Micro LED display including antistatic grounded circuit board

Abstract

Disclosed are an anti-static grounding circuit board and a micro LED display including the same. The disclosed display includes: a substrate, a first circuit unit, a second circuit unit, a side circuit unit, a plurality of micro LED chips, and a grounding circuit board, the grounding circuit board being disposed on a second surface of the substrate to ground static electricity generated in one or more of the first circuit unit, the second circuit unit, and the side circuit unit, wherein the grounding circuit board is electrically connected to the side circuit unit, disposed around the second circuit unit, and can ground the generated static electricity. Various other embodiments are also possible.

Description

Technical Field

[0001] Various embodiments of the present disclosure are directed to a micro LED display including an anti-static grounding structure. Background Art

[0002] The micro LED display is intended to be a frameless display or a modular display, and a wiring formation structure using a conductive layer directly attached to a side surface of a substrate may be inevitable.

[0003] During the production of displays such as LCDs or OLEDs, temperature / humidity and foreign matter can be fully controlled without exposing wiring and pads, and since the TFT circuit portion is handled in an unmanned environment, damage caused by static elasticity can be minimized.

[0004] Furthermore, since the display is located at the outermost side of the TFT circuit, damage caused by static elasticity can be reduced by disconnecting electrically connected wiring in a state where all wirings are electrically connected and in a state where potential damage caused by static electricity is minimized. Summary of the invention

[0005] Technical issues

[0006] However, in combination with a micro LED display wiring structure that requires wiring to be formed on the side surface of the substrate, if all wirings remain connected while forming the wirings on the side surface of the substrate, the assembly process cannot be easily performed, and there is no technology that ensures that the wirings can be disconnected to the final state without damaging the substrate.

[0007] Therefore, since processing is required with connection pads on the upper surface of the substrate and wirings on the side surfaces thereof exposed, the micro LED display is exposed to potential point / line / surface defects due to static elasticity.

[0008] Therefore, a grounding structure for protecting circuit components from static elasticity may be needed in order to ensure the product integrity of micro LED displays and their mass production.

[0009] Embodiments of the present disclosure may provide a ground connection circuit capable of protecting an internal MUX / DEMUX circuit and / or an IC of a driver unit from the resulting static elastic damage and a micro LED display including the ground connection circuit.

[0010] Embodiments of the present disclosure may provide a ground connection circuit that can protect a circuit portion of a circuit board from static elasticity not only in a set assembly state but also after assembly is completed when the product is transported or used.

[0011] Solution to the problem

[0012] According to various embodiments of the present disclosure, a micro LED display may include: a substrate including a first surface arranged to face a first direction, a second surface arranged to face a second direction opposite to the first direction, and a side surface arranged to face a third direction perpendicular to the first direction and the second direction; a first circuit unit arranged on the first surface; a second circuit unit arranged on the second surface; a side circuit unit arranged on the side surface and electrically connected in parallel with the first circuit unit; a plurality of micro LED chips arranged on the surface of the first circuit unit facing the first direction; and a grounding circuit board arranged on the second surface and configured to ground static electricity that has been generated in one or more circuit units among the first circuit unit, the second circuit unit and the side circuit unit, wherein the grounding circuit board is electrically connected to the side circuit unit, arranged on the periphery of the second circuit unit, and configured to ground the generated static electricity.

[0013] Advantageous Effects of the Invention

[0014] The present disclosure can protect the MUX circuit of the first circuit unit or the driver IC of the second circuit unit from static elasticity.

[0015] The present disclosure can protect the MUX / DEMUX circuit of the first circuit unit or the driver IC of the second circuit unit from static elasticity even after the assembly of the micro LED display is completed or when the micro LED display is shipped in a product state. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a side view showing the structure of a micro LED display according to various embodiments of the present disclosure, and the side view shows an enlarged view of a portion of the micro LED display.

[0017] Figure 2 and Figure 3 1 and 2 are side views respectively showing a ground structure arranged on a micro LED display according to various embodiments of the present disclosure.

[0018] Figure 4 is a plan view illustrating a ground structure disposed on a second surface of a substrate according to various embodiments of the present disclosure.

[0019] Figure 5 is a plan view illustrating another ground layer according to various embodiments of the present disclosure.

[0020] Figure 6 is a cross-sectional view illustrating a ground connection circuit according to various embodiments of the present disclosure. DETAILED DESCRIPTION

[0021] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that there is no intention to limit the present disclosure to a specific form, and the present disclosure should be interpreted as covering all modifications, equivalents and / or replacements that fall within the spirit and scope of the embodiments of the present disclosure. In conjunction with the description of the accompanying drawings, similar reference numerals may be used to represent similar components.

[0022] For example, the electronic device according to the embodiments of the present disclosure may include at least one of the following: a smart phone, a tablet personal computer (PC), a mobile phone, a video phone, an electronic book (e-book) reader, a desktop personal computer (PC), a laptop personal computer (PC), a net-book computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, and a wearable device (for example, smart glasses, a head mounted device (HMD), electronic clothes, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, a smart mirror, or a smart watch).

[0023] In some embodiments, the electronic device may be a smart home appliance. The smart home appliance may include at least one of the following: for example, a television, a digital video disk (DVD) player, a stereo, a refrigerator, an air conditioner, a cleaner, an oven, a microwave oven, a washing machine, an air cleaner, a set-top box, a home automation control panel, a security control panel, a TV box (e.g., Samsung HomeSync TM 、AppleTV TM or GoogleTV TM ), game consoles (e.g., Xbox TM and PlayStation TM ), electronic dictionaries, electronic keys, camcorders and electronic photo frames.

[0024] According to another embodiment, the electronic device may include at least one of the following: various medical devices (for example, various portable medical measuring devices (blood sugar monitoring devices, heart rate monitoring devices, blood pressure measuring devices, body temperature measuring devices, etc.), magnetic resonance angiography (MRA) machines, magnetic resonance imaging (MRI) machines, computed tomography (CT) machines, scanners, ultrasound machines, etc.), navigation devices, global positioning system (GPS) receivers, event data recorders (EDRs), flight data recorders (FDRs), vehicle infotainment equipment, marine electronic equipment (for example, marine navigation devices, gyroscopes, etc.), avionics equipment, security equipment, locomotive head units, household or industrial robots, automatic teller machines (ATMs) in banks, points of sale (POS) in stores, and Internet of Things devices (for example, light bulbs, various sensors, electricity meters or gas meters, sprinkler equipment, fire alarms, thermostats, street lights, ovens, sporting goods, hot water tanks, heaters, boilers, etc.).

[0025] According to some embodiments, the electronic device may include at least one of the following: a part of furniture or a building / structure, an electronic board, an electronic signature receiving device, a projector, and various measuring instruments (e.g., a water meter, an electric meter, a gas meter, and a radio wave meter, etc.). In various embodiments, the electronic device may be a combination of one or more of the aforementioned various devices. The electronic device according to some embodiments may be a flexible electronic device. In addition, the electronic device according to the embodiments of the present disclosure may not be limited to the above-mentioned devices, and may include new electronic devices obtained according to technological developments.

[0026] Figure 1 1 is a side view showing a micro LED display 10 according to various embodiments of the present disclosure, the side view showing an enlarged view of a portion of the micro LED display 10. In the rectangular coordinate system used therein, the x-axis may be the lateral direction of the micro LED display 10, the y-axis may be the longitudinal direction of the micro LED display 10, and the z-axis may be the thickness direction of the micro LED display 10. The micro LED display 10 shown may be used for a small display, and a plurality of micro LED displays 10 may be combined to be used as a large-screen display. For example, the micro LED display 10 according to one embodiment may be used for one of a display of an electronic device, a television screen, a theater movie screen, and an electronic display board.

[0027] Reference Figure 1 , a micro LED display 10 according to one embodiment may be used as a display of an electronic device. A micro LED display 10 according to one embodiment may include a substrate 11, first and second circuit units 12 and 14, and a plurality of micro LED chips 13. According to one embodiment, the substrate 11 may be made of a glass material, and may be a support plate for supporting a plurality of arranged micro LED chips 13 in the form of a plate. According to one embodiment, the substrate 11 may include a first surface 10a, a second surface 10b, and a third surface 10c. For example, the first surface 10a may be a front surface, the second surface 10b may be a rear surface, and the third surface 10c may be four side surfaces. According to one embodiment, a plurality of micro LED chips 13 may be arranged on the first circuit unit 12, and may emit light to realize a display area.

[0028] According to one embodiment, a plurality of micro LED chips 13 may be arranged on one surface of the first circuit unit 12 facing the first direction ① in the connection pad downward state. For example, each micro LED chip 13 may have a size of 100 microns or less, and may have a size of about several tens of microns. Each micro LED chip 13 may include a red element, a green element, and a blue element.

[0029] Figure 2 and Figure 3 1 and 2 are side views respectively showing a ground structure 20 disposed on a micro LED display 10 according to various embodiments of the present disclosure.

[0030] Reference Figure 2 According to one embodiment, the substrate 11 may include a first surface 10a facing a first direction ①, a second surface 10b facing a second direction ② opposite to the first direction ①, and a side surface 10c perpendicular to the first and second directions ① and ② and configured to surround at least a portion of a space between the first surface 10a and the second surface 10b. According to one embodiment, the substrate 11 may include a first circuit unit 12 disposed on the first surface 10a, a second circuit unit 14 disposed on the second surface 10b, and a side circuit unit 15 disposed on the third surface 10c.

[0031] According to one embodiment, the first circuit unit 12 may be disposed on the first surface 10a and may have a plurality of micro LED chips 13 disposed thereon. For example, the first circuit unit 12 may include a TFT circuit. The first circuit unit 12 may be formed by a conductive line patterned on the first surface 10a. According to one embodiment, the first circuit unit 12 may include a multiplexer (MUX) / demultiplexer (DEMUX) circuit. According to one embodiment, the first circuit unit 12 may be completely formed on the first surface 10a.

[0032] According to one embodiment, the second circuit unit 14 may be disposed on the second surface 10b. According to one embodiment, the second circuit unit 14 may be partially formed on the second surface 10b. The second circuit unit 14 may include an additional circuit unit 16 on which a driver IC 160 is disposed. According to one embodiment, the additional circuit unit 16 may be a flexible circuit board type and may be electrically connected to the second circuit unit 14. For example, the additional circuit unit 16 may have a driver IC 160 disposed on one surface thereof.

[0033] Reference Figure 3 According to one embodiment, the circuit unit 17 on which the driver IC 170 is disposed may be formed of a conductive material patterned directly on the second surface 10 b of the substrate 11 . That is, the circuit unit 17 may be included in the second circuit unit 14 .

[0034] Reference again Figure 2 According to one embodiment, the side circuit unit 15 may be disposed on one surface 10c of the four surfaces, may be electrically connected to the first circuit unit 12, and may be electrically connected to the ground structure 20. For example, the ground structure 20 may be formed as a flexible circuit board type, and may be referred to as a ground circuit board hereinafter.

[0035] According to one embodiment, the side circuit unit 15 may be formed of conductive lines patterned on edge regions of the first surface 10a, the side surface 10c, and the second surface 10b of the substrate 11, or may be formed by using a separate flexible circuit board.

[0036] According to one embodiment, in the case where static electricity is applied to the side circuit unit 15, the MUX / DEMUX circuit of the first circuit unit 12 or the driver IC 160 of the additional circuit unit 16 may be damaged by the applied static electricity, but the applied static electricity can be grounded by the grounding circuit board 20. Therefore, by increasing the static electricity induction path using the grounding circuit board 20, for example, the MUX / DEMUX circuit or the driver IC 160 can be protected. According to one embodiment, the grounding circuit board 20 can be located on an intermediate path between the MUX / DEMUX circuit and the driver IC to prevent the generated static current from reaching the MUX / DEMUX circuit or the driver IC.

[0037] According to one embodiment, the side circuit unit 15 may be electrically connected to the first circuit unit 12, and may be electrically connected to the second circuit unit 14. According to one embodiment, the first circuit unit 12 may not be electrically connected to the second circuit unit 14. According to one embodiment, the side circuit unit 15 may not be electrically connected to the second circuit unit 14.

[0038] Figure 4 is a plan view showing the ground circuit board 20 provided on the second surface 10 b of the substrate 11 according to various embodiments of the present disclosure. Figure 4 Only the signal layer 21 of the ground circuit board 20 is shown.

[0039] Reference Figure 4 According to one embodiment, the ground circuit board 20 may be disposed on the second surface 10 b of the substrate 11 . According to one embodiment, the ground circuit board 20 may include a signal layer 21 .

[0040] According to one embodiment, the signal layer 21 may include a first portion 210 connected to the side circuit unit 15 and a second portion 212 on which a plurality of antistatic protection elements 200 are arranged. According to one embodiment, the second portion 212 may be a trapezoid or an isosceles trapezoid. However, the second portion 212 may not be limited to this shape and may be formed in various shapes.

[0041] Figure 5 is a plan view showing another ground layer 22 according to various embodiments of the present disclosure.

[0042] Reference Figure 5 According to one embodiment, the ground layer 22 may include a portion electrically connected to the side circuit unit (eg, Figure 4 The first portion 220 of the side circuit unit edge portion 151 shown in FIG. 1 and the second portion 222 on which the ground connection pad 224 is disposed. According to one embodiment, the second portion 222 may be a trapezoid or an isosceles trapezoid and may have a shape that is consistent with the second portion of the signal layer 21 (e.g., Figure 4 According to one embodiment, the ground connection pad 224 may be arranged in a shape extending along the edge of the second portion 222. For example, the ground connection pad 224 may have a shape extending linearly in one direction.

[0043] Figure 6 is a cross-sectional view showing the ground circuit board 20 according to various embodiments of the present disclosure.

[0044] Reference Figure 6 According to one embodiment, the grounding circuit board 20 may be a structure configured to ground static electricity generated in one or more circuit units among the circuit units arranged on the substrate, wherein the circuit unit arranged on the substrate is, for example, a first circuit unit (e.g., Figure 1 , the first circuit unit 12 shown in FIG. 1 ), the second circuit unit (eg, Figure 2 14) or the side circuit unit 15. According to one embodiment, the ground circuit board 20 may be made of a flexible material and may be disposed on the periphery of the second circuit unit 14. According to one embodiment, the ground circuit board 20 may be disposed on the side circuit unit 15 and a circuit board on which a driver IC is disposed (e.g., Figure 2 For example, the ground circuit board 20 can be made of a flexible material.

[0045] According to one embodiment, the ground circuit board 20 may include a signal layer 21 and a ground layer 22. According to one embodiment, the signal layer 21 may include a first surface 21a and a second surface 21b opposite to the first surface 21a. According to one embodiment, the signal layer 21 may have a plurality of antistatic protection elements 200 arranged on the first surface 21a. Each antistatic protection element 200 may be mounted on the first surface 21a of the signal layer 21 in a type with a connection pad facing downward. According to one embodiment, the antistatic protection element 200 may be mounted on the signal layer 21 by a film on glass (FOG) method. For example, each antistatic protection element 200 may include a transient voltage suppressor (TVS) diode.

[0046] According to one embodiment, the ground layer 22 may be attached to the signal layer 21 and may be electrically connected to the antistatic protection element 200. The ground layer 22 may be arranged in at least one layer. According to one embodiment, each antistatic protection element 200 may be electrically connected to the ground connection pad 224.

[0047] According to one embodiment, each antistatic protection element 200 may include first and second connection pads 201 and 202. According to one embodiment, the first connection pad 201 may be electrically connected to the signal layer 21, and the second connection pad 202 may be electrically connected to the ground connection pad 224 provided on the ground layer 22. According to one embodiment, the signal layer 21 may be made of a flexible material. According to one embodiment, the ground layer 22 may be made of a flexible material.

[0048] According to one embodiment, a micro LED display may include: a substrate including a first surface arranged to face a first direction, a second surface arranged to face a second direction opposite to the first direction, and a side surface arranged to face a third direction perpendicular to the first direction and the second direction; a first circuit unit arranged on the first surface; a second circuit unit arranged on the second surface; a side circuit unit arranged on the side surface and electrically connected to the first circuit unit; a plurality of micro LED chips arranged on a surface of the first circuit unit facing the first direction; and a grounding circuit board configured to ground static electricity generated in one or more circuit units among the first circuit unit, the second circuit unit and the side circuit unit, wherein the grounding circuit board may be electrically connected to the side circuit unit, may be arranged on the periphery of the second circuit unit, and may be configured to ground the generated static electricity.

[0049] According to one embodiment, the ground circuit board may be disposed between the side circuit unit and the second circuit unit.

[0050] According to one embodiment, the ground circuit board may include a flexible material.

[0051] According to one embodiment, a ground circuit board may include: a signal layer having a plurality of antistatic protection elements arranged on a surface thereof; and at least one ground layer attached to the signal layer and electrically connected to the antistatic protection elements.

[0052] According to one embodiment, each of the antistatic protection elements may include first and second connection pads, wherein the first connection pad may be electrically connected to the signal layer, and the second connection pad may be electrically connected to the ground layer.

[0053] According to an embodiment, the ground layer may include a ground connection pad, and the second connection pad may be electrically connected to the ground connection pad.

[0054] According to one embodiment, each of the anti-static protection elements may include a TVS diode.

[0055] According to one embodiment, the signal layer may include a flexible material.

[0056] According to one embodiment, the ground layer may include a flexible material.

[0057] According to one embodiment, a plurality of antistatic protection elements may be mounted on a signal layer by using a FOG method.

[0058] According to one embodiment, the signal layer on which the plurality of antistatic protection elements are arranged may have an isosceles trapezoidal shape.

[0059] According to one embodiment, a portion of the ground layer on which the ground connection pad is disposed may have an isosceles trapezoidal shape.

[0060] According to an embodiment, the substrate may include a glass material.

[0061] According to one embodiment, the second circuit unit may be formed by a conductive material patterned on the second surface of the substrate, or may be connected to the second surface.

[0062] According to one embodiment, the first circuit unit may include a MUX / DEMUX circuit, the second circuit unit may include a driver IC, and the ground circuit board may be disposed on an intermediate path between the MUX / DEMUX circuit and the driver IC.

[0063] The various embodiments of the present disclosure disclosed in this specification and the accompanying drawings are merely specific examples presented to easily describe the technical details of the present disclosure and to help understand the present disclosure, and are not intended to limit the scope of the present disclosure. Therefore, it should be interpreted that the scope of the present disclosure is not limited to the various embodiments disclosed. Therefore, it should be understood that, in addition to the embodiments disclosed herein, all modifications and changes or modified and changed forms obtained from the technical ideas of the various embodiments of the present disclosure fall within the scope of the present disclosure.

Claims

1. A micro LED display comprising: A substrate, comprising a first surface arranged to face a first direction, a second surface arranged to face a second direction opposite to the first direction, and a side surface arranged to face a third direction perpendicular to the first direction and the second direction; A first circuit, disposed on the first surface; a second circuit disposed on a first portion of the second surface; a side circuit disposed on the side and electrically connected in parallel to the first circuit; A plurality of micro LED chips are arranged on a surface of the first circuit facing the first direction; as well as a grounding circuit board disposed on the second surface and configured to ground static electricity that has been generated in one or more circuits among the first circuit, the second circuit, and the side circuit, wherein the ground circuit board is disposed on a second portion of the second surface and between the second circuit and the side circuit, wherein the second portion of the second surface is different from the first portion of the second surface, Wherein, the ground circuit board comprises: a signal layer electrically connected to the side circuit; and A ground layer, attached to the first side of the signal layer, The ground layer is electrically connected to at least one anti-static protection element arranged on a second surface of the signal layer, and the second surface of the signal layer is opposite to the first surface of the signal layer.

2. The micro LED display according to claim 1, wherein: The ground circuit board includes a flexible material.

3. The micro LED display according to claim 1, wherein: Each of the at least one antistatic protection element includes a first connection pad and a second connection pad, and The first connection pad is electrically connected to the signal layer, and the second connection pad is electrically connected to the ground layer.

4. The micro LED display according to claim 3, wherein: The ground layer includes a ground connection pad, and the second connection pad is electrically connected to the ground connection pad.

5. The micro LED display according to claim 1, wherein: Each of the at least one anti-static protection element includes a TVS diode.

6. The micro LED display according to claim 1, wherein: The signal layer includes a flexible material.

7. The micro LED display according to claim 1, wherein: The ground layer includes a flexible material.

8. The micro LED display according to claim 1, wherein: The at least one antistatic protection element is mounted on the signal layer by using a FOG method.

9. The micro LED display according to claim 1, wherein: The signal layer on which the at least one antistatic protection element is arranged has an isosceles trapezoidal shape.

10. The micro LED display according to claim 4, wherein: A portion of the ground layer on which the ground connection pad is disposed has an isosceles trapezoidal shape.

11. The micro LED display according to claim 1, wherein: The substrate includes a glass material.

12. The micro LED display according to claim 1, wherein: The second circuit is formed by a conductive material patterned on the second side of the substrate, or is a flexible circuit board connected to the second side.

13. The micro LED display according to claim 1, wherein: The first circuit includes a MUX / DEMUX circuit, the second circuit includes a driver IC, and the ground circuit board is disposed on an intermediate path between the MUX / DEMUX circuit and the driver IC.

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