Backing, ultrasonic transduction system and manufacturing method of backing

Abstract

The invention relates to a backing, an ultrasonic transduction system and a manufacturing method of the backing. The backing comprises a first base body, a plurality of first grooves are formed in the surface, close to a piezoelectric layer, of the first base body, and each first groove is used for being filled with a conductive piece connected with a piezoelectric element of the piezoelectric layer. The first grooves are formed in the first base body, the weight of the backing is reduced, and then the weight of the ultrasonic transduction system is reduced. And each first groove of the backing is used for filling the conductive piece connected with a piezoelectric element of the piezoelectric layer, so that independent use of a flexible circuit board is avoided, and the height of the ultrasonic transduction system is reduced. Therefore, the structure that the backing is provided with the groove can reduce the weight and the size of the ultrasonic transduction system.

Description

technical field

[0001] The present application relates to the field of medical technology, in particular to a backing, an ultrasonic transducer system and a manufacturing method of the backing. Background technique

[0002] The ultrasonic transducer used in the field of ultrasonic diagnosis usually consists of piezoelectric layer, matching layer, acoustic lens, backing and electrode lead-out parts. The electrode lead-out part is a flexible circuit board. A flexible circuit board is disposed between the piezoelectric layer and the backing. Multiple conductive elements are arranged on the flexible circuit board. The conductive part is used to electrically connect the main body of the ultrasonic diagnosis system with the piezoelectric layer, so as to transmit signals of the piezoelectric array elements inside the ultrasonic transducer.

[0003] When performing ultrasonic testing, the staff will hold the ultrasonic transducer and move around the testing site to obtain testing...

Examples

Embodiment Construction

[0037] In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific implementation disclosed below.

[0038] The serial numbers numbered for components in this document, such as "first", "second", etc., are only used to classify the described objects and do not have any sequence or technical meaning. The "connection" and "connection" mention...

technical field

[0001] The present application relates to the field of medical technology, in particular to a backing, an ultrasonic transducer system and a manufacturing method of the backing. Background technique

[0002] The ultrasonic transducer used in the field of ultrasonic diagnosis usually consists of piezoelectric layer, matching layer, acoustic lens, backing and electrode lead-out parts. The electrode lead-out part is a flexible circuit board. A flexible circuit board is disposed between the piezoelectric layer and the backing. Multiple conductive elements are arranged on the flexible circuit board. The conductive part is used to electrically connect the main body of the ultrasonic diagnosis system with the piezoelectric layer, so as to transmit signals of the piezoelectric array elements inside the ultrasonic transducer.

[0003] When performing ultrasonic testing, the staff will hold the ultrasonic transducer and move around the testing site to obtain testing...

Examples

Embodiment Construction

[0037] In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific implementation disclosed below.

[0038] The serial numbers numbered for components in this document, such as "first", "second", etc., are only used to classify the described objects and do not have any sequence or technical meaning. The "connection" and "connection" mention...

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