Component mounting device and component mounting method

Abstract

The present invention provides a component mounting device and a component mounting method capable of efficiently deriving the deviation amount between the mounting position and the target position. The component mounting device includes: an operation parameter acquisition unit that acquires the operation parameters of the mounting head; a mounting deviation amount calculation unit that calculates a mounting deviation amount indicating the deviation amount between the mounting position of the component mounted on the substrate by the mounting head and the target position; a learning model generation unit that generates a learning model that takes the operation parameters as input and outputs the deviation amount between the mounting position and the target position based on learning data representing the relationship between the operation parameters and the mounting deviation amount; an estimation unit that inputs the operation parameters to the learning model and outputs an estimated deviation amount representing an estimated value of the deviation amount between the mounting position and the target position; and an operation instruction unit that outputs an operation instruction for operating the mounting head based on the estimated deviation amount to mount the component at the target position.

Description

Technical Field

[0001] The present invention relates to a component mounting device and a component mounting method. Background Art

[0002] In the production process of electronic devices, a component mounting device disclosed in Patent Document 1 is used.

[0003] Prior Art Documents

[0004] Patent Document 1: Japanese Patent Laid-Open Publication No. 2020-013819

[0005] The component mounting device mounts a component at a target position on a substrate. The mounting position (actual position) of the component may deviate from the target position. Therefore, a calibration process for calculating the deviation amount between the mounting position and the target position is performed. In the calibration process, the component is mounted on a dedicated jig. Based on the imaging result of the component mounted on the jig, the deviation amount between the mounting position and the target position is calculated. During the execution of the calibration process, the component mounting device cannot perform the mounting process of mounting the component on the substrate. Therefore, there is a possibility that the operability of the component mounting device is reduced. Summary of the Invention

[0006] An object of the present invention is to efficiently derive the deviation amount between the mounting position and the target position.

[0007] According to the present invention, there is provided a component mounting device including: an operation parameter acquisition unit that acquires operation parameters of a mounting head; a mounting deviation amount calculation unit that calculates a mounting deviation amount representing a deviation between a mounting position of a component mounted on a substrate by the mounting head and a target position; a learning model generation unit that generates a learning model based on learning data representing a relationship between the operation parameters and the mounting deviation amount, the learning model taking the operation parameters as an input and outputting a deviation between the mounting position and the target position; an estimation unit that inputs the operation parameters into the learning model and outputs an estimated deviation amount representing an estimated value of the deviation between the mounting position and the target position; and an operation instruction unit that outputs an operation instruction for operating the mounting head based on the estimated deviation amount to mount the component at the target position.

[0008] According to the present invention, it is possible to efficiently derive the deviation amount between the mounting position and the target position. Brief Description of the Drawings

[0009] Figure 1 It is a side view schematically showing a component mounting device according to an embodiment.

[0010] Figure 2 It is a top view schematically showing a component mounting device according to an embodiment.

[0011] Figure 3 It is a side view of the nozzle showing an embodiment.

[0012] Figure 4 It is a functional block diagram of the control device showing an embodiment.

[0013] Figure 5 It is a schematic diagram for explaining the operation parameters of the mounting head of an embodiment.

[0014] Figure 6 It is a schematic diagram for explaining the operation parameters of the mounting head of an embodiment.

[0015] Figure 7 It is a schematic diagram for explaining the operation parameters of the mounting head of an embodiment.

[0016] Figure 8 It is a schematic diagram for explaining the operation parameters of the mounting head of an embodiment.

[0017] Figure 9 It is a schematic diagram of the component detection device showing an embodiment.

[0018] Figure 10 It is a flowchart showing the learning stage of an embodiment.

[0019] Figure 11 It is a flowchart showing the installation stage of an embodiment.

[0020] Figure 12 It is a block diagram of the computer system showing an embodiment.

[0021] Explanation of reference numerals:

[0022] 1: Component mounting device; 2: Component supply device; 3: Substrate support device; 4: Nozzle; 5: Mounting head; 5S: Shaft; 6: Nozzle moving device; 7: Head moving device; 8: Component identification device; 9: Component detection device; 10: Control device; 11: Base; 12: Pillar; 13: X-axis moving device; 13A: Guide component; 13B: Actuator; 14: Y-axis moving device; 14A: Guide component; 14B: Actuator; 15: Pressure sensor; 21: Production program storage unit; 22: Action parameter acquisition unit; 23: Mounting deviation calculation unit; 24: Learning model generation unit; 25: Learning model storage unit; 26: Estimation unit; 27: Correction amount calculation unit; 28: Action instruction unit; 41: Connecting part; 42: First main body part; 43: Flange part; 44: Second main body part; 45: Holding part; 1000: Computer system; 1001: Processor; 1002: Main memory; 1003: Memory; 1004: Interface; C: Component; AP: Supply position; BP: Processing position; CP: Identification position; DP: Mounting position; EP: Adsorption position; FP: Center position; GP: Target position; W: Substrate; ΔB: Adsorption deviation; ΔM: Mounting deviation; ΔMe: Estimated deviation. Detailed implementation mode

[0023] Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. The constituent elements of the embodiments described below can be appropriately combined. In addition, there are cases where some of the constituent elements are not used.

[0024] In the embodiment, an XYZ rectangular coordinate system is set, and the positional relationship of each part is described with reference to the XYZ rectangular coordinate system. The XYZ rectangular coordinate system is a local coordinate system set in the component mounting device 1. The direction parallel to the X-axis in the specified plane is set as the X-axis direction. The direction parallel to the Y-axis in the specified plane orthogonal to the X-axis is set as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the specified plane is set as the Z-axis direction. The rotation or tilt direction centered on the X-axis is set as the θX direction. The rotation or tilt direction centered on the Y-axis is set as the θY direction. The rotation or tilt direction centered on the Z-axis is set as the θZ direction. The specified plane is parallel to the horizontal plane. The Z-axis direction is the up and down direction. In addition, the specified plane may be inclined with respect to the horizontal plane. In the following description, the specified plane is appropriately referred to as the XY plane.

[0025] [Component mounting device]

[0026] Figure 1 It is a side view schematically showing the component mounting device 1 of the embodiment. Figure 2 It is a top view schematically showing the component mounting device 1 of the embodiment. The component mounting device 1 mounts the component C on the substrate W printed with paste solder.

[0027] The component mounting device 1 includes a base 11, a support column 12, a component supply device 2, a substrate support device 3, a mounting head 5 having a nozzle 4, a nozzle moving device 6, a head moving device 7, a component recognition device 8, a component detection device 9, and a control device 10.

[0028] The base 11 is provided on the ground of an industrial facility where the component mounting device 1 is used. In the XY plane, the base 11 is long in the X-axis direction. The outer shape of the upper surface of the base 11 is rectangular. The support column 12 protrudes upward from the upper surface of the base 11. The support column 12 is fixed to the base 11. In the embodiment, the support columns 12 are respectively arranged at the four corners of the upper surface of the base 11.

[0029] The component supply device 2 supplies the component C. A supply position AP is set in the component mounting device 1. The component supply device 2 supplies the component C to the supply position AP. The component supply device 2 includes a plurality of tape feeders. The tape feeder has: a tape reel around which a tape holding the component C is wound; and a driving device that pays out the tape wound around the tape reel. The driving device pays out the tape so that the component C held by the tape moves to the supply position AP. In addition, the component supply device 2 may include a tray holding the component C.

[0030] The substrate support device 3 supports the substrate W. A processing position BP is set in the component mounting device 1. The substrate support device 3 supports the substrate W at the processing position BP. The substrate support device 3 is supported on the base 11. The substrate support device 3 includes: a substrate conveying device that conveys the substrate W to the processing position BP; and a substrate support member that supports the substrate W conveyed to the processing position BP. The substrate conveying device includes: a conveyor that conveys the substrate W along the X-axis direction; and a guiding member that guides the substrate W along the X-axis direction. The substrate support member supports the substrate W in such a manner that the surface of the substrate W is parallel to the XY plane.

[0031] The nozzle 4 can detachably hold the component C. The nozzle 4 is a suction nozzle that sucks the upper surface of the component C. An opening is provided at the front end of the nozzle 4. The opening of the nozzle 4 is connected to a vacuum system. In a state where the front end of the nozzle 4 is in contact with the upper surface of the component C, the component C is adsorbed and held at the front end of the nozzle 4 by performing a suction operation of the opening of the nozzle 4. The component C is released from the nozzle 4 by canceling the suction operation of the opening of the nozzle 4.

[0032] The mounting head 5 has a plurality of suction nozzles 4. The mounting head 5 mounts the component C held by the suction nozzle 4 onto the substrate W. The mounting head 5 is capable of moving between a supply position AP and a processing position BP. In the XY plane, the supply position AP and the mounting position BP are set at different positions. The mounting head 5 moves to the supply position AP and holds the component C supplied from the component supply device 2 with the suction nozzle 4. After the mounting head 5 holds the component C with the suction nozzle 4 at the supply position AP, it moves to the processing position BP and mounts the component C onto the substrate W supported by the substrate support device 3.

[0033] The mounting head 5 has a shaft 5S for mounting the suction nozzle 4. The suction nozzle 4 is mounted at the lower end of the shaft 5S.

[0034] The nozzle moving device 6 moves the suction nozzle 4 in the Z-axis direction and the θZ direction respectively. The nozzle moving device 6 includes an actuator mounted on the mounting head 5. The nozzle moving device 6 is provided for each of the plurality of suction nozzles 4. The nozzle moving device 6 moves the suction nozzle 4 in the Z-axis direction and the θZ direction by moving the shaft 5S in the Z-axis direction and the θZ direction.

[0035] The head moving device 7 moves the mounting head 5 in the X-axis direction and the Y-axis direction respectively. The head moving device 7 has an X-axis moving device 13 that moves the mounting head 5 in the X-axis direction and a Y-axis moving device 14 that moves the mounting head 5 in the Y-axis direction.

[0036] The X-axis moving device 13 includes a guide member 13A extending in the X-axis direction and an actuator 13B that generates power to move the mounting head 5 in the X-axis direction. The mounting head 5 is supported by the guide member 13A. The guide member 13A guides the mounting head 5 in the X-axis direction. At least a part of the actuator 13B is disposed between the mounting head 5 and the guide member 13A. The mounting head 5 is guided by the guide member 13A and moves in the X-axis direction using the power generated by the actuator 13B.

[0037] The Y-axis moving device 14 includes a pair of guide members 14A and an actuator 14B. The actuator 14B generates power to move the guide member 13A in the Y-axis direction. One of the guide members 14A is supported by two columns 12 disposed at the end on the +X side of the base 11. The other guide member 14A is supported by two columns 12 disposed at the end on the -X side of the base 11. The +X side end of the guide member 13A is supported by one of the guide members 14A. The -X side end of the guide member 13A is supported by the other guide member 14A. The guide member 14A guides the guide member 13A in the Y-axis direction. At least a part of the actuator 14B is disposed between the guide member 13A and the guide member 14A. The guide member 13A is guided by the guide member 14A and moves in the Y-axis direction using the power generated by the actuator 14B. By the guide member 13A moving in the Y-axis direction, the mounting head 5 moves in the Y-axis direction.

[0038] The nozzle 4 can move in four directions: the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction through the nozzle moving device 6 and the head moving device 7. By moving the nozzle 4, the component C held by the nozzle 4 can also move in the four directions: the X-axis direction, the Y-axis direction, the Z-axis direction, and the θZ direction.

[0039] The component recognition device 8 recognizes the component C held by the nozzle 4. The recognition position CP is set in the component mounting device 1. The component recognition device 8 recognizes the component C at the recognition position CP. The recognition position CP is set between the supply position AP and the processing position BP. The component recognition device 8 includes a photographing device. The component recognition device 8 recognizes the component C held by the nozzle 4 at the supply position AP before being mounted on the substrate W. The component recognition device 8 recognizes the shape of the component C and the holding state of the component C by the nozzle 4.

[0040] The component detection device 9 detects the component C mounted on the substrate W. The component detection device 9 is provided on the mounting head 5. The component detection device 9 includes a photographing device. The component detection device 9 is provided in multiple numbers corresponding to multiple nozzles 4. The component detection device 9 detects the mounting position DP of the component C mounted on the substrate W. The mounting position DP of the component C refers to the actual position of the component C mounted on the surface of the substrate W. The mounting position DP of the component C is a position of coordinates defined in the XYZ rectangular coordinate system.

[0041] The control device 10 includes a computer system. The control device 10 outputs an operation instruction to operate the mounting head 5. The control device 10 stores a production program representing the steps of mounting the component C on the substrate W. The control device 10 outputs an operation instruction to operate the mounting head 5 based on the production program.

[0042] [Nozzle]

[0043] Figure 3 is a side view of the nozzle 4 showing an embodiment. As Figure 3 shown, the nozzle 4 has: a connecting portion 41 that connects to the shaft 5S; a first main body portion 42 that connects to the connecting portion 41; a second main body portion 44 that connects to the first main body portion 42 via a flange portion 43; and a holding portion 45 that holds the component C.

[0044] The shaft 5S is tubular. The connecting portion 41 is columnar. The connecting portion 41 is inserted inside the shaft 5S. The first main body portion 42 connects to the lower portion of the connecting portion 41. The flange portion 43 connects to the lower portion of the first main body portion 42. The second main body portion 44 connects to the lower portion of the flange portion 43. The flange portion 43 is provided at the boundary between the first main body portion 42 and the second main body portion 44. An opening connected to the vacuum system is provided at the lower end portion of the holding portion 45. The vacuum system is connected to the opening of the holding portion 45 via the internal space of the shaft 5S.

[0045] The adsorption position EP on the upper surface of the component C by the nozzle 4. The adsorption position EP of the nozzle 4 refers to the position on the upper surface of the component C that is adsorbed by the nozzle 4. That is, the adsorption position EP of the nozzle 4 refers to the position on the upper surface of the component C that contacts the lower end portion of the holding portion 45. The control device 10 performs control so that the center position FP on the upper surface of the component C is adsorbed by the nozzle 4.

[0046] The mounting head 5 has a pressure sensor 15 that detects the adsorption pressure when the nozzle 4 adsorbs the component C. The pressure sensor 15 is disposed, for example, in the internal space of the shaft 5S. The adsorption pressure refers to the pressure between the vacuum system and the opening of the holding portion 45 when the nozzle 4 adsorbs the component C. The adsorption pressure is a negative pressure.

[0047] [Control Device]

[0048] Figure 4 is a functional block diagram of the control device 10 showing an embodiment. As Figure 4 shown, the control device 10 is respectively connected to the mounting head 5 including the nozzle moving device 6 and the head moving device 7, the component identification device 8, the component detection device 9, and the pressure sensor 15.

[0049] The control device 10 has a production program storage unit 21, an operation parameter acquisition unit 22, a mounting deviation amount calculation unit 23, a learning model generation unit 24, a learning model storage unit 25, an estimation unit 26, a correction amount calculation unit 27, and an operation instruction unit 28.

[0050] The production program storage unit 21 stores the production program. The production program refers to a computer program that represents the steps of mounting the component C on the substrate W.

[0051] The operation parameter acquisition unit 22 acquires the operation parameters of the mounting head 5. The operation parameters refer to the parameters that determine the operation of the mounting head 5.

[0052] Figure 5 It is a schematic diagram for explaining the operation parameters of the mounting head 5 in the embodiment. The operation parameters include operation instructions specified by the production program, detection data of the component recognition device 8, detection data of the pressure sensor 15, and calculation data of the control device 10. The operation parameter acquisition unit 22 acquires at least a part of the operation parameters from the production program storage unit 21. The operation parameter acquisition unit 22 acquires at least a part of the operation parameters from the component recognition device 8. The operation parameter acquisition unit 22 acquires at least a part of the operation parameters from the pressure sensor 15. The operation parameter acquisition unit 22 acquires at least a part of the operation parameters from the correction amount calculation unit 27.

[0053] In the embodiment, the operation parameters include the target position GP of the component C mounted on the substrate W, the movement conditions of the mounting head 5 to the target position GP, the movement conditions of the nozzle 4 when mounting the component C on the substrate W, the holding conditions of the nozzle 4 for the component C, the movement conditions of the component C at the component recognition device 8, and the correction amount calculated by the correction amount calculation unit 27.

[0054] Figure 6 It is a schematic diagram for explaining the operation parameters of the mounting head 5 in the embodiment. As Figure 6 shown, the target position GP of the component C refers to the target position of the component C mounted on the surface of the substrate W. The target position GP of the component C is a position of coordinates specified in the XYZ rectangular coordinate system. The target position GP of the component C is described in the production program. That is, the target position GP of the component C is specified based on the operation instruction.

[0055] As Figure 6 shown, the movement conditions of the mounting head 5 to the target position GP include the movement conditions of the mounting head 5 from the recognition position CP or the supply position AP to the target position GP. In addition, an alignment device (not shown) is provided on the mounting head 5. In the case where an alignment mark provided on the substrate W is provided, when the mounting head 5 moves from the alignment mark detection position to the target position GP after detecting the alignment mark by the alignment device, the movement conditions of the mounting head 5 to the target position GP include the movement conditions of the mounting head 5 from the alignment mark detection position to the target position GP. The movement conditions of the mounting head 5 to the target position GP include the movement distance, movement speed, and movement direction of the mounting head 5 to the target position GP. The movement distance includes the movement distance of the mounting head 5 in the X-axis direction and the movement distance in the Y-axis direction. The movement speed includes the movement speed of the mounting head 5 in the X-axis direction and the movement speed in the Y-axis direction. The movement direction is the movement direction of the mounting head 5 in the XY plane from the recognition position CP or the supply position AP to the target position GP. The movement conditions of the mounting head 5 to the target position GP are described in the production program. That is, the movement conditions of the mounting head 5 to the target position GP are specified based on the operation instruction.

[0056] Figure 7 is a schematic diagram for explaining the operation parameters of the mounting head 5 of the embodiment. As Figure 7 shown, the movement conditions of the nozzle 4 when mounting the component C on the substrate W include the moving distance and moving speed of the nozzle 4 in the Z-axis direction until the component C is mounted on the substrate W. In addition, the movement conditions of the nozzle 4 when mounting the component C on the substrate W include the rotation angle of the nozzle 4 in the θZ direction. The movement conditions of the nozzle 4 when mounting the component C on the substrate W are described in the production program. That is, based on the operation instruction, the movement conditions of the nozzle 4 when mounting the component C on the substrate W are specified.

[0057] Figure 8 is a schematic diagram for explaining the operation parameters of the mounting head 5 of the embodiment. As Figure 8 shown, the holding conditions of the nozzle 4 for the component C include the adsorption deviation amount ΔB, and the adsorption deviation amount ΔB represents the deviation amount between the adsorption position EP of the nozzle 4 and the center position FP of the upper surface of the component C. The adsorption deviation amount ΔB is detected by the component recognition device 8. That is, based on the detection data of the component recognition device 8, the adsorption deviation amount ΔB is specified.

[0058] The holding conditions of the nozzle 4 for the component C include the adsorption pressure when the nozzle 4 adsorbs the component C. The adsorption pressure is detected by the pressure sensor 15. That is, based on the detection data of the pressure sensor 15, the adsorption pressure is specified.

[0059] When the component recognition device 8 recognizes the component C held by the nozzle 4, the mounting head 5 moves the component C at the recognition position CP. The movement conditions of the component C at the component recognition device 8 include the moving distance, moving speed, and moving direction of the component C at the recognition position CP. The movement conditions of the component C at the component recognition device 8 are described in the production program. That is, based on the operation instruction, the movement conditions of the component C at the component recognition device 8 are specified.

[0060] The mounting deviation calculation unit 23 calculates the mounting deviation amount ΔM, and the mounting deviation amount ΔM represents the deviation amount between the mounting position DP of the component C mounted on the substrate W by the mounting head 5 and the target position GP. As described above, the mounting position DP of the component C refers to the actual position of the component C mounted on the surface of the substrate W. The target position GP of the component C refers to the target position of the component C mounted on the surface of the substrate W. The mounting position DP of the component C is detected by the component detection device 9. The target position GP of the component C is described in the production program. The mounting deviation calculation unit 23 calculates the mounting deviation amount ΔM based on the detection data of the component detection device 9 and the production program.

[0061] Figure 9It is a schematic diagram of the component detection device 9 showing an embodiment. The component detection device 9 includes an imaging device. The component detection device 9 is provided on the mounting head 5. The component detection device 9 detects the mounting position DP in the XYZ rectangular coordinate system of the component C mounted on the substrate W.

[0062] The learning model generation unit 24 generates a learning model based on learning data representing the relationship between the operation parameters of the mounting head 5 and the mounting deviation amount ΔM. The learning model takes the operation parameters of the mounting head 5 as input and outputs the deviation amount between the mounting position DP and the target position GP. That is, the learning model generation unit 24 performs machine learning based on the operation parameters obtained by the operation parameter acquisition unit 22 and the mounting deviation amount ΔM calculated by the mounting deviation calculation unit 23. The learning model generation unit 24 performs machine learning based on the operation parameters and the mounting deviation amount ΔM to generate a learning model.

[0063] The learning model storage unit 25 stores the learning model generated by the learning model generation unit 24.

[0064] The estimation unit 26 inputs the operation parameters of the mounting head 5 into the learning model and calculates an estimated deviation amount ΔMe, which represents the estimated value of the deviation amount between the mounting position DP and the target position GP. The estimation unit 26 outputs the calculated estimated deviation amount ΔMe. The operation parameters of the mounting head 5 are sent from the operation parameter acquisition unit 22 to the estimation unit 26. The learning model is sent from the learning model generation unit 24 to the estimation unit 26. The estimation unit 26 inputs the operation parameters obtained by the operation parameter acquisition unit 22 into the learning model generated by the learning model generation unit 24 and outputs the estimated deviation amount ΔMe.

[0065] The correction amount calculation unit 27 calculates a correction amount for mounting the component C at the target position GP based on the estimated deviation amount ΔMe output from the estimation unit 26. The correction amount is a correction amount related to the position of the mounting head 5 in the XY plane.

[0066] The motion instruction unit 28 outputs a motion instruction for moving the mounting head 5 based on the estimated deviation amount ΔMe output from the estimation unit 26 and the production program stored in the production program storage unit 21 to mount the component C at the target position GP. In the embodiment, the motion instruction unit 28 corrects the motion instruction described in the production program based on the correction amount calculated by the correction amount calculation unit 27 and outputs the corrected motion instruction to the mounting head 5.

[0067] As described above, the mounting head 5 has a plurality of suction nozzles 4. In an embodiment, the operation parameter acquisition unit 22 acquires operation parameters respectively related to the plurality of suction nozzles 4. The estimation unit 26 outputs an estimated deviation amount ΔMe for each of the plurality of suction nozzles 4. The correction amount calculation unit 27 calculates a correction amount for mounting the component C at the target position GP for each of the plurality of suction nozzles 4. The operation instruction unit 28 outputs an operation instruction to cause each of the plurality of suction nozzles 4 to mount the component C at the target position GP.

[0068] [Learning stage]

[0069] Figure 10 It is a flowchart showing the learning stage of the embodiment. In the learning stage, a learning model is generated that takes operation parameters as input and outputs the deviation amount between the mounting position DP and the target position GP.

[0070] In the mounting process of the component mounting device 1, the operation parameter acquisition unit 22 acquires the operation parameters of the mounting head 5. In addition, in the mounting process of the component mounting device 1, the mounting deviation calculation unit 23 calculates the mounting deviation amount ΔM based on the production program and the detection data of the component detection device 9. The mounting process of the component mounting device 1 refers to the process of mounting the component C on the substrate W by the mounting head 5. That is, the mounting process of the component mounting device 1 is a process of manufacturing an electronic device.

[0071] The learning model generation unit 24 acquires the operation parameters from the operation parameter acquisition unit 22. In addition, the learning model generation unit 24 acquires the mounting deviation amount ΔM from the mounting deviation calculation unit 23. The learning model generation unit 24 acquires learning data including the operation parameters and the mounting deviation amount ΔM when mounting the component C based on the operation parameters (step SA1).

[0072] The learning model generation unit 24 performs machine learning based on the learning data acquired in step SA1 (step SA2). As machine learning algorithms, examples include at least one of neural network, support vector machine (SVM), decision tree, random forest, and bootstrapping.

[0073] The learning model generation unit 24 generates a learning model by performing machine learning. The learning model takes operation parameters as input and outputs the deviation amount between the mounting position DP and the target position GP (step SA3).

[0074] The learning model generation unit 24 stores the learning model generated in step SA3 in the learning model storage unit 25 (step SA4).

[0075] [Mounting stage]

[0076] Figure 11 It is a flowchart showing the installation stage of the embodiment. In the installation stage, operation parameters are input into the learning model, and an estimated deviation amount ΔMe is output, where the estimated deviation amount ΔMe represents an estimated value of the deviation amount between the installation position DP and the target position GP.

[0077] In the installation process of the component installation device 1, the operation parameter acquisition unit 22 acquires the operation parameters of the mounting head 5 (step SB1).

[0078] The estimation unit 26 inputs the operation parameters obtained in step SB1 into the learning model stored in the learning model storage unit 25 and outputs an estimated deviation amount ΔMe, where the estimated deviation amount ΔMe represents an estimated value of the deviation amount between the installation position DP and the target position RP (step SB2).

[0079] The correction amount calculation unit 27 calculates a correction amount for mounting the component C at the target position GP based on the estimated deviation amount ΔMe output in step SB2 (step SB3).

[0080] The motion instruction unit 28 outputs a motion instruction for operating the mounting head 5 based on the estimated deviation amount ΔMe output from the estimation unit 26 and the production program stored in the production program storage unit 21, so as to mount the component C at the target position GP. In the embodiment, the motion instruction unit 28 corrects the motion instruction described in the production program based on the correction amount calculated in step SB3 and outputs the corrected motion instruction to the mounting head 5 (step SB4).

[0081] Thus, the component C is mounted at the target position GP on the surface of the substrate W.

[0082] The mounting head 5 has a plurality of suction nozzles 4. In the embodiment, the operation parameter acquisition unit 22 acquires operation parameters respectively related to the plurality of suction nozzles 4. The estimation unit 26 outputs an estimated deviation amount ΔMe for each of the plurality of suction nozzles 4. The correction amount calculation unit 27 calculates a correction amount for mounting the component C at the target position GP for each of the plurality of suction nozzles 4. The motion instruction unit 28 outputs a motion instruction to mount the component C at the target position GP through each of the plurality of suction nozzles 4.

[0083] [Computer system]

[0084] Figure 12FIG. 0 is a block diagram of a computer system 1000 showing an embodiment. The above control device 10 includes the computer system 1000. The computer system 1000 has: a processor 1001 such as a CPU (Central Processing Unit); a main memory 1002 including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory); a memory 1003; and an interface 1004 including an input / output circuit. The functions of the control device 10 are stored in the memory 1003 as a computer program. The processor 1001 reads out the computer program from the memory 1003 and expands it in the main memory 1002, and executes the above processing according to the computer program. In addition, the computer program can also be distributed to the computer system 1000 via a network.

[0085] The computer program can cause the computer system 1000 to execute, according to the above embodiment: obtaining the operation parameters of the mounting head 5; calculating a mounting deviation amount ΔM representing the deviation between the mounting position DP of the component C mounted on the substrate W by the mounting head 5 and the target position GP; generating a learning model that takes the operation parameters as input and outputs the deviation between the mounting position DP and the target position GP, based on learning data representing the relationship between the operation parameters and the mounting deviation amount ΔM; inputting the operation parameters into the learning model and outputting a predicted deviation amount ΔMe representing the predicted value of the deviation between the mounting position DP and the target position GP; and controlling the mounting head 5 based on the predicted deviation amount ΔMe to mount the component C at the target position GP.

[0086] [Effect]

[0087] As described above, according to the embodiment, in the learning stage, based on the learning data representing the relationship between the operation parameters of the mounting head 5 and the mounting deviation amount ΔM, a learning model is generated that takes the operation parameters as input and outputs the deviation between the mounting position DP and the target position GP. In the mounting stage, the operation parameters are input into the learning model, and a predicted deviation amount ΔMe representing the predicted value of the deviation between the mounting position DP and the target position GP is calculated. Based on the calculated predicted deviation amount ΔMe, the mounting head 5 is controlled to mount the component C at the target position GP. The operation parameters of the mounting head 5 are obtained in the mounting process of the component mounting device 1. Therefore, even without stopping the mounting process of the component mounting device 1, the predicted deviation amount ΔMe between the mounting position DP and the target position GP can be efficiently derived. Therefore, a decrease in the moving rate of the component mounting device 1 can be suppressed.

[0088] The operation parameter includes the target position GP of component C. As described above, the target position GP of component C is the position of coordinates defined in the XYZ rectangular coordinate system. When component C is mounted on the substrate W, the mounting head 5 is disposed above the target position GP. Based on the position of the mounting head 5 in the XYZ rectangular coordinate system, for example, there is a possibility that the deformation state of the base 11 or the support column 12 changes, or the vibration state of the base 11 or the support column 12 changes, or the weight balance of the base 11 or the support column 12 changes. Due to the change in the deformation state, the change in the vibration state, or the change in the weight balance, there is a possibility that the mounting deviation amount ΔM changes. That is, based on the target position GP, there is a possibility that the mounting deviation amount ΔM changes.

[0089] For example, when the target position GP is set at the central portion of the substrate W and when the target position GP is set at the peripheral portion of the substrate W, there is a possibility that the mounting deviation amount ΔM is different. For example, there is a possibility that the mounting deviation amount ΔM when the target position GP is set at the peripheral portion of the substrate W is larger than the mounting deviation amount ΔM when the target position GP is set at the center of the substrate W.

[0090] In addition, when the target position GP is set at a position close to the alignment mark and when the target position GP is set at a position far from the alignment mark, there is a possibility that the mounting deviation amount ΔM is different. For example, there is a possibility that the mounting deviation amount ΔM when the target position GP is set at a position far from the alignment mark is larger than the mounting deviation amount ΔM when the target position GP is set at a position close to the alignment mark.

[0091] By including the target position GP of component C in the operation parameter, the estimation unit 26 can appropriately calculate the estimated deviation amount ΔMe for each of the different target positions GP. The correction amount calculation unit 27 can appropriately calculate the correction amount for each of the different target positions GP. Therefore, the operation instruction unit 28 can appropriately mount component C at different target positions GP.

[0092] The operation parameter includes the movement conditions of the mounting head 5 up to the target position GP of component C. The movement conditions of the mounting head 5 include the movement distance, the movement speed, and the movement direction of the mounting head 5 up to the target position GP. Based on the movement conditions of the mounting head 5, for example, there is a possibility that the deformation state of the base 11 or the support column 12 changes, or the vibration state of the base 11 or the support column 12 changes, or the weight balance of the base 11 or the support column 12 changes. Due to the change in the deformation state, the change in the vibration state, or the change in the weight balance, there is a possibility that the mounting deviation amount ΔM changes. That is, based on the movement conditions of the mounting head 5, there is a possibility that the mounting deviation amount ΔM changes.

[0093] For example, when the moving distance of the mounting head 5 to the target position GP is the first moving distance and when it is the second moving distance longer than the first moving distance, there is a possibility that the mounting deviation amount ΔM is different. For example, there is a possibility that the mounting deviation amount ΔM when the moving distance of the mounting head 5 is the second moving distance is greater than the mounting deviation amount ΔM when the moving distance of the mounting head 5 is the first moving distance.

[0094] In addition, when the moving speed of the mounting head 5 to the target position GP is the first moving speed and when it is the second moving speed faster than the first moving speed, there is a possibility that the mounting deviation amount ΔM is different. For example, there is a possibility that the mounting deviation amount ΔM when the moving speed of the mounting head 5 is the second moving speed is greater than the mounting deviation amount ΔM when the moving speed of the mounting head 5 is the first moving speed.

[0095] In addition, when the moving direction of the mounting head 5 to the target position GP is the X-axis direction and when it is the Y-axis direction, there is a possibility that the mounting deviation amount ΔM is different. For example, there is a possibility that the mounting deviation amount ΔM when the moving direction of the mounting head 5 is the X-axis direction is greater than the mounting deviation amount ΔM when the moving direction of the mounting head 5 is the Y-axis direction.

[0096] By including the movement conditions of the mounting head 5 in the operation parameters, the estimation unit 26 can appropriately calculate the estimated deviation amount ΔMe for each of the different movement conditions of the mounting head 5. The correction amount calculation unit 27 can appropriately calculate the correction amount for each of the different movement conditions of the mounting head 5. Therefore, the operation instruction unit 28 can appropriately mount the component C at the target position GP under each of the different movement conditions of the mounting head 5.

[0097] The operation parameters include the movement conditions of the nozzle 4 when mounting the component C on the substrate W. The movement conditions of the nozzle 4 include the moving distance and moving speed of the nozzle 4 in the Z-axis direction until the component C is mounted on the substrate W. In addition, the movement conditions of the nozzle 4 when mounting the component C on the substrate W include the rotation angle of the nozzle 4 in the θZ direction. Based on the movement conditions of the nozzle 4, for example, there is a possibility that the deformation state of the nozzle 4 or the shaft 5S changes, or the vibration state of the nozzle 4 or the shaft 5S changes. Due to the change in the deformation state or the vibration state, there is a possibility that the mounting deviation amount ΔM changes. That is, based on the movement conditions of the nozzle 4, there is a possibility that the mounting deviation amount ΔM changes.

[0098] For example, when the moving distance of the nozzle 4 is the third moving distance and the fourth moving distance longer than the third moving distance, there is a possibility that the installation deviation amount ΔM is different. For example, there is a possibility that the installation deviation amount ΔM when the moving distance of the nozzle 4 is the fourth moving distance is greater than the installation deviation amount ΔM when the moving distance of the nozzle 4 is the third moving distance.

[0099] In addition, when the moving speed of the nozzle 4 is the third moving speed and the fourth moving speed faster than the third moving speed, there is a possibility that the installation deviation amount ΔM is different. For example, there is a possibility that the installation deviation amount ΔM when the moving speed of the nozzle 4 is the fourth moving speed is greater than the installation deviation amount ΔM when the moving speed of the nozzle 4 is the third moving speed.

[0100] In addition, when the rotation angle of the nozzle 4 is 0° and 90°, there is a possibility that the installation deviation amount ΔM is different. For example, due to a slight bend of the shaft 5S or eccentricity of the rotation center, there is a possibility that the installation deviation amount ΔM when the rotation angle of the nozzle 4 is 90° is greater than the installation deviation amount ΔM when the rotation angle of the nozzle 4 is 0°.

[0101] By including the moving conditions of the nozzle 4 in the operation parameters, the estimation unit 26 can appropriately calculate the estimated deviation amount ΔMe under each of the different moving conditions of the nozzle 4. The correction amount calculation unit 27 can appropriately calculate the correction amount under each of the different moving conditions of the nozzle 4. Therefore, the operation instruction unit 28 can appropriately mount the component C at the target position GP under each of the different moving conditions of the nozzle 4.

[0102] The operation parameters include the holding conditions of the nozzle 4 for the component C. The holding conditions of the component C include an adsorption deviation amount ΔB, and the adsorption deviation amount ΔB represents the deviation amount between the adsorption position EP of the nozzle 4 and the center position FP of the upper surface of the component C. Based on the adsorption deviation amount ΔB, there is a possibility that the installation deviation amount ΔM changes.

[0103] For example, in the case where the adsorption deviation amount ΔB is the first adsorption deviation amount and in the case of the second adsorption deviation amount that is larger than the first adsorption deviation amount, there is a possibility that the mounting deviation amount ΔM is different. For example, there is a possibility that the mounting deviation amount ΔM in the case where the adsorption deviation amount ΔB is the second adsorption deviation amount is larger than the mounting deviation amount ΔM in the case where the adsorption deviation amount ΔB is the first adsorption deviation amount. Generally, the mounting head 5 performs the mounting process in a state where the adsorption deviation amount ΔB is taken into account to mount the component C at the target position GP. However, if the adsorption deviation amount ΔB is too large, when the nozzle 4 holding the component C approaches the target position GP of the substrate W and the component C is released, for example, due to the weight balance of the component C, there is a possibility that the component C is mounted at a position deviated from the target position GP.

[0104] By including the adsorption deviation amount ΔB in the operation parameters, the estimation unit 26 can appropriately calculate the estimated deviation amount ΔMe for each of the different adsorption deviation amounts ΔB. The correction amount calculation unit 27 can appropriately calculate the correction amount for each of the different adsorption deviation amounts ΔB. Therefore, the operation instruction unit 28 can appropriately mount the component C at the target position GP for each of the different adsorption deviation amounts ΔB.

[0105] In addition, the holding condition of the component C includes the adsorption pressure when the nozzle 4 adsorbs the component C. Based on the adsorption pressure, there is a possibility that the mounting deviation amount ΔM changes.

[0106] For example, in the case where the adsorption pressure is the first adsorption pressure and in the case of the second adsorption pressure that is higher than the first adsorption pressure, there is a possibility that the mounting deviation amount ΔM is different. For example, there is a possibility that the mounting deviation amount ΔM in the case where the adsorption pressure is the second adsorption pressure is larger than the mounting deviation amount ΔM in the case where the adsorption pressure is the first adsorption pressure. A high adsorption pressure means that the adsorption of the component C by the nozzle 4 is imperfect. If the adsorption pressure of the component C by the nozzle 4 is imperfect, when the nozzle 4 holding the component C approaches the target position DP of the substrate W and the component C is released, for example, due to the weight balance of the component C, there is a possibility that the component C is mounted at a position deviated from the target position GP.

[0107] By including the adsorption pressure in the operation parameters, the estimation unit 26 can appropriately calculate the estimated deviation amount ΔMe for each of the different adsorption pressures. The correction amount calculation unit 27 can appropriately calculate the correction amount for each of the different adsorption pressures. Therefore, the operation instruction unit 28 can appropriately mount the component C at the target position GP for each of the different adsorption pressures.

[0108] The operation parameters include the movement conditions of the component C at the component recognition device 8. As described above, when the component recognition device 8 recognizes the component C held by the nozzle 4, the mounting head 5 moves the component C at the recognition position CP. The movement conditions of the component C at the component recognition device 8 include the movement distance, movement speed, and movement direction of the component C at the recognition position CP. Based on the movement conditions of the component C at the component recognition device 8, for example, there is a possibility that the deformation state of the base 11 or the column 12 changes, or the vibration state of the base 11 or the column 12 changes, or the weight balance of the base 11 or the column 12 changes. Due to the change in the deformation state, vibration state, or weight balance, there is a possibility that the recognition result of the component recognition device 8 changes. For example, there is a possibility that the adsorption deviation amount ΔB detected by the component recognition device 8 changes. As a result, there is a possibility that the mounting deviation amount ΔM changes. That is, based on the movement conditions of the component C at the component recognition device 8, there is a possibility that the mounting deviation amount ΔM changes.

[0109] By including the movement conditions of the component C at the component recognition device 8 in the operation parameters, the estimation unit 26 can appropriately calculate the estimated deviation amount ΔMe for each of the different movement conditions of the component C at the component recognition device 8. The correction amount calculation unit 27 can appropriately calculate the correction amount for each of the different movement conditions of the component C at the component recognition device 8. Therefore, the operation instruction unit 28 can appropriately mount the component C at the target position GP for each of the different movement conditions of the component C at the component recognition device 8.

[0110] The mounting head 5 has a plurality of nozzles 4. In the embodiment, the operation parameter acquisition unit 22 acquires the operation parameters respectively related to the plurality of nozzles 4. The estimation unit 26 outputs the estimated deviation amount ΔMe for each of the plurality of nozzles 4. The correction amount calculation unit 27 calculates the correction amount for mounting the component C at the target position GP for each of the plurality of nozzles 4. The operation instruction unit 28 outputs an operation instruction to mount the component C at the target position GP through each of the plurality of nozzles 4. Thus, each of the plurality of nozzles 4 can appropriately mount the component C at the target position GP.

[0111] [Other Embodiments]

[0112] In the above embodiment, in the learning stage, the mounting position DP of the component C is detected by the component detection device 9. The mounting position DP of the component C may also be detected by an inspection device different from the component mounting device 1.

Claims

1. A component mounting device, characterized in that: The component mounting device includes: An operation parameter acquisition unit that acquires the operation parameters of the mounting head; A mounting deviation amount calculation unit that calculates a mounting deviation amount, where the mounting deviation amount represents the deviation amount between the mounting position of the component mounted on the substrate by the mounting head and the target position; A learning model generation unit that generates a learning model based on learning data representing the relationship between the operation parameters and the mounting deviation amount, where the learning model takes the operation parameters as input and the deviation amount between the mounting position and the target position as output; An estimation unit that inputs the operation parameters to the learning model and outputs an estimated deviation amount, where the estimated deviation amount represents the estimated value of the deviation amount between the mounting position and the target position; And An operation instruction unit that outputs an operation instruction for moving the mounting head based on the estimated deviation amount to mount the component at the target position, The operation parameters include the target position, and the target position is a position specified based on the operation instruction, The operation parameters include the movement conditions of the mounting head up to the target position, The movement conditions include the movement distance, movement speed, and movement direction of the mounting head up to the target position.

2. The component mounting device according to claim 1, characterized in that: The mounting head has a nozzle that can detachably hold the component, The operation parameters include the movement conditions of the nozzle when mounting the component on the substrate.

3. The component mounting device according to claim 1, characterized in that: The mounting head has a nozzle that can detachably hold the component, holds the component at the supply position, and then mounts the component on the substrate, The operation parameters include the holding conditions of the component by the nozzle.

4. The component mounting device according to claim 3, characterized in that: The nozzle adsorbs the upper surface of the component, The holding conditions include an adsorption deviation amount, and the adsorption deviation amount represents the deviation amount between the adsorption position of the nozzle and the central position of the upper surface.

5. The component mounting device according to claim 3, characterized in that: The nozzle adsorbs the upper surface of the component, The holding conditions include the adsorption pressure when adsorbing the component.

6. The component mounting device according to claim 2, characterized in that: The mounting head has a plurality of the nozzles, The operation parameter acquisition unit acquires the operation parameters respectively related to the plurality of nozzles.

7. The component mounting device according to claim 1, characterized in that: The mounting head has a nozzle that can detachably hold the component, holds the component at the supply position, and then mounts the component on the substrate, The component mounting device includes a component identification device that identifies the component held by the nozzle, The operation parameters include the movement conditions of the component at the component identification device.

8. A component mounting method, characterized in that: The component mounting method includes: Acquiring the operation parameters of the mounting head; Calculate the mounting deviation amount, which represents the deviation amount between the mounting position of the component mounted on the substrate by the mounting head and the target position; Generate a learning model based on the learning data representing the relationship between the operation parameters and the mounting deviation amount, where the learning model takes the operation parameters as input and outputs the deviation amount between the mounting position and the target position; Input the operation parameters into the learning model to output an estimated deviation amount, which represents the estimated value of the deviation amount between the mounting position and the target position; and Based on the estimated deviation amount, move the mounting head to mount the component at the target position, The operation parameters include the target position, which is the position specified based on the operation instruction, The operation parameters include the movement conditions of the mounting head up to the target position, The movement conditions include the movement distance, movement speed, and movement direction of the mounting head up to the target position.

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