Computing module and computing device comprising the same

Abstract

The application discloses a kind of computing module and the computing device comprising the computing module, computing module is connected with the power module and control module of computing device, computing module includes substrate and respectively connected on substrate computing chip and conductive seat, conductive seat includes electric conductive seat and ground conductive seat, electric conductive seat connects power module, ground conductive seat is grounded, substrate has respectively corresponding electric pad and ground pad of electric conductive seat and ground conductive seat, control module includes control chip, it further includes first resistance, second resistance and third resistance, ground pad includes mutually separated ground pad and isolated pad, control chip is connected with isolated pad by flat cable, and first resistance and third resistance connect flat cable and ground, and second resistance connects flat cable and circuit voltage.The application only changes package, increases three resistances to reach the purpose of conductive seat drop detection, controls power supply to be closed when ground conductive seat drops to avoid equipment burning, result is accurate and low in alteration cost.

Description

Technical Field

[0001] This invention relates to a computing device, and more specifically, to a computing module for computing devices such as virtual digital currency processing devices. Background Technology

[0002] A computing device is an electronic device used for high-speed calculations, such as running specific algorithms and communicating with a remote server to obtain corresponding virtual currency. Currently, a computing board uses surface-mount copper sockets (power copper sockets and ground copper sockets) for power supply and grounded ribbon cables for signal line connections. However, during actual assembly and transportation, the soldered copper sockets are prone to detachment. If the power copper socket detaches, the computing board will not work due to lack of power. However, if the ground copper socket detaches, a large current will flow back through the ground wire in the signal ribbon cable, causing the ribbon cable to overheat and burn out. Summary of the Invention

[0003] The purpose of this invention is to provide a computing module with a function to detect the detachment of the grounding conductor, so that the control board can shut off the power supply when the grounding conductor detaches, thus preventing it from burning out.

[0004] The present invention also provides a computing device including the above-described computing module.

[0005] To achieve the above objectives, the computing module of the present invention is connected to the power supply module and control module of the computing device. The computing module includes a substrate and a computing chip and a conductive base respectively connected to the substrate. The conductive base includes an electrically conductive base and a ground conductive base. The electrically conductive base is connected to the power supply module, and the ground conductive base is grounded. The substrate has an electrical pad and a ground pad respectively corresponding to the electrically conductive base and the ground conductive base. The control module includes a control chip, which further includes a first resistor, a second resistor, and a third resistor. The ground pad includes a ground pad and an isolated pad that are separated from each other. The control chip is connected to the isolated pad via a ribbon cable, and the first resistor and the third resistor are respectively connected to the ribbon cable and ground. The second resistor is connected to the ribbon cable and the circuit voltage.

[0006] In one embodiment of the above-described calculation module, the resistance value of the second resistor is greater than the resistance value of the first resistor.

[0007] In one embodiment of the above-described calculation module, the resistance value of the second resistor is greater than the resistance value of the third resistor.

[0008] In one embodiment of the above-described computing module, the substrate is an aluminum substrate.

[0009] In one embodiment of the above-described computing module, the first resistor is disposed on the control module, and the second and third resistors are disposed on the substrate.

[0010] In one embodiment of the computing module described above, two heat sinks are further included, which are respectively connected to both sides of the substrate.

[0011] In one embodiment of the above-described calculation module, the ground pad is larger than the isolated pad.

[0012] In one embodiment of the above-described computing module, the isolated pad is disposed at the edge of the ground pad.

[0013] In one embodiment of the above-described calculation module, the ground pad is a rectangle with a blank area on the edge, and the isolated pad is disposed in the blank area.

[0014] In one embodiment of the above-described calculation module, the conductive base is a copper base, the electrically conductive base is an electrically conductive copper base, and the ground conductive base is a ground copper base.

[0015] The computing device of the present invention includes a computing module, a power supply module, and a control module. The computing module is electrically connected to the power supply module and is signal-connected to the control module. The computing module is the aforementioned computing module.

[0016] The beneficial effect of this invention is that it can achieve the purpose of detecting the detachment of the conductive base by simply changing the packaging and adding three resistors, with accurate results and low modification cost.

[0017] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0018] Figure 1 This is a structural block diagram of an embodiment of the computing device of the present invention;

[0019] Figure 2 This is a three-dimensional structural diagram of an embodiment of the computing module of the present invention;

[0020] Figure 3 This is an exploded three-dimensional structural diagram of an embodiment of the computing module of the present invention;

[0021] Figure 4 This is a schematic diagram of the ground pad structure of the computing module of the present invention;

[0022] Figure 5 This is a schematic diagram of the ground contact pin detachment detection circuit of the computing module of the present invention.

[0023] Among them, the attached reference numerals

[0024] 1: Computing equipment

[0025] 10: Calculation Module

[0026] 20: Power Module

[0027] 30: Control Module

[0028] 31: Control chip

[0029] 100: Substrate

[0030] 110: Ground pad

[0031] 111: Ground pad

[0032] 112: Isolated pad

[0033] 160: Connecting through hole

[0034] 200: Computing chip

[0035] 300: Conductive base

[0036] 310: Electrical Conductive Base

[0037] 320: Ground Conductor Base

[0038] 400: Connector

[0039] 410: Screws

[0040] 420: Elastic sealing gasket

[0041] 430: Spring

[0042] 700: Ribbon cable

[0043] 810: First heatsink

[0044] 811: Connecting through hole

[0045] 820: Second heatsink

[0046] 821: Threaded blind hole

[0047] R1: First resistor

[0048] R2: Second resistor

[0049] R3: Third resistor Detailed Implementation

[0050] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments to further understand the purpose, solution and effect of the present invention, but it is not intended to limit the scope of protection of the appended claims.

[0051] References to "embodiment," "another embodiment," "this embodiment," etc., in the specification refer to embodiments that may include specific features, structures, or characteristics, but not every embodiment must include these specific features, structures, or characteristics. Furthermore, such expressions do not refer to the same embodiment. Moreover, when describing specific features, structures, or characteristics in connection with embodiments, whether or not explicitly described, it is indicated that incorporating such features, structures, or characteristics into other embodiments is within the knowledge of those skilled in the art.

[0052] The specification and subsequent claims use certain terms to refer to specific components or parts. Those skilled in the art will understand that users or manufacturers may use different names or terms to refer to the same component or part. This specification and subsequent claims do not distinguish components or parts by differences in name, but rather by differences in function. The terms "comprising" and "including" used throughout the specification and subsequent claims are open-ended and should be interpreted as "including but not limited to." Furthermore, the term "connection" here includes any direct or indirect means of connection.

[0053] It should be noted that in the description of this invention, terms such as "lateral," "longitudinal," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are used only for the convenience of describing this invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention. For clarity, the sequential terms such as "first," "second," "third," and "fourth" used herein are used to distinguish an element, region, or part from another identical or similar element, region, or part, and are not used to limit specific elements, regions, or parts.

[0054] like Figure 1 As shown, Figure 1 This is a structural block diagram of an embodiment of the computing device of the present invention. The computing device 1 of the present invention includes a computing module 10, a power supply module 20, and a control module 30, wherein the computing module 10 is electrically connected to the power supply module 20, and the computing module 10 is signal-connected to the control module 30. The computing module 10 has multiple computing chips for running specific algorithms. The computing chips on the computing module 10 require a large amount of power to operate and communicate with a remote server. The power supply module 20 is used to provide power to the computing module 10, and the control module 30 is used to provide control signals to the computing module 10.

[0055] like Figure 2 and Figure 3 As shown, Figure 2 and Figure 3 These are, respectively, a perspective structural diagram and an exploded perspective structural diagram of an embodiment of the computing module of the present invention. The computing module 10 of the present invention includes a substrate 100, a computing chip 200, and a conductive base 300.

[0056] The substrate 100 is, for example, an aluminum substrate with excellent heat dissipation performance. This invention is not limited to this; other materials that can achieve the same function, such as a copper substrate, can also be used, all within the scope of protection of this invention. The substrate 100 includes a chip side and a substrate side. A computing chip 200 and a conductive base 300 are connected to the chip side. Multiple computing chips 200 are used for calculations using a certain algorithm. The conductive base 300 is disposed at one end of the substrate 100 to facilitate connection with the power module 20. The conductive base 300 and the power module 20 can be connected, for example, through a conductive metal busbar. The conductive metal busbar has a large connection and conduction area, resulting in strong conductivity and low conduction resistance, making it very suitable for computing devices with a large number of computing chips 200 arranged in the trend of automation and intelligence. Of course, in other embodiments, the conductive base 300 and the power module 20 can also be connected by conductive wires; this invention is not limited. The conductive base 300 and each computing chip 200 are connected through conductive busbars embedded in the chip side of the substrate 100. Each computing chip 200 is arranged in a matrix on the chip side of the substrate 100, wherein the distance between adjacent computing chips 200 in each row or column can be set to be the same or different according to the heat dissipation requirements. The substrate side can be made of aluminum substrate, copper substrate, etc., which have excellent heat dissipation performance, so as to dissipate the working heat generated by the computing chips 200 during operation as quickly as possible, and avoid heat accumulation on the substrate 100, which would cause the substrate 100 to have a high temperature and affect the normal operation of each computing chip 200 on the substrate 100. The conductive base 300 includes an electrically conductive base 310 and a ground conductive base 320. The electrically conductive base 310 is connected to the power module 20 to transmit working power to the computing module 10, and the ground conductive base 320 is used for grounding.

[0057] The conductive base 300 described above is, for example, a copper base. Correspondingly, the electrically conductive base 310 and the ground conductive base 320 are electrically conductive copper base and ground copper base, respectively. However, in other embodiments, the conductive base 300 may also be made of other materials with excellent conductivity, and the present invention is not limited thereto.

[0058] Combination Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the ground pad structure of the computing module of the present invention. Figure 5This is a schematic diagram of the ground contact detachment detection circuit of the computing module of the present invention. The substrate 100 has an electrical pad (not shown) and a ground pad 110 corresponding to the electrical contact 310 and the ground contact 320, respectively. The control module 30 includes a control chip 31. The computing module 10 of the present invention also includes a first resistor R1, a second resistor R2, and a third resistor R3. The ground pad 110 includes a ground contact pad 111 and an isolated pad 112 that are separated from each other. The control chip 31 is connected to the isolated pad 112 via a ribbon cable 700. The first resistor R1 and the third resistor R3 are respectively connected to the ribbon cable 700 and ground, and the second resistor R2 is connected to the ribbon cable 700 and the circuit voltage VCC.

[0059] In this invention, an isolated pad 112 for detection is newly added to the ground pad 110 corresponding to the ground conductive base 320. The GND_SENSE signal is pulled up to the circuit voltage VCC by the second resistor R2 on the calculation module 10 and pulled down to GND by the third resistor R3; and is connected to a control IO of the control chip 31 on the control module 30 for detection through the ribbon cable 700, and is pulled down to GND by the first resistor R1 on the control module 30.

[0060] Its working principle is as follows: When the ground contact 320 is properly soldered and not detached, the GND_SENSE signal is connected to GND through the ground contact 320. The control IO of the connection cable 700 of the control chip 31 detects this signal as low. When the ground contact 320 is poorly soldered or detached, the GND_SENSE signal is affected by the voltage division of the first resistor R1, the second resistor R2, and the third resistor R3, and its voltage is VCC*[(R1 / / R3) / (R1 / / R3+R2)]. With appropriate resistance values, R1, R2, and R3 can make this signal meet the high-level discrimination criteria of the control chip 31, thereby making the control chip 31 detect it as high. When the control chip 31 detects this signal as high, it can determine that the ground contact 320 has detached, issue a warning, and cut off the power to the computing module 10, thereby protecting the computing device and preventing the large current from returning through the ground wire in the signal cable due to the detachment of the ground contact, which could cause the cable to overheat and burn out.

[0061] Taking the current equipment as an example, the signal power domain VDD of the control chip 31 is 3.3V, its low voltage discrimination voltage is Vil=0.3*VDD=0.99V, and its high voltage discrimination voltage is Vih=0.7*VDD=2.31V; the voltage range of the circuit voltage VCC is 11.5V-14.5V.

[0062] With R1 = 12.4K, R2 = 20K, and R3 = 10K, if the local conductive base 320 is poorly soldered or detached, the voltage of the GND_SENSE signal is: VCC / (R2+R1 / / R3)*(R1 / / R3). When VCC is 11.5V, the GND_SENSE signal voltage is 2.49V; when VCC is 14.5V, the signal voltage is 3.14V. Therefore, when the circuit voltage VCC fluctuates between 11.5V and 14.5V, the GND_SENSE signal voltage ranges from 2.49V to 3.14V, all of which are greater than the high voltage discrimination standard of 2.31V for the control chip 31. Therefore, the control chip 31 can detect this signal as high.

[0063] When the grounding connector 320 is properly soldered and not detached, the GND_SENSE signal is connected to GND through the grounding connector 320, and its voltage is GND. This means the control chip 31 detects this signal as low, and the system operates normally. When the grounding connector 320 is poorly soldered or detached, the GND_SENSE signal, through the settings of the first resistor R1, the second resistor R2, and the third resistor R3, causes the control chip 31 to detect this signal as high, thus triggering an alarm and power cut-off.

[0064] As can be seen, the detection method for ground contact detachment of the present invention does not change the device itself, but only changes the pads and adds a detection point to achieve the effect of detecting contact detachment, which is low cost.

[0065] In this invention, the resistance of the second resistor R2 is greater than that of the first resistor R1. The resistance of the second resistor R2 is greater than that of the third resistor R3. The first resistor R1 and the third resistor R3 are connected between the ribbon cable 700 and GND, respectively. The second resistor R2 is connected between the ribbon cable 700 and the circuit voltage VCC. Setting the resistance of the second resistor R2 to be greater than that of the first resistor R1 and the third resistor R3 makes it easier for the GND_SENSE signal to meet the high-level discrimination criterion of the control chip 31 when the grounding contact 320 is poorly soldered or falls off, thereby issuing an alarm and cutting off power.

[0066] In this invention, the first resistor R1 is disposed on the control module 30, and the second resistor R2 and the third resistor R3 are disposed on the substrate 100 of the calculation module 10. The first resistor R1, the second resistor R2 and the third resistor R3 are disposed on the control module 30 and the substrate 100 respectively, which makes them easier to arrange and detect.

[0067] In this invention, the ground pad 111 is larger than the isolated pad 112. Specifically, the isolated pad 112 is disposed at the edge of the ground pad 111. For example, the ground pad 111 is a rectangular pad with a blank area at the edge, and the isolated pad 112 is disposed in the blank area.

[0068] In this embodiment, the isolated pad 112 is a circular pad, and the edge of the ground pad 111 has an arc-shaped area larger than that of the isolated pad 112. The isolated pad 112 is placed within this arc-shaped area, and there is a non-conductive area between the isolated pad 112 and the ground pad 111. Figure 4 As shown, the isolated pad 112 is preferably placed at the center of the arc-shaped area of ​​the ground pad 111.

[0069] In other embodiments, the isolated pad 112 is, for example, a square pad, and the edge of the ground pad 111 may have a rectangular area larger than the isolated pad 112. The isolated pad 112 is placed within this rectangular area. Similarly, the isolated pad 112 is preferably placed at the center of the rectangular area of ​​the ground pad 111 so that there is a non-conductive area between the isolated pad 112 and the ground pad 111.

[0070] As can be seen, in this invention, the shape of the isolated pad 112 is not limited, and a suitable shape and size can be set as needed.

[0071] In another embodiment of the present invention, GND_SENSE can also be connected to the power supply voltage VDD of the control chip 31 via a pull-up resistor R, and then connected to a detection IO of the control chip 31. Its working principle is as follows: when the ground copper base is properly soldered, GND_SENSE is connected to ground through the ground copper base, and the detection IO of the control chip 31 detects a low voltage, indicating normal soldering; when the ground copper base is detached or the soldering is poor, GND_SENSE is left floating, and the GND_SENSE signal level is pulled up to VDD through the resistor R; the detection IO of the control chip 31 detects a high voltage, indicating abnormal soldering, issuing an alarm, and interrupting operation.

[0072] In another embodiment of the present invention, when there are multiple pads on the same copper sheet, each pad can be reserved with a GND_SENSE (GND_SENSE0, GND_SENSE1, ...); and can be connected to the same detection signal or two different detection signals.

[0073] The computing module 10 of the present invention also includes a heat sink, such as Figure 2 and Figure 3 As shown, the heat sink includes a first heat sink 810 and a second heat sink 820, which are respectively disposed on both sides of the substrate 100 to dissipate operating heat. In this embodiment, the first heat sink 810 is disposed on the chip side of the substrate 100 where multiple computing chips 200 are mounted, and the second heat sink 820 is disposed on the substrate side opposite to the chip side.

[0074] The first heat sink 810 and the second heat sink 820 can be, for example, an integral finned heat sink, a distributed finned heat sink, or a liquid cooling structure, etc., and the present invention is not limited thereto. An integral finned heat sink can be, for example, a finned heat sink covering all computing chips 200 on the substrate 100. Its structure is relatively simple; it can be integrally disposed on both sides of the substrate 100, making it easy to implement and low in cost. A distributed finned heat sink can be, for example, an independent finned heat sink. Each independent finned heat sink can correspond to one computing chip 200, or each independent finned heat sink can correspond to a row or column of computing chips 200, or each independent finned heat sink can correspond to a matrix or a certain number of computing chips 200. Therefore, to cover all computing chips 200 on the substrate 100, multiple independent finned heat sinks must be used, and these multiple independent finned heat sinks work together to dissipate heat from the substrate 100. Each individual heatsink can have the same or different structure. For example, the fins of an individual heatsink for a chip that generates more heat or for a location with lower heat dissipation efficiency can be arranged more densely to balance the heat dissipation efficiency of each computing chip 200. The liquid cooling structure can be, for example, a heat-conducting plate with thermally conductive liquid cooling pipes.

[0075] In this embodiment, the first heat sink 810 and the second heat sink 820 are both integral finned heat sinks. The first heat sink 810 and the second heat sink 820 on both sides dissipate the working heat of the multiple computing chips 200 on the substrate 100 sandwiched in the middle, so as to prevent the computing chips 200 from exceeding the operating temperature and ensure the normal operation of the substrate 100.

[0076] The first heat sink 810 and the second heat sink 820 are connected to opposite sides of the substrate 100 via a connector 400. Specifically, in this embodiment, the first heat sink 810 is fixed to the second heat sink 820 via the connector 400, thereby clamping the substrate 100 between the first heat sink 810 and the second heat sink 820. Figure 3 As shown, the first heat sink 810 has a connecting through hole 811, the substrate 100 has a connecting through hole 160 corresponding to the connecting through hole 811 of the first heat sink 810, and the second heat sink 820 has a threaded blind hole 821 corresponding to the connecting through hole 811 of the first heat sink 810 and the connecting through hole 160 of the substrate 100. The connector 400 passes through the connecting through hole 811 of the first heat sink 810 and the connecting through hole 160 of the substrate 100 and connects to the threaded blind hole 821 of the second heat sink 820, thereby fixing the first heat sink 810, the substrate 100 and the second heat sink 820 together. After the first heat sink 810, the substrate 100 and the second heat sink 820 are fixedly connected together, it is not only easy to move, but also avoids displacement between them from affecting the performance of the computing chip 200.

[0077] The connector 400 includes a screw 410 and an elastic sealing gasket 420. The elastic sealing gasket 420 has a certain elastic deformation when compressed, thereby sealing the connection through hole 811 on the first heat sink 810. The elastic sealing gasket 420 is, for example, a plastic sealing gasket. Furthermore, sealant can be applied to the connection position of the screw 410 to improve the sealing effect. In addition, the connector 400 also includes a spring 430, which prevents the screw 410 from loosening.

[0078] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A computing module connected to a power module and a control module of a computing device, the computing module comprising a substrate and a computing chip and conductive pads connected to the substrate, respectively, the conductive pads comprising an electrical conductive pad and a ground conductive pad, the electrical conductive pad connected to the power module and the ground conductive pad connected to ground, the substrate having electrical pads and ground pads corresponding to the electrical and ground conductive pads, respectively, the control module comprising a control chip, wherein, It also includes a first resistor, a second resistor, and a third resistor. The ground pad includes a ground pad and an isolated pad that are separate from each other. The control chip is connected to the isolated pad via a ribbon cable. The first resistor and the third resistor are respectively connected to the ribbon cable and ground, and the second resistor is connected to the ribbon cable and the circuit voltage.

2. The computing module of claim 1, wherein, The resistance of the second resistor is greater than the resistance of the first resistor.

3. The computing module of claim 1, wherein, The resistance of the second resistor is greater than the resistance of the third resistor.

4. The computing module of claim 1, wherein, The substrate is an aluminum substrate.

5. The computing module of claim 1, wherein, The first resistor is disposed on the control module, and the second and third resistors are disposed on the substrate.

6. The computing module of claim 1, wherein, It also includes two heat sinks, which are respectively connected to both sides of the substrate.

7. The computing module according to any one of claims 1 to 6, characterized in that, The ground pad is larger than the isolated pad.

8. The computing module of claim 7, wherein, The isolated pad is located at the edge of the ground pad.

9. The computing module of claim 8, wherein, The ground pad is a rectangular pad with a blank area on the edge, and the isolated pad is located in the blank area.

10. The computing module of claim 1, wherein, The conductive base is a copper base, the electrically conductive base is an electrically conductive copper base, and the ground conductive base is a ground copper base.

11. A computing device comprising a computing module, a power module and a control module, the computing module being electrically connected with the power module, the computing module being signal connected with the control module, characterized in that, The computing module is the computing module according to any one of claims 1 to 10.

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