An ARM CPU computing module connection structure

Abstract

The present invention discloses a connection structure for an ARM CPU computing module, which includes a first ultra-thin backplane, a second ultra-thin backplane, a first computing module and a second computing module. One end of the first ultra-thin backplane is positioned and installed with a first connector, and a first connection terminal is arranged outside the first connector. One end of the second ultra-thin backplane is positioned and connected with a second connector, and a second connection terminal is arranged outside the second connector. First positioning and installation holes are opened at two corners on one side of the first ultra-thin backplane, and second positioning and installation holes are opened at two corners on one side of the second ultra-thin backplane. The connection structure for the ARM CPU computing module of the present invention uses the connection method of two ultra-thin backplane interfaces, the connection is simpler and faster, which is convenient for the computing module to perform connection operations more quickly, improves work efficiency, and has a built-in microchip module with a computing power of 0.8 Tops, and can support one-key model conversion.

Description

Technical Field

[0001] The present invention relates to the field of computing modules, and in particular to an ARM CPU computing module connection structure. Background Art

[0002] The computing module connection structure is a supporting structure for the electrical connection of the computing module. When the computer is in use, the application of the internal computing module is indispensable. It includes an ARM CPU computing module that can quickly respond to and process computer data. With the continuous development of science and technology, people's requirements for the manufacturing process of the computing module connection structure are getting higher and higher.

[0003] The existing computing module connection structure has certain disadvantages when in use. First, when in use, the internal structure of the computing module is relatively complex and cannot be connected very conveniently, which is not conducive to people's use. In addition, the thickness is relatively thick when connecting, which is not convenient for packaging, which brings certain adverse effects to people's use process. For this reason, we propose an ARM CPU computing module connection structure. Summary of the Invention

[0004] (1) Technical problems solved

[0005] In response to the shortcomings of the existing technology, the present invention provides an ARM CPU computing module connection structure, which uses two ultra-thin sinking plate interface connection methods, making the connection simpler and faster, facilitating the computing module to perform connection operations more quickly, improving work efficiency, and has a built-in microchip with a computing power of 0.8Tops, which can support one-click model conversion and can effectively solve the problems in the background technology.

[0006] (2) Technical solution

[0007] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: an ARM CPU computing module connection structure, comprising a No. 1 ultra-thin sinking plate, a No. 2 ultra-thin sinking plate, a No. 1 computing module and a No. 2 computing module, wherein one end of the No. 1 ultra-thin sinking plate is positioned and installed with a No. 1 connector, and a No. 1 connecting terminal is provided on the outer side of the No. 1 connector; one end of the No. 2 ultra-thin sinking plate is positioned and connected with a No. 2 connector, and a No. 2 connecting terminal is provided on the outer side of the No. 2 connector; a No. 1 positioning mounting hole is provided at two corners of one side of the No. 1 ultra-thin sinking plate; a No. 2 positioning mounting hole is provided at two corners of one side of the No. 1 ultra-thin sinking plate; a No. 2 positioning mounting hole is provided at two corners of one side of the No. 2 ultra-thin sinking plate; and plug-in slots are provided on the inner sides of the No. 2 connecting terminal and the No. 1 connecting terminal;

[0008] Inside the first computing module, there are a first module chip, a first ground wire, a first power module, a first data processing module, a first signal transmission module, and a first connection module. The first connection module is located at the position connecting the first signal transmission module. The first signal transmission module is located at the positions connecting the first data processing module and the first module chip. The first data processing module is connected to the first module chip. The first module chip is connected to the first ground wire and the first power module;

[0009] Inside the second computing module, there are a second connection module, a second data processing module, a second signal transmission module, a second power module, a second module chip, and a second ground wire. The second connection module is located at the position connecting the second signal transmission module. The second signal transmission module is located at the positions connecting the second data processing module and the second module chip. The second data processing module is connected to the second module chip. The second module chip is located at the position connecting the second ground wire and the second power module;

[0010] One end of the first ultra-thin backplane is electrically connected to one end of the second ultra-thin backplane through a first connector, a first connection terminal, a second connector, and a second connection terminal.

[0011] As a preferred technical solution of this application, there are welding holes between the first computing module and the first module chip. The middle part of the first computing module is fixedly connected to the lower end of the first module chip through the welding holes. The first module chip is electrically connected to the first ground wire, the first power module, the first data processing module, and the first signal transmission module.

[0012] As a preferred technical solution of this application, there is a welding position between the second computing module and the second module chip. The outer surface of the second computing module is welded to the lower end of the second module chip through the welding position. The second module chip is electrically connected to the second data processing module, the second signal transmission module, the second ground wire, and the second power module.

[0013] As a preferred technical solution of this application, there is a wire between the first connection module and the second connection module. The first connection module and the second connection module are electrically connected through the wire. One end of the first computing module is electrically connected to one end of the second computing module through the second connection module and the first connection module.

[0014] (III) Beneficial effects

[0015] Compared with the prior art, the present invention provides a connection structure for an ARM CPU computing module, which has the following beneficial effects: This connection structure for an ARM CPU computing module uses two ultra-thin daughter board interface connection methods, making the connection simpler and faster, facilitating the computing module to perform connection operations more quickly, improving work efficiency. It has a built-in microchip with a computing power of 0.8 Tops, and can support one-key model conversion. One end of the first ultra-thin daughter board is electrically connected to one end of the second ultra-thin daughter board through a first connector, a second connection terminal, a second connector, and a second connection terminal. It has a built-in microchip with a computing power of 0.8 Tops, and the RK3568 structure can support one-key model conversion. Inside the first computing module, there are a first module chip, a first ground wire, a first power module, a first data processing module, a first signal transmission module, and a first connection module. The first connection module is connected to the first signal transmission module, the first signal transmission module is connected to the first data processing module and the first module chip, the first data processing module is connected to the first module chip, and the first module chip is connected to the first ground wire and the first power module, facilitating the first computing module to perform operations on data signals. Inside the second ground wire, there are a second connection module, a second data processing module, a second signal transmission module, a second power module, a second module chip, and a second ground wire. The second connection module is connected to the second signal transmission module, the second signal transmission module is connected to the second data processing module and the second module chip, the second data processing module is connected to the second module chip, and the second module chip is connected to the second ground wire and the second power module, facilitating the second ground wire to perform operations on data signals. There is a wire between the first connection module and the second connection module, and the first connection module and the second connection module are electrically connected through the wire. One end of the first computing module is electrically connected to one end of the second ground wire through the second connection module and the first connection module, facilitating a faster connection between the two modules and improving the operation rate. The entire computing module connection structure is simple in structure, convenient to operate, and has a better effect than the traditional method. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 1 is a schematic diagram of the overall structure of a connection structure for an ARM CPU computing module according to the present invention.

[0017] Figure 2 FIG. 2 is a schematic diagram of the overall second structure of a connection structure for an ARM CPU computing module according to the present invention.

[0018] Figure 3 FIG. 3 is a schematic diagram of the side view structure of a connection structure for an ARM CPU computing module according to the present invention.

[0019] Figure 4 FIG. 4 is a schematic diagram of the structure of the second ultra-thin daughter board of a connection structure for an ARM CPU computing module according to the present invention.

[0020] Figure 5 This is a schematic diagram of the structure of the first ultra-thin backplane in the connection structure of an ARM CPU computing module according to the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of the connection module block diagram in the connection structure of an ARM CPU computing module according to the present invention.

[0022] In the figure: 1. The first ultra-thin backplane; 2. The first connector; 3. The first positioning and mounting hole; 4. The second ultra-thin backplane; 5. The second connector; 6. The second connection terminal; 7. The second positioning and mounting hole; 8. The first connection terminal; 9. The insertion slot; 10. The first computing module; 11. The first module chip; 12. The first ground wire; 13. The first power module; 14. The first data processing module; 15. The first signal transmission module; 16. The first connection module; 17. The second connection module; 18. The second data processing module; 19. The second signal transmission module; 20. The second power module; 21. The second module chip; 22. The second ground wire; 23. The second computing module. Detailed implementation manners

[0023] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings and specific implementation manners. However, those skilled in the art will understand that the following described embodiments are some embodiments of the present invention, rather than all embodiments, and are only used to illustrate the present invention and should not be construed as limiting the scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts fall within the scope of protection of the present invention. For those conditions not specified in the embodiments, they are carried out according to the conventional conditions or the conditions recommended by the manufacturer. Those reagents or instruments not specified by the manufacturer can be obtained as conventional products through commercial purchase.

[0024] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Embodiment

[0026] As Figures 1-6 shown, an ARM CPU computing module connection structure includes a first ultra-thin backplane 1, a second ultra-thin backplane 4, a first computing module 10, and a second computing module 23. One end of the first ultra-thin backplane 1 is positioned and installed with a first connector 2, and a first connection terminal 8 is arranged outside the first connector 2. One end of the second ultra-thin backplane 4 is positioned and connected with a second connector 5, and a second connection terminal 6 is arranged outside the second connector 5. Two first positioning and installation holes 3 are opened at two corners on one side of the first ultra-thin backplane 1, and two second positioning and installation holes 7 are opened at two corners on one side of the second ultra-thin backplane 4. Plugging slots 9 are opened inside both the second connection terminal 6 and the first connection terminal 8.

[0027] Furthermore, one end of the first ultra-thin backplane 1 is electrically connected to one end of the second ultra-thin backplane 4 through the first connector 2, the first connection terminal 8, the second connector 5, and the second connection terminal 6. Embodiment

[0028] Based on Embodiment 1, as Figures 1-6 shown, an ARM CPU computing module connection structure includes a first ultra-thin backplane 1, a second ultra-thin backplane 4, a first computing module 10, and a second computing module 23. One end of the first ultra-thin backplane 1 is positioned and installed with a first connector 2, and a first connection terminal 8 is arranged outside the first connector 2. One end of the second ultra-thin backplane 4 is positioned and connected with a second connector 5, and a second connection terminal 6 is arranged outside the second connector 5. Two first positioning and installation holes 3 are opened at two corners on one side of the first ultra-thin backplane 1, and two second positioning and installation holes 7 are opened at two corners on one side of the second ultra-thin backplane 4. Plugging slots 9 are opened inside both the second connection terminal 6 and the first connection terminal 8.

[0029] Further, inside the first computing module 10, there are a first module chip 11, a first ground wire 12, a first power module 13, a first data processing module 14, a first signal transmission module 15, and a first connection module 16. The first connection module 16 is connected to the first signal transmission module 15. The first signal transmission module 15 is connected to the first data processing module 14 and the first module chip 11. The first data processing module 14 is connected to the first module chip 11. The first module chip 11 is connected to the first ground wire 12 and the first power module 13.

[0030] Further, there are welding holes provided between the first computing module 10 and the first module chip 11. The middle part of the first computing module 10 is fixedly connected to the lower end of the first module chip 11 through the welding holes. Electrical connections are made between the first module chip 11 and the first ground wire 12, the first power module 13, the first data processing module 14, and the first signal transmission module 15. Embodiment

[0031] Based on Embodiment 2, as Figures 1-6 shown, an ARM CPU computing module connection structure includes a first ultra-thin backplane 1, a second ultra-thin backplane 4, a first computing module 10, and a second computing module 23. At one end of the first ultra-thin backplane 1, a first connector 2 is positioned and installed. Outside the first connector 2, there is a first connection terminal 8. At one end of the second ultra-thin backplane 4, a second connector 5 is positioned and connected. Outside the second connector 5, there is a second connection terminal 6. At two corners on one side of the first ultra-thin backplane 1, there are first positioning and installation holes 3. At two corners on one side of the second ultra-thin backplane 4, there are second positioning and installation holes 7. Plugging slots 9 are provided inside both the second connection terminal 6 and the first connection terminal 8.

[0032] Further, inside the second computing module 23, there are a second connection module 17, a second data processing module 18, a second signal transmission module 19, a second power module 20, a second module chip 21, and a second ground wire 22. The second connection module 17 is connected to the second signal transmission module 19. The second signal transmission module 19 is connected to the second data processing module 18 and the second module chip 21. The second data processing module 18 is connected to the second module chip 21. The second module chip 21 is connected to the second ground wire 22 and the second power module 20.

[0033] Further, there is a welding position provided between the second computing module 23 and the second module chip 21. The outer surface of the second computing module 23 is welded to the lower end of the second module chip 21 through the welding position. Electrical connections are made between the second module chip 21 and the second data processing module 18, the second signal transmission module 19, the second ground wire 22, and the second power module 20.

[0034] Further, a wire is provided between the first connection module 16 and the second connection module 17. The first connection module 16 and the second connection module 17 are electrically connected through the wire. One end of the first calculation module 10 is electrically connected to one end of the second calculation module 23 through the second connection module 17 and the first connection module 16.

[0035] Working principle: The present invention includes a first ultra-thin sinking board 1, a first connector 2, a first positioning and installation hole 3, a second ultra-thin sinking board 4, a second connector 5, a second connection terminal 6, a second positioning and installation hole 7, a first connection terminal 8, a plugging slot 9, a first calculation module 10, a first module chip 11, a first ground wire 12, a first power module 13, a first data processing module 14, a first signal transmission module 15, a first connection module 16, a second connection module 17, a second data processing module 18, a second signal transmission module 19, a second power module 20, a second module chip 21, a second ground wire 22, and a second calculation module 23. When in use, one end of the first ultra-thin sinking board 1 is electrically connected to one end of the second ultra-thin sinking board 4 through the first connector 2, the first connection terminal 8, the second connector 5, and the second connection terminal 6. It has a built-in microchip with a computing power of 0.8 Tops and can support one-key model conversion. Inside the first calculation module 10, there are a first module chip 11, a first ground wire 12, a first power module 13, a first data processing module 14, a first signal transmission module 15, and a first connection module 16. The first connection module 16 is connected to the position of the first signal transmission module 15, the first signal transmission module 15 is connected to the positions of the first data processing module 14 and the first module chip 11, the first data processing module 14 is connected to the first module chip 11, and the first module chip 11 is connected to the first ground wire 12 and the first power module 13, facilitating the operation of data signals by the first calculation module 10. Inside the second calculation module 23, there are a second connection module 17, a second data processing module 18, a second signal transmission module 19, a second power module 20, a second module chip 21, and a second ground wire 22. The second connection module 17 is connected to the position of the second signal transmission module 19, the second signal transmission module 19 is connected to the positions of the second data processing module 18 and the second module chip 2, the second data processing module 18 is connected to the second module chip 21, and the second module chip 21 is connected to the positions of the second ground wire 22 and the second power module 20, facilitating the operation of data signals by the second calculation module 23. A wire is provided between the first connection module 16 and the second connection module 17. The first connection module 16 and the second connection module 17 are electrically connected through the wire. One end of the first calculation module 10 is electrically connected to one end of the second calculation module 23 through the second connection module 17 and the first connection module 16, facilitating a faster connection between the two modules and improving the operation rate.

[0036] It should be noted that in this text, relational terms such as first and second (No. 1, No. 2, etc.) are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0037] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed.

Claims

1. An ARM CPU computing module connection structure, comprising a first ultra-thin backplane (1), a second ultra-thin backplane (4), a first computing module (10) and a second computing module (23), characterized in that: One end of the first ultra-thin sinking board (1) is positioned and installed with a first connector (2). A first connection terminal (8) is arranged outside the first connector (2). One end of the second ultra-thin sinking board (4) is positioned and connected with a second connector (5). A second connection terminal (6) is arranged outside the second connector (5). First positioning and installation holes (3) are opened at two corners on one side of the first ultra-thin sinking board (1). Second positioning and installation holes (7) are opened at two corners on one side of the second ultra-thin sinking board (4). Plug-in slots (9) are opened inside both the second connection terminal (6) and the first connection terminal (8). Inside the first computing module (10), there are a first module chip (11), a first ground wire (12), a first power module (13), a first data processing module (14), a first signal transmission module (15), and a first connection module (16). At the position where the first connection module (16) connects to the first signal transmission module (15), at the position where the first signal transmission module (15) connects to the first data processing module (14) and the first module chip (11), the first data processing module (14) connects to the first module chip (11), and the first module chip (11) connects to the first ground wire (12) and the first power module (13). Inside the second computing module (23), there are a second connection module (17), a second data processing module (18), a second signal transmission module (19), a second power module (20), a second module chip (21), and a second ground wire (22). At the position where the second connection module (17) connects to the second signal transmission module (19), at the position where the second signal transmission module (19) connects to the second data processing module (18) and the second module chip (21), the second data processing module (18) connects to the second module chip (21), and at the position where the second module chip (21) connects to the second ground wire (22) and the second power module (20). One end of the first ultra-thin sinking board (1) is electrically connected to one end of the second ultra-thin sinking board (4) through the first connector (2), the first connection terminal (8), the second connector (5), and the second connection terminal (6).

2. The connection structure of an ARM CPU computing module according to claim 1, characterized in that: There are welding hole positions between the first computing module (10) and the first module chip (11). The middle part of the first computing module (10) is fixedly connected to the lower end of the first module chip (11) through the welding hole positions. The first module chip (11) is electrically connected to the first ground wire (12), the first power module (13), the first data processing module (14), and the first signal transmission module (15).

3. The connection structure of an ARM CPU computing module according to claim 1, characterized in that: There is a welding position between the second computing module (23) and the second module chip (21). The outer surface of the second computing module (23) is welded and connected to the lower end of the second module chip (21) through the welding position. The second module chip (21) is electrically connected to the second data processing module (18), the second signal transmission module (19), the second ground wire (22), and the second power module (20).

4. The connection structure of an ARM CPU computing module according to claim 1, characterized in that: A wire is provided between the first connection module (16) and the second connection module (17), and the first connection module (16) and the second connection module (17) are electrically connected through the wire. One end of the first calculation module (10) is electrically connected to one end of the second calculation module (23) through the second connection module (17) and the first connection module (16).

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