Storage device unit

Abstract

The memory device unit comprises: a substrate having a main surface and a plurality of stacked wiring layers; and a memory device having a plate shape having a first surface, arranged on the substrate so that the first surface faces the main surface. The plurality of wiring layers include a heat generating layer having a heat generating circuit.

Description

Technical Field

[0001] The present disclosure relates to a memory device unit having a substrate configured with a memory device. Background Art

[0002] When an electronic device equipped with a storage device such as a solid-state drive (SSD), a hard disk drive (HDD), or a memory is used in a cold region, the electronic device is sometimes operated at a temperature lower than the guaranteed operation temperature of the storage device due to the low outside temperature. Patent document 1 discloses a memory card having a printed circuit board on which a semiconductor memory is mounted, a frame supporting the printed circuit board, and a heater disposed on the inner side of the frame. When the temperature of the memory card is lower than the guaranteed operation temperature range, the memory card is heated by the heater, and the memory can be operated within the guaranteed operation temperature range.

[0003] In addition, the following method is also known: a flexible printed circuit board (FPC) having a heater function is separately prepared and arranged around the storage device to heat the storage device. The temperature of the storage device is measured by a temperature sensor, and when it is lower than the guaranteed operation temperature of the storage device, the heater can be used to heat the storage device so that the storage device can operate within the guaranteed operation temperature range.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 02-231200 Summary of the invention

[0007] In the case of the method using the memory card or the FPC having a heater function described in Patent Document 1, there is still room for improvement in terms of reduction in manufacturing cost.

[0008] The storage device unit involved in the present disclosure comprises: a substrate having a main surface and having multiple stacked wiring layers; and a storage device having a plate shape with a first surface, which is configured on the substrate so that the first surface is opposite to the main surface, and the multiple wiring layers include a heating layer having a heating circuit.

[0009] According to the present disclosure, the manufacturing cost can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a perspective view of an information processing device equipped with a storage device unit according to one embodiment of the present disclosure.

[0011] Figure 2 Yes means Figure 1 A perspective view of the lower surface of a main body of an information processing device.

[0012] Figure 3 It means from Figure 1 A partial perspective view of a main body of an information processing device in a state where a storage device unit is removed from the main body of the information processing device.

[0013] Figure 4 It is a perspective view showing a storage device unit of the present disclosure.

[0014] Figure 5 yes Figure 4 An exploded perspective view of a storage device unit.

[0015] Figure 6 It is a diagram showing a heat generating layer of a storage device unit of the present disclosure.

[0016] Figure 7 It is a diagram showing another heat generating layer of the storage device unit of the present disclosure.

[0017] Figure 8 is a diagram showing a ground layer of a memory device cell according to the present disclosure.

[0018] Fig. 9 is a diagram showing a first layer of a memory device unit of the present disclosure. DETAILED DESCRIPTION

[0019] (The process of completing this disclosure)

[0020] Sometimes electronic devices such as laptop PCs are used outdoors. For example, in cold regions, when the outside temperature is below freezing, it is lower than the guaranteed operating temperature of storage devices such as SSDs, HDDs, or memories mounted on electronic devices. In such an environment, when the electronic device is started, there is a problem that the storage device does not operate normally or the access speed to the storage device is reduced. In order to prevent this, there is also a known method of preparing a flexible printed circuit board (FPC) formed with a heater circuit and arranging it around the storage device. For example, there is a method of surrounding the HDD with an FPC formed with a heater circuit, and heating the storage device with a heater when the temperature of the storage device is low at startup. In addition, there is also a method of arranging an FPC formed with a heater circuit between the SSD and the substrate on which the SSD is mounted, and heating the SSD with a heater.

[0021] In the case of a method of heating the storage device by an FPC having a heater circuit, it is difficult to reduce the manufacturing cost because the expensive FPC is prepared separately. In addition, there is also a problem of increasing the number of work steps when assembling the storage device in electronic equipment.

[0022] Therefore, the present inventors have studied electronic devices for solving these problems and have considered the following configuration.

[0023] A storage device unit involved in one embodiment of the present disclosure comprises: a substrate having a main surface and having multiple stacked wiring layers; and a storage device having a plate shape with a first surface, configured on the substrate so that the first surface is opposite to the main surface, and the multiple wiring layers include a heating layer having a heating circuit.

[0024] According to this structure, it is possible to reduce manufacturing costs. In addition, it is possible to improve workability during manufacturing and reduce man-hours.

[0025] The heating circuit may be formed in substantially the same shape as the storage device and arranged to overlap the storage device when viewed from a direction perpendicular to the main surface.

[0026] According to this structure, the storage device can be heated efficiently.

[0027] Alternatively, the storage device is a solid state drive.

[0028] According to this configuration, in an electronic device having an SSD, when the outside temperature is low at the time of startup, the SSD can be operated within the range of the guaranteed operation temperature by heating the SSD.

[0029] The plurality of wiring layers may include a ground layer having a ground pattern formed thereon at a position closer to the main surface than the heat generating layer.

[0030] According to this structure, the heat generated by the heat generating circuit can be efficiently transferred to the outside of the substrate.

[0031] Hereinafter, preferred embodiments for implementing the present disclosure will be described in detail with reference to the drawings.

[0032] (Implementation Method 1)

[0033] Figure 1 It is a perspective view of the information processing device 10 equipped with the storage device unit 20 according to one embodiment of the present disclosure. Figure 2 Yes means Figure 1 1 is a perspective view of the lower surface 12 b of the main body 12 of the information processing device 10. Figure 3 It means from Figure 1The main body 12 of the information processing device 10 is a partial three-dimensional view of the main body 12 of the information processing device 10 in a state where the storage device unit 20 is removed. In addition, the XYZ coordinate system shown in the figure is a system for easily understanding the embodiment, and does not limit the embodiment. In the XYZ coordinate system, the X-axis direction is the width direction of the information processing device, the Y-axis direction is the depth direction, and the Z direction is the thickness direction.

[0034] [Overall structure]

[0035] like Figure 1 As shown, the information processing device 10 is a so-called notebook personal computer, which has a main body 12 and a display 14 rotatably mounted on the main body 12. The main body 12 of the information processing device 10 is a plate-shaped body whose dimension in the thickness direction (Z-axis direction) is smaller than the dimension in the width direction (X-axis direction) and the dimension in the depth direction (Y-axis direction). In addition, a CPU and the like are built into the main body 12, and a keyboard 16 is provided on its upper surface 12a.

[0036] like Figure 2 As shown, a plurality of legs 18 are provided on the lower surface 12b of the main body 12 of the information processing device 10. In addition, a storage device unit 20 is detachably mounted on the lower surface 12b.

[0037] like Figure 3 As shown, in this embodiment, a recessed storage portion 12c is provided on the lower surface 12b of the main body 12, which is recessed in the thickness direction (Z-axis direction) of the main body 12 and stores the storage device unit 20. A connector 22 for connecting to the storage device unit 20 is provided on the bottom surface 12d of the storage portion 12c. The connector 22 is mounted inside the main body 12, and is connected to a mother substrate (not shown) on which a CPU or the like is mounted, for example, via a flexible cable (not shown).

[0038] <Storage Device Unit>

[0039] Figure 4 is a perspective view of the storage device unit 20 of the present disclosure. Figure 5 yes Figure 4 1 is an exploded perspective view of the storage device unit 20. Fig. 9 2 is a diagram showing the first layer 26e of the memory device unit 20 of the present disclosure. Figure 4 , Figure 5 as well as Fig. 9, the storage device unit 20 stored in the recessed storage portion 12c provided on the lower surface 12b of the main body 12 is described. The storage device unit 20 includes a substrate 26 and a storage device 28 arranged on the substrate 26. In addition, the storage device unit 20 includes a housing 24, two connectors 30 and 32 mounted on the main surface 26a of the substrate 26, and a thermistor 50 (see Fig. 9 ), and a cover 34 covering the substrate 26. The housing 24 of the storage device unit 20 accommodates the substrate 26, and the storage device 28 is mounted on the substrate 26.

[0040] <Substrate>

[0041] Figure 6 as well as Figure 7 It is a diagram showing the heat generating layers 26b and 26c of the storage device unit 20 of the present disclosure. Figure 8 26 is a diagram showing a grounding layer 26d of a storage device unit 20 of the present disclosure. The substrate 26 is formed by stacking a plurality of wiring layers. The substrate 26 is, for example, a rigid substrate made of a material such as glass epoxy resin. In the present embodiment, the substrate 26 has six stacked wiring layers from the first layer 26e on the main surface 26a side to the sixth layer on the side opposite to the main surface 26a. That is, the substrate 26 has six stacked wiring layers. Fig. 9 ) is mounted with a thermistor 50. The first layer 26e having the thermistor 50 is located between the ground layer 26d and the storage device 28. In addition, the first layer 26e having the thermistor 50 is the layer closest to the storage device 28 among the six wiring layers. The thermistor 50 is a temperature sensor for measuring the temperature of the storage device 28. In addition, the mounting position of the thermistor 50 is more preferably set in the area on the end side opposite to the position where the connectors 30 and 32 described later are arranged in the long side direction of the rectangular main surface 26a. It is considered that by setting it to this position, the error between the measured temperature of the thermistor 50 and the actual temperature of the storage device 28 can be further reduced.

[0042] like Figure 6 as well as Figure 7 As shown, the plurality of wiring layers of the substrate 26 include heat generating layers 26b and 26c having heat generating circuits 36 and 38 in the third and fourth layers. Figure 8As shown, the plurality of wiring layers of the substrate 26 include a ground layer 26d having a ground pattern 40 formed thereon in the second layer closer to the main surface 26a than the heat generating layers 26b and 26c. The ground layer 26d is located between the heat generating layers 26b and 26c and the storage device 28. When viewed from a direction (Z-axis direction) perpendicular to the main surface 26a of the substrate 26, the ground pattern 40 is arranged to overlap with the storage device 28. That is, the substrate 26 of the present embodiment includes a ground layer 26d in the second layer and heat generating layers 26b and 26c in the third and fourth layers in the wiring layers of the first to sixth layers.

[0043] like Figure 5 As shown, two connectors 30 and 32 are mounted on the substrate 26. One connector 30 protrudes from the substrate 26 in the thickness direction of the main body 12, and can be connected to the connector 22 provided in the storage portion 12c of the main body 12 in a detachable manner in the thickness direction. The other connector 32 is a connector connected to the interface connector 28a of the storage device 28, and is connected to the interface connector 28a in a direction (Y-axis direction) orthogonal to the thickness direction (Z-axis direction) of the main body 12. That is, the attachment and detachment direction of the connector 22 of the main body 12 and the connector 30 of the substrate 26 is 90° different from the attachment and detachment direction of the connector 32 of the substrate 26 and the interface connector 28a of the storage device 28. In addition, the connector 32 is electrically connected to the connector 30 via a circuit (not shown) on the substrate 26. Therefore, the storage device 28 connected to the connector 32 of the substrate 26 is mounted inside the main body 12 via the substrate 26 and is electrically connected to the mother substrate. In other words, the substrate 26 is a relay substrate that connects the storage device 28 and the mother substrate.

[0044] The storage device unit 20 having such a structure can be housed in the housing portion 12c of the main body 12 in the thickness direction (Z-axis direction) of the main body 12. Thus, the connector 22 of the main body 12 and the connector 30 of the storage device unit 20 can be detachably connected in the thickness direction.

[0045] like Figure 6 As shown in FIG. 1 , a heating circuit 36 ​​is formed on the heating layer 26b as the third layer of the substrate 26. The heating circuit 36 ​​is, for example, a wiring pattern formed of copper foil. The heating circuit 36 ​​generates heat when current flows through the resistance of the heating circuit 36. Figure 7 As shown in FIG. 1 , a similar heating circuit 38 is also formed on the heating layer 26c, which is the fourth layer of the substrate 26. In the present embodiment, the heating circuits 36 and 38 are formed of copper foil, but the material constituting the heating circuits 36 and 38 is not limited thereto, and a conductor having any resistivity can be selected. The heating circuits 36 and 38 can control the amount of heat generated by the heating circuits 36 and 38 according to the resistivity, thickness, and length of the wiring.

[0046] The heating circuits 36 and 38 of the heating layers 26b and 26c are heaters for heating the storage device 28 when the outside temperature is low. When the information processing device 10 is started, the temperature of the storage device 28 is measured by the thermistor 50. When the temperature of the storage device 28 is lower than a given temperature determined by the guaranteed operation temperature of the storage device 28, a current is passed through the heating circuits 36 and 38 to generate heat and heat the storage device 28. Here, the given temperature is, for example, the temperature of the lower limit of the guaranteed operation temperature (0°C). When the temperature of the storage device 28 rises to a given temperature (for example, 2°C) at which the storage device 28 can operate, which is determined by the guaranteed operation temperature of the storage device 28, the current to the heating circuits 36 and 38 is cut off, and the heating is terminated. In addition, the control of the heating circuits 36 and 38 based on the temperature of the storage device 28 is executed by the CPU of the information processing device 10. In addition, the control of the heating circuits 36 and 38 may also be executed by, for example, a microcomputer mounted on the substrate 26 or the storage device 28. In addition, the temperatures of 0° C. and 2° C. described above are examples for explaining the present disclosure, and other temperatures may be used, and the present disclosure is not limited to these.

[0047] like Figure 8 As shown, a ground pattern 40 is formed on the ground layer 26d as the second layer of the substrate 26. By arranging the ground layer 26d on the main surface side of the heat generating layers 26b and 26c, that is, on the storage device 28 side, the heat generated by the heat generating circuits 36 and 38 can be efficiently transferred to the storage device 28.

[0048] <Storage Device>

[0049] In this embodiment, an SSD is mounted on the substrate 26 as the storage device 28. Figure 5 As shown, the storage device 28 is formed into a plate shape having a first surface 28b. That is, the storage device 28 has a plate shape. By connecting the connector 32 mounted on the substrate 26 to the interface connector 28a of the storage device 28, the first surface 28b of the storage device 28 is arranged to be opposite to the main surface 26a of the substrate 26. In this way, since the storage device 28 is mounted on the substrate 26, the storage device 28 can be heated by the heat generated by the heating circuits 36 and 38 of the substrate 26. In this embodiment, the substrate 26 and the storage device 28 are arranged not to contact each other. That is, the first surface 28b of the storage device 28 is arranged separately from the main surface 26a of the substrate 26. By such a configuration, the storage device 28 can be prevented from being locally heated.

[0050] When viewed from a direction perpendicular to the main surface 26a of the substrate 26 (Z-axis direction), the heating circuits 36 and 38 are formed in substantially the same shape as the storage device 28 and are arranged so as to overlap with the storage device 28. That is, when viewed from a direction perpendicular to the main surface 26a of the substrate 26 (Z-axis direction), the shapes of the heating circuits 36 and 38 may be substantially the same as the shape of the storage device 28. By arranging the heating circuits 36 and 38 so as to overlap with the storage device 28, the storage device 28 can be efficiently heated.

[0051] The SSD used as the storage device 28 of this embodiment generally has an operation guarantee temperature of about 0° C. to 40° C. When the outside temperature is below freezing in cold regions, the temperature of the information processing device 10 and the storage device 28 mounted on the information processing device 10 may also drop below 0° C. In such a case, by heating the storage device 28 using the heating circuits 36 and 38, the storage device 28 can be used within the range of the operation guarantee temperature of the storage device 28.

[0052] [action]

[0053] The operation of the information processing device 10 having the above-described configuration will be described.

[0054] (1) When the information processing device 10 is activated, the temperature of the storage device 28 is measured by the thermistor 50 .

[0055] (2) When the temperature of the storage device 28 is lower than 0°C, for example, current flows through the heating circuits 36 and 38 of the heating layers 26b and 26c, and the storage device 28 starts to be heated. At this time, the storage device 28 is not powered, and the storage device 28 cannot be used. The control of the current of the heating circuits 36 and 38 and the control of the power supply to the storage device 28 are executed by, for example, a CPU or the like.

[0056] (3) When the temperature of the storage device 28 reaches, for example, 2° C. or higher, the current to the heating circuits 36 and 38 is cut off, and the heating of the storage device 28 is terminated.

[0057] (4) When the heating of the storage device 28 is completed, the power supply to the storage device 28 is started, and the storage device 28 is put into a usable state.

[0058] [Effect]

[0059] According to the present embodiment, the storage device 28 can be heated by providing the heating circuits 36 and 38 on the substrate 26 on which the storage device 28 is mounted without preparing a flexible printed circuit (FPC) having a heater circuit. Therefore, the manufacturing cost can be reduced compared to the case where the FPC having a heater circuit is used. In addition, since the process of assembling the FPC having a heater circuit into the storage device unit 20 is not required, the manufacturing man-hours can be reduced and the productivity can be improved.

[0060] Although the present disclosure has been described by taking the above-mentioned embodiments as examples, the embodiments of the present disclosure are not limited thereto.

[0061] For example, in the present embodiment, the heating circuits 36 and 38 are formed in two of the six wiring layers of the substrate 26. However, by adjusting the thickness and length of the wiring, the heating circuits may be formed in one or more than three of the wiring layers of the substrate 26. The thickness and length of the wiring of the heating circuit may be determined according to the amount of heat required to heat the storage device 28.

[0062] In addition, in the present embodiment, the third and fourth layers of the six wiring layers of the substrate 26 are heating layers 26b and 26c, and heating circuits 36 and 38 are formed on the heating layers 26b and 26c, respectively. However, the heating layer may be any of the plurality of wiring layers of the substrate 26. Preferably, the wiring layer located in the inner layer is used as the heating layer, and the heating circuit is formed. By using the wiring layer located in the inner layer as the heating layer, short circuits can be prevented.

[0063] In addition, in the present embodiment, the substrate 26 is formed by stacking 6 wiring layers, but the number of wiring layers is not limited thereto. In addition, in the present embodiment, the storage device 28 is arranged on the main surface 26a of the substrate 26, but the storage device may also be mounted on the surface opposite to the main surface 26a of the substrate 26. In this case, the ground layer may be formed in the wiring layer on the main surface 26a side of the substrate 26 located in the heat generation layer, and also in the wiring layer on the opposite side of the main surface 26a of the substrate 26 located in the heat generation layer.

[0064] In addition, in the present embodiment, the substrate 26 and the storage device 28 are arranged so as not to be in contact. However, for example, a material with high thermal conductivity may be arranged between the substrate 26 and the storage device 28, or the substrate 26 and the storage device 28 may be arranged so as to be in contact with each other. In this case, the storage device 28 can be heated more efficiently.

[0065] In addition, in the present embodiment, an SSD is used as the storage device 28, but the storage device 28 may be, for example, an HDD, a memory, or the like.

[0066] Industrial Applicability

[0067] The present disclosure can be applied to a storage device unit in which a storage device is arranged on a substrate, and an information processing device including the storage device unit.

[0068] -Description of Reference Numerals-

[0069] 20 Storage device unit

[0070] 26 substrate

[0071] 26a Main side

[0072] 26b Heating layer

[0073] 26c Heating layer

[0074] 26d Ground plane

[0075] 26e First Floor

[0076] 28 Storage Devices

[0077] 36 Heating circuit

[0078] 38 Heating circuit

[0079] 40 Ground pattern

[0080] 50 Thermistor

Claims

1. A storage device unit, comprising: a substrate having a main surface and having a plurality of stacked wiring layers; and a storage device having a plate shape having a first surface, arranged on the substrate so that the first surface faces the main surface, The plurality of wiring layers include a heat generating layer having a heat generating circuit, The plurality of wiring layers include a ground layer having a ground pattern, The ground layer is located between the heat generating layer and the storage device. The plurality of wiring layers include a layer having a thermistor, The layer having the thermistor is located between the ground layer and the storage device, The layer having the thermistor is a layer closest to the memory device among the plurality of wiring layers, The thermistor is located in a first end region opposite to a second end region where a connector is arranged on the main surface in the longitudinal direction of the substrate.

2. The storage device unit according to claim 1, wherein: The heating circuit is arranged to overlap with the storage device when viewed from a direction perpendicular to the main surface.

3. The storage device unit according to claim 2, wherein: When viewed from a direction perpendicular to the main surface, the shape of the heating circuit is substantially the same as the shape of the storage device.

4. The storage device unit according to any one of claims 1 to 3, wherein: The storage device is a solid state drive.

5. The storage device unit according to claim 1, wherein: The ground pattern is arranged to overlap with the storage device when viewed from a direction perpendicular to the main surface.

6. The storage device unit according to any one of claims 1 to 3, wherein: The first surface of the storage device is arranged to be separated from the main surface of the substrate.

7. The storage device unit according to any one of claims 1 to 3, wherein: The plurality of wiring layers include a plurality of the heat generating layers.

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