013] Before the battery cover is assembled, the second part is supported by the support component to avoid the situation where the second part does not contact the support component due to an excessively large distance during deformation, i.e., local lifting occurs, thereby generating film marks.

[0014] In a possible design, the support component includes a main body portion, and the main body portion can be deformed under pressure;

[0015] Along the thickness direction H, the main body portion is at least partially disposed below the bent portion.

[0016] As a result, when the bent portion in the second part is deformed, the supporting component located below can first come into contact with the deformed bent portion due to its shorter distance, and as the deformation force of the bent portion increases, the contact area between the bent portion and the supporting component increases. At the same time, the main body achieves soft support as it is deformed under pressure.

[0017] In a possible design, the bending portion has a first mating surface, and the main body portion has a second mating surface;

[0018] At least a portion of the first mating surface abuts against the second mating surface.

[0019] It is used to ensure that the main body can provide good soft support for the corresponding deformation position, increase the contact area, make the deformation of the flexible circuit board regular, and improve the stability of the soft support.

[0020] In a possible design, the first mating surface is an arc-shaped surface, and the second mating surface is a convex surface formed by a convex structure disposed on the main body, and the convex surface abuts against the arc-shaped surface.

[0021] For the raised structure whose second mating surface is located on the main body, when the flexible circuit board is deformed, the deformation within a certain range can contact any point on it through the set raised structure, thereby driving more area of ​​the flexible circuit board to cooperate with the raised structure, realizing the cooperation between the first mating surface and the second mating surface, thereby realizing soft support of the main body.

[0022] In a possible design, the supporting component further includes a positioning portion, which detachably connects the main body portion to the main board.

[0023] The stability of the main body when installed in the electronic device is ensured, and the installation is convenient. In the limited layout space of the electronic device, the added supporting components will not occupy more space.

[0024] In a possible design, the positioning portion includes a card block and a card slot;

[0025] The card block is located on the main body, the card slot is located on the main board, and the card block and the card slot connect the main body and the main board through card connection.

[0026] The detachable connection between the card block and the card slot is achieved by the card connection. This matching structure is simple, easy to operate, and firmly fixed.

[0027] In a possible design, the main body is made of soft silicone.

[0028] While soft silicone can achieve good elastic deformation effect, it is also light in weight, thus reducing the burden on the weight of the entire machine.

[0029] In one possible design, the electronic device further includes a film-proof imprint;

[0030] The film-proof imprint is located between the second portion and the membrane sheet, and along the thickness direction H, the projection of the film-proof imprint at least covers the bent portion.

[0031] By setting the anti-film-imprint Mylar to be attached to the surface of the diaphragm, the safety of the diaphragm is further ensured, and the flexible circuit board is prevented from directly touching the diaphragm and causing film imprints.

[0032] In a possible design, the minimum distance from the film-proof imprint to the second portion is between 0.8 mm and 1.5 mm.

[0033] This can further ensure the safe and stable performance of electronic equipment and prevent deformation of flexible circuit boards and damage to the anti-film imprint.

[0034] In a possible design, the flexible circuit board further includes a third part;

[0035] Along the extension direction L of the flexible circuit board, the second part is located between the first part and the third part, and the third part is connected to the main board.

[0036] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 An exploded diagram of an electronic device provided in an embodiment of the present application;

[0038] Figure 2 for Figure 1 A partial enlarged view of part A;

[0039] Figure 3 A cross-sectional view of an electronic device provided in an embodiment of the present application, wherein the direction indicated by the arrow is the thickness direction H of the electronic device;

[0040] Figure 4 for Figure 3 A partial enlarged view of part B, wherein the direction indicated by the arrow is the extension direction L of the flexible circuit board;

[0041] Figure 5 for Figure 4 A partial enlarged view of part C in the middle, wherein the direction indicated by the arrow is the thickness direction H of the electronic device;

[0042] Figure 6 A schematic diagram of the structure of the main body provided in an embodiment of the present application, wherein the direction indicated by the arrow is the length direction of the main body;

[0043] Figure 7 A schematic diagram of the mainboard structure provided in an embodiment of the present application.

[0044] Reference numerals:

[0045] 1-battery cover; 2-middle frame; 3-battery; 4-flexible circuit board; 41-first part; 42-second part; 421-bending part; 421a-first mating surface; 43-third part; 5-main board; 6-support component; 61-main body; 611-raised structure; 611a-second mating surface; 612-block; 62-positioning part; 7-diaphragm; 8-anti-film imprint; 9-board-to-board connector.

[0046] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0047] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0048] An embodiment of the present application provides an electronic device, such as Figure 1 , Figure 2 and Figure 4 As shown, the electronic device includes a housing and a middle frame 2. In the structure of the middle frame 2, a battery cover 1, a diaphragm 7, a flexible circuit board 4 and a battery 3 are sequentially arranged along the thickness direction H. A main board 5 is arranged side by side on one side of the battery 3. The diaphragm 7 is arranged on the inner surface of the battery cover 1 to enhance the aesthetic effect of the battery cover 1, and the projection of the diaphragm 7 in the thickness direction H at least partially covers the battery 3, the flexible circuit board 4 and the main board 5, wherein the projection of the battery 3 on the diaphragm 7 does not overlap with the projection of the main board 5 on the diaphragm 7. The battery 3 is arranged in the battery compartment in the bracket of the middle frame 2, and the main board 5 and the chip are arranged on one side of the battery compartment. The battery 3 is used to provide power to the chip. In order to realize the electrical connection between the main board 5 and the battery 3 in a limited space, as shown in FIG. Figure 4 The direction indicated by the arrow is the extension direction L of the flexible circuit board 4. The flexible circuit board 4 is located above the battery 3 and the main board 5. The flexible circuit board 4 uses its own good deformation ability to utilize the limited space layout to electrically connect the battery 3 and the main board 5, so as to maximize the utilization rate of the internal space and reduce the thickness of the electronic product as much as possible to achieve lightness and thinness.

[0049] The main board 5 and other components are connected via the flexible circuit board 4. Due to space limitations, the flexible circuit board 4 extends from the main board 5, passes through the gap between the battery 3 and the membrane 7, and is electrically connected to other components.

[0050] Furthermore, along the extension direction L of the flexible circuit board 4 (eg Figure 4The flexible circuit board 4 includes a first part 41 and a second part 42, the first part 41 is located between the diaphragm 7 and the battery 3, the first part 41 abuts against the battery 3, the second part 42 is located between the diaphragm 7 and the main board 5, and along the thickness direction H, the distance from the diaphragm 7 to the main board 5 is greater than the distance from the diaphragm 7 to the battery 3. The first part 41 located above the battery 3 can be supported by the battery 3, that is, the first part 41 at least partially abuts against the upper end surface of the battery 3, and the flexible circuit board 4 also includes a third part 43, the main board 5 and the third part 43 are snap-fitted and connected through the board-to-board connector 9, so as to connect the flexible circuit board 4 with the main board 5, so as to realize the electrical connection between the battery 3 and the main board 5 in a limited space through the flexible circuit board 4. Along the extension direction L of the flexible circuit board 4, the second part 42 is located between the first part 41 and the third part 43. Under this structure, the first part 41 is supported by the battery 3, and the third part 43 is connected to the main board 5. Since there is a height difference between the upper end surface of the battery 3 and the upper end surface of the main board 5 along the thickness direction H, the second part 42 includes a bending portion 421, so that the second part 42 can be bent by its own deformation force to achieve the transition of the height difference, and the main board 5 is electrically connected to the battery 3 in a limited space. In order to ensure the integrity of the whole machine, the battery cover 1 is detachably buckled along the thickness direction H to avoid the exposure of internal components. Among them, in electronic equipment, the battery cover 1 can be set as a glass battery cover, which is widely used due to its high cost-effectiveness, beautiful appearance, and strong and durable performance, and the combination of the glass battery cover and the diaphragm 7 is widely used.

[0051] However, the combined structure of the glass battery cover 1 and the diaphragm 7 is prone to slight deformation when squeezed by external force, which is usually called film printing, because the texture structure of the diaphragm 7 itself is relatively fragile. In the electronic device in the above-mentioned matching structure, in order to make the electronic device as light and thin as possible, the distance between the diaphragm 7 and the first part 41 along the thickness direction H is a reserved space, which can prevent the battery 3 from touching other parts and causing damage to the battery 3 when the battery 3 expands and deforms. However, under the setting of such a reserved space, since the first part 41 and the third part 43 are supported by the battery 3 and the main board 5 respectively, the second part 42 is suspended between the diaphragm 7 and the main board 5 along the thickness direction H. When installing the battery cover 1, the flexible circuit board 4 is subjected to the downward force of the battery cover 1 in the thickness direction, and tends to deform. The first part 41 is supported by the battery 3, which avoids the deformation of the first part 41. However, the second part 42 connected to the first part 41 will be bent and deformed near the edge of the battery 3 due to the lack of support from the support member. In addition, the first part 41 is located above the third part 43 in the thickness direction H. Under this structural matching condition, the bending of the second part 42 near the edge of the battery 3 is supported by the hard support of the edge of the battery 3, which will cause the bent and deformed part of the second part 42 to hit the diaphragm 7, thereby generating a film print. If the pre-set reserved space is increased in order to avoid the film print, although the problem of the film print can be solved, the overall thickness of the electronic device will increase, which is not conducive to the realization of thin and light products.

[0052] In order to avoid using the method of increasing the reserved space to solve the problem of film printing, the electronic device also includes a support component 6, which is arranged on the main board 5. Along the thickness direction H, the second part 42 is located between the film sheets 7 of the support component 6; along the extension direction L of the flexible circuit board 4, at least part of the support component 6 is located between the battery 3 and the bending portion 421, and the support component 6 is used to support the second part 42. The support component 6 is arranged to support the second part 42, so that when the battery cover 1 is assembled, along the thickness direction H, the flexible circuit board 4 is subjected to the downward force of the battery cover 1 and has a tendency to deform, the first part 41 is supported by the battery 3, so that the deformation of the first part 41 is avoided, and the second part 42 connected to the first part 41 can be abutted with the support component 6, and under the downward force of the battery cover 1, the support component 6 can be deformed, and under the support force of the support component 6, the second part 42 is prevented from bending near the edge of the battery 3 and hitting the battery cover 1. In the structural coordination with the support component 6, since the side of the support component 6 away from the battery 3 is close to the bent portion 421, when the support component 6 supports the second part 42, no new bent portion 421 will appear to hit the diaphragm 7, and the bent portion 421 will not be greatly deformed and hit the diaphragm 7 with the support of the support component 6. By using such a support component 6 to support the second part 42, film marks are avoided, and there is no need to increase the thickness to increase the avoidance space to avoid the second part 42 hitting the diaphragm 7, which is conducive to the thinness of the product.

[0053] The distance between the support component 6 and the diaphragm 7 is the first distance, and the distance between the battery 3 and the diaphragm 7 is the second distance. For the support component 6, in order to enable the support component 6 to support the second portion 42 when the battery cover 1 is assembled, the support component 6 cannot exceed the height of the battery 3 along the thickness direction H, so as to avoid the support component 6 lifting the second portion 42 and protruding toward the diaphragm 7, thereby causing a film mark on the diaphragm 7. Therefore, it is necessary to make the distance between the diaphragm 7 and the support component 6 greater than the distance between the diaphragm 7 and the battery 3, that is, the first distance is greater than the second distance.

[0054] Optionally, in order to realize the support component 6 to support the second part 42 by its own deformation ability when the battery cover 1 is assembled, before the battery cover 1 is assembled, the distance between the support component 6 and the second part 42 is less than or equal to 1 mm, so as to avoid the situation that the second part 42 will not contact with the support component 6 when deformed, that is, bend and hit the diaphragm 7 due to the excessive distance, resulting in film print. Alternatively, in order to ensure a better effect, the support component 6 can support the second part 42 when it is deformed, or the support component 6 can at least partially contact and cooperate with the second part 42. Before the battery cover 1 is assembled, for the different ways in which the support component 6 and the second part 42 are contacted and matched or have a certain distance, no matter which kind of cooperation is adopted, as long as the second part 42 can make it abut against the support component 6 when the flexible circuit board 4 is subjected to a downward force, and soft support is realized, so that the bending portion 421 of the second part 42 will not hit the diaphragm 7 during the deformation process, and will not bend near the edge of the battery 3 and hit the diaphragm 7.

[0055] As a specific implementation of this application, Figure 4 and Figure 5 As shown, in order to enable the support component 6 to support the second part 42 when the flexible circuit board 4 is deformed, the deformation degree of the bent portion 421 in the second part 42 is better guided to avoid hitting the diaphragm 7 and forming a film mark. Since the upper end surface of the battery 3 is located above the upper end surface of the main board 5 along the thickness direction H, this structure is set so that when the first part 41 and the third part 43 of the flexible circuit board 4 are connected to the upper end surface of the battery 3 and the upper end surface of the main board 5 respectively, the second part 42 thereof passes through the set bent portion 421 to compensate for the height difference between the two. In the flexible circuit board 4 with this layout, for the bent portion 421, when the battery cover 1 is assembled, the flexible circuit board 4 is driven to be affected by its deformation force, and the deformation force of the second part 42 is more likely to be concentrated near the bent portion 421, and the bent portion 421 is prone to produce a local lifting phenomenon along the thickness direction H, thereby causing the lifting at this position to touch the diaphragm 7 to produce a film mark. In order to avoid this situation, the support component 6 is located near the bent portion 421, so that when the battery cover 1 is assembled, the movement of the bent portion 421 along the thickness direction can make the support component 6 abut against at least part of the bent portion 421. Thus, the support component 6 supports the flexible circuit board 4.

[0056] Specifically, in order to ensure that the supporting component 6 can achieve a better supporting effect, the supporting component 6 includes a main body 61, which can be deformed under pressure. Along the thickness direction H, the main body 61 is at least partially placed below the bending portion 421. When the second part 42 is deformed and the bending portion 421 is deformed, the main body 61 located below can at least partially abut against the deformed bending portion 421 due to the short distance. As the deformation force increases, the contact area between the bending portion 421 and the main body 61 increases. At the same time, the main body 61 is deformed under pressure. In this way, the deformation of the bending portion 421 is toward the supporting component 6, and the deformed shape is mainly attached to the surface of the main body 61, so that no local lifting will occur to cause the generation of film printing, thereby improving the regularity and stability of the deformation of the second part 42.

[0057] More specifically, in order to ensure that the main body 61 can provide a good soft support for the second portion 42. Figure 5 and Figure 6 As shown, the bending portion 421 has a first mating surface 421a, and the main body 61 has a second mating surface 611a. When the second portion 42 is deformed, at least part of the first mating surface 421a abuts against the second mating surface 611a, and pushes the main body 61 to deform. The main body 61 is set to a regular strip structure, and its extension direction is parallel to the axis generated by the bending of the bending portion 421. The first mating surface 421a and the second mating surface 611a are set to ensure that the main body 61 can provide a better soft support effect for the corresponding more easily deformed position, increase the contact area, and improve the stability of the soft support of the main body 61.

[0058] Moreover, for the provided mating surface, the first mating surface 421a is an arcuate surface, and at least a part of the main body 61 is in contact with the corresponding part, thereby increasing the mating area and achieving a better soft support effect. The second mating surface 611a is a convex surface formed by the convex structure 611 disposed on the main body 61, and the convex surface can abut against the arcuate surface. For the second mating surface 611a located on the convex structure 611 of the main body 61, when the flexible circuit board 4 is deformed, the deformation within a certain range can be contacted with any point on it through the provided convex structure 611, thereby driving more area of ​​the second part 42 to cooperate with the convex structure 611, thereby achieving the cooperation between the first mating surface 421a and the second mating surface 611a, thereby achieving the soft support of the main body 61.

[0059] The protrusion structure 611 provided on the main body 61 may be one or more. Figure 5As shown, two protrusion structures 611 are provided, which are arranged in the form of arc grooves along the length direction at a corner of the main body 61, so that the two ends of the arc groove respectively form protrusion structures 611. The stability of the flexible support of the second part 42 is further guaranteed by the abutment of at least two abutment points.

[0060] The present application also provides a specific implementation method, such as Figure 6 and Figure 7 As shown, for the main body 61, in order to ensure its stability when installed in the electronic device and facilitate installation, the added support component 6 will not occupy more space within the limited layout space of the electronic device. The support component 6 also includes a positioning portion 62, which detachably connects the main body 61 to the motherboard 5.

[0061] Specifically, in order to ensure the stability of the connection between the main body 61 and the main board 5 and facilitate disassembly, the positioning part 62 includes a clamping block 612 and a clamping slot; the clamping block 612 is located in the main body 61, and the clamping slot is located in the main board 5. The clamping block 612 and the clamping slot connect the main body 61 and the main board 5 by clamping. The clamping block 612 and the clamping slot are clamped to realize the detachable connection between the two. This matching structure is simple, easy to operate, and firmly fixed.

[0062] Optionally, in order to reduce the impact of the added support component 6 on the weight of the entire machine, the main body 61 is set to soft silicone. The soft silicone can have a good elastic deformation effect and is light in weight, thereby reducing the burden on the weight of the entire machine.

[0063] In addition, in order to further reduce the weight of the support component 6, the block 612 disposed on the main body 61 is designed to be made of the same soft silicone material as the main body 61, and the card slot is set as a groove opened by the light metal bracket on the main board 5, so as to ensure the carding effect of the two while reducing the weight of the whole device. In addition, the bracket disposed on the main body is arranged in a corresponding avoidance position according to the limited space layout inside the electronic device, so as to ensure the connection with the main body 61 while not interfering with other electronic components.

[0064] In addition, if Figure 5 As shown, the electronic device further includes an anti-film printing Mylar 8; the anti-film printing Mylar 8 is located between the flexible circuit board 4 and the diaphragm 7, and the anti-film printing Mylar 8 is not arranged between the battery 3 and the diaphragm 7. The anti-film printing Mylar 8 is arranged so that it is attached to the surface of the diaphragm 7, thereby further ensuring the safety of the diaphragm 7 and preventing the flexible circuit board 4 from directly touching the diaphragm 7 to produce film marks.

[0065] Since the distance between the battery 3 and the diaphragm 7 is relatively small, there is no space between the battery 3 and the diaphragm 7 for setting the anti-film printing Mylar 8. The distance between the main board 5 and the diaphragm 7 is relatively large compared to the distance between the battery 3 and the diaphragm 7. By setting a support component 6 between the main board 5 and the diaphragm 7 to support the flexible circuit board 4, it is prevented that the bending area of ​​the flexible circuit board 4 will produce film prints on the diaphragm 7. Alternatively, by setting a support component 6 between the main board 5 and the diaphragm 7 to support the flexible circuit board 4, and setting the anti-film printing Mylar 8 between the diaphragm 7 and the flexible circuit board 4, it is prevented that the flexible circuit board 4 will produce film prints on the diaphragm 7.

[0066] Optionally, for the anti-film imprint 8, the anti-film imprint 8 is located between the second part 42 and the diaphragm 7, and the projection of the anti-film imprint 8 at least covers the bent portion 421 along the thickness direction H. In the assembly of the battery cover 1, the anti-film imprint 8 is a further protective measure to ensure the safety and stability of the electronic device after the support component 6 is provided. Generally, it is necessary to ensure that when the second part 42 is supported by the soft support, the bent portion 421, which is more easily deformed, will not contact the surface of the anti-film imprint 8 during deformation. Therefore, the minimum distance from the anti-film imprint to the second part 42 is between 0.8 mm and 1.5 mm.

[0067] In summary, by providing the support component 6, when the battery cover 1 is assembled in the electronic device, the flexible circuit board 4 driven by the support component 6 can produce relatively stable deformation, so as to avoid local lifting and film marks on the diaphragm 7. In addition, by providing the support component 6, the gap between the battery 3 and the diaphragm 7 can be reduced without film marks, making the electronic device lighter and thinner.

[0068] However, it should be noted that a portion of this patent application document contains content protected by copyright. The copyright owner reserves the copyright except for making copies of the patent document content in the patent office or the patent document record.

Claims

1. An electronic device, characterized in that: The invention comprises a battery cover (1), a middle frame (2), a diaphragm (7), a flexible circuit board (4), a battery (3) and a main board (5), wherein the battery (3), the flexible circuit board (4) and the main board (5) are arranged in the middle frame (2); the diaphragm (7) is arranged on the battery cover (1), and the battery (3) and the main board (5) are arranged side by side, wherein the projection of the battery (3) on the diaphragm (7) does not overlap with the projection of the main board (5) on the diaphragm (7); Along an extension direction L of the flexible circuit board (4), the flexible circuit board (4) comprises a first part (41) and a second part (42); The first part (41) is located between the diaphragm (7) and the battery (3), the second part (42) is located between the diaphragm (7) and the main board (5), and the distance between the diaphragm (7) and the main board (5) is greater than the distance between the diaphragm (7) and the battery (3); The electronic device further comprises a supporting component (6), wherein the supporting component (6) is arranged on the main board (5), and the second part (42) is located between the supporting component (6) and the diaphragm (7); The second part (42) comprises a bent portion (421), and along an extension direction L of the flexible circuit board (4), at least part of the supporting component (6) is located between the battery (3) and the bent portion (421), and the supporting component (6) is used to support the second part (42).

2. The electronic device according to claim 1, characterized in that: The distance between the diaphragm (7) and the supporting component (6) is greater than the distance between the diaphragm (7) and the battery (3).

3. The electronic device according to claim 1 or 2, characterized in that: The distance from the supporting member (6) to the second portion (42) is less than or equal to 1 mm; or, The support component (6) is at least partially in contact with the second portion (42).

4. The electronic device according to claim 3, characterized in that: The supporting component (6) comprises a main body portion (61), and the main body portion (61) can be deformed under pressure; Along the thickness direction H, the main body portion (61) is at least partially located below the bent portion (421).

5. The electronic device according to claim 4, characterized in that: The bent portion (421) has a first matching surface (421a), and the main body portion (61) has a second matching surface (611a); At least a portion of the first mating surface (421a) abuts against the second mating surface (611a).

6. The electronic device according to claim 5, characterized in that: The first matching surface (421a) is an arcuate surface, and the second matching surface (611a) is a convex surface formed by a convex structure (611) disposed on the main body (61), and the convex surface abuts against the arcuate surface.

7. The electronic device according to any one of claims 4 to 6, characterized in that: The supporting component (6) further comprises a positioning portion (62), wherein the positioning portion (62) detachably connects the main body portion (61) and the main board (5).

8. The electronic device according to claim 7, characterized in that: The positioning portion (62) comprises a clamping block (612) and a clamping slot; The card block (612) is located on the main body (61), the card slot is located on the main board (5), and the card block (612) and the card slot connect the main body (61) and the main board (5) through card connection.

9. The electronic device according to any one of claims 4 to 6, characterized in that: The main body (61) is made of soft silica gel.

10. The electronic device according to claim 1 or 2, characterized in that: The electronic device also includes an anti-film imprint (8); The film-proof imprint (8) is located between the second portion (42) and the membrane (7), and along the thickness direction H, the projection of the film-proof imprint (8) at least covers the bent portion (421).

11. The electronic device according to claim 10, characterized in that: The minimum distance between the anti-film imprint (8) and the second part (42) is between 0.8 mm and 1.5 mm.

12. The electronic device according to claim 1 or 2, characterized in that: The flexible circuit board (4) further includes a third part (43); Along the extension direction L of the flexible circuit board (4), the second part (42) is located between the first part (41) and the third part (43), and the third part (43) is connected to the main board (5).

Citation Information

Patent Citations

  • Electronic device

    CN212064059U