Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus and a substrate processing method capable of improving the centering accuracy when a substrate is placed in a substrate processing section are provided. A substrate processing apparatus of one embodiment includes a substrate processing section, a substrate conveying section, a first detection section, a second detection section, and a third detection section. The substrate processing section is used to hold and process a substrate. The substrate conveying section has a rotation shaft and is used to convey the substrate into the substrate processing section. The first detection section detects the position of the substrate conveying section relative to the substrate processing section in a direction of travel when the substrate is conveyed into the substrate processing section along the direction of travel. The second detection section detects the position of the substrate conveying section relative to the substrate processing section in a direction perpendicular to the direction of travel. The third detection section detects the inclination of the rotation shaft of the substrate conveying section relative to the substrate processing section.

Description

Technical Field

[0001] The embodiments of the present invention relate to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] Previously, there were known techniques for feeding a substrate into a substrate processing section that processes substrates such as semiconductor wafers (hereinafter also referred to as wafers) and placing the substrate in the substrate processing section (see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-137383 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] The present invention provides a technique that can improve the centering accuracy when a substrate is placed in a substrate processing unit.

[0008] Means for solving technical problems

[0009] One aspect of the substrate processing apparatus of the present invention includes a substrate processing unit, a substrate transport unit, a first detection unit, a second detection unit, and a third detection unit. The substrate processing unit is used to hold and process a substrate. The substrate transport unit has a rotating shaft for feeding the substrate into the substrate processing unit. The first detection unit is used to detect the position of the substrate transport unit relative to the substrate processing unit in the traveling direction as the substrate is fed into the substrate processing unit. The second detection unit is used to detect the position of the substrate transport unit relative to the substrate processing unit in a direction perpendicular to the traveling direction. The third detection unit is used to detect the inclination of the rotating shaft of the substrate transport unit relative to the substrate processing unit.

[0010] Invention Effects

[0011] By using the present invention, the centering accuracy when placing a substrate in the substrate processing section can be improved. Attached Figure Description

[0012] Figure 1 This is a schematic diagram showing the general structure of the substrate processing system in the implementation method.

[0013] Figure 2 This is a schematic diagram illustrating a specific structural example of the cleaning unit in the implementation method.

[0014] Figure 3 This is a plan view showing the substrate transport device in an embodiment.

[0015] Figure 4 This is a perspective view of the wafer detection unit according to the implementation method.

[0016] Figure 5 This is a plan view showing the substrate transport device and cleaning unit of the embodiment.

[0017] Figure 6 This is a plan view showing the first detection unit, the second detection unit, and the third detection unit in the embodiment.

[0018] Figure 7 yes Figure 6 The arrow pointing towards the cross section of line AA is shown.

[0019] Figure 8 yes Figure 6 The arrow in the BB line is shown in the cross-sectional view.

[0020] Figure 9 yes Figure 6 The arrow pointing towards the cross section of the CC line is shown.

[0021] Figure 10 This is a diagram used to illustrate the tilt detection process of the implementation method.

[0022] Figure 11 This is a diagram used to illustrate the tilt detection process of the implementation method.

[0023] Figure 12 This is a diagram used to illustrate the wafer feeding process of the implementation method.

[0024] Figure 13 This is a diagram used to illustrate the wafer feeding process of the implementation method.

[0025] Figure 14 This is a diagram used to illustrate the wafer feeding process of the implementation method.

[0026] Figure 15 This is a plan view showing the first detection section, the second detection section, the third detection section, and the fork-shaped section of the modified example 1 of the embodiment.

[0027] Figure 16 This is a plan view showing the first detection section, the second detection section, the third detection section, and the fork-shaped section of the modified embodiment 2.

[0028] Figure 17 This is a flowchart illustrating the sequence of input processing performed by the substrate processing system in the implementation method.

[0029] Explanation of reference numerals in the attached figures

[0030] W wafer (an example of a substrate), 1 substrate processing system (an example of a substrate processing apparatus), 6 control unit, 16 cleaning unit, 17 substrate transport device, 25 fork-shaped part (an example of a substrate transport unit), 28A, 28B, 28C through holes, 51 first detection unit, 51a light-emitting part, 51b light-receiving part, 52 second detection unit, 52a light-emitting part, 52b light-receiving part, 53 third detection unit, 53a light-emitting part, 53b light-receiving part, 72 substrate processing unit. Detailed Implementation

[0031] Hereinafter, with reference to the accompanying drawings, embodiments of the substrate processing apparatus and substrate processing method disclosed in this invention will be described in detail. This invention is not limited to the embodiments shown below. It should be noted that the drawings are schematic and may differ from actual measurements in terms of dimensional relationships and proportions. Furthermore, there may be instances where the dimensions or proportions of different elements differ between the drawings.

[0032] Previously, there were known techniques for feeding a substrate into a substrate processing section that processes substrates such as semiconductor wafers (hereinafter also referred to as wafers) and placing the substrate in the substrate processing section. However, when the orientation of the substrate transport section into which the substrate is fed is tilted, it is difficult to improve the centering accuracy of the substrate relative to the substrate processing section.

[0033] Therefore, there is a need for a technology that can overcome the above problems and improve the centering accuracy when placing a substrate in the substrate processing unit.

[0034] <Overview of Substrate Processing System>

[0035] First, refer to Figure 1 The general structure of the substrate processing system 1 in the embodiment will be described. Figure 1 This is a schematic diagram showing the general structure of the substrate processing system 1 according to the embodiment.

[0036] Substrate processing system 1 is an example of a substrate processing apparatus. Hereinafter, to clarify the positional relationships, the X-axis, Y-axis, and Z-axis are defined as mutually orthogonal, with the positive direction of the Z-axis defined as the vertically upward direction.

[0037] like Figure 1 As shown, the substrate processing system 1 includes an infeed / outfeed station 2 and a processing station 3. The infeed / outfeed station 2 and the processing station 3 are arranged adjacent to each other.

[0038] The infeed / outfeed station 2 includes a carrier placement section 11 and a transport section 12. The carrier placement section 11 can hold multiple carriers C that can accommodate multiple substrates, or in the first embodiment, semiconductor wafers W (hereinafter referred to as wafers W) in a horizontal state.

[0039] The transport section 12 is disposed adjacent to the carrier placement section 11, and a substrate transport device 13 and a transfer section 14 are disposed inside it. The substrate transport device 13 includes a wafer holding mechanism for holding the wafer W. The substrate transport device 13 is movable in the horizontal and vertical directions and can rotate about the vertical axis. The wafer holding mechanism is used to transport the wafer W between the carrier C and the transfer section 14.

[0040] The processing station 3 is arranged adjacent to the conveying section 12. The processing station 3 includes a conveying section 15 and multiple cleaning units 16. The multiple cleaning units 16 are arranged side by side on both sides of the conveying section 15.

[0041] The transport section 15 internally houses a substrate transport device 17. The substrate transport device 17 has a wafer holding mechanism for holding the wafer W. The substrate transport device 17 is movable in both the horizontal and vertical directions and can rotate about a vertical axis. The wafer holding mechanism is used to transport the wafer W between the transfer section 14 and the cleaning unit 16. Details regarding this substrate transport device 17 will be described later.

[0042] The cleaning unit 16 is used to perform a prescribed cleaning process on the peripheral portion of the wafer W transported by the substrate transport device 17. Details regarding the cleaning unit 16 will be described later.

[0043] In this invention, the direction along the X-axis is defined as the front-back direction, and the positive X-axis direction is defined as the front direction. Furthermore, in this invention, the direction in which the feed-in / feed-out station 2 and the processing station 3 are arranged side-by-side (in the figure, along the Y-axis) is defined as the left-right direction, and the side where the feed-in / feed-out station 2 is located is defined as the right side. Moreover, in this invention, the positive Y-axis direction is defined as the right direction.

[0044] Furthermore, the substrate processing system 1 includes a control device 5. This control device 5 is, for example, a computer, and includes a control unit 6 and a storage unit 7. The storage unit 7 stores programs for controlling various processes performed by the substrate processing system 1. The control unit 6 controls the operation of the substrate processing system 1 by reading and executing the programs stored in the storage unit 7.

[0045] Alternatively, the program can be recorded in a computer-readable storage medium and installed from that storage medium into the storage unit 7 of the control device 5. Examples of computer-readable storage media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards.

[0046] In the substrate processing system 1 configured as described above, firstly, the substrate transport device 13 of the delivery station 2 removes the wafer W from the carrier C placed in the carrier placement section 11 and places the removed wafer W into the transfer section 14. The wafer W placed in the transfer section 14 is then removed from the transfer section 14 by the substrate transport device 17 of the processing station 3 and sent into the cleaning unit 16.

[0047] After being processed by the cleaning unit 16, the wafer W sent into the cleaning unit 16 is sent out of the cleaning unit 16 by the substrate transport device 17 and placed in the transfer section 14. Then, the processed wafer W placed in the transfer section 14 is sent back to the carrier C of the carrier placement section 11 by the substrate transport device 13.

[0048] <Structure of the cleaning unit>

[0049] Below, refer to Figure 2 The structure of the cleaning unit 16 in the embodiment will be described. Figure 2 This is a schematic diagram illustrating a specific structural example of the cleaning unit 16 in the embodiment. For example... Figure 2 As shown, the cleaning unit 16 includes a chamber 71, a substrate processing section 72, a cleaning fluid discharge section 73, and a recovery dish 74.

[0050] The chamber 71 is used to house the substrate processing section 72, the cleaning fluid discharge section 73, and the recovery dish 74. An FFU (Fan Filter Unit) 71a is provided at the top of the chamber 71 to form a downward flow within the chamber 71.

[0051] The substrate processing unit 72 rotatably holds the wafer W and performs liquid processing on the held wafer W. The substrate processing unit 72 includes: a holding part 72a that holds the wafer W horizontally; a support member 72b that extends in the vertical direction and supports the holding part 72a; and a drive part 72c that rotates the support member 72b about a vertical axis.

[0052] The holding part 72a is connected to a suction device (not shown) such as a vacuum pump, and uses the negative pressure generated by the suction through the suction device to adsorb the back side of the wafer W, thereby holding the wafer W horizontally. As the holding part 72a, for example, a porous chuck or an electrostatic chuck can be used.

[0053] The holding section 72a has an adsorption area with a diameter smaller than that of the wafer W. This allows cleaning fluid discharged from the lower nozzle 73b of the cleaning fluid discharge section 73 (described later) to be supplied to the back side of the peripheral portion of the wafer W.

[0054] The cleaning fluid discharge section 73 has an upper nozzle 73a and a lower nozzle 73b. The upper nozzle 73a is positioned above the wafer W held in the substrate processing section 72, and the lower nozzle 73b is positioned below the wafer W.

[0055] The cleaning fluid supply unit 75 is connected to the upper nozzle 73a and the lower nozzle 73b. From the upstream side, the cleaning fluid supply unit 75 includes a cleaning fluid supply source 75a, a valve 75b, and a flow regulator 75c. The cleaning fluid supply source 75a is, for example, a container (tank) for storing the cleaning fluid. The flow regulator 75c is used to regulate the flow rate of the cleaning fluid supplied from the cleaning fluid supply source 75a to the upper nozzle 73a and the lower nozzle 73b via the valve 75b.

[0056] The upper nozzle 73a discharges cleaning fluid supplied from the cleaning fluid supply unit 75 to the front side of the periphery of the wafer W held in the substrate processing unit 72. The lower nozzle 73b discharges cleaning fluid supplied from the cleaning fluid supply unit 75 to the back side of the periphery of the wafer W held in the substrate processing unit 72.

[0057] Furthermore, the cleaning fluid discharge section 73 includes a first moving mechanism 73c for moving the upper nozzle 73a and a second moving mechanism 73d for moving the lower nozzle 73b. By using these first moving mechanisms 73c and second moving mechanisms 73d to move the upper nozzle 73a and the lower nozzle 73b, the discharge position of the cleaning fluid relative to the wafer W can be changed.

[0058] The recovery dish 74 is arranged to surround the substrate processing section 72. At the bottom of the recovery dish 74, there are: a drain port 74a for discharging the cleaning liquid discharged from the cleaning liquid discharge section 73 to the outside of the chamber 71; and an exhaust port 74b for venting the atmosphere inside the chamber 71.

[0059] The cleaning unit 16 is configured as described above. After holding the back side of the wafer W by adsorbing it with the holding part 72a, the driving part 72c is used to rotate the wafer W.

[0060] Next, the cleaning unit 16 discharges cleaning fluid from the upper nozzle 73a toward the front side of the peripheral portion of the rotating wafer W. Furthermore, in parallel with this discharge process, the cleaning unit 16 discharges cleaning fluid from the lower nozzle 73b toward the back side of the peripheral portion of the rotating wafer W. This allows for the cleaning of the peripheral portion of the wafer W.

[0061] <Structure of the substrate transport device>

[0062] Next, refer to Figures 3 to 11 The structure of the substrate transport device 17 in the embodiment will be described. Figure 3 This is a plan view of the substrate transport device 17 according to the embodiment. The substrate transport device 17 has two fork-shaped portions 25 (one not shown) arranged vertically overlapping each other. The fork-shaped portion 25 is an example of a substrate transport portion.

[0063] One of the two fork-shaped portions 25 is used to receive the wafer W from the module, and the other fork-shaped portion 25 is used to transfer the wafer W to the module.

[0064] The fork-shaped portion 25 has a main body portion 25a and a plurality of claw portions 26. The main body portion 25a is divided into two branches at its front end from the base and extends in the forward direction of the fork-shaped portion 25, forming a horseshoe shape that surrounds the side periphery of the wafer W. A plurality of (four in the figure) claw portions 26 protrude into the inside of the horseshoe-shaped main body portion 25a, supporting the back side of the wafer W.

[0065] On each of the multiple claw portions 26, there are suction holes 27 for attracting and holding the back side of the wafer W. The attraction is stopped when the base 24 is lowered to transfer the wafer W to the module.

[0066] Furthermore, three through holes 28A, 28B, and 28C are provided on the base end side of the main body 25a of the fork-shaped portion 25. Through holes 28A and 28B are arranged side by side in a direction perpendicular to the forward direction of the fork-shaped portion 25. Through holes 28A and 28C are arranged side by side in the forward direction of the fork-shaped portion 25.

[0067] The wafer inspection unit 29 has four light-emitting parts 31, four light-receiving parts 32, and a support part 33. The four light-emitting parts 31 are disposed below the fork-shaped part 25. The four light-receiving parts 32 are disposed above the fork-shaped part 25 and above the four light-emitting parts 31, respectively. The support part 33 supports the four light-emitting parts 31 and the four light-receiving parts 32 on the base 24.

[0068] A light-emitting part 31 and a light-receiving part 32 are grouped together to form a transmissive optical sensor. Hereinafter, this group of light-emitting part 31 and light-receiving part 32 will be used as a wafer inspection sensor 30.

[0069] The light-emitting part 31 and the light-receiving part 32 of the same wafer detection sensor 30 are arranged such that they sandwich the periphery of the wafer W held on the fork-shaped part 25 in the retracted position from above and below, and each group is arranged at intervals in the circumferential direction of the wafer W.

[0070] Figure 4 This is a perspective view of the wafer detection unit 29 according to the embodiment. Figure 4 As shown, the light-emitting part 31 is configured to emit light upwards. Figure 4 The arrow in the diagram indicates the optical path. The light-receiving section 32 is composed of a plurality of light-receiving elements arranged in a straight line from the center side to the outer periphery of the wafer W.

[0071] The light emitted from the light-emitting section 31 is partially blocked by the periphery of the wafer W, which is held in the retracted position on the fork-shaped section 25, and the other part passes through the side of the wafer W and illuminates the light-receiving section 32. Therefore, the size of the area in the light-receiving section 32 that is illuminated, that is, the number of light-receiving elements that receive light, varies accordingly with the position of the periphery of the wafer W directly above the light-emitting section 31.

[0072] The light-receiving unit 32 sends a detection signal corresponding to the size of the light-irradiated area to the control unit 6 (see reference). Figure 1 The control unit 6 detects the position of the periphery of the wafer W directly above each light-receiving part 32 based on the detection signal, and calculates the center position of the wafer W held on the fork-shaped part 25 based on the detected positions.

[0073] Figure 5 This is a plan view of the substrate transport device 17 and the cleaning unit 16 according to the embodiment. Figure 5 As shown, the substrate transport device 17 includes a left and right drive unit 21, a frame 22, a lifting platform 23, a base 24, two fork-shaped parts 25, and a wafer detection unit 29. The left and right drive unit 21 is used to move the frame 22 horizontally left and right.

[0074] The frame 22 is erected to surround the lifting platform 23, allowing the lifting platform 23 to move up and down in the vertical direction. The base 24 is mounted on the lifting platform 23 and rotates about the vertical axis via the lifting platform 23.

[0075] Two fork-shaped parts 25 are arranged on the base 24 in an overlapping manner, and the base 24 allows these fork-shaped parts 25 to move independently between a backward position and a forward position on the base 24.

[0076] To enable the movement of these components, the left and right drive units 21, frame 22, lifting platform 23, and base 24 include a drive mechanism (not shown) consisting of a motor, timing belt, and pulleys. The motor includes an encoder to enable the control unit 6 (see reference 6). Figure 1 It can detect the position of each part.

[0077] In addition, such as Figure 5 As shown, the cleaning unit 16 includes the substrate processing section 72 and the recovery dish 74 described above. Additionally, a lifting pin 76 is provided in the substrate processing section 72.

[0078] The lifting pins 76 are three liftable pins located inside the recycling dish 74. The lifting pins 76 connect the wafer W between the fork-shaped portion 25 located on the recycling dish 74 and the substrate processing portion 72.

[0079] The cleaning unit 16 has a vertical wall 48 that separates the cleaning unit 16 from the conveying section 15. With this wall 48, the processing performed inside the cleaning unit 16 can be prevented from being affected by the airflow in the conveying section 15.

[0080] On the wall portion 48, a feed inlet 49 is provided for feeding the wafer W into and out of the substrate processing unit 72. In addition, near the feed inlet 49, a first detection unit 51, a second detection unit 52, and a third detection unit 53, which are transmission-type optical sensors, are provided.

[0081] The first detection unit 51 and the second detection unit 52 are arranged side by side in the left-right direction, with the first detection unit 51 appearing to the left when viewed from the conveying unit 15 towards the cleaning unit 16. The first detection unit 51 and the third detection unit 53 are arranged side by side in the front-back direction, with the first detection unit 51 appearing to the rear. That is, the third detection unit 53 is located inside or outside (inside in the figure) of the cleaning unit 16 than the first detection unit 51 and the second detection unit 52.

[0082] Figure 6 This is a plan view showing the first detection unit 51, the second detection unit 52, and the third detection unit 53 according to the embodiment. Figure 6 The text also shows that in order to feed the wafer W and transfer it to the substrate processing unit 72, the fork-shaped part 25 enters the cleaning unit 16 in the forward direction through the feed inlet 49.

[0083] like Figure 6 As shown, the first detection unit 51 has a light-emitting unit 51a and a light-receiving unit 51b arranged side by side in the vertical direction. The light-emitting unit 51a is disposed below the feed inlet 49, and the light-receiving unit 51b is disposed above the feed inlet 49.

[0084] The light-emitting part 51a illuminates light upwards. The light-receiving part 51b has a plurality of light-receiving elements (e.g., 1024), which are arranged side by side along the front-back direction (X-axis direction).

[0085] The second detection unit 52 has a light-emitting unit 52a and a light-receiving unit 52b arranged side by side in the vertical direction. The light-emitting unit 52a is located below the feed inlet 49, and the light-receiving unit 52b is located above the feed inlet 49.

[0086] The light-emitting part 52a irradiates light upwards. The light-receiving part 52b has a plurality of light-receiving elements (e.g., 1024), which are arranged side by side along the left-right direction (Y-axis direction).

[0087] The third detection unit 53 has a light-emitting unit 53a and a light-receiving unit 53b arranged side by side in the vertical direction. The light-emitting unit 53a is located below the feed inlet 49, and the light-receiving unit 53b is located above the feed inlet 49.

[0088] The light-emitting part 53a irradiates light upwards. The light-receiving part 53b has a plurality of light-receiving elements (e.g., 1024), which are arranged side by side along the left-right direction (Y-axis direction).

[0089] Figure 7 yes Figure 6 The cross-sectional view along line AA shown is used to explain the operation of the first detection unit 51. Figure 7 In the diagram, arrows are used to schematically represent the light path formed by the light-emitting part 51a.

[0090] like Figure 7 As shown, the light-emitting part 51a is configured to: direct light towards the substrate processing part 72 (see reference 72) for the purpose of transferring the wafer W. Figure 5 The through hole 28A of the fork-shaped portion 25 traveling above and the edge portion 28Aa of the front side (positive X-axis direction side) of the through hole 28A are irradiated with light.

[0091] In the first detection unit 51, the size of the area where the light-receiving unit 51b receives light varies accordingly with the position of the edge portion 28Aa on the front side of the through hole 28A. Therefore, the light-receiving unit 51b outputs a signal to the control unit 6 that corresponds to the size of the light-receiving area.

[0092] Based on the output signal, the control unit 6 can detect the position of the edge portion 28Aa on the front side of the through hole 28A (hereinafter also simply referred to as the edge portion 28Aa of the through hole 28A). That is, the first detection unit 51 can detect the position of the fork-shaped portion 25 relative to the substrate processing unit 72 in the travel direction.

[0093] Figure 8 yes Figure 6 The cross-sectional view along the BB line shown is used to explain the operation of the second detection unit 52. Figure 8 In the diagram, arrows are used to schematically represent the light path formed by the light-emitting part 52a.

[0094] like Figure 8 As shown, the light-emitting part 52a is configured to: [the light is emitted] towards the substrate processing part 72 (see reference 72) for the purpose of transferring the wafer W. Figure 5 The through hole 28B of the fork-shaped portion 25 traveling above and the edge portion 28Ba on the right side (positive Y-axis direction side) of the through hole 28B are irradiated with light.

[0095] In the second detection unit 52, the size of the area where the light-receiving unit 52b receives light varies accordingly with the position of the right edge portion 28Ba of the through hole 28B. Therefore, the light-receiving unit 52b outputs a signal to the control unit 6 that corresponds to the size of the light-receiving area.

[0096] Based on the output signal, the control unit 6 can detect the position of the right edge portion 28Ba of the through hole 28B (hereinafter also simply referred to as the edge portion 28Ba of the through hole 28B) in the Y-axis direction. That is, the second detection unit 52 can detect the position of the fork-shaped portion 25 relative to the substrate processing unit 72 in a direction perpendicular to the travel direction.

[0097] As explained above, the first detection unit 51 and the second detection unit 52 are able to detect the position of the fork-shaped portion 25 relative to the substrate processing unit 72 on two horizontal axes that are orthogonal to each other.

[0098] Figure 9 yes Figure 6 The cross-sectional view showing the CC line is used to explain the operation of the third detection unit 53. Figure 9 In the diagram, arrows are used to schematically represent the light path formed by the light-emitting part 53a.

[0099] like Figure 9 As shown, the light-emitting part 53a is configured such that it is positioned in the substrate processing part 72 (see reference 72) for the purpose of transferring the wafer W. Figure 5 The through hole 28C of the fork-shaped portion 25 traveling above and the edge portion 28Ca on the right side (positive Y-axis direction side) of the through hole 28C are irradiated with light.

[0100] In the third detection unit 53, the size of the area where the light-receiving unit 53b receives light varies accordingly with the position of the right edge portion 28Ca of the through hole 28C. Therefore, the light-receiving unit 53b outputs a signal to the control unit 6 that corresponds to the size of the light-receiving area.

[0101] Based on the output signal, the control unit 6 can detect the position of the right edge portion 28Ca of the through hole 28C (hereinafter also simply referred to as the edge portion 28Ca of the through hole 28C) in the Y-axis direction. That is, the third detection unit 53 can detect the position of the fork-shaped portion 25 relative to the substrate processing unit 72 in a direction perpendicular to the travel direction.

[0102] Here, the third detection unit 53 of the embodiment can detect the tilt of the rotation axis of the fork-shaped portion 25 relative to the substrate processing unit 72 by cooperating with the second detection unit 52. (Refer to...) Figure 10 and Figure 11 The details of the tilt detection and processing of the rotating shaft are explained.

[0103] Figure 10 and Figure 11 This is a diagram used to illustrate the tilt detection process of the implementation method. Figure 10 and Figure 11 In order to make it easier to understand, the second detection unit 52 and the third detection unit 53 are shown side by side, one above the other.

[0104] Figure 10 Indicates the fork-shaped part 25 (refer to) Figure 6 The rotation axis of the substrate processing unit 72 (see reference) is relative to the substrate processing unit 72. Figure 6 The case where there is no tilt (i.e., the tilt angle is 0 (rad)). For example... Figure 10 As shown, the second detection unit 52 can determine the distance Ya between the edge portion 28Ba of the through hole 28B and the end portion 52ba of the light-receiving portion 52b based on the size of the light-receiving area of ​​the light-receiving portion 52b.

[0105] Similarly, the third detection unit 53 can determine the distance Yb ​​between the edge portion 28Ca of the through hole 28C and the end portion 53ba of the light-receiving portion 53b based on the size of the light-receiving area of ​​the light-receiving portion 53b.

[0106] Here, since the light-receiving portions 52b and 53b are arranged along the Y-axis, the aforementioned distances Ya and Yb are the distances between the edge portion 28Ba (28Ca) and the end portion 52ba (53ba) in the Y-axis direction. Furthermore, let the distance between the light-receiving portions 52b and 53b in the X-axis direction be distance Xa.

[0107] For example, in one embodiment, when the rotation axis of the fork-shaped portion 25 is not tilted relative to the substrate processing portion 72, such as Figure 10 As shown, the second detection unit 52, the third detection unit 53, and the through holes 28B and 28C are arranged such that the distance Ya is equal to the distance Yb.

[0108] Figure 11 Indicates the fork-shaped part 25 (refer to) Figure 6 The rotation axis of the substrate processing unit 72 (see reference) is relative to the substrate processing unit 72. Figure 6 (The situation of tilting.) For example, [the situation of tilting]. Figure 11 As shown, when the rotation axis of the fork-shaped portion 25 is tilted, the positional relationship between the through hole 28B and the through hole 28C provided in the fork-shaped portion 25 changes, and therefore, the distance Ya and the distance Yb ​​become different values.

[0109] Furthermore, the tilt angle θ (rad) of the rotation axis of the fork-shaped portion 25 relative to the substrate processing portion 72 is as follows: Figure 11 As indicated, it can be calculated using the following formula (1).

[0110] θ=tan -1 ((Ya-Yb) / Xa) ……(1)

[0111] As explained above, the third detection unit 53 of the embodiment can determine the tilt angle θ of the rotation axis of the fork-shaped part 25 relative to the substrate processing unit 72 by cooperating with the second detection unit 52.

[0112] <Chip Feed Processing>

[0113] Next, refer to the previous explanation. Figure 6 The details of the processing of the wafer W into the cleaning unit 16 by using the substrate transport device 17 to deliver the wafer W into the substrate processing unit 72 will be explained.

[0114] The position of the fork-shaped portion 25 used to transfer the wafer W to the substrate processing unit 72 is preset, and this preset position is used as the transfer start position. More specifically, the forward position of the fork-shaped portion 25 on the substrate 24 and the orientation of the fork-shaped portion 25 are preset as the transfer start position.

[0115] In other words, the base 24, the fork-shaped portion 25, and the lifting platform 23 (see reference) that cause the fork-shaped portion 25 to move forward and backward. Figure 5 The number of pulses (encoder value) output by the encoders installed in the motors included in the ) are preset. The position and orientation of the fork-shaped part 25 on the base 24 are set as "forward setting position" and "setting orientation" respectively.

[0116] When the wafer W is held in a predetermined reference holding position on the fork-shaped portion 25, and the fork-shaped portion 25 is located at the handover start position, the center of the wafer W on the substrate processing unit 72 is located on the rotation axis of the substrate processing unit 72. Figure 6 The diagram shows the states of the fork-shaped part 25 and the wafer W, which are respectively located at the starting position and the reference position of the junction.

[0117] In the diagram below, the center point of the wafer W held in the reference holding position is denoted as P0, the actual center point of the wafer W held is denoted as P1, and the rotation axis of the substrate processing unit 72 is denoted as P2. The orientation of the fork-shaped part 25 refers to the orientation of the center point P0 as viewed from the rotation axis of the fork-shaped part 25.

[0118] For example, when the wafer W is held on the fork-shaped part 25 with a deviation from the reference holding position, when the wafer W is handed over to the substrate processing unit 72, the control unit 6 moves the fork-shaped part 25 in a manner that deviates from the forward setting position and the setting orientation in order to compensate for the deviation.

[0119] That is, the control unit 6 calculates the encoder value after correcting the deviation from the chip W by an amount corresponding to the preset encoder value, and the fork-shaped part 25 moves accordingly with the corrected encoder value. In this invention, the position of the fork-shaped part 25 after moving is set as a temporary handover position.

[0120] Next, the control unit 6 controls the substrate transport device 17 to move the fork-shaped part 25 holding the wafer W in the forward direction (positive X-axis direction) and send the wafer W above the substrate processing unit 72 in the cleaning unit 16.

[0121] Next, the first detection unit 51 detects the position of the edge portion 28Aa of the through hole 28A provided on the fork-shaped portion 25, the second detection unit 52 detects the position of the edge portion 28Ba of the through hole 28B, and the third detection unit 53 detects the position of the edge portion 28Ca of the through hole 28C.

[0122] Next, the control unit 6 calculates the deviation between the detected edge portions 28Aa and 28Ba positions and the positions that should be detected after the fork-shaped portion 25 is corrected from the intersection start position to the intersection provisional position.

[0123] That is, the control unit 6 detects the positional deviation between the set provisional position of the handover and the actual position of the fork-shaped part 25.

[0124] Next, the control unit 6 further corrects the orientation of the fork-shaped part 25 from the set orientation in a manner that eliminates the positional deviation, and further corrects the position of the fork-shaped part 25 on the base 24 from the forward set position.

[0125] That is, the control unit 6 moves the fork-shaped part 25 by further correcting the encoder values ​​output from each encoder from the preset encoder values ​​by an amount corresponding to the positional deviation of the fork-shaped part 25. Then, the wafer W is handed over with the center point P1 of the wafer W located on the rotation axis P2 of the substrate processing unit 72.

[0126] In the above-described process of correcting the positional deviation of the fork-shaped portion 25, the position of the fork-shaped portion 25 relative to the substrate processing unit 72 in the X-axis direction and the Y-axis direction are taken only, and the process is performed as if the orientation of the fork-shaped portion 25 relative to the substrate processing unit 72 has not deviated.

[0127] In this situation, the accuracy of the correction will decrease accordingly with the amount of deviation in the orientation of the fork-shaped part 25. This is because the control unit 6 corrects the position in the Y-axis direction by rotating the fork-shaped part 25, and if the orientation of the fork-shaped part 25 deviates, the correction in the Y-axis direction will be insufficient, and the position in the X-axis direction will deviate as expected.

[0128] However, in the embodiment, a third detection unit 53 is provided in the cleaning unit 16. Therefore, in the process of correcting the positional deviation of the fork-shaped part 25, the positional deviation of the fork-shaped part 25 can also be corrected by referring to the orientation (tilt angle θ) of the fork-shaped part 25.

[0129] Therefore, according to the embodiment, the centering accuracy when the wafer W is placed in the substrate processing section 72 within the cleaning unit 16 can be improved.

[0130] One possible cause of the positional deviation of the fork-shaped portion 25 is that the base 24 rotates during the horizontal movement of the substrate transport device 17, and this horizontal movement is affected by inertia. In this embodiment, the positional deviation of the fork-shaped portion 25 can be corrected as described above, and therefore, the occurrence of abnormalities in the wafer W's delivery caused by the aforementioned reasons can be suppressed.

[0131] <Wafer Delivery and Processing>

[0132] Next, refer to Figures 12-14 The details of the wafer feeding process into the cleaning unit 16 are explained. Figures 12-14 This is a diagram illustrating the feeding process of the wafer W in the implementation method.

[0133] exist Figure 12 To make it easier to understand, the area including the center points P0 and P1 of the wafer W is enlarged before the dashed arrow. In addition, the position of the edge portion 28Aa of the through hole 28A and the position of the edge portion 28Ba of the through hole 28B, which are detected at the beginning of the intersection of the fork-shaped portion 25, are used as the reference positions for the edge portions 28Aa and 28Ba, respectively.

[0134] First, the control unit 6 positions the base 24 in front of the transfer section 14. With the fork-shaped section 25 in the forward position, the control unit 6 raises the base 24 to transfer the wafer W from the transfer section 14 to the fork-shaped section 25 for holding. Then, the control unit 6 moves the fork-shaped section 25 to the backward position.

[0135] Next, the control unit 6 calculates the position of the center point P1 of the wafer W based on the detection signals from each wafer detection sensor 30, and detects the deviation of the center point P1 from the center point P0 of the wafer W which is maintained at the aforementioned reference holding position.

[0136] The control unit 6 calculates the deviation ΔX1 along the horizontal direction of the first straight line L1 connecting the rotation center of the fork-shaped portion 25 and the center point P1, and the deviation ΔY1 along the horizontal direction of the second straight line L2 orthogonal to the first straight line L1, as specific deviations. This allows the position of the wafer W in the fork-shaped portion 25 to be detected.

[0137] Next, the control unit 6 moves the frame 22 to a predetermined position via the left and right drive units 21 of the substrate transport device 17. That is, the control unit 6 moves the frame 22 by outputting a predetermined encoder value from the motor of the left and right drive units 21. In addition, while the frame 22 is moving, the control unit 6 rotates the fork-shaped part 25 in a predetermined direction.

[0138] Next, in order to feed the wafer W onto the substrate processing unit 72, the control unit 6 controls the substrate transport device 17 to advance and rotate the fork-shaped portion 25. In this embodiment, the advance and rotation of the fork-shaped portion 25 are performed, for example, in parallel.

[0139] At this time, the control unit 6 performs forward movement of the fork-shaped part 25 such that it is positioned at a position offset from the forward set position by an amount corresponding to the deviation ΔX1. Similarly, the control unit 6 performs rotation movement of the fork-shaped part 25 such that it is offset from the set orientation by an amount corresponding to the deviation ΔY1.

[0140] That is, in the implementation method, such as Figure 13 As shown, the fork-shaped part 25 is moved to the aforementioned temporary position and stationary by correcting the deviations ΔX1 and ΔY1 so that the center point P1 of the wafer W is aligned with the rotation axis P2 of the substrate processing unit 72.

[0141] Next, the control unit 6 controls the first detection unit 51, the second detection unit 52 and the third detection unit 53 to detect the positions of the edge portion 28Aa of the through hole 28A, the edge portion 28Ba of the through hole 28B and the edge portion 28Ca of the through hole 28C of the fork-shaped portion 25.

[0142] Furthermore, for the reference position of the edge portion 28Aa of the through hole 28A, the amount corresponding to the deviation ΔX1 is corrected and obtained as the position that should be detected for the edge portion 28Aa of the through hole 28A.

[0143] Similarly, for the reference position of the edge portion 28Ba of the through hole 28B, the amount by which the orientation of the fork portion 25 is changed from the set orientation, that is, the amount corresponding to the deviation amount ΔY1, is obtained as the position that should be detected for the edge portion 28Ba of the through hole 28B.

[0144] Then, for the through hole 28A, the control unit 6 calculates the deviation between the position to be detected and the detected position (hereinafter referred to as ΔX2), and for the through hole 28B, it calculates the deviation between the position to be detected and the detected position (hereinafter referred to as ΔY2). These deviations ΔX2 and ΔY2 are not shown in the figure.

[0145] Here, in the embodiment, before the calculation of the deviation amounts ΔX2 and ΔY2, the control unit 6 calculates the tilt angle θ of the rotation axis of the fork-shaped part 25 relative to the substrate processing unit 72 based on the detected positions of the edge portion 28Ba of the through hole 28B and the edge portion 28Ca of the through hole 28C.

[0146] When calculating the deviations ΔX2 and ΔY2, the control unit 6 uses the tilt angle θ relative to the rotation axis of the fork-shaped portion 25 of the substrate processing unit 72 as a parameter to perform the calculation. This improves the accuracy of the calculation of the deviations ΔX2 and ΔY2.

[0147] Therefore, according to the embodiment, the centering accuracy when placing the wafer W into the substrate processing section 72 within the cleaning unit 16 can be improved.

[0148] Next, the control unit 6 controls the substrate transport device 17 to perform, for example, the forward and backward movement of the fork-shaped portion 25 corresponding to ΔX2 and the rotation of the fork-shaped portion 25 corresponding to ΔY2 in parallel. Thus, the control unit 6 can move the fork-shaped portion 25 such that the center point P1 of the wafer W is located on the rotation axis P2 of the substrate processing unit 72.

[0149] That is, the control unit 6 can be like Figure 14 As shown, the fork-shaped portion 25 is moved from the aforementioned provisional position of the junction to the junction position of the wafer W, which is newly set based on the provisional position and the deviation amounts ΔX2 and ΔY2.

[0150] Next, the control unit 6 raises the lifting pin 76 of the cleaning unit 16 to transfer the wafer W from the fork-shaped part 25 to the lifting pin 76. Then, the control unit 6 sequentially retracts the fork-shaped part 25 and lowers the lifting pin 76, thereby transferring the wafer W to the substrate processing unit 72.

[0151] In addition, although omitted in the above description, before or simultaneously with the wafer W being fed into one fork-shaped section 25, the wafer W held in the substrate processing section 72 is fed out.

[0152] Furthermore, the data required for correcting the position of the fork-shaped part 25 as described above, such as the handover start position and the reference holding position, is pre-stored in the storage unit 7 of the control device 5, and the operation of the fork-shaped part 25 is controlled based on this data.

[0153] As explained above, in this embodiment, the wafer W can be transported in a manner that aligns the center point P1 of the wafer W with the rotation axis P2 of the substrate processing unit 72. Therefore, when the cleaning unit 16 removes the film from the periphery of the wafer W, for example, it can prevent the removed width from deviating from the set value, thereby improving the yield of the wafer W.

[0154] Furthermore, in this embodiment, not only are the first detection unit 51 and the second detection unit 52 provided, but a third detection unit 53 is also provided. Therefore, the positional deviation of the fork-shaped portion 25 can be corrected by referring to the orientation (tilt angle θ) of the fork-shaped portion 25. Thus, according to this embodiment, the centering accuracy when placing the wafer W on the substrate processing unit 72 can be improved.

[0155] Furthermore, in the embodiment, in addition to the second detection unit 52, the third detection unit 53 is also able to detect the position of the fork-shaped portion 25 relative to the substrate processing unit 72 in a direction perpendicular to the travel direction (i.e., the Y-axis direction).

[0156] Therefore, even if a problem occurs with the second detection unit 52, the third detection unit 53 can be used to perform the processing performed by the second detection unit 52. Thus, according to this embodiment, the reliability of the substrate processing system 1 can be improved.

[0157] Furthermore, in this embodiment, the third detection unit 53 can be arranged in a manner that is not aligned with the second detection unit 52 along the Y-axis. This allows for accurate measurement of the distance Ya (referring to...) measured by the second detection unit 52, even when the rotation axis of the fork-shaped portion 25 is tilted. Figure 11 The distance Yb ​​measured by the third detection unit 53 (refer to) Figure 11 ) are values ​​that are different from each other.

[0158] Therefore, according to the embodiment, the tilt angle θ of the rotation axis of the fork-shaped portion 25 relative to the substrate processing portion 72 can be determined with high precision.

[0159] Furthermore, in the embodiment, the first detection unit 51 and the second detection unit 52 are disposed adjacent to the feed inlet 49, and the third detection unit 53 is disposed relative to the substrate processing unit 72 at a position that is inside or outside the first detection unit 51 and the second detection unit 52.

[0160] Therefore, the position and tilt angle θ of the fork-shaped portion 25 during the feeding process of the wafer W into the substrate processing unit 72 can be measured without hindering the feeding process. Thus, according to the embodiment, the wafer W can be smoothly fed into the substrate processing unit 72.

[0161] Furthermore, in this embodiment, the first detection unit 51 to the third detection unit 53 are all optical sensors having light-emitting parts 51a to 53a and light-receiving parts 51b to 53b. Moreover, in this embodiment, when detecting the position of the fork-shaped part 25, the light-emitting parts 51a to 53a and the light-receiving parts 51b to 53b are arranged with the through holes 28A to 28C provided on the fork-shaped part 25 spaced apart.

[0162] Therefore, the position and tilt angle θ of the fork-shaped portion 25 during the feeding process can be measured with high precision without hindering the feeding process. Thus, according to the embodiment, the wafer W can be fed into the substrate processing unit 72 smoothly and with high precision.

[0163] Furthermore, in this embodiment, through holes 28A to 28C corresponding to the first detection unit 51 to the third detection unit 53 are respectively provided in the fork-shaped portion 25. This increases the flexibility in the arrangement of the first detection unit 51 to the third detection unit 53 in the cleaning unit 16 and the flexibility in the arrangement of the through holes 28A to 28C in the fork-shaped portion 25.

[0164] Furthermore, in the embodiment, it is not limited to providing through holes 28A to 28C corresponding to the first detection unit 51 to the third detection unit 53 in the fork-shaped portion 25. Figure 15 This is a plan view showing the first detection unit 51, the second detection unit 52, the third detection unit 53, and the fork-shaped part 25 of the modified example 1 of the embodiment.

[0165] like Figure 15 As shown, in Modification 1, similar to the embodiment, a through hole 28A is provided at a position corresponding to the first detection unit 51, and a through hole 28B is provided at a position corresponding to the second detection unit 52. On the other hand, in Modification 1, the third detection unit 53 is arranged such that light is irradiated onto the edge portion 28Ba of the through hole 28B shared with the second detection unit 52.

[0166] In this case, the position of the fork-shaped portion 25 relative to the substrate processing portion 72 in the X-axis direction, the position in the Y-axis direction, and the tilt angle θ can also be determined by using the first detection unit 51 to the third detection unit 53.

[0167] Figure 16 This is a plan view showing the first detection unit 51, the second detection unit 52, the third detection unit 53, and the fork-shaped part 25 of Modified Example 2 of the embodiment. Figure 16 As shown, in modified example 2, a through hole 28 shared by the first detection part 51 to the third detection part 53 is provided in the fork-shaped part 25.

[0168] In Modification 2, the first detection unit 51 is configured to irradiate light onto the edge portion 28a along the Y-axis direction of the through hole 28, and the second detection unit 52 and the third detection unit 53 are configured to irradiate light onto the edge portion 28b along the X-axis direction of the through hole 28.

[0169] In this case, the position of the fork-shaped portion 25 relative to the substrate processing portion 72 in the X-axis direction, the position in the Y-axis direction, and the tilt angle θ can also be determined by using the first detection unit 51 to the third detection unit 53.

[0170] Furthermore, in the above-described embodiments, the first detection unit 51 to the third detection unit 53 are not limited to optical sensors having light-emitting parts 51a to 53a and light-receiving parts 51b to 53b. For example, CCD (Charge Coupled Device) sensors and CMOS (Complementary Metal Oxide Semiconductor) sensors may also be used to detect the positions of the edge portions 28Aa to 28Ca of the through holes 28A to 28C.

[0171] Furthermore, in the above-described embodiments, the objects detected by the first detection unit 51 to the third detection unit 53 are not limited to the edge portions 28Aa to 28Ca of the through holes 28A to 28C; any object can be used as a marker for detecting the position of the fork-shaped portion 25.

[0172] Furthermore, in the above-described embodiment, the deviation in the Y-axis direction is corrected by rotating the fork-shaped portion 25. However, the position of the fork-shaped portion 25 in the Y-axis direction can also be shifted by moving the frame 22 of the substrate transport device 17 in the Y-axis direction.

[0173] The substrate processing apparatus (substrate processing system 1) of the embodiment includes a substrate processing unit 72, a substrate transport unit (fork-shaped part 25), a first detection unit 51, a second detection unit 52, and a third detection unit 53. The substrate processing unit 72 holds a substrate (wafer W) and processes it. The substrate transport unit (fork-shaped part 25) has a rotation axis and feeds the substrate (wafer W) into the substrate processing unit 72. The first detection unit 51 detects the position of the substrate transport unit (fork-shaped part 25) relative to the substrate processing unit 72 in the travel direction (X-axis direction) when the substrate (wafer W) is fed into the substrate processing unit 72 along the travel direction (X-axis direction). The second detection unit 52 detects the position of the substrate transport unit (fork-shaped part 25) relative to the substrate processing unit 72 in a direction perpendicular to the travel direction (Y-axis direction). The third detection unit 53 detects the tilt of the rotation axis of the substrate transport unit (fork-shaped part 25) relative to the substrate processing unit 72. This improves the centering accuracy when placing the wafer W on the substrate processing unit 72.

[0174] Furthermore, in the substrate processing apparatus (substrate processing system 1) of the embodiment, the third detection unit 53 is arranged in a manner that is not perpendicular to the travel direction (Y-axis direction) relative to the second detection unit 52. As a result, the tilt angle θ of the rotation axis of the fork-shaped part 25 relative to the substrate processing unit 72 can be determined with high accuracy.

[0175] Furthermore, in the substrate processing apparatus (substrate processing system 1) of this embodiment, the first detection unit 51 and the second detection unit 52 are arranged adjacent to the feed inlet 49 of the substrate processing unit 72. Additionally, the third detection unit 53 is positioned relative to the substrate processing unit 72, either inside or outside the first detection unit 51 and the second detection unit 52. This allows the wafer W to be smoothly fed into the substrate processing unit 72.

[0176] Furthermore, in the substrate processing apparatus (substrate processing system 1) of the embodiment, the first detection unit 51, the second detection unit 52, and the third detection unit 53 are all optical sensors having light-emitting parts 51a-53a and light-receiving parts 51b-53b. Moreover, when detecting the position of the substrate transport unit (fork-shaped part 25), the light-emitting parts 51a-53a and the light-receiving parts 51b-53b are arranged across through holes 28A-28C provided on the substrate transport unit (fork-shaped part 25). This allows the wafer W to be smoothly and accurately fed into the substrate processing unit 72.

[0177] Furthermore, in the substrate processing apparatus (substrate processing system 1) of the embodiment, multiple through holes 28A to 28C are provided at positions corresponding to the first detection unit 51, the second detection unit 52, and the third detection unit 53. This increases the flexibility in the arrangement of the first detection unit 51 to the third detection unit 53 in the cleaning unit 16 and in the arrangement of the through holes 28A to 28C in the fork-shaped portion 25.

[0178] <Processing order>

[0179] Next, refer to Figure 17 The order of data input processing in the implementation method is explained. Figure 17 This is a flowchart illustrating the sequence of input processing performed by the substrate processing system 1 in the embodiment.

[0180] First, the control unit 6 controls the wafer detection sensor 30 to detect the positional deviation of the wafer W relative to the fork-shaped portion 25 (step S101). Then, the control unit 6 controls the substrate transport device 17 to move the fork-shaped portion 25 holding the wafer W in the forward direction and send the wafer W into the substrate processing unit 72 in the cleaning unit 16 (step S102).

[0181] Next, the control unit 6 controls the first detection unit 51 to the third detection unit 53 to detect the position (position in the X-axis direction and position in the Y-axis direction) and tilt angle θ of the fork-shaped part 25 relative to the substrate processing unit 72 (step S103). Then, based on the detection values ​​detected by the first detection unit 51 to the third detection unit 53, the control unit 6 calculates the correction amount for the reference position (step S104).

[0182] Next, the control unit 6 operates the substrate transport device 17 based on the calculated correction amount to correct the position of the fork-shaped part 25 relative to the substrate processing unit 72 (step S105). Then, the control unit 6 controls the first detection unit 51 to the third detection unit 53 to detect the position (position in the X-axis direction and position in the Y-axis direction) and tilt angle θ of the fork-shaped part 25 relative to the substrate processing unit 72 (step S106).

[0183] Next, the control unit 6 determines whether the position deviation of the fork-shaped part 25 is within the specified range based on the position (position in the X-axis direction and position in the Y-axis direction) of the fork-shaped part 25 detected by the first detection unit 51 and the second detection unit 52 (step S107).

[0184] Here, if the positional deviation of the fork-shaped part 25 is within the specified range (step S107 is "Yes"), the control unit 6 controls the fork-shaped part 25 and the cleaning unit 16 to place the wafer W on the substrate processing unit 72 (step S108) and complete the processing.

[0185] On the other hand, if the positional deviation of the fork-shaped part 25 is not within the specified range (No in step S107), the process returns to step S104.

[0186] The substrate processing method of this embodiment includes a detection step (step S103), a calculation step (step S104), and a correction step (step S105). In the detection step (step S103), when a substrate (wafer W) is fed into the substrate processing unit 72 along the travel direction (X-axis direction) using a substrate transport unit (fork-shaped part 25) having a rotation axis, the position of the substrate transport unit relative to the substrate processing unit in the travel direction, the position of the substrate transport unit relative to the substrate processing unit in the direction perpendicular to the travel direction (Y-axis direction), and the tilt angle of the rotation axis of the substrate transport unit relative to the substrate processing unit are detected. The calculation step (step S104) calculates a correction amount for the reference position based on the detection values ​​detected in the detection step (step S103). The correction step (step S105) corrects the position of the substrate transport section (fork-shaped section 25) relative to the substrate processing section 72 in the traveling direction and the position of the substrate transport section relative to the substrate processing section in the direction perpendicular to the traveling direction, based on the correction amount calculated in the calculation step (step S104). This improves the centering accuracy when the wafer W is placed on the substrate processing section 72.

[0187] The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments and various modifications can be made without departing from its spirit.

[0188] The embodiments disclosed herein are illustrative in all respects and should not be considered limiting. In fact, the above embodiments can be implemented in various ways. Furthermore, the above embodiments can be omitted, substituted, or modified in various ways without departing from the appended claims and their spirit.

Claims

1. A substrate processing apparatus, characterized in that, include: A substrate processing unit, which holds the substrate and processes the substrate; A substrate transport section having a rotating shaft extending in a vertical direction for feeding the substrate into the substrate processing section; The first detection unit is used to detect the position of the substrate conveying unit relative to the substrate processing unit in the traveling direction when the substrate is fed into the substrate processing unit along the traveling direction; The second detection unit is used to detect the position of the substrate transport unit relative to the substrate processing unit in a direction perpendicular to the travel direction on a horizontal plane. The third detection unit is used to detect the tilt of the rotation axis of the substrate transport unit relative to the substrate processing unit by cooperating with the second detection unit; and The control department that controls all departments. The control unit corrects the positional deviation of the substrate transport unit relative to the reference position based on the detection values ​​detected by the first detection unit, the second detection unit, and the third detection unit. The third detection unit is arranged in a manner that is not perpendicular to the direction of travel relative to the second detection unit.

2. The substrate processing apparatus as described in claim 1, characterized in that: The first detection unit and the second detection unit are arranged adjacent to the feed inlet of the substrate processing unit. The third detection unit is positioned relative to the substrate processing unit, either inside or outside the first and second detection units.

3. The substrate processing apparatus as described in claim 1, characterized in that: The first detection unit, the second detection unit, and the third detection unit are all optical sensors with a light-emitting part and a light-receiving part. When detecting the position of the substrate transport section, the light-emitting part and the light-receiving part are arranged apart from each other by a through hole provided in the substrate transport section.

4. The substrate processing apparatus as described in claim 3, characterized in that: Multiple through holes are provided at positions corresponding to the first detection unit, the second detection unit, and the third detection unit.

5. The substrate processing apparatus as described in claim 1, characterized in that: The control unit, When the substrate is fed into the substrate processing unit by the substrate transport unit, the first detection unit, the second detection unit, and the third detection unit detect the position of the substrate transport unit relative to the substrate processing unit in the travel direction, the position of the substrate transport unit relative to the substrate processing unit in a direction perpendicular to the travel direction, and the inclination of the rotation axis of the substrate transport unit relative to the substrate processing unit. Based on the detection values ​​detected by the first detection unit, the second detection unit, and the third detection unit, a correction amount for the reference position is calculated. Based on the calculated correction amount, the positions of the substrate transport section relative to the substrate processing section in the travel direction and the positions of the substrate transport section relative to the substrate processing section in a direction perpendicular to the travel direction are corrected.

6. A substrate processing method, characterized in that, include: The detection step involves, when a substrate is fed into a substrate processing unit along a travel direction using a substrate transport unit having a rotating shaft extending in the vertical direction, detecting the position of the substrate transport unit relative to the substrate processing unit in the travel direction, the position of the substrate transport unit relative to the substrate processing unit in the horizontal plane in a direction perpendicular to the travel direction, and the inclination of the rotating shaft of the substrate transport unit relative to the substrate processing unit. The calculation step involves calculating a correction amount for the reference position based on each detection value detected in the detection step. and The correction step, based on the correction amount calculated in the calculation step, corrects the position of the substrate transport section relative to the substrate processing section in the travel direction and the position of the substrate transport section relative to the substrate processing section in a direction perpendicular to the travel direction. The position of the substrate transport section relative to the substrate processing section in the travel direction is detected by the first detection section. The position of the substrate transport section relative to the substrate processing section in a direction perpendicular to the travel direction on a horizontal plane is detected by the second detection section. The tilt of the rotation axis of the substrate transport unit relative to the substrate processing unit is detected by the third detection unit in cooperation with the second detection unit. The third detection unit is arranged in a manner that is not perpendicular to the direction of travel relative to the second detection unit.

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