Laser module and assembly method thereof

Abstract

The present invention provides a laser module, including a semiconductor laser unit, a lens, a housing and a collar, wherein the semiconductor laser unit has a light emitting part, the lens is arranged downstream of the optical path of the semiconductor laser unit, the housing is sleeved on the outside of the light emitting part and the lens, the collar is a hollow structure, the outer wall of the collar is in contact with the inner wall of the housing, the inner wall of the collar is in contact with the side of the light emitting part, the collar is configured so that the light emitting axis of the light emitting part and the optical axis of the lens are colinear and parallel to the longitudinal direction of the housing, at least one fixing groove is provided on the side wall of the collar that radially penetrates the side wall of the collar, and the collar and the side of the light emitting part are glued and fixed at the position of the fixing groove. The embodiment of the present invention uses the collar to provide a bonding surface for the light emitting part and the housing, improves the bonding strength between the semiconductor laser unit and the housing, reduces the amount of adhesive used, shortens the curing time, and improves the yield and stability of the product. The embodiment of the present invention also provides an assembly method of the laser module.

Description

Technical Field

[0001] The present invention generally relates to the technical field of laser devices, and in particular to a laser module and an assembly method thereof. Background Art

[0002] Lasers are widely used in many fields due to their extremely small divergence, extremely high brightness, and extremely high energy density. As components that emit lasers, semiconductor laser units usually need to be installed in a housing of a certain shape to adapt to different application scenarios and application requirements. In equipment with high precision requirements, the focal length needs to be adjusted when installing the semiconductor laser unit to meet the use requirements, and the adjustment is made by changing the position of the semiconductor laser unit in the housing. In existing laser modules, the semiconductor laser unit and the housing are usually fixed with glue. When the semiconductor laser unit is adjusted to the appropriate position and meets the application requirements, glue is filled between the semiconductor laser unit and the housing to complete the fixation of the semiconductor laser unit and the housing.

[0003] The semiconductor laser unit is usually fixedly connected to the housing through a base. However, due to the low structural strength of the base itself and the small matching area with the housing, it is necessary to fill glue between the housing and the light-emitting component of the semiconductor laser unit. However, since a large amount of glue is required to fix the semiconductor laser unit and the glue takes a long time to cure, the semiconductor laser unit needs to be kept in the adjusted position while waiting for the glue to cure. Slight vibrations or collisions may cause the focal length of the semiconductor laser unit to change, or even cause the light output axis of the semiconductor laser unit to shift, seriously affecting the qualification rate of the final product.

[0004] The contents of the background technology section are merely the technologies known to the inventors and do not necessarily represent the prior art in the field. Summary of the invention

[0005] In view of one or more defects in the prior art, the present invention provides a laser module that can reduce the amount of adhesive required to fix the semiconductor laser unit and the housing, thereby shortening the time required for the adhesive to solidify, stabilize the light output axis of the semiconductor laser unit, enhance the bonding strength between the semiconductor laser unit and the housing, improve the yield rate in the production process, ensure product quality, and improve the stability of the product application. The present invention also provides a laser module assembly method for installing and assembling the aforementioned laser module.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A laser module, comprising:

[0008] A semiconductor laser unit having a light emitting portion;

[0009] A lens, the lens being disposed downstream of the optical path of the semiconductor laser unit;

[0010] A housing, the housing being sleeved on the outer sides of the light emitting portion and the lens; and

[0011] The collar is a hollow structure, the outer wall of the collar is fitted with the inner wall of the shell, the inner wall of the collar is fitted with the side of the light-emitting part, the collar is configured so that the light-emitting axis of the light-emitting part and the optical axis of the lens are colinear and parallel to the longitudinal direction of the shell, at least one fixing groove is provided on the side wall of the collar and radially penetrates the side wall of the collar, and the collar and the side of the light-emitting part are glued and fixed at the position of the fixing groove.

[0012] According to one aspect of the present invention, at least one first through hole radially penetrating the side wall of the shell and at least one second through hole radially penetrating the side wall of the shell are formed on the side wall of the shell.

[0013] According to one aspect of the present invention, the collar and / or the semiconductor laser unit are glued and fixed to the housing at the position of the first through hole, and the lens is glued and fixed to the housing at the position of the second through hole.

[0014] According to one aspect of the present invention, the first through hole and the fixing groove are staggered with each other in the circumferential direction of the collar.

[0015] According to one aspect of the present invention, the semiconductor laser unit further includes a base, the light emitting portion is disposed on the base, and the collar is adjacent to the base.

[0016] According to one aspect of the present invention, the fixing groove is located on a side of the collar facing toward the lens or away from the lens, or the fixing groove is opened in the middle of the collar.

[0017] According to one aspect of the present invention, the collar has a plurality of fixing grooves, and the plurality of fixing grooves are evenly distributed on the collar in a circumferential direction.

[0018] According to one aspect of the present invention, the collar has four fixing grooves, and the four fixing grooves are distributed in a cross shape.

[0019] According to one aspect of the present invention, chamfers are provided on the inner walls at both ends of the collar.

[0020] According to one aspect of the present invention, a first positioning groove is formed on the outer circumference of the base, and a second positioning groove is formed on the outer circumference of the collar, wherein the first positioning groove and the second positioning groove are adjacent to and aligned with each other.

[0021] According to one aspect of the present invention, the laser module further comprises an aperture and a projection mirror arranged in the housing and sequentially arranged downstream of the optical path of the lens, wherein the projection mirror receives the light beam after passing through the aperture and is configured to project a preset pattern.

[0022] According to one aspect of the present invention, the projection mirror is a straight line mirror configured to project a straight line.

[0023] According to one aspect of the present invention, a third through hole is further provided on the housing, the position of the third through hole corresponds to the projection mirror and is used for gluing and fixing the projection mirror.

[0024] According to one aspect of the present invention, the housing includes a first housing and a second housing, the first housing includes a coaxial large diameter portion and a small diameter portion, the second housing is sleeved on the small diameter portion, the semiconductor laser unit, the ring and the lens are arranged in the large diameter portion, and the projection mirror is arranged in the second housing.

[0025] The present invention also provides a method for assembling a laser module, comprising:

[0026] S101: Sleeve a collar on the outer side of the light-emitting portion of the semiconductor laser unit so that the collar supports the light-emitting portion, and a side wall of the collar is provided with at least one fixing groove that radially penetrates the side wall of the collar;

[0027] S102: fixing the collar and the light-emitting portion circumferentially at the position of the fixing groove by means of adhesive;

[0028] S103: placing a lens in the housing and fixing the lens to the inner wall of the housing;

[0029] S104: placing the collar and the semiconductor laser unit into a housing so that the inner wall of the housing fits the outer side of the collar; and

[0030] S105: Fix the collar and / or semiconductor laser unit relative to the housing.

[0031] According to one aspect of the present invention, the semiconductor laser unit further comprises a base, the outer circumference of the base comprises a first positioning groove, the outer circumference of the collar comprises a second positioning groove, and the step S101 comprises: making the first positioning groove and the second positioning groove adjacent and aligned, and sleeve the collar on the outer side of the light emitting portion of the semiconductor laser unit.

[0032] According to one aspect of the present invention, a first through hole and a second through hole are provided on the outer shell, and the first through hole and the fixing groove are staggered with each other in the circumferential direction of the ring. Step S105 comprises: fixing the base and / or the ring relative to the outer shell by an adhesive connection at the first through hole; and step S103 comprises: fixing the lens relative to the outer shell by an adhesive connection at the position of the second through hole.

[0033] According to one aspect of the present invention, the assembly method further includes: arranging an aperture and a projection mirror in the housing and sequentially arranging them downstream of the optical path of the semiconductor laser unit, wherein the projection mirror receives the light beam after passing through the aperture and is configured to project a preset pattern.

[0034] According to one aspect of the present invention, a third through hole is further provided on the housing, and the assembly method further comprises: fixing the projection mirror at the position of the third through hole by gluing

[0035] Compared with the prior art, the embodiments of the present invention provide a laser module, which uses a collar to provide a bonding surface for the light-emitting part and the housing, increases the matching area between the semiconductor laser unit and the housing, improves the bonding strength between the semiconductor laser unit and the housing, reduces the amount of adhesive used, avoids the risk of glue overflow, shortens the curing time, ensures a stable and firm connection, simplifies the glue dispensing process, improves the yield rate in the production process, effectively guarantees product quality, and improves the stability of the product in application. The embodiments of the present invention also provide a laser module assembly method for installing and assembling the aforementioned laser module. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0037] Figure 1 is a cross-sectional view of an embodiment of the present invention;

[0038] Figure 2 It is an assembly schematic diagram of an embodiment of the present invention;

[0039] Figure 3 is a schematic structural diagram of a semiconductor laser unit in one embodiment of the present invention;

[0040] Figure 4 is a schematic structural diagram of a collar in one embodiment of the present invention;

[0041] Figure 5 is a schematic diagram of the assembly of a semiconductor laser unit and a collar in one embodiment of the present invention;

[0042] Figure 6 is a schematic structural diagram of a housing in one embodiment of the present invention;

[0043] Figure 7 is an assembly schematic diagram of another embodiment of the present invention;

[0044] Figure 8 is a schematic diagram of the cooperation between the first housing and the second housing in one embodiment of the present invention;

[0045] Fig. 9 is a schematic flow chart of an assembly method in one embodiment of the present invention;

[0046] Fig.10 It is a schematic flow chart of an assembly method in another embodiment of the present invention.

[0047] In the figure: 1, laser module, 20, semiconductor laser unit, 21, light emitting part, 22, base, 23, first positioning groove, 30, lens, 40, housing, 41, first through hole, 42, second through hole, 43, third through hole, 50, collar, 51, fixing groove, 52, second positioning groove, 60, aperture, 70, projection mirror, 80, first housing, 81, fourth through hole, 82, fifth through hole, 90, second housing, 91, sixth through hole, 92, seventh through hole. DETAILED DESCRIPTION

[0048] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0049] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0050] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0053] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0054] Figure 1 and Figure 2 A schematic diagram of the structure of a laser module according to an embodiment of the present invention is shown below. Figure 1 and Figure 2 Detailed description.

[0055] like Figure 1 and Figure 2As shown, according to one embodiment of the present invention, the laser module 1 includes a semiconductor laser unit 20, a lens 30, a housing 40 and a collar 50. The semiconductor laser unit 20 can be a semiconductor laser, and the semiconductor laser unit 20 has a light-emitting portion 21, which is a component for emitting laser light. The laser light is emitted perpendicular to the emission surface of the light-emitting portion 21. To protect the components therein, the light-emitting portion 21 has a closed cavity. The semiconductor laser unit 20 can also be provided with pins as needed to connect the control circuit and the drive circuit. The lens 30 is arranged downstream of the optical path of the semiconductor laser unit 20, that is, the light-emitting portion 21 emits laser light toward the lens 30. The lens 30 is an important optical component, and its function is to adjust and change the optical properties of the incident light to meet different application requirements. For example, in this embodiment, the lens 30 can be set as a collimating lens for collimating the laser light. The focal length of the semiconductor laser unit 20 is adjusted mainly by adjusting the distance between the semiconductor laser unit 20 and the lens 30. The housing 40 in this embodiment is sleeved on the outside of the light emitting part 21 and the lens 30. The housing 40 provides protection for the semiconductor laser unit 20 and the lens 30, and ensures that the position of the laser optical axis emitted by the light emitting part 21 is fixed. The semiconductor laser unit 20 moves in the housing 40 to adjust the focal length. The shape and structure of the housing 40 can be set according to actual application requirements, for example Figure 1 and Figure 2 In the embodiment, the housing 40 is cylindrical. To ensure that the lens 30 and the housing 40 are stably connected, the shape of the lens 30 and the shape of the inner wall of the housing 40 need to be adjusted to shapes that can fit each other.

[0056] The collar 50 in this embodiment is a hollow structure, the outer wall of the collar 50 is in contact with the inner wall of the housing 40, the inner wall of the collar 50 is in contact with the side of the light emitting portion 21, the collar 50 is configured so that the light emitting axis of the light emitting portion 21 and the optical axis of the lens 30 are in line and parallel to the longitudinal direction of the housing 40, at least one fixing groove 51 is provided on the side wall of the collar 50 and radially penetrates the side wall of the collar, and the collar 50 and the side of the light emitting portion 21 are glued and fixed at the position of the fixing groove 51. In the present invention, the light emitting axis of the light emitting portion 21 refers to the symmetric axis of the light beam emitted from the light emitting portion 21, such as Figure 1 As shown in the axis O1 in FIG. 1 , the optical axis of the lens 30 is as shown in FIG. Figure 1As shown by the axis O2 in the figure. The inner and outer sides of the collar 50 are respectively fitted with the housing 40 and the light emitting part 21, which increases the fitting area of ​​the light emitting part 21 and the housing 40 in disguised form. Since the collar 50 is fixed to the light emitting part 21, the housing 40 and the collar 50 can be fixed to the light emitting part 21. When fixing the housing 40 and the collar 50, only a small amount of adhesive is required, so the amount of adhesive can be reduced, thereby shortening the curing time, so that a stable connection can be quickly formed between the semiconductor laser unit 20 and the housing 40, reducing the risk of focusing failure or optical axis deviation during the curing process. At the same time, the collar 50 can also limit the shaking of the light emitting part 21 in the housing 40. The light emitting part 21 is fixed in the housing 40 by the collar 50, providing support for the light emitting part 21, ensuring the stability of the position of the light emitting part 21, and using the collar 50 to ensure that the light emitting axis of the light emitting part 21 is in line with the optical axis of the lens 30 and parallel to the longitudinal direction of the housing 40, so as to avoid the optical elements and application devices downstream from being unable to be used normally due to the deviation of the light emitting part 21.

[0057] Figure 4 FIG. 5 shows a schematic structural diagram of a collar 50 according to an embodiment of the present invention. The fixing groove 51 is used to fix the light emitting portion 21. The collar 50 and the side surface of the light emitting portion 21 are glued and fixed at the position of the fixing groove 51. Figure 5 As shown, for example, the collar 50 is sleeved on the outside of the light-emitting portion 21, the inner wall of the collar 50 is fitted with the side of the light-emitting portion 21, and the fixing groove 51 passes through the side wall of the collar 50. The fixing groove 51 and the light-emitting portion 21 can be fitted directly at the position of the fixing groove 51 by using a dispensing process, and stable bonding can be achieved using only a small amount of adhesive. The collar 50 and the semiconductor laser unit 20 in this embodiment are fixed to form a whole. When focusing is required, the collar 50 moves in the housing 40 with the semiconductor laser unit 20 at the same time. The outer wall of the collar 50 is fitted with the inner wall of the housing 40, which is sufficient to meet the focusing range of the semiconductor laser unit 20. When the semiconductor laser unit 20 is adjusted to a suitable position, the collar 50 and the housing 40 can be directly fixed.

[0058] According to a preferred embodiment of the present invention, Figure 4 and Figure 5 As shown, the fixing groove 51 is located on the side of the collar 50 facing the lens 30 to facilitate the glue dispensing process. Similarly, the fixing groove 51 can also be opened at other positions of the collar 50, such as on the side of the collar 50 away from the lens 30, or the fixing groove 51 is opened in the middle of the collar 50, or a through hole is opened on the side wall of the collar 50 that penetrates the side wall of the collar 50, and the collar 50 and the light-emitting part 21 are fixedly connected by glue at the position of the through hole, and the collar 50 limits the displacement of the light-emitting part 21 and provides support.

[0059] The number of the fixing grooves 51 on the collar 50 can be increased according to actual needs, for example Figure 4 and Figure 5 As shown, four fixing grooves 51 are arranged on the collar 50, and the four fixing grooves 51 are evenly distributed on the collar 50 in the circumferential direction, that is, the four fixing grooves 51 are distributed in a cross shape. Similarly, other numbers of fixing grooves 51 can be provided to improve the combination stability between the collar 50 and the light-emitting part 21. Further, when multiple fixing grooves 51 are provided, the fixing grooves 51 are evenly arranged on the collar 50 in the circumferential direction, so that the light-emitting part 21 is subjected to stable circumferential force.

[0060] According to a preferred embodiment of the present invention, Figure 6 and Figure 1 As shown, at least one first through hole 41 and at least one second through hole 42 are provided on the side wall of the housing 40. The first through hole 41 is used to fix the whole including the collar 50 and the light emitting part 21, and the second through hole 42 is used to fix the lens 30. Similarly, according to a preferred embodiment of the present invention, the collar 50 and / or the semiconductor laser unit 20 are glued and fixed to the housing 40 at the position of the first through hole 41, and the lens 30 is glued and fixed to the housing 40 at the position of the second through hole 42. Figure 1 and Figure 3 As shown, according to a preferred embodiment of the present invention, the semiconductor laser unit 20 also has a base 22, and the light-emitting part 21 is arranged on the base 22. Furthermore, the side of the ring 50 away from the lens 30 can also be adjacent to and abut against the base 22. When adjusting the position of the semiconductor laser unit 20, the position corresponding to the first through hole 41 will change, which may correspond to the side of the ring 50, or the side of the base 22 or the connection position of the two. Since the outer side of the ring 50 fits the inner side of the shell 40, and the shape of the base 22 also matches the shell 40, only a small amount of adhesive is needed to achieve fixation when bonding and fixing the ring 50 (or the ring 50 and the semiconductor laser unit 20 as a whole) and the shell 40, thereby reducing the amount of adhesive used, shortening the curing time of the adhesive, improving production efficiency, and simplifying the glue dispensing process. For example, when using ultraviolet curing glue, ultraviolet irradiation curing can be directly performed after the ultraviolet curing glue is injected. When the amount of glue used is relatively small, the curing is rapid and the time required is short. Figure 1 As shown, the housing 40 is simultaneously glued and fixed to the side of the collar 50 and the side of the base 22 through the first through hole 41. The position of the second through hole 42 on the housing 40 corresponds to the position of the lens 30. At the position of the second through hole 42, the sides of the housing 40 and the lens 30 are fitted and fixed.

[0061] The traditional method of fixing the light-emitting part 21 is to inject glue to the side of the light-emitting part 21 through the first through hole 41. Since the side of the light-emitting part 21 is not in contact with the shell 40, a large amount of glue injection is required. Not only is the amount of glue used relatively large, but also the curing time will be prolonged when the thickness of the glue is thick. Due to the large amount of glue used, if ultraviolet curing glue is used, the ultraviolet rays cannot irradiate the inside, the curing effect is poor, the product stability is poor, and it may even fail to play the role of fixed bonding. Therefore, the traditional method usually uses quick-drying glue, but quick-drying glue has the defect of long curing time compared with ultraviolet curing glue. In the process of waiting for the quick-drying glue to cure, it is difficult to keep the semiconductor laser unit 20 stable for a long time, and there is a risk of unqualified products. In addition, if the glue injection is uneven, it may also cause uneven force on different sides of the light-emitting part 21, thereby causing the optical axis to shift and affecting the product quality. In addition, the traditional glue injection method may also cause the glue to overflow inside the shell 40, which not only fails to ensure the fixed connection between the shell 40 and the light-emitting part 21, but also may affect the light output of the light-emitting part 21.

[0062] Furthermore, a plurality of first through holes 41 and second through holes 42 may be arranged in the circumference of the housing 40 to increase the fixing position of the housing 40, the collar 50 and the lens 30. The plurality of first through holes 41 may be evenly arranged in the circumference of the housing 40 to ensure that the fixing positions are evenly distributed and the force is evenly applied, and the same is true for the second through holes 42. According to a preferred embodiment of the present invention, as Figure 2 As shown, the first through hole 41 and the second through hole 42 can also be arranged in the same radial direction of the housing 40 to facilitate glue dispensing and pasting.

[0063] According to a preferred embodiment of the present invention, the first through hole 41 on the housing 40 and the fixing groove 51 on the collar 50 are staggered in the circumferential direction of the collar 50, so as to prevent the adhesive from overflowing to the surface of the light emitter 21 through the fixing groove 51 when the housing 40 and the collar 50 are bonded. In addition, the amount of adhesive used is small, and the problem that the ultraviolet rays cannot irradiate the interior can be avoided, which provides conditions for selecting ultraviolet curing adhesive with a faster curing speed, quickly completing the curing process, and improving the yield rate.

[0064] like Figure 4 As shown, according to a preferred embodiment of the present invention, chamfers 53 are further provided on the inner walls at both ends of the ring 50. The ring 50 provides support for the light-emitting portion 21. In order to limit the shaking of the light-emitting portion 21 as much as possible, the inner wall of the ring 50 needs to be as close to the side of the light-emitting portion 21 as possible. In order to avoid difficulties in installing 50 and the light-emitting portion 21, chamfers 53 are provided on the inner walls at both ends of the ring 50 to facilitate assembly.

[0065] like Figure 2 and Figure 5As shown, according to a preferred embodiment of the invention, the outer periphery of the base 22 has a first positioning groove 23, and the outer periphery of the collar 50 has a second positioning groove 52, and the first positioning groove 23 and the second positioning groove 52 are adjacent and aligned. This embodiment uses the corresponding relationship between the first positioning groove 23 and the second positioning groove 52 to provide an indication for the installation process of the laser module 1, and its purpose is to avoid the first through hole 41 and the fixing groove 51 being in the same radial direction. When the shell 40 is opaque, the position of the fixing groove 51 cannot be accurately located during the assembly and installation process, and the base 22 closer to the edge of the shell 40 can serve as an indicator. The base 22 is aligned with the ring 50, and the first positioning groove 23 can indicate the position of the fixing groove 51 from the side. Specifically, the second positioning groove 52 on the ring 50 and the fixing groove 51 are not on the same radial direction of the ring 50, and the second positioning groove 52 is aligned with the first positioning groove 23. When the first positioning groove 23 and the first through hole 41 are on the same radial direction, the fixing groove 51 and the first through hole 41 are staggered with each other, thereby reducing the amount of adhesive and the curing time and avoiding overflow.

[0066] like Figure 1 and Figure 2 As shown, according to a preferred embodiment of the present invention, the laser module 1 also includes an aperture 60 and a projection mirror 70 which are arranged in the housing 40 and are arranged in sequence downstream of the optical path of the lens 30, wherein the aperture 60 is used to block stray light, and the projection mirror 70 receives the light beam after passing through the aperture 60, and projects a preset pattern, such as a cross mirror or a straight mirror, according to the structural characteristics of the projection mirror 70. Specifically, according to an embodiment of the present invention, the projection mirror 70 is a straight wave mirror, which projects a straight line shape. In order to ensure that the position of the projection mirror 70 is fixed, a third through hole 43 can also be set on the housing 40, and the position of the third through hole 43 corresponds to the projection mirror 70, and is used to glue and fix the projection mirror 70.

[0067] Figure 7 FIG. 2 shows a schematic diagram of a structure according to an embodiment of the present invention. Figure 8 The schematic diagram of the structure of the first housing 80 and the second housing 90 is shown as follows. Figure 7 and Figure 8 As shown, this embodiment has two housings, wherein the first housing 80 has a step structure (the two sides of the step are respectively a large diameter part and a small diameter part), for example, the radial cross section is two concentric circles with different diameters, the second housing 90 has a structure that matches the first housing 80, and the end of the first housing 80 with a smaller cross-sectional area can be inserted into the second housing 90, wherein the semiconductor laser unit 20, the collar 50 and the lens 30 are installed inside the first housing 80 (located at the end of the first housing 80 with a larger cross-sectional area), the projection mirror 70 is installed inside the second housing, and the aperture 60 ( Figure 7The diaphragm 60 is mounted at an end of the first housing 80 with a smaller cross-sectional area, and the diaphragm 60 is close to the projection lens 70. The diaphragm 60 is directly held and fixed by the first housing 80, and does not need to be installed sequentially as required in the aforementioned embodiment, thereby ensuring that the position and angle of the diaphragm 60 remain stable at all times.

[0068] like Figure 8 As shown, according to a preferred embodiment of the present invention, a fourth through hole 81 and a fifth through hole 82 are provided on the first housing 80, wherein the function of the fourth through hole 81 is similar to that of the first through hole 41 in the aforementioned embodiment, and is used to fix the combination of the collar 50 and the semiconductor laser unit 20, and the function of the fifth through hole 82 is similar to that of the second through hole 42 in the aforementioned embodiment, and is used to fix the lens 30, that is, the semiconductor laser unit 20, and the lens 30 and the collar 50 are fixed inside the first housing 80. A sixth through hole 91 and a seventh through hole 92 are provided on the second housing 90, wherein the function of the seventh through hole 92 is similar to that of the third through hole 43 in the aforementioned embodiment, and is used to fix the projection lens 70, and the sixth through hole 91 is used to fix with the small neck of the first housing 80. In this embodiment, the first shell 80 and the second shell 90 are separately arranged, the light-emitting part 21, the ring 50 and the lens 30 are arranged inside the first shell 80, and the projection mirror 70 is arranged inside the second shell 90. The distance and angle between the projection mirror 70 and the light-emitting part 21 and the lens 30 can be adjusted through the second shell 90, for example, by changing the distance from the small neck in the first shell 80 to the second shell 90 or by rotating the second shell 90 to change the angle and direction of the projection mirror 70, thereby adjusting the output light of the laser module 1.

[0069] Fig. 9 FIG. 1 shows a method 100 for assembling a laser module according to an embodiment of the present invention. Figure 8 As shown, the assembly method 100 includes:

[0070] In S101, a ring is sleeved on the outer side of the light-emitting part of the semiconductor laser unit so that the ring supports the light-emitting part. The ring supports the light-emitting part and limits the shaking of the light-emitting part, thereby improving the stability of the light-emitting part, thereby ensuring that the light-emitting axis of the light-emitting part is always in the same position to avoid displacement. At least one fixing groove radially penetrating the side wall of the ring is provided on the side wall of the ring, for example, four fixing grooves evenly distributed in a cross shape on the circumference of the ring, so as to fix the ring and the light-emitting part.

[0071] In S102, the collar and the light-emitting part are fixed circumferentially by glue at the position of the fixing groove to prevent the collar and the light-emitting part from being loosely combined and the collar falling off. Since the inner wall of the collar fits the side of the light-emitting part, only a small amount of glue is needed to fix the collar and the light-emitting part at the position of the fixing groove, which reduces the amount of glue and speeds up the curing of the glue, thereby improving production efficiency. In addition, the small amount of glue also avoids the risk of glue overflow and prevents uncured glue from flowing to other positions and affecting the light path.

[0072] In S103, a lens is placed in the housing and fixed to the inner wall of the housing. The function of the lens is to improve the laser emitted by the light-emitting part so that it is more suitable for specific application scenarios, such as a collimating lens. The lens is arranged downstream of the optical path of the light-emitting part, and the light-emitting axis of the light-emitting part fixed by the collar is collinear with the optical axis of the lens to ensure that the lens functions normally. The distance between the lens and the light-emitting part can be calculated according to actual use requirements. There are also multiple options for fixing the lens and the housing, such as setting a corresponding slot at the position corresponding to the lens in the housing, or fixing the lens and the housing by adhesive, etc.

[0073] In S104, the collar and the semiconductor laser unit are placed in the housing so that the inner wall of the housing fits the outer side of the collar, and the inner wall of the housing limits the movement of the collar, thereby limiting the movement of the light-emitting part, ensuring that the light-emitting part is always in a set position in the housing, such as on the axis of the housing. To meet the specific requirements of the product, the focal length can be adjusted by adjusting the position of the semiconductor laser unit in the housing, such as fine-tuning the semiconductor laser unit on the test equipment, and fixing the position of the semiconductor laser unit after meeting the qualified requirements.

[0074] In S105, the collar and / or semiconductor laser unit are fixed relative to the housing. Since the collar in this embodiment is fixedly connected to the light emitting part of the semiconductor laser unit, the two can be regarded as a whole and directly fixedly connected to the housing.

[0075] According to a preferred embodiment of the present invention, the semiconductor laser unit further comprises a base, the outer circumference of the base is provided with a first positioning groove, the outer circumference of the collar is provided with a second positioning groove, and in step S101, the first positioning groove and the second positioning groove are adjacent and aligned, and the collar is sleeved on the outer side of the light-emitting part of the semiconductor laser unit. Specifically, the base can be arranged on the other side of the light-emitting part emitting laser, and when the collar is sleeved on the outer side of the light-emitting part, one end of the collar is adjacent to the base. The first positioning groove of the base and the second positioning groove of the collar are aligned with each other, the first positioning groove and the second positioning groove can be set as rectangular grooves, and the second positioning groove can pass through the side wall of the collar, or can be a shallow mark located on the surface. The function of the first positioning groove and the second positioning groove is to indicate the relative position of the collar in the housing.

[0076] As mentioned above, the housing can be fixed to the corresponding structure by gluing. According to a preferred embodiment of the present invention, the housing is provided with a first through hole and a second through hole. In step S103, the lens is fixed relative to the housing by gluing at the position of the second through hole. Specifically, the second through hole is provided at the corresponding position of the lens, and the side of the lens can be gluing and fixed to the side wall of the housing by the second through hole. The first through hole and the fixing groove are staggered in the circumferential direction of the collar. In step S105, the base and / or the collar are fixed relative to the housing by gluing at the first through hole. When the collar and the light-emitting part are fixed by the fixing groove, it is not necessary to fill the fixing groove with glue. Therefore, the first through hole and the fixing groove are staggered in the circumferential direction of the collar in order to reduce the amount of glue. The relative positions of the first positioning groove and the second positioning groove with the housing can ensure that the first through hole and the fixing groove are staggered. Further, a plurality of the first through hole and the second through hole can be provided to increase the gluing and fixing area of ​​the housing and the corresponding structure and improve the structural stability.

[0077] Fig.10 The assembly method 200 of the laser module according to a preferred embodiment of the present invention is shown, wherein steps S201 and S202 are substantially the same as steps S101 and S102 in the assembly method 100, and steps S204, S205 and S206 are substantially the same as steps S103, S104 and S105 in the assembly method 100, respectively, and are not described in detail here. The assembly method 200 also includes S203, in which the aperture and the projection mirror are arranged in the housing and arranged in sequence downstream of the optical path of the semiconductor laser unit, wherein the projection mirror receives the light beam after passing through the aperture and is configured to project a preset pattern, the aperture is used to block stray light, and the aperture and the projection mirror are both components for realizing specific functions.

[0078] According to a preferred embodiment of the present invention, a third through hole is further provided on the housing, and the assembly method 200 further comprises: fixing the projection mirror at the position of the third through hole by gluing, and the fixing method of the projection mirror may be the same as the fixing method of the aforementioned lens.

[0079] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A laser module, comprising: A semiconductor laser unit having a light emitting portion; A lens, the lens being disposed downstream of the optical path of the semiconductor laser unit; A housing, the housing being sleeved on the outer sides of the light emitting portion and the lens; and The collar is a hollow structure, the outer wall of the collar is fitted with the inner wall of the shell, the inner wall of the collar is fitted with the side of the light-emitting part, the collar is configured so that the light-emitting axis of the light-emitting part and the optical axis of the lens are colinear and parallel to the longitudinal direction of the shell, at least one fixing groove is provided on the side wall of the collar and penetrates the side wall of the collar in the radial direction, and the collar and the side of the light-emitting part are glued and fixed at the position of the fixing groove; The collar and the semiconductor laser unit are fixed as a whole and are directly and fixedly connected to the housing; the lens is fixedly connected to the inner wall of the housing. 2 . The laser module according to claim 1 , wherein the side wall of the shell is provided with at least one first through hole penetrating the side wall of the shell in a radial direction and at least one second through hole penetrating the side wall of the shell in a radial direction.

3. The laser module according to claim 2, wherein the collar and / or the semiconductor laser unit is glued and fixed to the housing at the position of the first through hole, and the lens is glued and fixed to the housing at the position of the second through hole. 4 . The laser module according to claim 2 , wherein the first through hole and the fixing groove are staggered with each other in a circumferential direction of the ring. 5 . The laser module according to claim 1 , wherein the semiconductor laser unit further comprises a base, the light emitting portion is disposed on the base, and the collar is adjacent to the base. 6 . The laser module according to claim 1 , wherein the fixing groove is located on a side of the ring facing toward the lens or away from the lens, or the fixing groove is opened in the middle of the ring. 7 . The laser module according to claim 1 , wherein the collar has a plurality of the fixing grooves, and the plurality of fixing grooves are evenly distributed on the collar in a circumferential direction. 8 . The laser module according to claim 7 , wherein the collar has four fixing grooves, and the four fixing grooves are distributed in a cross shape.

9. The laser module according to any one of claims 1 to 4, wherein chamfers are provided on the inner walls at both ends of the ring. 10 . The laser module according to claim 5 , wherein a first positioning groove is formed on an outer circumference of the base, and a second positioning groove is formed on an outer circumference of the collar, and the first positioning groove and the second positioning groove are adjacent to and aligned with each other.

11. The laser module according to any one of claims 1-4, further comprising an aperture and a projection mirror arranged in the housing and sequentially arranged downstream of the optical path of the lens, wherein the projection mirror receives the light beam after passing through the aperture and is configured to project a preset pattern. 12 . The laser module according to claim 11 , wherein the projection mirror is a linear mirror configured to project a linear line. 13 . The laser module according to claim 11 , wherein a third through hole is further provided on the housing, and a position of the third through hole corresponds to the projection mirror and is used for gluing and fixing the projection mirror.

14. The laser module according to claim 11, wherein the shell includes a first shell and a second shell, the first shell includes a coaxial large diameter portion and a small diameter portion, the second shell is sleeved on the small diameter portion, the semiconductor laser unit, the ring and the lens are arranged in the large diameter portion, and the projection mirror is arranged in the second shell.

15. A method for assembling a laser module, comprising: S101: Sleeve a collar on the outer side of the light-emitting portion of the semiconductor laser unit so that the collar supports the light-emitting portion, and a side wall of the collar is provided with at least one fixing groove that radially penetrates the side wall of the collar; S102: fixing the collar and the light-emitting portion circumferentially at the position of the fixing groove by means of adhesive; S103: placing the lens in the housing and fixing the lens to the inner wall of the housing; S104: placing the collar and the semiconductor laser unit into a housing so that the inner wall of the housing fits the outer side of the collar; and S105: Fix the collar and / or the semiconductor laser unit relative to the housing, wherein the collar and the semiconductor laser unit are fixed as a whole and are directly fixedly connected to the housing.

16. The assembly method according to claim 15, wherein the semiconductor laser unit further comprises a base, the outer circumference of the base has a first positioning groove, the outer circumference of the collar has a second positioning groove, and the step S101 comprises: The first positioning groove and the second positioning groove are adjacent to and aligned with each other, and the collar is sleeved on the outer side of the light emitting part of the semiconductor laser unit.

17. The assembly method according to claim 16, wherein the housing is provided with a first through hole and a second through hole, the first through hole and the fixing groove are staggered in the circumferential direction of the collar, and the step S105 comprises: fixing the base and / or the collar relative to the housing at the first through hole by adhesive connection; The step S103 includes: fixing the lens relative to the housing at the position of the second through hole by adhesive connection.

18. The assembly method according to claim 15 or 16, further comprising: An aperture and a projection mirror are arranged in the housing and sequentially arranged downstream of the optical path of the semiconductor laser unit, wherein the projection mirror receives the light beam after passing through the aperture and is configured to project a preset pattern.

19. The assembly method according to claim 18, wherein the housing is further provided with a third through hole, the assembly method further comprising: The projection mirror is fixed at the position of the third through hole by gluing.

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