Display device

Abstract

The display device includes: a substrate including a display area and a peripheral area surrounding the display area; a plurality of pads arranged in a first direction of the peripheral area of the substrate and arranged in a second direction perpendicular to the first direction; and a circuit film disposed on the pads. Each pad includes: a signal wiring disposed on the substrate; a first dummy pattern disposed on the substrate and spaced apart from the signal wiring in the first direction; and a first insulating pattern disposed on the substrate between the signal wiring and the first dummy pattern.

Description

Technical Field

[0001] The present invention relates to a display device, and more particularly to a display device with improved display quality. Background Art

[0002] In recent years, display devices have been produced in various forms. For example, the display device can be produced in the form of a liquid crystal display, a plasma display device, an organic light emitting display, etc.

[0003] Before being supplied to a user, in order to improve the quality of the display device, the display device can undergo a rework process such as cleaning after removing a circuit film attached to the display device. During the rework process, when removing the circuit film, a part of the wiring may be peeled off together, thereby generating residues. Due to the residues, a short circuit may occur.

[0004] In addition, during the cleaning process of the display device, moisture and the like may penetrate into the interior of the display device through the wiring. In this case, due to the penetration of moisture, a short circuit may occur in the display device. Summary of the Invention

[0005] In view of the above circumstances, the technical problem of the present invention is to provide a display device with improved display quality.

[0006] However, the problems to be solved by the present invention are not limited to the above-mentioned problems, and various extensions can be made without exceeding the spirit and scope of the present invention.

[0007] A display device according to an embodiment for achieving the object of the present invention includes: a substrate including a display area and a peripheral area surrounding the display area; a plurality of pads arranged in a first direction in the peripheral area of the substrate, and the plurality of pads are arranged in a second direction perpendicular to the first direction; and a circuit film disposed on the pads. Each of the pads may include: a signal wiring disposed on the substrate; a first dummy pattern spaced apart from the signal wiring in the first direction on the substrate; and a first insulating pattern disposed between the signal wiring and the first dummy pattern on the substrate.

[0008] In one embodiment, it may be that the display device further includes: a transfer wiring configured between the display area and the signal wiring, and the transfer wiring transfers the signal received from the signal wiring to the display area.

[0009] In one embodiment, it may be that the signal wiring, the first dummy pattern, and the first insulating pattern are disposed on the same layer, and the first dummy pattern and the signal wiring include the same material.

[0010] In one embodiment, it may be that the first insulating pattern is disposed on a virtual straight line extending along the second direction in each of the pads.

[0011] In one embodiment, it may be that the display device further includes: a second insulating pattern disposed on the signal wiring; a first organic pattern disposed on the second insulating pattern; a third insulating pattern disposed on the first dummy pattern; a second organic pattern disposed on the third insulating pattern; and a conductive pattern covering the first organic pattern, the first insulating pattern, and the second organic pattern.

[0012] In one embodiment, it may be that the conductive pattern includes zinc oxide.

[0013] In one embodiment, it may be that the second insulating pattern and the first organic pattern overlap the signal wiring, and the third insulating pattern and the second organic pattern overlap the first dummy pattern.

[0014] In one embodiment, it may be that the display device further includes: an anisotropic conductive film including conductive balls disposed between the conductive pattern and the circuit film, and the conductive pattern and the circuit film are connected through the anisotropic conductive film.

[0015] In one embodiment, it may be that the conductive balls overlap the signal wiring.

[0016] In one embodiment, it may be that each of the pads has an "I" shape extending in the first direction and having a recessed middle portion in the first direction.

[0017] In one embodiment, it may be that the display device further includes: an integrated circuit disposed on the circuit film.

[0018] In one embodiment, it may be that each of the pads further includes: a second dummy pattern disposed on the substrate and spaced apart from the first dummy pattern in the first direction; and a second insulating pattern disposed on the substrate between the first dummy pattern and the second dummy pattern.

[0019] In one embodiment, it may be that the first dummy pattern, the second dummy pattern, the first insulating pattern, the second insulating pattern, and the signal wiring are disposed on the same layer, and the first dummy pattern, the second dummy pattern, and the signal wiring include the same material.

[0020] In one embodiment, it may be that the second insulating pattern is disposed on a virtual straight line extending along the second direction in each of the pads.

[0021] In one embodiment, it may be that the display device further includes: a third insulating pattern disposed on the signal wiring; a first organic pattern disposed on the third insulating pattern; a fourth insulating pattern disposed on the first dummy pattern; a second organic pattern disposed on the fourth insulating pattern; a fifth insulating pattern disposed on the second dummy pattern; a third organic pattern disposed on the fifth insulating pattern; and a conductive pattern covering the first organic pattern, the first insulating pattern, the second organic pattern, the second insulating pattern, and the third organic pattern.

[0022] In one embodiment, it may be that the third insulating pattern and the first organic pattern overlap with the signal wiring, the fourth insulating pattern and the second organic pattern overlap with the first dummy pattern, and the fifth insulating pattern and the third organic pattern overlap with the second dummy pattern.

[0023] In one embodiment, it may be that the conductive pattern includes zinc oxide.

[0024] In one embodiment, it may be that the display device further includes: an anisotropic conductive film including conductive spheres disposed between the conductive pattern and the circuit film, and the conductive pattern and the circuit film are connected through the anisotropic conductive film.

[0025] In one embodiment, it may be that the conductive spheres and the signal wiring overlap.

[0026] (Advantageous Effects of the Invention)

[0027] The display devices according to the embodiments of the present invention may include a plurality of pads, each pad including a signal wiring, a first dummy pattern disposed at a distance from the signal wiring, and a first insulating pattern disposed between the signal wiring and the first dummy pattern. In addition, the display device may include a circuit film connected to the plurality of pads through an anisotropic conductive film.

[0028] When removing the circuit film from the plurality of pads, through the first insulating pattern, the circuit film can be removed without the signal wiring and the first dummy pattern being peeled off. Thereby, it is possible to prevent the plurality of pads from being short-circuited due to residues generated during the removal of the circuit film.

[0029] In addition, the first dummy pattern can initially block the penetration of moisture, and the first insulating pattern can secondarily block the penetration of the moisture. Thereby, it is possible to prevent moisture from penetrating into the signal wiring.

[0030] However, the effects of the present invention are not limited to the above-described effects, and various expansions can be made without departing from the spirit and scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a plan view showing a display device according to an embodiment of the present invention.

[0032] Figure 2 is showing the arrangement in Figure 1 a plan view of an embodiment of a plurality of pads in the S region.

[0033] Figure 3 is showing along Figure 2 a cross-sectional view of an embodiment taken along the line I-I'.

[0034] Figure 4 is showing the arrangement in Figure 1 a plan view of an embodiment of a plurality of pads in the S region.

[0035] Figure 5 is along Figure 4 a cross-sectional view of an embodiment taken along the line II-II'.

[0036] (Reference Signs)

[0037] 100: Substrate; 105, 205: Signal wirings;

[0038] 110, 210: First insulating patterns; 115, 215: First dummy patterns;

[0039] 120, 220: Second insulating patterns; 125, 230: Third insulating patterns;

[0040] 130, 245: First organic patterns; 135, 250: Second organic patterns;

[0041] 140, 260: Conductive patterns; 145, 265: Conductive balls;

[0042] 150, 270: Anisotropic conductive film; CF: Circuit film. Detailed implementation manners

[0043] Hereinafter, with reference to the drawings, various embodiments of the present invention will be described in more detail. The same reference numerals are used for the same components in the drawings, and repeated descriptions of the same components are omitted.

[0044] Figure 1 It is a plan view showing a display device according to an embodiment of the present invention.

[0045] Refer to Figure 1 , the display device may include a substrate 100, a plurality of transmission wirings CL, and a circuit film CF.

[0046] The substrate 100 may include a display area DA and a peripheral area PA surrounding the display area DA. In one embodiment, the substrate 100 may include glass, metal, or an organic substance. For example, the substrate 100 may include a flexible material. The substrate 100 may include ultra-thin glass, metal, or plastic. For example, in the case of using the plastic, the substrate 100 may include polyimide. However, this is an illustration, and the substrate 100 may include various substances.

[0047] A plurality of pixels may be arranged in the display area DA. For example, the plurality of pixels may be arranged in a matrix form throughout the display area DA. The display device may display an image through the plurality of pixels. In one embodiment, the display device may be an organic light-emitting display device. In one embodiment, the display device may be a liquid crystal display device. However, this is an illustration, and the display device may mean various display devices capable of displaying an image.

[0048] A data driving unit, a scan driving unit, a light-emitting driving unit, a driving control unit, etc. for transmitting various signals to the display area DA may be arranged in the peripheral area PA.

[0049] Figure 2 It is a plan view showing an embodiment of a plurality of pads arranged in the Figure 1 S area.

[0050] Refer to Figure 1 and Figure 2, the display device may include a plurality of pads PAD. The plurality of pads PAD may be disposed on the substrate 100. The plurality of pads PAD may be disposed in a first direction D1 of the peripheral area PA of the substrate 100. However, this is an illustration, and the plurality of pads PAD may also be disposed in a second direction D2 perpendicular to the first direction D1 of the peripheral area PA, a third direction D3 opposite to the first direction D1, and a direction opposite to the second direction D2. The plurality of pads PAD may be arranged at intervals in the second direction D2. The plurality of pads PAD may transmit an external signal input from the circuit film CF to the display area DA. Here, the fourth direction D4 means a direction perpendicular to the plane defined by the first direction D1, the second direction D2, and the third direction D3.

[0051] The plurality of transmission wirings CL may be connected to the plurality of pads PAD. The plurality of transmission wirings CL may be disposed between the plurality of pads PAD and the display area DA. The plurality of transmission wirings CL may transmit the external signal received from the plurality of pads PAD to the display area DA.

[0052] The plurality of pads PAD may extend in the first direction D1. In one embodiment, the plurality of pads PAD may have an "I" shape with a recessed middle portion in the first direction D1. In one embodiment, each of the plurality of pads PAD may include a first pad contact portion PC1 at an end in the third direction D3 of the plurality of pads PAD. Through the first pad contact portion PC1, the external signal input to the circuit film CF may be transmitted to the plurality of pads PAD. The structure of the first pad contact portion PC1 will be described with reference to Figure 3 described later.

[0053] The plurality of pads PAD have the "I" shape, so that the components disposed on the plurality of pads PAD and the contact area of the plurality of pads PAD can be reduced. Thus, when removing the components disposed on the plurality of pads PAD from the plurality of pads PAD, the removal can be easily performed. Therefore, when removing the components disposed on the plurality of pads PAD from the plurality of pads PAD, short circuits caused by peeling of the plurality of pads PAD can be prevented.

[0054] For example, if a plurality of pads extending in the first direction D1 have a constant thickness in the second direction D2, the contact area with the circuit film CF may be widened compared to the plurality of pads PAD having an "I" shape. In this case, during the removal process of the circuit film CF, a part of the plurality of pads may be peeled off together to generate residues. Due to the residues, a short circuit may occur in the display device. In contrast, the plurality of pads PAD according to an embodiment of the present invention have an "I" shape, thereby preventing the generation of the residues, and thus preventing the occurrence of the short circuit in the display device.

[0055] The circuit film CF may be disposed in the first direction D1 of the peripheral area PA of the display device. The circuit film CF may also be disposed in the second direction D2, the third direction D3, etc. of the peripheral area PA. The circuit film CF may receive an input of an external signal and transmit it to the display area DA.

[0056] Figure 3 It represents a cross-sectional view of an embodiment taken along the Figure 2 I-I' line.

[0057] Referring to Figure 2 and Figure 3 , the display device may include the plurality of pads PAD, a second insulating pattern 120, a third insulating pattern 125, a first organic pattern 130, a second organic pattern 135, a conductive pattern 140, an anisotropic conductive film 150, and an integrated circuit IC. The plurality of pads PAD may each include a signal wiring 105, a first insulating pattern 110, and a first dummy pattern 115.

[0058] The signal wiring 105 may be disposed on the substrate 100. The signal wiring 105 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc. For example, the signal wiring 105 may include molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), etc. The signal wiring 105 may be connected to Figure 1 the transfer wiring CL. Therefore, the signal wiring 105 may transfer the external signal transferred from the circuit film CF to Figure 1 the transfer wiring CL.

[0059] The first dummy pattern 115 may be disposed at a distance from the signal wiring 105 in the first direction D1. The first dummy pattern 115 may include the same material as the signal wiring 105. The first dummy pattern 115 may be formed by patterning a part of the conductive pattern after forming the conductive pattern including the signal wiring 105. That is, through the patterning, the first dummy pattern 115 and the signal wiring 105 may be disposed at a distance from each other. By disposing the first dummy pattern 115 and the signal wiring 105 at a distance from each other, moisture penetrating to the end portion of the first dummy pattern 115 in the first direction D1 cannot penetrate to the signal wiring 105.

[0060] In the space where the first dummy pattern 115 and the signal wiring 105 are spaced apart, the first insulating pattern 110 may be disposed. The first insulating pattern 110 may be disposed in each of the plurality of pads PAD on a virtual straight line FL1 extending along the second direction D2. The first insulating patterns 110 may be disposed at a distance from each other on the virtual straight line FL1. The first insulating pattern 110 may overlap with the first pad contact portion PC1. In one embodiment, the first insulating pattern 110 may include silicon nitride (SiN x ). However, this is an illustration, and the first insulating pattern 110 may further include various materials having insulating properties. For example, the first insulating pattern 110 may further include silicon oxide (SiO2), silicon oxynitride (SiO x N y ), etc. By disposing the first insulating pattern 110 between the first dummy pattern 115 and the signal wiring 105, it is possible to prevent the moisture penetrating into the first dummy pattern 115 from penetrating to the signal wiring 105.

[0061] In addition, by disposing the first insulating pattern 110 between the first dummy pattern 115 and the signal wiring 105, the circuit film CF can be easily removed from the display device. In the prior art, the signal wiring 105 extends to the end portion of the substrate 100 in the first direction D1. Accordingly, when the circuit film CF is removed from the display device, there is a problem that the signal wiring 105 is peeled off. The display device according to the present invention may dispose the first insulating pattern 110 in the space generated by the patterning after patterning the signal wiring 105. Accordingly, when the circuit film CF is removed from the display device, only the first insulating pattern 110 may be removed together. That is, it is possible to prevent the signal wiring 105 and the first dummy pattern 115 from being peeled off.

[0062] In one embodiment, the signal wiring 105, the first insulating pattern 110, and the first dummy pattern 115 may be disposed on the same layer.

[0063] The second insulating pattern 120 may be disposed on the signal wiring 105. The second insulating pattern 120 may overlap with the signal wiring 105. The second insulating pattern 120 may include the same material as the first insulating pattern 110. Each of the insulating patterns to be described below may also include the same material as the first insulating pattern 110. Through the second insulating pattern 120, the exposed area of the signal wiring 105 can be reduced. Accordingly, when removing the circuit film CF from the display device, the signal wiring 105 can be prevented from being peeled off.

[0064] The third insulating pattern 125 may be disposed on the first dummy pattern 115. The third insulating pattern 125 may overlap with the first dummy pattern 115. Through the third insulating pattern 125, the exposed area of the first dummy pattern 115 can be reduced. Accordingly, when removing the circuit film CF, the first dummy pattern 115 can be prevented from being peeled off.

[0065] By disposing the second insulating pattern 120 and the third insulating pattern 125 at intervals, the first pad contact portion PC1 exposing a part of the signal wiring 105, a part of the first dummy pattern 115, and the first insulating pattern 110 can be formed. Through the first pad contact portion PC1, the external signal transmitted from the circuit film CF can be transmitted to the signal wiring 105.

[0066] The first organic pattern 130 may be disposed on the second insulating pattern 120. The first organic pattern 130 may overlap with the second insulating pattern 120. The second organic pattern 135 may be disposed on the third insulating pattern 125. The second organic pattern 135 may overlap with the third insulating pattern 125. The first organic pattern 130 and the second organic pattern 135 may include organic substances. For example, the organic substances may include acrylic resin, epoxy resin, phenol resin, polyimide resin, and the like. By being disposed such that the first organic pattern 130 overlaps with the second insulating pattern 120 and the second organic pattern 135 overlaps with the third insulating pattern 125, moisture penetrating to the upper surface of the display device can be effectively blocked.

[0067] The conductive pattern 140 may cover the first insulating pattern 110, the first organic pattern 130, and the second organic pattern 135. In one embodiment, the conductive pattern 140 may include a transparent metal material. For example, the conductive pattern 140 may include zinc oxide. In addition, the conductive pattern 140 may be selected from indium zinc oxide (IZO), zinc oxide (ZnO), and any combination thereof. However, this is illustrative, and the material included in the conductive pattern 140 is not limited thereto. For example, the conductive pattern 140 may include tin oxide. The conductive pattern 140 may prevent the signal wiring 105 and the anisotropic conductive film 150 from directly contacting each other. The conductive pattern 140 may transfer the external signal received from the circuit film CF to the signal wiring 105.

[0068] The anisotropic conductive film 150 may be disposed on the conductive pattern 140. The anisotropic conductive film 150 may connect the conductive pattern 140 and the circuit film CF. The anisotropic conductive film 150 may include conductive balls 145. The conductive balls 145 may overlap with the signal wiring 105. The external signal transferred from the circuit film CF may be transferred to the conductive pattern 140 through the conductive balls 145 and then transferred to the signal wiring 105. The conductive balls 145 only overlap with the signal wiring 105, so that the external signal may not be transferred to the first dummy pattern 115. Accordingly, a short circuit caused by the external signal flowing into the first dummy pattern 115 may be prevented.

[0069] The circuit film CF may be disposed on the anisotropic conductive film 150. The circuit film CF may receive the external signal. In one embodiment, the integrated circuit IC may be disposed on the circuit film CF. For example, the integrated circuit IC may be disposed on the bottom surface of the circuit film CF without overlapping with the plurality of pads PAD. However, this is illustrative, and the integrated circuit IC may also be disposed on the upper surface of the circuit film CF without overlapping with the plurality of pads PAD. In addition, the integrated circuit IC may be disposed on the upper surface of the circuit film CF while overlapping with the plurality of pads PAD.

[0070] Figure 4 is a plan view of another embodiment showing a plurality of pads in the S region disposed on Figure 1 the

[0071] Referring to Figure 1 and Figure 4, the plurality of pads PAD can be disposed on the substrate 100. The plurality of pads PAD can be disposed in the first direction D1 of the peripheral area PA of the substrate 100. The plurality of pads PAD can be arranged in the second direction D2. The plurality of pads PAD can transfer the external signal to the display area DA. In one embodiment, the plurality of transfer wirings CL can be disposed between the plurality of pads PAD and the display area DA. The plurality of transfer wirings CL can transfer the external signal received from the plurality of pads PAD to the display area DA. In one embodiment, each of the plurality of pads PAD can include a first pad contact portion PC1 at an end in the third direction D3 of the plurality of pads PAD. Each of the plurality of pads PAD can include a second pad contact portion PC2 at an end in the first direction D1. Through the first pad contact portion PC1, the external signal input to the circuit film CF can be transferred to the plurality of pads PAD. The description of the first pad contact portion PC1 and the second pad contact portion PC2 will be referred to Figure 5 hereinafter.

[0072] Figure 5 is a cross-sectional view of an embodiment taken along the Figure 4 II-II' line.

[0073] Referring to Figure 4 and Figure 5 , the display device may include a plurality of pads PAD, a third insulating pattern 230, a fourth insulating pattern 235, a fifth insulating pattern 240, a first organic pattern 245, a second organic pattern 250, a third organic pattern 255, a conductive pattern 260, and an anisotropic conductive film 270. Each of the plurality of pads PAD may include a signal wiring 205, a first insulating pattern 210, a first dummy pattern 215, a second insulating pattern 220, and a second dummy pattern 225.

[0074] The signal wiring 205 can be disposed on the substrate 100. The signal wiring 205 can include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. The signal wiring 205 can be connected to Figure 1 the transfer wiring CL. Accordingly, the signal wiring 205 can transfer the external signal transferred from the circuit film CF to Figure 1 the transfer wiring CL.

[0075] The first dummy pattern 215 may be disposed spaced apart from the signal wiring 205 in the first direction D1. The first dummy pattern 215 may include the same material as the signal wiring 205. By disposing the first dummy pattern 215 and the signal wiring 205 spaced apart from each other, it is possible to prevent moisture that penetrates the end portion of the first dummy pattern 215 in the first direction D1 from penetrating into the signal wiring 205.

[0076] The first insulating pattern 210 may be disposed in the space where the first dummy pattern 215 and the signal wiring 205 are spaced apart. The first insulating pattern 210 may be disposed on a virtual straight line FL1 extending from each of the plurality of pads PAD in the second direction D2. The first insulating pattern 210 may be disposed spaced apart on the virtual straight line FL1. The first insulating pattern 210 may overlap with the first pad contact portion PC1. By disposing the first insulating pattern 210 between the first dummy pattern 215 and the signal wiring 205, it is possible to prevent moisture that penetrates the first dummy pattern 215 from penetrating into the signal wiring 205.

[0077] In addition, by disposing the first insulating pattern 210 between the first dummy pattern 215 and the signal wiring 205, it is possible to easily remove the circuit film CF from the display device. In the prior art, the signal wiring 205 extends to the end portion of the substrate 100 in the first direction D1. Accordingly, when removing the circuit film CF from the display device, there is a problem that the signal wiring 205 is peeled off. After patterning the signal wiring 205, the display device disposes the first insulating pattern 210 in the space generated by the patterning, so that when removing the circuit film CF from the display device, only the first insulating pattern 210 may be removed together. Accordingly, it is possible to prevent the signal wiring 205 and the first dummy pattern 215 from being peeled off.

[0078] The second dummy pattern 225 may be disposed spaced apart from the first dummy pattern 215 in the first direction D1. The second dummy pattern 225 may include the same material as the signal wiring 205. The second dummy pattern 225 may be formed by patterning a part of the conductive pattern after forming the conductive pattern including the signal wiring 205. That is, by the patterning, the second dummy pattern 225 and the first dummy pattern 215 may be disposed spaced apart from each other. By disposing the second dummy pattern 225 and the first dummy pattern 215 spaced apart from each other, it is possible to prevent moisture that penetrates the end portion of the second dummy pattern 225 in the first direction D1 from penetrating into the signal wiring 205.

[0079] In the space where the second dummy pattern 225 and the first dummy pattern 215 are spaced apart, the second insulating pattern 220 may be disposed. The second insulating pattern 220 may be disposed in each of the plurality of pads PAD on a virtual straight line FL2 extending along the second direction D2. The second insulating patterns 220 may be spaced apart on the virtual straight line FL2. The second insulating pattern 220 may overlap with the second pad contact portion PC2. By disposing the second insulating pattern 220 between the first dummy pattern 215 and the second dummy pattern 225, it is possible to prevent moisture that has penetrated into the second dummy pattern 225 from penetrating into the signal wiring 205. Accordingly, it is possible to prevent defects caused by short circuits generated in the display device.

[0080] In addition, by disposing the second insulating pattern 220 between the first dummy pattern 215 and the second dummy pattern 225, it is possible to easily remove the circuit film CF from the display device. For the display device, when removing the circuit film CF from the display device, only the second insulating pattern 220 may be removed together. Accordingly, it is possible to prevent the first dummy pattern 215 and the second dummy pattern 225 from being peeled off.

[0081] In one embodiment, the signal wiring 205, the first insulating pattern 210, the first dummy pattern 215, the second insulating pattern 220, and the second dummy pattern 225 may be disposed on the same layer.

[0082] The third insulating pattern 230 may be disposed on the signal wiring 205. The third insulating pattern 230 may overlap with the signal wiring 205. By means of the third insulating pattern 230, when removing the circuit film CF from the display device, it is possible to prevent the signal wiring 205 from being peeled off.

[0083] The fourth insulating pattern 235 may be disposed on the first dummy pattern 215. The fourth insulating pattern 235 may overlap with the first dummy pattern 215. By means of the fourth insulating pattern 235, when removing the circuit film CF from the display device, it is possible to prevent the first dummy pattern 215 from being peeled off.

[0084] By disposing the third insulating pattern 230 and the fourth insulating pattern 235 at intervals, the first pad contact portion PC1 exposing a part of the signal wiring 205, a part of the first dummy pattern 215, and the first insulating pattern 210 can be formed. Through the first pad contact portion PC1, the external signal transmitted from the circuit film CF can be transmitted to the signal wiring 205.

[0085] The first organic pattern 245 may be disposed on the third insulating pattern 230. The first organic pattern 245 may overlap with the third insulating pattern 230. The second organic pattern 250 may be disposed on the fourth insulating pattern 235. The second organic pattern 250 may overlap with the fourth insulating pattern 235. The first organic pattern 245 and the second organic pattern 250 may include organic substances. By disposing the first organic pattern 245 to overlap with the third insulating pattern 230 and the second organic pattern 250 to overlap with the fourth insulating pattern 235, the permeating moisture can be effectively blocked on the display device.

[0086] The fifth insulating pattern 240 may be disposed on the second dummy pattern 225. The fifth insulating pattern 240 may overlap with the second dummy pattern 225. Through the fifth insulating pattern 240, when the circuit film CF is removed from the display device, the situation where the second dummy pattern 225 is peeled off can be prevented.

[0087] By disposing the fourth insulating pattern 235 and the fifth insulating pattern 240 at intervals, the second pad contact portion PC2 exposing a part of the first dummy pattern 215, a part of the second dummy pattern 225, and the second insulating pattern 220 can be formed. The second pad contact portion PC2 has an opening exposing the second insulating pattern 220, so that when the circuit film CF is removed from the display device, the first dummy pattern 215 and the second dummy pattern 225 may not be peeled off.

[0088] The third organic pattern 255 may be disposed on the fifth insulating pattern 240. The third organic pattern 255 may overlap with the fifth insulating pattern 240. The third organic pattern 255 may include organic substances. By disposing the third organic pattern 255 to overlap with the fifth insulating pattern 240, the permeating moisture can be effectively blocked on the display device.

[0089] The conductive pattern 260 may cover the first organic pattern 245, the first insulating pattern 210, the second organic pattern 250, the second insulating pattern 220, and the third organic pattern 255. In one embodiment, the conductive pattern 260 may include zinc oxide. For example, the conductive pattern 260 may be selected from indium zinc oxide (IZO), zinc oxide (ZnO), and any combination thereof. However, this is illustrative, and the material included in the conductive pattern 260 is not limited thereto. The conductive pattern 260 may prevent the signal wiring 205 from coming into direct contact with the anisotropic conductive film 270. The conductive pattern 260 may transfer the external signal received from the circuit film CF to the signal wiring 205.

[0090] The anisotropic conductive film 270 may be disposed on the conductive pattern 260. The anisotropic conductive film 270 may connect the conductive pattern 260 and the circuit film CF. The anisotropic conductive film 270 may include conductive spheres 265. The conductive spheres 265 may overlap with the signal wiring 205. The external signal transferred from the circuit film CF is transferred to the conductive pattern 260 through the conductive spheres 265, and then transferred to the signal wiring 205. The conductive spheres 265 only overlap with the signal wiring 205, so that the external signal may not be transferred to the first dummy pattern 215 and the second dummy pattern 225. Accordingly, it is possible to prevent defects caused by short circuits due to the penetration of moisture.

[0091] The circuit film CF may be disposed on the anisotropic conductive film 270. The circuit film CF may receive an input of the external signal. In one embodiment, the integrated circuit IC may be disposed on the circuit film CF. For example, the integrated circuit IC may be disposed on the upper surface or the bottom surface of the circuit film CF.

[0092] (Industrial Applicability)

[0093] The present invention may be applied to a display device. For example, the present invention may be applied to a high-resolution smartphone, a mobile phone, a smart tablet, a smart watch, a tablet PC, a vehicle navigation system, a television, a computer display, a laptop computer, and the like.

[0094] As described above, the exemplary embodiments of the present invention have been described, but those skilled in the art should understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the present invention described in the claims.

Claims

1. A display device, characterized in that, Comprising: A substrate, including a display area and a peripheral area surrounding the display area; A plurality of pads, configured in a first direction of the peripheral area of the substrate, and arranging the plurality of pads in a second direction perpendicular to the first direction; And A circuit film, configured on the pads, Each of the pads includes: A signal wiring, configured on the substrate; A first dummy pattern, on the substrate, arranging the first dummy pattern at an interval from the signal wiring in the first direction; and A first insulating pattern, configured on the substrate between the signal wiring and the first dummy pattern, The pads include a first pad and a second pad, The second pad is spaced apart from the first pad in the second direction, The first insulating pattern of the first pad is spaced apart from the first insulating pattern of the second pad in the second direction.

2. The display device according to claim 1, wherein Further comprising: A transfer wiring, configured between the display area and the signal wiring, The transfer wiring transfers the signal received from the signal wiring to the display area.

3. The display device according to claim 1, wherein The signal wiring, the first dummy pattern and the first insulating pattern are configured on the same layer, The first dummy pattern and the signal wiring include the same material.

4. The display device according to claim 1, wherein The first insulating pattern is configured on a virtual straight line extending along the second direction in each of the pads.

5. The display device according to claim 1, wherein Further comprising: A second insulating pattern, configured on the signal wiring; A first organic pattern, configured on the second insulating pattern; A third insulating pattern, configured on the first dummy pattern; A second organic pattern, configured on the third insulating pattern; And A conductive pattern, covering the first organic pattern, the first insulating pattern and the second organic pattern.

6. The display device according to claim 5, wherein The conductive pattern includes zinc oxide.

7. The display device according to claim 5, wherein The second insulating pattern and the first organic pattern overlap with the signal wiring, The third insulating pattern and the second organic pattern overlap with the first dummy pattern.

8. The display device according to claim 5, wherein Further comprising: An anisotropic conductive film, including conductive balls configured between the conductive pattern and the circuit film, The conductive pattern and the circuit film are connected through the anisotropic conductive film.

9. The display device according to claim 8, wherein The conductive balls and the signal wiring overlap.

10. The display device according to claim 1, wherein Each of the pads has an "I" shape extending in the first direction and with a middle part in the first direction being recessed.

11. The display device according to claim 1, characterized in that, Further comprising: An integrated circuit, configured on the circuit film.

12. The display device according to claim 1, wherein Each of the pads further includes: A second dummy pattern, on the substrate, arranging the second dummy pattern at an interval from the first dummy pattern in the first direction; and A second insulating pattern is disposed between the first dummy pattern and the second dummy pattern on the substrate.

13. The display device according to claim 12, wherein the first dummy pattern, the second dummy pattern, the first insulating pattern, the second insulating pattern, and the signal wiring are disposed in the same layer, the first dummy pattern, the second dummy pattern, and the signal wiring include the same material.

14. The display device according to claim 12, wherein the second insulating pattern is disposed on each of the pads on a virtual straight line extending along the second direction.

15. The display device according to claim 12, characterized in that, Further comprising: a third insulating pattern disposed on the signal wiring; a first organic pattern disposed on the third insulating pattern; a fourth insulating pattern disposed on the first dummy pattern; a second organic pattern disposed on the fourth insulating pattern; a fifth insulating pattern disposed on the second dummy pattern; a third organic pattern disposed on the fifth insulating pattern; and a conductive pattern covering the first organic pattern, the first insulating pattern, the second organic pattern, the second insulating pattern, and the third organic pattern.

16. The display device according to claim 15, wherein the third insulating pattern and the first organic pattern overlap with the signal wiring, the fourth insulating pattern and the second organic pattern overlap with the first dummy pattern, the fifth insulating pattern and the third organic pattern overlap with the second dummy pattern.

17. The display device according to claim 15, wherein the conductive pattern includes zinc oxide.

18. The display device according to claim 15, characterized in that, Further comprising: an anisotropic conductive film including conductive balls disposed between the conductive pattern and the circuit film, the conductive pattern and the circuit film are connected through the anisotropic conductive film.

19. The display device according to claim 18, wherein the conductive balls and the signal wiring overlap.

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