Device and method for testing an interconnect bonding part

Abstract

An interconnect bonding part testing device for testing the bonding strength of an electronic device, the electronic device including at least one interconnect bonding part attached to the electronic device. The interconnect bonding part testing device has a positioning mechanism and a test tool assembly mounted on the positioning mechanism. The test tool assembly is configured to push a first part of the interconnect bonding part and lift a second part of the interconnect bonding part, and the positioning mechanism operates to align the test tool assembly with the interconnect bonding part during the test, and apply a pushing force to the first part of the interconnect bonding part and a pulling force to the second part of the interconnect bonding part. The interconnect bonding part testing device has a fixture, which includes at least one force sensing element mounted thereon. The at least one force sensing element is configured to apply a resistance force to the test tool assembly when engaging with the test tool assembly.

Description

Technical Field

[0001] The present invention relates to an apparatus and method for testing the strength of interconnect bonds such as wire bonds on an electronic device, and more particularly to an apparatus capable of performing both shear tests and tensile tests. Background Art

[0002] In the process of assembling and packaging semiconductors, a wire bonder is used to electrically interconnect a semiconductor wafer and a substrate. Wires are supplied from a coil containing bonding wires to a capillary to perform wire bonding. Generally, each bond includes a segment of gold or copper wire bonded to the surface of the substrate.

[0003] Testing the strength of the bonds is important for the user to confirm whether a particular wire or interconnect bond formed is qualified. Due to the size of the bond, the test tool for testing the bond strength of these bonds must be able to accurately measure very small forces and deflections.

[0004] There are various known types of bond tests, such as shear tests and pull tests. The shear test tests the shear strength of the bond by applying a shear force to the side of the bond to shear off the bond from the substrate. The tensile test tests the pull strength of the wire bond by pulling the wire away from the wire bond.

[0005] The machines for performing these tests usually have a test tool that can be placed relative to the bond to perform the test. Then, the test tool can be moved to perform the test, which typically involves measuring the force required to break the bond. Since the user has to perform such tests manually and also use different machines to perform different types of tests, it is very time-consuming.

[0006] In addition, since the performance of the machine changes over time, the force generated by the motor or the force detected by the sensor will fluctuate over a period of time. If this occurs in mass production, the test accuracy will be affected. Therefore, in order to perform preventive maintenance on the test machine, the user needs to manually perform force tests regularly (sometimes weekly or even daily). This is both cumbersome and time-consuming, thereby reducing the overall equipment efficiency of the machine.

[0007] Therefore, it would be beneficial to design an interconnect bond test apparatus that avoids and overcomes these drawbacks. Summary of the Invention

[0008] Therefore, an object of the present invention is to provide an interconnect bond test apparatus suitable for performing shear tests and pull tests on interconnect bonds formed on an electronic device.

[0009] Another object of the present invention is to provide an interconnect bond test apparatus suitable for performing self-monitoring machine force tests.

[0010] Accordingly, a first aspect of the present invention provides an interconnect bonding portion testing device for testing the bonding strength of an electronic device, the electronic device including at least one interconnect bonding portion attached to the electronic device, the interconnect bonding portion testing device including: a positioning mechanism; a testing tool assembly mounted on the positioning mechanism and configured to push a first portion of the interconnect bonding portion and lift a second portion of the interconnect bonding portion during testing; a fixture including at least one force sensing element mounted on the fixture, and the at least one force sensing element being configured to apply a resistance force to the testing tool assembly when engaging with the testing tool assembly, wherein the positioning mechanism operates to align the testing tool assembly with the interconnect bonding portion during testing, and apply a pushing force to the first portion of the interconnect bonding portion and a pulling force to the second portion of the interconnect bonding portion.

[0011] In one embodiment, the testing tool assembly includes a first testing tool and a second testing tool, the first testing tool being configured to apply a pushing force to push a first portion of the interconnect bonding portion, and the second testing tool being configured to apply a pulling force to lift a second portion of the interconnect bonding portion.

[0012] In one embodiment, the direction of the pushing force is perpendicular to the direction of the pulling force.

[0013] In one embodiment, the interconnect bonding portion testing device further includes at least one sensor connected to the first testing tool and the second testing tool, the at least one sensor operating to determine the reaction forces applied to the first testing tool and the second testing tool when applying the pushing force and the pulling force.

[0014] In one embodiment, the at least one sensor is a first force sensor.

[0015] In one embodiment, the bottom end of the first testing tool away from the positioning mechanism has a pointed end portion configured to engage with the first portion of the interconnect bonding portion when applying the pushing force.

[0016] In one embodiment, the second testing tool has a hook at its distal end away from the positioning mechanism, the hook being configured to engage with the second portion of the interconnect bonding portion when applying the pulling force.

[0017] In one embodiment, the at least one force sensing element includes at least one flexure portion.

[0018] In one embodiment, the fixture further includes a constant weight portion mounted to the fixture, and the testing tool assembly is configured to engage and lift the constant weight portion.

[0019] In one embodiment, the constant weight portion is a self-weight block.

[0020] In one embodiment, the at least one force sensing element further includes a second force sensor.

[0021] In one embodiment, the second force sensor is a strain gauge.

[0022] In one embodiment, the fixture further includes a lever block mounted on the fixture, and the test tool assembly is configured to engage and lift the lever block.

[0023] In one embodiment, the second force sensor is a piezoelectric sensor.

[0024] In one embodiment, the second force sensor is a bending type sensor.

[0025] According to a second aspect of the present invention, there is provided a method for testing the bonding strength of an electronic device, the electronic device including at least one interconnect bonding portion attached to the electronic device, the method including the steps of: providing a test tool assembly mounted on a positioning mechanism; moving the test tool assembly with the positioning mechanism to align the test tool assembly with the interconnect bonding portion; applying a pushing force to a first portion of the interconnect bonding portion and a pulling force to a second portion of the interconnect bonding portion with the test tool assembly; engaging the test tool assembly with a force sensing element mounted on the fixture; and determining a reaction force applied to the test tool assembly through the force sensing element.

[0026] In one embodiment, the test tool assembly includes a first test tool and a second test tool, the first test tool being configured to apply a pushing force to a first portion of the interconnect bonding portion, and the second test tool being configured to apply a pulling force to a second portion of the interconnect bonding portion.

[0027] In one embodiment, the steps of applying the pushing force and the pulling force further include the step of: determining a reaction force applied to the first and second test tools with at least one sensor connected to the first and second test tools.

[0028] The following description of the specification, the appended claims and the drawings are helpful for better understanding the above and other features, aspects and advantages. Description of the Drawings

[0029] Embodiments of the present invention will be described hereinafter by way of example only with reference to the drawings, wherein.

[0030] Figure 1 is an isometric view of an interconnect bonding portion testing device according to a first preferred embodiment of the present invention.

[0031] Figure 2 The front view of the positioning mechanism on which the test tool assembly is mounted.

[0032] Figure 3 The isometric view of the fixture on which a force sensing element and a self-weight block are mounted.

[0033] Figure 4A The front view of the positioning mechanism, in which the test tool engages with the fixture during the self-monitoring machine shear force test.

[0034] Figure 4B The close-up view of the force sensing element marked with reference signs.

[0035] Figure 5A The isometric view of the fixture, in which the force sensing element engages with the first test tool.

[0036] Figure 5B The graph showing the relationship between the reaction force at the tip of the shear tool learned by the machine and the distance moved by the shear tool.

[0037] Figure 6A The isometric view of the lifting tool that engages with the self-weight block and lifts it.

[0038] Figure 6B Is Figure 6A The side view of the lifting tool shown, in which a sensor is connected to the lifting tool.

[0039] Figure 6C The graph showing the force required for the lifting tool to lift the self-weight block over a period of time.

[0040] Figure 7A The isometric view of the interconnect bonding part test device according to the second preferred embodiment of the present invention.

[0041] Figure 7B Is Figure 7A The side view of the interconnect bonding part test device shown.

[0042] Figure 8A The cross-sectional side view of the interconnect bonding part test device according to the second preferred embodiment of the present invention.

[0043] Figure 8B The plan view of the wire bonding part test device according to the third preferred embodiment of the present invention.

[0044] Figure 8C Is along Figure 8B The cross-sectional view taken along line A-A shown.

[0045] Figure 9A The cross-sectional side view according to the third preferred embodiment of the present invention, in which a flexure piece is mounted on the fixture.

[0046] Figure 9B is Figure 9A a plan view of, in which a plurality of flexure sheets are mounted on the fixture.

[0047] Figure 10 is a side view of a shearing tool for pushing a pressure sensor. Detailed implementation manner

[0048] Figure 1 is an isometric view of an interconnect bonding part testing device 10 according to a first preferred embodiment of the present invention. For example, a wire bonder can be used to create the interconnect bonding part to be tested. Generally, the interconnect bonding part testing device 10 includes a positioning mechanism 20, a pair of front and rear tracks 12, 14, and a fixture 30, and a test tool assembly 22 is mounted on the positioning mechanism.

[0049] The fixture 30 is mounted on a frame 18, and the frame 18 is in turn mounted on the front track 12. The fixture 30 may have a plurality of through holes 38. The fixture 30 can be mounted on the frame 18 by any suitable fastening means, for example, screws or fasteners fixed by means of the through holes 38. Alternatively, the fixture 30 can also be mounted on the frame 18 by a suitable adhesive. The frame 18 can be mounted on the front track 12 by any suitable fastening means, such as screws or fasteners. Alternatively, the frame 18 can also be mounted on the front track 12 by a suitable adhesive. Therefore, the position of the fixture 30 relative to the front track 12 is fixed.

[0050] The front track 12 and the rear track 14 are spaced apart from each other in the transverse direction such that the front track 12 is located between the fixture 30 and the rear track 14. The front track 12 is substantially parallel to the rear track 14. A stage 16 is provided between the front track 12 and the rear track 14, which is adapted to receive an electronic device supported by a substrate such as a lead frame 19 for testing. This embodiment will be described with reference to the lead frame. However, those skilled in the art can understand that the bonding strength test disclosed in the present invention is equally applicable to other substrates other than the lead frame.

[0051] The lead frame 19 can be held on the stage 16 by a clamping device. For example, the lead frame 19 can be mechanically clamped on the stage by a gripper (not shown), and then further held on the stage 16 by a vacuum suction device provided on the stage 16. The lead frame 19 is adapted to engage with the test tool assembly 22 during a shear test or a pull test.

[0052] The positioning mechanism 20 can be connected to an XY drive mechanism (not shown), and the XY drive mechanism drives the positioning mechanism 20 to move through the XY axes on a horizontal plane. Alternatively, the XY drive mechanism can be connected to the stage 16 that holds the lead frame 19, so as to drive the stage 16 to move through the XY axes on a horizontal plane. A separate Z-axis drive mechanism (not shown) can be connected to the positioning mechanism 20 to drive the positioning mechanism 20 to move vertically in the Z direction. The X-, Y-, and Z-axis drive mechanisms can operate together or separately according to programming instructions from a processor to move the positioning mechanism 20. For example, the positioning mechanism 20 can be programmed to move so that the test tool assembly 22 is located above the interconnect bonding portion and is bonded to the interconnect bonding portion on the lead frame 19.

[0053] The interconnect bonding portion test device 10 can be configured, for example, to perform a shear ball push test and a wire pull test on the interconnect bonding portions of an electronic device. Although the present disclosure relates to interconnect bonding portions, those skilled in the art can understand from the disclosed content that the present invention is not limited thereto. For example, the interconnect bonding portion can be, but is not limited to, a wire bond, a ball bond, a ball bump, a ball-solder-on-bump (BSOB), a bump-after-ball (BBOS), a ball vertical array (BVA), a stacked die wire bond, a die attach bond, and a wedge bond. How to perform the shear ball push test and the wire pull test according to embodiments of the present invention will be described below.

[0054] Referring to Figure 1 , the test tool assembly 22 is configured to perform a shear ball push test and / or a wire pull test on an electronic device supported on the lead frame 19. The stacked lead frames to be tested can be loaded onto a magazine (not shown) that is spaced apart from the stage 16. The user determines the lead frame to be tested. During the test, a feeder (not shown) pushes the selected lead frame onto the stage 16. The lead frame 19 can be mechanically clamped on the stage by a gripper (not shown) first, and then further held on the stage 16 by generating vacuum suction on the stage 16.

[0055] During the shear push ball test, the XY drive mechanism drives the positioning mechanism 20 to move such that the shear tool of the test tool assembly 22 is positioned above the interconnect bond to be tested. Then, the Z-axis drive mechanism drives the positioning mechanism 20 to move vertically downward toward the interconnect bond to be tested. Once the shear tool contacts the top surface of the electronic device or lead frame 19 adjacent to the interconnect bond to be tested, the positioning mechanism 20 is lifted vertically upward to a predetermined height to lift the shear tool 24 to the same height. This predetermined height can be determined by user programming and depends on the size of the interconnect bond to be tested. Thereafter, the XY drive mechanism drives the positioning mechanism 20 to move so as to push the interconnect bond until the interconnect bond is completely sheared off. When the shear tool pushes the interconnect bond, the interconnect bond exerts a reaction force on the tip of the shear tool. Then, a sensor connected to the shear tool can measure the reaction force required to completely push the interconnect bond away from the lead frame, thereby obtaining the ball shear force.

[0056] In an alternative arrangement where the XY drive mechanism is connected to the stage 16, the XY drive mechanism drives the stage 16 holding the lead frame 19 such that the shear tool of the test tool assembly 22 is positioned above the interconnect bond to be tested. Then, the Z-axis drive mechanism drives the positioning mechanism 20 to move vertically downward toward the interconnect bond to be tested. Once the shear tool contacts the top surface of the electronic device or lead frame 19 adjacent to the interconnect bond to be tested, the positioning mechanism 20 is lifted vertically upward to a predetermined height to lift the shear tool 24 to the same height. This predetermined height can be determined by user programming and depends on the size of the interconnect bond to be tested. Thereafter, the XY drive mechanism drives the stage to push the tip of the shear tool 24 until the interconnect bond is completely sheared off.

[0057] During the wire pull test, the XY drive mechanism drives the positioning mechanism 20 to move such that the pulling tool of the test tool assembly 22 is positioned above the interconnect bond to be tested. Then, the Z-axis drive mechanism drives the positioning mechanism 20 to move vertically downward toward the interconnect bond to be tested. The hook on the pulling tool engages the wire of the interconnect bond to be tested. Then, the Z-axis drive mechanism drives the pulling tool to pull the wire of the interconnect bond upward toward the positioning mechanism until the wire breaks or the bond disconnects and is lifted off the lead frame 19 (whichever occurs earlier). A sensor connected to the pulling tool then measures the pulling force required to lift the wire until the wire breaks or the bond disconnects, thereby obtaining the wire pull force.

[0058] In an alternative arrangement where the XY drive mechanism is connected to the stage 16, the XY drive mechanism can drive the stage 16 that holds the lead frame 19 such that the lifting tool of the test tool assembly 22 is positioned above the interconnect bond to be tested. Subsequently, the Z-axis drive mechanism drives the positioning mechanism 20 to move vertically downward toward the interconnect bond to be tested. The hook on the lifting tool engages with the wire of the interconnect bond to be tested. Then, the Z-axis drive mechanism drives the lifting tool to lift the wire of the interconnect bond upward toward the positioning mechanism until the wire breaks or the bond disconnects and is lifted off the lead frame 19 (whichever occurs earlier). Thus, the interconnect bond testing apparatus according to the present invention allows the shear test and the pull test to be performed on the same machine. Consequently, different types of tests can be carried out without the need to use multiple machines or manually change the test tools of the machine. The advantage is that little manual intervention is required because the shear ball push test and the wire pull test can be automatically performed and the results sent to the processor.

[0059] Moreover, the user can also select which test to perform (shear ball push test or wire pull test) on their own, and it can be programmed according to the user's requirements. For example, the user may prefer to perform the wire pull test before the shear ball push test to save costs. In this example, after performing the wire pull test until the wire breaks, the remaining ball bond can still be used for the shear ball push test, thus minimizing waste of resources. However, if the shear ball push test is performed first, the wire pull test cannot be performed on the same ball bond because the ball bond has been sheared off by then.

[0060] After the shear ball push test and the wire pull test are performed on the lead frame, a pushing device (not shown) pushes the lead frame to unload it from the stage 16. Subsequently, the stage 16 is ready to receive the next lead frame for testing. This makes the entire testing of the interconnect bond fully automated without manual intervention.

[0061] When operating the above-described interconnect bond testing apparatus 10, the performance of the drive mechanism and the sensors changes over time, resulting in the driving force and the sensed force fluctuating over a period of time, making the test results increasingly inaccurate. Therefore, it is preferable to periodically detect the interconnect bond testing apparatus 10 to ensure that it can continue to operate as expected especially without human intervention.

[0062] Figure 2 is a front view of the positioning mechanism 20 on which the test tool assembly 22 is mounted. The test tool assembly 22 includes a shear tool 24 and a lifting tool 26. The shear tool 24 has a pointed end 25 at the bottom end away from the positioning mechanism 20. Preferably, the shape of the pointed end 25 is conical (more clearly as Figure 5Aas shown). The cutting tool 24 is connected to a sensor (not shown). The lifting tool 26 has a hook 27 at the bottom end away from the positioning mechanism 20. The lifting tool 26 is connected to a sensor 38 (as Figure 6B shown).

[0063] An image sensor 28 is also mounted on the positioning mechanism 20 and is spaced apart from the test tool assembly 22. Thus, the image sensor 28 can move together with the positioning mechanism 20. The image sensor 28 can be in the form of a camera and is positioned such that the fixture 30 can be observed through the image sensor 28. The image sensor 28 is operable to align the test tool assembly 22 with the fixture 30 so as to perform a self-monitoring machine force test.

[0064] Figure 3 is an isometric view of a fixture 30 that can be used with a preferred embodiment of the present invention. A force sensing element 32 and a dead weight 34 are mounted on the fixture 30. Preferably, the force sensing element 32 is mounted on the top surface of the fixture 30 and is pushed by the cutting tool 24 during a self-monitoring machine shear force test. Preferably, the area around the force sensing element 32 should be kept clear to avoid any interference during the self-monitoring machine shear force test of the test tool assembly 22. The force sensing element 32 can be made of any flexible material or a suitable material that elastically deflects, deforms or shears when a force is applied thereto. The force sensing element 32 can be, but is not limited to, a flexure, a sheet, a machined metal, a member elastically held by a spring, a strain gauge, a piezoelectric sensor, a bending type sensor or a force sensor. Preferably, the shape of the force sensing element 32 is a regular shape having a plurality of side walls, for example, it can have four side walls. This is beneficial because it allows the force sensing element 32 to have a plurality of contact points during the self-monitoring machine shear force test. The cutting tool 24 can be configured to apply a force to any one of the four side walls of the force sensing element 32 to push the force sensing element 32.

[0065] The fixture 30 can have a plurality of through holes 38 for mounting the fixture 30 to the frame 18 by suitable fastening means such as screws and fasteners. Figure 3 The illustrated embodiment shows two holes. However, any number of holes can be used to operatively connect the fixture 30 to the front rail 12.

[0066] The constant weight part (such as the dead weight block 34) is located on the fixture support 35 mounted on the side wall of the fixture 30. Alternatively, the fixture support 35 can be integrally formed with the fixture 30. Preferably, the fixture support 35 extends from the fixture 30 in a direction parallel to the front track 12. The dead weight block 34 is configured to rest on the top surface of the fixture support 35. The dead weight block 34 can be made of any material with a known mass (such as free weight). The wire 36 is attached to the top surface of the dead weight block 34. The wire 36 is adapted to engage with the lifting tool 26 during the self-monitoring machine tensile test. The wire 36 can be made of a metal that is at least ductile so that the wire 36 does not break when the lifting tool 26 lifts the dead weight block 34. Preferably, the wire 36 is made of a hard material such as metal.

[0067] Figure 4A is a front view of the positioning mechanism 20, where the shearing tool 24 engages with the force sensing element 32 during the self-monitoring machine shear force test. During the self-monitoring machine shear force test, the XY drive mechanism connected to the positioning mechanism 20 drives the positioning mechanism 20 to a position such that the test tool assembly 22 is vertically above the fixture 30.

[0068] Reference marks 39 can be marked on the fixture 30 (see Figure 4B ), so that they can be observed by the image sensor 28. Reference marks 39 can be marked on the force sensing element 32, so that when the image sensor 28 captures an image of the reference mark 39, the shearing tool 24 aligns with the force sensing element 32 above to perform the self-monitoring machine shear force test. Reference marks 39 can also be marked on the dead weight block 34, so that when the image sensor 28 captures an image of the reference mark 39, the lifting tool 26 can align with the dead weight block 34 above to perform the self-monitoring machine tensile test. Alternatively, reference marks 39 can be marked on both the force sensing element 32 and the dead weight block 34 simultaneously, so that when the image sensor 28 captures an image of either of the two reference marks 39, the shearing tool 24 and the lifting tool 26 can align with the force sensing element 32 or the dead weight block 34 above respectively to perform the self-monitoring machine force test. The reference marks 39 can have any form or shape, or they can be located at any position along the fixture, the force sensing element, or the dead weight block, as long as they can be observed by the image sensor 28. Preferably, the reference marks 39 are located on the top surface of the fixture, the force sensing element, or the dead weight block, so that an unobstructed image of the reference mark 39 can be obtained by the image sensor 28.

[0069] When the image sensor 28 captures an image of the reference mark 39 marked on the fixture 30, the image sensor 28 can confirm that the test tool assembly 22 is aligned with the fixture 30. Any deviation and deviation from the alignment captured by the image sensor 28 can be corrected by a signal sent to the XY drive mechanism.

[0070] Once it is confirmed that the test tool assembly 22 is aligned with the fixture 30, the Z-axis drive mechanism can drive the positioning mechanism 20 to move the shearing tool 24 vertically towards the force sensing element 32. In Figure 4A the illustrated embodiment, the shearing tool 24 contacts the force sensing element 32. At this stage, the lifting tool 26 is in the "resting" position, during which the wire 36 of the lifting tool 26 is not engaged with the dead weight 34.

[0071] Figure 5A is an isometric view of the fixture 30, in which the force sensing element 32 is engaged with the shearing tool 24. The tip 25 of the shearing tool 24 is configured to push the side wall of the force sensing element 32. The Z-axis drive mechanism drives the positioning mechanism 20 to move vertically downward until the tip 25 contacts the top plate 31 located on the top surface of the fixture 30. When contacting the top plate 31, the positioning mechanism 20 is lifted vertically upward to a predetermined height to lift the shearing tool 24 to the same height. This predetermined height can be determined by user programming and depends on the characteristics of the force sensing element 32 used. The top plate 31 can be made of a hard material such as sapphire.

[0072] After that, the positioning mechanism 20 can be driven by the XY drive mechanism to move in the S direction as shown in Figure 5A and push the side wall of the force sensing element 32. The force sensing element 32 will undergo elastic deformation and generate a reaction force R on the tip 25. The sensor connected to the shearing tool 24 can measure the reaction force R acting on the tip 25 and send the data to the processor. The processor records the value of the reaction force R and the distance that the shearing tool 24 has moved.

[0073] The machine can learn the relationship between the reaction force R acting on the tip 25 and the distance that the shearing tool 24 has moved, as shown in Figure 5B In Figure 5A the illustrated embodiment, the shearing tool 24 pushes the force sensing element 32 in the S direction. It should be noted that the shearing tool 24 can also be configured to apply a force to any one of the four side walls of the force sensing element 32 to push the force sensing element 32, so as to obtain the reaction force R on the tip 25 of the shearing tool 24.

[0074] In Figure 5BIn this case, the relationship between the reaction force R generated at the tip 25 of the shearing tool 24 and the distance the shearing tool 24 moves is learned, and then the learned slope is obtained. The self-monitoring machine shearing force test can be programmed to be performed regularly according to the preferences and requirements of the user. For example, the self-monitoring machine shearing force test can be set to be performed once a week or once a month. The results obtained from each shearing force test can be tabulated, and the slope is compared with the learned slope. Ideally, any differences and deviations from the learned slope should be minimized. The tolerance can be determined by the user. Preferably, the recommended tolerance is + / - 0.5%. If the test result falls outside the tolerance, the processor can warn the user and then perform necessary compensation and / or correction actions on the shearing tool 24 and / or the sensor.

[0075] Advantageously, the shearing tool 24 and the tip 25 are made of a hard material such as metal. For example, the shearing tool can be made of titanium or an aluminum-lithium alloy, and the tip can be made of tungsten carbide. The size or shape of the tip 25 is generally set according to the interconnect bond to be tested. Thus, the tip 25 is replaceable, and correspondingly, larger or smaller tips can be used for larger or smaller bondings.

[0076] Figure 6A is an isometric view of the lifting tool 26 that engages and lifts the dead weight 34. The dead weight 34 is placed on the fixture support 35. The lifting tool 26 has a hook 27 that is located at the end of the lifting tool 26 remote from the positioning mechanism 20. The wire 36 attached to the top surface of the dead weight is adapted to engage the hook 27 and is lifted upward in the direction of the positioning mechanism 20. During the self-monitoring machine tensile force test, when the lifting tool 26 is aligned with the wire 36 of the dead weight 34, the Z-axis drive mechanism (not shown) drives the lifting tool 26 to move vertically downward, so that the hook 27 engages the wire 36. Then, the Z-axis drive mechanism drives the lifting tool 26 to move upward toward the positioning mechanism 20. The lifting tool 26 lifts the dead weight 34 upward in the direction L away from the fixture support 35. As Figure 6B shown, the sensor 38 is connected to the lifting tool 26. The sensor 38 can be a dynamometer. The sensor 38 can be used to measure the force required to lift the dead weight 34 off the fixture support 35. As Figure 6C shown by the curve in, the force required to lift the dead weight 34 off the fixture support 35 is constant and does not change with time.

[0077] Alternatively, a self - monitoring machine pull test can be performed on the force - sensing element 32. In this case, the force - sensing element 32 can be mounted on the fixture 30 such that a portion of the force - sensing element 32 extends from the fixture 30 (not shown). A notch (not shown) can be formed near the edge of the force - sensing element 32, and the notch is adapted to engage with the hook 27 of the lifting tool 26. During the self - monitoring machine pull test, when the lifting tool 26 is aligned with the notch on the force - sensing element 32, the Z - axis drive mechanism drives the lifting tool 26 to move vertically downward, so that the hook 27 engages with the notch on the force - sensing element 32. Then, the Z - axis drive mechanism drives the lifting tool 26 to move upward along the direction of the positioning mechanism 20. The force - sensing element 32 will undergo elastic deformation and generate a reaction force on the hook 27. A sensor connected to the lifting tool 26 can measure the reaction force acting on the hook 27 and send the data to the processor. The processor records the value of the reaction force and the distance that the lifting tool 26 has moved. The machine can learn the relationship between the reaction force acting on the hook 27 and the distance that the lifting tool 26 has moved, and the result is similar to the learned slope as shown in Figure 5B shown.

[0078] The self - monitoring machine pull test can be programmed to be performed regularly according to the user's preferences and requirements. For example, the self - monitoring machine pull test can be programmed to be performed once a week or once a month. The results obtained from each pull test can be compared with the constant - force curve or the learned slope. Ideally, any differences and deviations from the constant - force curve or the learned slope should be minimized. The allowable tolerance can be determined by the user. Preferably, the recommended allowable tolerance is + / - 0.5%. If the test result falls outside the allowable tolerance, the processor can warn the user and then perform necessary compensation and / or correction actions on the lifting tool 26 and / or the sensor 38. Thus, the performance of the machine can be self - monitored over time.

[0079] Advantageously, the hook 27 is made of a hard material such as metal. The size of the hook 27 is usually set according to the interconnect bond to be tested. Therefore, the hook 27 is replaceable, and larger or smaller hooks can be used accordingly. Thus, the performance of the machine can be self - monitored over time without manual intervention to perform a force test using different test tools. This will reduce the likelihood of equipment failure, lower maintenance costs, reduce downtime, and improve production quality.

[0080] Figure 7A and 7B are an isometric view and a side view of an interconnect bond testing device according to a second preferred embodiment of the present invention. The fixture 30 has an inner cavity 47, and the fixture 30 is mounted on the frame 18 such that the front rail 12 is received within the inner cavity 47 of the fixture (as shown in Figure 7BAs shown). The fixture is accommodated within the housing 40. The top surface of the housing 40 has a pair of grooves located at one end of the housing 40 near the front track 12. The grooves are adapted to accommodate the shear tool 24 and the lifting tool 26 during the self-monitoring machine force test. The force sensing element is mounted on the fixture such that the force sensing element is located above the front track 12. As Figure 7B shown, the tip 25 of the shear tool 24 and the lifting tool 26 are located above the front track 12. Thus, in this embodiment, the working area of the self-monitoring machine force test is above the front track 12. This is particularly advantageous for machines that cannot reach the force sensing element correctly for the self-monitoring machine force test due to the short stroke of the positioning mechanism and space limitations.

[0081] Figure 8A is a cross-sectional side view of an interconnect bonding portion test device according to a second preferred embodiment of the present invention. The force sensing element in this embodiment may be a lever block 42. The lever block 42 is mounted on the fixture 30 by a U-shaped bracket 51 and fastened with a suitable fastening device such as a fastener 44. When a pulling force is applied to the opposite ends of the lever block 42, the lever block 42 rotates about the pivot 43. The opposite ends of the lever block 42 are provided with notches that are adapted to engage with the hook 27 and are lifted upward along the direction of the positioning mechanism.

[0082] During the self-monitoring machine tensile test, when the lifting tool 26 is aligned with the notch on the lever block 42, the Z-direction driving mechanism (not shown) drives the lifting tool 26 to move vertically downward, so that the hook 27 engages with the notch on the lever block 42. Then, the Z-direction driving mechanism drives the lifting tool 26 to move upward along the direction of the positioning mechanism 20. Thus, the lifting tool 26 lifts the opposite ends of the lever block 42 along the direction L1, causing the lever block 42 to rotate about the pivot pin 43. As shown previously Figure 6B shown, the sensor 38 is connected to the lifting tool 26. The sensor 38 may be a dynamometer. The sensor 38 can measure the reaction force acting on the hook 27 and send the information to the processor. The processor records the value of the reaction force and the distance moved by the lifting tool 26. The machine can learn the relationship between the reaction force R acting on the hook 27 and the distance moved by the lifting tool 26, and the result is as Figure 5B shown.

[0083] Figure 8B is a plan view of an interconnect bonding portion test device according to a second preferred embodiment of the present invention, Figure 8C is a cross-sectional view along the Figure 8B line A-A shown. A second force sensing element is mounted at one end of the fixture 30. The second force sensing element may be a strain gauge. For example, it may be as Figure 8BThe load cell type strain gauge 41 shown. A bump 45 is provided at the opposite end of the load cell type strain gauge 41 away from the jig 30. The load cell type strain gauge 41 is mounted on the jig 30 through a protrusion 52 and fixed by a C-shaped clip-like fastener 46. The C-shaped clip-like fastener 46 firmly holds the load cell type strain gauge 41 on the jig 30.

[0084] During the self-monitoring machine shear force test, the tip 25 of the shear tool 24 is configured to push the bump 45 of the load cell 41. The Z-axis drive mechanism drives the positioning mechanism to move vertically downward until the tip 25 is aligned with the bump 45 of the load cell 41. After that, the positioning mechanism can be driven by the XY drive mechanism to move in the S1 direction as shown and push the bump 45. The load cell type strain gauge 41 will undergo elastic deformation and generate a reaction force on the tip 25. The sensor connected to the shear tool 24 can measure the reaction force acting on the tip 25 and send the information to the processor. The processor records the value of the reaction force and the distance the shear tool 24 has moved. The machine can learn the relationship between the reaction force acting on the tip 25 and the distance the shear tool 24 has moved, and the result is as shown Figure 8C in. Figure 5B shown.

[0085] Figure 9A is a cross-sectional side view of a jig according to a third preferred embodiment of the present invention, in which a flexure piece is mounted on the jig. A force sensing element such as the flexure piece 48 is mounted to the jig 30 through a fastener 44. The self-monitoring machine tensile force test can be performed in a similar manner as described in the above embodiments. During the self-monitoring machine tensile force test, the lifting tool 26 can be configured to lift the free end of the flexure piece 48 near the front rail 12. The sensor connected to the lifting tool 26 can measure the reaction force acting on the hook 27 and send the information to the processor. The processor records the value of the reaction force and the distance the lifting tool 26 has moved. The machine can learn the relationship between the reaction force acting on the hook 27 and the distance the lifting tool 26 has moved, and the result is as shown Figure 5B shown.

[0086] Figure 9B is Figure 9APlan view, in which a plurality of flexure pieces are mounted on the fixture 30. A force sensing element is mounted on the fixture 30, such as a plurality of flexure pieces 49. The plurality of flexure pieces 49 are configured to engage with the tip 25 of the shearing tool 24 during a self-monitoring machine shear force test. The shearing tool 24 pushes the plurality of flexure pieces 49 at the protrusion 53, which is located at the end of the plurality of flexure pieces 49 remote from the fixture 30. A sensor connected to the shearing tool 24 can measure the reaction force acting on the tip 25 and send the information to the processor. The processor records the value of the reaction force and the distance traveled by the shearing tool 24. The machine can learn the relationship between the reaction force acting on the tip 25 and the distance traveled by the shearing tool 24, the results of which are as Figure 5B shown.

[0087] Although various examples of using force sensing elements to perform self-monitoring machine force tests have been provided, those skilled in the art will understand from the present invention that the examples provided herein are not limited thereto. For example, force sensors, piezoelectric sensors, or other sensors suitable for directly or indirectly measuring force can be used instead of flexures and flexure members mounted on the fixture 30, as Figure 10 schematically shown.

[0088] Although the present invention has been described in great detail with reference to certain embodiments, there may be other embodiments.

[0089] Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

Claims

1. An interconnect bonding part testing device for testing the bonding strength of an electronic device, the electronic device including at least one interconnect bonding part attached to the electronic device, the interconnect bonding part testing device comprising: Positioning mechanism; A test tool assembly, which includes a first test tool and a second test tool mounted on the positioning mechanism, the first test tool being configured to push a first portion of the interconnect bonding portion during testing and the second test tool being configured to lift a second portion of the interconnect bonding portion during testing; And A fixture, which includes at least one force sensing element mounted on the fixture for performing a self-monitoring machine force test, and the at least one force sensing element is configured to apply a resistance force to the test tool assembly when engaging with the test tool assembly, Wherein, the positioning mechanism is operated to move during testing such that the test tool assembly is positioned to align with the interconnect bonding portion, and a pushing force is applied to the first portion of the interconnect bonding portion by the first test tool and a pulling force is applied to the second portion of the interconnect bonding portion by the second test tool, Wherein, the positioning mechanism can also be operated to move such that the test tool assembly is positioned to engage with any one of the at least one force sensing element to perform the self-monitoring machine force test.

2. The interconnect bonding part testing device according to claim 1, wherein, The positioning mechanism can also be operated to move the test tool assembly such that after the second test tool applies a pulling force to lift the second portion of the interconnect bonding portion, the first test tool can be operated to apply a pushing force to push the first portion of the interconnect bonding portion.

3. The interconnect bonding part testing device according to claim 1, wherein, The direction of the pushing force is perpendicular to the direction of the pulling force.

4. The interconnect bonding part testing device according to claim 2, wherein, It further includes at least one sensor connected to the first test tool and the second test tool, and the at least one sensor operates to determine the reaction forces applied to the first test tool and the second test tool when applying the pushing force and the pulling force.

5. The interconnect bonding part testing device according to claim 4, wherein, The at least one sensor is a first force sensor.

6. The interconnect bonding part testing device according to claim 2, wherein, The bottom end of the first test tool away from the positioning mechanism has a pointed end portion, and the pointed end portion is configured to engage with the first portion of the interconnect bonding portion when applying the pushing force.

7. The interconnect bonding part testing device according to claim 2, wherein, The second test tool has a hook at its distal end away from the positioning mechanism, and the hook is configured to engage with the second portion of the interconnect bonding portion when applying the pulling force.

8. The interconnect bonding part testing device according to claim 1, wherein, The at least one force sensing element includes at least one flexure portion.

9. The interconnect bonding part testing device according to claim 8, wherein, The fixture further includes a constant weight portion mounted to the fixture, and the test tool assembly is configured to engage and lift the constant weight portion.

10. The interconnect bonding part testing device according to claim 9, wherein, The constant weight portion is a self-weight block.

11. The interconnect bonding part testing device according to claim 1, wherein, The at least one force sensing element includes a second force sensor.

12. The interconnect bonding part testing device according to claim 11, wherein, The second force sensor is a strain gauge.

13. The interconnect bonding part testing device according to claim 12, wherein, The fixture further includes a lever block mounted to the fixture, and the test tool assembly is configured to engage and lift the lever block.

14. The interconnect bonding part testing device according to claim 11, wherein, The second force sensor is a piezoelectric sensor.

15. The interconnect bonding part testing device according to claim 11, wherein, The second force sensor is a bending type sensor.

16. A method for testing the bonding strength of an electronic device, the electronic device including at least one interconnect bonding portion attached to the electronic device, the method comprising the steps of: Provide a test tool assembly mounted on a positioning mechanism, wherein the test tool assembly includes a first test tool and a second test tool; Use the positioning mechanism to move the test tool assembly to position the test tool assembly to align with the interconnect bonding portion; During testing, a pushing force is applied to a first portion of the interconnect bond using the first test tool and a pulling force is applied to a second portion of the interconnect bond using the second test tool; A self-monitoring machine force test is performed by moving the test tool assembly with a positioning mechanism such that the test tool assembly is positioned to engage a force sensing element mounted on a fixture; And The reaction force applied to the test tool assembly is determined by the force sensing element.

17. The method according to claim 16, wherein, The steps of applying the pushing force and applying the pulling force include: moving the test tool assembly with the positioning mechanism such that after the pulling force is applied to the second portion of the interconnect bond by the second test tool, the pushing force is applied to the first portion of the interconnect bond by the first test tool.

18. The method according to claim 17, wherein, When applying the pushing force and the pulling force, it also includes the steps of: determining the reaction forces applied to the first test tool and the second test tool using at least one sensor connected to the first test tool and the second test tool.

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