Laser projection system and heat dissipation equipment

Abstract

The present application discloses a laser projection system and heat dissipation device, belonging to the field of projection display technology. The laser projection system includes: a laser projection host and a heat dissipation device. The heat sink in the heat dissipation device is located outside the laser projection host, and the heat dissipation control component in the heat dissipation device can adjust the heat dissipation of the heat sink based on the temperature of at least one of the first end and the second end of the heat conduction pipe and the maximum operating temperature of the device to be cooled, thereby effectively extending the service life of the laser projection system. In addition, the heat dissipation device and the laser host are separate, so that different models of laser hosts can be connected to the same heat dissipation device, effectively reducing the manufacturing cost of the laser projection system.

Description

Technical Field

[0001] The present application relates to the field of projection display technology, and in particular to a laser projection system and heat dissipation equipment. Background Art

[0002] A laser projector typically includes components such as a laser, lens, digital micromirror device (DMD), light valve, and circuit boards. When the laser projector is operating, these components generate heat, causing the projector to operate at a high temperature. Excessively high operating temperatures can shorten the projector's lifespan. Summary of the Invention

[0003] The present invention provides a laser projection system and heat dissipation device. This solves the technical problem of the existing laser projection system, which has a high operating temperature and a short service life. The technical solution is as follows:

[0004] In one aspect, a laser projection system is provided, comprising: a laser projection host and a heat dissipation device;

[0005] The heat dissipation device includes: a radiator located outside the laser projection host, a heat dissipation control component connected to the radiator, and a heat conduction pipe having a first end connected to the radiator;

[0006] The laser projection host comprises: a heat dissipation device, the heat dissipation device abutting against the second end of the heat conduction pipe;

[0007] The heat dissipation control component is configured to adjust the heat dissipation of the radiator based on the temperature of at least one of the first end and the second end of the heat conduction pipe and the maximum operating temperature of the device to be cooled.

[0008] In another aspect, a heat dissipation device is provided, comprising:

[0009] heat sink;

[0010] A heat conducting pipe having a first end connected to the radiator, and a second end of the heat conducting pipe configured to abut against a component to be cooled in the laser projection host;

[0011] and the heat dissipation control component connected to the heat dissipation control component, wherein the heat dissipation control component is configured to adjust the heat dissipation of the radiator based on the temperature of at least one of the first end of the heat conduction pipe and the second end of the heat conduction pipe, and the maximum operating temperature of the device to be cooled.

[0012] The technical solutions provided in the embodiments of the present application provide at least the following benefits:

[0013] The heat sink in the heat dissipation device is located outside the laser projection host, and the heat dissipation control component in the heat dissipation device can adjust the heat dissipation of the heat sink based on the temperature of at least one of the first end and the second end of the heat conduction pipe and the maximum operating temperature of the device to be dissipated, so that the heat dissipation device can dissipate heat for the device to be dissipated in the laser projection host, thereby preventing the operating temperature of the device to be dissipated from exceeding its maximum operating temperature, thereby preventing the device to be dissipated from being damaged due to the high operating temperature, and effectively improving the service life of the laser projection system. In addition, the heat dissipation device and the laser host in the present application are split, so that different models of laser hosts can be connected to the same heat dissipation device, effectively reducing the manufacturing cost of the laser projection system. At the same time, since the heat sink in the heat dissipation device is located outside the laser projection host, it effectively avoids the problem of components in the laser projection host hindering the heat dissipation of the heat sink, improves the efficiency of the heat dissipation device in dissipating heat for the device to be dissipated, and thus achieves better heat dissipation effect of the laser projection system. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0015] Figure 1 It is a laser projection host with a heat dissipation structure provided by the relevant technology;

[0016] Figure 2 1 is a schematic structural diagram of a laser projection system provided in an embodiment of the present application;

[0017] Figure 3 is a schematic structural diagram of another laser projection system provided in an embodiment of the present application;

[0018] Figure 4 This is a schematic structural diagram of another laser projection system provided in an embodiment of the present application;

[0019] Figure 5 Schematic diagram of the structure of another laser projection system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0021] Please refer to Figure 1 , Figure 1It is a laser projection host with a heat dissipation structure provided by the related technology. The laser projection host may include: laser 01, lens 02, DMD light valve ( Figure 1 When the laser projector is operating, the components within it generate heat, resulting in a high operating temperature. To reduce the operating temperature of the laser projector, a first heat dissipation assembly 04 and a second heat dissipation assembly 05 may be provided within the laser projector.

[0022] The first heat dissipation component 04 may include: a first radiator 041, a liquid cooling pipeline ( Figure 1 (not labeled) and a cold head 042 abutting the device to be cooled. One end of the liquid cooling pipeline is connected to the first radiator 041, and the other end is connected to the cold head 042. Heat generated by the device to be cooled during operation is transferred sequentially through the cold head 042 and the liquid cooling pipeline to the first radiator 041 for dissipation. The first heat dissipation assembly 04 dissipates heat from the device to be cooled along path a.

[0023] The second heat dissipation assembly 05 may include: a second heat sink 051, a metal heat pipe 052, and a heat conduction block ( Figure 1 (Not labeled in the figure). One end of the metal heat pipe 052 is connected to the second heat sink 052, and the other end is connected to the heat block. Heat generated by the device to be cooled is transferred to the second heat sink 052 via the heat block and the metal heat pipe, where it is dissipated. The second heat sink assembly 05 dissipates heat from the device to be cooled along path b.

[0024] Each of the first and second heat sinks 041 and 051 may include a heat sink body and a fan, with the fan's air outlet facing the heat sink body. The rotating fans provide heat dissipation for the first and second heat sinks 041 and 051. The heat dissipation device may be at least one of the laser 01, lens 02, DMD light valve, and circuit board 03.

[0025] However, due to the different locations of components within different laser projector models, each model requires a separate, integrated heat sink assembly, leading to higher manufacturing costs. Furthermore, when the heat sink assembly is located within the laser projector, the various components within the laser projector block the airflow of the fan within the heat sink assembly, resulting in poor heat dissipation from the heat sink assembly and ultimately, poor cooling of the laser projector.

[0026] Please refer to Figure 2 , Figure 2 FIG1 is a schematic diagram of the structure of a laser projection system provided in an embodiment of the present application. The laser projection system may include: a heat dissipation device 100 and a laser projection host 200.

[0027] The heat dissipation device 100 may include: a radiator 101 located outside the laser projection host 200 , a heat dissipation control component 102 connected to the radiator 101 , and a heat dissipation pipe 103 having a first end connected to the radiator 101 .

[0028] The laser projection system 200 may include a heat dissipation device 201 , which abuts against the second end of the heat conducting pipe 102 . It should be noted that the first end and the second end of the heat conducting pipe 102 are different ends of the heat conducting pipe 103 .

[0029] In the embodiment of the present application, the heat dissipation control component 102 establishes a communication connection with the radiator 101. The heat dissipation control component is configured to adjust the heat dissipation of the radiator 101 based on the temperature of at least one of the first end and the second end of the heat conduction pipe 103 and the maximum operating temperature of the device to be cooled 201.

[0030] In summary, the laser projection system provided in the embodiments of the present application includes: a laser projection host and a heat dissipation device. The heat sink in the heat dissipation device is located outside the laser projection host, and the heat dissipation control component in the heat dissipation device is capable of adjusting the heat dissipation of the heat sink based on the temperature of at least one of the first end and the second end of the heat conduction pipe and the maximum operating temperature of the component to be dissipated. This enables the heat dissipation device to dissipate heat from the component to be dissipated in the laser projection host, preventing the operating temperature of the component to be dissipated from exceeding its maximum operating temperature, thereby preventing damage to the component to be dissipated due to high operating temperatures, and effectively extending the service life of the laser projection system. Furthermore, the heat dissipation device and the laser host in the present application are separate, allowing different models of laser hosts to be connected to the same heat dissipation device, effectively reducing the manufacturing cost of the laser projection system. Furthermore, since the heat sink in the heat dissipation device is located outside the laser projection host, it effectively prevents components within the laser projection host from obstructing the heat dissipation of the heat sink, thereby improving the efficiency of the heat dissipation device in dissipating heat from the component to be dissipated, and thus achieving better heat dissipation effect of the laser projection system.

[0031] In the embodiment of the present application, there are multiple ways for the heat dissipation control component in the heat dissipation device to control the radiator to dissipate heat. The embodiment of the present application uses the following three possible implementation methods as examples for description:

[0032] In the first possible implementation, Figure 3 As shown, Figure 3is a schematic diagram of the structure of another laser projection system provided in an embodiment of the present application. The laser projection system may further include: a temperature sensor 300 located at the first end of the heat transfer pipe 103. The temperature sensor 300 is connected to the heat dissipation control component 102. For example, the temperature sensor 300 may be in communication with the heat dissipation control component 102. The temperature sensor 300 is capable of detecting the temperature of the first end of the heat transfer pipe 103 and transmitting the temperature of the first end of the heat transfer pipe 103 to the heat dissipation control component 102.

[0033] The heat dissipation control component 102 is configured to adjust the heat dissipation of the radiator 101 based on the temperature of the first end of the heat conducting pipe 103 detected by the temperature sensor 300 and the upper limit temperature of the first end of the heat conducting pipe 103 .

[0034] In the embodiment of the present application, since the second end of the heat conducting pipe 103 abuts the heat dissipation device 201, the upper limit temperature of the second end of the heat conducting pipe 103 is the maximum operating temperature of the heat dissipation device 201. The heat dissipation temperature of the heat conducting pipe 103 is the difference between the temperature of the second end of the heat conducting pipe 103 and the temperature of the first end of the heat conducting pipe 103. The heat dissipation temperature of the heat conducting pipe 103 is related to the fixed length and material of the heat conducting pipe 103. When the length and material of the heat conducting pipe 103 are fixed, the heat dissipation temperature of the heat conducting pipe 103 is also fixed. Therefore, the upper limit temperature of the first end of the heat conducting pipe 103 is the difference between the maximum operating temperature of the heat dissipation device 201 and the heat dissipation temperature of the heat conducting pipe 103. For example, assuming that the maximum operating temperature of the heat dissipation device 201 is 45°C (degrees Celsius) and the heat dissipation temperature of the heat conducting pipe is 10°C, the upper limit temperature of the first end of the heat conducting pipe 103 is 35°C.

[0035] For example, the laser projection host 200 in the laser projection system may further include: a memory 202, which is in communication with the heat dissipation control component 102. The memory 202 may store information on the maximum operating temperature of the device to be dissipated 201. The heat dissipation control component 102 in the heat dissipation device 100 stores the heat dissipation temperature of the heat pipe 102. Therefore, after the laser projection system is powered on, the memory 202 in the laser projection host 200 may send information on the maximum operating temperature of the device to be dissipated 101 to the heat dissipation control component 102 in the heat dissipation device 100, so that the heat dissipation control component 102 can determine the upper limit temperature of the first end of the heat dissipation pipe 103 based on the maximum operating temperature of the device to be dissipated 201 and the heat dissipation temperature of the heat dissipation pipe 102.

[0036] In an embodiment of the present application, the heat dissipation control component 102 is configured to: when the temperature sensor 300 detects that the temperature of the first end of the heat conducting pipe 103 is higher than the upper limit temperature of the first end of the heat conducting pipe 103, control the radiator 101 to increase the heat dissipation to reduce the temperature of the first end of the heat conducting pipe 103, so that the temperature of the second end of the heat conducting pipe 103 is also reduced, thereby reducing the temperature of the device to be cooled 201, and ensuring that the operating temperature of the device to be cooled 201 is lower than its maximum operating temperature.

[0037] In the second possible implementation, Figure 4 As shown, Figure 4 is a schematic diagram of the structure of another laser projection system provided in an embodiment of the present application. The laser projection system may further include: a temperature sensor 300 located at the second end of the heat transfer pipe 103. The temperature sensor 300 is connected to the heat dissipation control component 102. For example, the temperature sensor 300 may be in communication with the heat dissipation control component 102. The temperature sensor 300 is capable of detecting the temperature of the second end of the heat transfer pipe 103 and transmitting the temperature of the second end of the heat transfer pipe 103 to the heat dissipation control component 102.

[0038] In the embodiment of the present application, since the second end of the heat conducting pipe 103 is in contact with the heat dissipation device 201 and the temperature sensor 300 is located at the second end of the heat conducting pipe, the temperature detected by the temperature sensor 300 is the operating temperature of the heat dissipation device 201.

[0039] Optionally, the laser projection host 200 in the laser projection system may further include a memory 202, which is communicatively connected to the heat dissipation control component 102. The memory 202 may store information regarding the maximum operating temperature of the device 201 to be dissipated. After the laser projection system is powered on, the memory 202 in the laser projection host 200 may transmit the information regarding the maximum operating temperature of the device 101 to be dissipated to the heat dissipation control component 102 in the heat dissipation device 100. Thus, the heat dissipation control component 102 in the heat dissipation device 200 is configured to control the heat dissipator 101 to increase heat dissipation to reduce the temperature of the first end of the heat dissipation device 103, thereby reducing the temperature of the second end of the heat dissipation device 101 and thereby ensuring that the operating temperature of the device 201 to be dissipated is less than its maximum operating temperature.

[0040] In the third possible implementation, Figure 5 As shown, Figure 5is a schematic diagram of the structure of another laser projection system provided in an embodiment of the present application. The laser projection system may further include: a first temperature sensor 301 located at a first end of the heat transfer pipe 103; and a second temperature sensor 302 located at a second end of the heat transfer pipe 103. Both the first temperature sensor 301 and the second temperature sensor 302 are in communication with the heat dissipation control assembly 102.

[0041] In this way, the heat dissipation control component 102 is configured to: when the temperature of the first end of the heat-conducting pipe 103 detected by the first temperature sensor 301 is higher than the upper limit temperature of the first end of the heat-conducting pipe 103, and / or when the temperature of the second end of the heat-conducting pipe 103 detected by the second temperature sensor 302 is higher than the maximum operating temperature of the device to be cooled 201, control the radiator 101 to increase the heat dissipation amount to reduce the temperature of the first end of the heat-conducting pipe 103, so that the temperature of the second end of the heat-conducting pipe 103 is also reduced, thereby reducing the temperature of the device to be cooled 201, and ensuring that the operating temperature of the device to be cooled 201 is lower than its maximum operating temperature.

[0042] It should be noted that the specific working principle of the laser projection system in the third possible implementation manner can refer to the corresponding contents of the laser projection system in the first possible implementation manner and the second possible implementation manner, which will not be repeated here.

[0043] Optional, such as Figure 3 、 Figure 4 or Figure 5 As shown, the radiator 101 in the heat dissipation device 100 may include: a heat dissipation plate 1011 and a fan 1012, and the air outlet surface 1012a of the fan 1012 faces the heat dissipation plate 1011. The heat dissipation plate 1011 is connected to the first end of the heat conduction pipe 103. The fan 1012 is connected to the heat dissipation control component 102, and the heat dissipation control component 102 is configured to: control the rotation speed of the fan 102 to adjust the fan heat of the radiator. For example, the fan 1012 may include a fan body and a drive motor, and the heat dissipation control component 102 is connected to the drive motor. The heat dissipation control component 102 can control the drive motor to adjust the rotation speed of the fan body, thereby adjusting the heat dissipation of the radiator 101.

[0044] In the embodiment of the present application, the rotation speed of the fan 1012 is positively correlated with the heat dissipation of the radiator 101. For example, Figure 3Taking the laser projection system shown as an example, the method by which the heat dissipation control component 102 controls the fan speed is described. When the heat dissipation control component 102 determines that the temperature at the first end of the heat dissipation pipe 103 is higher than its upper temperature limit, the heat dissipation control component 102 controls the fan speed to increase the heat dissipation of the radiator, thereby ensuring that the operating temperature of the device to be cooled 201 is lower than its maximum operating temperature. Subsequently, when the heat dissipation control component 102 determines that the difference between the temperature at the first end of the heat dissipation pipe 103 and its upper temperature limit is lower than a difference threshold, the heat dissipation control component 102 controls the fan speed to decrease the heat dissipation of the radiator, thereby ensuring low power consumption during operation of the laser projection system.

[0045] Optional, such as Figure 3 、 Figure 4 or Figure 5 As shown, the heat dissipation device 100 may further include: a heat sink 104 connected to the second end of the heat dissipation pipe 103. The heat sink 104 may abut against the device 201 to be cooled. The first end of the heat conductive pipe may increase the contact area with the device 201 to be cooled via the heat sink 104, thereby improving the efficiency of heat dissipation of the device 201 to be cooled. The heat dissipation pipe 104 may be a liquid cooling heat pipe or a metal heat pipe. When the heat dissipation pipe 104 is a liquid cooling heat pipe, since the liquid cooling heat pipe is easy to bend, it is convenient to assemble the laser projection host 200 and the heat dissipation device 100, and the volume of the laser projection system formed after assembly can be kept small.

[0046] In the embodiment of the present application, the component 201 to be cooled in the laser projector 200 can be any one of a laser, a lens, a DMD light valve, and a circuit board. Typically, there are multiple components 201 to be cooled in the laser projector 200. Therefore, the heat dissipation device 100 also needs to include multiple heat sinks 101 and multiple heat pipes 103. The multiple heat sinks 101 correspond one-to-one to the multiple components 201 to be cooled, and each heat sink 101 is connected to the corresponding component 201 to be cooled via at least one heat pipe 103.

[0047] In the embodiment of the present application, since the maximum operating temperatures of the components 201 to be cooled may be different, for example Figure 3 、 Figure 4 or Figure 5The memory 202 in the laser projection host 200 may store information regarding the maximum operating temperature of each heat dissipation device 201, and the heat dissipation control component 102 in the heat dissipation device 100 may store the heat dissipation temperature of the heat conduction pipe 102 corresponding to each heat dissipation device 201. After the laser projection system is powered on and started, the memory 202 may send the information regarding the maximum operating temperature of each heat dissipation device 201 to the heat dissipation control component 102, so that the heat dissipation control component 102 can obtain the maximum operating temperature of each heat dissipation device 201. Furthermore, the heat dissipation control component 102 can determine the upper limit temperature of the first end of the heat conduction pipe 102 connected to each heat dissipation device 201 based on the maximum operating temperature of each heat dissipation device 201 and the heat dissipation temperature of the heat conduction pipe 102 corresponding to each heat dissipation device 201.

[0048] For example, assuming that there are three components 201 to be cooled in the laser projection assembly 200, the maximum operating temperatures of the three components 201 to be cooled are T1, T2 and T3 respectively, and the heat dissipation temperatures of the heat dissipation pipes 103 connected to the three components 201 to be cooled are △T1, △T2 and △T3 respectively, then the upper limit temperatures of the heat dissipation pipes 103 connected to the three components 201 to be cooled are: T1-△T1, T2-△T2 and T3-△T3 respectively.

[0049] Optionally, the heat dissipation device 100 in the laser projection system in the embodiment of the present application is configured as follows: when the heat dissipation of the radiator 101 in the heat dissipation device 100 is at a maximum, if the operating temperature of the device to be cooled 201 is greater than the maximum operating temperature of the device to be cooled 201, a prompt message is issued indicating that the device to be cooled 201 cannot be cooled.

[0050] For example, for the laser projection system in the first possible implementation, if the fan 1012 in the heat sink 101 of the heat sink device 100 has the highest rotational speed, the heat sink 101 will dissipate the greatest amount of heat. At this point, if the heat dissipation control component 102 determines that the temperature of the first end of the heat pipe 103 is greater than the upper limit temperature of the first end of the heat pipe 103, the heat sink 100 will issue a prompt indicating that the heat sink 201 cannot be cooled.

[0051] For the laser projection system in the second possible implementation, if the fan 1012 within the radiator 101 in the heat dissipation device 100 has the highest rotational speed, the heat dissipation capacity of the radiator 101 is maximized. At this point, if the heat dissipation control component 102 determines that the temperature at the second end of the heat transfer pipe 103 is greater than the maximum operating temperature of the device 201 to be cooled, the heat dissipation device 100 issues a message indicating that the device 201 to be cooled cannot be cooled.

[0052] In the embodiment of the present application, there are multiple optional implementations for the heat dissipation device 100 to issue a prompt message indicating that the device to be cooled 201 cannot be cooled. For example, in one optional implementation, the heat dissipation device 100 may further include: a first alarm. When the heat dissipation device 100 determines that the heat dissipation of the radiator 101 in the heat dissipation device 100 is at its maximum, but the operating temperature of the device to be cooled 201 is still greater than the maximum operating temperature of the device to be cooled 201, the first alarm may be operated to issue a prompt message indicating that the device to be cooled 201 cannot be cooled. In this case, the prompt message may be an audible message. In another optional implementation, when the heat dissipation device 100 determines that the heat dissipation of the radiator 101 in the heat dissipation device 100 is the maximum, but the operating temperature of the device to be cooled 201 is still greater than the maximum operating temperature of the device to be cooled 201, the heat dissipation device 100 can send a prompt message to the laser projection host 200 that the device to be cooled 201 cannot be cooled. After the laser projection host 200 receives the prompt message, the laser projection host 200 can project corresponding text information to remind people using the laser projection system.

[0053] Optional, such as Figure 3 、 Figure 4 or Figure 5 As shown, the laser projection system may further include an ambient temperature detection component 400, which is typically located outside the heat dissipation component 200 or the laser projection host 100 and is in communication with the heat dissipation control component 102 in the heat dissipation device 100. The ambient temperature detection component 400 is configured to detect the temperature of the environment in which the laser projection system is located and transmit the detected temperature to the heat dissipation control component 102.

[0054] Normally, the temperature of the first end of the heat pipe 103 is about 10°C higher than the room temperature (i.e., the temperature of the environment in which the laser projection system is detected). If the difference between the temperature of the first end of the heat pipe 103 and the room temperature is small, the heat emitted by the heat dissipation device 201 may not be transferred to the radiator 101 through the heat pipe 102, that is, the heat dissipation device 100 may malfunction.

[0055] Therefore, after receiving the temperature of the laser projection system's environment detected by the ambient temperature detection component 400, the heat dissipation control component 102 determines whether the difference between the temperature of the first end of the heat transfer pipe 103 and the temperature of the laser projection system's environment is less than a difference threshold. For example, the difference threshold may be 10°C. When the difference between the temperature of the first end of the heat transfer pipe 103 and the temperature of the laser projection system's environment is less than the difference threshold, the heat dissipation device 100 will issue a warning message indicating that the heat dissipation device 100 has failed.

[0056] In the embodiment of the present application, there are multiple optional implementations for the heat dissipation device 100 to issue a prompt message indicating that the heat dissipation device 100 has failed. For example, in one optional implementation, the heat dissipation device 100 may further include: a second alarm. When the difference between the temperature of the first end of the heat conduction pipe 103 and the temperature of the environment in which the laser projection system is located is less than a difference threshold, the second alarm may be operated to issue a prompt message indicating that the heat dissipation device 100 has failed. In this case, the prompt message may be an audible message. In another optional implementation, when the difference between the temperature of the first end of the heat conduction pipe 103 and the temperature of the environment in which the laser projection system is located is less than a difference threshold, the heat dissipation device 100 may send a prompt message indicating that the heat dissipation device 100 has failed to the laser projection host 200. After the laser projection host 200 receives the prompt message, the laser projection host may project a corresponding text message to alert the person using the laser projection system.

[0057] Optional, such as Figure 3 、 Figure 3 and Figure 5 As shown, the heat dissipation device 100 may further include: a first shell 100a, in which the radiator 101 and the heat dissipation control component 102 may be located. The laser projection assembly 200 may further include: a second shell 200a, in which the heat dissipation device 201 is located. In the embodiment of the present application, the heat dissipation device 100 and the laser projection host 200 are of separate designs. The heat dissipation device 100 and the laser projection host 200 are usually manufactured separately, and then the two are assembled to obtain the laser projection system in the embodiment of the present application. After the heat dissipation device 100 and the laser projection host 200 are assembled, the first shell 100a may generally be located above the second shell 200a.

[0058] In the embodiment of the present application, when the laser projection system is a large-scale projection system, the heat dissipation device 100 can be located in a well-ventilated location to improve the heat dissipation efficiency of the device to be cooled 201 in the laser projection host 200 .

[0059] In summary, the laser projection system provided in the embodiments of the present application includes: a laser projection host and a heat dissipation device. The heat sink in the heat dissipation device is located outside the laser projection host, and the heat dissipation control component in the heat dissipation device is capable of adjusting the heat dissipation of the heat sink based on the temperature of at least one of the first end and the second end of the heat conduction pipe and the maximum operating temperature of the component to be dissipated. This enables the heat dissipation device to dissipate heat from the component to be dissipated in the laser projection host, preventing the operating temperature of the component to be dissipated from exceeding its maximum operating temperature, thereby preventing damage to the component to be dissipated due to high operating temperatures, and effectively extending the service life of the laser projection system. Furthermore, the heat dissipation device and the laser host in the present application are separate, allowing different models of laser hosts to be connected to the same heat dissipation device, effectively reducing the manufacturing cost of the laser projection system. Furthermore, since the heat sink in the heat dissipation device is located outside the laser projection host, it effectively prevents components within the laser projection host from obstructing the heat dissipation of the heat sink, thereby improving the efficiency of the heat dissipation device in dissipating heat from the component to be dissipated, and thus achieving better heat dissipation effect of the laser projection system.

[0060] The present application also provides a heat dissipation device. The structure of the heat dissipation device can be referred to Figure 2 、 Figure 3 、 Figure 4 or Figure 5 A heat dissipation device 100 in a laser projection system is shown. The heat dissipation device may include: a heat sink; a heat pipe having a first end connected to the heat sink, the second end of the heat pipe being configured to abut a component to be cooled within the laser projection system; and a heat dissipation control component connected to the heat dissipation control component, the heat dissipation control component being configured to adjust the heat dissipation of the heat sink based on the temperature of at least one of the first end and the second end of the heat pipe, and the maximum operating temperature of the component to be cooled.

[0061] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific principles of the heat dissipation device described above can refer to the corresponding contents in the aforementioned embodiment of the laser projection system, and will not be repeated here.

[0062] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0063] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A laser projection system, characterized in that: include: A laser projection host and a heat dissipation device, wherein the laser projection host and the heat dissipation device are designed to be separated; The heat dissipation device includes: a radiator located outside the laser projection host, a heat dissipation control component connected to the radiator, and a heat conduction pipe having a first end connected to the radiator; the heat dissipation device also includes: a first housing, wherein the radiator and the heat dissipation control component are both located within the first housing; the radiator includes: a heat dissipation plate and a fan, wherein the air outlet surface of the fan faces the heat dissipation plate, the heat dissipation plate is connected to the first end of the heat conduction pipe, and the fan is connected to the heat dissipation control component; The laser projection host includes: a device to be cooled, the device to be cooled abutting against the second end of the heat conducting pipe; the laser projection host also includes: a second housing, the device to be cooled located within the second housing; the laser projection host also includes: a memory, the memory being in communication with the heat dissipation control component, the memory storing a maximum operating temperature of the device to be cooled; after the laser projection system is powered on and started, the memory is used to send information about the maximum operating temperature of the device to be cooled to the heat dissipation control component; The heat dissipation control component is configured to: control the speed of the fan based on the temperature of at least one of the first end of the heat conduction pipe and the second end of the heat conduction pipe, and the maximum operating temperature of the device to be cooled, so as to adjust the heat dissipation of the radiator; The heat conducting pipe has a portion distributed between the first shell and the second shell; the heat conducting pipe is a liquid cooling heat dissipation pipe, and the liquid cooling heat dissipation pipe can be bent.

2. The laser projection system according to claim 1, wherein: The laser projection system further includes: a temperature sensor located at the first end of the heat conducting pipe, the temperature sensor being connected to the heat dissipation control assembly; The heat dissipation control component is configured to: adjust the heat dissipation of the radiator based on the temperature of the first end of the heat conducting pipe detected by the temperature sensor and the upper limit temperature of the first end of the heat conducting pipe; The upper limit temperature of the first end of the heat-conducting pipe is the difference between the maximum operating temperature of the device to be cooled and the heat dissipation temperature of the heat-conducting pipe, and the heat dissipation temperature of the heat-conducting pipe is the difference between the temperature of the second end of the heat-conducting pipe and the temperature of the first end of the heat-conducting pipe.

3. The laser projection system according to claim 2, wherein: The heat dissipation control component is configured to control the radiator to increase heat dissipation when the temperature of the first end of the heat conducting pipe detected by the temperature sensor is higher than the upper limit temperature of the first end of the heat conducting pipe.

4. The laser projection system according to claim 1, wherein: The laser projection system further includes: a temperature sensor located at the second end of the heat conducting pipe, the temperature sensor being connected to the heat dissipation control assembly; The heat dissipation control component is configured to control the radiator to increase heat dissipation when the temperature of the second end of the heat conducting pipe detected by the temperature sensor is higher than the maximum operating temperature of the device to be cooled.

5. The laser projection system according to any one of claims 1 to 4, characterized in that: The laser projection host includes a plurality of the components to be cooled, and the heat dissipation device includes a plurality of the radiators and a plurality of the heat conducting pipes. The plurality of the components to be cooled correspond to the plurality of the radiators one-to-one, and each of the radiators is connected to the corresponding component to be cooled via at least one heat conducting pipe.

6. The laser projection system according to any one of claims 1 to 4, characterized in that: The heat dissipation device is configured to: when the heat dissipation of the radiator is at its maximum, if the operating temperature of the device to be dissipated is greater than the maximum operating temperature of the device to be dissipated, issue a prompt message indicating that the device to be dissipated cannot be cooled.

7. The laser projection system according to any one of claims 1 to 4, characterized in that: The heat dissipation device is configured to issue a prompt message indicating that the heat dissipation device has failed when the difference between the temperature of the first end of the heat conduction pipe and the temperature of the environment where the laser projection system is located is less than a difference threshold.

8. The laser projection system according to any one of claims 1 to 4, characterized in that: The device to be cooled is any one of a laser, a lens, a digital micromirror device (DMD) light valve and a circuit board.

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