Display device and method of manufacturing the same

Abstract

The present invention relates to a display device and a method of manufacturing the same. The display device includes a substrate, a driving pad disposed on the substrate, an insulating layer exposing the driving pad and disposed on the substrate, a circuit board including a circuit pad overlapping the driving pad, and a connector disposed between the circuit board and the insulating layer and including a plurality of conductive particles electrically connecting the driving pad and the circuit pad, the driving pad including a first pad disposed on the substrate, and a second pad disposed on the first pad and having an opening exposing the first pad.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0065832, filed on June 1, 2020, the entire contents of which are incorporated herein by reference for all purposes, as if fully set forth herein. Technical Field

[0003] The present invention generally relates to a display device, and more specifically, to a display device having a circuit board and a method of manufacturing the display device. Background Technology

[0004] Various display devices have been developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation units, and gaming units.

[0005] The display device includes a display panel for displaying images. The display panel includes grid lines, data lines, and pixels connected to the grid lines and data lines. The display panel is electrically connected to a circuit board and electronic components that provide electrical signals for displaying images to the grid lines or data lines.

[0006] Circuit boards and electronic components are electrically connected to the display panel using various methods. For example, the circuit board is electrically connected to the display panel using conductive adhesive members arranged between the pads on the circuit board and the pads on the display panel.

[0007] The information disclosed in this background section is only for understanding the background technology of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0008] The applicant discovered that defects such as short circuits may occur between the circuit pads or drive pads of the display device.

[0009] The display device constructed according to the principles and embodiments of the present invention, and the method of manufacturing the display device, align conductive particles with circuit pads or drive pads to improve the efficiency of the process of bonding the pads of the display panel to the pads of the circuit board.

[0010] For example, the conductive adhesive component can be first bonded to the circuit board such that the conductive particles in the conductive adhesive component are aligned on the circuit pads. Therefore, it is easy to check whether the conductive particles are aligned on the circuit pads. Furthermore, when the conductive particles aligned on the circuit pads are bonded to the drive pads of the display panel, the conductive particles are easily bonded to the drive pads.

[0011] Therefore, the conductive particles do not overlap with the space between circuit pads or drive pads, and can reduce or prevent the possibility of short circuits between circuit pads or drive pads.

[0012] Additional features of the inventive concept will be set forth in the following description and will be apparent in part from the description or may be learned by practice of the inventive concept.

[0013] According to one aspect of the present invention, a display device includes: a substrate; driving pads disposed on the substrate; an insulating layer exposing the driving pads and disposed on the substrate; a circuit board including circuit pads overlapping the driving pads; and a connector disposed between the circuit board and the insulating layer and including a plurality of conductive particles electrically connecting the driving pads and the circuit pads, wherein the driving pads include: a first pad disposed on the substrate; and a second pad disposed on the first pad and having an opening exposing the first pad.

[0014] At least one of the multiple conductive particles can contact the first pad through an opening.

[0015] The connector may include a conductive adhesive component, and the multiple conductive particles may include solder.

[0016] The first and second pads can be made of different materials.

[0017] The first pad can be formed of metal, and the second pad can be formed of a transparent conductive layer.

[0018] The connector may include: a conductive adhesive member including an adhesive layer having an engagement region overlapping the drive pad and a non-engaged region adjacent to the engagement region but not overlapping the drive pad.

[0019] Multiple conductive particles can be arranged between the drive pad and the circuit pad.

[0020] Multiple conductive particles may not overlap with non-bonded areas.

[0021] The display device may further include a filler disposed between the adhesive layer and the circuit board.

[0022] The circuit board may further include: a base layer supporting circuit pads, and the circuit pads may include: a first circuit pad disposed on the base layer; and a second circuit pad covering the first circuit pad and disposed on the base layer.

[0023] The second circuit pad may have a thinner thickness than the first circuit pad, and multiple conductive particles may contact the second circuit pad.

[0024] The display device may further include: an auxiliary insulating layer that exposes driving pads and is disposed on an insulating layer, wherein an adhesive layer may be disposed between the auxiliary insulating layer and the circuit board.

[0025] The display device may further include a filler disposed between the adhesive layer and the circuit board.

[0026] According to another aspect of the present invention, a method of manufacturing a display device includes the following steps: arranging a component comprising a plurality of conductive particles on a circuit pad of a circuit board; aligning the plurality of conductive particles to overlap with the circuit pad by using the affinity between the plurality of conductive particles and the circuit pad; arranging a drive pad of a display panel to face the plurality of conductive particles aligned on the circuit pad; and pressing the circuit board to electrically connect the circuit pad to the drive pad of the display panel through the plurality of conductive particles.

[0027] The method may further include the steps of: filling a filler between the component and the circuit board; and curing the filler.

[0028] The affinity between multiple conductive particles and circuit pads can include hydrophilicity.

[0029] Multiple conductive particles may include solder arranged between drive pads and circuit pads.

[0030] The component may include a conductive adhesive component, and the drive pad may include: a first pad; and a second pad disposed on the first pad and formed of a material different from that of the first pad, the second pad having an opening that exposes the first pad, wherein at least one of a plurality of conductive particles can contact the first pad through the opening of the second pad.

[0031] According to another aspect of the present invention, a method of manufacturing a display device includes the following steps: arranging a component comprising a plurality of conductive particles on a drive pad of a display panel; aligning the plurality of conductive particles to overlap with the drive pad; arranging circuit pads of a circuit board facing the plurality of conductive particles aligned on the drive pad of the display panel; and pressing the circuit board to electrically connect the circuit pads to the drive pad of the display panel via the plurality of conductive particles.

[0032] Multiple conductive particles can be aligned using an infrared laser to overlap with the drive pads.

[0033] It should be understood that both the preceding general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0034] The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the inventive concept.

[0035] Figure 1A This is a perspective view of an embodiment of a display device constructed according to the principles of the present invention.

[0036] Figure 1B yes Figure 1A An exploded perspective view of the display device.

[0037] Figure 2 yes Figure 1B A cross-sectional view of the display module of the display device.

[0038] Figure 3 yes Figure 1B A plan view of the display panel and circuit board of the display device.

[0039] Figure 4 yes Figure 1B An exploded perspective view of the circuit board, driver chip, and driver pads of the display device.

[0040] Figure 5 yes Figure 4 A cross-sectional view of an embodiment of the second conductive adhesive component.

[0041] Figure 6 It is along Figure 4 The exploded cross-section of line I-I'.

[0042] Figure 7 yes Figure 6 A plan view of an embodiment of the second pad of the drive pad of the display panel.

[0043] Figure 8A This is a plan view of an embodiment of the second conductive adhesive member before the conductive particles are aligned.

[0044] Figure 8B This is after the conductive particles are aligned. Figure 8A A plan view of the second conductive adhesive component.

[0045] Figure 9 yes Figure 1B A cross-sectional view of an embodiment of the connection between the display panel and the circuit board of a display device.

[0046] Figure 10 This is a cross-sectional view of an embodiment of the second conductive adhesive component and the display panel before the conductive particles are aligned.

[0047] Figure 11This is a cross-sectional view of another embodiment of the second conductive adhesive component and the display panel after the conductive particles have been aligned.

[0048] Figure 12 yes Figure 1B A cross-sectional view of another embodiment of the connection between the display panel and the circuit board of a display device. Detailed Implementation

[0049] In the following description, several specific details are set forth for illustrative purposes in order to provide a thorough understanding of various embodiments or implementations of the invention. As used herein, “embodiment” and “implementation” are interchangeable terms utilizing one or more non-limiting examples of apparatus or methods of the inventive concept disclosed herein. However, it will be apparent that various embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are illustrated in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, the various embodiments may be different, but are not necessarily exclusive. For example, specific shapes, configurations, and characteristics of embodiments may be used or implemented in another embodiment without departing from the inventive concept.

[0050] Unless otherwise specified, the illustrated embodiments are to be understood as providing exemplary features of variations in some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise specified, features, components, modules, layers, films, panels, regions, and / or aspects of the various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, interchanged, and / or rearranged without departing from the inventive concept.

[0051] Crosshairs and / or shading are typically used in accompanying drawings to clarify boundaries between adjacent elements. Therefore, unless specified otherwise, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonality between illustrated elements, and / or any other characteristic, property, or attribute of the elements. Furthermore, in the drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. A particular process sequence may be performed differently than described when embodiments can be implemented differently. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order. Additionally, the same reference numerals denote the same elements.

[0052] When an element, such as a layer, is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly connected to, or directly coupled to that other element or layer, or an intermediary element or layer may be present. However, when an element or layer is referred to as being "directly" on, directly connected to, or directly coupled to another element or layer, an intermediary element or layer is not present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without an intermediary element. Furthermore, the D1, D2, and D3 axes are not limited to the three axes of a Cartesian coordinate system such as the x, y, and z axes, and can be interpreted in a broader sense. For example, the D1, D2, and D3 axes can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0053] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be referred to as the second element without departing from the teachings of this disclosure.

[0054] Spatial relative terms such as “below,” “under,” “below,” “lower,” “above,” “upper,” “above,” “above,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and, therefore, to describe the relationship of one element to another as illustrated in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to include different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will subsequently be oriented “above” other elements or features. Thus, the exemplary term “below” can include both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and thus, the spatial relative descriptors used herein shall be interpreted accordingly.

[0055] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms “a” and “the” are intended to also include the plural forms unless the context clearly indicates otherwise. Furthermore, when used in this specification, the terms “comprising” and / or “including” specify the presence of said features, integers, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximations rather than terms of degree, and are therefore used to account for inherent deviations in measured, calculated, and / or provided numerical values ​​as recognized by those skilled in the art.

[0056] This document describes various embodiments with reference to cross-sectional and / or exploded views as schematic illustrations of idealized embodiments and / or intermediate structures. Therefore, variations in the shape of the illustrations are contemplated due to factors such as manufacturing techniques and / or tolerances. Consequently, the embodiments disclosed herein should not be construed as limited to specific illustrated shapes of regions, but rather should include shape deviations, for example, due to manufacturing processes. In this way, the regions illustrated in the figures can be essentially schematic, and the shapes of these regions may not reflect the true shapes of the areas of the device, and therefore are not intended to be limiting.

[0057] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms such as those defined in common dictionaries shall be interpreted as having the meaning consistent with their meaning in the relevant field context and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0058] The embodiments will be explained in detail below with reference to the accompanying drawings.

[0059] Figure 1A This is a perspective view of an embodiment of a display device DD constructed according to the principles of the present invention. Figure 1B yes Figure 1A An exploded perspective view of the display device DD. Figure 2 yes Figure 1B A cross-sectional view of the display module DM of the display device DD.

[0060] In this embodiment, as a representative example, the display device DD is illustrated as being incorporated into a mobile phone. The camera module, power module, and electronic modules mounted on the motherboard can be housed together with the display device DD in a bracket and / or housing, thus forming a mobile phone. The display device DD can be applied to or take the form of other electronic devices, including large electronic products such as televisions and monitors, as well as small and medium-sized electronic products such as tablet computers, car navigation units, gaming units, and smartwatches.

[0061] Reference Figure 1A The display device DD displays the image IM through the display surface DD-IS. Figure 1A The icon image is shown as a representative example of an image IM. The display surface DD-IS is substantially parallel to the plane defined by the first direction DR1 and the second direction DR2. The third direction DR3 indicates the normal direction of the display surface DD-IS (i.e., the thickness direction of the display device DD). In the following description, expressing "when viewed in a plane," "in a plane," or "in a plan view" means viewing on the third direction DR3. Hereinafter, the front (or upper) surface and the rear (or lower) surface of each layer or each unit of the display device DD are distinguished from each other by the third direction DR3. However, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are opposite to each other, and therefore, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be changed to other directions (e.g., opposite directions).

[0062] Furthermore, the display surface DD-IS includes a display area DD-DA through which the image IM is displayed, and a non-display area DD-NDA defined as adjacent to the display area DD-DA. The image IM is not displayed through the non-display area DD-NDA; however, embodiments are not limited to this or are not subject to this limitation. The non-display area DD-NDA may be adjacent to one side of the display area DD-DA or may be omitted.

[0063] Reference Figure 1B The display device DD may include a window WM, a display module DM, a driver chip DC, a circuit board CF, and a housing BC. The housing BC can house the display module DM and can be coupled to the window WM.

[0064] A window WM can be arranged on a display module DM and can transmit images provided by the display module DM to the outside. The window WM may include a transmissive region TA and a non-transmissive region NTA. The transmissive region TA may overlap with the display regions DD-DA and may have a shape corresponding to the display regions DD-DA. The image IM displayed by the display regions DD-DA of the display device DD can be viewed from the outside through the transmissive region TA of the window WM.

[0065] The non-transmissive region NTA may overlap with the non-display region DD-NDA and may have a shape corresponding to the non-display region DD-NDA. Compared to the transmissive region TA, the non-transmissive region NTA may have a relatively low transmittance. However, the embodiments are not limited to this or are not limited thereto, and the non-transmissive region NTA may be omitted.

[0066] The window WM can include glass, sapphire, or plastic materials. The window WM can have a single-layer structure or multiple layers. The window WM can include a substrate layer and can include at least one printed layer overlapping the non-transparent region NTA and disposed on the rear surface of the substrate layer. The printed layer can have a predetermined color. As an example, the printed layer can be black or can have a color other than black.

[0067] The display module DM is arranged between the window WM and the housing BC. The display module DM includes a display panel DP and an input sensing unit, which may be in the form of an input sensing layer ISU. The display panel DP generates an image and provides the generated image to the window WM.

[0068] The display panel DP according to the illustrated embodiment can be a light-emitting display panel. However, the embodiments are not limited thereto. For example, the display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel may include quantum dots or quantum rods. Furthermore, the display panel DP is rigid. In another embodiment, the display panel DP may be flexible enough to fold relative to a folding axis or bend along one direction.

[0069] In the following description, an organic light-emitting display panel will be used as a representative example of a display panel (DP). However, the embodiments are not limited to organic light-emitting display panels, and various other types of display panels may be used.

[0070] Reference Figure 2 The display panel DP includes a substrate SUB, a circuit element layer DP-CL disposed on the substrate SUB, a display element layer DP-OLED disposed on the circuit element layer DP-CL, and an insulating layer TFL disposed on the display element layer DP-OLED.

[0071] The display panel DP includes the display area DP-DA and the non-display area DP-NDA. The display area DP-DA of the display panel DP is... Figure 1A The display area shown is DD-DA or Figure 1B The transmissive area TA shown corresponds to the non-display area DP-NDA of the display panel DP. Figure 1A The non-display area DD-NDA shown is... Figure 1B The non-transmissive region NTA shown corresponds to this.

[0072] The substrate SUB may include at least one plastic film. As an example, the substrate SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate, which are flexible substrates. The substrate SUB may be a component supporting the display panel DP, and will be described as a display substrate in the following description.

[0073] The circuit element layer DP-CL includes at least one insulating interlayer and circuit elements. The insulating interlayer includes at least one intermediate inorganic layer and / or at least one intermediate organic layer. The circuit elements include signal lines and pixel driving circuitry.

[0074] The DP-OLED display element layer includes a plurality of organic light-emitting diodes. The DP-OLED display element layer further includes an organic layer such as a pixel defining layer. According to another embodiment, when a liquid crystal display panel is used as a display panel, the display element layer may be a liquid crystal layer.

[0075] An insulating layer TFL encapsulates the display element layer DP-OLED. As an example, the insulating layer TFL can be a thin-film encapsulation layer. The insulating layer TFL protects the display element layer DP-OLED from moisture, oxygen, and foreign matter such as dust particles. However, the embodiments are not limited to this or not limited thereto. An encapsulation substrate can be used instead of the insulating layer TFL. In this case, the encapsulation substrate can face the substrate SUB, and the circuit element layer DP-CL and the display element layer DP-OLED can be arranged between the encapsulation substrate and the substrate SUB.

[0076] like Figure 2 As shown, the insulating layer TFL overlaps with the display area DP-DA. However, the embodiments are not limited to this or are not limited thereto. For example, the insulating layer TFL may partially overlap with the non-display area DP-NDA.

[0077] An input sensing layer (ISU) can be positioned between the window (WM) and the display panel (DP). The ISU can sense input applied from the outside. This input can be provided in various forms. For example, external input can include various forms such as a part of the user's body, a stylus, light, heat, or pressure. Additionally, besides input via contact with a part of the user's body, such as a hand, spatial touch (e.g., hovering) near or close to the user can also be a form of external input.

[0078] The input sensing layer (ISU) can be directly disposed on the display panel (DP). The input sensing layer (ISU) can be formed together with the display panel (DP) via a continuous process. However, embodiments are not limited to this or are not restricted to it. The input sensing layer (ISU) can be coupled to the display panel (DP) by an adhesive layer after it has been provided as a separate panel. As another example, the input sensing layer (ISU) can be omitted.

[0079] Refer again Figure 1B The DC drive chip can be connected to the non-display area DP-NDA (see...). Figure 2 These components can be overlapped and arranged on the display panel DP. For example, the driver chip DC can generate drive signals for the operation of the display panel DP based on control signals provided from the circuit board CF. The driver chip DC can then transmit the generated drive signals to the circuit element layer DP-CL of the display panel DP.

[0080] Circuit board CF is electrically connected to display module DM. (Refer to...) Figure 1B The circuit board CF is connected to the display panel DP. However, the circuit board CF can be electrically connected to both the display panel DP and the input sensing layer ISU.

[0081] According to an embodiment, each of the circuit board CF and the driver chip DC can be electrically connected to the display panel DP via a connector that can take the form of a conductive adhesive member. For example, the conductive adhesive member can be arranged between the circuit board CF and the display panel DP, and the circuit board CF is electrically connected to the display panel DP via a plurality of conductive particles included in the conductive adhesive member.

[0082] Specifically, a process is performed to bond conductive adhesive components to one component of the circuit board CF and the display panel DP, and subsequently, a process is performed to bond conductive adhesive components to the remaining components of the circuit board CF and the display panel DP. (Refer to...) Figure 6 This document describes in detail the process of bonding a circuit board (CF) to a display panel (DP) using conductive adhesive components.

[0083] Figure 3 yes Figure 1B A plan view of the display panel DP and circuit board CF of the display device DD.

[0084] Reference Figure 3 The display panel DP may include a driving circuit GDC, multiple signal lines SGL, multiple first driving pads DP-PD, multiple second driving pads DP-CPD, and multiple pixels PX. Pixels PX may be disposed within the display area DP-DA. Each pixel PX may include an organic light-emitting diode (OLED) and a pixel driving circuit connected to the OLED. The driving circuit GDC, signal lines SGL, first driving pads DP-PD, second driving pads DP-CPD, and pixel driving circuit may be included in... Figure 2 The circuit element layer DP-CL is shown.

[0085] The driving circuit GDC sequentially outputs gate signals to gate lines GL. The driving circuit GDC further outputs another control signal to pixel PX. The driving circuit GDC may include multiple thin-film transistors formed using the same process (e.g., low-temperature polycrystalline silicon (LTPS) or low-temperature polycrystalline oxide (LTPO) process) as the transistors in the pixel driving circuit of pixel PX.

[0086] The signal line SGL includes gate lines GL, data lines DL, power lines PL, and control signal lines CSL. Each gate line GL is connected to the corresponding pixel in pixel PX, and each data line DL is connected to the corresponding pixel in pixel PX. The power line PL is connected to pixel PX. The control signal line CSL provides control signals to the drive circuit GDC.

[0087] Signal lines SGL overlap with the display area DP-DA and the non-display area DP-NDA. Each signal line SGL includes a pad portion and a line portion. The line portion overlaps with the display area DP-DA and the non-display area DP-NDA. The pad portion is connected to the end of the line portion. The pad portion is arranged in the non-display area DP-NDA and overlaps with the corresponding signal pad in the first drive pad DP-PD.

[0088] In the following text, the area in the non-display area DP-NDA that has the first driver pad DP-PD can be referred to as the chip area NDA-DC, and the area in the non-display area DP-NDA that has the second driver pad DP-CPD can be referred to as the first pad area NDA-PC1.

[0089] According to an embodiment, Figure 1B The driver chip DC shown can be mounted on the chip area NDA-DC. The first driver pad DP-PD can be electrically connected to the driver chip DC to transmit the electrical signals provided by the driver chip DC to the signal line SGL.

[0090] In detail, the first driving pad DP-PD includes a first row driving pad DP-PD1 disposed in a first row along a first direction DR1 and a second row driving pad DP-PD2 disposed in a second row along the first direction DR1. However, the embodiments are not limited to this or are not limited thereto. For example, the first driving pad DP-PD may be disposed in one or more rows along the first direction DR1.

[0091] A portion of the circuit board CF can be arranged in the first pad area NDA-PC1. A second drive pad DP-CPD is electrically connected to the circuit board CF and receives electrical signals from the circuit board CF. The second drive pad DP-CPD transmits electrical signals from the circuit board CF to itself. The circuit board CF can be rigid or flexible. For example, when the circuit board CF is flexible, a flexible printed circuit board can be provided as the circuit board CF.

[0092] The circuit board CF may include timing control circuitry for controlling the operation of the display panel DP. This timing control circuitry may be integrated into a single chip and mounted on the circuit board CF. Additionally, the circuit board CF may include input sensing circuitry for controlling the input sensing layer ISU.

[0093] The circuit board CF may include circuit pads CF-PD that are electrically connected to the display panel DP. The circuit pads CF-PD may be arranged in a second pad area NDA-PC2 defined in the circuit board CF.

[0094] In the illustrated embodiment, the display panel DP includes Figure 1B The driver chip DC shown is mounted on the first driver pad DP-PD. However, the embodiment is not limited to this or is not limited thereto. The driver chip DC may be mounted on the circuit board CF, and in this case, the first driver pad DP-PD may be omitted.

[0095] Figure 4 yes Figure 1B An exploded perspective view of the circuit board CF, driver chip DC, first driver pad DP-PD, and second driver pad DP-CPD of the display device DD. Figure 5 yes Figure 4 A cross-sectional view of an embodiment of the second conductive adhesive component SF-F.

[0096] Reference Figure 4 The display device DD further includes conductive adhesive members SF-D and SF-F. The conductive adhesive members SF-D and SF-F include a first conductive adhesive member SF-D and a second conductive adhesive member SF-F.

[0097] like Figure 5As shown, the second conductive adhesive component SF-F includes an adhesive layer ALY and multiple conductive particles SB made of solder and distributed within the adhesive layer ALY. The conductive particles SB are irregularly distributed within the adhesive layer ALY. The first conductive adhesive component SF-D has a similar structure to... Figure 5 The configuration and structure of the second conductive adhesive member SF-F shown are substantially the same.

[0098] Refer again Figure 4 A first conductive adhesive member SF-D is disposed between the driver chip DC and the substrate SUB of the display panel DP, and electrically connects the driver chip DC to the display panel DP. A second conductive adhesive member SF-F is disposed between the circuit board CF and the substrate SUB of the display panel DP, and electrically connects the circuit board CF to the display panel DP.

[0099] The driver chip DC includes an upper surface DC-US and a lower surface DC-DS. The lower surface DC-DS of the driver chip DC faces the display panel DP. The driver chip DC includes connection pads DC-PD that are electrically connected to first driver pads DP-PD arranged on the substrate SUB. The connection pads DC-PD include a first row of connection pads DC-PD1 arranged along a first direction DR1 in a first row and a second row of connection pads DC-PD2 arranged along the first direction DR1 in a second row. The first row of connection pads DC-PD1 and the second row of connection pads DC-PD2 are exposed to the outside from the lower surface DC-DS of the driver chip DC. In the illustrated embodiment, the connection pads DC-PD are arranged in two rows. However, in other embodiments, the connection pads DC-PD may be arranged in one or more rows corresponding to the arrangement of the first driver pads DP-PD.

[0100] According to the illustrated embodiment, the first conductive adhesive member SF-D is first bonded to one component of the driver chip DC and the substrate SUB of the display panel DP, and subsequently bonded to the remaining components of the substrate SUB of the driver chip DC and the display panel DP. For example, the upper surface of the first conductive adhesive member SF-D facing the driver chip DC is first bonded to the connection pad DC-PD of the driver chip DC, and subsequently, the first driver pad DP-PD of the display panel DP is bonded to the lower surface of the first conductive adhesive member SF-D.

[0101] Specifically, in the case where the first conductive adhesive member SF-D is bonded to the driver chip DC, the conductive particles SB included in the first conductive adhesive member SF-D are aligned on the connection pad DC-PD. For example... Figure 5 As shown, before the first conductive adhesive component SF-D is bonded to the driver chip DC, conductive particles SB are irregularly distributed in the adhesive layer ALY.

[0102] According to the illustrated embodiment, when the first conductive adhesive member SF-D is disposed on the lower surface DC-DS of the driver chip DC, conductive particles SB made of solder are aligned on the connection pads DC-PD by affinity properties (such as hydrophilic connection pads DC-PD). The manufacture of electrical components with hydrophilic properties (such as connection pads DC-PD) is well known in the art. The interfacial contact properties between the conductive particles SB comprising solder and the connection pads DC-PD improve with increasing hydrophilicity of the connection pads DC-PD. As a result, the conductive particles SB overlap with the connection pads DC-PD but do not overlap spatially between two adjacent connection pads DC-PD. Therefore, due to the alignment of the conductive particles SB by affinity such as hydrophilicity, the possibility of short circuits between two adjacent connection pads DC-PD can be reduced or prevented.

[0103] Furthermore, when the first conductive adhesive component SF-D is first bonded to the driver chip DC, it is easier to check whether the conductive particles SB are aligned on the connection pad DC-PD. For example, in cases where the substrate SUB and the driver chip DC are bonded to the first conductive adhesive component SF-D substantially simultaneously, it is difficult to check whether the conductive particles SB are aligned on the connection pad DC-PD.

[0104] The circuit pads CF-PD included in the circuit board CF are electrically connected to the second drive pad DP-CPD. The circuit pads CF-PD are exposed to the outside from the lower surface of the circuit board CF.

[0105] The upper surface of the second conductive adhesive component SF-F contacts the circuit pad CF-PD of the circuit board CF, and the lower surface of the second conductive adhesive component SF-F contacts the second drive pad DP-CPD.

[0106] According to the illustrated embodiment, the second conductive adhesive member SF-F is first bonded to one component of the circuit board CF and the substrate SUB of the display panel DP, and subsequently bonded to the remaining components of the circuit board CF and the substrate SUB of the display panel DP. For example, the upper surface of the second conductive adhesive member SF-F facing the circuit board CF is first bonded to the circuit pad CF-PD of the circuit board CF, and subsequently, the second drive pad DP-CPD of the display panel DP is bonded to the lower surface of the second conductive adhesive member SF-F.

[0107] Specifically, in the case where the second conductive adhesive member SF-F is bonded to the circuit board CF, the conductive particles SB included in the second conductive adhesive member SF-F are aligned on the circuit pad CF-PD. Similar to the first conductive adhesive member SF-D, before the second conductive adhesive member SF-F is bonded to the circuit board CF, the conductive particles SB are irregularly distributed in the adhesive layer ALY.

[0108] According to the illustrated embodiment, when the second conductive adhesive member SF-F is disposed on the lower surface of the circuit board CF, conductive particles SB made of solder are aligned on the circuit pad CF-PD through the hydrophilic circuit pad CF-PD. The interfacial contact properties between the conductive particles SB including solder and the circuit pad CF-PD improve with increasing hydrophilicity of the circuit pad CF-PD. As a result, the conductive particles SB overlap with the circuit pad CF-PD but do not overlap spatially with two adjacent circuit pads CF-PD. Therefore, the possibility of short circuits between two adjacent circuit pads CF-PD can be reduced or prevented.

[0109] Furthermore, when the second conductive adhesive component SF-F is first bonded to the circuit board CF, it is easier to check whether the conductive particles SB are aligned on the connection pads DC-PD.

[0110] For reference Figure 4 The conductive adhesive members SF-D and SF-F are bonded to the display panel DP after being bonded to the driver chip DC and the circuit board CF, respectively. However, the embodiments are not limited to this or are not restricted thereto. For example, similar to the reference... Figure 4 In the aforementioned process, conductive adhesive components SF-D and SF-F can be bonded to the driver chip DC and circuit board CF respectively after being bonded to the display panel DP.

[0111] Figure 6 It is along Figure 4 The exploded cross-section of line I-I'. Figure 7 yes Figure 6 A plan view of an embodiment of the second pad CPD2 in the second drive pad DP-CPD of the display panel DP. Figure 8A This is a plan view of an embodiment of the second conductive adhesive member SF-F before the conductive particles SB are aligned. Figure 8B This is a plan view of the second conductive adhesive component SF-F after the conductive particles SB are aligned. Figure 9 yes Figure 1B A cross-sectional view of an embodiment of the connection between the display panel DP and the circuit board CF of the display device DD.

[0112] In the following text, reference will be made to Figure 6 , Figure 7Figure 8 and Figure 9 Description of use Figure 4 The process shown illustrates the bonding of the circuit board CF to the display panel DP using the second conductive adhesive member SF-F. The process of bonding the driver chip DC to the display panel DP using the first conductive adhesive member SF-D can be compared with the referenced process. Figure 6 , Figure 7 Figure 8 and Figure 9 The processes described are basically the same.

[0113] Reference Figure 6 The display panel DP includes reference Figure 2 The substrate SUB, the insulating layers IL1 and IL2 disposed on the substrate SUB, and the second driving pad DP-CPD (hereinafter referred to as the driving pad).

[0114] According to the illustrated embodiment, at least one insulating layer is disposed between the drive pad DP-CPD and the substrate SUB, and as an example, Figure 6 The diagram shows a first insulating layer IL1 and a second insulating layer IL2 stacked on a substrate SUB. The drive pad DP-CPD is disposed on the first insulating layer IL1. The second insulating layer IL2 exposes the drive pad DP-CPD to the outside and is disposed on the first insulating layer IL1.

[0115] The driver pad DP-CPD includes a first pad CPD1 disposed on a first insulating layer IL1 and a second pad CPD2 disposed on the first pad CPD1. The first pad CPD1 and the second pad CPD2 are in electrical contact. The driver pad DP-CPD is electrically connected to the circuit pad CF-PD via a second conductive adhesive member SF-F (hereinafter referred to as the "conductive adhesive member"). As a result, the electrical signal output from the circuit pad CF-PD is applied to the driver pad DP-CPD via the conductive adhesive member.

[0116] According to the illustrated embodiment, the first pad CPD1 and the second pad CPD2 comprise different materials from each other. For example, the first pad CPD1 comprises a metallic material, while the second pad CPD2 comprises a transparent conductive layer. The transparent conductive layer includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene, etc. The metallic material includes molybdenum, silver, titanium, copper, aluminum, and their alloys.

[0117] Specifically, the second pad CPD2 is provided with at least one opening OP exposed by the first pad CPD1. Figure 7The second pad CPD2 is shown when viewed in a plane. The second pad CPD2 defines a plurality of openings OP, and the first pad CPD1 is exposed through the openings OP. As another example, the second pad CPD2 may have a mesh structure, and the openings OP are defined by the mesh structure.

[0118] An opening OP can be provided through the second pad CPD2 to expose the first pad CPD1. Because the electrical bonding characteristics between the first pad CPD1, which is formed of a metallic material, and the conductive particles SB, which are made of solder, are better than those between the second pad CPD2, which is a transparent conductive layer, and the conductive particles SB, the electrical connection characteristics between the drive pad DP-CPD and the circuit pad CF-PD are improved when the conductive particles SB contact the first pad CPD1 through the opening OP defined by the second pad CPD2.

[0119] The circuit board CF includes a substrate layer CF-BS and circuit pads CF-PD. An insulating layer is further disposed on the substrate layer CF-BS. As an example, the insulating layer is disposed between the substrate layer CF-BS and the circuit pads CF-PD.

[0120] The circuit pad CF-PD includes a first circuit pad CF-P1 disposed on a substrate layer CF-BS, and a second circuit pad CF-P2 covering the first circuit pad CF-P1 and disposed on the substrate layer CF-BS. The second circuit pad CF-P2 has a thickness less than that of the first circuit pad CF-P1. In the illustrated embodiment, the first circuit pad CF-P1 comprises copper (Cu), while the second circuit pad CF-P2 comprises tin (Sn). The second circuit pad CF-P2 can prevent the first circuit pad CF-P1, which comprises copper (Cu), from being oxidized by air.

[0121] According to the illustrated embodiment, the conductive adhesive member SF-F is first bonded to the circuit pad CF-PD of the circuit board CF. For example... Figure 6 As shown, the conductive particles SB included in the conductive adhesive component SF-F are aligned on the circuit pad CF-PD by means of the circuit pad CF-PD which has hydrophilicity to attract the conductive particles SB.

[0122] For details, refer to Figure 8A The conductive particles SB distributed in the adhesive layer ALY are in a misaligned state. For example, the conductive particles SB are provided to overlap with areas where the conductive particles SB are bonded to circuit pads CF-PD and areas where the conductive particles SB are not bonded to circuit pads CF-PD.

[0123] Reference Figure 8BThe adhesive layer ALY includes a bonding region CA that overlaps with the circuit pad CF-PD and a non-bonding region NA that is adjacent to the bonding region CA and does not overlap with the circuit pad CF-PD. When the conductive adhesive member SF-F is first bonded to the circuit pad CF-PD, the conductive particles SB, which are irregularly distributed in the adhesive layer ALY, move to the bonding region CA.

[0124] As described above, the conductive particles SB made of solder are self-aligned in the bonding region CA due to the hydrophilicity of the circuit pads CF-PD. As a result, as... Figure 8B As shown, conductive particles SB are aligned on the bonding area CA that overlaps with the circuit pad CF-PD.

[0125] Refer again Figure 6 When the conductive adhesive component SF-F is bonded to the circuit board CF, the conductive particles SB are aligned to overlap with the circuit pad CF-PD. In this case, the conductive particles SB are in direct contact with the second circuit pad CF-P2 and do not overlap with the space between the circuit pads CF-PD. However, a small number of conductive particles SB may overlap with the space between the circuit pads CF-PD, but this is due to process errors.

[0126] Reference Figure 9 The conductive adhesive component SF-F is bonded between the circuit board CF and the display panel DP. According to the illustrated embodiment, when the conductive particles SB are aligned on the circuit pads CF-PD, the conductive particles SB are easily bonded to the drive pads DP-CPD of the display panel DP.

[0127] In detail, the circuit board CF and the display panel DP are aligned so that the aligned conductive particles SB face the drive pad DP-CPD. In this case, the conductive particles SB are arranged between the drive pad DP-CPD and the circuit pad CF-PD, without overlapping the spaces between the drive pads DP-CPD or between the circuit pads CF-PD. Subsequently, the circuit board CF or the display panel DP is pressed, and thus, the conductive particles SB are bonded to the drive pad DP-CPD.

[0128] like Figure 9 As shown, in the process of bonding the circuit board CF to the display panel DP, the conductive particles SB can not only contact the second pad CPD2, but also through the opening OP defined by the second pad CPD2 (see reference). Figure 7 It contacts the first pad CPD1. As a result, the circuit pad CF-PD and the drive pad DP-CPD are electrically connected to each other through the conductive particle SB.

[0129] Furthermore, after the bonding process between the circuit board CF and the display panel DP is completed using the conductive adhesive component SF-F, a filler FY is provided between the substrate layer CF-BS of the circuit board CF and the conductive adhesive component SF-F. As an example, the filler FY includes a photoinitiator. The filler FY including the photoinitiator is cured by external ultraviolet light. As another example, the filler FY includes a thermal initiator, and in this case, the filler FY including the thermal initiator is cured by external heat.

[0130] The filler FY is filled in the internal space between the circuit board CF and the conductive adhesive component SF-F, so that the display panel DP and the circuit board CF can be bonded more firmly.

[0131] For reference Figure 6 , Figure 7 Figure 8 and Figure 9 During the bonding process in which the conductive adhesive member SF-F is first bonded to the circuit board CF, the conductive particles SB are aligned on the circuit pads CF-PD. This allows for easy inspection of whether the conductive particles SB are aligned on the circuit pads CF-PD. For example, it is easy to check for overlap between the conductive particles SB and the non-bonded area NA that does not overlap with the circuit pads CF-PD. As a result, the overall processing time required to bond the display panel DP to the circuit board CF via the conductive adhesive member SF-F can be reduced.

[0132] When performing the process of bonding the drive pads DP-CPD of the display panel DP to the conductive particles SB aligned in the bonding area CA, the conductive particles SB are easily bonded to the drive pads DP-CPD. Therefore, the conductive particles SB do not overlap with the space between the circuit pads CF-PD or the space between the drive pads DP-CPD, and thus, short circuits between the circuit pads CF-PD or between the drive pads DP-CPD can be prevented.

[0133] Figure 10 This is a cross-sectional view of an embodiment of the second conductive adhesive member and the display panel before the conductive particles are aligned. Figure 11 This is a cross-sectional view of another embodiment of the second conductive adhesive component and the display panel after the conductive particles have been aligned. Figure 12 yes Figure 1B A cross-sectional view of another embodiment of the connection between the display panel DP and the circuit board CF of the display device DD.

[0134] When with Figure 6 Compared to the display panel DP shown, Figure 10The display panel DP shown further includes a third insulating layer IL3 disposed on the second insulating layer IL2. The third insulating layer IL3 exposes the drive pad DP-CPD to the outside, is disposed on the second insulating layer IL2, and is an organic layer. The third insulating layer IL3 may be referred to as an auxiliary insulating layer.

[0135] In the following text, reference will be made to Figure 10 , Figure 11 and Figure 12 This describes the process of bonding the conductive adhesive component SF-F to the circuit board CF after the conductive adhesive component SF-F is first bonded to the display panel DP.

[0136] Reference Figure 10 The conductive adhesive component SF-F is first bonded to the display panel DP. In this case, the conductive adhesive component SF-F is arranged on the third insulating layer IL3, and the conductive particles SB are not aligned.

[0137] According to the illustrated embodiment, structure HM is arranged on conductive adhesive member SF-F and the conductive adhesive member SF-F is pressed. For example, structure HM is a transparent sapphire or quartz member.

[0138] Subsequently, an external infrared laser IR irradiates the conductive adhesive component SF-F through a structure HM arranged on the conductive adhesive component SF-F.

[0139] According to an embodiment, the conductive particles SB, irregularly distributed in the adhesive layer ALY, are made of solder and aligned on the drive pads DP-CPD by heat applied to them by an external infrared laser IR. As a result, as Figure 11 As shown, the conductive particles SB are aligned on the drive pad DP-CPD. That is, the conductive particles SB overlap with the drive pad DP-CPD.

[0140] Specifically, due to the second insulating layer IL2 and the third insulating layer IL3, the area overlapping with the drive pad DP-CPD corresponds to the space recessed from the third insulating layer IL3. For example, the conductive particles SB arranged on each drive pad are aligned in the recessed space through the second insulating layer IL2 and the third insulating layer IL3. As a result, the possibility of a short circuit between the conductive particles SB aligned on one drive pad and the conductive particles SB aligned on another drive pad adjacent to that one drive pad in the drive pad DP-CPD can be reduced or prevented.

[0141] Reference Figure 12After the conductive adhesive component SF-F is bonded to the drive pad DP-CPD of the display panel DP, the circuit board CF is bonded to the conductive adhesive component SF-F. In this case, the conductive particles SB are aligned on the drive pad DP-CPD. As a result, the circuit pad CF-PD of the circuit board CF, after being aligned to face the drive pad DP-CPD, is bonded to the conductive particles SB. Subsequently, filler FY is filled between the conductive adhesive component SF-F and the substrate layer CF-BS.

[0142] While certain embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalents that will be apparent to those skilled in the art.

Claims

1. A display device, comprising: substrate; Drive pads are arranged on the substrate; An insulating layer, exposing the drive pads, is disposed on the substrate; A circuit board, including circuit pads that overlap with the drive pads; as well as A connector, disposed between the circuit board and the insulating layer, includes a plurality of conductive particles electrically connecting the drive pads and the circuit pads. The driving pad includes: The first pad is disposed on the substrate; and A second pad is disposed on the first pad and has an opening that exposes the first pad, wherein at least one of the plurality of conductive particles contacts the first pad through the opening.

2. The display device according to claim 1, wherein: The connector includes a conductive adhesive component, and The plurality of conductive particles include solder.

3. The display device according to claim 1, wherein, The connector includes: a conductive adhesive member comprising an adhesive layer, and The adhesive layer has a bonding region that overlaps with the drive pad and a non-bonding region that is adjacent to the bonding region but does not overlap with the drive pad.

4. The display device according to claim 3, wherein, The circuit board further includes: a base layer supporting the circuit pads, and the circuit pads include: First circuit pads are disposed on the substrate layer; and The second circuit pad covers the first circuit pad and is disposed on the substrate layer.

5. A method for manufacturing a display device, the method comprising the following steps: A component comprising multiple conductive particles is arranged on the circuit pads of a circuit board. The plurality of conductive particles are aligned to overlap with the circuit pads by utilizing the affinity between the plurality of conductive particles and the circuit pads. The drive pads of the display panel are arranged to face the plurality of conductive particles aligned on the circuit pads. as well as Press the circuit board to electrically connect the circuit pads to the drive pads of the display panel via the plurality of conductive particles. The driving pad includes: First pad; and The second pad is disposed on the first pad and has an opening that exposes the first pad. At least one of the plurality of conductive particles is in contact with the first pad through the opening.

6. The method according to claim 5, wherein, The plurality of conductive particles include solder disposed between the drive pad and the circuit pad.

7. The method according to claim 5, wherein: The component includes a conductive adhesive component, and The second pad is formed of a material different from that of the first pad.

8. A method for manufacturing a display device, the method comprising the following steps: A component comprising multiple conductive particles is arranged on the drive pads of the display panel; Align the plurality of conductive particles to overlap with the drive pad; The circuit pads of the circuit board are arranged to face the plurality of conductive particles aligned on the drive pads of the display panel. as well as Press the circuit board to electrically connect the circuit pads to the drive pads of the display panel via the plurality of conductive particles. The driving pad includes: First pad; and The second pad is disposed on the first pad and has an opening that exposes the first pad. At least one of the plurality of conductive particles is in contact with the first pad through the opening.

9. The method according to claim 8, wherein, The plurality of conductive particles are aligned by an infrared laser to overlap with the drive pad.

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