Storage device with detachable capacitor connection structure

Abstract

The present disclosure provides a detachable capacitor connection structure for a storage device. In an embodiment, a connection element detachably connects a capacitor module including one or more capacitors to a circuit board so that the capacitor module is stacked on the circuit board. The connection element includes: a first connector including two pins mounted on the bottom plane of the capacitor module; and a second connector including two sockets mounted on the top plane of the circuit board corresponding to the bottom of the capacitor module, suitable for connecting the first connector to the circuit board.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to schemes for connecting a capacitor to a storage device. Background Art

[0002] The computer environment paradigm has shifted to ubiquitous computing systems that can be used anywhere, anytime. As a result, the use of portable electronic devices such as mobile phones, digital cameras, and notebook computers has increased rapidly. These portable electronic devices typically use a memory system having (multiple) memory devices, i.e., (multiple) data storage devices. The data storage devices are used as primary memory devices or auxiliary memory devices of the portable electronic devices.

[0003] The data storage device includes a power supply. The power supply may be implemented using one or more capacitors. Summary of the invention

[0004] Aspects of the present invention include a storage device having a detachable capacitor connection structure.

[0005] In one aspect, a storage device includes: a circuit board; a capacitor module including one or more capacitors; and a connecting element for detachably connecting the capacitor module to the circuit board so that the capacitor module is stacked on the circuit board. The connecting element includes: a first connector including two pins mounted on a bottom plane of the capacitor module; and a second connector including two sockets mounted on a top plane of the circuit board corresponding to the bottom of the capacitor module, suitable for connecting the first connector to the circuit board.

[0006] In another aspect, a storage device includes: a circuit board; a capacitor module including one or more capacitors; and a connecting element for detachably connecting the capacitor module to the circuit board. The connecting element includes: a finger disposed on at least one edge of the capacitor module; and a connector mounted on a portion of the circuit board that is accessible to the edge of the capacitor module and adapted to connect the finger to the circuit board.

[0007] In another aspect, a storage device includes: a circuit board including two through holes; a capacitor including two pins; and a connecting element for detachably connecting the capacitor to the circuit board. The connecting element includes: a plug including two right-angle pins respectively connected to the two through holes; and a socket connected to the plug so that the two pins of the capacitor are guided to be connected to the two through holes respectively.

[0008] Other aspects of the invention will become apparent from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a block diagram illustrating an example of a data processing system.

[0010] Figure 2 is a diagram illustrating an example of a power supply of a storage device.

[0011] Figure 3A and Figure 3B A connection structure between one or more capacitors in a storage device and a circuit board according to an embodiment of the present invention is shown.

[0012] 4A to 9C is a diagram illustrating a storage device having a detachable capacitor connection structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0013] Each embodiment is described in more detail below with reference to the accompanying drawings. However, the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to make the present disclosure thorough and complete, and to fully convey the scope of the present invention to those skilled in the art. Moreover, references to "embodiment", "another embodiment" and the like herein are not necessarily only directed to one embodiment, and different references to any such phrases are not necessarily directed to the same (multiple) embodiments. Throughout the present disclosure, the same reference numerals refer to the same parts in the drawings and embodiments of the present invention.

[0014] The present invention can be implemented in many ways, including being implemented as a process, a device, a system, a computer program product implemented on a computer-readable storage medium, and / or a processor, such as a processor suitable for running instructions stored on a memory connected to the processor and / or provided by it. In this specification, these embodiments or any other form that the present invention can adopt can be referred to as technology. Generally, the order of the steps of the disclosed process can be changed within the scope of the present invention. Unless otherwise stated, components such as processors or memories described as being suitable for performing tasks can be implemented as general components temporarily configured to perform tasks at a given time or specific components manufactured to perform tasks. As used herein, the term "processor" etc. refers to one or more devices, circuits and / or processing cores suitable for processing data such as computer program instructions.

[0015] A detailed description of embodiments of the invention and drawings illustrating aspects of the invention are provided below. The invention is described in conjunction with such embodiments, but the invention is not limited to any embodiment. The scope of the invention is limited only by the claims. The invention encompasses many alternatives, modifications, and equivalents within the scope of the claims. Many specific details are set forth in the following description in order to provide a thorough understanding of the invention. These details are provided for illustrative purposes; the invention may be practiced according to the claims without some or all of these specific details. For the sake of clarity, technical materials known in the technical field related to the invention are not described in detail so as not to unnecessarily obscure the invention.

[0016] Figure 1 is a block diagram illustrating an example of data processing system 10 .

[0017] Reference Figure 1 , the data processing system 10 may include a host device 50 and a storage device (or memory system) 100. The storage device 100 may receive a request from the host device 50 and operate in response to the received request. For example, the storage device 100 may store data to be accessed by the host device 50.

[0018] The host device 50 may be implemented using any of a variety of electronic devices. In various embodiments, the host device 50 may include electronic devices such as desktop computers, workstations, three-dimensional (3D) televisions, smart televisions, digital audio recorders, digital audio players, digital photo recorders, digital photo players, and / or digital video recorders, and digital video players. In various embodiments, the host device 50 may include portable electronic devices such as mobile phones, smart phones, e-books, MP3 players, portable multimedia players (PMPs), and / or portable game consoles.

[0019] The storage device 100 may include a controller 110, a memory device 120, and a power supply 130. The controller 110 may exchange signals SGL with the host device 50 through a signal connector SC. The signal SGL may include commands, addresses, and data. According to the interface scheme between the host device 50 and the storage device 100, the signal connector SC may be configured as any one of various types of connectors.

[0020] The controller 110 may control the overall operation of the memory device 120 in response to the signal SGL from the host device 50. For example, the controller 110 may control the memory device 120 to perform one or more erase operations, program operations, and read operations.

[0021] The memory device 120 may be coupled to the controller 110 through one or more channels. The memory device 120 may be implemented using a plurality of non-volatile memory devices. The controller 110 and the memory device 120 may be implemented using any of various storage devices such as a solid state drive (SSD) and a memory card.

[0022] The power supply 130 may supply power PWR input from the host device 50 through the power connector PC to the inside of the storage device 100 .

[0023] Figure 2 is a diagram illustrating an example of the power supply 130 of the storage device 100 .

[0024] Reference Figure 2 , the power supply 130 may include a plurality of capacitors C1 to Cn, a boost regulator RU, and a buck regulator RD. Figure 1 Not shown in the drawings, the memory device 100 may further include a power switch 130 and a power controller 150 coupled to the power source 130 .

[0025] The power switch 130 may provide a normal power transmission path or a power loss protection (PLP) transmission path under the control of the power controller 150. In the normal power transmission path, the power provided from the host device 50 is transmitted through the normal power transmission path, which includes the power switch 140, the power controller 150, the boost regulator RU, and the plurality of capacitors C1 to Cn. The boost regulator RU may convert a low input voltage from the host device 50 into a high voltage (e.g., 35V or higher) through the power switch 140 and the power controller 150. The high voltage may be used to charge the plurality of capacitors C1 to Cn.

[0026] When the storage device 100 loses input power from the host device 50, the plurality of capacitors C1 to Cn may be discharged, and the energy stored in the plurality of capacitors C1 to Cn may be transferred through a PLP transfer path including the buck regulator RD, the power switch 140, the power controller 150, and the internal power regulator. The storage device 100 may use the plurality of capacitors (i.e., PLP capacitors) as a power source to back up all necessary data from the internal memory (e.g., volatile memory) of the controller 110 to the memory device 120 (e.g., NAND flash memory device).

[0027] In this way, a plurality of capacitors C1 to Cn can form a capacitor array to provide sufficient energy to maintain the power rail voltage for data backup transmission from the controller 110 to the memory device. The capacitor array or bulk capacitor can be used as a power loss protection (PLP) capacitor for the memory device 100. Typically, the capacitor array or bulk capacitor can be fixedly connected (e.g., by direct soldering) to the printed circuit board (PCB) of the memory device 100. This type of connection poses challenges to testing and repair work in mass production and return material authorization (RMA) operations. In other words, reflow soldering and manual rework may be required to remove and replace failed capacitors. Therefore, it is desirable to provide a connection structure for connecting one or more capacitors to a circuit board of a memory device and easily replacing a failed capacitor in the memory device.

[0028] Figure 3A and Figure 3B A connection structure between one or more capacitors and a circuit board according to an embodiment of the present invention is shown.

[0029] Reference Figure 3A , the capacitor 320 may be detachably connected to the circuit board 310 of the storage device 100 via the connecting element 330. In some embodiments, the capacitor 320 may be implemented using a through-hole PLP capacitor (eg, an aluminum electrolytic capacitor), and the connecting element 330 may include, for example, FIG. 4A to FIG. 7 The connection structure shown.

[0030] Reference Figure 3B , the capacitor module 340 can be detachably connected to the circuit board 310 via the connecting element 350. In some embodiments, the capacitor module 340 can be implemented using a surface mount PLP capacitor array (e.g., a polymer tantalum solid capacitor), and the connecting element 330 can include, for example, FIG. 8A to FIG. 9B The connection structure shown.

[0031] Figure 4A and Figure 4B is a diagram illustrating a storage device 100 having a detachable capacitor connection structure according to an embodiment of the present invention.

[0032] Reference Figure 4A , the storage device 100 may include Figure 3A Circuit board 310 and capacitor 320 are shown. Capacitor 320 may include two pins (+)(-). In some embodiments, capacitor 320 may be implemented using an aluminum electrolytic capacitor.

[0033] The connecting element 330 may be used as Figure 4B The dual in-line package (DIP) socket shown in FIG. Figure 4BAs shown, the DIP socket may have a rectangular housing 410 with two through holes (in Figure 4B The top of the housing 410 is shown in FIG. 4 and two parallel pins 420 extending into two through holes of the housing 410. The parallel pins 420 can then be mounted on the circuit board 310. In an embodiment, the parallel pins 420 can be respectively inserted into the two through holes of the circuit board 310 to mount the capacitor 320 to the circuit board 310.

[0034] When the two pins (+)(-) of the capacitor 320 are inserted into the two through holes of the DIP socket, the DIP socket can detachably connect the two pins (+)(-) of the capacitor 320 to the circuit board 310, respectively. Figure 4A and Figure 4B In the illustrated example of FIG. 3 , the DIP socket is vertically mounted on the circuit board 310, and the capacitor 320 is horizontally arranged to the circuit board 310. Therefore, the two pins (+)(-) of the capacitor 320 can be bent by about 90 degrees and inserted into the two through holes of the DIP socket.

[0035] Figure 5A and Figure 5B is a diagram illustrating a storage device 100 having a detachable capacitor connection structure according to an embodiment of the present invention.

[0036] Reference Figure 5A , the storage device 100 may include Figure 3A Circuit board 310 and capacitor 320 are shown. Capacitor 320 may include two pins (+)(-). In some embodiments, capacitor 320 may be implemented using an aluminum electrolytic capacitor.

[0037] The connecting element 330 may be used as Figure 5B The right angle socket shown in the figure is implemented. The right angle socket can have a rectangular housing 510 with two through holes and two parallel right angle pins 520. The vertical parts of the right angle pins 520 are held in the two through holes of the housing 510, and the bent parts of the right angle pins 520 protrude from the two through holes. The protruding parts of the parallel right angle pins 520 can be mounted on the circuit board 310. In an embodiment, the parallel right angle pins 520 can be respectively mounted in the two through holes of the circuit board 310.

[0038] When the two pins (+)(-) of the capacitor 320 are inserted into the two through holes of the right angle socket, the right angle socket can detachably connect the two pins (+)(-) of the capacitor 320 to the two through holes of the circuit board 310, respectively. Figure 5A and Figure 5BIn the illustrated example, the parallel right-angle pins 520 are vertically mounted to the circuit board 310, while the rectangular housing 510 and the capacitor 320 are horizontally arranged to the circuit board 310. Therefore, compared to Figure 4A and Figure 4B In the example, the two pins (+)(-) of the capacitor 320 can be inserted into the two through holes of the right-angle socket without bending.

[0039] FIG. 6A to FIG. 6C is a diagram illustrating a storage device 100 having a detachable capacitor connection structure according to an embodiment of the present invention.

[0040] Reference Fig. 6A , the storage device 100 may include Figure 3A Circuit board 310 and capacitor 320 are shown. Capacitor 320 may include two pins (+)(-). In some embodiments, capacitor 320 may be implemented using an aluminum electrolytic capacitor.

[0041] The connecting element 330 may include Figure 6B The plug 330A and the socket 330B are shown. The plug 330A may include a housing 610 and two parallel right-angle pins 620. The housing 610 may include two through holes into which the two parallel right-angle pins 620 are inserted. The parallel right-angle pins 620 may be mounted on the circuit board 310. In an embodiment, the parallel right-angle pins 620 may be respectively mounted in the two through holes of the circuit board 310.

[0042] The plug 330A and the socket 330B may have a connection structure by which the plug 330A and the socket 330B are interlocked with each other. For this structure, the housing 610 of the plug 330A may include a sleeve S. The sleeve S may be formed in a direction perpendicular to the main body of the housing 610. The socket 330B may include a housing 630 with two through holes H1, H2 and a crimping structure C1, C2. The two through holes H1, H2 may be formed in the center of the housing 630 along a set direction. The crimping structures C1, C2 may protrude from the top of the housing 630 so that an opening is formed between the crimping structures C1 and C2. In other words, the plug 330A may be a locking plug, and the socket 330B may be implemented using a crimping housing. When the plug 330A is mounted or interlocked to the socket 330B, the sleeve S of the plug 330A may be inserted through the opening between the crimping structures C1 and C2 of the socket 330B. In this way, the crimping structures C1 and C2 can guide the correct installation between the plug 330A and the socket 330B. The interlocking structure can prevent the incorrect installation between the plug 330A and the socket 330B. Figure 6C The details of the connection or mating between the plug 330A and the socket 330B are shown in FIG. Figure 6CAs shown, the right angle pin 620 of the plug 330A may be connected to the pin of the capacitor via the pin SP of the receptacle 330B.

[0043] After the plug 330A and the socket 330B are interlocked with each other, the two pins (+)(-) of the capacitor 320 are inserted into the two through holes of the socket 330B, and the connecting element 330 can detachably connect the two pins (+)(-) of the capacitor 320 to the circuit board 310, respectively. In the illustrated example of FIG. 6 , the parallel right-angle pins 620 are vertically mounted to the circuit board 310, while the plug 330A, the socket 330B and the capacitor 320 are horizontally arranged to the circuit board 310. Therefore, compared to Figure 4A and Figure 4B In the example, the two pins (+)(-) of the capacitor 320 can be inserted into the two through holes of the socket 330B without being bent.

[0044] Figure 7 A detachable capacitor connection structure in a memory device 100 having a plurality of capacitors 320 according to an embodiment of the present invention is shown.

[0045] Reference Figure 7 , the plurality of capacitors 320 forming an array may be connected to the circuit board 310 respectively through a plurality of connecting elements 330. In some embodiments, each of the connecting elements 330 may have a 4A to 6B The same connection structure is shown.

[0046] FIG. 8A to FIG. 8C is a diagram illustrating a storage device 100 having a detachable capacitor connection structure according to an embodiment of the present invention.

[0047] Reference Fig. 8A , the storage device 100 may include Figure 3B The circuit board 310 and capacitor module 340 are shown. The circuit board 310 may include one or more integrated chips (ICs). The capacitor module 340 may include one or more capacitors CAP in an array. In some embodiments, the capacitor CAP may be mounted on the top plane (or surface) of the capacitor module 340, and each capacitor may be implemented using a polymer tantalum solid capacitor.

[0048] The connector 810 and the finger 820 as the connection element 350 can detachably connect the capacitor module 340 to the circuit board 310. The finger 820 can be arranged on at least one edge of the capacitor module 340. In some embodiments, the finger 820 can be implemented using a gold finger. The connector 810 can be mounted on a portion of the edge of the circuit board 310 that is accessible to the capacitor module 340. The finger 820 can be inserted into the connector 810 of the circuit board 310.

[0049] Connector 810 can be used as Figure 8B The female socket shown in FIG. 8 is implemented. The female socket may include a housing 812 and one or more pins 814. The housing 812 may include one or more recessed holes for mounting the pins 814. The pins 814 may be mounted on the portion of the circuit board 310. When the finger 820 is inserted into the recessed hole of the housing 812, the connector 810 may connect the capacitor CAP to the portion of the circuit board 310 through the finger 820 and the pin 814.

[0050] Reference Figure 8C , the capacitor module 340 may further include a notch (or key) 830. The notch 830 may be formed on a portion of the edge of the capacitor module 340 that forms the finger 820. The portion of the edge may be located such as Figure 8B The notch 830 can prevent incorrect installation between the finger 820 and the connector 810. In some embodiments, the size of the capacitor module 340 as an add-in card module can be optimized to increase the insertion force against gravity.

[0051] 9A to 9C is a diagram illustrating a storage device 100 having a detachable capacitor connection structure according to an embodiment of the present invention.

[0052] Reference Fig.9A , the storage device 100 may include Figure 3B Circuit board 310 and capacitor module 340 shown. Circuit board 310 may include one or more integrated chips (ICs). Capacitor module 340 may include one or more capacitors CAP in an array. In some embodiments, capacitor CAP may be mounted on the top plane (or surface) and / or bottom plane of capacitor module 340, and each capacitor may be implemented using a polymer tantalum solid capacitor. In the example shown, capacitor CAP is mounted on the top plane and bottom plane of capacitor module 340.

[0053] The connection element 350 may detachably connect the capacitor module 340 to the circuit board 310 so that the capacitor module 340 is stacked on the circuit board 310. The connection element 350 may include two pins 920A, 920B as a first connector and two sockets 910A, 910B as a second connector.

[0054] The two pins 920A, 920B may be mounted on the bottom plane (or surface) of the capacitor module 340. Fig.9A As shown, two pins 920A and 920B can be installed on the left and right sides of the bottom plane of the capacitor module 340, respectively. In some embodiments, the pins 920A and 920B can be used as shown in FIG. Fig. 9B The male pins shown are implemented.

[0055] The two sockets 910A, 910B may be mounted on the top plane of the circuit board 310 corresponding to the bottom plane of the capacitor module 340 so that the two pins 920A, 920B are connected to the circuit board 310. Fig. 9B As shown, the two sockets 910A, 910B can be implemented using female sockets, and the two pins 920A, 920B can be implemented using male plugs. The two sockets 910A, 910B can be installed on the left and right sides of the top plane of the circuit board 310, respectively, and the left and right sides of the top plane of the circuit board 310 correspond to the left and right sides of the bottom plane of the capacitor module 340. Each socket 910A, 910B may include a housing with a plurality of connecting pins SP1. Each pin 920A, 920B may include a housing with a plurality of connecting pins SP2. In some embodiments, as Fig. 9B As shown, two sockets 910A, 910B and two pins 920A, 920B have an asymmetric structure to prevent incorrect installation. In some embodiments, each of the two pins 920A, 920B has a notch N, and each of the two sockets 910A, 910B has a protrusion P. The protrusion P and the notch N can be formed at a set portion. For example, the protrusion P can be formed at the central portion of one side of the housing of each socket 910A, 910B. The notch N can be formed at the central portion of one side of the housing of each pin 920A, 920B. When each pin 920A, 920B is inserted into each socket 910A, 910B, the protrusion P can be inserted into the notch N, and the housing of each pin 920A, 920B can surround the housing of each socket 910A, 910B. In this way, the structure can prevent incorrect installation between each socket 910A, 910B and each pin 920A, 920B. Fig. 9C The details of the connection or cooperation between each socket 910A, 910B and each pin 920A, 920B are shown in FIG. Fig. 9C As shown, when two pins 920A, 920B are inserted into two sockets 910A, 910B, pin SP1 of each socket 910A, 910B can be connected to pin SP2 of each pin 920A, 920B, so that capacitor CAP of capacitor module 340 is connected to circuit board 310 through the connection between pin SP2 and pin SP1.

[0056] As described above, embodiments provide a detachable capacitor connection structure for detachably connecting one or more capacitors to a circuit board in a storage device.

[0057] Although the foregoing embodiments have been shown and described in considerable detail for purposes of clarity and understanding, the present invention is not limited to the details provided. As will be appreciated by those skilled in the art based on the foregoing disclosure, there are many alternative ways to implement the present invention. Therefore, the disclosed embodiments are exemplary, not restrictive. The present invention is intended to encompass all modifications and substitutions that fall within the scope of the claims.

Claims

1. A storage device, comprising: Circuit boards; A capacitor module, comprising one or more capacitors; as well as a connecting element to detachably connect the capacitor module to the circuit board so that the capacitor module is stacked on the circuit board, The connecting element comprises: A first connector, including two pins, mounted on the bottom plane of the capacitor module; as well as a second connector, including two sockets, mounted on a top plane of the circuit board corresponding to a bottom of the capacitor module, connecting the first connector to the circuit board, Each of the pins comprises a housing with a plurality of connecting pins, and each of the sockets comprises a housing with a plurality of connecting pins, When the pins are inserted into the sockets, the housing of each pin surrounds the housing of each socket, and the connecting pins of each socket are connected to the connecting pins of each pin, so that the capacitor of the capacitor module is connected to the circuit board through the connection between the connecting pins of the sockets and the connecting pins of the pins. 2 . The storage device of claim 1 , wherein the first connector comprises two male pins mounted on left and right sides of a bottom plane of the capacitor module.

3. The storage device according to claim 2, wherein the second connector comprises two female sockets, and the two female sockets are respectively installed on the left and right sides of the top plane of the circuit board corresponding to the left and right sides of the bottom plane of the capacitor module. 4 . The storage device according to claim 3 , wherein the first connector has a recessed portion, and the second connector has a protruding portion, the protruding portion being inserted into the recessed portion. 5 . The storage device of claim 1 , wherein the capacitor is mounted on at least one of a top plane and a bottom plane of the capacitor module.

6. The memory device of claim 5, wherein the capacitor comprises a polymer tantalum solid capacitor.

7. A storage device, comprising: A circuit board including two through holes; A capacitor including two pins; as well as a connecting element to detachably connect the capacitor to the circuit board, The connecting element comprises: A plug including two right-angle pins connected to the two through holes respectively; as well as a socket connected to the plug so that the two pins of the capacitor are guided to be connected to the two through holes, respectively, The plug includes a sleeve that can be inserted into a crimping structure on a socket housing.

8. The storage device according to claim 7, wherein the plug comprises the two right-angle pins and a housing having a sleeve and two through holes into which the two right-angle pins are inserted.

9. The storage device of claim 8, wherein the socket comprises two holes connected to the two right-angle pins and a crimping structure locked to the sleeve.

10. The memory device of claim 7, wherein the capacitor comprises an aluminum electrolytic capacitor.

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