An electronic label and preparation method and related equipment

Abstract

The present invention discloses an electronic label, a preparation method and a device with the electronic label. The electronic label comprises: a thermal transfer surface material layer, a flexible RFID electronic tag, a wave-transparent board layer and an aluminum foil layer; the wave-transparent board layer is provided with a label accommodating hole, and the flexible RFID electronic tag is accommodated in the label accommodating hole; the wave-transparent board layer is respectively bonded to the thermal transfer surface material layer and the aluminum foil layer. The above-mentioned electronic label provided by the embodiment of the present invention can be directly used as a printing material to enter the printer to realize thermal transfer to facilitate the reading and writing of the printer, while ensuring the efficiency of the printing operation. The use of the wave-transparent board ensures that the overall flatness of the electronic label is ensured, while making the reading angle and distance range of the electronic label larger. The flexible RFID electronic tag is isolated from the medium to which the electronic label is attached by the aluminum foil, so as to ensure the performance consistency of the electronic tag during use, and at the same time, enhance the signal sensitivity and signal stability of the electronic tag.

Description

Technical Field

[0001] The invention relates to an electronic mark and a preparation method thereof and equipment with the electronic mark. Background Art

[0002] A sign is a sign that displays identification information to facilitate people to obtain information or services. Its identification information may include geographic location information, equipment or product LOGO information, equipment ownership information, QR code information, etc. As the application of RFID tags becomes more and more widespread, more and more signboards with RFID tags are also put into use. By attaching signboards with RFID tags to equipment or the base or pole of the equipment, the equipment can be identified. Summary of the invention

[0003] In view of the technical defects and technical drawbacks existing in the prior art, the embodiments of the present invention provide an electronic label and a preparation method thereof, and a device with an electronic label.

[0004] As one aspect of an embodiment of the present invention, it relates to an electronic label, comprising: a thermal transfer surface material layer, a flexible RFID electronic tag, a wave-transparent board layer and an aluminum foil layer;

[0005] The wave-transmitting plate layer is provided with a label receiving hole, and the flexible RFID electronic label is received in the label receiving hole;

[0006] The wave-transparent plate layer is respectively adhered to the thermal transfer surface material layer and the aluminum foil layer.

[0007] In one or some optional embodiments, in the electronic identification, the dielectric constant of the wave-transmitting board layer is 0.8-1.5, the high temperature resistance is greater than 100°C, the compression strength is greater than 0.6MPa, the tensile strength is greater than 3.40MPa, and the flame retardant grade is V-0.

[0008] In one or some optional embodiments, in the electronic label, the thickness of the aluminum foil layer is 0.03 mm to 0.1 mm.

[0009] In one or some optional embodiments, the electronic label further includes: a TPU layer; and the TPU layer is laminated to the aluminum foil layer.

[0010] In one or some optional embodiments, the electronic label further comprises: a thermoplastic polyester layer; the thermoplastic polyester layer is arranged between the thermal transfer surface material layer and the wave-transparent board layer.

[0011] In one or some optional embodiments, in the electronic label, the thermoplastic polyester layer is made of a transparent material.

[0012] In one or some optional embodiments, the electronic label further includes: a release film; the release film is bonded to the TPU layer via a pressure-sensitive adhesive.

[0013] In one or some optional embodiments, in the electronic label, the thermal transfer surface material layer, the thermoplastic polyester layer, the wave-transparent board layer, the aluminum foil layer and the TPU layer are respectively bonded together by adhesive.

[0014] In one or some optional embodiments, in the electronic label, the adhesive has a high temperature resistance greater than 200°C.

[0015] As another aspect of an embodiment of the present invention, it relates to a method for preparing the above-mentioned electronic mark, comprising:

[0016] Die-cutting the wave-transmitting plate layer to obtain a label receiving hole;

[0017] Laminating the wave-transparent plate layer and the aluminum foil layer, and accommodating the flexible RFID electronic tag in the tag accommodating hole;

[0018] The thermal transfer surface material layer is laminated to the wave-transparent board layer.

[0019] In one or some optional embodiments, in the method for preparing the electronic label, before laminating the wave-transparent plate layer to the aluminum foil layer, the method further includes: laminating the TPU layer to the aluminum foil layer.

[0020] In one or some optional embodiments, in the method for preparing the electronic label, before laminating the TPU layer with the aluminum foil layer, it also includes: bonding the TPU layer with a release film and attaching glue to the TPU layer; and attaching glue to the aluminum foil layer.

[0021] In one or some optional embodiments, in the method for preparing the electronic label, laminating the thermal transfer surface material layer with the wave-transparent board layer comprises:

[0022] The thermoplastic polyester layer is laminated between the wave-transparent board layer and the thermal transfer surface material layer.

[0023] In one or some optional embodiments, the method for preparing the electronic label, before laminating the thermoplastic polyester layer between the wave-transparent board layer and the thermal transfer surface material layer, further comprises:

[0024] The wave-transparent board layer, the thermoplastic polyester layer and the thermal transfer surface material layer are attached with glue.

[0025] In one or some optional embodiments, the method for preparing the electronic label further comprises: die-cutting the bonded electronic label.

[0026] As a third aspect of an embodiment of the present invention, it relates to a device with an electronic identification, including the above-mentioned electronic identification.

[0027] The embodiments of the present invention achieve at least the following technical effects:

[0028] The above-mentioned electronic identification provided by the embodiment of the present invention adopts a multi-layer structure. By setting a label accommodating hole in the wave-transmitting plate layer, the flexible RFID electronic label is accommodated in the label, thereby ensuring the overall flatness of the electronic identification. In addition, each layer structure of the electronic label is made of flexible material, so that the electronic identification has good bending resistance and high tensile strength. The electronic identification can be directly used as a printing material to enter the printer for thermal transfer. During printing, the printer can also conveniently read and write the flexible RFID electronic label, thereby ensuring the efficiency of the printing operation.

[0029] The above-mentioned electronic identification provided by the embodiment of the present invention adopts a wave-transparent plate to accommodate a flexible RFID electronic tag. While ensuring the overall flatness of the electronic identification, since the wave-transparent plate is a low-dielectric material with weather-resistant properties, it can reduce interface reflection and transmission loss during electromagnetic wave transmission, and has little obstruction effect on the signal of the accommodated flexible RFID electronic tag, ensuring that the signal of the flexible RFID electronic tag can be transmitted normally, thereby making the reading angle and distance range of the electronic identification larger.

[0030] The electronic identification provided by the embodiment of the present invention isolates the flexible RFID electronic tag from the medium to which the electronic tag is attached by aluminum foil, reflects the signal transmitted by the flexible RFID electronic tag, and ensures the performance consistency of the electronic tag during use. At the same time, due to the anti-metal property of the aluminum foil, a coupling magnetic field is generated between the aluminum foil and the flexible RFID electronic tag, and the signal frequency deviation is compensated by coupling. The signal frequency of the electronic tag is more stable, the signal sensitivity and signal stability of the electronic tag are enhanced, and the transmission capacity of the electronic tag is also more stable.

[0031] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structure described in the written description, claims, and drawings.

[0032] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0034] Figure 1 A schematic diagram of the structure of an electronic identification provided by an embodiment of the present invention;

[0035] Figure 2 A schematic flow chart of a method for preparing an electronic label provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0037] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0038] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0039] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] The inventor of the present invention has found that the identification plate with RFID tag in the prior art usually directly adopts a simple layered structure. Since the area of ​​the RFID tag is small and it has a certain thickness, the identification plate after the multi-layer structure is composite-molded is protruding at the position of the RFID tag. Therefore, before the identification plate is composite-molded, it is necessary to print the identification information on the thermal transfer surface material first. And because the identification plate is uneven, when the identification plate with RFID tag is attached to the device or the base or rod of the device, it is easy to cause signal deviation of the electronic identification, affecting the signal stability and transmission capacity of the RFID tag. In order to at least partially solve the technical problems existing in the prior art, the inventor has made the present invention, and provides an electronic identification, a method for preparing an electronic identification and a device with the electronic identification through specific implementation methods.

[0041] Example 1

[0042] Reference Figure 1 As shown, an embodiment of the present invention provides an electronic identification, including: a thermal transfer surface material layer 1, a flexible RFID electronic tag 2, a wave-transparent board layer 3 and an aluminum foil layer 4;

[0043] The wave-transmitting plate layer 3 is provided with a label receiving hole, and the flexible RFID electronic label 2 is received in the label receiving hole;

[0044] The wave-transparent plate layer 3 is respectively adhered to the thermal transfer surface material layer 1 and the aluminum foil layer 4 .

[0045] In the embodiment of the present invention, the flexible RFID electronic tag 2 can adopt the RFID electronic tag in the prior art, and its specific structure can refer to the detailed description in the prior art. In the embodiment of the present invention, the identification information of the electronic identification is set on the thermal transfer surface material layer 1, and the information content and style contained in the identification information can be set according to actual needs. In the embodiment of the present invention, no specific limitation is made here.

[0046] The above-mentioned electronic identification provided by the embodiment of the present invention adopts a multi-layer structure. By setting a label accommodating hole in the wave-transparent plate layer 3, the flexible RFID electronic label 2 is accommodated in the label, thereby ensuring the overall flatness of the electronic identification. In addition, each layer structure of the electronic label is made of flexible material, so that the electronic identification has good bending resistance and high tensile strength. The electronic identification can be directly used as a printing material to enter the printer for thermal transfer. During printing, the printer can also conveniently read and write the flexible RFID electronic label 2, thereby ensuring the efficiency of the printing operation.

[0047] The above-mentioned electronic identification provided by the embodiment of the present invention adopts a wave-transparent plate to accommodate the flexible RFID electronic tag 2. While ensuring the overall flatness of the electronic identification, since the wave-transparent plate is a low-dielectric material with weather-resistant properties, it can reduce the interface reflection and transmission loss during the electromagnetic wave transmission process, and has little obstruction effect on the signal of the accommodated flexible RFID electronic tag 2, ensuring that the signal of the flexible RFID electronic tag 2 can be transmitted normally, thereby making the reading angle and distance range of the electronic identification larger.

[0048] The electronic identification provided in the embodiment of the present invention isolates the flexible RFID electronic tag 2 from the medium to which the electronic identification is attached by aluminum foil, reflects the signal transmitted by the flexible RFID electronic tag 2, and ensures the performance consistency of the electronic tag during use. At the same time, due to the anti-metal property of the aluminum foil, a coupling magnetic field is generated between the aluminum foil and the flexible RFID electronic tag 2, and the signal frequency deviation is compensated by coupling. The signal frequency of the electronic tag is more stable, the signal sensitivity and signal stability of the electronic tag are enhanced, and the transmission capacity of the electronic tag is also more stable.

[0049] In one embodiment, in the electronic label, the dielectric constant of the wave-transmitting plate layer 3 is 0.8-1.5, the high temperature resistance is greater than 100° C., the compression strength is greater than 0.6 MPa, the tensile strength is greater than 3.40 MPa, and the flame retardant grade is V-0.

[0050] In the embodiment of the present invention, when electromagnetic waves are transmitted to the surface of ordinary dielectric materials, interface reflection inevitably occurs, which directly affects the transmission energy of electromagnetic waves. In order to weaken this interface influence, a wave-transparent plate is used as a non-conductive dielectric layer in the electronic identification. The wave-transparent plate has a low dielectric constant, so the impedance to electromagnetic waves is smaller, the loss of signal transmission is reduced, and the interface influence can be well weakened, so that the impedance matching of the multi-layer structure of the electronic identification is achieved, so that the front and side signal transmission of the flexible RFID electronic tag 2 is not affected, and the signal propagation capability is enhanced; and the wave-transparent plate has good compression resilience and flexibility, and at the same time, has the characteristics of aging resistance, acid and alkali resistance, high temperature resistance, flame retardancy, etc., so that the electronic identification can be used in complex environments, and the service life and mechanical stability of the electronic identification can also be guaranteed.

[0051] In one embodiment, in the electronic label, the thickness of the aluminum foil layer 4 is 0.03 mm to 0.1 mm.

[0052] In the embodiment of the present invention, the aluminum foil layer 4 is used as an anti-metal label layer, which is mainly used to isolate the electronic label from the environment behind it and improve the sensitivity of the electronic label. If the thickness of the aluminum foil layer 4 is too large, it will affect the performance of the electronic label. If the thickness of the aluminum foil layer 4 is too thin, the aluminum foil is prone to wrinkles when bent or twisted, and the electronic label may drift in signal frequency. Based on this, the inventor of the present invention found through experiments that setting the thickness of the aluminum foil layer 4 to between 0.03mm and 0.1mm can not only ensure the signal performance of the electronic label, but also prevent the aluminum foil from wrinkling during the use of the electronic label, thereby affecting the performance of the electronic label and affecting the signal transmission of the flexible RFID electronic tag 2.

[0053] In one embodiment, the electronic label further includes: a TPU layer 5 ; the TPU layer 5 is laminated to the aluminum foil layer 4 .

[0054] Since the material of the dielectric layer in the prior art is prone to bending and deformation, patterns and cracks are likely to appear on the surface of the dielectric layer, causing the signal frequency of the electronic mark to drift and affecting the signal stability of the electronic mark. In the embodiment of the present invention, in order to enhance the bending resistance of the electronic mark, a TPU material with better softness is added after the aluminum foil layer 4 of the electronic mark. When the electronic mark is bent, for example, when the electronic mark is fixed on a distribution pole tower, the force of the bent part can be dispersed, releasing the internal force, ensuring the overall flatness of the electronic mark when it is bent, preventing the electronic mark from wrinkling, and ensuring the signal reading accuracy of the electronic mark and the appearance integrity of the electronic mark.

[0055] In one embodiment, the electronic label further comprises: a thermoplastic polyester layer 6 ; the thermoplastic polyester layer 6 is disposed between the thermal transfer surface material layer 1 and the wave-transmitting board layer 3 .

[0056] In a specific embodiment, the thermoplastic polyester layer 6 may be made of a transparent material.

[0057] In the embodiment of the present invention, the thermoplastic polyester layer 6 serves as a protective layer for encapsulating the flexible RFID electronic tag 2, and encapsulates the flexible RFID electronic tag 2 in the tag receiving hole of the wave-transparent plate. At the same time, due to the structural characteristics of the thermal transfer material itself, the flatness of the thermal transfer surface material itself is poor. By arranging the thermoplastic polyester layer 6 between the thermal transfer material layer and the wave-transparent plate layer 3, the surface of the electronic label can be made flat, which is more conducive to the thermal transfer of the electronic label.

[0058] In an embodiment of the present invention, the thermoplastic polyester layer 6 is transparent. Before the thermoplastic polyester layer 6 of the electronic label is compounded with the thermal transfer surface material layer 1, the label information of the flexible RFID electronic tag 2 can be intuitively displayed, which is convenient for reading, writing and matching during the preparation process of the electronic label.

[0059] In one embodiment, the electronic label further includes: a release film 7 ; the release film 7 and the TPU layer 5 are bonded together via a pressure-sensitive adhesive 8 .

[0060] In the embodiment of the present invention, the pressure-sensitive adhesive 8 can adopt the high-strength pressure-sensitive adhesive 8 in the prior art, so as to facilitate the attachment of the electronic label to the distribution pole tower, equipment, etc., and ensure that the electronic label is firmly attached.

[0061] The electronic label provided in the embodiment of the present invention is rolled up by the release film 7 before being attached to the area to be labeled, so that the electronic label can be easily stored and transported, and multiple electronic labels attached to the release film 7 can also be easily rolled up to form a roll.

[0062] In one embodiment, in the electronic label, the thermal transfer surface material layer 1, the thermoplastic polyester layer 6, the wave-transparent plate layer 3, the aluminum foil layer 4 and the TPU layer 5 are respectively bonded together by adhesive 9.

[0063] In a specific embodiment, the adhesive 9 has a high temperature resistance greater than 200°C.

[0064] In the embodiment of the present invention, the multi-layer structure of the electronic tag is bonded together by a high temperature resistant adhesive 9, so that the electronic tag can be better adapted to a high temperature environment during use, thereby improving the temperature tolerance of the electronic tag.

[0065] Example 2

[0066] Based on the same inventive concept, Figure 2 As shown, an embodiment of the present invention also provides a method for preparing an electronic mark, which includes:

[0067] S101: die-cutting the wave-transmitting plate layer 3 to obtain a label receiving hole;

[0068] S102: Laminating the wave-transmitting plate layer 3 and the aluminum foil layer 4, and accommodating the flexible RFID electronic tag 2 in the tag accommodating hole;

[0069] S103: Laminating the thermal transfer surface material layer 1 and the wave-transparent board layer 3 .

[0070] The method for preparing the above-mentioned electronic identification provided in the embodiment of the present invention can obtain the electronic identification described in the above-mentioned embodiment 1. The principle of solving the problem by this method is similar to that of the above-mentioned electronic identification. Therefore, the implementation of this method can refer to the specific implementation method of the electronic identification in the above-mentioned embodiment 1, and the repeated parts will not be repeated.

[0071] In the preparation method of the electronic identification provided by the embodiment of the present invention, the specific implementation method of die-cutting the wave-transparent board layer 3 can refer to the description in the prior art. When the layers of the electronic identification are composited, the wave-transparent board layer 3 and the aluminum foil layer 4 are first laminated and composited, the flexible RFID electronic tag 2 is placed in the receiving hole, and then the thermal transfer surface material layer 1 is laminated with the wave-transparent board layer 3. This can prevent the flexible RFID electronic tag 2 from being squeezed or damaged during the production process, and at the same time, ensure the accurate position of the flexible RFID electronic tag 2.

[0072] In one embodiment, the method for preparing the electronic label further includes laminating the TPU layer 5 to the aluminum foil layer 4 before laminating the wave-transmitting plate layer 3 to the aluminum foil layer 4 .

[0073] In the method for preparing the electronic label provided by the embodiment of the present invention, the TPU layer 5 is first bonded to the aluminum foil layer 4, which can prevent the aluminum foil layer 4 from bending or being damaged during the production process, thereby ensuring that the electronic label is prepared in a good quality.

[0074] In one embodiment, in the method for preparing the electronic label, before laminating the TPU layer 5 with the aluminum foil layer 4, the method further includes: bonding the TPU layer 5 with the release film 7 to attach glue to the TPU layer 5; and attaching glue to the aluminum foil layer 4.

[0075] In the embodiment of the present invention, the method of attaching the glue to the TPU layer 5 and the aluminum foil, and the method of bonding the TPU layer 5 to the release film 7 can refer to the specific implementation methods in the prior art, and are not specifically limited in the embodiment of the present invention.

[0076] In one embodiment, in the method for preparing the electronic label, laminating the thermal transfer surface material layer 1 with the wave-transparent board layer 3 comprises:

[0077] The thermoplastic polyester layer 6 is laminated between the wave-transparent board layer 3 and the thermal transfer surface material layer 1 .

[0078] In a specific embodiment, the method for preparing the electronic label, before laminating the thermoplastic polyester layer 6 between the wave-transparent plate layer 3 and the thermal transfer surface material layer 1, further comprises:

[0079] The wave-transparent plate layer 3, the thermoplastic polyester layer 6 and the thermal transfer surface material layer 1 are attached with glue.

[0080] In the embodiment of the present invention, the method of attaching glue to the aluminum foil and bonding the aluminum foil and the release film 76 can refer to the specific implementation methods in the prior art, and no specific limitation is made in the embodiment of the present invention.

[0081] In one embodiment, the method for preparing the electronic label further comprises: die-cutting the bonded electronic label.

[0082] In the embodiment of the present invention, the implementation method of die-cutting the electronic logo can refer to the specific implementation method of die-cutting the electronic logo in the prior art, and is not specifically limited in the embodiment of the present invention.

[0083] Example 3

[0084] Based on the same inventive concept, an embodiment of the present invention further provides a device with an electronic identification, including the electronic identification described in the above embodiment 1.

[0085] The above-mentioned device with electronic identification provided in the embodiment of the present invention can be any device in the prior art. The specific implementation method of the electronic identification in the device can refer to the detailed description of the electronic identification in the above-mentioned embodiment 1, and the repeated parts will not be repeated.

[0086] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0087] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electronic identification, characterized in that: include: Thermal transfer surface material layer, flexible RFID electronic tag, wave-transparent board layer and aluminum foil layer; The wave-transmitting plate layer is provided with a label accommodating hole, and the flexible RFID electronic label is accommodated in the label accommodating hole, thereby ensuring that the overall flatness of the electronic label is good, so that the electronic label can be directly used as a printing material to enter the printer for thermal transfer, and the flexible RFID electronic label can be read and written during printing, and the interface reflection and transmission loss during the electromagnetic wave transmission process are reduced, and the signal obstruction effect on the accommodated flexible RFID electronic label is very small, ensuring that the signal of the flexible RFID electronic label can be transmitted normally; The wave-transparent plate layer is respectively attached to the thermal transfer surface material layer and the aluminum foil layer, and the flexible RFID electronic tag is isolated from the medium to which the electronic label is attached by the aluminum foil layer, and the signal transmitted by the flexible RFID electronic tag is reflected to ensure the performance consistency of the electronic tag during use. At the same time, due to the anti-metal property of the aluminum foil, the signal frequency deviation is compensated by coupling; The dielectric constant of the wave-transmitting plate layer is 0.8-1.5, the high temperature resistance is greater than 100°C, the compression strength is greater than 0.6MPa, the tensile strength is greater than 3.40MPa, and the flame retardant grade is V-0; The thickness of the aluminum foil layer is 0.03 mm to 0.1 mm; The electronic label further comprises: a TPU layer; the TPU layer is laminated with the aluminum foil layer; The electronic label further comprises: a thermoplastic polyester layer; the thermoplastic polyester layer is arranged between the thermal transfer surface material layer and the wave-transparent board layer; the thermoplastic polyester layer is made of transparent material.

2. The electronic identification according to claim 1, characterized in that: Also includes: Release film; the release film and the TPU layer are bonded together by a pressure-sensitive adhesive.

3. The electronic identification according to claim 2, characterized in that: The thermal transfer surface material layer, the thermoplastic polyester layer, the wave-transparent plate layer, the aluminum foil layer and the TPU layer are respectively bonded together by adhesive.

4. The electronic identification according to claim 3, characterized in that: The adhesive has a high temperature resistance of greater than 200°C.

5. A method for preparing an electronic mark according to any one of claims 1 to 4, characterized in that: include: Die-cutting the wave-transmitting plate layer to obtain a label receiving hole; Laminating the wave-transparent plate layer and the aluminum foil layer, and accommodating the flexible RFID electronic tag in the tag accommodating hole; The thermal transfer surface material layer is laminated to the wave-transparent board layer.

6. The method for preparing an electronic mark according to claim 5, characterized in that: Before laminating the wave-transparent plate layer to the aluminum foil layer, the method further includes laminating the TPU layer to the aluminum foil layer.

7. The method for preparing an electronic mark according to claim 6, characterized in that: Before laminating the TPU layer to the aluminum foil layer, the method further includes: bonding the TPU layer to a release film and attaching glue to the TPU layer; and attaching glue to the aluminum foil layer.

8. The method for preparing an electronic mark according to claim 5, characterized in that: The step of laminating the thermal transfer surface material layer to the wave-transparent board layer comprises: The thermoplastic polyester layer is laminated between the wave-transparent board layer and the thermal transfer surface material layer.

9. The method for preparing an electronic mark according to claim 8, characterized in that: Before laminating the thermoplastic polyester layer between the wave-transparent board layer and the thermal transfer surface material layer, the method further comprises: The wave-transparent board layer, the thermoplastic polyester layer and the thermal transfer surface material layer are attached with glue.

10. The method for preparing an electronic mark according to claim 8, characterized in that: Also includes: Die-cut the bonded electronic logo.

11. A device with an electronic mark, characterized in that: Including the electronic identification described in any one of claims 1-4.

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