Laser processing device

Abstract

The present application provides a laser processing device capable of changing the beam diameter of a laser beam without stopping the device during laser processing. A beam adjusting unit of the laser processing device that adjusts the beam diameter of the laser beam includes: a first lens unit and a second lens unit that are movable along the optical path of the laser beam; and a first moving mechanism and a second moving mechanism that move the first lens unit and the second lens unit along the optical path, respectively. A control unit includes a storage section that stores in advance the beam diameter of the laser beam and the positions of the first lens unit and the second lens unit corresponding to the beam diameter, and causes the first moving mechanism and the second moving mechanism to act to move the first lens unit and the second lens unit to the positions corresponding to the prescribed beam diameter.

Description

Technical Field

[0001] This invention relates to laser processing apparatus. Background Technology

[0002] As a method for dividing wafers such as semiconductor wafers, the following method has been proposed: forming a laser processing groove by irradiating a laser beam along a spacer formed on the wafer, and cutting along the laser processing groove using a breaking device (see Patent Document 1).

[0003] A laser processing apparatus for performing such laser processing includes: a chuck stage for holding a workpiece; and a laser beam irradiation unit for irradiating a laser beam onto the workpiece held by the chuck stage. The laser beam irradiation unit includes: a laser oscillator for oscillating laser light; and a focusing lens for focusing the laser beam emitted from the laser oscillator.

[0004] Regarding the laser beam irradiation unit, it is preferable that the laser beam incident on the condenser lens is a collimated beam with a predetermined beam diameter. However, the laser beam emitted from the laser oscillator has individual differences for each laser oscillator and has a divergence angle. In response, a laser processing apparatus has been disclosed that includes a beam adjustment unit disposed between the laser oscillator and the condenser lens for adjusting the beam diameter and divergence angle of the laser beam emitted from the laser oscillator (see Patent Document 2).

[0005] Patent Document 1: Japanese Patent Application Publication No. 10-305420

[0006] Patent Document 2: Japanese Patent Application Publication No. 2008-168323

[0007] However, existing beam adjustment units, after confirming the beam diameter and divergence angle (parallelism) of the laser beam received by a receiver such as a CCD (Charge Coupled Device), require adjustment each time to achieve the desired beam diameter and divergence angle. That is, if a different beam diameter is desired during laser processing, the device must be stopped to perform the adjustment operation for the desired beam diameter and divergence angle, resulting in a decrease in productivity. Summary of the Invention

[0008] Therefore, the object of the present invention is to provide a laser processing apparatus that can change the beam diameter of the laser beam without stopping the apparatus during laser processing.

[0009] According to the present application, there is provided a laser processing apparatus, wherein the laser processing apparatus has: a chuck table that holds a workpiece; a laser beam irradiation unit that irradiates a laser beam to the workpiece held by the chuck table; an input unit that inputs a processing condition of the laser beam; and a control unit that controls at least the chuck table, the laser beam irradiation unit, and the input unit, the laser beam irradiation unit includes: a laser oscillator; a condenser lens that condenses the laser beam emitted from the laser oscillator; and a beam adjustment unit that is provided between the laser oscillator and the condenser lens, adjusts a beam diameter of the laser beam emitted from the laser oscillator, includes: a first lens unit and a second lens unit that are provided on an optical path of the laser beam emitted from the laser oscillator and are provided so as to be movable along the optical path; and a first moving mechanism and a second moving mechanism that move the first lens unit and the second lens unit along the optical path, respectively, the control unit includes a storage section that stores in advance the beam diameter of the laser beam and positions of the first lens unit and the second lens unit corresponding to the beam diameter, and causes the first moving mechanism and the second moving mechanism of the beam adjustment unit to move the first lens unit and the second lens unit to positions corresponding to a prescribed beam diameter input from the input unit.

[0010] According to the present application, it is possible to change the beam diameter of the laser beam without stopping the apparatus in laser processing. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is a perspective view showing a structure example of a laser processing apparatus of an embodiment.

[0012] Figure 2 is a schematic view that schematically shows Figure 1 is a schematic view showing a structure of a laser beam irradiation unit of the laser processing apparatus shown in FIG. 1.

[0013] Figure 3 is a perspective view showing Figure 2 a structure example of a beam adjustment unit of the laser beam irradiation unit shown in FIG. 2.

[0014] Figure 4 is a view showing Figure 1 a structure example of a screen displayed by a touch panel of the laser processing apparatus shown in FIG. 1.

[0015] Figure 5 is a view showing Figure 1 another structure example of a screen displayed by a touch panel of the laser processing apparatus shown in FIG. 1.

[0016] Figure 6 is a view showing Figure 1FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application.

[0017] Figure 7 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 1 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application.

[0018] Reference Signs

[0019] 1: laser processing apparatus; 10: chuck table; 20: laser beam irradiation unit; 21: laser beam; 22: laser oscillator; 23: reference lens; 24: beam adjustment unit; 241: 1st lens unit; 242: 2nd lens unit; 25: beam measurement unit; 26: mirror; 27: condenser lens; 28: processing point; 30: lens moving mechanism; 31: support base; 32: 1st lens support member; 33: 2nd lens support member; 34: 1st moving mechanism; 35: 2nd moving mechanism; 36: 1st lens position detection unit; 37: 2nd lens position detection unit; 80: touch panel; 81: display unit; 82: input unit; 90: control unit; 91: storage section; 92: arithmetic section; 100: workpiece. DETAILED DESCRIPTION

[0020] Embodiments of the present application will be described below in detail with reference to the accompanying drawings. The present application is not limited to the contents described in the following embodiments. In addition, among the structural elements described below, there are structural elements that are substantially the same as those that can be easily conceived by those skilled in the art. Furthermore, the structures described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the structures can be made within a scope that does not depart from the gist of the present application.

[0021] A laser processing apparatus 1 according to an embodiment of the present application will be described with reference to the accompanying drawings. Figure 1 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 2 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 1 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 3 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 2 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 4 Figure 5 Figure 6 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 1 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 7 FIG. 1 is a diagram showing a structure example of a laser processing apparatus 1 according to an embodiment of the present application. Figure 1 ​​An example of the table of the processing condition data 913-1 of the laser processing apparatus 1. The laser processing apparatus 1 of the embodiment is an apparatus that processes a workpiece 100 by irradiating the workpiece 100, which is a processing target, with a laser beam 21.

[0022] As shown in Figure 1 The laser processing apparatus 1 has a chuck table 10, a laser beam irradiation unit 20, an X-axis direction moving unit 40, a Y-axis direction moving unit 50, a Z-axis direction moving unit 60, a photographing unit 70, a touch panel 80, and a control unit 90. In the following description, the X-axis direction is one direction on a horizontal plane. The Y-axis direction is a direction perpendicular to the X-axis direction on the horizontal plane. The Z-axis direction is a direction perpendicular to the X-axis direction and the Y-axis direction. In the laser processing apparatus 1 of the embodiment, the processing feed direction is the X-axis direction, the indexing feed direction is the Y-axis direction, and the focal point position adjustment direction is the Z-axis direction.

[0023] The workpiece 100 is a wafer such as a semiconductor wafer, an optical device wafer, or the like, which is a circular plate-shaped wafer having a substrate of silicon (Si), sapphire (Al2O3), gallium arsenide (GaAs), silicon carbide (SiC), or the like. Note that the workpiece 100 is not limited to the embodiment and can not be circular plate-shaped in the present application. The processing of the workpiece 100 by the laser processing apparatus 1 is, for example, modification layer formation processing of forming a modification layer inside the workpiece 100 by stealth dicing, groove processing of forming a groove on the front surface of the workpiece 100, or cutting processing of cutting the workpiece 100 along a division predetermined line, or the like.

[0024] The chuck table 10 holds the workpiece 100 with a holding surface 11. For example, in a state where a ring-shaped frame 110 is attached to the workpiece 100, a band 111 having a larger diameter than the outer diameter of the workpiece 100 is attached to the back surface of the workpiece 100 and is supported in the opening of the ring-shaped frame 110, the workpiece 100 is placed on the holding surface 11 of the chuck table 10.

[0025] The holding surface 11 is a disc shape formed of porous ceramics or the like. In the embodiment, the holding surface 11 is a plane parallel to the horizontal direction. The holding surface 11 is connected to a vacuum suction source via a vacuum suction path, for example. The chuck table 10 suction-holds the workpiece 100 placed on the holding surface 11. A plurality of jig portions 12 that hold the ring-shaped frame 110 that supports the workpiece 100 are arranged around the chuck table 10.

[0026] The chuck table 10 rotates about an axis parallel to the Z-axis via a rotating unit 13. The rotating unit 13 is supported by an X-axis moving plate 14. The rotating unit 13 and the chuck table 10 move along the X-axis via the X-axis moving plate 14 and the X-axis moving unit 40. The rotating unit 13 and the chuck table 10 move along the Y-axis via the X-axis moving plate 14, the X-axis moving unit 40, and the Y-axis moving plate 15 and the Y-axis moving unit 50.

[0027] The laser beam irradiation unit 20 is a unit that irradiates the workpiece 100 held by the chuck table 10 with a pulsed laser beam 21. For example... Figure 2 As shown, the laser beam irradiation unit 20 includes a laser oscillator 22, a beam adjustment unit 24, a beam measurement unit 25, a reflector 26, and a focusing lens 27. At least the focusing lens 27 in the laser beam irradiation unit 20 is supported by a Z-axis direction moving unit 60, which is positioned to... Figure 1 The main body 2 of the laser processing device 1 shown is vertically mounted on a column 3.

[0028] The laser oscillator 22 emits a laser beam 21 of a specified wavelength for processing the workpiece 100. The laser beam 21 emitted by the laser beam irradiation unit 20 is a wavelength that is either transmissible or absorptive to the workpiece 100.

[0029] The beam adjustment unit 24 adjusts the beam diameter of the laser beam 21 emitted from the laser oscillator 22. In one embodiment, the beam adjustment unit 24 is disposed between the laser oscillator 22 and the beam measurement unit 25, but in this invention, it can be disposed at any position as long as it is between the laser oscillator 22 and the focusing lens 27. The beam adjustment unit 24 includes a reference lens 23, a first lens unit 241, a second lens unit 242, and a lens moving mechanism 30.

[0030] A reference lens 23 is disposed between the laser oscillator 22 and the first lens unit 241 in the optical path of the laser beam 21 emitted from the laser oscillator 22. In an embodiment, the reference lens 23 is a plano-convex lens, but it is not limited to this in the present invention. The reference lens 23 is a lens that serves as a reference for the positions of the first lens unit 241 and the second lens unit 242, which are movable under the control of the control unit 90 described later, and is not moved under the control of the control unit 90.

[0031] The first lens unit 241 is configured to move along the optical path of the laser beam 21 emitted from the laser oscillator 22. In an embodiment, the first lens unit 241 is a plano-concave lens disposed between the reference lens 23 and the second lens unit 242. In an embodiment, the first lens unit 241 comprises a single lens, but in this invention, it may also consist of multiple lens groups. The first lens unit 241 is positioned at a first distance 243 from the reference lens 23 along the optical axis. The first distance 243 can be adjusted by moving the first lens unit 241 along the optical path using the first moving mechanism 34 of the lens moving mechanism 30, which will be described later.

[0032] The second lens unit 242 is configured to move along the optical path of the laser beam 21 emitted from the laser oscillator 22. In one embodiment, the second lens unit 242 is a biconvex lens disposed between the first lens unit 241 and the beam measurement unit 25. In one embodiment, the second lens unit 242 comprises a single lens, but in this invention, it may also consist of multiple lens groups. The second lens unit 242 is positioned at a second distance 244 from the first lens unit 241 along the optical path. The second distance 244 can be adjusted by moving the second lens unit 242 along the optical path using the second moving mechanism 35 of the lens moving mechanism 30, which will be described later.

[0033] The beam adjustment unit 24 can adjust the beam diameter of the laser beam 21 emitted from the laser oscillator 22 by adjusting the first distance 243 and the second distance 244 between the first lens unit 241 and the second lens unit 242. At this time, the beam adjustment unit 24 can adjust the laser beam 21 emitted from the laser oscillator 22 with a divergence angle into a parallel laser beam 21.

[0034] The lens moving mechanism 30 moves the first lens unit 241 and the second lens unit 242 along the optical path of the laser beam 21, respectively. Figure 3 As shown, the lens moving mechanism 30 includes a support base 31, a first lens support component 32, a second lens support component 33, a first moving mechanism 34, a second moving mechanism 35, a first lens position detection unit 36, and a second lens position detection unit 37.

[0035] The support base 31 includes a first guide rail 311 and a second guide rail 312. The first guide rail 311 and the second guide rail 312 are arranged such that their two sides are parallel to each other and parallel to the optical path of the laser beam 21.

[0036] The first lens support member 32 is provided so as to be movable along the first guide rail 311 of the support base 31. The first lens support member 32 includes a first guided rail 321. The first guided rail 321 is fitted to the first guide rail 311 of the support base 31. The first guided rail 321 is movable along the first guide rail 311, so that the first lens support member 32 is movable in a direction parallel to the optical path of the laser beam 21. The first lens support member 32 supports the first lens unit 241. That is, the first lens unit 241 is integrally movable with the first lens support member 32 in a direction parallel to the optical path of the laser beam 21.

[0037] The second lens support member 33 is provided so as to be movable along the second guide rail 312 of the support base 31. The second lens support member 33 includes a second guided rail 331. The second guided rail 331 is fitted to the second guide rail 312 of the support base 31. The second guided rail 331 is movable along the second guide rail 312, so that the second lens support member 33 is movable in a direction parallel to the optical path of the laser beam 21. The second lens support member 33 supports the second lens unit 242. That is, the second lens unit 242 is integrally movable with the second lens support member 33 in a direction parallel to the optical path of the laser beam 21.

[0038] The first moving mechanism 34 moves the first lens support member 32 along the first guide rail 311 of the support base 31, so as to move the first lens unit 241 along the optical path of the laser beam 21. The first moving mechanism 34 includes an externally threaded rod 341, a pulse motor 342, a bearing block 343, an internally threaded block 344, and a through internally threaded hole 345.

[0039] The externally threaded rod 341 is provided in parallel to the first guide rail 311 of the support base 31. The externally threaded rod 341 is provided so as to be rotatable about an axis. The pulse motor 342 is fixedly provided to the support base 31 at one end side of the externally threaded rod 341. The pulse motor 342 is a drive source for rotationally driving the externally threaded rod 341. An output shaft of the pulse motor 342 is coupled to the externally threaded rod 341. The pulse motor 342 is controlled by a control unit 90 described later. The bearing block 343 is fixedly provided to the support base 31 at the other end side of the externally threaded rod 341. The bearing block 343 supports the externally threaded rod 341 so as to be rotatable about an axis. The internally threaded block 344 is fixedly provided to the first lens support member 32. The through internally threaded hole 345 is formed in the internally threaded block 344. The through internally threaded hole 345 is screwed to the externally threaded rod 341.

[0040] The pulse motor 342 drives the external thread rod 341 in the forward direction or the reverse direction, whereby the internal thread block 344 moves along the external thread rod 341. Thus, the first lens support member 32 to which the internal thread block 344 is fixed moves along the first guide rail 311, and therefore the first lens unit 241 supported by the first lens support member 32 moves along the optical path of the laser beam 21. That is, the first moving mechanism 34 controls the pulse motor 342 so that the control unit 90 described later drives the external thread rod 341 in the forward direction or the reverse direction, whereby the first lens unit 241 moves along the optical path of the laser beam 21.

[0041] The second moving mechanism 35 moves the second lens support member 33 along the second guide rail 312 of the support base 31, and thereby moves the second lens unit 242 along the optical path of the laser beam 21. The second moving mechanism 35 includes an external thread rod 351, a pulse motor 352, a bearing block 353, an internal thread block 354, and a through internal thread hole (not shown).

[0042] The external thread rod 351 is disposed in parallel with the second guide rail 312 of the support base 31. The external thread rod 351 is disposed so as to be rotatable about an axis. The pulse motor 352 is fixedly disposed at one end portion side of the external thread rod 351 to the support base 31. The pulse motor 352 is a drive source for rotationally driving the external thread rod 351. An output shaft of the pulse motor 352 is coupled to the external thread rod 351. The pulse motor 352 is controlled by the control unit 90 described later. The bearing block 353 is fixedly disposed at the other end portion side of the external thread rod 351 to the support base 31. The bearing block 353 supports the external thread rod 351 so as to be rotatable about an axis. The internal thread block 354 is fixedly disposed to the second lens support member 33. A through internal thread hole (not shown) is formed in the internal thread block 354. The through internal thread hole is screwed with the external thread rod 351.

[0043] The pulse motor 352 drives the external thread rod 351 in the forward direction or the reverse direction, whereby the internal thread block 354 moves along the external thread rod 351. Thus, the second lens support member 33 to which the internal thread block 354 is fixed moves along the second guide rail 312, and therefore the second lens unit 242 supported by the second lens support member 33 moves along the optical path of the laser beam 21. That is, the second moving mechanism 35 controls the pulse motor 352 so that the control unit 90 described later drives the external thread rod 351 in the forward direction or the reverse direction, whereby the second lens unit 242 moves along the optical path of the laser beam 21.

[0044] The first lens position detection unit 36 detects the moving position of the first lens unit 241. The first lens position detection unit 36 includes a linear scale 361 and a reading head 362.

[0045] The linear scale 361 is provided in parallel with the externally threaded rod 341 of the first moving mechanism 34. The reading head 362 is provided on the internally threaded block 344 fixed to the first lens support member 32. The reading head 362 moves along the linear scale 361. The reading head 362 detects the moving position of the first lens unit 241 corresponding to the linear scale 361. The reading head 362 transmits a detection signal to the control unit 90 described later.

[0046] The second lens position detection unit 37 detects the moving position of the second lens unit 242. The second lens position detection unit 37 includes a linear scale 371 and a reading head 372.

[0047] The linear scale 371 is provided in parallel with the externally threaded rod 351 of the second moving mechanism 35. The reading head 372 is provided on the internally threaded block 354 fixed to the second lens support member 33. The reading head 372 moves along the linear scale 371. The reading head 372 detects the moving position of the second lens unit 242 corresponding to the linear scale 371. The reading head 372 transmits a detection signal to the control unit 90 described later.

[0048] In addition, the detection unit that detects the moving positions of the first lens unit 241 and the second lens unit 242 is not limited to the embodiment, and in the present application, for example, the calculation can be performed based on the count value of the driving pulse that drives the pulse motor 342 of the first moving mechanism 34 and the pulse motor 352 of the second moving mechanism 35.

[0049] Figure 2 The illustrated beam measurement unit 25 measures the beam diameter of the laser beam 21 whose beam diameter is adjusted by the beam adjustment unit 24. The beam measurement unit 25 is provided so as to be movable to a position at which the laser beam 21 whose beam diameter is adjusted by the beam adjustment unit 24 is received. In the embodiment, the beam measurement unit 25 is provided downstream of the beam adjustment unit 24. The beam measurement unit 25 includes, for example, a beam profiler that measures the beam diameter and the spatial intensity distribution of the laser beam 21. The beam profiler, for example, photographs the laser beam 21, and acquires a planar image of the laser beam 21 that shows the shape and the spatial intensity distribution of the laser beam 21. In addition, the position at which the beam diameter of the laser beam 21 is measured by the beam measurement unit 25 is not limited to the embodiment, and in the present application, it can be a condensing point after being condensed by the condensing lens 27, a position at which the condensing point is diverged, or the like.

[0050] The mirror 26 reflects the laser beam 21, and reflects it toward the workpiece 100 held by the holding surface 11 of the chuck table 10. In the embodiment, the mirror 26 reflects the laser beam 21 whose beam diameter is adjusted by the beam adjustment unit 24 toward the condensing lens 27.

[0051] The condenser lens 27 condenses the laser beam 21 emitted from the laser oscillator 22 to be irradiated on the workpiece 100 held by the holding surface 11 of the chuck table 10. The condenser lens 27 condenses the laser beam 21 reflected by the mirror 26 to the machining point 28.

[0052] In the embodiment, the machining point 28, which is the condensing point of the laser beam 21, is set on the front surface of the workpiece 100. While the laser beam 21 is irradiated on the machining point 28, the chuck table 10 is subjected to machining feed, so that a laser-machined groove along the division predetermined line is formed on the front surface of the workpiece 100.

[0053] Figure 1 The X-axis direction moving unit 40 shown is a unit that relatively moves the chuck table 10 and the laser beam irradiation unit 20 in the X-axis direction as the machining feed direction. In the embodiment, the X-axis direction moving unit 40 moves the chuck table 10 in the X-axis direction. In the embodiment, the X-axis direction moving unit 40 is provided on the device main body 2 of the laser machining device 1. The X-axis direction moving unit 40 supports the X-axis direction moving plate 14 so as to be movable in the X-axis direction.

[0054] The X-axis direction moving unit 40 includes a publicly known ball screw 41, a publicly known pulse motor 42, and a publicly known guide rail 43. The ball screw 41 is provided so as to be rotatable around an axis. The pulse motor 42 rotates the ball screw 41 around the axis. The guide rail 43 supports the X-axis direction moving plate 14 so as to be movable in the X-axis direction. The guide rail 43 is fixedly provided to the Y-axis direction moving plate 15.

[0055] The Y-axis direction moving unit 50 is a unit that relatively moves the chuck table 10 and the laser beam irradiation unit 20 in the Y-axis direction as the indexing feed direction. The Y-axis direction moving unit 50 moves the chuck table 10 in the Y-axis direction. In the embodiment, the Y-axis direction moving unit 50 is provided on the device main body 2 of the laser machining device 1. The Y-axis direction moving unit 50 supports the Y-axis direction moving plate 15 so as to be movable in the Y-axis direction.

[0056] The Y-axis direction moving unit 50 includes a publicly known ball screw 51, a publicly known pulse motor 52, and a publicly known guide rail 53. The ball screw 51 is provided so as to be rotatable around an axis. The pulse motor 52 rotates the ball screw 51 around the axis. The guide rail 53 supports the Y-axis direction moving plate 15 so as to be movable in the Y-axis direction. The guide rail 53 is fixedly provided to the device main body 2.

[0057] The Z-axis direction moving unit 60 is a unit that relatively moves the chuck table 10 and the laser beam irradiation unit 20 in the Z-axis direction as a condensing point position adjustment direction. In the embodiment, the Z-axis direction moving unit 60 moves the laser beam irradiation unit 20 in the Z-axis direction. In the embodiment, the Z-axis direction moving unit 60 is provided to the column 3 that is vertically provided from the device main body 2 of the laser processing device 1. The Z-axis direction moving unit 60 supports at least the condensing lens 27 (refer to Figure 2 ) in the laser beam irradiation unit 20 so as to be movable in the Z-axis direction.

[0058] The Z-axis direction moving unit 60 includes a publicly known ball screw 61, a publicly known pulse motor 62, and a publicly known guide rail 63. The ball screw 61 is provided so as to be rotatable around an axis. The pulse motor 62 rotates the ball screw 61 around the axis. The guide rail 63 supports the laser beam irradiation unit 20 so as to be movable in the Z-axis direction. The guide rail 63 is fixedly provided to the column 3.

[0059] The photographing unit 70 photographs the workpiece 100 held by the chuck table 10. The photographing unit 70 includes a CCD camera or an infrared camera that photographs the workpiece 100 held by the chuck table 10. The photographing unit 70 is fixed, for example, in a manner adjacent to the condensing lens 27 (refer to Figure 2 ) of the laser beam irradiation unit 20. The photographing unit 70 photographs the workpiece 100 to obtain an image for performing alignment of the workpiece 100 with the laser beam irradiation unit 20, and outputs the obtained image to the control unit 90 described later.

[0060] The touch panel 80 is provided to the laser processing device 1 in a state in which a display surface faces an outer side. Various screens displayed by the touch panel 80 have screen structures corresponding to kinds and versions of programs that operate in the laser processing device 1. A setting screen displayed by the touch panel 80 is configured to include a device structure of the laser processing device 1, that is, setting items corresponding to components provided to the laser processing device 1 and kinds of the components, and the like. The touch panel 80 has a display unit 81 and an input unit 82.

[0061] The display unit 81 is configured from a display device such as a liquid crystal display (LCD), an organic EL display (OELD), or an inorganic EL display (IELD).

[0062] The display unit 81 displays various screens related to the operation of the laser processing apparatus 1 and the like. The display unit 81 displays various screens in accordance with the control of the arithmetic unit 92 of the control unit 90 described later. The various screens include, for example, the menu screen 83 illustrated in Figure 4 Figure 5 Figure 6 the processing condition data list screen 84 illustrated in

[0063] Figure 1 The input unit 82 inputs the processing condition of the laser beam 21 to be irradiated to the work 100 to the laser processing apparatus 1 in accordance with the operation of the operation screen displayed on the display unit 81 by the operator.

[0064] The input unit 82 can be configured to include an input device such as a touch panel. In the case where the input unit 82 is configured by a touch panel, the input unit 82 can detect the contact or proximity of the finger, pen, stylus, or the like of the operator. The detection method of the touch panel can be any of an electrostatic capacity method, a resistive film method, a surface acoustic wave method, an infrared ray method, a load detection method, and the like.

[0065] In the configuration example illustrated in Figure 4 , a plurality of menu buttons 831 to 837 for executing the maintenance, operation, setting, and the like of the laser processing apparatus 1 are displayed in the menu screen 83. The menu button 831 can receive an operation for displaying an operation screen related to full automation. In addition, the menu button 832 can receive an operation for displaying an operation screen related to manual operation. In addition, the menu button 833 can receive an operation for displaying the processing condition data list screen 84 illustrated in Figure 5 and Figure 6 . In addition, the menu button 834 can receive an operation for displaying an operation screen related to laser maintenance. In addition, the menu button 835 can receive an operation for displaying an operation screen related to operator maintenance. In addition, the menu button 836 can receive an operation for displaying an operation screen related to machine maintenance. In addition, the menu button 837 can receive an operation for displaying an operation screen related to engineering maintenance.

[0066] For example, in the case where the arithmetic unit 92 of the control unit 90 described later detects the operation of the operator who selects the menu button 833 in the menu screen 83 illustrated in Figure 4 , Figure 5 and Figure 6 the processing condition data list screen 84 illustrated in is displayed on the display unit 81.The processing condition data list screen 84 shown is displayed on the touch panel 80. In the processing condition data list screen 84, a list of the processing condition data of the workpiece 100 is displayed. The processing condition data list screen 84 includes a directory display section 85, a list display section 86, a data number display section 87, an enter button 88, and an exit button 89.

[0067] In the directory display section 85, a list of the directories in which the processing condition data of the workpiece 100 is stored is displayed. As exemplified by the images 851 to 856, in the directory display section 85, information of the directories is displayed by a prescribed icon image and a directory name composed of a character string such as "List Sample 1". As for the directory name, a directory name set by the operator at the time of storing the processing condition data can be displayed.

[0068] In the list display section 86, a list of the file names of the processing condition data stored in the directory is displayed. For example, as shown in the image 861, the arithmetic section 92 of the control unit 90 described later displays a list of the file names of the processing condition data stored in the directory whose directory name is "List Sample 1". Figure 5 Figure 6 As shown in the image 861, the arithmetic section 92 of the control unit 90 described later displays a list of the file names of the processing condition data stored in the directory whose directory name is "List Sample 1".

[0069] As exemplified by the images 861 to 864, in the list display section 86, information of the processing condition data is displayed by a data number composed of a numeral such as "110" and a file name composed of a character string such as "Beam Diameter_A-1". The data number can be a unique number automatically assigned in the laser processing apparatus 1 at the time of storing the processing condition data. As for the file name, a file name set by the operator at the time of storing the processing condition data can be displayed. In the example shown in the image 861, the processing condition data includes data related to the beam diameter of the laser beam 21. Figure 6

[0070] In the data number display section 87, a data number uniquely assigned to the processing condition data selected is displayed. For example, as shown in the image 863, in a case where the arithmetic section 92 of the control unit 90 described later detects an operator's operation of selecting the image 863 corresponding to the processing condition data of the beam diameter of "Data Number: 130" and "File Name: Beam Diameter_B-1", the data number display section 87 is caused to display the data number "130" of the processing condition data selected. Figure 6

[0071] ​​​The enter button 88 is assigned an execution function of various operations corresponding to the screen being displayed in the touch panel 80. For example, when the processing condition data list screen 84 is being displayed in the touch panel 80, as one of the functions assigned to the enter button 88, there is a function of displaying a setting screen of the processing condition data selected in the list display section 86. With respect to the arithmetic section 92 of the control unit 90 described later, for example, in a state where the data number of the processing condition data is displayed in the data number display section 87, when an operation of the enter button 88 is detected, the touch panel 80 displays a setting screen of the processing condition data selected (for example, data number: "130" and file name: "beam diameter_B-1").

[0072] The setting screen of the processing condition data includes, for example, a processing condition data display section that displays a plurality of setting items of the processing condition data individually. By the operator touching an arbitrary file name displayed in the list display section 86, the processing condition data display section displays the individual processing condition data on the setting screen of the processing condition data. In the setting screen, a setting value set by the operator can be input to each item displayed in the processing condition data display section from the input unit 82. The touch panel 80 can display a user interface such as a soft keyboard on the display unit 81 according to the detection result of the input unit 82. For example, when an operation of an item of the processing condition data display section of the setting screen is detected, the touch panel 80 can display a drop-down menu or a soft keyboard corresponding to the item or the like.

[0073] The exit button 89 is assigned a function of causing the touch panel 80 to display the menu screen 83 illustrated in FIG. 8 again, or the like. The arithmetic section 92 of the control unit 90 described later, for example, causes the touch panel 80 to display the menu screen 83 illustrated in FIG. 8 again when an operation of the exit button 89 is detected. Figure 4 Figure 4

[0074] Figure 1 The control unit 90 illustrated in FIG. 8 is a computer including an arithmetic processing device as an arithmetic unit, a storage device as a storage unit, and an input / output interface device as a communication unit. The arithmetic processing device includes, for example, a microprocessor such as a CPU (Central Processing Unit). The storage device has a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory). The arithmetic processing device performs various arithmetic operations according to a prescribed program stored in the storage device. The arithmetic processing device outputs various control signals to the above-described structural elements via the input / output interface device in accordance with the arithmetic result, thereby performing control of the laser processing device 1. The control unit 90 includes the storage section 91 and the arithmetic section 92. ​​

[0075] The storage unit 91 is capable of storing programs and data used to implement various processes executed by the control unit 90. The storage unit 91 stores control program 911, system data 912, and processing condition data 913.

[0076] The control program 911 provides functions for controlling the processing of the laser processing apparatus 1. More specifically, the control program 911 provides functions for controlling the operation of the rotating unit 13, the laser beam irradiation unit 20, the lens moving mechanism 30, the X-axis moving unit 40, the Y-axis moving unit 50, the Z-axis moving unit 60, the imaging unit 70, and the touch panel 80.

[0077] System data 912 is data related to the system structure of the laser processing apparatus 1. System data 912 includes data related to the screen structure of the various operation screens displayed on the touch panel 80.

[0078] Processing condition data 913 comprises multiple data points related to the basic conditions of laser processing. Processing condition data 913 is stored, for example, in a prescribed directory. Processing condition data 913 includes processing condition data generated by the operator in laser processing apparatus 1 and copies of other processing condition data generated in laser processing apparatus 1.

[0079] The processing condition data generated by the operator in the laser processing apparatus 1 includes processing condition data 913-1 set for each laser processing apparatus 1, corresponding to the mechanical errors between apparatuses. For example... Figure 7 As illustrated, the processing condition data 913-1 includes the beam diameter of the laser beam 21 and the first lens unit 241 and the second lens unit 242 corresponding to the beam diameter (see reference). Figure 2 Data linked to positions such as (etc.). Figure 7 In one example shown, the processing condition data 913-1 includes data that associates a filename consisting of strings such as "beam diameter_A-1" with the positions of the first lens unit 241 and the second lens unit 242 used to form the beam diameter corresponding to the filename. The string "beam diameter_A-1" corresponds to the filename displayed on the overview display unit 86. Alternatively, a data number consisting of digits such as "110" can be used instead of the string "beam diameter_A-1". Figure 7 In one example shown, the positions of the first lens unit 241 and the second lens unit 242 are represented by a first distance 243 and a second distance 244 (see reference). Figure 2(etc.) indicates. Processing condition data 913-1 is generated for each laser processing apparatus 1, for example, during the manufacture of the laser processing apparatus 1, at the time of factory shipment, etc. Therefore, even for the same type of laser processing apparatus 1, the processing condition data 913-1 may sometimes differ for each individual laser processing apparatus 1.

[0080] The arithmetic unit 92 controls each of the above-mentioned structural elements of the laser processing apparatus 1 according to the control program 911 stored in the storage unit 91, so that the laser processing apparatus 1 performs processing operations on the workpiece 100. The arithmetic unit 92 controls the rotation unit 13, the laser beam irradiation unit 20, the lens moving mechanism 30, the X-axis moving unit 40, the Y-axis moving unit 50, the Z-axis moving unit 60, the imaging unit 70, and the touch panel 80.

[0081] The arithmetic unit 92, for example, calculates the beam diameter of the laser beam 21 and the first lens unit 241 and the second lens unit 242 corresponding to the beam diameter (see reference). Figure 2 The position of (etc.) is stored in the storage unit 91 as processing condition data 913. The arithmetic unit 92, for example, causes the imaging unit 70 to capture an image of the workpiece 100. The arithmetic unit 92, for example, performs image processing on the image captured by the imaging unit 70. The arithmetic unit 92, for example, detects the processing line of the workpiece 100 through image processing. The arithmetic unit 92, for example, causes the first moving mechanism 34 and the second moving mechanism 35 (see reference) to... Figure 2 The arithmetic unit 92, for example, drives the X-axis direction movement unit 40 to move the processing point 28, which serves as the focusing point of the laser beam 21, along the processing line, and causes the laser beam irradiation unit 20 to irradiate the laser beam 21.

[0082] As explained above, in the laser processing apparatus 1 of the embodiment, the storage unit 91 of the control unit 90 pre-stores the beam diameter of the laser beam 21 and the positions of the first lens unit 241 and the second lens unit 242 corresponding to the beam diameter. The beam diameter of the laser beam 21 and the positions of the first lens unit 241 and the second lens unit 242 corresponding to the beam diameter stored in the storage unit 91 are set according to each laser processing apparatus 1 in accordance with the inter-device mechanical error. The beam diameter of the laser beam 21 and the positions of the first lens unit 241 and the second lens unit 242 corresponding to the beam diameter stored in the storage unit 91 can also be set according to the frequency of each laser beam 21 emitted from the laser oscillator 22.

[0083] The processing condition data, such as the beam diameter of the laser beam 21 and the positions of the first lens unit 241 and the second lens unit 242 corresponding to the beam diameter, can be generated, for example, by measuring the beam diameter of the laser beam 21 at each of the first distances 243 and the second distances 244 using the beam measurement unit 25.

[0084] In the laser processing apparatus 1 of this embodiment, the control unit 90 activates the first moving mechanism 34 and the second moving mechanism 35 of the beam adjustment unit 24, moving the first lens unit 241 and the second lens unit 242 to positions corresponding to the predetermined beam diameter specified from the input unit 82. At this time, the control unit 90 moves the first lens unit 241 and the second lens unit 242 according to processing condition data pre-stored in the storage unit 91. That is, the laser processing apparatus 1 can automatically change the beam diameter of the laser beam 21 to the respective beam diameters specified from the input unit 82, thus enabling adjustment to the desired beam diameter in a short time and providing repeatability for the same beam diameter.

[0085] Therefore, the laser processing apparatus 1 does not require adjustment of the beam diameter each time, thus facilitating the selection of laser processing conditions for processing different devices. For example, even when processing wafers with different materials, thicknesses, and spacing dimensions, the beam diameter incident on the condenser lens 27 can be easily changed for processing. Furthermore, the beam diameters of the first and second paths can be easily changed, allowing for the combination of laser beams 21 with various beam diameters for laser processing.

[0086] Furthermore, the device does not need to be stopped to adjust the beam diameter, and adjustments can be made automatically even during laser processing, thus reducing the time spent on adjustment operations and suppressing productivity losses. In addition, the beam diameter of the laser beam 21 and the positions of the first lens unit 241 and the second lens unit 242 corresponding to the beam diameter are set according to each laser processing device 1, thus reducing mechanical errors between devices.

[0087] Furthermore, the present invention is not limited to the embodiments described above. That is, various modifications can be made without departing from the spirit of the present invention.

Claims

1. A laser processing apparatus, wherein the laser processing apparatus has: a chuck table that holds a workpiece; a laser beam irradiation unit that irradiates a laser beam to the workpiece held by the chuck table; an input unit that inputs a processing condition of the laser beam; and a control unit that controls at least the chuck table, the laser beam irradiation unit, and the input unit, the laser beam irradiation unit includes: a laser oscillator; a condenser lens that condenses a laser beam emitted from the laser oscillator; and a beam adjustment unit that is provided between the laser oscillator and the condenser lens, adjusts a beam diameter of the laser beam emitted from the laser oscillator and having a divergence angle, and adjusts to a parallel laser beam, the beam adjustment unit includes: a first lens unit and a second lens unit that are provided on an optical path of the laser beam emitted from the laser oscillator and are provided so as to be movable along the optical path; and a first moving mechanism and a second moving mechanism that move the first lens unit and the second lens unit, respectively, along the optical path, the control unit includes a storage section that stores, in advance for each laser processing apparatus, a beam diameter of a laser beam and positions of the first lens unit and the second lens unit corresponding to the beam diameter in correspondence with an apparatus-to-apparatus mechanical error, the control unit does not need to detect the beam diameter and the divergence angle of the laser beam during laser processing, but directly causes the first moving mechanism and the second moving mechanism of the beam adjustment unit to act so as to move the first lens unit and the second lens unit to positions corresponding to a prescribed beam diameter input from the input unit, based on the relationship between the beam diameter and the positions stored in the storage section.

Images