High throughput, multi-chamber substrate processing system

Abstract

A semiconductor processing system includes first, second, and third processing module assemblies. The third processing module assembly is between the first and second processing module assemblies and includes an opening for providing substrates to be processed in the various processing module assemblies. The processing modules are arranged laterally relative to the opening. The first and second processing module assemblies each include an associated transfer chamber, an associated substrate transfer device, and a plurality of associated processing modules attached to the associated transfer chamber. The third processing module assembly can include an associated transfer chamber, an associated substrate transfer device, and a single associated processing module attached to the associated transfer chamber. The processing system is configured to load substrates into the processing module assemblies adjacent to the third processing module assembly in sequence, and finally into the processing module of the third processing module assembly.

Description

Technical Field

[0001] This application relates to substrate processing systems, and more particularly to substrate processing systems having multiple processing chambers. Background Technology

[0002] Manufacturing semiconductor devices, such as in integrated circuit manufacturing, typically involves numerous processes on a substrate (e.g., a semiconductor wafer), including polishing, deposition, etching, photolithography, and thermal processing. Due to stringent quality requirements for the processing results, in some cases these different processes may be performed in dedicated chambers configured to process one substrate at a time. Consequently, processing multiple substrates simultaneously requires a processing system with multiple processing chambers.

[0003] Systems with these multiple chambers are large and require substrate movement within the system, which can limit processing throughput. Therefore, there is a continued need for systems and methods for processing substrates at high throughput in multiple chambers. Summary of the Invention

[0004] In some embodiments, a semiconductor processing system for processing a substrate includes a first processing module assembly, a second processing module assembly, a third processing module assembly, and a controller. The first processing module assembly includes a first transfer chamber containing a first substrate transfer device and a plurality of first processing modules. The first processing modules are attached to and accessible by the first substrate transfer device. The second processing module assembly includes a second transfer chamber containing a second substrate transfer device and a plurality of second processing modules. The second processing modules are attached to and accessible by the second substrate transfer device. The third processing module assembly is disposed between the first and second processing module assemblies. The third processing module assembly includes a third transfer chamber containing a third substrate transfer device, a third processing module attached to and accessible by the third substrate transfer device, and a resealable opening for receiving a substrate from an external environment. A first side of the third processing module assembly is attached to the first processing module assembly, and a second side of the third processing module assembly is attached to the second processing module assembly. The controller is configured to perform the following actions, including: sequentially loading a substrate from a load-locking chamber into a first processing module, a second processing module, and a third processing module using a first substrate transfer device, a second substrate transfer device, and a third substrate transfer device; processing the substrate loaded into the processing module; and unloading the processed substrate from the first processing module and the second processing module using the first substrate transfer device, the second substrate transfer device, and the third substrate transfer device before unloading the processed substrate from the third processing module.

[0005] In some embodiments, processing the substrate includes sequentially starting substrate processing in the processing module while loading other processing modules, upon completion of loading each processing module.

[0006] In some embodiments, unloading the processed substrate includes unloading the substrate sequentially from a first processing module, a second processing module, and then a third processing module.

[0007] In some embodiments, the first processing module component and the second processing module component are attached to the opposite side of the third processing module component.

[0008] In some embodiments, the processing system further includes a load-locking chamber configured to dock with a resealable opening, and a transport chamber including a plurality of loading ports for docking with a substrate carrier. The transport chamber is attached to the load-locking chamber and configured to supply a substrate to the load-locking chamber.

[0009] In some embodiments, the third processing module is attached to the side of the third transfer chamber opposite the resealable opening.

[0010] In some embodiments, sequentially loading the substrate includes transferring the substrate directly from the third substrate transfer device to the first substrate transfer device, and transferring the substrate directly from the third substrate transfer device to the second substrate transfer device.

[0011] In some embodiments, the first substrate transfer device includes a first arm, each first arm having a first end effector; the second substrate transfer device includes a second arm, each second arm having a second end effector; and the third substrate transfer device includes a third arm, each third arm having a third end effector. Each of the first, second, and third end effectors includes two pickup extensions spaced apart from each other, wherein the distance between the two pickup extensions of the third end effector is different from the distance between the two pickup extensions of the first and second end effectors.

[0012] In some embodiments, each of the first and second transfer chambers has a hexagonal shape when viewed from above and includes five sides for docking with the five first processing modules and the five second processing modules, respectively.

[0013] In some embodiments, the load-locking chamber includes a plurality of load-locking stations for accommodating a plurality of substrates.

[0014] In some embodiments, the processing system further includes a first buffer chamber disposed between the first processing module component and the third processing module component, and a second buffer chamber disposed between the second processing module component and the third processing module component.

[0015] In some embodiments, the first buffer chamber and the second buffer chamber include two stations, each configured to accommodate a substrate.

[0016] In some embodiments, the first buffer chamber and the second buffer chamber include four stations, each configured to accommodate a substrate.

[0017] In some embodiments, a semiconductor processing system for processing a substrate includes a first processing module assembly, a second processing module assembly, a third processing module assembly, and a controller. The first processing module assembly includes a first transfer chamber containing a first substrate transfer device and a plurality of first processing modules. The first processing modules are attached to and accessible by the first substrate transfer device. The second processing module assembly includes a second transfer chamber containing a second substrate transfer device and a plurality of second processing modules. The second processing modules are attached to and accessible by the second substrate transfer device. The third processing module assembly is disposed between the first and second processing module assemblies. The third processing module assembly includes a third transfer chamber containing a third substrate transfer device, a third processing module attached to and accessible by the third substrate transfer device, and a resealable opening for receiving a substrate from an external environment. A first side of the third processing module assembly is attached to the first processing module assembly, and a second side of the third processing module assembly is attached to the second processing module assembly. The controller is configured to perform the following actions: loading a substrate into a first processing module and a third processing module during overlapping time; sequentially loading a substrate into the third processing module; processing the substrate loaded into the processing module; unloading the processed substrate from the first processing module and the second processing module during overlapping time; and sequentially unloading the processed substrate from the third processing module.

[0018] In some embodiments, the processing system further includes a load-locking chamber configured to dock with a resealable opening, and a transport chamber including a plurality of loading ports for docking with a substrate carrier. The transport chamber is attached to the load-locking chamber and configured to supply a substrate to the load-locking chamber.

[0019] In some embodiments, each of the first processing module, the second processing module, and the third processing module includes four reaction chambers for processing the substrate.

[0020] In some embodiments, each of the first transfer chamber assembly and the second transfer chamber has a hexagonal shape when viewed from above and includes five portions for docking with the five first processing modules and the five second processing modules, respectively.

[0021] In some embodiments, each of the first substrate transfer device, the second substrate transfer device, and the third substrate transfer device includes four arms.

[0022] In some embodiments, the processing system further includes a first buffer chamber disposed between the first processing module component and the third processing module component, and a second buffer chamber disposed between the second processing module component and the third processing module component.

[0023] In some embodiments, the first buffer chamber and the second buffer chamber include two stations, each configured to accommodate a substrate.

[0024] In some embodiments, the first buffer chamber and the second buffer chamber include four stations, each configured to accommodate a substrate. Attached Figure Description

[0025] Figure 1A This is a schematic plan view of a substrate processing system equipped with multiple horizontally oriented processing module components.

[0026] Figure 1B This is a schematic plan view showing two substrate transfer devices that transfer substrates to each other.

[0027] Figure 2 This is a schematic plan view of a substrate processing system equipped with three vertically oriented processing module components.

[0028] Figure 3 This is a schematic plan view of a substrate processing system equipped with multiple horizontally oriented processing module components and an intermediate buffer chamber.

[0029] Figure 4 This is a schematic plan view showing a substrate processing system with a substrate loading sequence.

[0030] Figure 5 It is a description Figure 4 A table of substrate-loading steps in the substrate loading sequence.

[0031] Figure 6 This is a schematic plan view of a substrate processing system showing the substrate unloading sequence.

[0032] Figure 7 It is a description Figure 6 A table of substrate-unloading steps in the substrate loading sequence.

[0033] Figure 8 It is a graph showing the relationship between substrate processing time and the rate at which the processing module is idle.

[0034] Figure 9 It is an illustrative representation of the use Figure 4 and Figure 6 A diagram illustrating the overall sequence of the substrate processing system.

[0035] Figure 10 It is shown that it is used for Figure 4 Another example of a table showing the substrate-loading steps of a substrate processing system.

[0036] Figure 11 It is shown that it is used for Figure 4 Another example of a table showing the substrate-unloading steps of a substrate processing system.

[0037] Figure 12 This is a schematic plan view of another substrate processing system equipped with multiple processing module components and an intermediate buffer chamber. Detailed Implementation

[0038] In some embodiments, the semiconductor processing system includes horizontally oriented processing module assemblies. Each processing module assembly includes a central transport chamber surrounded by one or more processing modules. Each processing module assembly may each include a reaction chamber for processing a semiconductor substrate (e.g., a semiconductor wafer). The semiconductor processing system may include at least three processing module assemblies that allow substrate communication between them, with a central processing module assembly having a resealable door (e.g., a gate valve) through which a substrate can be supplied for processing in any of the processing module assemblies. In some embodiments, the door may provide an opening to a load-locking chamber, which in turn has a door leading to a transport chamber for receiving a substrate carrier.

[0039] The processing module assemblies are horizontally oriented; in a sense, as units, they are arranged such that they extend laterally across the door of the central processing module assembly. In some embodiments, within a cleanroom, the horizontally oriented processing module assemblies may extend laterally across the cleanroom walls. This contrasts with a processing system having vertically oriented processing module assemblies, in which the processing module assemblies extend in a straight line from the opening of the processing system toward the cleanroom walls.

[0040] As further described herein, the central processing module simply allows for efficient loading and unloading sequences, where substrates can be loaded into adjacent processing module components first. For example, substrates can be loaded sequentially into different processing module components in a coordinated sequence, or they can be loaded into adjacent processing module components simultaneously.

[0041] Advantageously, the horizontally oriented semiconductor processing system disclosed herein can offer one or more advantages. For example, by extending laterally, the semiconductor processing system allows for the addition of a greater number of processing module assemblies compared to a vertically oriented processing system, which might limit the addition of additional processing module assemblies in a vertically oriented system due to the available distance to the rear wall of the cleanroom. This distance may undesirably be smaller than the distance in the lateral dimension. Furthermore, as discussed herein, even with a similar number of processing module assemblies provided in a vertically oriented processing system, the total number of processing modules in a horizontally oriented processing system can be larger, which can increase processing throughput. Additionally, as discussed herein, compared to a vertically oriented processing system where a substrate may need to flow through all processing module assemblies to reach certain processing modules, loading and processing efficiency can be improved because the distance and / or number of substrate handling robots required to move a specific substrate from the substrate carrier to the processing module can be reduced.

[0042] Reference will now be made to the accompanying drawings, in which the same reference numerals always denote the same parts.

[0043] Figure 1A This is a schematic plan view of a substrate processing system 100 equipped with multiple horizontally oriented processing module assemblies 110, 120, and 130. Each processing module assembly 110, 120, and 130 includes one or more processing modules 112, 122, and 132, respectively arranged around a central transfer chamber 115, 125, and 135. Processing modules 112, 122, and 132 may each include multiple reaction chambers 114, 124, and 134 for processing the substrate, with one substrate housed in a dedicated chamber during processing. In the illustrated embodiment, three horizontally oriented processing module assemblies are shown. In other embodiments, the substrate processing system 100 may include a greater number of processing module assemblies, such as four, five, or other processing module assemblies.

[0044] The processing system 100 may further include a controller 180, which may include a hardware microprocessor, microcontroller, programmable logic controller, dedicated hardware, and / or memory, etc. It should be understood that the various hardware components forming the controller 180 may reside in a common location or may be distributed hardware communicating with each other. The controller may be programmed or otherwise configured to perform the various processes described herein. Processes may include, for example, any loading, processing, and / or unloading sequences described herein. In some embodiments, these processes may be programmed into the controller by storing them as instructions in a non-transitory computer-readable medium (e.g., memory). The controller may communicate with and be configured to send instructions to various power supplies, heating systems, pumps, robots (e.g., substrate transport arms), and airflow controllers or valves of the processing system 100 to perform the programmed processes, as will be understood by those skilled in the art.

[0045] Continue to refer to Figure 1A The substrate processing system 100 may include a first processing module assembly 110, a second processing module assembly 120, and a third processing module assembly 130. The substrate processing system 100 may also include a load locking chamber 140 and a transport chamber 150.

[0046] The first processing module assembly 110 may include a plurality of first processing modules 112 and a first transfer chamber 115. Each first processing module 112 may include a plurality of first reaction chambers 114. The first transfer chamber 115 includes a substrate transfer device 118, which may be a transfer arm and may also be referred to as a first transfer arm. The first substrate transfer device 118 is configured to receive a substrate and transfer the substrate to one of the first processing modules 112 or to a third transfer chamber 135. A module door 190 (schematically shown as a pair of rectangular partitions) is provided between each first processing module 112 and the first transfer chamber 115. It should be understood that the module door 190 may be a resealable closure, such as a gate valve, and Figure 1A The number of module doors 190 is for illustrative purposes only and can be changed as needed for sealing between substrate access and volume. A module door 190 for a specific first processing module 112 can be opened when the first substrate transfer device 118 transfers a substrate to or from the first processing module 112. The corresponding module door 190 can be closed after the substrate has been transferred to or removed from the first processing module 112. It should be understood that the operation of the module doors 190, transfer arms, etc., can be controlled by the controller 180.

[0047] In some embodiments, the first processing module assembly 110 may have a hexagonal shape when viewed from above (e.g., in the top plan view shown) and may have a plurality of first processing modules 112, for example, five first processing modules 112. The first processing modules 112 may be attached to one side of the first transfer chamber 115. In some embodiments, each first processing module 112 includes a plurality of first reaction chambers 114, for example, four first reaction chambers 114. As shown, the four first reaction chambers 114 may be arranged in a 2×2 matrix, but it should be understood that other arrangements are also possible. Each first reaction chamber 114 may be used to process a substrate. Preferably, each first reaction chamber 114 is a single-substrate chamber configured to process a single substrate at a time. For example, the first reaction chamber 114 may be sized and have a substrate support configured to accommodate a single substrate. In some embodiments, the first reaction chamber 114 may be a plasma-enhanced chemical vapor deposition (CVD) reaction chamber, a thermal CVD reaction chamber, a plasma-enhanced atomic layer deposition (ALD) reaction chamber, a thermal ALD reaction chamber, an etching reaction chamber, a UV curing reaction chamber, etc. The first reaction chamber 114 may include a commercially available reaction chamber, such as... reaction chamber reaction chamber reaction chamber (e.g.) 2000 and 3000), reaction chamber, and / or The 400 series reaction chambers are available from ASM USA in Phoenix, Arizona, and ASM Europe BV in Almere, Netherlands. Other commercially available reaction chambers include those from ASM Japan KK (Tokyo, Japan), under the trade name... XP and XP8.

[0048] In some embodiments, the first substrate transfer device 118 may be a transfer arm comprising two or more transfer sub-arms. In some embodiments, the main drive portion of each of the two or more transfer sub-arms may have various joint structures, such as a 3-link selective compliant articulated robotic arm (SCARA), a 4-link SCARA, a dual symmetrical arm, a frog-leg / scissor arm, and a linear sliding arm. Each of the two or more transfer sub-arms may include one or more end effectors. For example, each of the two or more transfer sub-arms may include multiple end effectors, such as two end effectors. The number of end effectors may be equal to the number of stations arranged in a matrix in the load locking chamber 140, or equal to... Figure 1A The number of first reaction chambers 114 in a first processing module 112 shown.

[0049] Each first processing module 112 can be connected to the first transfer chamber 115 via a module door 190. The module door 190 can be configured to be opened and closed to provide access to and isolation between the first reaction chamber 114 and the first transfer chamber 115, respectively. For example, after the substrate is transferred into the first reaction chamber 114 and while processing the substrate, the first reaction chamber 114 can be isolated from the first transfer chamber 115. Therefore, a highly controlled processing environment can be maintained in the first reaction chamber 114, and cross-contamination can be prevented.

[0050] Continue to refer to Figure 1A The second processing module assembly 120 may include a plurality of second processing modules 122 and a second transfer chamber 125. Each second processing module 122 may include a plurality of second reaction chambers 124. The second transfer chamber 125 includes a substrate transfer device, which may be a transfer arm and may also be referred to as a second transfer arm. The second transfer device 128 is configured to receive a substrate and transfer the substrate to one of the second processing modules 122 or to a third transfer chamber 135. One or more module gates 190 may be disposed between each second processing module 122 and the second transfer chamber 125. As indicated herein, Figure 1A The number of module doors 190 is for illustrative purposes only and can be changed as needed for sealing between substrate access and volume. Module doors 190 can be opened when the second substrate transfer device 128 transfers a substrate into or out of the second processing module 122 (during loading and unloading, respectively). Module doors 190 can be closed after the substrate has been transferred into or removed from the second processing module 122. The operation of module doors 190, transfer arms, etc., can be controlled by controller 180.

[0051] In some embodiments, the second processing module assembly 120 may have a hexagonal shape when viewed from above (e.g., in the top plan view shown) and may have a plurality of second processing modules 122, for example, five second processing modules 122. The second processing modules 122 may be attached to one side of the second transfer chamber 125. In some embodiments, each second processing module 122 includes a plurality of second reaction chambers 124, for example, four second reaction chambers 124. As shown, the four second reaction chambers 124 may be arranged in a 2×2 matrix, but other arrangements are also possible. Each second reaction chamber 124 may be used to process a substrate. Preferably, each second reaction chamber 124 is a single-substrate chamber configured to process a single substrate at a time. It should be understood that the second reaction chamber 124 may be similar to the first reaction chamber 114. For example, in some embodiments, the first reaction chamber 114 may be a plasma-enhanced chemical vapor deposition (CVD) reaction chamber, a thermal CVD reaction chamber, a plasma-enhanced atomic layer deposition (ALD) reaction chamber, a thermal ALD reaction chamber, an etching reaction chamber, a UV curing reaction chamber, etc. The first reaction chamber 114 may include a commercially available reaction chamber, such as... reaction chamber reaction chamber reaction chamber (e.g.) 2000 and 3000), reaction chamber, and / or The 400 series reaction chambers are available from ASM USA in Phoenix, Arizona, and ASM Europe BV in Almere, Netherlands. Other commercially available reaction chambers include those from ASM Japan KK (Tokyo, Japan), under the trade name... XP and XP8.

[0052] In some embodiments, the second substrate transfer device 128 may be a transfer arm comprising two or more transfer sub-arms. In some embodiments, the main drive portion of each of the two or more transfer sub-arms may have various joint structures, such as a 3-link selectively compliant articulated robotic arm (SCARA), a 4-link SCARA, a dual-symmetric arm, a frog-leg / scissor arm, and a linear sliding arm. Each of the two or more transfer sub-arms may include one or more end effectors. For example, each of the two or more transfer sub-arms may include multiple end effectors, such as two end effectors. The number of end effectors may be equal to the number of stations arranged in a matrix in the load locking chamber 140, or equal to... Figure 1A The number of second reaction chambers 124 in a second processing module 122 shown.

[0053] Each second processing module 122 can be connected to the second transfer chamber 125 via a module door 190. The module door 190 can be configured to be opened and closed to provide access to and isolation between the second reaction chamber 124 and the second transfer chamber 125, respectively. For example, after the substrate is transferred into the second reaction chamber 124 and while processing the substrate, the second reaction chamber 124 can be isolated from the second transfer chamber 125. Therefore, a highly controlled processing environment can be maintained in the second reaction chamber 124, and cross-contamination can be prevented.

[0054] Continue to refer to Figure 1A The third processing module component 130 may include a processing module 132 and a third transfer chamber 135. One or more module doors 190 may be disposed between the third processing module 132 and the third transfer chamber 135. It should be understood that... Figure 1A The number of module doors 190 is for illustrative purposes only and can be changed as needed for substrate access and sealing between volumes. Module doors 190 for the third processing module 132 can be opened when the third substrate transfer device 139 transfers a substrate to or from the third processing module 132. Module doors 190 can be closed after the substrate has been transferred to or removed from the third processing module 132. The operation of module doors 190, transfer arms, etc., can be controlled by controller 180. In some other embodiments, where there is sufficient space in the area of ​​processing module 132 (e.g., the first processing module assembly 110 and processing module assembly 120 are spaced apart from the third processing module assembly 130, for example, by a buffer chamber), processing module 132 can be replaced by an additional processing module assembly having a central transfer chamber and processing modules arranged around that transfer chamber.

[0055] Continue to refer to Figure 1AThe processing module 132 may include a plurality of third reaction chambers 134. In some embodiments, each third processing module 132 includes four third reaction chambers 134. As shown, the four third reaction chambers 134 may be arranged in a 2×2 matrix, but other arrangements are also possible. The third transfer chamber 135 may include a third substrate transfer device 139, which may be a transfer arm and may also be referred to as a third transfer arm. The third substrate transfer device 139 may be configured to receive a substrate and transfer the substrate to the third processing module 132, the first transfer chamber 115, the second transfer chamber 125, or the load locking chamber 140. It should be understood that the third reaction chamber 134 may be similar to the first reaction chamber 114 and the second reaction chamber 124. In some embodiments, the third reaction chamber 134 may be a plasma-enhanced chemical vapor deposition (CVD) reaction chamber, a thermal CVD reaction chamber, a plasma-enhanced atomic layer deposition (ALD) reaction chamber, a thermal ALD reaction chamber, an etching reaction chamber, a UV curing reaction chamber, etc. The first reaction chamber 114 may include a commercially available reaction chamber, such as reaction chamber reaction chamber reaction chamber (e.g.) 2000 and 3000), reaction chamber, and / or The 400 series reaction chambers are available from ASM USA in Phoenix, Arizona, and ASM Europe BV in Almere, Netherlands. Other commercially available reaction chambers include those from ASM Japan KK (Tokyo, Japan), under the trade name... XP and XP8.

[0056] The third substrate transfer device 139 may be a transfer arm comprising two or more transfer sub-arms. In some embodiments, the main drive portion of each of the two or more transfer sub-arms may have various joint structures, such as a 3-link selectively compliant articulated robotic arm (SCARA), a 4-link SCARA, a dual-symmetric arm, a frog-leg / scissor arm, and a linear sliding arm. Each of the two or more transfer sub-arms may include one or more end effectors. For example, each of the two or more transfer sub-arms may include multiple end effectors, such as two end effectors. The number of end effectors may be equal to the number of stations arranged in a matrix in the load locking chamber 140, or equal to... Figure 1A The number of third reaction chambers 134 in the third processing module 132 shown.

[0057] The third processing module 132 can be connected to the third transfer chamber 135 via module door 190. Module door 190 can be configured to close to isolate the third reaction chamber 134 from the third transfer chamber 135. For example, the third reaction chamber 134 can be isolated from the third transfer chamber 135 after the substrate has been transferred into the third reaction chamber 134 and while the substrate is being processed. Therefore, a highly controlled processing environment can be maintained in the third reaction chamber 134, and cross-contamination can be prevented.

[0058] Continue to refer to Figure 1A The load-locking chamber 140 may include a plurality of load-locking stations 142. The transport chamber 150 may include a plurality of loading ports 152 for docking with an external substrate carrier 153, and a plurality of actuators 154, such as robotic arms, for moving substrates from the substrate carrier 153 to the load-locking stations 142. In some embodiments, the transport chamber 150 may be a device front-end module (EFEM). In some embodiments, the substrate carrier 153 is a front-opening assembly box (FOUP). The load-locking chamber 140 connects the third transfer chamber 135 and the transport chamber 150 to each other to provide substrate communication between the third transfer chamber 135 and the transport chamber 150.

[0059] In some embodiments, load locking chamber 140 may be connected to transport chamber 150 via transport door 194 (e.g., gate valve) and to third transfer chamber 135 via load locking door 192 (e.g., gate valve). In some embodiments, transport chamber 150 and third transfer chamber 135 may be connected to opposite sides of load locking chamber 140. Load locking chamber 140 may be configured to provide a vacuum atmosphere approximately equal to the pressure in third transfer chamber 135 when a third substrate transfer device 139 of third transfer chamber 135 loads or unloads a substrate into or from load locking chamber 140. Similarly, the pressure within load locking chamber 140 may be varied to match the pressure in transport chamber 150 when receiving an untreated substrate from transport chamber 150 or returning a treated substrate to transport chamber 150. A plurality of load locking stations 142 may be disposed in load locking chamber 140. As shown, load locking stations 142 may be arranged in a 2×2 matrix, but other arrangements are also possible. The load locking door 192 can be located between the third transfer chamber 135 and the load locking chamber 140. It should be understood that... Figure 1A The number of load locking doors 192 is for illustrative purposes and can be changed. Load locking doors 192 can be opened when the third substrate transfer device 139 transfers a substrate in and out of the load locking chamber 140. Load locking doors 192 can be closed after the substrate has been transferred in and out of the load locking chamber 140. The operation of the load locking doors 192, transfer arms, etc., can be controlled by the controller 180.

[0060] Transport chamber 150 may include a door opener (not shown) for opening and closing the door of loading port 152 to provide access to a robotic arm 154 for transferring substrates between loading port 152 and load locking chamber 140. The robotic arm 154 may move within transport chamber 150, for example, using guide rails to guide the movement of the robotic arm 154. Load port 152 contains substrates in a sealed space (e.g., inside a mating substrate carrier) to protect the substrates from atmospheric impurities or chemical contamination. In some embodiments, two robotic arms 154 are provided, and each robotic arm 154 may include two transfer arms. Thus, four substrates can be transferred simultaneously from loading port 152 to load locking chamber 140. As illustrated, it will be understood that in some embodiments, the number of substrates (e.g., four substrates) that can be transferred simultaneously by robotic arms 154 is equal to the number of load locking stations 142, which in turn is equal to the number of reaction chambers in each processing module of the respective processing module assembly.

[0061] The transport door 194 is located between the transport chamber 150 and the load locking chamber 140. Figure 1A The number of transport doors 194 is for illustrative purposes only and can be changed. Transport doors 194 can be opened when the robotic arm 154 transports a substrate in and out of the load locking chamber 140. Transport doors 194 can be closed when transporting a substrate in and out of the load locking chamber 140. The operation of the load locking door 192, the transport arm, etc., can be controlled by the controller 180.

[0062] Refer again Figure 1AA third processing module assembly 130 may be disposed between the first processing module assembly 110 and the second processing module assembly 120. In some embodiments, a first transfer chamber 115 is attached to a first side 116 of the third transfer chamber 135. A second transfer chamber 125 is attached to a second side 126 of the third transfer chamber 135. The first side 116 and the second side 126 may be opposite each other and substantially parallel to each other. A load locking chamber 140 may be connected to a third side 136 of the third processing module assembly 130. A third processing module 132 may be attached to a fourth side 138 of the third processing module assembly 130. The third side 136 and the fourth side 138 may be opposite each other and substantially parallel to each other. The first side 116 and the second side 126, as well as the third side 136 and the fourth side 138, may be perpendicular to each other. When viewed from the load locking chamber 140, the first, third, and second processing module assemblies 110, 130, and 120 may be arranged in a transverse or horizontal direction. For example, the first, third, and second processing module assemblies 110, 130, and 120 may extend laterally relative to the resealable opening provided by door 192. In some embodiments, as shown, the first, third, and second processing module assemblies 110, 130, and 120 may extend along a line substantially parallel to the resealable opening provided by door 192. In some embodiments, the depth from loading port 152 to the third reaction chamber 132 may be equal to or less than six (6) meters, which may be advantageous for accommodating the processing system 100 in a typical cleanroom environment. Furthermore, although in Figure 1A Three processing module components are shown for the sake of illustration and ease of discussion; however, in some embodiments, the processing system 100 may include four or more processing module components. Preferably, as described above, the four or more processing module components are laterally connected and arranged in a line extending laterally relative to door 192. When four or more processing module components are laterally connected, the length from loading port 152 to the third reaction chamber 132 remains equal to or less than six (6) meters. As a result, flexibility can be provided to expand the processing capacity of the processing system 100, especially since many cleanroom environments can provide greater capacity to accommodate equipment in both lateral and depth dimensions.

[0063] One or more doors 191 may be provided between the first transfer chamber 115 and the third transfer chamber 135, and similar doors 191 may also be provided between the second transfer chamber 125 and the third transfer chamber 135. Figure 1A The number of chamber doors 191 is for illustrative purposes only and can be changed. Chamber doors 191 can be opened when a substrate is transferred from one transfer chamber to another. Chamber doors 191 can be closed after the substrate has been transferred from one transfer chamber to another. The operation of the chamber doors 191, the transfer arm for moving the substrate, etc., can be controlled by the controller 180.

[0064] In some embodiments, substrates can be transferred from one transfer chamber to another by direct substrate switching between transfer arms. Figure 1A This is a schematic plan view showing two transfer arms that directly transfer a substrate to each other. The first transfer arm 200 may include a plurality of arms 210, each arm having an end effector 212. The second transfer arm 300 may include a plurality of arms 310, each arm having an end effector 312. In some embodiments, pairs of transfer arms 200, 300 may correspond to pairs of transfer arms 118, 139 and 128, 339 (FIG. 1). End effectors 212, 312 each include one or more extensions assembled together such that each extension can individually support a substrate. As shown, in some embodiments, the extensions may be rod-shaped, and the distance between the extensions of each end effector 212, 312 may be selected such that the extensions can be staggered when positioned together. In some embodiments, the spacing between the extensions may be adjustable. In some other embodiments, the spacing between the extensions may be fixed.

[0065] like Figure 1B As shown, as an example, the extensions of end effector 212 can be inserted between the extensions of end effector 312, and the substrate can be transferred from one end effector to another. For example, to move the substrate from end effector 312 to end effector 212, the end effector can be configured such that the extension of end effector 212 is between the extensions of end effector 312 and below the substrate seated on end effector 312. Then, end effector 212 can move upward and / or end effector 312 can move downward, such that the substrate rests on end effector 212, and end effector 212 can then move away from the unaffected end effector 312.

[0066] It should be understood that the transverse or horizontally oriented processing module assembly of Figure 1 offers various advantages over processing systems with more conventional vertically oriented processing module assemblies. Figure 1B This is a schematic plan view of a substrate processing system 5 equipped with three vertically oriented processing module assemblies 10, 20, and 30. Figure 2 As shown, each processing module assembly includes multiple processing modules with multiple reaction chambers. When the substrate processing system 5 is equipped with three vertically oriented processing module assemblies 10, 20, and 30, the depth of the manufacturing cleanroom where the processing system 5 is located may limit the number of processing module assemblies that can be accommodated. For example, as shown, the vertically oriented processing system 5 may occupy more than 6m, which is greater than the depth occupied by the processing system in Figure 1. Therefore, it may not be possible to add additional processing module assemblies to the vertically oriented processing system 5. In addition, the substrate processing system 5 has nine processing modules, while the substrate processing system 100 (Figure 2 It has 11 processing modules. Therefore, even if the two processing systems contain an equal number of processing module components, the number of substrate processing systems 5 that can perform processing is greater than that of the other two systems. Figure 1A The substrate processing system in the middle is 100 small.

[0067] Figure 1A This is a schematic plan view of a substrate processing system 200 equipped with three processing module assemblies 110, 120, and 130. The substrate processing system 200 includes a first processing module assembly 110, a second processing module assembly 120, a third processing module assembly 130, a first buffer chamber 160, and a second buffer chamber 170. The substrate processing system 200 may also include a load locking chamber 140 and a transport chamber 150. The substrate processing system 100 is similar to the substrate processing system 100, except that it has features specific for substrate processing systems 100, 160, and 170. Figure 3 The system 100 shown has the same functions and configuration as described.

[0068] A first buffer chamber 160 is disposed between the first processing module assembly 110 and the third processing module assembly 130. The first buffer chamber 160 isolates the first transfer chamber 115 from the third transfer chamber 135. The first buffer chamber 160 may include a plurality of stations 165 for receiving substrates to be transferred between the first transfer chamber 115 and the third transfer chamber 135. The number of stations 165 may vary depending on the configuration of the system 100. For example, as... Figure 1A As shown, the total number of stations 165 can be two (2), although other numbers of stations can be provided. Therefore, two substrates can be transferred simultaneously, for example, during overlapping periods. The first buffer chamber 160 can temporarily store substrates while the first substrate transfer device 118 or the third substrate transfer device 139 transports other substrates. For example, when a substrate is transferred from the load locking chamber 140 to one of the first processing modules 112, the third substrate transfer device 139 transfers the substrate from the load locking chamber 140 and places it in station 165 of the first buffer chamber 160, and then the first substrate transfer device 118 transfers the substrate from station 165 to one of the first processing modules 112. In some embodiments, the first buffer chamber 260 can be configured to provide a high vacuum function, a degassing function, or a heating function.

[0069] A second buffer chamber 170 is disposed between the second processing module assembly 120 and the third processing module assembly 130. The second buffer chamber 170 can isolate the second transfer chamber 125 and the third transfer chamber 135. The second buffer chamber 170 may include a plurality of stations 175 for accommodating a substrate. The number of stations 175 can vary depending on the configuration of the system 100. For example, as... Figure 3As shown, the total number of stations 175 can be two (2), although other numbers of stations may be provided. The second buffer chamber 170 may temporarily store substrates while the second substrate transfer device 128 or the third substrate transfer device 139 transports other substrates. For example, when a substrate is transferred from the load locking chamber 140 to one of the second processing modules 122, the third substrate transfer device 139 transfers the substrate from the load locking chamber 140 and places the substrate in station 175 of the second buffer chamber 170, and then the second substrate transfer device 128 transfers the substrate from station 175 to one of the second processing modules 122. In some embodiments, the second buffer chamber 170 may be configured to provide a high vacuum function, a degassing function, or a heating function.

[0070] As described above, buffer chambers 160 and 170 may include various numbers of stations 165 and 175. Figure 3 This is a schematic plan view of another substrate processing system 300 equipped with three processing module components 110, 120, and 130. The substrate processing system 300 is similar to... Figure 12 The substrate processing system 200, in addition to the first buffer chamber 260 and the second buffer chamber 270 (which can replace the first buffer chamber 160 and the second buffer chamber 170 respectively), has features specific for... Figure 3 The system 200 shown has the same functions and configuration as described. For example... Figure 3 As shown, the total number of stations 265 and 275 in the first buffer chamber 260 and the second buffer chamber 270 can be four (4). Therefore, four substrates can be moved into and out of the buffer chambers 260 and 270 simultaneously.

[0071] Figure 12 yes Figure 4 A schematic plan view of the substrate processing system 200, with arrows indicating the movement of the substrate to illustrate the substrate loading sequence. Figure 3 It is a description Figure 5 A table of substrate-loading steps in the substrate loading sequence. As described herein, the actions used to perform the loading sequence can be controlled by controller 180.

[0072] In some embodiments, such as Figure 4 and 5 As shown, the number of processing modules can be 11, each with 4 reaction chambers, and the number of substrates that can be processed can be 44, i.e., one processing module with four substrates. Other arrangements with different numbers of processing modules and / or different numbers of reaction chambers per processing module are also possible. For ease of discussion, as shown in the figure, Figure 4The processing modules are identified as 1-1, 1-2, 1-3, 1-4, 1-5, 2-1, 2-2, 2-3, 2-4, 2-5, and 3-1. Substrate 1-44 is transferred from loading port 152 to the corresponding processing modules 1-1, 1-2, 1-3, 1-4, 1-5, 2-1, 2-2, 2-3, 2-4, 2-5, and 3-1 via transport chamber 150, load locking chamber 240, and first buffer chamber 160 or second buffer chamber 170. Since the number of stations 165 and 175 in the corresponding buffer chambers 160 and 170 can be two (2), two substrates can be transferred to the first transport chamber 115 or the second transport chamber 125 at once. For Figure 4 The first row indicates the loading step (e.g., steps 1-25) or time, and the first column indicates the position of the substrate at that step or time. The numbers in the format "a, b" in each entry of the table represent specific pairs of substrates, allowing the table to be understood as depicting the positions of paired substrates within the processing system after performing a specific sequence of steps. Each step indicates the movement of the substrate from the position indicated in the previous higher row to the position indicated in the row containing the specific number pair. It should be understood that the time elapsed in a single step may vary or be the same as in other steps, depending on the time required to move the substrate from one indicated position to another.

[0073] For example, refer to Figure 5 The substrate 1-20 to be processed in processing modules 1-1, 1-2, 1-3, 1-4, and 1-5 is transported via transport chamber 150, load locking chamber 140, third transfer chamber 135, first buffer chamber 160, and first transfer chamber 115. Figure 5 The substrates 21-40 to be processed in processing modules 2-1, 2-2, 2-3, 2-4, and 2-5 are sequentially transferred to the corresponding processing modules 1-1, 1-2, 1-3, 1-4, and 1-5. The substrates 21-40 are transferred via transfer chamber 150, load locking chamber 140, third transfer chamber 135, second buffer chamber 170, and second transfer chamber 125. Figure 4 The substrates 41-44 to be processed in processing module 3-1 are sequentially transferred to the corresponding processing modules 2-1, 2-2, 2-3, 2-4, and 2-5. The substrates 41-44 to be processed in processing module 3-1 are transferred via transport chamber 150, load locking chamber 140, and third transfer chamber 135.

[0074] from Figure 4As can be seen, a total of 25 steps can be performed until all 44 substrates are transferred to their respective processing modules. In some embodiments, in step 24, substrates 37-38 and 41-42 can be transferred simultaneously to processing modules 2-5 and 3-1 respectively, because substrates 41-42 can be transferred from the third transfer chamber 135 to processing module 3-1 without obstruction by the movement of other substrates. In step 25, substrates 39-40 and 43-44 can be transferred simultaneously to processing modules 2-5 and 3-1 respectively, because substrates 43-44 can be transferred from the third transfer chamber 135 to processing module 3-1 without obstruction by the movement of other substrates. Furthermore, the third substrate transfer device 139 has four arms, which facilitates the transfer of substrates 41-44.

[0075] from Figure 5 As can be seen, the substrate is transferred to either the first transfer chamber 115 or the second transfer chamber 125 via a third transfer chamber 135, which is located between the first transfer chamber 115 and the second transfer chamber 125. Therefore, the substrate does not need to traverse the first transfer chamber 115, the second transfer chamber 125, and the third transfer chamber 135 multiple times, which is consistent with... Figure 4 This differs from conventional vertically oriented processing module assemblies, where the substrate of the furthest processing module assembly may require traversing two separate transfer chambers to reach it. This offers advantages compared to processing systems with more conventional vertically oriented processing module assemblies. For example, the number of transfer steps can be reduced.

[0076] Figure 2 This is a schematic plan view of a substrate processing system 200 showing a substrate unloading sequence. Figure 6 It is a description Figure 7 A table of substrate-unloading steps in the substrate loading sequence. In some embodiments, such as Figure 6 and Figure 6 As shown, after processing is completed in the corresponding processing modules 1-1, 1-2, 1-3, 1-4, 1-5, 2-1, 2-2, 2-3, 2-4, 2-5, and 3-1, the substrate 1-44 is sequentially transferred from the corresponding processing modules 1-1, 1-2, 1-3, 1-4, 1-5, 2-1, 2-2, 2-3, 2-4, 2-5, and 3-1 to the loading port 152 via the transfer chamber 150, the load locking chamber 240, and the first buffer chamber 160 or the second buffer chamber 170.

[0077] For example, substrate 1-20 in processing modules 1-1, 1-2, 1-3, 1-4, and 1-5 is transferred to loading port 152 via first transfer chamber 115, first buffer chamber 160, third transfer chamber 135, load locking chamber 140, and transfer chamber 150. Substrate 21-40 in processing modules 2-1, 2-2, 2-3, 2-4, and 2-5 is transferred to loading port 152 via second transfer chamber 125, second buffer chamber 170, third transfer chamber 135, load locking chamber 140, and transport chamber 150. Substrate 41-44 in processing module 3-1 is transferred to loading port 152 via third transfer chamber 135, load locking chamber 140, and transport chamber 150. Substrate 41-44 waits in processing module 3-1' until third chamber 135 is available after processing is complete. Figure 7 As can be seen, a total of 27 steps can be performed until all 44 substrates are transferred to loading port 152.

[0078] Figure 7 It is a graph showing the relationship between substrate processing time and the rate at which the processing module is idle. Figure 8 It is an illustrative representation of the use Figure 9 and Figure 4 A diagram illustrating the overall sequence of the substrate processing system 200. Figure 6 The X-axis represents the processing cycle time within the processing module. The processing cycle time can vary depending on the type of processing being performed. Figure 8 The Y-axis represents the percentage of the total processing cycle time during which the processing module controls and waits for the substrate to be processed. (Reference) Figure 8 The total processing cycle time can be defined as the time period during which a substrate is loaded into the processing module, processed within the processing module, unloaded from the processing module, and until a new substrate is loaded into the processing module. The duration of processing on the substrate within the processing module can vary depending on the processing to be performed. However, due to the configuration of the substrate processing system and the steps required to move the substrate within the system, the duration of transferring a substrate out of the processing module and transferring a new substrate into the processing module is fixed. Therefore, as the processing time increases, such as Figure 9 As shown, the percentage of processing cycle time during which the processing module is idle and waiting for the next substrate to be processed is reduced. For example, when the processing time is approximately thirty-eight (38) minutes, the percentage of processing cycle time for the processing module that is about to receive a new substrate for processing may be less than ten percent (10). When the processing time is approximately eighty-two (82) minutes, the percentage of processing cycle time for the processing module that is about to receive a new substrate for processing may be less than five percent (5).

[0079] Figure 8 It is shown that it is used for Figure 10Another example of a table showing the substrate-loading steps of a substrate processing system. (See reference...) Figure 4 The first substrate transfer device 118 and the second substrate transfer device 128 can transfer substrates simultaneously (or at overlapping times). For example, processing modules of the first processing module assembly 110 and the second processing module assembly 120 can be loaded simultaneously. In some embodiments, the transfer arm 154 picks up four substrates from the loading port 152 and transfers them to the load locking chamber 142. The third substrate transfer device 139 picks up four substrates from the load locking chamber 140 and transfers two substrates to the first buffer chamber 160 and the second buffer chamber 170, respectively. The first substrate transfer device 118 and the second substrate transfer device 128 pick up two substrates from the first buffer chamber 160 and the second buffer chamber 170, respectively. The first substrate transfer device 118 and the second substrate transfer device 128 transfer two substrates to the corresponding processing modules of the first processing module assembly 110 and the second processing module assembly 120, respectively. Therefore, as Figure 4 As shown, substrates can be transferred to processing modules 1-1, 1-2, 1-3, 1-4, 1-5, 2-1, 2-2, 2-3, 2-4, and 2-5 at approximately the same (or overlapping) time. In steps 11-14, all four substrates 41-44 can be transferred to processing module 3-1 together, since substrate transfer device 139 can be used to transfer the four substrates 41-44 directly to processing module 3-1. Because processing module 3-1 may fill the four substrates faster than processing modules 1-5 and 2-5, processing in processing module 3-1 may begin earlier than processing in processing modules 1-5 and 2-5. In this embodiment, a total of 15 steps can be performed until all 44 substrates are transferred to their respective processing modules.

[0080] Figure 10 It is a description Figure 11 A table showing the substrate-unloading steps of the substrate processing system. (See table below.) Figure 6 As explained in the diagram, the first substrate transfer device 118 and the second substrate transfer device 128 can transfer substrates at approximately the same (or overlapping) time. If all processing in each processing module takes approximately the same amount of time, the processing in module 3-1 may complete earlier than the processing in modules 1-5 and 2-5, because the processing in processing module 3-1 may begin earlier than the processing in processing modules 1-5 and 2-5, as referenced. Figure 10 Figure 10In some embodiments, in steps 8-12, the third transfer chamber 135 can be used to transfer substrates from processing modules 1-4, 2-4 (and 1-5, 2-5), and the substrates in processing module 3-1 can remain in processing module 3-1, even after processing in processing module 3-1 is completed, until the transfer of substrates in processing modules 1-4, 3-4 (and 1-5, 2-5) is completed. Therefore, processing with a longer processing time can be performed in processing module 3-1. In this embodiment, a total of 16 steps can be performed until all 44 substrates are transferred to their respective processing modules.

[0081] Although the invention has been illustrated with reference to some embodiments in the foregoing description, the invention is not limited thereto. In fact, various modifications of the invention will become apparent to those skilled in the art from the foregoing description, in addition to those shown and described herein, and fall within the scope of the appended claims. In all disclosed embodiments, any element used in some embodiments may be used interchangeably or additionally in another embodiment, unless such substitution is impractical, or would have an adverse effect or prevent it from being used for its intended purpose. For all purposes, all publications, patents, and patent applications cited herein are incorporated herein by reference in their entirety to the same extent that each individual publication, patent, or patent application is specifically and individually indicated to be incorporated herein by reference. Further details of the invention are provided in the following non-limiting examples.

[0082] Throughout this application, unless otherwise expressly stated, the use of the singular includes the plural. The use of "or" in this application includes "and / or" unless otherwise expressly stated. Furthermore, the terms "comprising," "including," and "containing" are not restrictive.

Claims

1. A semiconductor processing system for processing a substrate, the processing system comprising: The first processing module components include: A first transfer chamber, comprising a first substrate transfer device; and Multiple first processing modules, each of which is attached to the first transfer chamber and accessible by the first substrate transfer device; The second processing module component includes: A second transfer chamber, comprising a second substrate transfer device; and Multiple second processing modules, each of which is attached to the second transfer chamber and accessible by the second substrate transfer device; A third processing module component is located between the first processing module component and the second processing module component, the third processing module component comprising: The third transfer chamber includes a third substrate transfer device; A third processing module, which is attached to the third transfer chamber and accessible by the third substrate transfer device; and A resealable opening for receiving a substrate from the external environment. The first side of the third processing module component is attached to the first processing module component, and the second side of the third processing module component is attached to the second processing module component; and The controller is configured to perform the following actions, including: The first substrate transfer device, the second substrate transfer device and the third substrate transfer device are used to sequentially load the substrate from the load locking chamber into the first processing module, the second processing module and the third processing module; Processing the substrate loaded into the processing module; and Before unloading the processed substrate from the third processing module, the first substrate transfer device, the second substrate transfer device, and the third substrate transfer device are used to unload the processed substrate from the first processing module and the second processing module.

2. The processing system of claim 1, wherein the processing substrate includes, upon completion of loading each processing module, sequentially starting the processing substrate in the processing module while simultaneously loading other processing modules.

3. The processing system of claim 1, wherein unloading the processed substrate comprises unloading the substrate sequentially from the first processing module, the second processing module, and then the third processing module.

4. The processing system of claim 1, wherein the first processing module component and the second processing module component are attached to opposite sides of the third processing module component.

5. The processing system of claim 1, further comprising: A load-locking chamber configured to dock with the resealable opening; as well as The transport chamber includes multiple loading ports for docking with a substrate carrier, wherein the transport chamber is attached to the load-locking chamber and configured to provide a substrate to the load-locking chamber.

6. The processing system of claim 1, wherein the third processing module is attached to the side of the third transfer chamber opposite to the resealable opening.

7. The processing system of claim 1, wherein each of the first processing module, the second processing module and the third processing module includes four reaction chambers for processing the substrate.

8. The processing system of claim 1, wherein sequentially loading the substrate comprises: The substrate is directly transferred from the third substrate transfer device to the first substrate transfer device; as well as The substrate is directly transferred from the third substrate transfer device to the second substrate transfer device.

9. The processing system of claim 1, wherein the first substrate transfer device includes first arms, each first arm having a first end effector. The second substrate transfer device includes second arms, each second arm having a second end effector, and The third substrate transfer device includes a third arm, each third arm having a third end effector. Each of the first end effector, the second end effector, and the third end effector includes two pickup extensions spaced apart from each other, wherein the distance between the two pickup extensions of the third end effector is different from the distance between the two pickup extensions of the first end effector and the second end effector.

10. The processing system of claim 1, wherein each of the first and second transfer chambers has a hexagonal shape when viewed from above and includes five sides for docking with the five first processing modules and the five second processing modules, respectively.

11. The processing system of claim 1, wherein the load locking chamber comprises a plurality of load locking stations for accommodating a plurality of substrates.

12. The processing system of claim 1, further comprising a first buffer chamber disposed between the first processing module component and the third processing module component, and a second buffer chamber disposed between the second processing module component and the third processing module component.

13. The processing system of claim 12, wherein the first buffer chamber and the second buffer chamber comprise two stations, each configured to respectively contain a substrate.

14. The processing system of claim 12, wherein the first buffer chamber and the second buffer chamber comprise four stations, each configured to respectively contain a substrate.

15. A semiconductor processing system for processing a substrate, the processing system comprising: The first processing module components include: A first transfer chamber, comprising a first substrate transfer device; and Multiple first processing modules, each of which is attached to the first transfer chamber and accessible by the first substrate transfer device; The second processing module component includes: A second transfer chamber, comprising a second substrate transfer device; and Multiple second processing modules, each of which is attached to the second transfer chamber and accessible by the second substrate transfer device; A third processing module component is located between the first processing module component and the second processing module component, the third processing module component comprising: The third transfer chamber includes a third substrate transfer device; A third processing module, which is attached to the third transfer chamber and accessible by the third substrate transfer device; and A resealable opening for receiving a substrate from the external environment. The first side of the third processing module component is attached to the first processing module component, and the second side of the third processing module component is attached to the second processing module component; and The controller is configured to perform the following actions, including: The substrate is loaded into the first processing module and the second processing module during the overlapping time. The substrate is loaded into the third processing module in sequence; The substrate loaded into the processing module is processed; The processed substrate is unloaded from the first processing module and the second processing module during overlapping time; and The processed substrate is unloaded sequentially from the third processing module.

16. The processing system of claim 15, further comprising: A load-locking chamber configured to dock with the resealable opening; as well as The transport chamber includes multiple loading ports for docking with a substrate carrier, wherein the transport chamber is attached to the load-locking chamber and configured to provide a substrate to the load-locking chamber.

17. The processing system of claim 15, wherein each of the first processing module, the second processing module, and the third processing module comprises four reaction chambers for processing the substrate.

18. The processing system of claim 15, wherein each of the first and second transfer chambers has a hexagonal shape when viewed from above and includes five portions for docking with the five first processing modules and the five second processing modules, respectively.

19. The processing system of claim 15, wherein each of the first substrate transfer device, the second substrate transfer device, and the third substrate transfer device comprises four arms.

20. The processing system of claim 15, further comprising a first buffer chamber disposed between the first processing module component and the third processing module component, and a second buffer chamber disposed between the second processing module component and the third processing module component.

21. The processing system of claim 20, wherein the first buffer chamber and the second buffer chamber comprise two stations, each configured to accommodate a substrate.

22. The processing system of claim 20, wherein the first buffer chamber and the second buffer chamber comprise four stations, each configured to accommodate a substrate.

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