Method and system for manufacturing a device

Abstract

The present invention relates to methods and systems for manufacturing equipment, and in particular, a method or process can be provided, the method or process comprising: using a first manufacturing method to form a first sinterable equipment part; and using a second manufacturing method to form a second equipment part. The sinterable first equipment part can then be heated while fastening the first equipment part to the second equipment part to form an integral final equipment part.

Description

Technical Field

[0001] The described subject matter relates to methods and processes for manufacturing devices. Background Art

[0002] Metal injection molded parts and devices can be bonded during the sintering process. Sintering is a process whereby the powdered metal and binder are heated to a temperature just below the melting point of the metal to bond the powdered particles together. The heating can be done by a laser, in an oven, etc. Metal injection molded parts have manufacturing limitations inherent to the metal injection molding process.

[0003] Additive manufacturing processes have been developed such as by three-dimensional (3-D) printing. During the 3-D printing process, successive layers of a part are deposited until the part is formed. Each layer is essentially a sliced ​​cross-section of the part being formed. Such manufacturing allows for the formation of complex shapes. It may be desirable to have systems and methods that are different from those currently available. Summary of the invention

[0004] In one or more embodiments, a method is provided that can include heating a sinterable first device part while fastening the first device part to a second device part to form a unitary final device part.

[0005] In one or more embodiments, a method is provided that may include: additively manufacturing a conductive green body; and obtaining a non-sinterable conductive body. The method may include heating both the conductive green body and the non-sinterable conductive body together to sinter the conductive green body and to couple the conductive green body with the non-sinterable conductive body.

[0006] In one or more embodiments, a method is provided that may include: coupling a sinterable conductive green body with a non-sinterable body; and sintering the sinterable conductive green body and the non-sinterable body to form a combined assembly of a sintered conductive green body and a non-sinterable green body. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The inventive subject matter may be understood by reading the following description of non-limiting embodiments with reference to the accompanying drawings, in which:

[0008] Figure 1 a schematic process diagram illustrating a process for manufacturing a device;

[0009] Figure 2 A perspective view of the illustrated device;

[0010] Figure 3 A cross-sectional view of the device is shown;

[0011] Figure 4A perspective view of the illustrated device;

[0012] Figure 5 A cross-sectional view of the device is shown;

[0013] Figure 6 A perspective view of the illustrated device; and

[0014] Figure 7 A cross-sectional view of the device is shown. DETAILED DESCRIPTION

[0015] Embodiments of the subject matter described herein relate to methods and processes for forming a device using combined device parts. A first part of the device can be formed using a first manufacturing method, while a second part is formed using a second manufacturing method. In one example, the first part is made by metal injection molding, while the second part is made using an additive process. One of the first part or the second part can be sinterable, so that the first part and the second part can then be heated to bond the parts together to form a single, monolithic device.

[0016] As used herein, the term non-sinterable refers to a blank, part, portion, etc. that is set to a final state so that the blank may not be sintered. Specifically, the blank, part, portion, etc. have been solidified so that the blank, part, portion, etc. cannot be sintered together with another blank, part, portion, etc. during a combination or connection process or step. Such non-sinterable materials include materials that cannot be sintered and materials that can be sintered but have been subjected to a sintering process and thus can no longer be sintered. As an example, a metal powder can be sintered within a determined temperature range for a determined period of time to allow each of the metal powder particles to be combined with each other. After the determined period of time, the combined particles can be cooled to form a single formed metal blank, part, portion, etc. If a single formed metal blank, part, portion, etc. is then reheated back to the determined temperature range for sintering, even if the formed metal blank, part, portion, etc. is within the determined temperature range, no particles remain, thereby preventing additional sintering. By transforming from powder particles into a formed metal body, part, portion, etc., even though the powder form of the material is sinterable, the formed metal body is now a non-sinterable material.

[0017] As used herein, the term sinterable refers to a body, part, portion, etc. that is not set to a final state such that the body may be capable of being sintered. Specifically, the body, part, portion, etc. has not yet been solidified such that the body, part, portion, etc. can be sintered with another body, part, portion, etc. during a combination or joining process or step. Exemplary sinterable bodies, parts, portions, etc. are powdered metals, often using an adhesive binder, having particles that can be bonded together by a sintering process.

[0018] Figure 1 A method or process 100 for forming a single monolithic block device is illustrated. The process can be utilized to combine or couple a blank, a part, a portion, etc. to a blank, a part, a portion, etc. to form the device. In step 102, a sinterable first device part is formed. The sinterable first device part may include a powdered metal, including steel, stainless steel, aluminum, titanium, copper, iron, alloys, etc. In one embodiment, the powdered metal may include a binder that holds the powder together. In one example, the powdered metal is a portion of a green body representing a mixture of powdered metal and a binder (binder) that is weakly bonded together before sintering occurs. In this way, the sinterable first device part can be a sinterable three-dimensional green body. Optionally, during the heating process, the binder or binder can evaporate. Specifically, by selecting a binder that evaporates within the heating temperature range, only the metal remains as part of the device part, thereby enhancing the device part.

[0019] In another example, only a portion of the first device part may include powdered metal, wherein the remainder of the first device part cannot be sintered. Alternatively, a flux may be applied to the interface between the sinterable first device part and the second device part. The flux may be configured to bond the sinterable first device part to the second device part during heating. In yet another example, when forming the sinterable first device part, the sinterable first device part may include one or more recessed portions at the interface between the sinterable first device part and the second device part. Such recessed portions may further facilitate the coupling between the sinterable first device part and the second device part.

[0020] By forming a sinterable first device part separate from a second device part, the sinterable first device part can be a different metal or formed using a less expensive manufacturing process than the second device part. As a result, when forming a single monolithic block device, a simpler part requiring less complexity, flexibility, strength, or other different characteristics can be formed separately from a second device part that is more expensive, more complex to manufacture, requires greater flexibility or strength, etc., and still be combined to make a single monolithic block device.

[0021] At step 104, a second device part is formed. The second device part can be formed using an additive process such as three-dimensional printing. In particular, additive processes are capable of forming device parts with more complex geometries than other manufacturing methods such as metal injection molding. Nevertheless, additive processes tend to be more expensive than other manufacturing processes. Thus, by only utilizing additive processes to form device parts with complex geometries and utilizing less expensive processes to form other parts, the advantages of additive manufacturing are achieved at a reduced cost. In one example, the second device part can be formed to have an overhanging extension that extends further from the second device part than any extension of the first device part that can be sintered. Thus, additional design flexibility for the second device part can be achieved.

[0022] In step 106, optionally, a sintering aid is added to the sinterable first device part to reduce the sintering temperature of the sinterable first device part. The sintering temperature of the device part can be changed using the sintering aid. Suitable sintering aids can include nanoparticle sintering aids and mesoporous materials. Suitable sintering aids can include transition metals. Suitable transition metals can include one or more of copper, iron, nickel, palladium, cobalt, etc. The sintering aid can be in the form of a liquid or solid at room temperature and is selected based on the end-use application, the material being used, and the additive manufacturing method adopted. In one embodiment, different amounts of sintering aids can be added to different parts of the sinterable first device part. In this way, the parts of the first device part where it is desired to be combined by the sintering process can receive the sintering aid accordingly. In one embodiment, controlling the amount of the sintering aids present in the various parts allows controlled sintering so that some parts are sintered before other parts.

[0023] In one example, a sinterable first device part can be formed by metal particles aggregated together by additive manufacturing in a green body. The first density of the metal particles in the green body can be substantially common throughout the green body before adding sintering aids. After the sinterable first device part is heated, the sinterable first device part can have different densities in different volumes of the sinterable first device part. In some embodiments, different amounts of sintering aids can be added to different parts of the sinterable first device part. For example, having more sintering aids near a certain surface can allow the surface part to be sintered before the internal part. This can allow stress relaxation of the entire component during its construction. On the contrary, having more sintering aids inside (relative to the skin part) can allow internal support for the component when the component completes the sintering process, and in some instances, surface cracking can be alleviated. In other other embodiments, the distribution of the sintering aid can be homogeneous in the first part of the component being formed, but does not exist or is in different concentrations in another part located far from the first part. Based at least in part on application-specific parameters, the concentration of the sintering aid can be changed abruptly across a defined volume, or the concentration can be changed over a defined and / or controlled concentration gradient. Another degree of control can be achieved by using different sintering aid compositions in different portions of the part. Thus, the sintering process can be controlled with respect to ratio, location, and sequence.

[0024] At step 108, the sinterable first device part is heated while the first device part is fastened to the second device part to form the device. The heating of the sinterable material of the first device part can be provided by a laser, an oven, etc. The temperature of the sinterable first device part is raised to just below the melting point of the metal powder, thereby causing bonding of the metal powder and simultaneously bonding the first device part and the second device part.

[0025] In one example, heating the sinterable first device part causes the first device part to sinter, while in another example, heating the sinterable first device part does not cause the second device part to sinter. In one example, both the sinterable first device part and the second device part are sinterable, and the sinterable first device part has a first sintering temperature, and the second device part has a second sintering temperature different from the first sintering temperature. In particular, the material of the first device part can be different from the material of the second device part, resulting in different sintering temperature ranges for each device part.

[0026] In one embodiment, heating the sinterable first device part occurs at a temperature that is at least as hot as the hotter sintering temperature of the first sintering temperature and the second sintering temperature. Specifically, heating the first device part and the second device part may include ramping the temperature at which the sinterable first device part and the second device part are heated to the first sintering temperature. The heating temperature of the sinterable first device part and the second device part may then be maintained at one or more of the (one or more) first sintering temperatures that are hotter than the first sintering temperature but cooler than the second sintering temperature. The heating temperature of the first device part and the second device part may then be ramped to the second sintering temperature. In this way, sintering occurs for both the first device part and the second device part. As a result, heating the sinterable first device part causes the sinterable first device part to be bonded to the second device part without welding or brazing the sinterable first device part to the second device part.

[0027] In yet another embodiment, heating the sinterable first device part shrinks the sinterable first device part to form an interference fit to the second device part without welding or brazing the sinterable first device part to the second device part. Specifically, the bonding material and metal powder of the sinterable first device part can have different thermal expansion coefficients, thereby causing a change in the size of the device part as a result of being heated. Therefore, the change in size can be used to provide an additional connection between the first device part and the second device part. Alternatively, the sinterable first device part and the second device part can have substantially similar thermal expansion coefficients. In any case, when the part is sintered in an oven with a controlled temperature, the atmospheric composition (e.g., argon, nitrogen, etc.) and pressure (e.g., applied pressure, atmospheric pressure, vacuum, etc.), the size of the device part can be changed by adjusting these three variables. Thus, the shrinkage can be controlled accordingly during the process. Alternatively, the ratio of metal powder to the bonding material within the sinterable part can also be adjusted and is considered to be the size of the control shrinkage.

[0028] Figure 2-3 Graphic usage Figure 1200 is an exemplary block device formed by an additive manufacturing process. In particular, a first sinterable device part 202 is bonded to a second device part 204 at a bonding interface surface 206. In an example, the first sinterable device part is a rolled tube that can be formed by a metal injection method or otherwise. At the same time, the second device part includes: an inlet 208, which includes a bonding surface; and an outlet 210, which has an arcuate tapered surface. In particular, the second device part has a more complex geometry and can thus be formed by an additive manufacturing process and then sintered to the rolled tube. In one example, the first sinterable device part is made of the same material as the second device part. Alternatively, the first sinterable device part is made of a different material than the second device part. In such an embodiment, the first sinterable device part can be bonded to the second device part by maintaining heat at a first sintering temperature and then ramping the heat and maintaining the heat at a second sintering temperature. Alternatively, even when the materials of the first sinterable device part and the second device part are different, a sintering aid can be applied to provide a matching sintering temperature.

[0029] Figure 4-5 Graphic usage Figure 1 4. An exemplary block device 400 formed by an additive manufacturing process. A first sinterable device part 402 can be combined with a second device part 404 at a first bonding interface surface 406, and a third device part 405 can also be combined with the first sinterable device part at a second bonding interface surface 407. As an example, the first sinterable device part can be a rolled tube that can be formed by a metal injection method or otherwise. At the same time, the second device part can include: an inlet 408, which includes a first bonding surface; and an outlet 410, which has an arcuate tapered surface. In particular, the second device part has a more complex geometry and can thus be formed by an additive manufacturing process and then sintered to the rolled tube. In one example, the first sinterable device part is made of the same material as the second device part. Similarly, the third device part also has an outlet 414 and an inlet 412 including a third bonding interface surface. In one embodiment, the outlet can have an arcuate tapered surface, and in other embodiments, the outlet can have a relatively more complex geometry. As a result, the third device part can be made by an additive manufacturing process.

[0030] The first sinterable device part may be made of a different material than the second device part and / or the third device part. To this end, the first device part, the second device part, and the third device part may each be made of a different material, the same material, or two of the three may be made of the same material, wherein the third is a different material. Based on the materials, during the sintering process, the temperature may be ramped up and maintained to the first sintering temperature, the second sintering temperature, and / or the third sintering temperature. Alternatively, a sintering aid may be applied to either or both of the first bonding surface and the second bonding surface to provide a matching sintering temperature even when the materials of the first sinterable device part, the second device part, and / or the third device part are different.

[0031] Figure 6-7 Shows that you can use Figure 1 Another example of a block device 600 formed by the process of Figure 6-7 In the embodiment of the invention, a plurality of sinterable device parts 602 can be formed by a first manufacturing process. In particular, in one example, a plurality of sinterable device parts are a plurality of plates that can be used as heat exchangers or radiators. A plurality of sinterable device parts can be bonded to a second device part 604, which includes a plurality of slots 606 or openings for receiving corresponding sinterable device parts in a plurality of sinterable device parts. The second device part thus includes a complex geometry of the slots and can be formed by an additive manufacturing process. Similar to other embodiments, the materials of the second device part and the plurality of sinterable devices can be the same or different. Moreover, sintering can occur at different bonding temperatures by using (one or more) sintering aids, etc. Thus, when the first device part is fastened to the second device part, each is heated to form an integral final device part. Furthermore, as in other embodiments, by using different manufacturing methods for different device parts and sintering the device parts together, the manufacturing cost can be reduced without reducing the overall strength of the block device. To this end, a complex geometry can be achieved. The technical effect can be an improved manufacturing process.

[0032] In one or more embodiments, a method may be provided, the method comprising heating a sinterable first device part while fastening the first device part to a second device part to form an integral final device part. Optionally, heating the sinterable first device part may cause the first device part to sinter. Alternatively, heating the sinterable first device part may not cause the second device part to sinter. On the other hand, the method may also include forming the sinterable first device part into a sinterable three-dimensional green body. Optionally, both the sinterable first device part and the second device part may be sinterable. The sinterable first device part may have a first sintering temperature, and the second device part may have a second sintering temperature different from the first sintering temperature. The method may also include heating the sinterable first device part at a temperature that may be at least as hot as the hotter sintering temperature of the first sintering temperature and the second sintering temperature. In another aspect, heating the first and second equipment parts may include: ramping the temperature at which the sinterable first and second equipment parts are heated to a first sintering temperature; and maintaining the heated temperature of the sinterable first and second equipment parts at one or more of (a) the first sintering temperature or (b) a temperature that is hotter than the first sintering temperature but cooler than the second sintering temperature. Heating the first and second equipment parts may also include ramping the heated temperature of the sinterable first and second equipment parts to the second sintering temperature.

[0033] Optionally, heating the sinterable first device part can cause the sinterable first device part to be bonded to the second device part without welding or brazing the sinterable first device part to the second device part. In one aspect, heating the sinterable first device part can cause the sinterable first device part to shrink to form an interference fit to the second device part without welding or brazing the sinterable first device part to the second device part. In another example, the sinterable first device part can be a green body with a binder, and heating the sinterable first device part can remove the binder from the green body. On the other hand, the sinterable first device part and the second device part can have substantially similar coefficients of thermal expansion.

[0034] Optionally, the method may include applying a flux to an interface between the sinterable first device part and the second device part. The flux may bond the sinterable first device part to the second device part during heating. On the other hand, the method may also include adding a sintering aid to the sinterable first device part to reduce the sintering temperature of the sinterable first device part. On the other hand, different amounts of the sintering aid may be added to different volumes of the sinterable first device part. On the other hand, the sinterable first device part may be formed by metal particles aggregated together by additive manufacturing in a green body, wherein a first density of the metal particles in the green body is substantially common throughout the green body before the sintering aid is added, and after the sinterable first device part is heated, the sinterable first device part has different densities in different volumes of the sinterable first device part.

[0035] Optionally, the method may also include forming the sinterable first device part to include one or more recesses at an interface between the sinterable first device part and the second device part. On the other hand, the method may also include forming the second device part to have an overhanging extension that extends further from the second device part than any extension of the sinterable first device part. In one or more embodiments, a method is provided, which may include: additively manufacturing a conductive green body; and obtaining a non-sinterable conductive body. The method may also include heating both the conductive green body and the non-sinterable conductive body together to sinter the conductive green body and to couple the conductive green body to the non-sinterable conductive body.

[0036] Optionally, the conductive green body and the non-sinterable conductive body may be formed of different grades of stainless steel. In another example, the conductive green body and the non-sinterable conductive body may be formed of different transition metals. In another aspect, the non-sinterable conductive body may be formed of a cermet or ceramic material. In yet another aspect, obtaining the conductive green body includes printing a three-dimensional green body. In one or more embodiments, a method is provided, which may include: coupling a sinterable conductive green body with a non-sinterable body; and sintering the sinterable conductive green body and the non-sinterable body to form a combined assembly of a sintered conductive body and a non-sinterable body.

[0037] In one embodiment, the sintering temperature difference can be used in conjunction with the difference in melting points between two materials in a single part or component. Temperature control can be used to produce a first structure or framework at a first sintering temperature having a melting temperature slightly higher than the first sintering temperature. Then, heat can be increased to produce a second structural derivative of the first structure. For example, as the first sintered material melts (now melts) at the second, higher sintering temperature, the first material can, for example, flow, drain (in the presence of passages), churn internally, etc. That is, instead of forming a static sintered part from one material, a first and temporary part is made, followed by a second derivative part structured based on the structure of the first, temporary part in which a second material is combined with a melted first material flow (hardened after cooling of the final part) and sintered (thereby producing a second structure).

[0038] Unless the context clearly stipulates otherwise, the singular forms "one", "an" and "the" include plural references. "Optional" or "optionally" means that the event or situation described subsequently may or may not occur, and means that this description may include an instance in which the event occurs and an instance in which the event does not occur. Approximate language as used throughout the specification and claims in this article can be applied to any quantitative representation that can be permitted to change without causing a change in the basic function that may be associated with it to be modified. Therefore, the value modified with (one or more) terms (such as, "approximately", "substantially" and "approximately") will not be limited to the specified exact value. In at least some instances, approximate language can correspond to the accuracy of the instrument used to measure the value. Here and throughout the specification and claims, range limitations can be combined and / or interchanged, unless the context or language indicates otherwise, such a range can be indicated and includes all sub-ranges contained therein.

[0039] This written description uses examples to disclose embodiments, including the best mode, and to enable one of ordinary skill in the art to practice the embodiments, including making and using any devices or systems and performing any incorporated methods. The claims define the patentable scope of the disclosure, and include other examples that occur to one of ordinary skill in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

1. A method for manufacturing a device part, comprising: forming a sinterable first device part from a first material comprising a first sintering temperature; forming a second device part from a second material comprising a second sintering temperature; The first equipment part is connected to the second equipment part to form an integral final equipment part by: fastening the sinterable first equipment part to the second equipment part; ramping the temperature of the sinterable first equipment part and the second equipment part to the first sintering temperature; maintaining the temperature of the sinterable first equipment part and the second equipment part at the first sintering temperature; ramping the temperature of the sinterable first device part and the second device part to the second sintering temperature; maintaining the temperature of the sinterable first equipment part and the second equipment part at the second sintering temperature, wherein the sinterable first equipment part is formed of metal particles aggregated together by additive manufacturing in a green body, wherein a first density of the metal particles aggregated together in the green body is substantially common throughout the green body, and wherein after the sinterable first equipment part is connected to the second equipment part, the sinterable first equipment part has different densities in different volumes of the sinterable first equipment part.

2. The method according to claim 1, wherein: The sinterable first device part is heated to sinter the first device part.

3. The method according to claim 1, wherein: Heating the sinterable first device part does not cause sintering of the second device part.

4. The method of claim 1, further comprising forming the sinterable first device part into a sinterable three-dimensional green body.

5. The method according to claim 1, wherein: The sinterable first device part and the second device part are both sinterable, the sinterable first device part has a first sintering temperature, and the second device part has a second sintering temperature different from the first sintering temperature, and heating the sinterable first device part occurs at a temperature at least as hot as the second sintering temperature or at a sintering temperature hotter than the second sintering temperature.

6. The method according to claim 5, wherein: Heating the first equipment part and the second equipment part comprises: ramping the temperature at which the sinterable first equipment part and the second equipment part are heated to the first sintering temperature; maintaining the heated temperature of the sinterable first equipment part and the second equipment part at one or more of (a) the first sintering temperature or (b) a temperature that is hotter than the first sintering temperature but cooler than the second sintering temperature; and The heating temperature of the sinterable first device part and the second device part is ramped to the second sintering temperature.

7. The method according to claim 1, wherein: Heating the sinterable first device part bonds the sinterable first device part to the second device part without welding or brazing the sinterable first device part to the second device part.

8. The method according to claim 1, wherein: Heating the sinterable first equipment part shrinks the sinterable first equipment part to form an interference fit to the second equipment part without welding or brazing the sinterable first equipment part to the second equipment part.

9. The method according to claim 1, wherein: The sinterable first device part is a green body having a binder, and heating the sinterable first device part removes the binder from the green body.

10. The method according to claim 1, wherein: The sinterable first device part and the second device part have substantially similar coefficients of thermal expansion.

11. The method of claim 1 further comprising applying a flux to an interface between the sinterable first device part and the second device part, the flux bonding the sinterable first device part to the second device part during heating.

12. The method according to claim 1, wherein: Different amounts of sintering aid are added to different volumes of the sinterable first device part.

13. The method according to claim 12, wherein: The sinterable first device part is formed of metal particles aggregated together by additive manufacturing in a green body, wherein a first density of the metal particles in the green body is substantially common throughout the green body before adding the sintering aid, and after heating the sinterable first device part, the sinterable first device part has different densities in the different volumes of the sinterable first device part.

14. The method of claim 1, further comprising forming the sinterable first equipment part to include one or more recesses at an interface between the sinterable first equipment part and the second equipment part.

15. The method of claim 1 further comprising forming the second equipment part to have an overhanging extension extending further from the second equipment part than any extension of the sinterable first equipment part.

16. A method of manufacturing a device part, comprising: Additive manufacturing involves conducting green bodies at sintering temperatures; obtaining a non-sinterable conductive green body comprising a melting temperature, wherein the sintering temperature is higher than the melting temperature; as well as The conductive green body and the non-sinterable conductive body are both heated together to the sintering temperature, wherein the conductive green body and the non-sinterable conductive body are heated to produce a derived structure and to couple the conductive green body with the non-sinterable conductive body.

17. The method according to claim 16, wherein: The conductive green body and the non-sinterable conductive body are formed of different grades of stainless steel.

18. The method according to claim 16, wherein: The conductive green body and the non-sinterable conductive body are formed of different transition metals.

19. The method according to claim 16, wherein: The non-sinterable conductive body is formed of a cermet or ceramic material.

20. The method according to claim 16, wherein: Obtaining the conductive green body includes printing a three-dimensional green body.

21. A method of manufacturing a device part, comprising: Forming an unsinterable green body; forming a sinterable conductive green body; forming a recess in the sinterable conductive green body at a predetermined interface between the sinterable conductive green body and the non-sinterable green body, wherein the recess is configured to facilitate coupling between the non-sinterable green body and the sinterable conductive green body; coupling the sinterable conductive green body with the non-sinterable green body around the predetermined interface by inserting the non-sinterable green body into a recessed portion of the sinterable conductive green body; and The sinterable conductive green body and the non-sinterable green body are sintered to form a combined assembly of a sintered conductive green body and the non-sinterable green body.

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