Coil assembly

Abstract

This disclosure provides an electronic component comprising: a main body; a coil portion disposed inside the main body; a noise removal portion disposed on a surface of the main body; an insulating layer disposed on the noise removal portion; a first external electrode and a second external electrode each connected to the coil portion and disposed on the insulating layer to overlap with the noise removal portion; and a third external electrode disposed spaced apart from the first external electrode and the second external electrode and in contact with the noise removal portion.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0062334, filed on May 25, 2020, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a coil assembly. Background Technology

[0003] An inductor (a type of coil assembly) is a typical passive electronic component used in electronic devices, along with resistors and capacitors.

[0004] As electronic devices become more high-performance and miniaturized, the number of electronic components used in such devices can increase, the electronic components can be miniaturized, and the operating frequency of the electronic components can be increased.

[0005] For these reasons, the likelihood of problems caused by relatively high-frequency noise in the coil assembly increases. Summary of the Invention

[0006] One aspect of this disclosure is to provide a coil assembly that can easily remove high-frequency noise.

[0007] According to one aspect of this disclosure, a coil assembly includes: a body; a coil portion disposed inside the body; a noise removal portion disposed on a surface of the body; an insulating layer disposed on the noise removal portion; a first external electrode and a second external electrode each connected to the coil portion and disposed on the insulating layer to overlap with the noise removal portion; and a third external electrode disposed spaced apart from the first external electrode and the second external electrode and in contact with the noise removal portion.

[0008] According to another aspect of this disclosure, a coil assembly may include: a body; a coil portion disposed inside the body; a noise removal portion disposed on a surface of the body in a first direction and in contact with the surface; an insulating layer disposed on the noise removal portion in the first direction; a first external electrode and a second external electrode respectively connected to opposite ends of the coil portion; and a third external electrode configured to be spaced apart from the first external electrode and the second external electrode and in contact with the noise removal portion. The insulating layer may be disposed in the first direction between the noise removal portion and each of the first external electrode and the second external electrode. Attached Figure Description

[0009] The above and other aspects, features and advantages of this disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] Figure 1 This is a schematic view of a coil assembly according to a first embodiment of the present disclosure.

[0011] Figure 2 When observing from direction A Figure 1 A diagram showing the time.

[0012] Figure 3 It shows along Figure 1 A view of the section cut by line I-I'.

[0013] Figure 4 It shows along Figure 1 A view of the section cut by line II-II'.

[0014] Figure 5 yes Figure 3 A magnified view of part B.

[0015] Figure 6 This is a view showing the signal transmission characteristics (S-parameters) of each of the experimental and comparative examples.

[0016] Figure 7 This is a schematic illustration of a first modification example of the first embodiment of the present disclosure and corresponds to Figure 5 The view.

[0017] Figure 8 This is a schematic illustration of a second modified example of the first embodiment of this disclosure and corresponds to Figure 5 The view.

[0018] Figure 9 This is an illustrative example of a third modification of the first embodiment of this disclosure and corresponds to... Figure 4 The view.

[0019] Figure 10 This is an illustrative example of a third modification of the first embodiment of this disclosure and corresponds to... Figure 2 The view.

[0020] Figure 11 This schematically illustrates a coil assembly according to a second embodiment of the present disclosure and corresponds to... Figure 3 The view.

[0021] Figure 12 This schematically illustrates a coil assembly according to a second embodiment of the present disclosure and corresponds to... Figure 4 The view.

[0022] Figure 13 This is a schematic view of a coil assembly according to a third embodiment of the present disclosure.

[0023] Figure 14When observed in the C direction Figure 13 A diagram showing the time.

[0024] Figure 15 It shows along Figure 13 A view of the section cut by line III-III'. Detailed Implementation

[0025] The terminology used in the description of this disclosure is for describing particular embodiments and is not intended to limit the disclosure. Unless otherwise indicated, singular terms include plural forms. The terms "comprising," "including," "constructed as," etc., in the description of this disclosure are used to indicate the presence of features, quantities, steps, operations, elements, components, or combinations thereof, without excluding the possibility of combining or adding one or more additional features, quantities, steps, operations, elements, components, or combinations thereof. Furthermore, the terms "set on," "located on," etc., may indicate that an element is located on or below an object, and do not necessarily mean that the element is above the object with respect to the direction of gravity.

[0026] The terms “integrated into” and “combined into” can refer not only to components that are in direct and physical contact with each other, but also to a configuration in which another component is located between the components so that the components are also in contact with other components.

[0027] For ease of description, the dimensions and thicknesses of the elements shown in the accompanying drawings are illustrated by way of example, and this disclosure is not limited thereto.

[0028] In the attached figures, the X direction is the first direction or length direction of the main body, the Y direction is the second direction or width direction of the main body, and the Z direction is the third direction or thickness direction of the main body.

[0029] In the following, a coil assembly according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. Referring to the drawings, the same or corresponding components may be designated by the same reference numerals, and repeated descriptions will be omitted.

[0030] In electronic devices, various types of electronic components can be used, and various types of coil components can be used between electronic components for noise removal or other purposes.

[0031] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency (HF) inductors, ordinary ferrite beads, high-frequency (GHz) ferrite beads, common-mode filters, etc.

[0032] First Embodiment and Modification Examples

[0033] Figure 1 This is a schematic view of a coil assembly according to a first embodiment of the present disclosure. Figure 2 When observing from direction A Figure 1A diagram showing the time. Figure 3 It shows along Figure 1 A view of the section cut by line I-I'. Figure 4 It shows along Figure 1 A view of the section cut by line II-II'. Figure 5 yes Figure 3 A magnified view of part B. Figure 6 This is a view showing the signal transmission characteristics (S-parameters) of each of the experimental and comparative examples.

[0034] Reference Figures 1 to 5 According to the first embodiment of the present disclosure, the coil assembly 1000 may include a main body 100, a support substrate 200, a coil portion 300, an insulating layer 400, a noise removal portion 500, and a first external electrode 610, a second external electrode 620, and a third external electrode 630.

[0035] The main body 100 may form the appearance of the coil assembly 1000 according to this embodiment, and the coil portion 300 may be embedded in the main body 100.

[0036] The main body 100 can be formed into a hexahedral shape overall.

[0037] Reference Figure 1 The main body 100 may include a first surface 101 and a second surface 102 opposite to each other in the longitudinal direction X of the main body 100, a third surface 103 and a fourth surface 104 opposite to each other in the width direction Y of the main body 100, and a fifth surface 105 and a sixth surface 106 opposite to each other in the thickness direction Z of the main body 100. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the main body 100 may correspond to a wall surface of the main body 100 that connects the fifth surface 105 and the sixth surface 106 of the main body 100. In the following, the two end surfaces of the main body 100 may refer to the first surface 101 and the second surface 102 of the main body 100, and the two side surfaces of the main body 100 may refer to the third surface 103 and the fourth surface 104 of the main body 100. In addition, one surface and the other surface of the main body 100 may refer to the sixth surface 106 and the fifth surface 105 of the main body 100, respectively.

[0038] For example, the main body 100 may be configured such that the coil assembly 1000, in which the first external electrode 610, the second external electrode 620, and the third external electrode 630 (described later) are formed according to this embodiment, has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. Since the above values ​​are merely design values ​​that do not reflect process errors, they should be considered to fall within the scope of this disclosure to the extent that they are considered process errors.

[0039] The length, width, and thickness of the coil assembly 1000 described above can be measured using a micrometer. The micrometer measurement method can be performed as follows: using a micrometer (device) equipped with Gage R&R technology (i.e., gauge repeatability and reproducibility technology), zero the micrometer, insert the coil assembly 1000 between the tips of the micrometer, and rotate the measuring dial of the micrometer. When measuring the length of the coil assembly 1000 using the micrometer method, the length of the coil assembly 1000 can refer to the value of a single measurement or the arithmetic mean of multiple measurements. This can be applied equivalently to the width and thickness of the coil assembly 1000.

[0040] The length, width, and thickness of the coil assembly 1000 described above can be measured using cross-sectional analysis methods. As an example, a method for measuring the length of the coil assembly 1000 using cross-sectional analysis will be described. Based on an image of a cross-section (a cross-section in the length direction X-thickness direction Z) of the body 100 at its midpoint in the width direction Y, captured by an optical microscope or scanning electron microscope (SEM), as shown in the captured image, the length of the coil assembly 1000 can refer to the maximum value among multiple line segments parallel to the length direction X of the body 100 and connecting the outermost boundary line of the coil assembly 1000. Alternatively, as shown in the captured image, the length of the coil assembly 1000 can refer to the minimum value among multiple line segments parallel to the length direction X of the body 100 and connecting the outermost boundary line of the coil assembly 1000. Alternatively, as shown in the captured image, the length of the coil assembly 1000 can refer to the arithmetic mean of at least three lengths among multiple line segments parallel to the length direction X of the body 100 and connecting the outermost boundary line of the coil assembly 1000. This can be applied equally to the width and thickness of the coil assembly 1000.

[0041] The body 100 may include a magnetic material and a resin. Specifically, the body 100 may be formed by stacking one or more magnetic composite sheets comprising a resin and a magnetic material dispersed in the resin. The body 100 may have a structure other than one in which the magnetic material is dispersed in the resin. For example, the body 100 may be formed using a magnetic material such as ferrite.

[0042] Magnetic materials can be ferrite powder particles or metallic magnetic powder particles.

[0043] Examples of ferrite powder particles may include at least one of spinel-type ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites, etc.), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites, etc.), garnet-type ferrites (such as Y-based ferrites, etc.), and Li-based ferrites.

[0044] The metallic magnetic powder particles may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic powder particles may be at least one selected from pure iron powder, Fe-Si based alloy powder, Fe-Si-Al based alloy powder, Fe-Ni based alloy powder, Fe-Ni-Mo based alloy powder, Fe-Ni-Mo-Cu based alloy powder, Fe-Co based alloy powder, Fe-Ni-Co based alloy powder, Fe-Cr based alloy powder, Fe-Cr-Si based alloy powder, Fe-Si-Cu-Nb based alloy powder, Fe-Ni-Cr based alloy powder, and Fe-Cr-Al based alloy powder.

[0045] The metallic magnetic powder particles can be amorphous or crystalline. For example, the metallic magnetic powder particles can be Fe-Si-B-Cr based amorphous alloy powder particles, but are not limited to this.

[0046] Ferrite powder particles and magnetic powder particles may each have an average diameter of approximately 0.1 μm to 30 μm, but are not limited thereto. In this case, the average diameter may refer to the particle size distribution expressed by D50 or D90.

[0047] The body 100 may include two or more types of magnetic materials dispersed in the resin. In this context, the term "different types of magnetic materials" means that the magnetic materials dispersed in the resin are distinguished from each other by diameter, composition, crystallinity, and shape.

[0048] The resin may include, but is not limited to, epoxy resins, polyimides, liquid crystal polymers, etc., in single or combined forms.

[0049] The main body 100 may include a core C passing through the central portion of each of the support substrate 200 and the coil portion 300, which will be described later. The core C may be formed by filling the through-holes of the coil portion 300 with a magnetic composite sheet, but is not limited thereto.

[0050] The support substrate 200 can be embedded in the main body 100. The support substrate 200 can support the coil section 300, which will be described later.

[0051] The support substrate 200 can be formed using an insulating material including a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or the support substrate 200 can be formed using an insulating material in which a reinforcing material (such as glass fiber or inorganic filler) is impregnated with such an insulating resin. For example, the support substrate 200 can be formed using materials such as prepreg, Ajinomoto build-up film (ABF), FR-4, bismaleimide triazine (BT) resin, photosensitive dielectric (PID), copper clad laminate (CCL), etc., but is not limited thereto.

[0052] As an inorganic filler, at least one selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0053] When the support substrate 200 is formed using an insulating material including reinforcing material, the support substrate 200 provides better rigidity. When the support substrate 200 is formed using an insulating material that does not contain glass fiber, the support substrate 200 can help reduce the overall thickness of the coil portion 300. When the support substrate 200 is formed using an insulating material containing photosensitive insulating resin, the number of processes for forming the coil portion 300 can be reduced. Therefore, it can be advantageous in terms of reducing production costs, and fine vias can be formed.

[0054] The coil portion 300 can be embedded in the main body 100 and can exhibit the characteristics of a coil assembly. For example, when the coil assembly 1000 of this embodiment is used as a power inductor, the coil portion 300 can stabilize the power supply of the electronic device by storing the electric field as a magnetic field and maintaining the output voltage.

[0055] The coil portion 300 may be formed on at least one of the two surfaces of the support substrate 200, and may form at least one turn. In this embodiment, the coil portion 300 may include a first coil pattern 311 and a second coil pattern 312 and a through hole 320. The first coil pattern 311 and the second coil pattern 312 are formed on two surfaces of the support substrate 200 that are opposite to each other in the thickness direction Z of the body 100. The through hole 320 passes through the support substrate 200 to connect the first coil pattern 311 and the second coil pattern 312 to each other.

[0056] Each of the first coil pattern 311 and the second coil pattern 312 can be in the form of a planar spiral shape having at least one turn around the core C. For example, based on Figure 3 and Figure 4 In the direction of the first coil pattern 311, at least one turn of the first coil pattern 311 can be formed around the core C on the lower surface of the support substrate 200, and at least one turn of the second coil pattern 312 can be formed around the core C on the upper surface of the support substrate 200.

[0057] The ends of the first coil pattern 311 and the second coil pattern 312 may be connected to the first external electrode 610 and the second external electrode 620, which will be described later, respectively. For example, the end of the first coil pattern 311 may extend to expose from the first surface 101 of the body 100 to connect to the first external electrode 610 formed on the first surface 101 of the body 100, and the end of the second coil pattern 312 may extend to expose from the second surface 102 of the body 100 to connect to the second external electrode 620 formed on the second surface 102 of the body 100.

[0058] At least one of the coil patterns 311 and 312 and the via 320 may include at least one conductive layer. For example, when the second coil pattern 312 and the via 320 are formed on another surface of the support substrate 200 by plating, the second coil pattern 312 and the via 320 may each include a seed layer and an electroplated layer. The seed layer may be formed by a vapor deposition method such as electroless plating or sputtering. Each of the seed layer and the electroplated layer may have a single-layer structure or a multi-layer structure. The multi-layer electroplated layer may be formed by a conformal film structure in which one electroplated layer is covered by another electroplated layer, or it may have a form in which another electroplated layer is stacked only on one surface of one electroplated layer. The seed layer of the second coil pattern 312 and the seed layer of the via 320 may be formed integrally, and there may be no boundary between them, but this is not a limitation. The electroplated layer of the second coil pattern 312 and the electroplated layer of the via 320 may be formed integrally, and there may be no boundary between them, but this is not a limitation.

[0059] As another example, based on Figure 3 and Figure 4In the orientation where the first coil pattern 311 disposed on the lower surface side of the support substrate 200 and the second coil pattern 312 disposed on the upper surface side of the support substrate 200 are formed separately and then jointly stacked on the support substrate 200 to form the coil portion 300, the via 320 may include a high-melting-point metal layer and a low-melting-point metal layer, wherein the melting point of the low-melting-point metal layer is lower than that of the high-melting-point metal layer. In this case, the low-melting-point metal layer may be formed using solder containing lead (Pb) and / or tin (Sn). At least a portion of the low-melting-point metal layer may melt due to pressure and temperature during batch stacking. For this reason, an intermetallic compound layer (IMC layer) may be formed on at least a portion of the boundary between the low-melting-point metal layer and the second coil pattern 312 and the boundary between the low-melting-point metal layer and the high-melting-point metal layer.

[0060] based on Figure 3 and Figure 4 In the direction of the coil patterns 311 and 312, they can be formed to protrude from the lower and upper surfaces of the support substrate 200, respectively. As another example, based on... Figure 3 and Figure 4 In the direction of the first coil pattern 311, it can be formed to protrude from the lower surface of the support substrate 200, and the second coil pattern 312 can be formed to be embedded in the support substrate 200, but may have an upper surface protruding from the upper surface of the support substrate 200. In this case, a recess can be formed in the upper surface of the second coil pattern 312, such that the upper surface of the support substrate 200 and the upper surface of the second coil pattern 312 are not located on the same plane. As another example, based on Figure 3 and Figure 4 In this orientation, the second coil pattern 312 may be formed to protrude from the upper surface of the support substrate 200, and the first coil pattern 311 may be formed to be embedded in the lower surface of the support substrate 200, but may have a lower surface protruding from the lower surface of the support substrate 200. In this case, a recess may be formed in the lower surface of the first coil pattern 311, such that the lower surface of the support substrate 200 and the lower surface of the first coil pattern 311 may not be located on the same plane.

[0061] Each of the coil patterns 311 and 312 and the via 320 may be formed using, but is not limited to, a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), or alloys thereof.

[0062] An insulating film IF may be disposed between the body 100 and each of the first coil pattern 311 and the second coil pattern 312. For example, refer to Figure 3 and Figure 4The insulating film IF can be formed as a conformal film along the surfaces of the first coil pattern 311, the support substrate 200, and the second coil pattern 312. The insulating film IF protects each of the coil patterns 311 and 312 and insulates the coil patterns 311 and 312 from the body 100, and may include known insulating materials (such as parylene). Any insulating material can be included in the insulating film IF without particular limitation. The insulating film IF can be formed by vapor deposition, etc., but is not limited thereto, and can be formed by stacking insulating materials (such as Ajinomoto deposited film (ABF)) on the support substrate 200.

[0063] An insulating layer 400 may be disposed between the noise removal section 500 (described later) and the first external electrode 610 and the second external electrode 620. In this embodiment, since the noise removal section 500 is disposed on the sixth surface 106 of the body 100, the insulating layer 400 may also be disposed on the sixth surface 106 of the body 100.

[0064] The insulating layer 400 can be formed by stacking an insulating film on the sixth surface 106 of the body 100 (on which the noise removal section 500, which will be described later, is formed). The insulating film can be a conventional non-photosensitive insulating film (such as Ajinomoto laminate (ABF), prepreg, etc.) or a photosensitive insulating film (such as photosensitive dielectric (PID) or dry film). Because the first external electrode 610 and the second external electrode 620 and the noise removal section 500 are capacitively coupled, the insulating layer 400 can be used as a dielectric layer. This will be described in detail later.

[0065] A noise removal unit 500 may be disposed on the surface of the body 100 to discharge high-frequency noise generated from and / or transmitted to the coil assembly 1000 according to the embodiment to the outside of the coil assembly 1000, such as a mounting substrate. Specifically, the noise removal unit 500 may be capacitively coupled to each of the first external electrode 610 and the second external electrode 620 to remove high-frequency noise from the input signal transmitted to the coil assembly 1000 according to the embodiment and the output signal transmitted outward from the coil assembly 1000 according to the embodiment. This will be described in detail later. In this context, when designing the coil assembly 1000 according to the embodiment, the term "high-frequency noise" may refer to a signal having a frequency exceeding the upper limit of a frequency range set as the operating frequency. As a non-limiting example, in this embodiment, high-frequency noise may refer to a signal of 600 MHz or higher.

[0066] The noise removal section 500 may include a conductor. For example, the noise removal section 500 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), or alloys thereof, but is not limited thereto. The noise removal section 500 may be formed by stacking a metal film (such as a copper film) on the sixth surface of the body 100, but is not limited thereto.

[0067] The first external electrode 610 and the second external electrode 620 can be connected to the coil portion 300. In this embodiment, the first external electrode 610 can be disposed on the first surface 101 of the body 100, contact and connect to the end of the first coil pattern 311 exposed from the first surface 101 of the body 100, and extend to a portion of each of the third surface 103, fourth surface 104, fifth surface 105, and sixth surface 106 of the body 100. The second external electrode 620 can be disposed on the second surface 102 of the body 100, contact and connect to the end of the second coil pattern 312 exposed from the second surface 102 of the body 100, and extend to a portion of each of the third surface 103, fourth surface 104, fifth surface 105, and sixth surface 106 of the body 100. On each of the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the body 100, the first external electrode 610 and the second external electrode 620 may be arranged to be spaced apart from each other.

[0068] Each of the first external electrode 610 and the second external electrode 620 may extend to a portion of the sixth surface 106 of the body 100 to overlap with the noise removal portion 500. When the coil assembly 1000 according to this embodiment is mounted on a mounting substrate, the first external electrode 610 and the second external electrode 620 may be input / output electrodes that electrically connect the coil assembly 1000 to the mounting substrate. In this embodiment, the noise removal portion 500 (which may be a conductor) and the first external electrode 610 and the second external electrode 620 (which may be conductors) may be arranged to overlap each other. An insulating layer 400 (which may be a dielectric) may be disposed between the noise removal portion 500 and each of the first external electrode 610 and the second external electrode 620 such that the noise removal portion 500 is capacitively coupled to each of the first external electrode 610 and the second external electrode 620. For example, the noise removal portion 500 and each of the first external electrode 610 and the second external electrode 620 may form a capacitor through the insulating layer 400. Due to the capacitive coupling described above, high-frequency noise transmitted to each of the first external electrode 610 and the second external electrode 620 can be transmitted to the noise removal unit 500. The noise removal unit 500 can be connected to a third external electrode 630, which will be described later. The third external electrode 630 can be connected to a grounding element, such as a mounting substrate, to remove high-frequency noise to the mounting substrate, etc. Considering the frequency range of the high-frequency noise to be removed, the overlap area between the noise removal unit 500 and each of the first external electrode 610 and the second external electrode 620, the dielectric constant of the insulating layer 400, and the thickness of the insulating layer 400 can be changed in an appropriate manner.

[0069] The third external electrode 630 may be configured to be spaced apart from the first external electrode 610 and the second external electrode 620, and may contact and be connected to the noise removal unit 500. When the coil assembly 1000 according to this embodiment is mounted on a mounting substrate or the like, the third external electrode 630 may be connected to the grounding element of the mounting substrate; or when the coil assembly 1000 according to this embodiment is packaged in an electronic component package, the third external electrode 630 may be connected to the grounding element of the electronic component package. The third external electrode 630 may be the grounding electrode of the coil assembly 1000 according to this embodiment.

[0070] In this embodiment, the third external electrode 630 may be formed on the third surface 103, fourth surface 104, fifth surface 105, and sixth surface 106 of the body 100, but may be formed by removing a portion of the upper side from a completely rectangular cross-section. For this reason, the third external electrode 630 may be configured to be spaced apart from the first external electrode 610 and the second external electrode 620 on the third surface 103, fourth surface 104, fifth surface 105, and sixth surface 106 of the body 100.

[0071] The third external electrode 630 can penetrate the insulating layer 400 to contact and connect to the noise removal unit 500. For example, see reference. Figure 2 and Figure 3 A protrusion may be formed in a region of the third external electrode 630 disposed on the sixth surface 106 of the body 100, and the protrusion may penetrate a portion of the insulating layer 400 to allow the third external electrode 630 and the noise removal portion 500 to contact and connect. Therefore, an opening O corresponding to the protrusion may be formed in the insulating layer 400. As another example, based on... Figure 2 A slit extending from the lower edge of the sixth surface 106 of the body 100 to the upper edge of the sixth surface 106 of the body 100 can be formed on the insulating layer 400, and the third external electrode 630 can contact and connect to the noise removal part 500 through the slit. In this case, the width of the slit can be equal to the width of the area of ​​the third external electrode 630 disposed on the sixth surface 106 of the body 100. Figure 2 The distance of the third external electrode 630 in the X direction, but not limited to this.

[0072] Each of the first external electrode 610, the second external electrode 620, and the third external electrode 630 may include at least one of a conductive resin layer and an electroplated layer. The conductive resin layer may be formed by printing conductive paste onto the surface of the body 100 and curing the printed conductive paste, and may include any one or more conductive metals selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag), as well as a thermosetting resin. The electroplated layer may include any one or more metals selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

[0073] Reference Figures 3 to 5The noise removal section 500 can be configured to contact the sixth surface 106 of the main body 100. Since the noise removal section 500 is provided on the sixth surface 106 of the main body 100, high-frequency noise can be emitted to the outside of the component relatively quickly. For example, since the noise removal section 500 is provided on the sixth surface 106 of the main body 100, the capacitor used to remove high-frequency noise can be formed relatively close to the mounting substrate to shorten the path for removing high-frequency noise. Furthermore, since the noise removal section 500 is provided between the main body 100 and the mounting substrate, the magnetic flux formed by the coil section 300 can reduce noise caused by circuit patterns on the mounting substrate. Additionally, the noise removal section 500 can be configured to contact the sixth surface 106 of the main body 100 to minimize the increase in the overall thickness of the component due to the formation of the noise removal section 500. Additionally, the noise removal section 500 may be configured as the sixth surface 106 of the contact body 100 to minimize the distance between the coil section 300 and the noise removal section 500, which are arranged relative to each other via the body 100 having a non-zero dielectric constant, and to form capacitive coupling between the coil section 300 and the noise removal section 500 to remove high-frequency noise.

[0074] The noise removal section 500 may be configured to be spaced apart from each of the edges where one surface (i.e., the sixth surface) of the body 100 intersects with the two end surfaces and the two side surfaces of the body 100. For example, refer to Figure 2 The noise removal section 500 may be disposed on the sixth surface 106 of the main body 100, but may not extend to the edge where the sixth surface 106 of the main body 100 intersects with the first surface 101, second surface 102, third surface 103, and fourth surface 104 of the main body 100. For this reason, the side surface of the noise removal section 500 may be arranged to have a separation space spaced apart from the aforementioned edge. An insulating layer 400 may be disposed within this separation space, and the insulating layer 400 may cover the side surface of the noise removal section 500. According to the above structure, the noise removal section 500 may be spaced apart from the edge where the sixth surface 106 of the main body 100 intersects with the first surface 101 and second surface 102 of the main body 100. Therefore, the first external electrode 610 and the second external electrode 620 may be prevented from short-circuiting each other due to the noise removal section 500. Due to stress concentration, conductive metal magnetic powder particles may be exposed from the edge of the sixth surface 106 of the main body 100. According to the above structure, the first external electrode 610 and the second external electrode 620 can be prevented from short-circuiting due to the noise removal part 500 and the metal magnetic powder exposed around the edge.

[0075] Figure 6 This is a view showing the signal transmission characteristics (S-parameters) of each of the experimental and comparative examples.

[0076] The comparative example is a coil assembly excluding the noise removal unit 500 described above, while the experimental example is a coil assembly including the noise removal unit 500 described above. In both the comparative and experimental examples, all conditions are identical except for the presence or absence of the noise removal unit 500. For example, the number of turns of the coil, the diameter of the metal wire constituting the coil, and the dimensions of the main body can all be the same in both examples. In both the comparative and experimental examples, the signal transmission characteristics between the ports are confirmed using the 3D EM simulator HFSS with the first external electrode as the input terminal and the second external electrode as the output terminal (S21). The signal transmission characteristics at frequencies of 600MHz, 800MHz, and 1GHz are confirmed in both the comparative and experimental examples (S21). In summary, the results are shown in Table 1 below.

[0077] [Table 1]

[0078]

[0079] Reference Figure 6 As shown in Table 1, the experimental examples are more effective at removing high-frequency signals compared to the comparative examples. For example, it can be seen that the comparative example, which lacks a noise removal section, allows relatively high-frequency signals to pass through. This means that high-frequency signals can be transmitted relatively well from the input terminal to the output terminal, and that the effect of removing high-frequency noise is negligible. Conversely, the experimental example, which includes a noise removal section, does not allow relatively high-frequency signals to pass through well. Therefore, it can be seen that when comparing the experimental examples and the comparative examples, the experimental examples effectively prevent unwanted high-frequency noise.

[0080] Figure 7 This is a schematic illustration of a first modification example of the first embodiment of the present disclosure and corresponds to Figure 5 The view.

[0081] Reference Figure 5 and Figure 7 In the first embodiment, an adhesive layer AL may be further included between the sixth surface 106 of the body 100 and the noise removal portion 500. The noise removal portion 500 may be disposed on the sixth surface 106 of the body 100. Since the body 100, which includes an insulating resin, and the noise removal portion 500, which includes a conductor, may be heterogeneous materials, the bonding strength between them may be relatively weak. In this modified example, the noise removal portion 500 may be prevented from being peeled off by providing the adhesive layer AL between the noise removal portion 500 and the sixth surface 106 of the body 100. The adhesive layer AL and the noise removal portion 500 may be formed by stacking a material such as resin-coated copper (RCC) on the sixth surface 106 of the body 100, but are not limited thereto. The adhesive layer AL may include, but is not limited to, a thermosetting resin such as epoxy resin.

[0082] Figure 8 This is a schematic illustration of a second modified example of the first embodiment of this disclosure and corresponds to Figure 5 The view.

[0083] Reference Figure 5 and Figure 8 In a first embodiment, the noise removal unit 500 may include a first conductive layer 11 and a second conductive layer 12 disposed on the first conductive layer 11. The first conductive layer 11 may be a seed layer for forming the second conductive layer 12 by an electroplating process, and the second conductive layer 12 may be an electroplated layer formed by plating the first conductive layer 11, which serves as the seed layer, onto the sixth surface 106 of the body 100. The first conductive layer 11 may be formed by a vapor deposition process such as sputtering or electroless plating. Each of the first conductive layer 11 and the second conductive layer 12 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but is not limited thereto. Figure 8 The diagram shows a second conductive layer 12 plated to cover the side surface of the first conductive layer 11, but is not limited thereto. As another example, with... Figure 8 Unlike other conductive layers, when an anti-plating agent is used to form the second conductive layer 12, the second conductive layer 12 may not cover the side surface of the first conductive layer 11.

[0084] Figure 9 This is an illustrative example of a third modification of the first embodiment of this disclosure and corresponds to... Figure 4 The view. Figure 10 This is an illustrative example of a third modification of the first embodiment of this disclosure and corresponds to... Figure 2 The view.

[0085] Reference Figure 2 and Figure 4 as well as Figure 9 and Figure 10In the first embodiment, it can be modified to further include a fourth external electrode 640 spaced apart from the first external electrode 610, the second external electrode 620, and the third external electrode 630. In this modified example, the third external electrode 630 can be disposed on the third surface 103 of the body 100, such that both ends of the third external electrode 630 are arranged to extend to each of the fifth surface 105 and the sixth surface 106 of the body 100. The fourth external electrode 640 can be disposed on the fourth surface 104 of the body 100, such that both ends of the fourth external electrode 640 are arranged to extend to each of the fifth surface 105 and the sixth surface 106 of the body 100. The fourth external electrode 640 can contact and connect to the noise removal part 500, and can be used together with the third external electrode 630 as a ground electrode of the coil assembly 1000 according to this embodiment. In this case, the aforementioned protrusion and the opening O or slit can be applied to the fourth external electrode 640 and the insulating layer 400 applied to this modified example, respectively. Figure 9 and Figure 10 Unlike other components, the fourth external electrode 640 may not contact or be connected to the noise removal unit 500. In this case, when mounting the coil assembly according to this modified example, the fourth external electrode 640 can be used as a non-contact terminal and can be connected to a grounding element of the mounting substrate or the like, or to a grounding element of the package. The aforementioned structures of the third external electrode 630 and the fourth external electrode 640 can be easily formed when the third external electrode 630 and the fourth external electrode 640 are formed on the third surface 103 and the fourth surface 104 of the body 100 using a TWA printing process or the like.

[0086] Although not shown, the outer insulating layer may be formed on the first surface 101, second surface 102, third surface 103, fourth surface 104, fifth surface 105 and sixth surface 6 of the body 100 in areas other than the areas in which the first external electrode 610, the second external electrode 620, the third external electrode 630 and the fourth external electrode 640 are formed, but the scope of this disclosure is not limited thereto.

[0087] Although the above description assumes that the first external electrode 610 and the second external electrode 620 are respectively arranged on the five surfaces of the body 100, this is merely illustrative. As another example, the external electrodes 610 and 620 may be formed as three-sided electrodes (e.g., the first external electrode 610 may be disposed on the first surface 101 of the body 100 such that the two ends of the first external electrode 610 extend only to the fifth surface 105 and the sixth surface 106 of the body 100, respectively), or as L-shaped electrodes (e.g., the first external electrode 610 may be disposed on the first surface 101 of the body 100 and extend only to the sixth surface 106 of the body 100).

[0088] Second embodiment and modification example

[0089] Figure 11 This schematically illustrates a coil assembly according to a second embodiment of the present disclosure and corresponds to... Figure 3 The view. Figure 12 This schematically illustrates a coil assembly according to a second embodiment of the present disclosure and corresponds to... Figure 4 The view.

[0090] Reference Figures 1 to 5 as well as Figure 11 and Figure 12 When comparing the coil assembly 2000 according to this embodiment with the coil assembly 1000 according to the first embodiment of this disclosure, the structures of the noise removal units 510 and 520 and the insulating layers 410 and 420 may be different. Therefore, in describing this embodiment, only the structures of the noise removal units 510 and 520 and the insulating layers 410 and 420 that differ from those in the first embodiment of this disclosure will be described. For the remaining construction of this embodiment, the description of the first embodiment and the description of the modified examples of the first embodiment of this disclosure can be applied as is.

[0091] Reference Figure 11 and Figure 12 The noise removal portions 510 and 520 applied to the coil assembly 2000 according to this embodiment may include a first noise removal portion 510 configured to contact the sixth surface 106 of the body 100, and a second noise removal portion 520 configured to contact the fifth surface 105 of the body 100. Insulating layers 410 and 420 may include a first insulating layer 410 disposed on the first noise removal portion 510, and a second insulating layer 420 disposed on the second noise removal portion 520. The first external electrode 610 and the second external electrode 620 may extend to portions of the fifth surface 105 and the sixth surface 106 of the body 100, respectively, to be capacitively coupled to the first noise removal portion 510 on the sixth surface 106 of the body 100, and capacitively coupled to the second noise removal portion 520 on the fifth surface 105 of the body 100, respectively. For example, in this embodiment, based on... Figure 11 In the direction described in the first embodiment of this disclosure, capacitive coupling between the noise removal unit 500 and each of the first external electrode 610 and the second external electrode 620 can be formed on each of the upper and lower surfaces of the body 100. In this embodiment, the capacitive coupling between each of the first external electrode 610 and the second external electrode 620 and the noise removal units 510 and 520 can be increased to improve the effect of removing high-frequency noise.

[0092] Unlike the first embodiment of this disclosure, the third external electrode 630 may be continuously formed on the third surface 103, fourth surface 104, fifth surface 105, and sixth surface 106 of the body 100 to have a rectangular cross-sectional shape. In this case, the protrusions and openings described in the first embodiment of this disclosure may also be formed in the second insulating layer 420 and the third external electrode 630 disposed on the fifth surface 105 of the body 100. That is, the third external electrode 630 may be formed in a closed-loop shape around the body 100 and may be connected to the first noise removal portion 510 and the second noise removal portion 520 disposed on opposite surfaces (e.g., the fifth surface 105 and the sixth surface 106) of the body 100 through each opening O defined on the first insulating layer 410 and the second insulating layer 420. This closed-loop shape of the third external electrode may be applied to another exemplary embodiment of the coil assembly, in which the first noise removal portion 510 and the second noise removal portion 520 are disposed on the side surfaces (e.g., the third surface 103 and the fourth surface 104) of the body 100.

[0093] In this embodiment, it can be modified to further include the fourth external electrode described in the third modified example of the first embodiment of this disclosure. In this case, the third external electrode 630 may contact the first noise removal unit 510 and / or the second noise removal unit 520, and the fourth external electrode may contact the first noise removal unit 510 and / or the second noise removal unit 520.

[0094] Third Embodiment and Modification Examples

[0095] Figure 13 This is a schematic view of a coil assembly according to a third embodiment of the present disclosure. Figure 14 When observed in the C direction Figure 13 A diagram showing the time. Figure 15 It shows along Figure 13 A view of the section cut by line III-III'.

[0096] Reference Figures 1 to 5 as well as Figures 13 to 15 When comparing the coil assembly 3000 according to this embodiment with the coil assembly 1000 according to the first embodiment of this disclosure, the noise removal units 510 and 520 and the insulating layers 410 and 420 may be provided differently. Therefore, in describing this embodiment, only the structures of the noise removal units 510 and 520 and the insulating layers 410 and 420 that differ from those in the first embodiment of this disclosure will be described. For the remainder of the construction of this embodiment, the description of the first embodiment of this disclosure and the description of the modified examples of the first embodiment can be applied as is.

[0097] Reference Figures 13 to 15The noise removal portion applied to the coil assembly 3000 according to this embodiment can be configured to contact at least one of the two side surfaces of the body. Additionally, an insulating layer can be provided on the surface of the body on which the noise removal portion is provided. Hereinafter, the description will assume that the noise removal portions 510 and 520 and the insulating layers 410 and 420 are formed on the third and fourth surfaces of the body 100, respectively; however, this is merely illustrative. Therefore, the fact that the noise removal portions 510 and 520 are provided only on one of the third surface 103 and the fourth surface 104 of the body 100 does not exclude the scope of this embodiment.

[0098] In this embodiment, noise removal portions 510 and 520 may include a first noise removal portion 510 configured to contact the third surface 103 of the body 100, and a second noise removal portion 520 configured to contact the fourth surface 104 of the body 100. Insulating layers 410 and 420 may include a first insulating layer 410 disposed on the first noise removal portion 510, and a second insulating layer 420 disposed on the second noise removal portion 520. The first external electrode 610 and the second external electrode 620 may extend to portions of the third surface 103 and the fourth surface 104 of the body 100, respectively, to be capacitively coupled to the first noise removal portion 510 on the third surface 103 of the body 100, and capacitively coupled to the second noise removal portion 520 on the fourth surface 104 of the body 100, respectively.

[0099] Although Figure 13 and Figure 15 This embodiment is shown to include a fourth external electrode 640, but the scope of this embodiment is not limited thereto. The fourth external electrode 640 may be omitted in this embodiment. Alternatively, the third external electrode 630 may be modified to contact each of the first noise removal unit 510 and the second noise removal unit 520 individually.

[0100] In this embodiment, the noise removal units 510 and 520 described in this embodiment may be modified to combine with the noise removal unit 500 described in the first embodiment of this disclosure, and / or the noise removal units 510 and 520 described in the second embodiment of this disclosure.

[0101] According to embodiments of this disclosure, high-frequency noise can be easily removed.

[0102] Although exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A coil assembly comprising: a main body; a coil portion provided inside the main body; a noise removal portion provided to contact a surface of the main body; an insulating layer provided on the noise removal portion; first and second outer electrodes each connected to the coil portion and provided on the insulating layer, the first and second outer electrodes being superposed with the noise removal portion and the insulating layer being provided between the first and second outer electrodes and the noise removal portion, and the first and second outer electrodes being spaced apart from the noise removal portion by the insulating layer; and a third outer electrode provided to be spaced apart from the first and second outer electrodes and to contact the noise removal portion.

2. The coil assembly according to claim 1, further comprising a fourth outer electrode provided to be spaced apart from the first, second, and third outer electrodes. the fourth outer electrode contacts the noise removal portion.

3. The coil assembly of claim 2, wherein, the third outer electrode penetrates the insulating layer to contact the noise removal portion.

4. The coil assembly of claim 1, wherein, the main body has a first surface and a second surface each connecting the first surface to the second surface of the main body and facing each other in a thickness direction of the main body, two end surfaces each connecting the two end surfaces of the main body to each other and facing each other in a length direction of the main body, and two side surfaces each connecting the two end surfaces of the main body to each other and facing each other in a width direction of the main body, 5. The coil assembly of claim 1, wherein, wherein the noise removal portion is provided to contact the first surface of the main body, the first and second outer electrodes are provided to be spaced apart from each other on the first surface of the main body, and each of the first and second outer electrodes is superposed with the noise removal portion in the thickness direction, and the third outer electrode is provided to be spaced apart from the first and second outer electrodes on the first surface of the main body. the first and second outer electrodes extend from the first surface of the main body to the two end surfaces of the main body, and 6. The coil assembly of claim 5, wherein, the noise removal portion is provided to be spaced apart from edges where the first surface of the main body meets the two end surfaces of the main body and the two side surfaces of the main body, respectively. the insulating layer covers side surfaces of the noise removal portion in the width direction and side surfaces of the noise removal portion in the length direction.

7. The coil assembly of claim 6, wherein, the noise removal portion includes a first noise removal portion provided to contact the first surface of the main body and a second noise removal portion provided to contact the second surface of the main body, 8. The coil assembly of claim 6, wherein, the insulating layer includes a first insulating layer provided on the first noise removal portion and a second insulating layer provided on the second noise removal portion, the first and second outer electrodes further extend from the two end surfaces of the main body to the second surface of the main body, and each of the first and second outer electrodes is superposed with the first and second noise removal portions in the thickness direction. ​ 9. The coil assembly of claim 1, wherein, the body has a first surface and a second surface opposite to each other in a thickness direction of the body, two end surfaces each connecting the first surface to the second surface of the body and opposite to each other in a length direction of the body, and two side surfaces each connecting the two end surfaces of the body to each other and opposite to each other in a width direction of the body, wherein the noise removing portion is arranged to contact at least one of the two side surfaces of the body, and the first outer electrode and the second outer electrode are respectively arranged on the two end surfaces of the body, and each extends onto the at least one of the two side surfaces of the body to be superposed with the noise removing portion in the width direction.

10. The coil assembly of claim 9, wherein, the insulating layer is arranged between the noise removing portion and each of the first outer electrode and the second outer electrode in the width direction.

11. The coil assembly of claim 1, wherein, the noise removing portion includes a conductor.

12. The coil assembly of claim 1, wherein, the noise removing portion includes a seed layer arranged on the surface of the body, and a plated layer arranged on the seed layer.

13. A coil assembly comprising: a body; a coil portion arranged inside the body; a noise removing portion arranged on a surface of the body in a first direction and contacting the surface; an insulating layer arranged on the noise removing portion in the first direction; a first outer electrode and a second outer electrode respectively connected to opposite end portions of the coil portion; and a third outer electrode arranged to be spaced apart from the first outer electrode and the second outer electrode and to contact the noise removing portion, wherein the insulating layer is arranged between the noise removing portion and each of the first outer electrode and the second outer electrode in the first direction, and the first outer electrode and the second outer electrode are spaced apart from the noise removing portion by the insulating layer, and wherein the noise removing portion is superposed with each of the first outer electrode and the second outer electrode in the first direction. the body includes a magnetic material and a resin.

14. The coil assembly of claim 13, wherein, the insulating layer includes an opening through which the third outer electrode is connected to the noise removing portion.

15. The coil assembly of claim 13, wherein, 16. The coil assembly according to claim 13, further comprising a fourth outer electrode arranged to be spaced apart from the first outer electrode, the second outer electrode, and the third outer electrode and to contact the noise removing portion. the insulating layer includes a first opening and a second opening through which the third outer electrode and the fourth outer electrode are respectively connected to the noise removing portion.

17. The coil assembly of claim 16, wherein, the first outer electrode and the second outer electrode are respectively arranged on two end surfaces of the body to be connected to opposite end portions of the coil portion, and each extends onto the surface of the body.

18. The coil assembly of claim 13, wherein, the noise removing portion includes a first noise removing portion arranged to contact the surface of the body and a second noise removing portion arranged to contact an opposite surface of the surface of the body, and 19. The coil assembly of claim 18, wherein, the insulating layer includes a first insulating layer arranged on the first noise removing portion and a second insulating layer arranged on the second noise removing portion, and the first insulating layer is arranged between the first noise removing portion and the second noise removing portion in the first direction, and Each of the first and second outer electrodes is stacked with the first and second noise removing portions in the first direction.

20. The coil assembly of claim 19, wherein, The third outer electrode is formed in a closed loop shape surrounding the main body, and is connected to the first noise removing portion through an opening provided in the first insulating layer and to the second noise removing portion through an opening provided in the second insulating layer.

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