A pressure sensor for a ventilator

Abstract

This invention relates to the field of sensor technology, specifically a pressure sensor for a ventilator, comprising a ceramic substrate, with a first housing and a second housing respectively disposed on both sides of the ceramic substrate; a through hole is formed on the ceramic substrate, and a pressure chip is disposed on the surface of the through hole; terminal pads for soldering terminals are disposed on any set of symmetrical sides of the ceramic substrate; a conditioning chip, solder pads, and a capacitor are also disposed on the ceramic substrate, with the solder pads respectively connected to the conditioning chip and / or the pressure chip; the capacitors are respectively connected to the solder pads and / or the terminal pads; and an air nozzle is disposed on the first housing and / or the second housing. This device is not only simple in structure and small in size, but also has stable performance and can effectively extend its service life.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to a pressure sensor for ventilators. Background Technology

[0002] The pressure sensor is a core component of a ventilator. In a ventilator, the pressure sensor primarily converts the collected airway pressure values ​​into electrical signals, then sends the measured values ​​to the MCU to accurately determine whether to administer inhalation or exhalation. The MCU then issues commands to control the intake pump, increasing or decreasing the tubing pressure to ensure the patient breathes naturally and smoothly without resistance.

[0003] Existing pressure sensors are prone to deformation under high and low temperatures and pressure stress, which can affect MEMS. Inadequate circuit design can lead to system instability. In addition, time drift and temperature drift can still occur after the sensor chip is packaged.

[0004] Furthermore, existing terminals used to connect sensors to the motherboard are generally manufactured by stamping, and then SMT soldering is performed by drilling holes at corresponding positions on the motherboard. The existing terminals have a wall thickness of 0.3mm and a width of 0.55mm, resulting in weak structural strength. They are prone to deformation during transportation and soldering. After soldering, the terminals are prone to deformation or breakage when vibration occurs during use, leading to poor output. Moreover, the terminals are single-pin stamped, and SMT requires manual placement into the fixture, which is inefficient, costly, and results in poor soldering consistency, making quality control difficult.

[0005] Therefore, a technology is urgently needed to solve this problem. Summary of the Invention

[0006] The purpose of this invention is to overcome the problems of the prior art and provide a pressure sensor for ventilators. The circuit board is made of sintered ceramic plate with aluminum oxide composition to enhance dielectric compatibility and solve the temperature drift problem. A capacitor is set in the circuit to realize overvoltage protection and anti-static protection functions. In addition, the structure is simplified and the performance is stabilized by optimizing the connection of pads, capacitors and chips.

[0007] The above objectives are achieved through the following technical solutions:

[0008] A pressure sensor for a ventilator includes a ceramic substrate. The ceramic substrate has a first surface and a second surface. The first surface and the second surface are respectively provided with a first housing connection area and a second housing connection area that are symmetrical to each other. The first housing area is used to bond a first housing and form a first cavity. The second housing area is used to bond a second housing and form a second cavity. A through hole is formed on the first surface of the substrate corresponding to the first cavity. A pressure chip is disposed on the surface of the through hole, and a retaining ring is disposed around the pressure chip.

[0009] The ceramic substrate has terminal pads for welding terminals on any set of symmetrical sides, and the terminal pads are located outside the first housing and the second housing.

[0010] A conditioning chip and a pad are also provided on the first surface of the substrate, and the pads are respectively connected to the conditioning chip and / or the pressure chip; a capacitor is provided on the corresponding second surface of the substrate in the second cavity, and the capacitor is respectively connected to the pad and / or the terminal pad;

[0011] An air nozzle is provided on the first housing and / or the second housing.

[0012] Furthermore, vias are formed on the ceramic substrate, and the vias are used for connecting the capacitor to the pads and / or the terminal pads.

[0013] Furthermore, there are five vias, including VCC via, VDDA via, OUT via, VDDD via, and GND via;

[0014] The terminal pads are divided into eight groups, including VCC terminal pads, OUT terminal pads and GND terminal pads, and the GND via is located on the GND terminal pads.

[0015] The pads include a first EXHI pad, a second EXHI pad, a first INP pad, a second INP pad, a first EXLO pad, a second EXLO pad, an INN pad, a VDDA pad, a first GND pad, a second GND pad, an OUT pad, a VCC pad, and a VDDD pad;

[0016] The capacitors include capacitor C1, capacitor C2, capacitor C3, and capacitor C4.

[0017] Furthermore, the VDDA capacitor pad of capacitor C1 is connected to the VDDA via, the GND capacitor pad of capacitor C1 is connected to the GND capacitor pad of capacitor C2, the GND capacitor pad of capacitor C2 is connected to the GND via, the VDDD capacitor pad of capacitor C2 is connected to the VDDD via, the VCC capacitor pad of capacitor C3 is connected to both the VCC via and the VCC terminal pad, the GND capacitor pad of capacitor C3 is connected to the GND capacitor pad of capacitor C4, the GND capacitor pad of capacitor C4 is also connected to the GND capacitor pad of capacitor C2, and the OUT capacitor pad of capacitor C4 is connected to both the OUT via and the OUT terminal pad.

[0018] The first EXHI pad is connected to the second EXHI pad, the first INP pad is connected to the second INP pad, the first EXLO pad is connected to the second EXLO pad, the first GND pad is connected to the second GND pad, the second GND pad is connected to the GND via, the VDDA pad is connected to the VDDA via, the OUT pad is connected to the OUT via, the VCC pad is connected to the VCC via, and the VDDD pad is connected to the VDDD via.

[0019] Furthermore, the first EXHI pad, the first INP pad, the first EXLO pad, and the INN pad are respectively connected to the pressure chip.

[0020] Furthermore, the pressure chip includes an IN+ solder joint, an IN- solder joint, an OUT+ solder joint, and two OUT- solder joints. The first EXHI pad is connected to the IN+ solder joint via a gold wire, the first INP pad is connected to the two OUT- solder joints via a gold wire, the first EXLO pad is connected to the IN- solder joint via a gold wire, and the INN pad is connected to the OUT+ solder joint via a gold wire.

[0021] Furthermore, the second EXHI pad, the second INP pad, the second EXLO pad, the INN pad, the VDDA pad, the first GND pad, the second GND pad, the VCC pad, the OUT pad, and the VDDD pad are respectively connected to the conditioning chip.

[0022] Further, the conditioning chip includes INP solder pads, EXLO solder pads, INN solder pads, EXHI solder pads, VDDA solder pads, VSSA solder pads, OUT solder pads, VS solder pads, VSSD solder pads, and VDDD solder pads. The second INP pad is connected to the INP solder pad via a gold wire. The second EXLO pad is connected to the EXLO solder pad via a gold wire. The INN pad is connected to the INN solder pad via a gold wire. The second EXHI pad is connected to the EXHI solder pad via a gold wire. The VDDA pad is connected to the VDDA solder pad via a gold wire. The first GND pad is connected to the VSSA solder pad via a gold wire. The second GND pad is connected to the VSSD solder pad via a gold wire. The OUT pad is connected to the OUT solder pad via a gold wire. The VCC pad is connected to the VS solder pad via a gold wire. The VDDD pad is connected to the VDDD solder pad via a gold wire.

[0023] Furthermore, the terminal includes a first welding portion for welding to a terminal pad and a second welding portion for welding to a motherboard pad, with an elastic reinforcing portion provided between the first welding portion and the second welding portion; the first welding portion, the elastic reinforcing portion and the second welding portion are integrally formed to constitute an arch-shaped terminal body.

[0024] Furthermore, the thickness of the terminal body is 0.3mm to 0.4mm.

[0025] Furthermore, the elastic reinforcement portion is shaped like a "Z", the included angle between the first welding portion and the elastic reinforcement portion is 85°, and the included angle between the second welding portion and the elastic reinforcement portion is 90°.

[0026] Furthermore, the width of the first welded part is 1mm to 1.2mm, and it includes an elevation angle that facilitates snap-fitting, the elevation angle being 25° to 35°.

[0027] Furthermore, symmetrical solder grooves are provided on both sides of the first welding part.

[0028] Furthermore, the width of the elastic reinforcement portion is 0.85mm to 1.35mm.

[0029] Furthermore, the width of a set of bent edges located at the lower end of the elastic reinforcement is 1.35 mm.

[0030] Furthermore, the width of the second welded portion is 0.5mm to 0.6mm.

[0031] Furthermore, the terminal body is made of C5191 phosphor bronze.

[0032] Beneficial effects

[0033] The pressure sensor for ventilators provided by this invention is not only simple in structure and small in size, but also has stable performance and can effectively extend its service life. It also has the following advantages:

[0034] 1. The circuit board is made of sintered ceramic plate with aluminum oxide composition, which can minimize the deformation of the plate under high and low temperature and pressure stress, and reduce the impact on MEMS.

[0035] 2. A capacitor was designed into the circuit to add overvoltage protection and anti-static protection functions;

[0036] 3. The conditioning chip and pressure chip are fixed to the ceramic substrate with adhesive using COB packaging technology;

[0037] 4. An elastic reinforcement has been added to the terminal structure to form an "arch"-shaped structure, which provides a certain degree of elasticity under vibration and impact, thereby increasing the vibration resistance of the ventilator pressure sensor during use and transportation, and thus increasing the stability of output performance.

[0038] 5. The terminal and ventilator motherboard welding method has been changed to solder pads. Compared with solder pad hole welding, terminal welding reduces the drilling process and has the advantage of reducing the board size when space is limited. Attached Figure Description

[0039] Figure 1 This is a perspective view of a pressure sensor for a ventilator according to the present invention;

[0040] Figure 2 This is a cross-sectional view of a pressure sensor for a ventilator according to the present invention;

[0041] Figure 3 This is a schematic diagram of the first side structure of the substrate of a pressure sensor for a ventilator according to the present invention;

[0042] Figure 4 This is a schematic diagram of the second side structure of the substrate of a pressure sensor for a ventilator according to the present invention;

[0043] Figure 5 This is a schematic diagram of the conditioning chip mechanism of a pressure sensor for a ventilator according to the present invention;

[0044] Figure 6 This is a schematic diagram of the pressure chip mechanism of a pressure sensor for a ventilator according to the present invention;

[0045] Figure 7 This is a terminal side view of a pressure sensor for a ventilator according to the present invention;

[0046] Figure 8 This is a perspective view of the terminals of a pressure sensor for a ventilator according to the present invention;

[0047] Figure 9 This is a diagram showing another connection configuration of the nozzle of a pressure sensor for a ventilator according to the present invention.

[0048] Illustration markings:

[0049] 1-Ceramic substrate, 2-First side of substrate, 3-Second side of substrate, 4-First housing connection area, 5-Second housing connection area, 6-First housing, 7-Second housing, 8-First cavity, 9-Second cavity, 10-Through hole, 11-Air nozzle, 12-Retaining ring, 13-INP solder joint, 14-EXLO solder joint, 15-INN solder joint, 16-EXHI solder joint, 17-VDDA solder joint, 18-VSSA solder joint, 19-OUT solder joint, 20-VS solder joint, 21-VSSD solder joint, 22-VDDD solder joint, 23-IN+ solder joint, 24-IN- solder joint, 25-OUT+ solder joint, 26-OUT- solder joint, 27-VCC terminal pad, 28-OUT terminal pad, 29-GND terminal pad, 30-VCC via, 31-VDDA via 32-OUT via, 33-VDDD via, 34-GND via, 35-C1 capacitor, 36-C2 capacitor, 37-C3 capacitor, 38-C4 capacitor, 39-First EXHI pad, 40-Second EXHI pad, 41-First INP pad, 42-Second INP pad, 43-First EXLO pad, 44-Second EXLO pad, 45-INN pad, 46-VDDA pad, 47-First GND pad, 48-Second GND pad, 49-OUT pad, 50-VCC pad, 51-Terminal, 52-First soldering part, 53-Elastic reinforcement part, 54-Second soldering part, 55-Elevation angle, 56-Solder bath, 57-Bent edge, 58-VDDD pad, 59-Conditioning chip, 60-Pressure chip, 61-Identification point. Detailed Implementation

[0050] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. The described embodiments are merely some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Example 1

[0052] like Figure 1 and 2As shown, a pressure sensor for a ventilator includes a ceramic substrate 1. The ceramic substrate 1 includes a first substrate surface 2 and a second substrate surface 3. The first substrate surface 2 and the second substrate surface 3 are respectively provided with a first housing connection area 4 and a second housing connection area 5 that are symmetrical to each other. The first housing area 4 is used to bond a first housing 6 and form a first cavity 8. The second housing area 5 is used to bond a second housing 7 and form a second cavity 9. A through hole 10 is opened on the first substrate surface 2 corresponding to the first cavity 8. A pressure chip 60 is provided on the surface of the through hole 10, and a retaining ring 12 is provided around the pressure chip 60.

[0053] The ceramic substrate 1 has terminal pads for welding terminals 51 on any set of symmetrical sides, and the terminal pads are located outside the first housing 6 and the second housing 7.

[0054] The first surface 2 of the substrate is further provided with a conditioning chip 59 and pads, and the pads are respectively connected to the conditioning chip 59 and / or the pressure chip 60.

[0055] A capacitor is provided on the second surface 3 of the substrate corresponding to the second cavity 9, and the capacitor is connected to the pad and / or the terminal pad respectively;

[0056] An air nozzle 11 is provided on the first housing 6 and / or the second housing 7.

[0057] Specifically, in this embodiment, the ceramic substrate 1 is a circuit board sintered from aluminum oxide, which can minimize the deformation of the board under high and low temperatures and pressure stress, and reduce the impact on MEMS.

[0058] This design also incorporates capacitors in the circuit, which provide overvoltage protection and electrostatic discharge protection.

[0059] The pressure chip 60 and the conditioning chip 59 are fixed to the ceramic substrate 1 using COB packaging technology and appropriate adhesive.

[0060] Electrical signal transmission is achieved by using ultrasonic thermo-press welding of gold wires to achieve electrical conduction.

[0061] In addition, because the operating temperature of the ventilator is required to be 0℃-50℃ and the relative humidity is 45%-75%, the shell is made of injection-molded material with low water absorption deformation rate.

[0062] To ensure correct orientation between the back-end housing and the pins, identification points 61 were added to the ceramic substrate 1, which facilitates the correct assembly of the components.

[0063] There are three types of air nozzles on the housing in this embodiment:

[0064] The first housing 6 has an air nozzle 11, while the second housing does not have an air nozzle;

[0065] The first housing 6 has an air nozzle 11, and the second housing also has an air nozzle 11;

[0066] The first housing 6 does not have an air nozzle 11, while the second housing has an air nozzle 11.

[0067] The connection between the air nozzle 11 and the housing can be a vertical connection (e.g., Figure 1 It can also be a horizontal connection (such as...) Figure 9 ).

[0068] Example 2

[0069] like Figure 3 and 4 As shown, as an optimization of this solution, vias are provided on the ceramic substrate, and the vias are used to connect the capacitor to the pads and / or the terminal pads.

[0070] Specifically, there are 5 vias, including VCC via 30, VDDA via 31, OUT via 32, VDDD via 33 and GND via 34;

[0071] The terminal pads are in eight groups, including VCC terminal pad 27, OUT terminal pad 28 and GND terminal pad 29, and the GND via 34 is located on the GND terminal pad 29.

[0072] The pads include a first EXHI pad 39, a second EXHI pad 40, a first INP pad 41, a second INP pad 42, a first EXLO pad 43, a second EXLO pad 44, an INN pad 45, a VDDA pad 46, a first GND pad 47, a second GND pad 48, an OUT pad 49, a VCC pad 50, and a VDDD pad 58.

[0073] The capacitors include capacitor C1 (35), capacitor C2 (36), capacitor C3 (37), and capacitor C4 (38).

[0074] The connection relationships between the components are as follows:

[0075] The VDDA capacitor pad of capacitor C1 35 is connected to the VDDA via 31. The GND capacitor pad of capacitor C1 35 is connected to the GND capacitor pad of capacitor C2 36. The GND capacitor pad of capacitor C2 36 is connected to the GND via 34. The VDDD capacitor pad of capacitor C2 36 is connected to the VDDD via 33. The VCC capacitor pad of capacitor C3 37 is connected to the VCC via 30 and the VCC terminal pad 27. The GND capacitor pad of capacitor C3 37 is connected to the GND capacitor pad of capacitor C4 38. The GND capacitor pad of capacitor C4 38 is also connected to the GND capacitor pad of capacitor C2 36. The OUT capacitor pad of capacitor C4 38 is connected to the OUT via 32 and the OUT terminal pad 28.

[0076] The first EXHI pad 39 is connected to the second EXHI pad 40, the first INP pad 41 is connected to the second INP pad 42, the first EXLO pad 43 is connected to the second EXLO pad 44, the first GND pad 47 is connected to the second GND pad 48, the second GND pad 48 is connected to the GND via 34, the VDDA pad 46 is connected to the VDDA via 30, the OUT pad 49 is connected to the OUT via 32, the VCC pad 50 is connected to the VCC via 30, and the VDDD pad 58 is connected to the VDDD via 33.

[0077] Example 3

[0078] like Figure 6 As shown, the connection relationship between the pressure chip 60, the capacitor, the pad, and the terminal pad in this embodiment is as follows:

[0079] The first EXHI pad 39, the first INP pad 41, the first EXLO pad 44, and the INN pad 45 are respectively connected to the pressure chip 60.

[0080] Specifically, the pressure chip 60 includes an IN+ solder joint 23, an IN- solder joint 24, an OUT+ solder joint 25, and two OUT- solder joints 26. The first EXHI pad 39 is connected to the IN+ solder joint 23 via a gold wire, the first INP pad 41 is connected to the two OUT- solder joints 26 via a gold wire, the first EXLO pad 43 is connected to the IN- solder joint 24 via a gold wire, and the INN pad 45 is connected to the OUT+ solder joint 25 via a gold wire.

[0081] Example 4

[0082] like Figure 5 As shown, the connection relationship between the conditioning chip 59, the capacitor, the pad, and the terminal pad in this embodiment is as follows:

[0083] The second EXHI pad 40, the second INP pad 42, the second EXLO pad 44, the INN pad 45, the VDDA pad 46, the first GND pad 47, the second GND pad 48, the VCC pad 50, the OUT pad 49, and the VDDD pad 58 are respectively connected to the conditioning chip 59.

[0084] Specifically, the conditioning chip 59 includes INP solder joint 13, EXLO solder joint 14, INN solder joint 15, EXHI solder joint 16, VDDA solder joint 17, VSSA solder joint 18, OUT solder joint 19, VS solder joint 20, VSSD solder joint 21, and VDDD solder joint 22. The second INP pad 42 is connected to the INP solder joint 13 via gold wire, the second EXLO pad 44 is connected to the EXLO solder joint 14 via gold wire, the INN pad 45 is connected to the INN solder joint 15 via gold wire, and the second EXH... Pad 40 is connected to the EXHI solder joint 16 via a gold wire; pad 46 is connected to the VDDA solder joint 17 via a gold wire; first GND pad 47 is connected to the VSSA solder joint 18 via a gold wire; second GND pad 48 is connected to the VSSD solder joint 21 via a gold wire; OUT pad 49 is connected to the OUT solder joint 19 via a gold wire; VCC pad 50 is connected to the VS solder joint 20 via a gold wire; and VDDD pad 58 is connected to the VDDD solder joint 22 via a gold wire.

[0085] Example 5

[0086] like Figure 7 and 8 As shown, this embodiment provides a terminal 51 for connecting the pressure sensor to an external motherboard. The terminal 51 includes a first welding part 52 for welding to a terminal pad and a second welding part 54 for welding to a motherboard pad. An elastic reinforcing part 53 is provided between the first welding part 52 and the second welding part 54. The first welding part 52, the elastic reinforcing part 53 and the second welding part 54 are integrally formed to constitute the bow-shaped terminal 51 body.

[0087] As an optimization of this embodiment:

[0088] The width of the first welding part 52 is 1mm to 1.2mm; the thickness of the terminal body 51 is 0.3mm to 0.4mm; the width of the second welding part 54 is 0.5mm to 0.6mm; the material of the terminal body 51 is C5191 phosphor bronze.

[0089] The elastic reinforcing portion 53 is shaped like a "Z". The inner angle between the first welding portion 52 and the elastic reinforcing portion 53 is 85°, and the inner angle between the second welding portion 54 and the elastic reinforcing portion 53 is 90°. The 85° inner angle between the first welding portion 52 and the elastic reinforcing portion 53 creates an angle with a certain tension, which facilitates clamping along one side of the ceramic substrate 1, thereby achieving rapid connection with the terminal pads.

[0090] In addition, in order to facilitate the quick positioning of the terminal 51 and the terminal pad on the ceramic substrate 1, and also to prevent damage to the terminal pad due to operational errors, an elevation angle 55 is provided at the end of the first welding part 52 to facilitate snap-fit, and the elevation angle 55 is 25° to 35°.

[0091] As a welding method between the first welding part 52 and the pad on the ceramic substrate 1, symmetrical solder grooves 56 are respectively opened on both sides of the first welding part 52. After the first welding part 52 and the pad are positioned, soldering is performed along the solder grooves 56, which can not only effectively fix them, but also prevent solder from overflowing.

[0092] As an optimization of the elastic reinforcement portion 53 described in this embodiment, the width of the elastic reinforcement portion 53 is 0.85mm to 1.35mm.

[0093] In addition, in order to maximize the elastic strength, the width of a set of bent edges 57 located at the lower end of the elastic reinforcement is 1.35 mm.

[0094] The bow-shaped needle structure is designed to mitigate vibration, so that when the machine vibrates or the air tube is under stress during use, the force is not applied entirely to the ceramic plate, which could affect the output or cause damage to the ceramic plate.

[0095] As for the terminal body in the SMT incoming material design: the terminal body is designed in the form of a strip, the spacing between two terminals is 2.54mm, and the number of terminals on a single strip is designed to be an integer multiple of 4, which is convenient for automated soldering by SMT machines.

[0096] The above description is merely illustrative of the embodiments of the present invention and is not intended to limit the present invention. For those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A pressure sensor for a ventilator, characterized in that, The device includes a ceramic substrate, which comprises a first substrate surface and a second substrate surface. The first substrate surface and the second substrate surface are respectively provided with symmetrically arranged first and second shell connection areas. The first shell connection area is used to bond a first shell and form a first cavity. The second shell connection area is used to bond a second shell and form a second cavity. The first cavity and the second cavity are physically isolated by the ceramic substrate. A through hole is formed on the corresponding first substrate surface within the first cavity. A pressure chip is disposed on the surface of the through hole, and a retaining ring is disposed around the pressure chip. The ceramic substrate has terminal pads for welding terminals on any set of symmetrical sides, and the terminal pads are located outside the first housing and the second housing. A conditioning chip and a pad are also provided on the first surface of the substrate, and the pads are respectively connected to the conditioning chip and / or the pressure chip; a capacitor is provided on the second surface of the substrate corresponding to the second cavity, and the capacitor is respectively connected to the pad and / or the terminal pad; a via is formed on the ceramic substrate, and the via is used to connect the capacitor to the pad and / or the terminal pad; An air nozzle is provided on the first housing and / or the second housing; The connection between the air nozzle and the housing can be vertical or horizontal; the air nozzle can be configured in the following ways: the first housing has an air nozzle and the second housing does not; the first housing has an air nozzle and the second housing also has an air nozzle; the first housing does not have an air nozzle and the second housing has an air nozzle. The terminal includes a first welding portion for soldering to a terminal pad and a second welding portion for soldering to a motherboard pad. An elastic reinforcing portion is provided between the first welding portion and the second welding portion. The first welding portion, the elastic reinforcing portion, and the second welding portion are integrally formed to constitute an arch-shaped terminal body. The elastic reinforcing portion is shaped like a zigzag. The included angle between the first welding portion and the elastic reinforcing portion is 85°, and the included angle between the second welding portion and the elastic reinforcing portion is 90°.

2. The pressure sensor for a ventilator according to claim 1, characterized in that, There are 5 vias, including VCC via, VDDA via, OUT via, VDDD via and GND via; The terminal pads are divided into eight groups, including VCC terminal pads, OUT terminal pads and GND terminal pads, and the GND via is located on the GND terminal pads. The pads include a first EXHI pad, a second EXHI pad, a first INP pad, a second INP pad, a first EXLO pad, a second EXLO pad, an INN pad, a VDDA pad, a first GND pad, a second GND pad, an OUT pad, a VCC pad, and a VDDD pad; The capacitors include capacitor C1, capacitor C2, capacitor C3, and capacitor C4.

3. A pressure sensor for a ventilator according to claim 2, characterized in that, The VDDA capacitor pad of capacitor C1 is connected to the VDDA via. The GND capacitor pad of capacitor C1 is connected to the GND capacitor pad of capacitor C2. The GND capacitor pad of capacitor C2 is connected to the GND via. The VDDD capacitor pad of capacitor C2 is connected to the VDDD via. The VCC capacitor pad of capacitor C3 is connected to both the VCC via and the VCC terminal pad. The GND capacitor pad of capacitor C3 is connected to the GND capacitor pad of capacitor C4. The GND capacitor pad of capacitor C4 is also connected to the GND capacitor pad of capacitor C2. The OUT capacitor pad of capacitor C4 is connected to both the OUT via and the OUT terminal pad. The first EXHI pad is connected to the second EXHI pad, the first INP pad is connected to the second INP pad, the first EXLO pad is connected to the second EXLO pad, the first GND pad is connected to the second GND pad, the second GND pad is connected to the GND via, the VDDA pad is connected to the VDDA via, the OUT pad is connected to the OUT via, the VCC pad is connected to the VCC via, and the VDDD pad is connected to the VDDD via.

4. A pressure sensor for a ventilator according to claim 2, characterized in that, The first EXHI pad, the first INP pad, the first EXLO pad, and the INN pad are respectively connected to the pressure chip.

5. A pressure sensor for a ventilator according to claim 4, characterized in that, The pressure chip includes an IN+ solder joint, an IN- solder joint, an OUT+ solder joint, and two OUT- solder joints. The first EXHI pad is connected to the IN+ solder joint via a gold wire, the first INP pad is connected to the two OUT- solder joints via a gold wire, the first EXLO pad is connected to the IN- solder joint via a gold wire, and the INN pad is connected to the OUT+ solder joint via a gold wire.

6. A pressure sensor for a ventilator according to claim 2, characterized in that, The second EXHI pad, the second INP pad, the second EXLO pad, the INN pad, the VDDA pad, the first GND pad, the second GND pad, the VCC pad, the OUT pad, and the VDDD pad are respectively connected to the conditioning chip.

7. A pressure sensor for a ventilator according to claim 6, characterized in that, The conditioning chip includes INP, EXLO, INN, EXHI, VDDA, VSSA, OUT, VS, VSSD, and VDDD solder pads. The second INP pad is connected to the INP solder pad via a gold wire. The second EXLO pad is connected to the EXLO solder pad via a gold wire. The INN pad is connected to the INN solder pad via a gold wire. The second EXHI pad is connected to the EXHI solder pad via a gold wire. The VDDA pad is connected to the VDDA solder pad via a gold wire. The first GND pad is connected to the VSSA solder pad via a gold wire. The second GND pad is connected to the VSSD solder pad via a gold wire. The OUT pad is connected to the OUT solder pad via a gold wire. The VCC pad is connected to the VS solder pad via a gold wire. The VDDD pad is connected to the VDDD solder pad via a gold wire.

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