Electronic device

Abstract

An electronic device is provided, including a display element layer, an encapsulation layer, a sensor layer, and a high-refraction layer disposed on the sensor layer, wherein the sensor layer includes a sensing electrode disposed in an effective area, and a sensing line electrically connected with the sensing electrode and extending in a first direction, disposed in a line area. The sensor layer further includes a first conductive layer disposed on the encapsulation layer, a second conductive layer disposed on the first conductive layer, an inorganic insulating layer disposed between the first conductive layer and the second conductive layer, and an organic insulating layer disposed between the second conductive layer and the high-refraction layer. The organic insulating layer includes at least one opening in the line area, the at least one opening extending in a second direction, and the inorganic insulating layer is exposed through the at least one opening.

Description

[0001] Cross-references to related applications

[0002] This patent application claims priority and benefit to Korean Patent Application No. 10-2020-0061696, filed on May 22, 2020, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to electronic devices including sensor layers. Background Technology

[0004] Electronic devices include an effective area activated by electrical signals. The electronic device can sense input applied from the outside through the effective area and simultaneously display various images to provide information to the user.

[0005] Electronic devices may include various elements activated by electrical signals, such as display elements, touch elements, or detection elements. Furthermore, structures including optical functional layers on display elements and methods for forming these optical functional layers have been developed to improve the display quality of electronic devices. Summary of the Invention

[0006] This disclosure provides an electronic device with improved reliability by controlling (or adjusting) the position of the high-refractive layer.

[0007] In one aspect, an embodiment provides an electronic device including an effective region and a line region disposed adjacent to the effective region. The electronic device includes: a display element layer; an encapsulation layer disposed on the display element layer; a sensor layer including a sensing electrode disposed in the effective region and a sensing line disposed in the line region, electrically connected to the sensing electrode and extending in a first direction; and a high-refractive-index layer disposed on the sensor layer. The sensor layer may further include: a first conductive layer disposed on the encapsulation layer; a second conductive layer disposed on the first conductive layer; an inorganic insulating layer disposed between the first conductive layer and the second conductive layer; and an organic insulating layer disposed between the second conductive layer and the high-refractive-index layer. In the line region, at least one opening is defined in the organic insulating layer, the at least one opening extending in a second direction different from the first direction, and the inorganic insulating layer is exposed by the at least one opening in the organic insulating layer.

[0008] In an embodiment, a plurality of contact holes may be defined in the inorganic insulating layer, and the plurality of contact holes may include a first contact hole and a second contact hole defined on one side and the other side of at least one opening in the organic insulating layer, respectively.

[0009] In one embodiment, the first conductive layer and the second conductive layer can be electrically connected to each other through the first contact hole and the second contact hole in a plurality of contact holes.

[0010] In one embodiment, the first and second contact holes among the plurality of contact holes may be filled by a second conductive layer.

[0011] In an embodiment, the first and second contact holes among the plurality of contact holes may overlap with the organic insulating layer, but may not overlap with the high-refractive layer.

[0012] In the implementation, the first direction may extend from the effective area to the line area, and the second direction may be perpendicular to the first direction.

[0013] In one embodiment, the electronic device may further include a plurality of embankments disposed in the online region and surrounding at least a portion of the effective region. These embankments may be disposed adjacent to the effective region and may not overlap with at least one opening in the organic insulating layer.

[0014] In an embodiment, the line region may include: a first portion disposed adjacent to the effective region, wherein a plurality of embankments are disposed in the first portion; a second portion overlapping at least one opening of the organic insulating layer; and a third portion disposed between the first and second portions. The inorganic insulating layer, the organic insulating layer, and the high-refractive-index layer may overlap each other in the first portion of the line region; the inorganic insulating layer may not overlap with the organic insulating layer and the high-refractive-index layer in the second portion of the line region; and the inorganic insulating layer may overlap with the organic insulating layer and may not overlap with the high-refractive-index layer in the third portion of the line region.

[0015] In one embodiment, the first conductive layer, the inorganic insulating layer, the second conductive layer, the organic insulating layer, and the high-refractive-index layer may be formed sequentially in the first part of the online region, the first conductive layer and the inorganic insulating layer may be formed in the second part of the online region, and the first conductive layer, the inorganic insulating layer, the second conductive layer, and the organic insulating layer may be formed sequentially in the third part of the online region.

[0016] In one embodiment, the electronic device may further include an adhesive layer disposed on the high-refractive-index layer and a polarizer layer disposed on the adhesive layer. The adhesive layer may contact the high-refractive-index layer in a first portion of the online region, contact the exposed inorganic insulating layer in a second portion of the online region, and contact the organic insulating layer in a third portion of the online region.

[0017] In one embodiment, at least one opening in the organic insulating layer may include a bottom portion defined by the exposed inorganic insulating layer and a side portion defined by the organic insulating layer overlapping the second conductive layer. The angle of inclination of the side portion relative to the bottom portion may range from about 100° to about 110°.

[0018] In an implementation, the plurality of dikes may include a first dike disposed adjacent to the effective area, a second dike disposed outside the first dike, and a third dike disposed outside the second dike, and the high-refractive layer may have a thickness that gradually decreases in the direction from the first dike to the third dike.

[0019] In an implementation, in a plan view, the edge of the high-refractive layer may overlap with the third embankment.

[0020] In an implementation, the high-refractive-index layer may have a refractive index equal to or greater than about 1.6.

[0021] In one embodiment, the electronic device may also include a plurality of sub-protrusions spaced apart from each other in at least one opening in the organic insulating layer.

[0022] In one implementation, the multiple sub-protrusions and the organic insulating layer may comprise the same material.

[0023] In another aspect, an electronic device comprising an effective region, a line region disposed adjacent to the effective region, and a pad region spaced apart from and adjacent to the line region may include: a display element layer; a package layer disposed on the display element layer; a sensor layer including a sensing electrode disposed in the effective region and a sensing line disposed in the line region, electrically connected to the sensing electrode and extending in a first direction; and a high-refractive-index layer disposed on the sensor layer. The sensor layer may further include: a first conductive layer disposed on the package layer; a second conductive layer disposed on the first conductive layer; an inorganic insulating layer disposed between the first conductive layer and the second conductive layer; and an organic insulating layer disposed between the second conductive layer and the high-refractive-index layer. In the line region, a first opening and a second opening are defined in the organic insulating layer, each of the first and second openings extending in a second direction different from the first direction. The second opening may be configured to be closer to the pad region than the first opening. A first contact hole is defined in the inorganic insulating layer in the line region on one side adjacent to the first opening in the effective region, and a second contact hole is defined in the inorganic insulating layer on one side adjacent to the second opening in the pad region.

[0024] In an implementation, the second direction may be perpendicular to the first direction, and each of the first opening and the second opening may have a strip shape extending in the second direction in a plan view.

[0025] In one embodiment, the electronic device may further include an adhesive layer disposed on the high-refractive-index layer and filling a first opening in the organic insulating layer, and a polarizer layer disposed on the adhesive layer.

[0026] In one embodiment, the adhesive layer may contact the inorganic insulating layer exposed through the first or second opening, but may not contact the second conductive layer. Attached Figure Description

[0027] An additional understanding of the embodiments of the present invention will become more apparent from the detailed description of the embodiments with reference to the accompanying drawings, wherein:

[0028] Figure 1 This is a schematic perspective view showing an electronic device according to an embodiment;

[0029] Figure 2 This is a schematic cross-sectional view showing an electronic device according to an embodiment;

[0030] Figure 3 This is a schematic cross-sectional view showing an electronic device according to an embodiment;

[0031] Figure 4 This is a schematic plan view showing the sensor layer according to an embodiment;

[0032] Figure 5 This is a schematic plan view showing an electronic device according to an embodiment;

[0033] Figure 6 This is a schematic plan view showing a portion of an electronic device according to an embodiment;

[0034] Figure 7 This is a schematic cross-sectional view showing a portion of an electronic device according to an embodiment;

[0035] Figure 8 This is a schematic plan view showing a portion of an electronic device according to an embodiment;

[0036] Figure 9A This is a schematic plan view showing a portion of an electronic device according to an embodiment;

[0037] Figure 9B This is a schematic plan view showing a portion of an electronic device according to an embodiment;

[0038] Figure 10 This is a schematic perspective view showing a portion of the opening according to an embodiment;

[0039] Figure 11 This is a schematic cross-sectional view showing a portion of an electronic device according to an embodiment;

[0040] Figure 12 This is a schematic cross-sectional view showing a portion of an electronic device according to an embodiment;

[0041] Figure 13 This is a schematic cross-sectional view showing a portion of an electronic device according to an embodiment; and

[0042] Figure 14This is a schematic plan view showing a portion of an electronic device according to an embodiment. Detailed Implementation

[0043] Because this disclosure can be implemented in various ways, preferred embodiments are shown in the accompanying drawings and described in the detailed description of the invention. However, this does not limit this disclosure to the specific embodiments, and it should be understood that this disclosure covers all modifications, equivalents, and substitutions within the spirit and scope of the invention.

[0044] In this specification, it will also be understood that when a component (or region, layer, part) is referred to as being “on”, “connected to”, or “linked to” another component, it may be directly set on a component, or connected to or linked to a component, or there may be an intermediate third component.

[0045] In this application, it will be understood that when a layer, film, region, or plate is in "direct contact" with another layer, film, region, or plate, there is no other layer, film, region, or plate between them. For example, if a layer is "directly disposed" on another layer, then that layer may be disposed on that other layer without the use of additional members such as adhesive members.

[0046] The same reference numerals throughout the text denote the same elements. Furthermore, in the accompanying drawings, the thickness, scale, and dimensions of components may be exaggerated for clarity.

[0047] The term “and / or” includes any and all combinations of one or more of the associated listed items.

[0048] It will be understood that although terms such as “first” and “second” are used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one component from others. For example, a first element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless otherwise stated, singular terms may include plural forms.

[0049] The terms “below,” “under,” “above,” “over,” etc., are used to explain the relational relationships of the components shown in the accompanying drawings. These terms can be relative concepts and are described based on the orientation shown in the drawings. It will also be understood that when an element or layer is referred to as being “on” another element or layer, it may be positioned above or below that other element or layer.

[0050] Unless otherwise defined or implied herein, all terms used (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms such as those defined in a general dictionary shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and shall not be interpreted in an ideal or overly formal sense unless clearly defined in the specification.

[0051] It will also be understood that, when used in this specification, the terms “comprising,” “including,” “having,” etc., indicate the presence of the stated features, integrals, steps, operations, elements, components, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof.

[0052] In the specification and claims, for purposes of meaning and interpretation, the phrase “at least one of…” is intended to include the meaning of “at least one selected from the group of…”. For example, “at least one of A and B” can be understood to mean “A, B, or A and B”.

[0053] In the following description, an electronic device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0054] Figure 1 This is a schematic perspective view showing an electronic device according to an embodiment. Figure 2 It is along Figure 1 A schematic cross-sectional view taken along line I-I'. (Refer to...) Figure 1 and Figure 2 The electronic device ED according to the embodiment can be activated by an electrical signal. Although the electronic device ED can be, for example, a mobile phone, a tablet computer, a navigation unit for a vehicle, a game console, or a wearable device, the embodiment is not limited to these. Figure 1 An example of an electronic device ED is shown, which is a mobile phone.

[0055] An electronic device ED can display an image through an effective area AA. The effective area AA may include a flat surface defined by a first direction axis DR1 and a second direction axis DR2 (or parallel to the first direction axis DR1 and the second direction axis DR2). The effective area AA may also include a curved surface extending from at least one side of the flat surface defined by the first direction axis DR1 and the second direction axis DR2 (or parallel to the first direction axis DR1 and the second direction axis DR2). Figure 1The electronic device ED of the embodiment includes two curved surfaces extending from two side surfaces of a flat surface defined by a first directional axis DR1 and a second directional axis DR2 (or parallel to the first directional axis DR1 and the second directional axis DR2). However, the embodiment is not limited to the shape of the effective region AA shown. For example, the effective region AA may include only the flat surface, or it may also include at least two curved surfaces, for example, four curved surfaces extending from the four side surfaces of the flat surface.

[0056] Despite Figure 1 The first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 are shown in the accompanying figures below. However, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 reflect relative concepts and are interchangeable. The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be referred to as the first direction to the third direction and may be represented by the same reference numerals (i.e., DR1, DR2, and DR3).

[0057] In this specification, the first direction axis DR1 and the second direction axis DR2 are perpendicular to each other, and the third direction axis DR3 is the normal direction relative to the plane defined by the first direction axis DR1 and the second direction axis DR2.

[0058] The thickness direction of the electronic device ED may be parallel to a third directional axis DR3, which is the normal direction relative to the plane defined by the first directional axis DR1 and the second directional axis DR2. In this specification, the front (or top) and rear (or bottom) surfaces of the components of the electronic device ED may be defined based on the third directional axis DR3.

[0059] like Figure 2 As shown, the electronic device ED may include a display layer DP and a sensor layer TP disposed on the display layer DP. The electronic device ED may also include an optical layer PP disposed on the sensor layer TP. The electronic device ED may also include a window WP disposed on the sensor layer TP. The window WP may be disposed on the optical layer PP, and an adhesive member AP may be disposed between the optical layer PP and the window WP.

[0060] The display layer DP may include a substrate layer BS, a circuit layer CL disposed on the substrate layer BS, a display element layer EDL disposed on the circuit layer CL, and a packaging layer TFE disposed on the display element layer EDL. The packaging layer TFE may cover the display element layer EDL or overlap with the display element layer EDL.

[0061] The substrate layer BS can be a component that provides a substrate surface on which the display element layer EDL is disposed. The substrate layer BS can be a glass substrate, a metal substrate, a polymer substrate, etc. However, the implementation is not limited to this. For example, the substrate layer BS can be an inorganic layer, an organic layer, or a composite material layer.

[0062] The base layer BS may have a multilayer structure. For example, the base layer BS may have a three-layer structure comprising a synthetic resin layer, an adhesive layer, and a synthetic resin layer. Specifically, the synthetic resin layer may include a polyimide-based resin. The synthetic resin layer may include at least one selected from acrylate-based resins, methacrylate-based resins, polyisoprene-based resins, vinyl resin-based resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyamide-based resins, and parylene-based resins. In this specification, the term "X-based" resin indicates a feature including a functional group of "X".

[0063] A circuit layer CL may be disposed on a substrate layer BS. The circuit layer CL may include an insulating layer, semiconductor patterns, conductive patterns, and signal lines. The insulating layer, semiconductor patterns, and conductive patterns may be provided by methods such as coating and deposition, and then the insulating layer, semiconductor patterns, and conductive patterns may be selectively patterned by a photolithography process. Subsequently, semiconductor patterns, conductive patterns, and signal lines included in the circuit layer CL can be provided.

[0064] The display element layer (EDL) can be disposed on the circuit layer (CL). The display element layer (EDL) may include light-emitting elements. For example, the display element layer (EDL) may include organic light-emitting elements, quantum dot light-emitting elements, micro LED light-emitting elements, or nano LED light-emitting elements.

[0065] The encapsulation layer TFE may be disposed on the display element layer EDL. The encapsulation layer TFE may include at least one organic layer and at least one inorganic layer. For example, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer sequentially laminated (or formed). However, the implementation is not limited to the layers included in the encapsulation layer TFE.

[0066] A sensor layer (TP) can be placed on the display layer (DP). The sensor layer (TP) can sense external input applied from the outside. External input can be user input. For example, user input can include various types of external input, such as a part of the user's body, light, heat, a pen, or pressure.

[0067] The sensor layer TP can be provided on the display layer DP via a continuous process. In one embodiment, the sensor layer TP can be directly disposed on the display layer DP. The feature of direct disposal may mean that no third component is disposed between the sensor layer TP and the display layer DP. For example, no separate adhesive member may be disposed between the sensor layer TP and the display layer DP. As another example, the sensor layer TP can be directly disposed on the encapsulation layer TFE.

[0068] However, the implementation is not limited to this. For example, an adhesive member (not shown) may also be provided between the sensor layer TP and the display layer DP.

[0069] An optical layer PP may be disposed on a sensor layer TP. The optical layer PP may include at least one of optical functional layers such as an optical path control layer that modulates the optical path or an anti-reflection layer that reduces the reflectivity of external light incident from the outside. For example, the optical layer PP may be a polarizer in an electronic device ED according to an embodiment.

[0070] A window WP can be disposed on the optical layer PP. The window WP can correspond to the top layer of the electronic device ED. The window WP can be a reinforced tempered glass substrate. The window WP can have a tempered surface to stably protect the sensor layer TP and the display layer DP from external impacts. According to embodiments, the window WP may also include a printed layer (not shown) disposed at the inner or outer edge. For example, the printed layer (not shown) may correspond to the peripheral area NAA (see reference). Figure 5 ).

[0071] The adhesive component AP can also be disposed between the window WP and the optical layer PP. The adhesive component AP may include an optically transparent adhesive layer.

[0072] Figure 3 This is a schematic cross-sectional view showing an electronic device according to an embodiment. Figure 3 It corresponds to the effective area AA of the electronic device ED (refer to...) Figure 1 A schematic cross-sectional view of a portion of ( ).

[0073] At least one inorganic layer is provided on the top surface of the substrate layer BS in the display layer DP. The inorganic layer may include at least one of alumina, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be multilayered. The multilayer inorganic layers may form (or constitute) a barrier layer and / or a buffer layer. In this embodiment, the display layer DP includes a buffer layer BFL.

[0074] The buffer layer BFL enhances the bonding strength between the substrate layer BS and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer, and the silicon oxide layer and silicon nitride layer may be laminated (or formed) alternately with each other.

[0075] Semiconductor patterns may be disposed on the buffer layer BFL. The semiconductor pattern may include polycrystalline silicon. However, the implementation is not limited to this. For example, the semiconductor pattern may include amorphous silicon or metal oxide.

[0076] Figure 3Only a portion of the semiconductor pattern is shown, and the semiconductor pattern may also be disposed on another region. The semiconductor pattern may be arranged on the pixels according to specific rules. The semiconductor pattern may have electrical characteristics at least partially determined by the doping of the semiconductor pattern. The semiconductor pattern may include doped and undoped regions. The doped regions may be doped with n-type or p-type dopant. A p-type transistor may include a doped region doped with p-type dopant, and an n-type transistor may include a doped region doped with n-type dopant.

[0077] Doped regions can have higher conductivity than undoped regions and can essentially function as electrodes or signal lines. Undoped regions essentially correspond to the active layer (or channel) of a transistor. In other words, a portion of a semiconductor pattern can be the active layer of a transistor, another portion can be the source or drain of a transistor, and yet another portion can be a connection electrode or a connection signal line.

[0078] Each pixel can have an equivalent circuit including seven transistors, a capacitor and a light-emitting element, and the equivalent circuit of a pixel can be converted into various circuits. Figure 3 An example is shown that includes a transistor TR and a light-emitting element EMD in a pixel.

[0079] The source S1, active layer A1, and drain D1 of the transistor TR can be provided from a semiconductor pattern. The source S1 and drain D1 can extend from the active layer A1 in opposite directions in the cross section. Figure 3 A portion of the connection signal line SCL provided from a semiconductor pattern is shown. Although not shown separately, the connection signal line SCL may be electrically connected to the drain D1 of the transistor TR on a plane or layer.

[0080] A first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may commonly overlap with the pixel and cover or overlap with the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In an embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. In addition to the first insulating layer 10, the insulating layer of the circuit layer CL, which will be described below, may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. Although the inorganic layer may include at least one of the above materials, the embodiments are not limited thereto.

[0081] The gate G1 of transistor TR is disposed on the first insulating layer 10. Gate G1 may be part of a metal pattern. Gate G1 overlaps with the active layer A1. Gate G1 may act as a mask during the doping of the semiconductor pattern.

[0082] A second insulating layer 20 may be disposed on the first insulating layer 10 to cover the gate G1 or overlap with the gate G1. The second insulating layer 20 may commonly overlap with a pixel. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. In an embodiment, the second insulating layer 20 may be (or include) a single-layer silicon oxide layer.

[0083] A third insulating layer 30 may be disposed on the second insulating layer 20, and in the embodiment, the third insulating layer 30 may be (or include) a single layer of silicon oxide.

[0084] A first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 can be electrically connected to the connection signal line SCL through the contact hole CNT-1 passing through the first insulating layer 10, the second insulating layer 20 and the third insulating layer 30.

[0085] A fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be (or include) a single layer of silicon oxide. A fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be (or include) an organic layer.

[0086] A second connecting electrode CNE2 may be disposed on the fifth insulating layer 50. The second connecting electrode CNE2 can be electrically connected to the first connecting electrode CNE1 through the contact hole CNT-2 passing through the fourth insulating layer 40 and the fifth insulating layer 50.

[0087] A sixth insulating layer 60 may be disposed on the fifth insulating layer 50 to cover the second connecting electrode CNE2 or overlap with the second connecting electrode CNE2. The sixth insulating layer 60 may be (or include) an organic layer.

[0088] The display element layer (EDL), including the light-emitting element (EMD), can be disposed on the circuit layer (CL). The light-emitting element (EMD) may include a first electrode (AE), a light-emitting layer (EL), and a second electrode (CE).

[0089] The first electrode AE ​​can be disposed on the sixth insulating layer 60. The first electrode AE ​​can be electrically connected to the second connecting electrode CNE2 through the contact hole CNT-3 passing through the sixth insulating layer 60.

[0090] A pixel defining layer 70 may be disposed on the sixth insulating layer 60 to overlap a portion of the first electrode AE. An opening 70-OP is defined (or formed) in the pixel defining layer 70. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE. In this embodiment, the light-emitting region PXA may be defined as the region corresponding to the portion of the first electrode AE ​​exposed by the opening 70-OP. A non-light-emitting region NPXA may surround the light-emitting region PXA.

[0091] A light-emitting layer (EL) may be disposed on the first electrode AE. The EL may be disposed within the opening 70-OP. For example, the EL may be provided individually in each of the pixels. In the case where the EL is provided individually in each of the pixels, each of the ELs may emit light having at least one color selected from blue, red, and green. However, the implementation is not limited to this. For example, the EL may be electrically connected to the pixels and disposed publicly. In this case, the EL may provide blue light or white light. The EL may comprise an organic light-emitting material or a quantum dot material.

[0092] The second electrode CE can be disposed on the light-emitting layer EL. The second electrode CE can have an integral shape and be disposed in common within the pixel.

[0093] Although not shown, a hole transport region may be provided between the first electrode AE ​​and the light-emitting layer EL. The hole transport region may be commonly provided in the light-emitting region PXA and the non-light-emitting region NPXA. The hole transport region may include a hole transport layer and may also include a hole injection layer. An electron transport region may be provided between the light-emitting layer EL and the second electrode CE. The electron transport region may include an electron transport layer and may also include an electron injection layer. The hole transport region and the electron transport region may be provided as common layers in the pixel. However, the implementation is not limited to this. For example, the hole transport region and the electron transport region may also be patterned corresponding to the light-emitting region PXA.

[0094] The encapsulation layer TFE can be disposed on the display element layer EDL. The encapsulation layer TFE can also be disposed on the second electrode CE.

[0095] The sensor layer TP may include a sensor substrate layer BS-TP, a first conductive layer ML1, an inorganic insulating layer IPV, a second conductive layer ML2, and an organic insulating layer OPV.

[0096] The sensor substrate layer BS-TP can be an inorganic layer comprising one of silicon nitride, silicon oxynitride, and silicon oxide. As another example, the sensor substrate layer BS-TP can be an organic layer comprising an epoxy resin, an acrylate resin, or an imide resin. The sensor substrate layer BS-TP can have a monolayer structure or a multilayer structure laminated (or formed) on a third-party DR3.

[0097] Each of the first conductive layer ML1 and the second conductive layer ML2 may have a monolayer structure or a multilayer structure laminated on the third conductive layer DR3. The conductive layer with a monolayer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof. The transparent conductive layer may include transparent conductive oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), and indium zinc tin oxide (IZTO). Furthermore, the transparent conductive layer may include conductive polymers such as PEDOT, metal nanowires, or graphene.

[0098] The conductive layers ML1 and ML2, which have a multilayer structure, may include metal layers. For example, the metal layers may have a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti). The conductive layers ML1 and ML2, which have a multilayer structure, may include at least one metal layer and at least one transparent conductive layer.

[0099] The second conductive layer ML2 may have a thickness greater than that of the first conductive layer ML1. For example, the second conductive layer ML2 may have a thickness approximately 1.5 times that of the first conductive layer ML1. For example, the first conductive layer ML1 may have a thickness approximately... The thickness, and the second conductive layer ML2 can have approximately The thickness of the conductive layer is not limited to this. However, the implementation is not limited to the thickness of the conductive layer. For example, in an implementation, the first conductive layer ML1 may have a thickness equal to the thickness of the second conductive layer ML2, and the first conductive layer ML1 may have a thickness greater than the thickness of the second conductive layer ML2.

[0100] The inorganic insulating layer IPV may include at least one of alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic insulating layer IPV may have a surface energy different from that of the high-refractive-index layer HL, which will be described below. The high-refractive-index resin used to manufacture the high-refractive-index layer HL may have low adhesion to the inorganic insulating layer IPV. Therefore, when a high-refractive-index resin is provided, it may not diffuse onto the inorganic insulating layer IPV.

[0101] The organic insulating layer OPV may include at least one selected from acrylate-based resins, methacrylate-based resins, polyisoprene-based resins, vinyl resins, epoxy-based resins, urethane-based resins, cellulose-based resins, siloxane-based resins, polyimide-based resins, polyamide-based resins, and dinaphthalene-based phenyl resins. The organic insulating layer OPV may have a surface energy similar to that of the high-refractive-index layer HL. The high-refractive-index resin used to manufacture the high-refractive-index layer HL may have high adhesion to the organic insulating layer OPV. Therefore, when a high-refractive-index resin is provided, it can be readily applied and diffused onto the organic insulating layer OPV.

[0102] In this embodiment, the organic insulating layer (OPV) may have a greater thickness than the inorganic insulating layer (IPV). The organic insulating layer (OPV) may have a thickness approximately five times greater than the inorganic insulating layer (IPV). The inorganic insulating layer (IPV) may have a thickness of approximately... The thickness, and the organic insulating layer OPV can have approximately to approximately The thickness. However, the thickness of each of the inorganic insulating layer IPV and the organic insulating layer OPV is not limited to the values ​​mentioned above.

[0103] Pixel openings OP can be defined (or formed) within a portion of the organic insulating layer OPV. Pixel openings OP can overlap with the light-emitting region PXA. Pixel openings OP can expose the top surface of the inorganic insulating layer IPV.

[0104] A high-refractive-index layer HL may be disposed on an organic insulating layer OPV. The high-refractive-index layer HL may be disposed in a pixel aperture OP. The high-refractive-index layer HL may have a refractive index greater than that of the organic insulating layer OPV. The high-refractive-index layer HL may have a refractive index equal to or greater than about 1.6. The high-refractive-index layer HL may include a siloxane resin. In addition to a siloxane resin, the high-refractive-index layer HL may include at least one of zirconium oxide particles, alumina particles, and titanium oxide particles. For example, the high-refractive-index layer HL may have a refractive index equal to or greater than about 1.6 and equal to or less than about 1.75. Specifically, the high-refractive-index layer HL may have a refractive index of about 1.7. The difference between the refractive index of the high-refractive-index layer HL and the refractive index of the organic insulating layer OPV may be about 0.1 or greater than about 0.1. For example, the organic insulating layer OPV may have a refractive index of about 1.4 to about 1.55. Specifically, the organic insulating layer OPV may have a refractive index of about 1.53.

[0105] Although not shown in the accompanying drawings, an optical control layer (not shown) may also be provided below the high-refractive-index layer HL. The optical control layer may have a refractive index relatively lower than that of the high-refractive-index layer HL. For example, the optical control layer may have a refractive index of about 1.4 to about 1.55. Specifically, the optical control layer may have a refractive index of about 1.53.

[0106] For example, the high-refractive-index layer HL in the effective region AA can have an average thickness of approximately 1.8 mm. Linear region WA (refer to example) Figure 4 The high-refractive-index layer HL in the active region AA can have a smaller thickness than the high-refractive-index layer HL in the active region AA.

[0107] Light emitted from the light-emitting layer EL can be emitted in both the lateral and forward directions, for example, in a direction parallel to the third directional axis DR3. Optical efficiency can be determined based on the light emitted in the forward direction. Light emitted in the lateral direction of the electronic device ED according to the embodiment can be refracted or totally reflected by the difference in refractive index between the high-refractive-index layer HL and the side surface of the organic insulating layer OPV defining the pixel opening OP. Therefore, the light emitted in the lateral direction can have an optical path that changes in or adjacent to the third directional axis DR3. Thus, the electronic device ED including the high-refractive-index layer HL according to the embodiment can exhibit improved optical efficiency characteristics.

[0108] Figure 4This is a schematic plan view illustrating a sensor layer according to an embodiment. The sensor layer TP can sense external input applied from the outside. External input can be user input. For example, user input can include various types of external input, such as a part of the user's body, light, heat, a pen, or pressure. The sensor layer TP can include a sensing area TP-AA and a peripheral area NAA. The sensing area TP-AA can be activated by an electrical signal. For example, the sensing area TP-AA can sense the input. The peripheral area NAA can surround the sensing area TP-AA. The sensing area TP-AA can correspond to the effective area AA of the electronic device ED.

[0109] The sensor layer TP may include sensing electrodes Tx and Rx disposed on a sensing region TP-AA corresponding to the effective region AA, and a sensing line SL extending in a first direction DR1 while being electrically connected to the sensing electrodes Tx and Rx and disposed in the line region WA. For example, the sensor layer TP may include a first sensing electrode Tx, a second sensing electrode Rx, a first sensing line TL, and a second sensing line RL.

[0110] The first sensing electrode Tx and the second sensing electrode Rx can be disposed in the sensing region TP-AA. The sensor layer TP can obtain information about the external input by the change in the mutual capacitance between the first sensing electrode Tx and the second sensing electrode Rx.

[0111] Each of the first sensing electrodes Tx may extend in a direction parallel to the first direction axis DR1. The first sensing electrodes Tx may be spaced apart from each other in a direction parallel to the second direction axis DR2. Each of the second sensing electrodes Rx may extend in a direction parallel to the second direction axis DR2. The second sensing electrodes Rx may be spaced apart from each other in a direction parallel to the first direction axis DR1. The first sensing electrodes Tx and the second sensing electrodes Rx may intersect each other.

[0112] Each of the first sensing electrodes Tx may include a first portion Tx-a and a second portion Tx-b defined between adjacent first portions Tx-a. The first portion Tx-a may be referred to as a sensing portion, and the second portion Tx-b may be referred to as a connecting portion or a cross portion.

[0113] The first portion Tx-a and the second portion Tx-b can be electrically connected to each other to have an integral shape. Therefore, the second portion Tx-b can be defined as a part of the first sensing electrode Tx that intersects with the second sensing electrode Rx. The first portion Tx-a and the second portion Tx-b can be disposed on the same layer.

[0114] Each of the second sensing electrodes Rx may include a sensing pattern Rx-a and a bridging pattern Rx-b electrically connected to two adjacent sensing patterns Rx-a within the sensing pattern Rx-a. The sensing pattern Rx-a and the bridging pattern Rx-b may be disposed on different layers. Although in Figure 4 The example shows two bridging patterns Rx-b connecting two sensing patterns Rx-a, but different numbers of bridging patterns Rx-b (e.g., one bridging pattern Rx-b or three bridging patterns Rx-b) can connect sensing patterns Rx-a.

[0115] The first part Tx-a, the second part Tx-b, and the sensing pattern Rx-a can be disposed on the same layer. The bridging pattern Rx-b can be disposed on a different layer than the first part Tx-a, the second part Tx-b, and the sensing pattern Rx-a. For example, the bridging pattern Rx-b can be included in the first conductive layer ML1 (see reference). Figure 3 The first portion Tx-a, the second portion Tx-b, and the sensing pattern Rx-a may be included in the second conductive layer ML2 (see reference). Figure 3 However, the implementation is not limited to this. For example, the bridging pattern Rx-b and the second part Tx-b can be arranged in various ways as long as they are set on different layers.

[0116] Each of the first sensing electrode Tx and the second sensing electrode Rx may be electrically connected to a corresponding sensing line SL of the first sensing line TL and the second sensing line RL. For example, the first sensing electrode Tx may be connected to the first sensing line TL. The second sensing electrode Rx may be electrically connected to the second sensing line RL. However, the implementation is not limited to the connection relationship between the first sensing line TL and the second sensing line RL and the first sensing electrode Tx and the second sensing electrode Rx shown. For example, the first sensing electrode Tx may be electrically connected to two first sensing lines TL. The first sensing electrode Tx may include one end electrically connected to the first sensing line TL and the other end electrically connected to another first sensing line TL.

[0117] Here, Figure 4 The shapes of the sensing electrodes Tx and Rx, the number of sensing electrodes Tx and Rx, and the connection relationships between the sensing lines SL are merely illustrative. However, the implementation is not limited to these.

[0118] Figure 5 This is a schematic plan view showing a portion of an electronic device according to an embodiment. Figure 6 It shows the corresponding Figure 5 A schematic plan of part of the EE area. Figure 7 It is along Figure 6 A schematic cross-sectional view taken from line II-II'. Figure 8This is a schematic plan view showing a portion of an electronic device according to an embodiment. Figure 8 It shows the corresponding Figure 6 A floor plan of part of the GG area.

[0119] Reference Figures 5 to 8 According to the embodiments, the electronic device ED may include an active area AA and a peripheral area NAA. The peripheral area NAA may include a line area WA and a pad area PA. The line area WA of the peripheral area NAA may be adjacent to the active area AA, and the line area WA may be disposed between the active area AA and the pad area PA. The pad area PA is provided with a pad PD. The pad PD may be electrically connected to a corresponding sensing line SL.

[0120] Here, a portion of the line region WA in the electronic device ED according to the embodiment may be bent relative to a virtual bending axis BX extending in a direction parallel to the second direction axis DR2, and folded in the rear direction of the electronic device ED.

[0121] The optical layer edge PP-ED can be positioned adjacent to the effective region AA relative to the bending axis BX. The optical layer edge PP-ED can be spaced apart from the edge DM-ED of the electronic device ED. For example, a portion of the line region WA may not be adjacent to the optical layer PP (see reference). Figure 11 Overlap. The optical layer edge PP-ED can represent the polarizer layer PL (refer to...). Figure 11 The edge of ).

[0122] The electronic device ED according to the embodiment may include a display element layer EDL (refer to...) Figure 3 ), and the encapsulation layer TFE disposed on the display element layer EDL, including sensing electrodes Tx and Rx (refer to Figure 4 ) as well as the sensor layer TP of the sensing line SL, and the high refractive layer HL disposed on the sensor layer TP.

[0123] The sensor layer TP may include a first conductive layer ML1 disposed on the encapsulation layer TFE, a second conductive layer ML2 disposed on the first conductive layer ML1, an inorganic insulating layer IPV disposed between the first conductive layer ML1 and the second conductive layer ML2, and an organic insulating layer OPV disposed between the second conductive layer ML2 and the high refractive layer HL.

[0124] The encapsulation layer TFE may include a first inorganic layer IL1, an organic layer OL, and a second inorganic layer IL2. The first inorganic layer IL1, the organic layer OL, and the second inorganic layer IL2 protect the display element layer EDL (see reference). Figure 3It is protected from moisture or oxygen and prevents the introduction of foreign matter such as dust particles. Each of the first inorganic layer IL1 and the second inorganic layer IL2 may include at least one of silicon nitride, silicon oxynitride, and silicon oxide. For example, in an embodiment, each of the first inorganic layer IL1 and the second inorganic layer IL2 may include titanium oxide or aluminum oxide. However, the embodiment is not limited thereto. The organic layer OL may include an acrylic resin. However, the embodiment is not limited thereto.

[0125] At least one opening, including openings OV-1 and OV-2, may be defined in the organic insulating layer OPV. Openings OV-1 and OV-2 may be provided in the line region WA. Openings OV-1 and OV-2 extend in a second direction DR2, different from a first direction DR1, which is the extension direction of the line. The first direction DR1 may extend from the effective region AA to the line region WA.

[0126] The inorganic insulating layer IPV can be exposed through openings OV-1 and OV-2. For example, at least a portion of the organic insulating layer OPV and the second conductive layer ML2 can be removed, and the inorganic insulating layer IPV can be exposed at openings OV-1 and OV-2.

[0127] Reference Figure 7 A first opening OV-1 and a second opening OV-2 can be defined in the organic insulating layer OPV. The first opening OV-1 and the second opening OV-2 can be distinguished based on the organic protrusion DM-T disposed between them. Here, the organic protrusion DM-T and the organic insulating layer OPV can be the same layer.

[0128] In one embodiment, the first opening OV-1 and the second opening OV-2 may be spaced apart from each other. The second opening OV-2 may be positioned closer to the pad region PA than the first opening OV-1.

[0129] The inorganic insulating layer IPV can be exposed in the first opening OV-1 and the second opening OV-2, and the exposed inorganic insulating layer IPV can avoid contact with the high-refractive-index layer HL. The second conductive layer ML2 can be overlapped by the organic insulating layer OPV and spaced apart from the high-refractive-index layer HL, or removed from the first opening OV-1 and the second opening OV-2 so as not to contact the high-refractive-index layer HL. Therefore, when the high-refractive-index layer HL is provided in the electronic device ED according to the embodiment, the high-refractive-index resin can not diffuse along the second conductive layer ML2. In the embodiment, since the conductive material of the second conductive layer ML2 has high adhesion to the high-refractive-index resin, the inorganic insulating layer IPV can be exposed by removing the second conductive layer ML2 so that the second conductive layer ML2 does not contact the high-refractive-index resin, and thus the diffusion of the high-refractive-index resin can be controlled.

[0130] Even when the high-refractive resin diffuses into the first opening OV-1, the organic protrusion DM-T can act as a dike to prevent the high-refractive resin from flowing.

[0131] Here, the second direction DR2, in which openings OV-1 and OV-2 extend, may be perpendicular to the first direction DR1. However, the implementation is not limited to this. Figure 9A and Figure 9B This is a schematic plan view showing a portion of the line area according to an embodiment. Figure 9A and Figure 9B This is a schematic diagram showing the arrangement relationship between the sensing line SL and the openings OV-1 and OV-2.

[0132] Reference Figure 9A Each of the openings OV-1 and OV-2 may extend in a second direction DR2, which is perpendicular to a first direction DR1 in which the sensing line SL extends. Each of the openings OV-1 and OV-2 may have a strip shape extending in the second direction DR2 on a plane defined by the first direction axis DR1 and the second direction axis DR2.

[0133] Reference Figure 9B The sensing line SL may extend diagonally relative to the first opening OV-1, and the sensing line SL may extend in a direction perpendicular to the second opening OV-2. For example, the extension directions of openings OV-1 and OV-2 may differ from the extension direction of the sensing line SL. The extension directions of openings OV-1 and OV-2 may be perpendicular to or diagonally opposite to the extension direction of the sensing line SL.

[0134] Refer again Figure 7 and Figure 8 Contact holes CH1 and CH2 can be defined in the inorganic insulating layer IPV. Contact holes CH1 and CH2 can be defined on one side and the other side of at least one opening OV-1 and OV-2, respectively. A first contact hole CH1 can be defined adjacent to a first opening OV-1 in the organic insulating layer OPV, and a second contact hole CH2 can be defined adjacent to a second opening OV-2 in the organic insulating layer OPV. The first contact hole CH1 and the second contact hole CH2 can penetrate the inorganic insulating layer IPV.

[0135] The first conductive layer ML1 and the second conductive layer ML2 can be electrically connected to each other through the first contact hole CH1 and the second contact hole CH2. The first contact hole CH1 and the second contact hole CH2 can be filled with the material of the second conductive layer ML2. Although in Figure 7 and Figure 8The diagram shows a first contact hole CH1 defined on one side of the first opening OV-1 and a second contact hole CH2 defined on one side of the second opening OV-2, but the embodiment is not limited thereto. Multiple contact holes may be defined on one side of the first opening OV-1, and multiple contact holes may be defined on one side of the second opening OV-2.

[0136] The second contact hole CH2 may extend in a direction parallel to the first direction axis DR1. For example, in one embodiment, the second contact hole CH2 may extend longitudinally in a plane parallel to the first direction axis DR1, and the first conductive layer ML1 and the second conductive layer ML2 may be electrically connected to each other over the entire extended second contact hole CH2. For example, the second contact hole CH2 may be filled with the material of the second conductive layer ML2 in the extending direction of the second contact hole CH2, and the first conductive layer ML1 and the second conductive layer ML2 may be electrically contacting each other over the entire extended second contact hole CH2.

[0137] Reference Figure 7 and Figure 8 The first contact hole CH1 and the second contact hole CH2 may overlap with the organic insulating layer OPV, but may not overlap with the high refractive layer HL.

[0138] The electronic device ED according to the embodiment may include embankments DM1, DM2, and DM3. Embankments DM1, DM2, and DM3 may be disposed in an online area WA. Embankments DM1, DM2, and DM3 may be disposed outside an effective area AA. Embankments DM1, DM2, and DM3 may surround at least a portion of the effective area AA. (See reference...) Figure 7 and Figure 8 The dams DM1, DM2, and DM3 may not overlap with the openings OV-1 and OV-2 defined in the organic insulation layer OPV. The dams DM1, DM2, and DM3 may not overlap with the openings OV-1 and OV-2, and are positioned closer to the effective area AA than the openings OV-1 and OV-2.

[0139] Dike sections DM1, DM2, and DM3 may include a first dike section DM1, a second dike section DM2, and a third dike section DM3. However, the implementation is not limited to the number of dike sections DM1, DM2, and DM3. For example, two dike sections or four or more dike sections may be provided.

[0140] Among the dike sections DM1, DM2, and DM3, the first dike section DM1 may be located closest to the effective area AA. The first dike section DM1, the second dike section DM2, and the third dike section DM3 may be arranged sequentially in a direction away from the effective area AA. The second dike section DM2 may surround at least a portion of the first dike section DM1. The third dike section DM3 may surround at least a portion of the second dike section DM2. The first dike section DM1, the second dike section DM2, and the third dike section DM3 may be spaced apart from each other.

[0141] Each of the first embankment DM1, the second embankment DM2, and the third embankment DM3 may have a structure in which the layers are laminated. For example, the first embankment DM1 may include a first base portion DM1-B and a first laminated portion DM1-T laminated (or formed) on the first base portion DM1-B; the second embankment DM2 may include a second base portion DM2-B and a second laminated portion DM2-T laminated on the second base portion DM2-B; and the third embankment DM3 may include a third base portion DM3-B, a third laminated portion DM3-T laminated on the third base portion DM3-B, and a third protruding portion DM3-C laminated on the third laminated portion DM3-T.

[0142] The third substrate portion DM3-B may include the fifth insulating layer 50 (see reference). Figure 3 The same material, and can be used with the fifth insulating layer 50 (refer to...) Figure 3 The same process is used. The third substrate portion DM3-B may include organic materials.

[0143] The first substrate portion DM1-B, the second substrate portion DM2-B, and the third laminate portion DM3-T may include a sixth insulating layer 60 (see reference). Figure 3 The same material, and can be used with the sixth insulating layer 60 (see reference). Figure 3 The same process is provided. The first substrate portion DM1-B, the second substrate portion DM2-B, and the third lamination portion DM3-T may include the pixel defining layer 70 (see reference). Figure 3 The same material, and can be used with the pixel-defined layer 70 (see reference). Figure 3 The same process is provided.

[0144] When supplying organic monomer resin to provide organic layer OL, the first dike DM1, the second dike DM2 and the third dike DM3 can be used to prevent organic monomer leakage.

[0145] Each of the first dike section DM1, the second dike section DM2, and the third dike section DM3 may extend in a direction intersecting the sensing line SL. (Refer to...) Figure 7 and Figure 8 Since each of the sensing lines SL extends in the first direction DR1, and each of the first embankment DM1, the second embankment DM2 and the third embankment DM3 extends in the second direction DR2, the sensing lines SL can intersect with the first embankment DM1, the second embankment DM2 and the third embankment DM3.

[0146] The sensing line SL may be disposed on the first embankment DM1, the second embankment DM2, and the third embankment DM3, and may have a curved shape at the portion where the sensing line SL overlaps with the edges of the first embankment DM1, the second embankment DM2, and the third embankment DM3. The sensing line SL may have a notch shape around the portion where the sensing line SL overlaps with the edges of the first embankment DM1, the second embankment DM2, and the third embankment DM3.

[0147] The first conductive layer ML1 and the second conductive layer ML2 forming the sensing line SL can be electrically connected through contacts CH-a and CH-c. Contacts CH-a and CH-c can overlap with the first dam DM1 and the second dam DM2, and can be defined within the inorganic insulating layer IPV. Although in Figure 7 and Figure 8 The diagram shows a contact portion CH-a that overlaps with the first dike portion DM1 and a contact portion CH-c that overlaps with the second dike portion DM2, but the implementation is not limited to this. In other embodiments, two or more contact portions may overlap with the dike portions, or the contact portions may not be limited to the portions that overlap with the dike portions.

[0148] In the implementation, the line area WA may include a first part WA-a, a second part WA-b and a third part WA-c, wherein the first part WA-a is provided with embankments DM1, DM2 and DM3 and is provided adjacent to the effective area AA, the second part WA-b overlaps with the first opening OV-1, and the third part WA-c is provided between the first part WA-a and the second part WA-b.

[0149] The inorganic insulating layer IPV, the organic insulating layer OPV, and the high-refractive-index layer HL may overlap each other in the first part WA-a, the inorganic insulating layer IPV, the organic insulating layer OPV, and the high-refractive-index layer HL may not overlap each other in the second part WA-b, and the inorganic insulating layer IPV may overlap with the organic insulating layer OPV and may not overlap with the high-refractive-index layer HL in the third part WA-c.

[0150] The first conductive layer ML1, the inorganic insulating layer IPV, the second conductive layer ML2, the organic insulating layer OPV, and the high-refractive-index layer HL may be sequentially laminated (or formed) in the first part WA-a, and the first conductive layer ML1 and the inorganic insulating layer IPV may be laminated in the second part WA-b. Furthermore, the first conductive layer ML1, the inorganic insulating layer IPV, the second conductive layer ML2, and the organic insulating layer OPV may be sequentially laminated in the third part WA-c.

[0151] For example, in an electronic device ED according to an embodiment, the high-refractive-index layer HL may cover the entire effective region AA or overlap with the entire effective region AA, and may extend in the direction from the effective region AA to the line region WA. The high-refractive-index layer HL may overlap with a portion of the line region WA, and may not overlap with the line region WA but adjacent to the pad region PA (see reference). Figure 5 The rest of the text overlaps.

[0152] In the online region WA, the high-refractive-index layer HL may overlap with the dikes DM1, DM2, and DM3, but may not overlap with the first opening OV-1. The high-refractive-index layer HL may have a thickness that gradually decreases in the direction from the first dike DM1 to the third dike DM3. For example, the high-refractive-index layer HL may have a thickness of about 1.7 mm to about 1.8 mm in the effective region AA, and an average thickness of about 22 μm to about 38 μm in the portions overlapping with the dikes DM1, DM2, and DM3. However, the implementation is not limited to this.

[0153] In the electronic device ED according to the embodiment, the edge HL-ED of the high-refractive-index layer HL may overlap with the third dam DM3. The high-refractive-index layer HL may have a thickness that gradually increases in the direction from above the third dam DM3 to the effective region AA.

[0154] Although in this specification the edge HL-ED of the high-refractive-index layer HL overlaps with the central portion of the third dam DM3, the implementation is not limited thereto. For example, the edge HL-ED of the high-refractive-index layer HL may overlap with the entire third dam DM3. As another example, the edge HL-ED of the high-refractive-index layer HL may overlap with the portion between the third dam DM3 and the first opening OV-1.

[0155] Figure 10 This is a schematic perspective view illustrating a first opening OV-1 in an electronic device according to an embodiment. The first opening OV-1 may include a bottom portion OP-BT defined by an exposed inorganic insulating layer IPV and a side portion OP-SS defined by an organic insulating layer OPV overlapping with a second conductive layer ML2. In this embodiment, the bottom portion OP-BT of the first opening OV-1 may be a portion of the surface of the exposed inorganic insulating layer IPV, and the side portion OP-SS of the first opening OV-1 may be a portion of the side surface of the organic insulating layer OPV. The angle θ of the side portion OP-SS relative to the bottom portion OP-BT may be greater than about 90°. For example, the angle θ of the side portion OP-SS relative to the bottom portion OP-BT may be in the range of about 100° to about 110°.

[0156] Figure 11This is a schematic cross-sectional view illustrating an electronic device according to an embodiment. The electronic device ED according to an embodiment may further include an optical layer PP disposed on a high-refractive-index layer HL. The optical layer PP may be a polarizer including optical functional layers. The optical layer PP may include an adhesive layer AL and a polarizer layer PL.

[0157] The polarizer layer PL can be a film-type linear polarizer comprising an elongated (or stretched) polymer film. For example, the elongated polymer film can be an elongated polyvinyl alcohol-based film. The polarizer layer PL can be manufactured by adsorbing a dichroic dye onto the elongated polymer film. For example, the polarizer layer PL can include an elongated polyvinyl alcohol-based film and iodine adsorbed thereon. Here, the elongation direction of the polymer film can be the absorption axis of the polarizer layer PL, and the direction perpendicular to the elongation direction can be the transmission axis of the polarizer layer PL. The optical layer PP can also include at least one phase retardation layer (not shown) disposed below the polarizer layer PL. For example, the optical layer PP can include a λ / 2 phase retardation layer disposed below the polarizer layer PL and a λ / 4 phase retardation layer disposed below the λ / 2 phase retardation layer.

[0158] The adhesive layer AL can be an optically transparent adhesive film (OCA) or an optically transparent adhesive resin layer (OCR).

[0159] Iodine, as a dichroic dye contained in the polarizer layer PL, can move in an ionic state through the adhesive layer AL and can be transferred to the sensor layer TP, etc. If the ionic iodine contacts the second conductive layer ML2 of the sensor layer TP, the second conductive layer ML2 may corrode, and the sensing sensitivity may deteriorate.

[0160] In this embodiment, the adhesive layer AL does not directly contact the second conductive layer ML2, and the second conductive layer ML2 does not come into contact with the dichroic dye transferred through the adhesive layer AL. Therefore, corrosion of the second conductive layer ML2 can be prevented, and sensing sensitivity and performance can be maintained.

[0161] Specifically, in the electronic device ED according to the embodiment, when the inorganic insulating layer IPV contacts the adhesive layer AL in the first opening OV-1, wherein the first opening OV-1 is filled with the adhesive layer AL and the second conductive layer ML2 is removed, the degradation of sensing performance caused by the use of the polarizer layer PL can be resolved.

[0162] The adhesive layer AL can contact the high-refractive-index layer HL in the first part WA-a of the online region WA, the adhesive layer AL can contact the exposed inorganic insulating layer IPV in the second part WA-b, and the adhesive layer AL can contact the organic insulating layer OPV in the third part WA-c.

[0163] Despite Figure 11In this embodiment, the edge of the polarizer layer PL overlaps with the organic protrusion DM-T, but the implementation is not limited to this. For example, the edge of the polarizer layer PL may overlap with the second opening OV-2.

[0164] An electronic device ED in which the second conductive layer ML2 is at least partially removed from openings OV-1 and OV-2, according to an embodiment, may have a larger line resistance than an electronic device in which the second conductive layer ML2 is not removed. However, the increase in resistance may correspond to a variation within the sensitivity deviation of the sensor layer TP. Therefore, as shown in the embodiment, even when the second conductive layer ML2 is at least partially removed to expose the inorganic insulating layer IPV, the sensor layer TP can maintain its sensing characteristics.

[0165] An electronic device according to an embodiment includes an opening in an online region that exposes an inorganic insulating layer of a sensor layer. This prevents the diffusion of the high-refractive-index resin and allows control over the position of the high-refractive-index layer. Even when the second conductive layer contacts the polarizer layer, the electronic device according to an embodiment can minimize performance degradation of the second conductive layer by removing it from the opening to expose the inorganic insulating layer.

[0166] Figures 12 to 14 This is a schematic diagram illustrating an electronic device according to an embodiment. (When referring to...) Figures 12 to 14 When describing the electronic device according to the embodiments, the description of the electronic device will no longer be related to... Figures 1 to 11 The features described in the text overlap, while the main description focuses on the differences.

[0167] Figure 12 This is a schematic cross-sectional view illustrating an electronic device according to an embodiment. According to... Figure 12 The electronic device ED-a and reference in the implementation of the above embodiments Figures 6 to 11 The difference in the described implementation is that the organic protrusion DM-T also includes a second conductive layer ML2.

[0168] The second conductive layer ML2 in the organic protrusion DM-T may be covered by or overlapped with the organic insulating layer OPV. At least one contact hole CH3 and CH4 may be defined in the inorganic insulating layer IPV in the organic protrusion DM-T. The first conductive layer ML1 and the second conductive layer ML2 may be electrically connected to each other through at least one contact hole CH3 and CH4. At least one contact hole CH3 and CH4 may be filled with the material of the second conductive layer ML2. Figure 12 The electronic device ED-a in the embodiment can reduce the resistance of the sensing line by further including contact holes CH3 and CH4 in the organic protrusion DM-T that electrically connect the first conductive layer ML1 and the second conductive layer ML2.

[0169] Figure 13This is a schematic cross-sectional view illustrating an electronic device according to an embodiment, and Figure 14 This is a schematic plan view showing an electronic device according to an embodiment.

[0170] Reference Figure 13 and Figure 14 The electronic device ED-b according to the embodiment may further include an opening (e.g., Figure 13 and Figure 14 The sub-protrusions S-DM in the first opening OV-1. The sub-protrusions S-DM may be spaced apart from each other in the first opening OV-1. Here, the sub-protrusions S-DM may be made of or comprise the same material as the organic insulating layer OPV.

[0171] Reference Figure 14 Each of the sub-protrusions S-DM may have a rectangular shape in a plane. However, the implementation is not limited to this. For example, each of the sub-protrusions S-DM may have a circular, elliptical, or polygonal shape in a plane.

[0172] Despite Figure 13 and Figure 14 The sub-protrusions S-DM are arranged according to a predetermined pattern, but the implementation is not limited to this. For example, the sub-protrusions S-DM may be spaced apart from each other and randomly arranged in the first opening OV-1.

[0173] The protrusion S-DM can act as a dam to prevent the high-refractive resin supplied for providing the high-refractive layer HL from diffusing from the first opening OV-1 to the second opening OV-2.

[0174] The electronic device according to the embodiment can control the position of the high-refractive-index layer by including an opening in the online region to expose the inorganic insulating layer of the sensor layer. Even when the second conductive layer is removed from the opening, the electronic device according to the embodiment can maintain its sensing sensitivity characteristics by electrically connecting the first and second conductive layers through contact holes defined on opposite sides of the opening. The electronic device according to the embodiment has many advantageous characteristics, such as reliability, by minimizing the contact between the dichroic dye of the polarizer layer and the conductive layer of the sensor layer.

[0175] Because the inorganic insulating layer is exposed in the opening defined in the organic insulating layer, the electronic device according to the embodiment can exhibit improved reliability without degrading the sensing characteristics of the sensor layer by controlling the flow of the high-refractive layer.

[0176] Although exemplary embodiments of the invention have been described, it is understood that the invention should not be limited to these exemplary embodiments, but rather various changes and modifications can be made by those skilled in the art within the spirit and scope of the invention as claimed below.

[0177] Therefore, the actual scope of protection of this invention should be determined by the technical scope of the appended claims.

Claims

1. An electronic device, comprising an effective area and a line area disposed adjacent to the effective area, the electronic device comprising: Display component layer; An encapsulation layer is disposed on the display element layer; The sensor layer includes: Sensing electrodes are disposed in the effective area; and A sensing line, disposed in the line region, is electrically connected to the sensing electrode. And extending in the first direction; and A high-refractive-index layer is disposed on the sensor layer, wherein The sensor layer also includes: A first conductive layer is disposed on the encapsulation layer; A second conductive layer is disposed on the first conductive layer; An inorganic insulating layer is disposed between the first conductive layer and the second conductive layer; and An organic insulating layer is disposed between the second conductive layer and the high-refractive-index layer. Wherein, in the line region, at least one opening is defined in the organic insulating layer, the at least one opening extending in a second direction different from the first direction, and The inorganic insulating layer is exposed through at least one opening in the organic insulating layer.

2. The electronic device according to claim 1, wherein, A plurality of contact holes are defined in the inorganic insulating layer, and the plurality of contact holes include a first contact hole and a second contact hole located on one side and the other side of the at least one opening in the organic insulating layer, respectively.

3. The electronic device according to claim 2, wherein, The first conductive layer and the second conductive layer are electrically connected to each other through the first contact hole and the second contact hole in the plurality of contact holes.

4. The electronic device according to claim 2, wherein, The first and second contact holes of the plurality of contact holes are filled by the second conductive layer.

5. The electronic device according to claim 2, wherein, The first and second contact holes of the plurality of contact holes overlap with the organic insulating layer but do not overlap with the high-refractive layer.

6. The electronic device according to claim 1, wherein, The first direction extends from the effective region to the line region, and The second direction is perpendicular to the first direction.

7. The electronic device of claim 1, further comprising a plurality of embankments disposed in the linear region and surrounding at least a portion of the effective region. in, The plurality of embankments are disposed adjacent to the effective area and do not overlap with the at least one opening of the organic insulating layer.

8. The electronic device according to claim 7, wherein, The line region includes: The first part is located adjacent to the effective area, wherein the plurality of dikes are arranged in the first part; The second part overlaps with at least one opening in the organic insulating layer; and The third part is located between the first and second parts, wherein The inorganic insulating layer, the organic insulating layer, and the high-refractive-index layer overlap each other in the first portion of the line region. The inorganic insulating layer does not overlap with the organic insulating layer and the high-refractive-index layer in the second part of the line region, and The inorganic insulating layer overlaps with the organic insulating layer in the third part of the line region but does not overlap with the high-refractive layer.

9. The electronic device according to claim 8, wherein The first conductive layer, the inorganic insulating layer, the second conductive layer, the organic insulating layer, and the high-refractive-index layer are sequentially formed in the first portion of the line region. The first conductive layer and the inorganic insulating layer are formed in the second portion of the line region, and The first conductive layer, the inorganic insulating layer, the second conductive layer, and the organic insulating layer are sequentially formed in the third part of the line region.

10. The electronic device according to claim 9, further comprising: An adhesive layer is disposed on the high-refractive-index layer; as well as A polarizer layer is disposed on the adhesive layer, wherein The adhesive layer contacts the high-refractive-index layer in the first portion of the line region. The adhesive layer contacts the exposed inorganic insulating layer in the second portion of the line region, and The adhesive layer contacts the organic insulating layer in the third part of the line region.

11. The electronic device according to claim 1, wherein, The at least one opening in the organic insulating layer includes: The bottom portion is defined by the exposed inorganic insulating layer; and The side portion is defined by the organic insulating layer overlapping the second conductive layer, and The angle of inclination of the side portion relative to the bottom portion is in the range of 100° to 110°.

12. The electronic device according to claim 7, wherein The plurality of embankments includes: The first embankment is located adjacent to the effective area; The second dike section is located outside the first dike section; as well as The third dike section is located outside the second dike section, and The high-refractive-index layer has a thickness that gradually decreases in the direction from the first embankment to the third embankment.

13. The electronic device according to claim 12, wherein, The edge of the high-refractive layer overlaps with the third embankment in the plan view.

14. The electronic device according to claim 1, wherein, The high-refractive-index layer has a refractive index equal to or greater than 1.

6.

15. The electronic device of claim 1, further comprising a plurality of sub-protrusions spaced apart from each other in the at least one opening of the organic insulating layer.

16. The electronic device according to claim 15, wherein, The plurality of sub-protrusions and the organic insulating layer comprise the same material.

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