Display device

Abstract

The present disclosure provides a display device comprising a substrate, an active element, a light-emitting element, a color conversion element, and a shading element. The active element includes a channel and is disposed on the substrate. The light-emitting element is driven by the active element to emit a first light beam. The first light beam emitted by the light-emitting element enters the color conversion element and is converted into a second light beam. The second light beam passes through the substrate, and the channel of the active element is protected from at least a substantial portion of the second light beam by the shading element.

Description

Technical Field

[0001] The present disclosure relates to a display device. Background Art

[0002] As display devices become increasingly ubiquitous, their performance becomes increasingly important. For example, consumers increasingly demand a wide color gamut. To address this, displays that utilize quantum dots to enhance color gamut have been developed. However, most self-luminous displays using quantum dots are top-emission, and no bottom-emission displays have been used. Summary of the Invention

[0003] One embodiment of the present disclosure provides a display device comprising a substrate, an active device, a light-emitting element, a color conversion element, and a shielding element. The active device includes a channel and is disposed on the substrate. The light-emitting element is driven by the active device to emit a first light beam. The first light beam emitted by the light-emitting element enters the color conversion element and is converted into a second light beam. The second light beam passes through the substrate, and the channel of the active device is protected from at least a substantial portion of the second light beam by the shielding element. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 FIG2 is a schematic cross-sectional view of a display device according to a first embodiment of the present disclosure.

[0005] Figures 2 to 5 Schematic cross-sectional views of the active element and the first light shielding layer according to different variations of the first embodiment of the present disclosure are shown.

[0006] Figure 6 FIG2 is a schematic cross-sectional view of a display device according to a second embodiment of the present disclosure.

[0007] Figure 7 FIG2 is a schematic cross-sectional view of a display device according to a third embodiment of the present disclosure.

[0008] Figure 8 FIG2 is a schematic cross-sectional view of a display device according to a fourth embodiment of the present disclosure.

[0009] Figure 9 FIG2 is a schematic cross-sectional view of a display device according to a fifth embodiment of the present disclosure.

[0010] Figure 10 FIG2 is a schematic cross-sectional view of a display device according to a sixth embodiment of the present disclosure.

[0011] Figure 11 FIG2 is a schematic cross-sectional view of a display device according to a seventh embodiment of the present disclosure.

[0012] Figure 12 and Figure 13 FIG. 1 is a schematic diagram showing a method for manufacturing a display device according to an eighth embodiment of the present disclosure.

[0013] Figure 14 and Figure 15 FIG. 1 is a schematic diagram of a method for manufacturing a display device according to a ninth embodiment of the present disclosure.

[0014] Figures 16 to 23 FIG. 1 is a schematic diagram showing a method for manufacturing a display device according to the tenth embodiment of the present disclosure.

[0015] Figures 24 to 26 FIG. 1 is a schematic diagram of a method for forming a color filter layer according to some embodiments of the present disclosure.

[0016] Figure 27 FIG. 1 is a schematic diagram showing a method of forming a fill layer and a protective layer on the first light-shielding layer and the color filter layer according to some embodiments of the present disclosure.

[0017] Figure 28 FIG. 4 is a schematic diagram of a method for forming a second light shielding layer according to some embodiments of the present disclosure.

[0018] Figures 29 to 31 FIG. 1 is a schematic diagram showing a method of forming a color conversion element and a filling element according to some embodiments of the present disclosure.

[0019] Figure 32 FIG. 1 is a schematic diagram showing a method of forming a fill layer and a protective layer on the second light-shielding layer and the color conversion element according to some embodiments of the present disclosure.

[0020] Figure 33 Schematic diagram of a method for forming a through-hole structure according to some embodiments of the present disclosure is shown.

[0021] Figure 34 Schematic diagrams of through-hole structures according to some embodiments of the present disclosure are shown.

[0022] Explanation of reference numerals: 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 - display device; 102 - substrate; 102S1 - lower surface; 102S2, 108S, 120S, 122S, S - upper surface; 104 - active element; 106 - light-emitting element; 106A - first electrode; 106B - light-emitting layer; 106C - second electrode; 106R - light-collecting structure; 108 - color conversion element; 108A - first color conversion element; 108A1 - first color conversion layer; 108B - second color conversion element 108B1 - second color conversion layer; 108P, 120P, 122P - protrusions; 110 - light shielding element; 110A - first light shielding layer; 110AP - flat portion; 110B - second light shielding layer; 110C - third light shielding layer; 112 - active element layer; 114 - first insulating layer; 116 - second insulating layer; 120 - color filter layer; 120A - first color filter layer; 120B - second color filter layer; 120C - third color filter layer; 122 - filling element; 1221 - filling element Filling layer; 118, 124, 128, 136, 540 - filling layer; 124R, 128R - recess; 126, 130 - protective layer; 130P - protrusion; 130R - recess; 132 - pixel definition layer; 134 - buffer layer; 138 - insulating layer; 138S - inclined surface; 82 - active substrate; 94A - first stack; 94B - second stack; 94C - third stack; 94R - groove; CH; CP - channel; center point of color conversion element; D1 - first direction; D2 - second direction; G-gate; L1-first light; L2, L2'-second light; M1-first metal layer; M2-second metal layer; OP1, OP2, OPP, OP3, OP11, OP12, OP13, OP21, OP22, OP23-openings; P1-upper part; P2-lower part; S1-spacing; SD1-source (drain); SD2-source (drain); TH, TH1, TH2-through hole; TS-through hole structure; TS1-first through hole structure; TS2-second through hole structure; VD-normal direction. DETAILED DESCRIPTION

[0023] The present disclosure is described in detail below with reference to specific embodiments and accompanying drawings. To make the present disclosure more clear and understandable, the following drawings may be simplified schematic diagrams, and the elements therein may not be drawn to scale. Furthermore, the numbers and sizes of the elements in the drawings are for illustration only and are not intended to limit the scope of the present disclosure.

[0024] Throughout this disclosure and the appended claims, certain terms are used to refer to specific components. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names, and this disclosure does not intend to distinguish between components that have the same function but different names. Throughout the following description and claims, the words "including" and "comprising" are open-ended and should be interpreted as meaning "including, but not limited to..."

[0025] The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only with reference to the directions of the accompanying drawings. Therefore, the directional terms used are used to illustrate and are not used to limit the present disclosure. It must be understood that the elements specifically described or illustrated can exist in various forms well known to those skilled in the art. In addition, when an element or film layer is referred to as being on another element or another film layer, or being referred to as being connected to another element or another film layer, it should be understood that the element or film layer is directly located on the other element or another film layer, or is directly connected to the other element or film layer, or there may be other elements or film layers between the two (indirectly). But on the contrary, when an element or film layer is referred to as being "directly" "on" another element or film layer or "directly connected to" another element or film layer, it should be understood that there is no intervening element or film layer between the two.

[0026] The use of ordinal numbers such as "first" and "second" in the specification and claims to modify claim elements does not in itself imply or represent any previous ordinal number of the claimed elements, nor does it represent the order of one claimed element relative to another claimed element, or the order in the manufacturing method. The use of such ordinal numbers is only used to clearly distinguish one claimed element with a certain name from another claimed element with the same name.

[0027] Here, the terms "about" and "approximately" generally mean within 15% of a given value or range, such as within 10%, within 5%, within 3%, within 2%, within 1%, or within 0.5%. The quantities given here are approximate quantities, that is, even if "about" or "approximately" is not specifically stated, the meaning of "about", "approximately" or "approximately" can still be implied.

[0028] It should be noted that the technical solutions provided in the following different embodiments can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present disclosure.

[0029] The display device disclosed herein may include a light-emitting device, a sensing device, a touch display, a curved display, or a free-shape display, but is not limited thereto. The display device may be a bendable or flexible display device. The display device may be, for example, a spliced ​​display device, but is not limited thereto. It should be noted that the display device may be any arrangement or combination of the aforementioned, but is not limited thereto. The display device can be applied to any electronic product or electronic device that requires a light source, light-emitting device, or display device, such as, but not limited to, televisions, tablet computers, laptop computers, mobile phones, cameras, wearable devices, electronic entertainment devices, etc.

[0030] Figure 1 The figure shows a cross-sectional view of a display device according to the first embodiment of the present disclosure. In order to clearly illustrate the main features of the present disclosure, the drawings herein show a cross-sectional view of a portion of the display device, but are not limited thereto. Figure 1 As shown, the display device 1 provided in this embodiment may include a substrate 102, an active device 104, a light-emitting device 106, a color conversion device 108, and a light shielding device 110, wherein the active device 104, the light-emitting device 106, the color conversion device 108, and the light shielding device 110 may be disposed on the substrate 102. The light-emitting device 106 may be driven by the active device 104 to emit a first light beam L1, so that the first light beam L1 emitted from the light-emitting device 106 may enter the color conversion device 108 and be converted into second light beams L2 and L2'. The second light beams L2 and L2' may pass through the substrate 102 and be emitted from a lower surface 102S1 of the substrate 102 relative to the light-emitting device 106. Therefore, the display device 1 may be, for example, a so-called bottom emission type display device. It should be noted that, since the second light L2 and L2′ generated by the color conversion element 108 after absorbing the first light L1 may not have directionality, that is, the traveling direction of the second light L2 and L2′ may be different from the traveling direction of the first light L1, in order to reduce or prevent the active element 104 from generating an electrical offset (e.g., a threshold voltage offset) or leakage due to the irradiation of the second light L2 and L2′, in the present disclosure, the channel CH of the active element 104 is the portion of the semiconductor layer corresponding to the gate (G) (e.g., Figure 1As shown, since the channel CH may experience an electrical shift (e.g., a shift in the threshold voltage) or leakage when the second light beams L2 and L2′ are irradiated on the channel CH, the channel CH may be protected by the shading element 110 so as to be shielded from at least a majority of the second light beams L2 and L2′. This allows the display device 1 to operate as expected. In one approach to shielding the channel CH from at least a majority of the second light beams L2 and L2′ by the shading element 110, a straight line may be drawn from the center point CP of the color conversion element 108 to any point on the channel CH of the active element 104 (the straight line represents any optical path of the second light beams L2 and L2′). As long as the straight line includes (or crosses) any portion of the shading element 110, the channel CH of the active element 104 may be shielded from at least a majority of the second light beams L2 and L2′ by the shading element 110. However, the present embodiment is not limited thereto.

[0031] The specific structure of the display device 1 provided in this embodiment will be described below. Figure 1 In the embodiment, the active element 104, the light-emitting element 106, the color conversion element 108, and the light-shielding element 110 may be disposed on the same side of the substrate 102, but the present invention is not limited thereto. The substrate 102 may include, for example, a flexible substrate or a non-flexible substrate. The material of the substrate 102 may include, for example, glass, ceramic, quartz, sapphire, acrylic, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyethersulfone (PES), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), polyarylate (PAR), other suitable materials, or combinations thereof, but the present invention is not limited thereto.

[0032] like Figure 1As shown, the active element 104 is disposed between the shading element 110 and the substrate 102, and the color conversion element 108 is located above the active element 104, so that at least a portion of the shading element 110 can be disposed between the color conversion element 108 and the channel CH of the active element 104. Therefore, the shading element 110 can block the second light L2, L2' generated by the color conversion element 108, thereby reducing or preventing the electrical properties of the active element 104 from being affected by the second light L2, L2'. For example, the projected edge of the shading element 110 projected along the normal direction VD onto a plane (e.g., the upper surface 102S2 of the substrate 102) and the projected edge of the channel CH projected along the normal direction VD onto the same plane (e.g., the upper surface 102S2 of the substrate 102), wherein the distance S1 between the two projected edges of the shading element 110 and the channel CH facing the same side ranges from 0.5 microns to 5 microns, wherein the distance S1 is the shortest distance between the two projected edges. Figure 1 In the embodiment, the interval S1 may be any interval in a direction parallel to the upper surface 102S2 of the substrate 102 , and the direction parallel to the upper surface 102S2 may be, for example, the first direction D1 or the second direction D2 .

[0033] In one embodiment, the display device 1 may include an active device layer 112 disposed between the light-shielding element 110 and the substrate 102, and between the color conversion element 106 and the substrate 102. The active device layer 112 is configured to control the on / off switching of the light-emitting element 106 and the brightness of the first light beam L1, thereby enabling the display device 1 to display an image. The active device layer 112 may include a plurality of active devices 104, each of which may be electrically connected to the light-emitting element 106 to drive the corresponding light-emitting element 106. The active device 104 may include a channel CH, and by adjusting the charge in the channel CH, the current or voltage flowing through the channel CH can be controlled, thereby controlling the on / off switching of the light-emitting element 106 and the brightness of the first light beam L1. Figure 1 The active element 104 in the embodiment may be, for example, a driving element, but is not limited thereto. Figure 1 In the embodiment, one active device 104 can be electrically connected to one light emitting device 106, but is not limited thereto. In some embodiments, one active device 104 can also be electrically connected to multiple light emitting devices 106 corresponding to the color conversion devices 108 that generate the second light L2, L2' of the same color.

[0034] In some embodiments, the structure of the active device layer 112 is not limited to Figure 1As shown, the active device layer 112 may further include multiple signal lines and multiple switching elements (not shown). The signal lines may include, for example, data lines, scan lines, and power lines, and the switching elements may be electrically connected to corresponding active elements 104 to control the charge in the channel. In some embodiments, the active device layer 112 may further include circuits for controlling the display device 1, such as, but not limited to, gate drive circuits. In some embodiments, the switching elements may also be disposed between the light shielding element 110 and the substrate 102 in the normal direction VD of the substrate 102 to reduce or prevent their electrical properties from being affected by the second light L2, L2'. In some embodiments, the active device layer 112 may include a 7T2C type pixel circuit (i.e., including seven thin-film transistors and two capacitors), a 7T3C type pixel circuit (i.e., including seven thin-film transistors and three capacitors), a 3T1C type pixel circuit (i.e., three thin-film transistors and one capacitor), a 3T2C type pixel circuit (i.e., three thin-film transistors and two capacitors), or other suitable types of pixel circuit architectures.

[0035] For example, the active device 104 and / or the switch device may be a thin film transistor, but is not limited thereto. Figure 1The active device 104 shown is a top-gate thin-film transistor (TFT). The active device layer 112 may include a channel CH, a first insulating layer 114, a first metal layer M1, a second insulating layer 116, and a second metal layer M2. The first insulating layer 114 may be disposed on the channel CH and serve as a gate insulating layer for the active device 104. The first metal layer M1 is disposed on the first insulating layer 114 and may, for example, form the gate G of the active device 104 and a scan line electrically connected to the gate G. The second insulating layer 116 is disposed on the first insulating layer 114 and the first metal layer M1. The second metal layer M2 is disposed on the second insulating layer 116 and may, for example, form the source (drain) SD1 and the drain (source) SD2 of the active device, as well as a data line electrically connected to the drain (source) SD2. The second insulating layer 116 may have a through-hole, allowing the source (drain) SD1 and the drain (source) SD2 to be electrically connected to the channel CH via the through-hole. In some embodiments, the transistor structure of the active device 104 is not limited thereto, and may be, for example, a bottom-gate transistor, or may be modified to a dual-gate transistor or other suitable transistor as required. Alternatively, the channel CH may include, for example, amorphous silicon, low-temperature polysilicon (LTPS), low-temperature polycrystalline oxide (LTPO), or a metal-oxide semiconductor, but is not limited thereto. The number of insulating layers in the display device 1 may vary depending on the type of thin-film transistor. In some embodiments, different thin-film transistors may include channels CH made of different materials, but is not limited thereto. In some embodiments, the channel CH may include, for example, a P-type doped or N-type doped semiconductor, but is not limited thereto. In some embodiments, the active device layer 112 may include a fill layer 118 disposed on the active device 104 so that the device formed on the active device layer 112 can be formed on a flat surface, thereby reducing defects in the formed device. In some embodiments, the lower surface 102S1 of the substrate 102 may further be provided with an optical film, such as a quarter-wave plate, an anti-reflection layer, or other suitable film layers.

[0036] exist Figure 1In an embodiment, the light-shielding element 110 may include a first light-shielding layer 110A and a second light-shielding layer 110B, and the first light-shielding layer 110A is disposed between the substrate 102 (or the active device layer 112) and the second light-shielding layer 110B. The first light-shielding layer 110A is disposed on the active device layer 112 and has a plurality of openings OP1, while the second light-shielding layer 110B may be disposed on the first light-shielding layer 110A and have a plurality of openings OP2. For example, in the normal direction VD, one opening OP2 may correspond to one opening OP1, and one light-emitting element 106 may correspond to one opening OP2, but is not limited thereto. In some embodiments, the number of light-emitting elements 106 corresponding to one opening OP2 may be adjusted based on the actual design. In one embodiment, the optical density (OD) of the first light-shielding layer 110A and / or the optical density of the second light-shielding layer 110B may be, for example, greater than 2.5 to achieve the function of shielding or blocking light from penetrating. For example, the material of the light-shielding element 110 and / or the first light-shielding layer 110A and / or the material of the second light-shielding layer 110B may include, but are not limited to, a light-absorbing material, a light-reflecting material, or other suitable materials. The light-absorbing material may include, for example, a light-shielding resin. For example, the light-absorbing material may include a black photoresist material with insulating properties, a black ink material, a photoresist material doped with carbon, titanium, a pigment, or a dye, an ink material doped with carbon, titanium, a pigment, or a dye, or other suitable materials. When the first light-shielding layer 110A uses a light-absorbing material, the thickness of the first light-shielding layer 110A in the normal direction VD may range from, for example, 1.2 micrometers (μm) to 2.5 μm, but is not limited to this. The reflective material may, for example, include metal or other suitable materials. When the first light-shielding layer 110A uses a reflective material, the thickness of the first light-shielding layer 110A may, for example, range from 900 angstroms to 1.2 microns, but is not limited thereto. In some embodiments, the thickness of the second light-shielding layer 110B may, for example, be greater than the thickness of the first light-shielding layer 110A. It should be noted that the "thickness" used herein refers to the maximum thickness of the element in the normal direction VD of the substrate 102. In some embodiments, the thickness of each element can be measured using an optical microscope (OM), a scanning electron microscope (SEM), a thin film thickness profiler (α-step), an ellipsometer, or other suitable methods. In detail, in some embodiments, a scanning electron microscope can be used to obtain an image of any cross-section of the structure and measure the thickness of each element in the image.

[0037] In some embodiments, the top-view shape of the first light-shielding layer 110A and / or the second light-shielding layer 110B along the normal direction VD may be, for example, a mesh, a line, a block, a dot, or other suitable shapes. In some embodiments, the cross-sectional shape of the first light-shielding layer 110A and the second light-shielding layer 110B may be, for example, a rectangle, a trapezoid, or other suitable shapes. The cross-sectional direction may be, for example, the first direction D1 or the second direction D2.

[0038] exist Figure 1 In the embodiment, the display device 1 may further include a plurality of color filter layers 120, each disposed in a corresponding opening OP1. The color filter layers 120 and the color conversion element 108 may be disposed on the same side of the substrate 102, and the color filter layers 120 may be disposed between the substrate 102 (or the active device layer 112) and the color conversion element 108 to enhance the color purity of the second light L2, L2' emitted from the substrate 102 or to enhance the color gamut of the display device 1. Specifically, the color filter layers 120 may include a first color filter layer 120A, a second color filter layer 120B, and a third color filter layer 120C, each disposed in a corresponding opening OP1. Furthermore, at least two of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may have different colors. For example, the colors of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may include red, green, yellow, magenta, cyan, blue, colorless, or white. When the colors of the first color filter layer 120A and the second color filter layer 120B are the same, the first color filter layer 120A and the second color filter layer 120B may be yellow, while the third color filter layer 120C may be colorless, white, or blue. Alternatively, when the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C are different colors, the first color filter layer 120A may be red or magenta, the second color filter layer 120B may be green or cyan, and the third color filter layer 120C may be blue, colorless, or white, but the present invention is not limited thereto. For example, the color filter layer 120 may include a photoresist material or an ink material, but is not limited thereto. The "photoresist material" herein refers to a material having a photoresist type or property.

[0039] exist Figure 1In this embodiment, the color conversion element 108 is disposed between the substrate 102 (or active device layer 112) and the light-emitting device 106. At least a first light-shielding layer 110A is disposed between the color conversion element 108 and the channel CH of the active device 104. This allows the second light beams L2 and L2' generated by the color conversion element 108 to be shielded by at least the first light-shielding layer 110A. In the normal direction VD, the color conversion element 108 corresponds to the light-emitting device 106, allowing the first light beam L1 generated by the light-emitting device 106 to enter the corresponding color conversion element 108. After absorbing a portion of the first light beam L1, the color conversion element 108 generates the second light beams L2 and L2'. Therefore, the second light beams L2 and L2' may have longer peak wavelengths than the first light beam L1. For example, the first light beam L1 may be blue light, and the second light beams L2 and L2' may be red or green light, but this is not limited to these. The color conversion element 108 may include, for example, phosphor materials, fluorescent materials, quantum dots, color filter materials, or other color conversion materials capable of converting light colors. These color conversion materials may be arranged and combined in any manner, and are not limited thereto. In some embodiments, because the thickness of the second light-shielding layer 110B is greater than the thickness of the first light-shielding layer 110A, the thickness of the color conversion element 108 disposed in the opening OP2 in the normal direction VD may be greater than the thickness of the color filter layer 120 disposed in the opening OP1. This may improve the transmission path of the first light L1 in the color conversion element 108, thereby improving the color conversion efficiency of the color conversion element 108. Figure 1 In some embodiments, one color conversion element 108 may correspond to one light emitting element 106 , but the present invention is not limited thereto. In some embodiments, one color conversion element 108 may correspond to multiple light emitting elements 106 .

[0040] like Figure 1As shown, the display device 1 may include a plurality of color conversion elements 108, with each color conversion element 108 disposed in a corresponding opening OP2. The second light-shielding layer 110B of the light-shielding element 110 may be disposed between two adjacent color conversion elements 108 to block the mixing of second light beams L2 and L2' of different colors. For example, the color conversion elements 108 may include a first color conversion element 108A and a second color conversion element 108B, with the color of the second light beam L2 generated by the first color conversion element 108A being different from the color of the second light beam L2' generated by the second color conversion element 108B. In one embodiment, the display device 1 may further include a filling element 122 disposed in the opening OP2 not corresponding to the color conversion element 108. For example, the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 may each be disposed in a corresponding opening OP2. Since the filling element 122 is colorless and transparent, the first light L1 generated by the light emitting element 106 can pass through the filling element 122 without changing its color, so that the first light L1 can be used as the light of the pixel or sub-pixel, and the first light L1 and the second light L2 and L2' of different colors can be mixed to produce white light. For example, the first light L1 can be blue light, the first color conversion element 108A can generate red light, and the second color conversion element 108B can generate green light, but the present invention is not limited thereto. Figure 1 In the embodiment of the present invention, the first color conversion element 108A and the second color conversion element 108B can each be a single color conversion layer, but are not limited thereto. In some embodiments, the first color conversion element 108A and / or the second color conversion element 108B can include multiple color conversion layers, such as Figure 13 As shown. Figure 1 In some embodiments, the filling element 122 may be a single-layer filling layer, and the filling layer may include a transparent resin or other suitable materials, but is not limited thereto. In some embodiments, the filling element 122 may also include multiple filling layers. In some embodiments, the filling layer may include the same material or have the same color as the third color filter layer 120C. In some embodiments, the filling element 122 may also include scattering particles (not shown) to uniformize the first light L1 emitted from the opening OP2 toward the substrate 102. The materials of the scattering particles include, for example, titanium dioxide (TiO2), zinc oxide (ZnO X ) or structural particles with scattering properties, but not limited thereto.

[0041] In some embodiments, as Figure 1As shown, the display device 1 may further include a filler layer 124, which is disposed between the first light-shielding layer 110A and the second light-shielding layer 110B and between the color filter layer 120 and the color conversion element 108, and has a flat upper surface. It should be noted that the upper surface of the color filter layer 120 and the upper surface of the first light-shielding layer 110A are not located on the same plane but have a height difference. Therefore, when the second light-shielding layer and the color conversion element are directly manufactured on an uneven surface, the second light-shielding layer 110B is prone to light leakage, and light generated by different color conversion elements 108 is prone to light mixing. Figure 1 In the embodiment, by providing the filler layer 124, the second light shielding layer 110B and the color conversion element 108 can be provided on a flat upper surface, thereby alleviating or avoiding the manufacturing defects of the second light shielding layer 110B and the color conversion element 108, thereby improving the problems of light leakage and light mixing. The filler layer 124 can include, for example, a transparent resin or other suitable material. In some embodiments, such as Figure 1 As shown, the display device 1 may further include a protective layer 126 disposed between the leveling layer 124 and the second light-shielding layer 110B or / and between the leveling layer 124 and the color conversion element 108. In this case, the protective layer 126 may be uniformly formed on the leveling layer 124, so that its upper surface is also flat. The protective layer 126 may include an inorganic material layer, or a stack of organic and inorganic material layers. For example, the inorganic material layer may include, but is not limited to, silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or other suitable protective materials, or any combination of the foregoing inorganic materials. The organic material layer may include, but is not limited to, resin. In some embodiments, the protective layer may also be a single inorganic material layer or a stack of multiple inorganic material layers. In some embodiments, the protective layer 126 may also be disposed between the first light-shielding layer 110A and the leveling layer 124, and between the color filter layer 120 and the leveling layer 124.

[0042] In some embodiments, as Figure 1 As shown, the display device 1 may further include another leveling layer 128 disposed on the second light-shielding layer 110B and the color conversion element 108, and the light-emitting element 106 is disposed on the leveling layer 128. The leveling layer 128 may, for example, be comprised of the same material as the leveling layer 124, but is not limited thereto. In some embodiments, the display device 1 may further include another protective layer 130 disposed between the leveling layer 128 and the light-emitting element 106. The protective layer 130 or the leveling layer 128 may also protect the color conversion element 108 or the filling element 122 from moisture and oxygen. In some embodiments, the stacking order of the protective layer 130 and the leveling layer 128 may be reversed. The protective layer 130 may, for example, be comprised of the same material as the protective layer 126, but is not limited thereto.

[0043] like Figure 1As shown, the light-emitting element 106 can be disposed on the protective layer 130 (or the fill layer 128). The light-emitting element 106 can include, for example, an inorganic light-emitting diode (LED), an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro LED, a quantum dot LED (including QLED, QDLED), a nanowire LED, or a bar-type LED. In some embodiments, the light-emitting element 106 can also include fluorescence, phosphorescence, or other suitable materials, or combinations thereof, but is not limited thereto. Figure 1 The light emitting element 106 is an organic light emitting diode, but is not limited thereto. The light emitting element 106 may include a first electrode 106A, a light emitting layer 106B, and a second electrode 106C. The light emitting layer 106B is disposed between the first electrode 106A and the second electrode 106C to generate the first light L1. Figure 1 In an embodiment, the first electrode 106A is disposed on the protective layer 130, and the display device 1 may further include a pixel definition layer 132, disposed on the protective layer 130 and the first electrode 106A, and the pixel definition layer 132 may include a plurality of openings OPP corresponding to a plurality of light-emitting areas. The pixel definition layer 132 may, for example, include an organic material, but is not limited thereto. In one embodiment, the light-emitting layer 106B of different light-emitting elements 106 may be a continuous light-emitting layer, extending from the upper surface of the pixel definition layer 132 through the sidewall to the different first electrodes 106A exposed by different openings OPP, and the second electrodes 106C of different light-emitting elements 106 may be a continuous electrode, disposed on the light-emitting layer 106B. In some embodiments, the light-emitting layer 106B and the second electrode 106C disposed on the plurality of first electrodes 106A may also include discontinuous blocks, respectively corresponding to the plurality of first electrodes 106A, but is not limited thereto. In Figure 1In certain embodiments, the protective layer 130, the leveling layer 128, the second light-shielding layer 110B, the protective layer 126, the leveling layer 124, the first light-shielding layer 110A, and the leveling layer 118 may have a plurality of through-holes TH, each of which may include a through-hole structure TS. This allows the first electrode 106A of the light-emitting element 106 to be electrically connected to the corresponding active element 104 via the through-hole structure TS in the through-hole TH. The through-hole structure TS may include a conductive material, which may be, for example, the same material as the first electrode 106A, but is not limited thereto. In some embodiments, a plurality of light-emitting elements 106 may also be disposed in at least one opening OPP. In some embodiments, the second electrode 106C may be electrically connected to a driving circuit, but is not limited thereto.

[0044] In some embodiments, the light-emitting element 106 may include a single or multiple light-emitting layer 106B, but is not limited thereto. In some embodiments, the light-emitting element 106 may also include a hole transport layer, a hole injection layer, an electron transport layer, an electron injection layer, and a charge generation layer, which are disposed between the first electrode 106A and the second electrode 106C, but is not limited thereto. When the first electrode 106A is an anode and the second electrode 106C is a cathode, the hole transport layer and the hole injection layer may be disposed between the first electrode 106A and the light-emitting layer 106B, and the electron transport layer and the electron injection layer may be disposed between the second electrode 106C and the light-emitting layer 106B. When the light-emitting element 106 includes multiple light-emitting layers 106B, the charge generation layer may be disposed between the two light-emitting layers 106B, but is not limited thereto. In some embodiments, the first electrode 106A and the second electrode 106C may also be a cathode and an anode, respectively, but are not limited thereto.

[0045] The first electrode 106A may include a transparent or semi-transparent conductive material, such as silver (Ag), aluminum (Al), ytterbium (Yb), titanium (Ti), magnesium (Mg), nickel (Ni), lithium (Li), calcium (Ca), copper (Cu), lithium fluoride / gallium (LiF / Ga), lithium fluoride / aluminum (LiF / Al), magnesium silver (MgAg), calcium silver (CaAg), nanosilver paste, or other suitable conductive materials, or any combination thereof. Since the first electrode 106A has a thickness of, for example, several nanometers to tens of nanometers, it allows light to pass through. The second electrode 106C may include a light-reflecting conductive material, such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), iron (Fe), or other suitable metals, or any combination thereof.

[0046] In some embodiments, as Figure 1As shown, the display device 1 may optionally include a buffer layer 134 disposed between the substrate 102 and the active device layer 112. The buffer layer 134 may be used, for example, to prevent moisture, oxygen, or ions from entering the display device 1. The buffer layer 134 may be a single layer or multiple layers. The material of the buffer layer 134 may include, but is not limited to, silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, resin, other suitable materials, or combinations thereof.

[0047] The display device is not limited to the above-described embodiment and may have different embodiments or variations. To simplify the description, the different embodiments and variations below will use the same reference numerals as the first embodiment to designate the same elements. To facilitate comparison between the first embodiment and the different embodiments and variations, the differences between the different embodiments and variations will be highlighted below, and repeated descriptions will not be repeated.

[0048] Figures 2 to 5 The figure shows a cross-sectional view of the active element and the first light shielding layer of different variations of the first embodiment of the present disclosure. In one variation, as shown in FIG. Figure 2 As shown, the upper surface of the first light shielding layer 110A in the cross-sectional direction may be, for example, arc-shaped, so that light incident obliquely into the first light shielding layer 110A may encounter the first light shielding layer 110A having a certain thickness. Therefore, compared with the first light shielding layer 110A having a rectangular cross-sectional shape, the first light shielding layer 110A having an arc-shaped upper surface may block more obliquely incident light. In the above-described variant embodiment, the active device layer 112 and / or other devices may be connected to the first light shielding layer 110A. Figure 1 Similar or identical, so no further details will be given here, but the present invention is not limited to this.

[0049] In another variation, Figure 3 As shown, the first light shielding layer 110A may also cover the active element 104 and be disposed in the active element layer 112, so as to block the second light entering the active element layer 112 from irradiating the active element 104. In this case, the first light shielding layer 110A may include an insulating light-absorbing material, such as a black photoresist material or ink material, but is not limited thereto. In addition, the active element layer 112 may include a filling layer 136, which is disposed on the first light shielding layer 110A and the substrate 102. In some embodiments, when the first light shielding layer 110A covers the active element 104, the display device 1 may further include another light shielding layer (not shown) disposed on the active element layer 112. The other light shielding layer or light shielding element may include a reflective material, such as metal materials such as molybdenum (Mo), aluminum (Al), chromium (Cr), etc., but is not limited thereto. In the variant embodiment, the active element layer 112 and / or other elements may be Figure 1 Similar or identical, so no further details will be given here, but the present invention is not limited to this.

[0050] In another embodiment, Figure 4 As shown, the first light shielding layer 110A may include a reflective metal material, such as molybdenum (Mo), aluminum (Al), chromium (Cr) and other metals, but not limited thereto. In this case, the first light shielding layer 110A may surround the active element 104 and be separated from the active element 104. For example, an insulating layer 138 is provided between the first light shielding layer 110A and the active element 104. For example, the first light shielding layer 110A may have a cross-sectional shape of an arc, but not limited thereto. In the variant embodiment, the active element layer 112 and / or other elements may be Figure 1 Similar or identical, so no further details will be given here, but the present invention is not limited to this.

[0051] In yet another embodiment, Figure 5 As shown, Figure 4 Differently, the insulating layer 138 may have two flat inclined surfaces 138S, and the first light shielding layer 110A may include at least two inclined flat portions 110AP, which are respectively disposed on the inclined surfaces 138S to shield the light entering the active device 104. The angle between each flat portion 110AP and the upper surface 102S2 of the substrate 102 may be an acute angle, and the flat portions 110AP may be connected to each other to form a triangular shape with the upper surface 102S2 of the substrate 102, but is not limited thereto. When the first light shielding layer 110A includes a metal material, the first light shielding layer 110A may have a better bond with the flat surface than when formed on a curved surface. Therefore, by forming the first light shielding layer 110A on the flat inclined surface 138S, the bond between the first light shielding layer 110A and the insulating layer 138 may be improved. In the variant embodiment, the active device layer 112 and / or other components may be connected to the Figure 1 Similar or identical, so no further details will be given here, but the present invention is not limited to this.

[0052] Figure 6 FIG2 is a cross-sectional view of a display device according to a second embodiment of the present disclosure. Figure 6 As shown, the first light shielding layer 110A and the second light shielding layer 110B of this embodiment can be in direct contact, that is, the second light shielding layer 110B can be directly formed on the first light shielding layer 110A. Figure 6In the embodiment shown, the thickness of the color filter layer 120 may be less than the thickness of the first light-shielding layer 110A, so the color filter layer 120 has not yet filled the opening OP1 of the first light-shielding layer 110A, and the remaining space may be provided with a filling layer 124 and a protective layer 126. Moreover, the upper surface of the uppermost protective layer 126 in the opening OP1 may be substantially flush with the upper surface of the first light-shielding layer 110A, so that the upper surface of the protective layer 126 and the upper surface of the first light-shielding layer 110A present a substantially flat surface, thereby helping to improve the quality or structural stability of the second light-shielding layer 110B coated on the first light-shielding layer 110A. In addition, by forming the second light-shielding layer 110B directly on the first light-shielding layer 110A, the second light L2, L2' generated from the color conversion element 108 or the first light L2 passing through the filling element 122 can be blocked from passing through the filling layer 124 and the protective layer 126 to another adjacent sub-pixel, thereby reducing the color mixing of adjacent sub-pixels. Figure 6 In the embodiment, since the filling layer 124 and the protective layer 126 are not arranged between the first light shielding layer 110A and the second light shielding layer 110B, the through hole TH can be arranged in the protective layer 130, the filling layer 128, the second light shielding layer 110B, the first light shielding layer 110A and the filling layer 118, but is not limited thereto.

[0053] In some embodiments, the number of light shielding layers of the light shielding element 110 is not limited to two layers, and may be three or more layers. In some embodiments, the stacking order of the leveling layer 124 and the protective layer 126 may also be interchanged, that is, the protective layer 126 may be located between the leveling layer 124 and the color filter layer 120. In this case, the upper surface of the leveling layer 124 may be substantially flush with the upper surface of the first light shielding layer 110A. In some embodiments, Figure 6 The display device 2 shown can also be used Figure 1 Any structure or feature of the display device 1 or Figures 2 to 5 The first light shielding layer 110A of any of the variations shown.

[0054] Figure 7 FIG2 is a cross-sectional view of a display device according to a third embodiment of the present disclosure. Figure 7As shown, the display device 3 provided in this embodiment may not include a color filter layer. Therefore, a leveling layer 124 may be provided in the opening OP1. The leveling layer 124 may, for example, comprise a colorless, transparent photoresist material, but is not limited thereto. In some embodiments, the opening OP1 may also be filled with a protective layer 126. In this case, the color conversion element 108 may optionally include a color filter pigment. Due to the scattering effect of color filter pigments, the addition of color filter pigments can improve the color conversion efficiency of the color conversion element 108. In some embodiments, the material of the color conversion element 108 may be quantum dots with high color conversion efficiency to reduce the first light L1 from being emitted from below the color conversion element 108. In some embodiments, the leveling layer 124 may comprise a Bragg multilayer film (distributed Bragg reflector, DBR). Because the material of the Bragg multilayer film may shrink less with temperature than the color filter layer, the leveling layer 124 in this case can form a relatively flat surface with the first light shielding layer 110A, thereby improving the quality or structural stability of the second light shielding layer 110B coated on the first light shielding layer 110A. In some embodiments, Figure 7 Other components of the display device 3 shown may also be Figure 1 or Figure 6 The structure or feature of the display device or Figures 2 to 5 The first light shielding layer 110A of any of the variations shown.

[0055] Figure 8 FIG2 is a cross-sectional view of a display device according to a fourth embodiment of the present disclosure. Figure 8 As shown, the display device 4 of this embodiment may not include Figure 1 The color filter layer 120, the first light shielding layer 110A, the filler layer 124 and the protective layer 126 are included in the embodiment of the present invention. One method of not including the color filter layer 120 is to mix the color filter pigment into the color conversion element 108. In other words, the light shielding element 110 can be formed by the second light shielding layer 110B. Figure 8 In the embodiment, since the color conversion element 108 or the filling element 122 and the second light shielding layer 110B are disposed on the same plane, in order to reduce or prevent the second light L2, L2′ generated by the color conversion element 108 or the first light L1 passing through the filling element 122 from irradiating the active element 104, the width of the second light shielding layer 110B between adjacent color conversion elements 108 or between the color conversion element 108 and the filling element 122 in the direction parallel to the upper surface 102S2 of the substrate 102 is relatively large. Figure 1The width of the first light-shielding layer 110A in the same direction is wide. For example, the projection edge of the second light-shielding layer 110B projected onto the upper surface 102S2 of the substrate 102 along the normal direction VD and the projection edge of the channel CH projected onto the upper surface 102S2 of the substrate 102 along the normal direction VD, wherein the spacing S1 between the two projection edges of the second light-shielding layer 110B and the channel CH facing the same side ranges from 5.5 microns to 10 microns, and the spacing S1 may be the shortest distance between the two projection edges. In some embodiments, increasing the spacing S1 may simultaneously increase the width of the upper surface and the width of the lower surface of the second light-shielding layer 110B, wherein the increase in the width of the upper surface may be less than or equal to the increase in the width of the lower surface. In some embodiments, increasing the spacing S1 may also increase the width of the lower surface without changing the width of the upper surface of the second light-shielding layer 110B. Figure 8 In the embodiment of the present invention, since the display device 4 may not include Figure 1 The first light shielding layer 110A, the filling layer 124 and the protective layer 126 are formed in the protective layer 130, the filling layer 128, the second light shielding layer 110B and the filling layer 118, but the present invention is not limited thereto. In some embodiments, Figure 8 Other components of the display device 4 shown may also be Figure 1 Display device structure or features or Figures 2 to 5 The first light shielding layer 110A of any of the variations shown.

[0056] Figure 9 FIG2 is a cross-sectional view of a display device according to a fifth embodiment of the present disclosure. Figure 9 As shown, the color filter layer 120 and the color conversion element 108 in the display device 5 of this embodiment are respectively disposed on opposite sides of the substrate 102, that is, respectively disposed on the upper surface 102S2 and the lower surface 102S1 of the substrate 102. Figure 9 In the embodiment, the first light shielding layer 110A may be first formed on the lower surface 102S1 of the substrate 102, and then the color filter layer 120 may be formed in the opening OP1 of the first light shielding layer 110A. Since the flatness of the substrate 102 is better than the flatness of the fill layer (such as the fill layer 118), disposing the first light shielding layer 110A and the color filter layer 120 on the lower surface 102S1 of the substrate 102 may help to improve the formation quality or structural stability of the first light shielding layer 110A, and the first light shielding layer 110A has a light shielding effect, so that the light passing through the upper surface 102S2 of the substrate will not be reflected back to the channel CH. In some embodiments, a fill layer 540 may be provided under the first light shielding layer 110A and the color filter layer 120. In some embodiments, such as Figure 9 As shown, the second light shielding layer 110B can be formed directly on the active device 104, so that the active device layer 112 does not include Figure 1In this case, the through hole TH can be set in the protective layer 130, the filling layer 128 and the second light shielding layer 110B, but is not limited thereto. In some embodiments, the active device layer 112 can also include a filling layer set between the active device 104 and the second light shielding layer 110B to help form the second light shielding layer 110B. In some embodiments, Figure 9 Other components of the display device 5 shown may also be Figure 1 Display device structure or features or Figures 2 to 5 The first light shielding layer 110A of any of the variations shown.

[0057] Figure 10 FIG2 is a cross-sectional view of a display device according to a sixth embodiment of the present disclosure. Figure 10 As shown, the light emitting element 106 in the display device 6 of this embodiment may have a light collecting structure 106R for collecting the generated first light L1 and emitting it toward the color conversion element 108 or the filling element 122. For example, the light collecting structure 106R may be n-shaped (or inverted U-shaped) and have a notch facing the substrate 102 (or the color conversion element 108). Figure 10In this embodiment, the thickness of the color conversion element 108 and the thickness of the filling element 122 can be greater than the thickness of the second light-shielding layer 110B, so that the upper surface of the color conversion element 108 can be higher than the upper surface of the second light-shielding layer 110B. The display device 6 of this embodiment can be devoid of a pixel definition layer. Therefore, the first electrode 106A, the light-emitting layer 106B, and the second electrode 106C disposed on the color conversion element 108 and the second light-shielding layer 110B can extend along the contours formed by the upper surfaces of the color conversion element 108 and the second light-shielding layer 110B. Specifically, the display device 6 can further include a protective layer 130 disposed between the first electrode 106A and the color conversion element 108 (or the filling element 122). Because the protective layer 130 is uniformly (or conformally) formed on the second light-shielding layer 110B, the color conversion element 108, and the filling element 122, the upper surface of the protective layer 130 can still have a contoured topography. For example, the protective layer 130 may have a plurality of recessed portions 130R and a plurality of protruding portions 130P, which are alternately connected in sequence, and the recessed portions 130R are disposed on the second light-shielding layer 110B, while the protruding portions 130P are disposed on the color conversion element 108 and the filling element 122, respectively. Therefore, the first electrode 106A, the light-emitting layer 106B, and the second electrode 106C of the light-emitting element 106 disposed on the protruding portions 130P may have grooves with the notches facing downwards, which are used to serve as the light-collecting structure 106R. It should be noted that since the thickness of the color conversion element 108 can be increased to be greater than the thickness of the second light-shielding layer 110B, the color conversion efficiency of the color conversion element 108 can be improved. In addition, since the area where the light-emitting layer 106B of the light-emitting element 106 contacts both the first electrode 106A and the second electrode 106C can extend along the contour of the ups and downs, the light-emitting area of ​​the light-emitting element 106 can be increased to improve the light-emitting brightness of the light-emitting element 106. In some embodiments, Figure 10 Other components of the display device 6 shown may also be Figure 1 Display device structure or features or Figures 2 to 5 The first light shielding layer 110A of any of the variations shown.

[0058] Figure 11 FIG2 is a cross-sectional view of a display device according to the seventh embodiment of the present disclosure. Figure 11As shown, the thickness of the first light-shielding layer 110A in the display device 7 of this embodiment can be greater than the combined thickness of the color conversion element 108 and the color filter layer 120. For example, the color filter layer 120 and the color conversion element 108 can include an ink material that is injected into the opening OP1 of the first light-shielding layer 110A. In some embodiments, because the solvent of the color filter layer 120 and the solvent of the color conversion element 108 (or the filling element 122) can be different, a protective layer 126 can be disposed between the color filter layer 120 and the color conversion element 108 (or the filling element 122) to prevent mutual interference between the color filter layer 120 and the color conversion element 108 (or the filling element 122). In some embodiments, a leveling layer 124 can also be disposed between the color filter layer 120 and the color conversion element 108 (or the filling element 122). Because the color filter layer 120 is prone to shrinkage during the formation process, resulting in an uneven top surface, the provision of a leveling layer 124 facilitates the formation of the color conversion element 108 (or filling element 122). For example, the leveling layer 124 can be disposed between the color filter layer 120 and the protective layer 126, or between the protective layer 126 and the color conversion element 108 (or filling element 122). The leveling layer 124 or the protective layer 126 can also protect the color filter layer 120 from moisture and oxygen.

[0059] In some embodiments, a filling layer 128 and a protective layer 130 may be further disposed on the color conversion element 108 (or the filling element 122) in the opening OP1, but the present invention is not limited thereto. Figure 11 In the embodiment of the present invention, the first electrode 106A may be disposed on the protective layer 130 in the opening OP1, such that the upper surface of the first electrode 106A is substantially flush with the upper surface of the first light shielding layer 110A, to facilitate the formation of the pixel definition layer 132 on the first light shielding layer 110A and the first electrode 106A, but the present invention is not limited thereto. In some embodiments, a protective layer 130 or a filling layer 128 may also be disposed in the opening OP1, such that the upper surface of the protective layer 130 or the filling layer 128 is substantially flush with the upper surface of the first light shielding layer 110A, to facilitate the formation of the first electrode 106A and the pixel definition layer 132. In some embodiments, Figure 11 Other components of the display device 7 shown may also be Figure 1 Display device structure or features or Figures 2 to 5 The first light shielding layer 110A of any of the variations shown.

[0060] Figure 12 and Figure 13 FIG2 is a schematic diagram of a method for manufacturing a display device according to an eighth embodiment of the present disclosure, wherein Figure 13 FIG2 is a cross-sectional view of a display device according to an eighth embodiment of the present disclosure. Figure 13As shown in FIG. 8 , the thickness of the first light shielding layer 110A in the display device 8 of this embodiment is smaller than the thickness of the color filter layer 120. Figure 13 In the embodiment of the present invention, the number of light-shielding layers of the light-shielding element 110 may be different from the total number of color filter layers 120 and color conversion layers of the color conversion element 108. For example, the number of light-shielding layers of the light-shielding element 110 may be greater than the number of color conversion layers of the color conversion element 108. For example, the light-shielding element 110 may be formed of four light-shielding layers, and the color conversion element 108 may be formed of two color conversion layers, but the present invention is not limited thereto. Figure 13 In the embodiment of the present invention, the display device 8 may include a first light-shielding layer 110A, a color filter layer 120, and a color conversion element 108 (or a filling element 122). The color filter layer 120 may be in direct contact with the color conversion element 108 (or the filling element 122), but is not limited thereto. In some embodiments, a protective layer (e.g., a protective layer) may be disposed between the color filter layer 120 and the color conversion element 108. Figure 6 The protective layer 126 shown) and / or the filling layer (such as Figure 6 In some embodiments, the fill layer 124 is provided, but is not limited thereto. Figure 13 Other components of the display device 8 shown may also be Figure 1 or Figure 6 Display device structure or features or Figures 2 to 5 The first light shielding layer 110A of any of the variations shown.

[0061] The following will further describe Figure 13 The manufacturing method of the display device 8 shown in FIG. Figure 12 As shown, an active substrate 82 is first provided. The active substrate 82 may include a substrate 102 and an active device layer 112 including an active device 104. In some embodiments, the active substrate 82 may further include a buffer layer 134 disposed between the substrate 102 and the active device layer 112, but is not limited thereto. Since the substrate 102, the active device 104, the active device layer 112, and the buffer layer 134 may be similar or identical to Figure 1 The embodiment shown or its variant embodiments are not described in detail here. Figure 12In an embodiment, the method for forming the active substrate 82 may include, for example, first forming a buffer layer 134 on the substrate 102, then sequentially forming a channel CH on the buffer layer 134, forming a first insulating layer 114 on the channel CH, forming a first metal layer M1 including a gate G and a scan line on the first insulating layer 114, forming a second insulating layer 116 on the first metal layer M1 and the first insulating layer 114, forming a through hole in the second insulating layer 116 and the first insulating layer 114, forming a second metal layer M2 including a source (drain) electrode SD1, a drain (source) electrode SD2, and a data line on the second insulating layer 116, and forming a fill layer 118 on the second metal layer M2 and the second insulating layer 116. In one embodiment, the source (drain) electrode SD1 and the drain (source) electrode SD2 may be disposed in the through hole to electrically connect to the channel CH, or a conductive material may be disposed in the through hole to electrically connect the source (drain) electrode SD1 and the drain (source) electrode SD2 to the channel CH. In some embodiments, the method of forming the active substrate 82 may be adjusted accordingly with different types of active devices 104 or different device or circuit structures in the active substrate 82 .

[0062] Then, if Figure 12 As shown, a first light shielding layer 110A is formed on the active substrate 82, wherein the first light shielding layer 110A has a plurality of openings OP1 to expose the active substrate 82. Then, a first color filter layer 120A, a second color filter layer 120B, and a third color filter layer 120C are formed on the active substrate 82 in the openings OP1. Figure 12 In the embodiment, the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may partially extend onto the first light-shielding layer 110A, and each have a thickness greater than that of the first light-shielding layer 110A.

[0063] In one embodiment, the colors of at least two of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may be different. Figure 1The embodiments of the present invention are not described in detail here. As the colors of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C vary, the methods for forming the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may also vary. For example, when the colors of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C are all different, the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may be formed separately in the corresponding openings OP1. The order of forming the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C is not limited and may be any order of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C. In this case, the first color filter layer 120A can be, for example, red or magenta, the second color filter layer 120B can be, for example, green or cyan, and the third color filter layer 120C can be, for example, blue, colorless, or white, but is not limited thereto. When the color of the first color filter layer 120A and the second color filter layer 120B are the same, the first color filter layer 120A and the second color filter layer 120B can be formed simultaneously in the corresponding opening OP1. Furthermore, the order of forming the first color filter layer 120A and the second color filter layer 120B and the third color filter layer 120C is not limited. For example, the first color filter layer 120A and the second color filter layer 120B can be formed before or after the third color filter layer 120C. In this case, the first color filter layer 120A and the second color filter layer 120B can be, for example, yellow, and the third color filter layer 120C can be, for example, colorless, white, or blue. In some embodiments, the material of the color filter layer 120 may include, for example, a photoresist material or an ink material, but is not limited thereto.

[0064] Then, if Figure 13 As shown in FIG, a second light shielding layer 110B is formed on the first light shielding layer 110A. Figure 13 In the embodiment, the second light-shielding layer 110B may extend onto the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C, such that the upper surface of the second light-shielding layer 110B is higher than the upper surfaces of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C, but the present invention is not limited thereto. The second light-shielding layer 110B may have a plurality of openings OP2, each exposing the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C.

[0065] Next, a first color conversion layer 108A1, a second color conversion layer 108B1, and a filling layer 1221 are formed in the opening OP2. In the normal direction VD of the upper surface 102S2 of the substrate 102, the first color conversion layer 108A1 may overlap with the first color filter layer 120A, the second color conversion layer 108B1 may overlap with the second color filter layer 120B, and the filling layer 1221 may overlap with the third color filter layer 120C. Because the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221 all comprise different materials, they can be formed separately in the corresponding opening OP2. The order in which the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221 are formed is not limited and can be any arrangement of the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221. In some embodiments, the first color conversion layer 108A1 and the second color conversion layer 108B1 may comprise quantum dots of different particle sizes to generate second light of different colors. In some embodiments, the filling layer 1221 may have the same color or material as the third color filter layer 120C, such as, but not limited to, a colorless, blue, or white photoresist material.

[0066] Then, a third light shielding layer 110C is formed on the second light shielding layer 110B. Figure 13 In the embodiment, the structure of the third light shielding layer 110C may be similar to that of the second light shielding layer 110B, that is, the third light shielding layer 110C may extend onto the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221, and the third light shielding layer 110C may have a plurality of openings OP3 to expose the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221. Figure 13 In the embodiment, after forming the third light-shielding layer 110C, the steps of forming the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221 and the step of forming the third light-shielding layer 110C may be repeated to form another first color conversion layer 108A1, another second color conversion layer 108B1, and another filling layer 1221 in the opening OP3 of the third light-shielding layer 110C, and another third light-shielding layer 110C is formed on the third light-shielding layer 110C, thereby forming the first color conversion element 108A, the second color conversion element 108B, the filling element 122, and the light-shielding element 110. Figure 13In the embodiment, the thickness of the light shielding element 110 in the normal direction VD perpendicular to the upper surface 102S2 of the substrate 102 is greater than the sum of the thicknesses of the color filter layer 120 and the color conversion element 108 in the normal direction VD, but the present invention is not limited thereto.

[0067] The number of times the steps of forming the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221, and the step of forming the third light-shielding layer 110C are repeated may depend on the number of first color conversion layers 108A1, the number of second color conversion layers 108B1, and the number of filling layers 1221. For example, when the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 respectively comprise a single first color conversion layer 108A1, a single second color conversion layer 108B1, and a single filling layer 1221, the steps of forming the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221, and the step of forming the third light-shielding layer 110C do not need to be repeated. Similarly, when the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 respectively include at least three first color conversion layers 108A1, at least three second color conversion layers 108B1, and at least three filling layers 1221, the steps of forming the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221, and the step of forming the third light-shielding layer 110C may be repeated at least twice.

[0068] Then, if Figure 13 As shown, after forming the first color conversion element 108A, the second color conversion element 108B, the filling element 122, and the light shielding element 110, a leveling layer 128 and a protective layer 130 are sequentially formed on the first color conversion element 108A, the second color conversion element 108B, the filling element 122, and the light shielding element 110. In some embodiments, the order of the leveling layer 128 and the protective layer 130 can be reversed, or one of the leveling layer 128 and the protective layer 130 can be formed on the first color conversion element 108A, the second color conversion element 108B, the filling element 122, and the light shielding element 110.

[0069] Then, if Figure 13As shown, a through hole TH is formed in the protective layer 130, the leveling layer 128, the light shielding element 110, and the leveling layer 118 to expose the source (drain) SD1 of the active device 104. Next, a through hole structure TS is provided in the through hole TH, and a first electrode 106A is formed. Subsequently, a pixel definition layer 132, a light-emitting layer 106B, and a second electrode 106C are formed on the first electrode 106A and the protective layer 130. Furthermore, a plurality of light-emitting elements 106 are formed on the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221, thereby completing the display device 8 of this embodiment.

[0070] Figure 14 and Figure 15 FIG. 1 is a schematic diagram of a method for manufacturing a display device according to a ninth embodiment of the present disclosure, wherein Figure 15 FIG2 is a cross-sectional view of a display device according to a ninth embodiment of the present disclosure. Figure 15 As shown, the display device 9 provided in this embodiment is Figure 13 The difference of the display device 8 shown is that the first color conversion element 108A, the second color conversion element 108B and the filling element 122 are formed before the second light shielding layer 110B is formed. Figure 15 In the embodiment, the number of light-shielding layers of the light-shielding element 110 may be less than the total number of color filter layers 120 and color conversion layers of the color conversion element 108. For example, the light-shielding element 110 may be formed by two light-shielding layers, and the color conversion element 108 may be formed by two color conversion layers, but the present invention is not limited thereto. In some embodiments, the upper surface of the light-shielding element 110 may be slightly lower than or substantially flush with the upper surface of the color conversion element 108 and / or the upper surface of the filling element 122, but the present invention is not limited thereto. The manufacturing method of the display device 9 of this embodiment will be used in conjunction with Figure 14 and Figure 15 The details are as follows. Figure 14 As shown, in the manufacturing method of the display device 9 of this embodiment, the steps of providing the active substrate 82 and forming the first light shielding layer 110A can be the same as Figure 12 as well as Figure 13 The embodiments shown are the same, so they will not be described in detail here.

[0071] exist Figure 14In the illustrated embodiment, after forming the first light-shielding layer 110A, a first stack 94A, a second stack 94B, and a third stack 94C are formed on the active substrate 82 in the opening OP1. The first stack 94A includes a first color filter layer 120A and a first color conversion element 108A disposed on the first color filter layer 120A. The second stack 94B includes a second color filter layer 120B and a second color conversion element 108B disposed on the second color filter layer 120B. The third stack 94C includes a third color filter layer 120C and a filling element 122 disposed on the third color filter layer 120C. Because the top surfaces of the first stack 94A, the second stack 94B, and the third stack 94C may be higher than the top surface of the first light-shielding layer 110A, recesses 94R may be formed between the first stack 94A, the second stack 94B, and the third stack 94C, corresponding to the first light-shielding layer 110A. The method of forming the first stack 94A, the second stack 94B, and the third stack 94C is further described as follows. In one embodiment, after forming the first light shielding layer 110A, the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C can be formed on the active substrate 82 in the opening OP1. In this case, the formation method of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C can be the same as Figure 12 as well as Figure 13The embodiment shown is the same and will not be further described here. Next, a first color conversion layer 108A1 is formed on the first color filter layer 120A, a second color conversion layer 108B1 is formed on the second color filter layer 120B, and a filling layer 1221 is formed on the third color filter layer 120C. The order of forming the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221 is not limited; any order of the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221 can be used. Next, the steps of forming the first color conversion layer 108A1, forming the second color conversion layer 108B1, and forming the filling layer 1221 may be repeated to form another first color conversion layer 108A1 on the first color conversion layer 108A1, another second color conversion layer 108B1 on the second color conversion layer 108A1, and another filling layer 1221 on the filling layer 1221, thereby forming the first stack 94A, the second stack 94B, and the third stack 94C. The number of times the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221 are repeated may depend on the number of first color conversion layers 108A1, the number of second color conversion layers 108B1, and the number of filling layers 1221. For example, when the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 respectively comprise a single first color conversion layer 108A1, a single second color conversion layer 108B1, and a single filling layer 1221, it is not necessary to repeat the steps of forming the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221. Similarly, when the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 respectively comprise at least three first color conversion layers 108A1, at least three second color conversion layers 108B1, and at least three filling layers 1221, the steps of forming the first color conversion layer 108A1, the second color conversion layer 108B1, and the filling layer 1221 may be repeated at least twice. Since the materials or colors of the first color filter layer 120A, the second color filter layer 120B, the third color filter layer 120C, the first color conversion layer 108A1, the second color conversion layer 108B1 and the filling layer 1221 can be the same as those mentioned above Figure 12 and Figure 13 Examples or Figure 1 The embodiments shown are the same and therefore will not be described again in detail.

[0072] The method disclosed herein for forming the first color filter layer 120A, the second color filter layer 120B, the third color filter layer 120C, the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 is not limited to the above. In some embodiments, Figure 14As shown, the first stack 94A, the second stack 94B, and the third stack 94C can be formed separately, and the order of forming the first stack 94A, the second stack 94B, and the third stack 94C can be any order of the first stack 94A, the second stack 94B, and the third stack 94C. For example, after forming the first light-shielding layer 110A, the first color filter layer 120A and the first color conversion element 108A can be sequentially formed on the active substrate 82 in the corresponding opening OP1 to form the first stack 94A. Then, the second color filter layer 120B and the second color conversion element 108B can be sequentially formed on the active substrate 82 in the corresponding opening OP1 to form the second stack 94B. Next, the third color filter layer 120C and the filling element 122 can be sequentially formed on the active substrate 82 in the corresponding opening OP1 to form the third stack 94C. The number of the first color conversion layers 108A1 of the first color conversion element 108A, the number of the second color conversion layers 108B1 of the second color conversion element 108B, and the number of the filling layers 1221 of the filling element 122 can be adjusted according to actual needs.

[0073] In some embodiments, as Figure 14 As shown, two of the first stack 94A, the second stack 94B, and the third stack 94C may be mixed. For example, after forming the first light-shielding layer 110A, the first color filter layer 120A and the second color filter layer 120B may be formed in the corresponding opening OP1. Then, the first color conversion element 108A is formed on the first color filter layer 120A, and the second color conversion element 108B is formed on the second color filter layer 120B to form the first stack 94A and the second stack 94B. Next, the third color filter layer 120C and the filling element 122 are sequentially formed on the active substrate 82 in the corresponding opening OP1 to form the third stack 94C. Alternatively, in some embodiments, as Figure 14 As shown, after forming the first light-shielding layer 110A, the first color filter layer 120A and the third color filter layer 120C may be formed in the corresponding opening OP1. Then, the first color conversion element 108A is formed on the first color filter layer 120A, and the filling element 122 is formed on the third color filter layer 120C to form the first stack 94A and the third stack 94C. Next, the second color filter layer 120B and the second color conversion element 108B are sequentially formed on the active substrate 82 in the corresponding opening OP1 to form the second stack 94B. The disclosed method of forming the first stack 94A, the second stack 94B, and the third stack 94C is not limited to the above.

[0074] It should be noted that in Figure 14In the illustrated embodiment, the color filter layer 120 may comprise, for example, a photoresist material, such that the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may each partially extend onto the first light-shielding layer 110A, and each have a thickness greater than that of the first light-shielding layer 110A. Furthermore, since the color conversion layer of the color conversion element 108 may comprise, for example, a photoresist material, the color conversion layer may be formed or stacked directly on the color filter layer 120 without a barrier wall. Figure 14 In the embodiment of the present invention, the first light shielding layer 110A, the color filter layer 120, the first color conversion layer 108A1, the second color conversion layer 108B1 and the filling layer 1221 may respectively include photoresist materials, so that the color filter layer 120 may be in direct contact with the color conversion element 108 (or the filling layer 1221), but the present invention is not limited thereto. In some embodiments, a protective layer (such as a protective layer) may be further provided between the color filter layer 120 and the color conversion element 108. Figure 6 The protective layer 126 shown) and / or the filling layer (such as Figure 6 The fill layer 124 is shown, but is not limited thereto.

[0075] like Figure 15 As shown, after forming the first stack 94A, the second stack 94B, and the third stack 94C, a second light-shielding layer 110B is formed on the first light-shielding layer 110A on one side of the first stack 94A, the second stack 94B, or the third stack 94C, or between any two of the first stack 94A, the second stack 94B, and the third stack 94C, to form the light-shielding element 110. The upper surface of the second light-shielding layer 110B is lower than the upper surfaces of the first stack 94A, the second stack 94B, and the third stack 94C. For example, the second light-shielding layer 110B may comprise an ink material. When forming the second light-shielding layer 110B, the first stack 94A, the second stack 94B, and the third stack 94C may serve as retaining walls to fill the recess 94R with the second light-shielding layer 110B, but the present invention is not limited thereto. In some embodiments, the second light-shielding layer 110B may also comprise a photoresist material.

[0076] like Figure 15 As shown, after forming the second light shielding layer 110B, a fill layer 128, a protective layer 130, a pixel definition layer 132, and a light emitting element 106 are formed on the first stack 94A, the second stack 94B, the third stack 94C, and the second light shielding layer 110B of the light shielding element 110, thereby forming the display device 9 of this embodiment. Since the steps of forming the fill layer 128, the protective layer 130, the pixel definition layer 132, and the light emitting element 106 and their variations can be the same as those described above, Figure 13 The embodiments shown are the same, so they will not be repeated here. In some embodiments, Figure 15 Other components of the display device 9 shown may also be Figure 1 or Figure 6 Display device structure or features or Figures 2 to 5 The first light shielding layer 110A of any of the variations shown.

[0077] Figures 16 to 23 The figure shows a schematic diagram of a method for manufacturing a display device according to the tenth embodiment of the present disclosure. Figure 16 As shown, an active substrate 82 is first provided. The active substrate 82 may include a substrate 102 and an active device layer 112 including an active device 104. In some embodiments, the active substrate 82 may further include a buffer layer 134 disposed between the substrate 102 and the active device layer 112, but is not limited thereto. Since the substrate 102, the active device 104, the active device layer 112, and the buffer layer 134 may be similar or identical to Figure 1 In some embodiments, the method for forming the active substrate 82 may be similar to or the same as that of Figure 12 The embodiments shown or other suitable variations are not described in detail here.

[0078] like Figure 16As shown, a first light shielding layer 110A is formed on the active substrate 82. For example, the method for forming the first light shielding layer 110A may include the following steps. First, a light shielding photoresist is formed on the active substrate 82 by spin coating, slit coating or other suitable processes. Then, the light shielding photoresist is dried, for example, by a vacuum drying process. Then, the light shielding photoresist is subjected to a pre-baking process, that is, soft baking, at a temperature range of 70°C to 100°C. Then, the light shielding photoresist is subjected to an exposure process and a development process through a mask to form openings OP11, openings OP12 and openings OP13. Then, a post-baking process, that is, hard baking, is performed at a temperature range of 200°C to 250°C to form the first light shielding layer 110A. The cross-sectional shape of the first light-shielding layer 110A in the formed direction (e.g., the first direction D1 or the second direction D2) can be, for example, rectangular, trapezoidal, or other suitable shapes. It should be noted that the top-view areas of the opening OP11 and the opening OP12 can differ. For example, the widths of the opening OP11 and the opening OP12 in the same cross-sectional direction can differ. This allows the brightness of light of different colors passing through the opening OP11 and the opening OP12 to be coordinated and meet desired requirements. For example, when the transmittance of the first color filter layer 120A formed in the opening OP11 in a subsequent step is greater than the transmittance of the second color filter layer 120B formed in the opening OP12, the top-view area of ​​the opening OP11 can be smaller than the top-view area of ​​the opening OP12. Alternatively, when the light conversion efficiency of the first color conversion element 108A formed in the opening OP11 in a subsequent step is greater than the light conversion efficiency of the second color conversion element 108B formed in the opening OP12, the top-view area of ​​the opening OP11 can be smaller than the top-view area of ​​the opening OP12. The light conversion efficiency herein can be, for example, the ratio of the brightness of the light converted by the color conversion element to the brightness of the light illuminating the color conversion element, but is not limited thereto. Similarly, the top-view areas of openings OP11 and OP12 can be used to adjust the brightness of the light passing through. In some embodiments, opening OP13 can also be different from openings OP11 and OP12. For example, when a colorless, transparent filling element 122 or a colorless, transparent filling element 122 containing metal particles or scattering particles is disposed in opening OP13 in a subsequent step, opening OP13 can be smaller than openings OP11 and OP12, but is not limited thereto.

[0079] Then, if Figure 17As shown, a first color filter layer 120A is formed in the opening OP11, a second color filter layer 120B is formed in the opening OP12, and a third color filter layer 120C is formed in the opening OP13. Figure 17 In an embodiment, the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may respectively partially extend onto the first light-shielding layer 110A, and each have a thickness greater than the thickness of the first light-shielding layer 110A. In one embodiment, the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may include a photoresist material. For example, a method for forming at least one of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may include the following steps. First, a colored or colorless and transparent photoresist material is formed in the opening OP11, the opening OP12, or the opening OP13 by spin coating, a slit coating process, or other suitable process. Then, the photoresist material is dried, for example, by a vacuum drying process. Next, the photoresist material is subjected to a pre-baking process at a temperature ranging from 70°C to 100°C. Then, the photoresist material is subjected to an exposure process and a development process through a mask to leave the photoresist material in the opening OP11, the opening OP12 or the opening OP13. Then, the photoresist material can be selectively irradiated with infrared rays to remove part of the water oxygen (water vapor and / or oxygen) or ions near the upper surface of the photoresist material. In some embodiments, the method of removing water oxygen or ions is not limited to irradiation with infrared rays, and other suitable methods can also be used. Subsequently, a post-baking process is performed at a temperature range of 200°C to 250°C to form one of the first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C. Then, the above steps are repeated at least twice to form the other ones of the first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C. Then, a degassing process may be optionally performed to remove or release most of the water, oxygen, or ions in the formed first color filter layer 120A, second color filter layer 120B, third color filter layer 120C, and first light-shielding layer 110A, thereby reducing the impact of the water, oxygen, or ions on the subsequently formed color conversion element 108 and / or light-emitting element 106. It should be noted that the degassing process can not only reduce the amount of water, oxygen, or ions near the top surface of the film layer, but also reduce the amount of water, oxygen, or ions far from the top surface.

[0080] In some embodiments, as Figure 24As shown, the upper surface 120S of at least one of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may have a concave structure. In other words, at least one of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may have a protrusion 120P located on the first light shielding layer 110A. In some embodiments, as Figure 25 As shown, the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may also include an ink material. For example, a method for forming at least one of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may include the following steps. First, a colored or colorless transparent ink material is formed in the opening OP11, the opening OP12, or the opening OP13 using an inkjet printing process or other suitable process. During this step, the top surface 120S of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C is lower than the top surface of the first light shielding layer 110A. For example, the thickness of the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C in the normal direction VD may be less than the thickness of the first light shielding layer 110A in the normal direction VD to prevent overflow of the ink material. Then, a post-baking process, a UV curing process, or other suitable process at a temperature ranging from 100°C to 250°C is performed to cure the ink material, thereby forming the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C. Next, a degassing process is performed to remove or release water, oxygen, or ions from the formed first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C, thereby reducing the impact of water, oxygen, or ions on the subsequently formed color conversion elements 108 and / or light-emitting elements 106. In some embodiments, the ink material may have a high concentration of solids, for example, the content of the colored solid filter material may be higher than the content of the liquid solvent. In some embodiments, when the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C include ink materials, the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may have a flat or concave upper surface 120S. Figure 26 As shown, when the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C include ink materials, the first color filter layer 120A, the second color filter layer 120B, and the third color filter layer 120C may have an upwardly protruding upper surface 120S.

[0081] like Figure 18 As shown, after forming the first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C, a fill layer 124 is formed on the first color filter layer 120A, the second color filter layer 120B, the third color filter layer 120C and the first light shielding layer 110A. Figure 18 In the embodiment of the present invention, the leveling layer 124 may have a flat upper surface, but is not limited thereto. In some embodiments, after the leveling layer 124 is formed, a protective layer 126 may be selectively formed on the leveling layer 124. In some embodiments, as Figure 27 As shown, the leveling layer 124 may be formed on the surfaces of the first color filter layer 120A, the second color filter layer 120B, the third color filter layer 120C and the first light-shielding layer 110A and have a non-flat surface. For example, when the thickness of the first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C in the normal direction VD is greater than the thickness of the first light-shielding layer 110A in the normal direction VD, the leveling layer 124 may have a recess 124R located directly above the first light-shielding layer 110A. In some embodiments, when the thickness of the first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C is less than the thickness of the first light-shielding layer 110A, the leveling layer 124 may have a recess located directly above the first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C. Figure 27 In some embodiments, the protective layer 126 may be formed on the filling layer 124 along with the undulations of the upper surface of the filling layer 124, and thus may also have a depression corresponding to the first light shielding layer 110A. In some embodiments, the filling layer 124 may also be formed on Figures 24 to 26 The surface formed by the first color filter layer 120A, the second color filter layer 120B, the third color filter layer 120C and the first light shielding layer 110A has a non-flat surface.

[0082] like Figure 19As shown, a second light-shielding layer 110B is formed on the fill layer 124 or the protective layer 126. For example, the method for forming the second light-shielding layer 110B may include the following steps. First, a light-shielding photoresist is formed on the protective layer 126 by spin coating, slit coating process or other suitable process. Then, the light-shielding photoresist is dried, for example, by a vacuum drying process. Next, the light-shielding photoresist is subjected to a pre-baking process at a temperature range of 70°C to 100°C. Then, the light-shielding photoresist is exposed and developed through a mask to form openings OP21, OP22 and OP23, wherein the openings OP21, OP22 and OP23 overlap with the openings OP11, OP12 and OP13 in the normal direction VD, respectively. Next, a post-baking process is performed at a temperature range of 200°C to 250°C to form the second light-shielding layer 110B. The second light-shielding layer 110B may have a rectangular, trapezoidal, or other suitable shape in a cross-sectional direction (e.g., the first direction D1 or the second direction D2). It should be noted that the top-view areas of opening OP21 and opening OP22 may differ from each other. For example, the widths of opening OP21 and opening OP22 in the same cross-sectional direction may differ from each other. This allows the brightness of the different colors of light emitted from opening OP21 and opening OP22 to be matched and matched to meet desired requirements. For example, the overlapping area of ​​opening OP21 and opening OP11 in the normal direction VD may differ from the overlapping area of ​​opening OP22 and opening OP12 in the normal direction VD. This allows the brightness of the light emitted downward from opening OP11 and opening OP12 to be matched and mixed to achieve desired colors. In some embodiments, opening OP23 may also differ from opening OP21 and opening OP22, but is not limited thereto. In some embodiments, the widths of openings OP21, OP22, and OP23 may be smaller than the widths of the corresponding openings OP11, OP12, and OP13, but is not limited thereto. In some embodiments, as Figure 28 As shown, when the filling layer 124 or the protective layer 126 has a recess directly above the first light shielding layer 110A, the second light shielding layer 110B may be disposed in the recess 124R.

[0083] Then, if Figure 20 As shown, the first color conversion element 108A is formed in the opening OP21, the second color conversion element 108B is formed in the opening OP22, and the filling element 122 is formed in the opening OP23. Figure 20In one embodiment, the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 may each partially extend onto the second light-shielding layer 110B and have a thickness greater than that of the second light-shielding layer 110B. In one embodiment, the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 may comprise a photoresist material. The material of the first color conversion element 108A and the second color conversion element 108B may comprise a phosphorescent material, a fluorescent material, quantum dots, or other suitable color-converting material capable of converting light color. For example, a method for forming at least one of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 may comprise the following steps: First, a photoresist material comprising a color-converting material capable of converting light color is formed in the openings OP21 and OP22, or a colorless, transparent photoresist material is formed in the opening OP23, by spin coating, slit coating, or other suitable process. The photoresist material is then dried, for example, by a vacuum drying process. Next, the photoresist material is subjected to a pre-bake process at a temperature ranging from 70°C to 100°C. The photoresist material is then exposed and developed using a mask to leave the photoresist material within the opening OP21, opening OP22, or opening OP23. Next, the photoresist material is irradiated with infrared rays to remove water, oxygen, or ions near the top surface of the photoresist material. In some embodiments, the method for removing water, oxygen, or ions is not limited to irradiation with infrared rays, but may be other suitable methods. Subsequently, a post-bake process is performed at a temperature ranging from 200°C to 250°C to form one of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122. The above steps are then repeated at least twice to form the other of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122. Then, a degassing process is performed to remove or release water, oxygen, or ions in the formed first color conversion element 108A, the second color conversion element 108B, the filling element 122, and the second light shielding layer 110B, thereby reducing the impact of water, oxygen, or ions on the formed color conversion element 108 and / or the subsequently formed light emitting element 106.

[0084] In some embodiments, as Figure 29As shown, the upper surface 108S of at least one of the first color conversion element 108A and the second color conversion element 108B may have a concave structure. In other words, at least one of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 may have a protruding portion 108P located on the second light shielding layer 110B. In some embodiments, the upper surface 122S of the filling element 122 may also have a concave structure, and the filling element 122 may have a protruding portion 122P located on the second light shielding layer 110B. In some embodiments, as Figure 30 As shown, the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 may also include an ink material. For example, a method for forming at least one of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 may include the following steps. First, an ink material containing a color conversion material or a colorless and transparent ink material is formed in the opening OP21, the opening OP22, or the opening OP23 using an inkjet printing process or other suitable process. The color conversion material may include a phosphorescent material, a fluorescent material, quantum dots, or other suitable material. During this step, the upper surface 108S of the first color conversion element 108A and the second color conversion element 108B, as well as the upper surface 122S of the filling element 122, are lower than the upper surface of the first light-shielding layer 110A. For example, the thickness of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 in the normal direction VD may be less than the thickness of the second light-shielding layer 110B in the normal direction VD to prevent overflow of the ink material. Then, a post-baking process, a UV curing process, or other suitable process is performed at a temperature ranging from 90° C. to 125° C. to cure the ink material and form one of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122. The above steps are then repeated at least twice to form the other of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122. A degassing process is then performed to remove or release water, oxygen, or ions from the formed first color conversion element 108A, the second color conversion element 108B, and the filling element 122, thereby reducing the impact of the water, oxygen, or ions on the subsequently formed color conversion element 108 and / or the light-emitting element 106. In some embodiments, when the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 include ink materials, the upper surfaces 108S of the first color conversion element 108A and the second color conversion element 108B and the upper surface 122S of the filling element 122 may have a flat structure or a concave structure. Figure 31As shown, when the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 include ink materials, the upper surfaces 108S of the first color conversion element 108A and the second color conversion element 108B and the filling element 122 may have an upper surface 122S that protrudes upward. In some embodiments, Figure 20 、 Figure 29 、 Figure 30 and Figure 31 The first color conversion element 108A, the second color conversion element 108B and the filling element 122 formed by any one of the above can be used in conjunction with Figure 17 、 Figure 24 、 Figure 25 and Figure 26 The first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C formed by any one of the above-mentioned methods are shown in FIG. Figure 28 The structure shown.

[0085] like Figure 21 As shown, after forming the first color conversion element 108A, the second color conversion element 108B and the filling element 122, a filling layer 128 is formed on the first color conversion element 108A, the second color conversion element 108B and the filling element 122. Figure 21 In the embodiment of the present invention, the leveling layer 128 may have a flat upper surface, but is not limited thereto. In some embodiments, after the leveling layer 128 is formed, a protective layer 130 may be selectively formed on the leveling layer 128. In some embodiments, as shown in FIG. Figure 32 As shown, the leveling layer 128 may be formed on the surfaces of the first color conversion element 108A, the second color conversion element 108B, the filling element 122, and the second light shielding layer 110B and have a non-flat surface. For example, when the thickness of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 is greater than the thickness of the second light shielding layer 110B, the leveling layer 128 may have a recess 128R located directly above the second light shielding layer 110B. In some embodiments, when the thickness of the first color conversion element 108A, the second color conversion element 108B, and the filling element 122 is less than the thickness of the second light shielding layer 110B, the leveling layer 128 may have a recess located directly above the first color conversion element 108A, the second color conversion element 108B, and the filling element 122. Figure 32 In some embodiments, the protective layer 130 may be formed on the filling layer 128 along with the undulations of the upper surface of the filling layer 128, and thus may also have a depression corresponding to the second light shielding layer 110B. In some embodiments, the filling layer 128 may also be formed on Figures 29 to 31The surfaces of the first color conversion element 108A, the second color conversion element 108B, the filling element 122 and the second light shielding layer 110B have non-flat surfaces. In some embodiments, Figure 21 and Figure 32 The filling layer 128 and the protective layer 130 formed by any one of them can also be matched Figure 17 、 Figure 24 、 Figure 25 and Figure 26 The first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C formed by any one of Figure 28 The structure shown or Figure 20 、 Figure 29 、 Figure 30 and Figure 31 The first color conversion element 108A, the second color conversion element 108B, and the filling element 122 are formed by any one of them.

[0086] like Figure 22 As shown, after the filling layer 128 (or protective layer 130) is formed, a through hole TH penetrating the filling layer 128, the second light shielding layer 110B, the filling layer 124, the first light shielding layer 110A and the filling layer 118 may be formed to expose the source (drain) SD1. The method of forming the through hole TH may, for example, include at least one of laser etching, dry etching or wet etching or other suitable methods. Then, a through hole structure TS is formed in the through hole TH, wherein the through hole structure TS may include a conductive material, and the conductive material may, for example, include nano silver glue, conductive particles, conductive fluid material or other suitable conductive materials. In some embodiments, when a protective layer 130 is formed on the filling layer 128 and a protective layer 126 is formed on the filling layer 124, the through hole TH may also penetrate the protective layer 130 and the protective layer 126. In some embodiments, as Figure 33As shown, the through-hole structure TS may include a multi-layer structure. Taking a two-layer through-hole structure TS as an example, the through-hole structure TS may include a first through-hole structure TS1 and a second through-hole structure TS2 disposed on the first through-hole structure TS1. The first through-hole structure TS1 may be formed after forming the leveling layer 124 (or protective layer 126) and before forming the second light-shielding layer 110B. The second through-hole structure TS2 may be formed after forming the leveling layer 128 (or protective layer 130). The first through-hole structure TS1 may be formed, for example, by first forming a through-hole TH1 in the leveling layer 124, the first light-shielding layer 110A, and the leveling layer 118, and then forming a conductive material in the through-hole TH1. The second through-hole structure TS2 may be formed, for example, by forming a through-hole TH2 in the leveling layer 128 and the second light-shielding layer 110B, and then forming a conductive material in the through-hole TH2. Because the through-hole structure TS must penetrate a film layer of a certain thickness, using multiple layers of the through-hole structure TS can reduce the top surface area of ​​the through-hole structure TS. In some embodiments, when a protective layer 126 is formed on the leveling layer 124, the through-hole TH1 can also penetrate the protective layer 126. When a protective layer 130 is formed on the leveling layer 128, the through-hole TH2 can also penetrate the protective layer 130. In some embodiments, the number of layers of the through-hole structure TS can be adjusted according to needs.

[0087] In some embodiments, as Figure 34 Part (I), Part (II), Part (III) and Figure 22 As shown, the through-hole structure TS may, for example, include an upper portion P1 and a lower portion P2, wherein the upper portion P1 is disposed on the lower portion P2 and on the upper surface S of the corresponding fill layer 128 or protective layer 130, and the lower portion P2 is disposed in the through-hole TH. Moreover, the width of the upper portion P1 in the cross-sectional direction is greater than the width of the lower portion P2 in the cross-sectional direction or the top opening width of the through-hole TH, so as to facilitate electrical connection of the through-hole structure TS with subsequently formed elements, for example, to facilitate electrical connection with the first electrode 106A of the light-emitting element 106. The shape of the lower portion P2 in the cross-sectional direction (for example, the first direction D1 or the second direction D2) may be, for example, a triangle, an inverted trapezoid, a rectangle, or other suitable shapes. In some embodiments, as Figure 34 Part (IV), Part (V), Part (VI) and Figure 22 As shown, the through hole structure TS can also be disposed in the through hole TH and formed by the lower portion P2. In this case, the cross-sectional shape of the lower portion P2 can also be, for example, a triangle, an inverted trapezoid, a rectangle, or other suitable shapes. In some embodiments, Figure 33 The first through hole structure TS1 and / or the second through hole structure TS2 shown may also include Figure 34 When the first through hole structure TS1 has the upper portion P1 and the lower portion P2 shown in the portion (I), portion (II) and portion (III) of FIG. Figure 34 When the upper portion P1 and the lower portion P2 shown in parts (I), (II) and (III) of the embodiment are connected, the second through hole structure TS2 can still achieve electrical connection with the first through hole structure TS1 even if there is a large error in the alignment of the through hole TH2 and the through hole TH1. In this case, the width of the upper portion P1 in the cross-sectional direction can be greater than the width of the lower portion P2 in the cross-sectional direction or Figure 33 In some embodiments, the first through hole structure TS1 and / or the second through hole structure TS2 may also be formed by Figure 34 In some embodiments, the first through hole structure TS1 and / or the second through hole structure TS2 may also be formed by Figure 34 In some embodiments, Figure 22 、 Figure 33 and Figure 34 Any of the through-hole structures shown can also be used with Figure 17 、 Figure 24 、 Figure 25 and Figure 26 The first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C formed by any one of Figure 28 The structure shown or Figure 20 、 Figure 29 、 Figure 30 and Figure 31 The first color conversion element 108A, the second color conversion element 108B, and the filling element 122 formed by any one of Figure 21 and Figure 32 In some embodiments, the fill layer 128 and the protective layer 130 are formed by any one of Figure 34 Any of the through-hole structures shown may also be applicable to any of the above embodiments.

[0088] like Figure 23As shown, after forming the through-hole structure TS, a first electrode 106A is formed on the protective layer 130 and the through-hole structure TS, so that the first electrode 106A can be electrically connected to the corresponding active device 104 through the corresponding through-hole structure TS. Then, a pixel definition layer 132 is formed on the first electrode 106A and the protective layer 130, wherein the pixel definition layer 132 may include a plurality of openings OPP corresponding to a plurality of light-emitting areas. The thickness of the pixel definition layer 132 may be greater than the thickness of the first electrode 106A. The optical density (OD) of the pixel definition layer 132 may be, for example, greater than 2.5 to achieve the function of shading or blocking light penetration. For example, the material of the pixel definition layer 132 may include, but is not limited to, a light-absorbing material, a light-reflecting material, or other suitable materials, such as a photoresist material. The method of forming the pixel definition layer 132 may, for example, include a spin coating or a slit coating process. In some embodiments, the pixel definition layer 132 may have a high resistance, but is not limited to this. Next, a light-emitting layer 106B is formed on the pixel definition layer 132 and the first electrode 106A, and then a second electrode 106C is formed on the light-emitting layer 106B, thereby forming the light-emitting element 106. The light-emitting layer 106B may be formed by, for example, a physical vapor deposition process, a chemical vapor deposition process, an inkjet process, or other suitable processes. Figure 23 In the display device 10 shown, the second electrode 106C may have a flat upper surface, but is not limited thereto. Since the first electrode 106A, the light emitting layer 106B and the second electrode 106C may be similar or identical to Figure 1 In some embodiments, such as Figure 1 As shown, the upper surface of the second electrode 106C may have a depression. The manufacturing method of the tenth embodiment can also be applied to manufacturing Figure 1 The display device 1 shown or other suitable embodiments. In some embodiments, Figure 23 The first electrode 106A is connected to Figure 33 The second through hole structure TS2 shown can be formed using the same process. In some embodiments, Figure 23 The first electrode 106A is connected to Figure 33 The second through hole structure TS2 shown can be formed using the same material. In some embodiments, Figure 23 The first electrode 106A is connected to Figure 33 The second through hole structure TS2 shown can be formed using the same process and the same material. In some embodiments, Figure 23 and Figure 1 Any of the light emitting elements 106 shown can also be used with Figure 17 、 Figure 24 、 Figure 25 and Figure 26The first color filter layer 120A, the second color filter layer 120B and the third color filter layer 120C formed by any one of Figure 28 The structure shown or Figure 20 、 Figure 29 、 Figure 30 and Figure 31 The first color conversion element 108A, the second color conversion element 108B and the filling element 122 formed by any one of Figure 21 and Figure 32 The filling layer 128 and the protective layer 130 formed by any one of Figure 22 、 Figure 33 and Figure 34 Any of the through-hole structures shown.

[0089] In summary, in the display device disclosed herein, because a light shielding element is disposed between the color conversion element and the channel of the active element, the channel of the active element is less susceptible to exposure to the second light, thereby reducing or preventing electrical offsets (e.g., threshold voltage offsets) or leakage. Thus, the display device disclosed herein can achieve bottom emission performance when combined with the color conversion element.

[0090] The foregoing description is merely an example of the present disclosure and is not intended to limit the present disclosure. Persons skilled in the art will readily appreciate that the present disclosure is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present disclosure are intended to be within the scope of protection of the present disclosure.

Claims

1. A display device, characterized in that: include: a substrate; An active element and another active element each include a channel, and the active element and the another active element are disposed on the substrate; A light emitting element and another light emitting element are driven by the active element and the another active element respectively to emit a first light; a color conversion element and another color conversion element; a color filter layer disposed between the substrate and the color conversion element; a first filling layer, disposed between the active element and the color filter layer; a second fill layer disposed between the color filter layer and the color conversion element; and A light-shielding element comprising a first light-shielding layer and a second light-shielding layer; The second light-shielding layer includes an opening corresponding to the light-emitting element and another opening corresponding to the other light-emitting element, wherein a width of the opening is different from a width of the other opening in one direction, the color conversion element is disposed in the opening, and the other color conversion element is disposed in the other opening; The first light emitted from the light emitting element enters the color conversion element and is converted into a second light. The second light passes through the substrate, and the channel of the active element is protected by the shading element from at least a large part of the second light.

2. The display device according to claim 1, wherein The active element is a thin film transistor.

3. The display device according to claim 1, wherein The first light is blue light.

4. The display device according to claim 1, wherein The second light has a longer peak wavelength than the first light.

5. The display device according to claim 1, wherein The light emitting element is an organic light emitting diode.

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