Light emitting device, display device and backlight device thereof

Abstract

A light emitting device, a display device and a backlight device thereof, the light emitting device having a plurality of light emitting driving modules which can be spliced to a main circuit substrate. Each of the light emitting driving modules includes a carrier board, a plurality of light emitting units and a driving circuit wafer. The light emitting units are disposed on a first surface of the carrier board. The driving circuit wafer is disposed on a second surface of the carrier board and electrically connected to the light emitting units. The second surface is fixed to the main circuit substrate. The driving circuit wafer is located between the carrier board and the main circuit substrate. A plurality of first contact pads are disposed on the second surface of the carrier board. The main circuit substrate is provided with a plurality of second contact pads corresponding to the first contact pads. The first contact pads are in contact with and fixed to the second contact pads. The present application forms a modular structure of the light emitting units, the carrier board and the driving circuit wafer as a whole, so as to achieve the effect of greatly reducing the color difference between the light emitting units in different areas of the main circuit substrate.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a light emitting device, and a display device and a backlight device using the same. BACKGROUND

[0002] The statements herein are provided only for the purpose of providing background information related to the present disclosure and do not necessarily constitute the prior art.

[0003] Light-emitting diodes (LEDs) are not only applied in the field of lighting, but also popularly applied in display devices, such as backlight of liquid crystal display devices or as pixels of light-emitting diode display devices (LED Display). In the subfield of various display technologies, the design of circuit layout is an important development direction. FIG. 7A and FIG. 7B respectively show the configuration of two opposite surfaces of an LED circuit board in the prior art display device structure. The upper surface S1 of the LED circuit board S shown in FIG. 7A is provided with a plurality of light-emitting diodes S3, which are electrically connected to the driving circuit chips S4 shown in FIG. 7B through the circuit board S. A plurality of driving circuit chips S4 are arranged on the lower surface S2 of the circuit board S opposite to the upper surface S1. Therefore, the prior art circuit layout of the display device is to arrange a plurality of driving circuit chips S4 on a single circuit board S with a large area to drive the entire surface of the light-emitting diodes S3.

[0004] In recent years, some display architectures have been developed, which divide a plurality of light-emitting diodes S3 into small blocks and then insert them into a large circuit board S1. The patent application CN108630717A belongs to this category. SUMMARY

[0005] However, whether it is the prior art shown in FIG. 7A and FIG. 7B, or the display architecture of the patent application CN108630717A, the circuit layout of different areas on the circuit board is not uniform, and the plurality of driving circuit chips have high diversity, which causes the disadvantage of more complex circuit layout manufacturing. In addition, even if the light-emitting diodes are divided into small blocks as in the technical solution of the patent application CN108630717A, the circuit layout of the underlying large circuit board still needs to be individually modified according to the circuit traces of each different small area, which needs to be improved.

[0006] Therefore, some embodiments of the present disclosure disclose a light emitting device including a main circuit substrate and a plurality of light emitting driving modules. The light emitting driving modules can be spliced to the main circuit substrate. Each of the light emitting driving modules includes a carrier board, a plurality of light emitting units, and a driving circuit wafer. The carrier board has a first surface facing away from the main circuit substrate and a second surface facing the main circuit substrate. The light emitting units are disposed on the first surface of the carrier board. The driving circuit wafer is disposed on the second surface of the carrier board and electrically connected to the light emitting units. The second surface is fixed to the main circuit substrate. The driving circuit wafer is located between the carrier board and the main circuit substrate. A plurality of first contact pads are disposed on the second surface of the carrier board. The first contact pads are distributed around the driving circuit wafer, and the main circuit substrate is provided with a plurality of second contact pads corresponding to the first contact pads. At least a portion of the first contact pads are in contact with and fixed to at least a portion of the second contact pads.

[0007] In one or more embodiments of the present disclosure, the main circuit substrate has a plurality of accommodating portions, and the driving circuit wafer is accommodated in one of the accommodating portions.

[0008] In one or more embodiments of the present disclosure, the periphery of each accommodating portion is provided with the second contact pads.

[0009] In one or more embodiments of the present disclosure, the thickness of one of the first contact pads and the thickness of one of the second contact pads are less than the thickness of the driving circuit wafer.

[0010] In one or more embodiments of the present disclosure, the carrier board has a recessed portion recessed toward the first surface on the second surface, and the driving circuit wafer is disposed in the recessed portion.

[0011] In one or more embodiments of the present disclosure, each of the light emitting units is used to display a pixel.

[0012] In one or more embodiments of the present disclosure, each of the light emitting units includes a red light emitting sub-unit, a green light emitting sub-unit, and a blue light emitting sub-unit.

[0013] In one or more embodiments of the present disclosure, the light emitting device further includes an encapsulation glue disposed on the first surface of the carrier board and covering the light emitting units. The encapsulation glue contains light absorbing substances.

[0014] In one or more embodiments of the present disclosure, the carrier board is a dark or black carrier board.

[0015] In one or more embodiments of the present disclosure, the light emitting units emit white light or blue light.

[0016] In one or more embodiments of the present disclosure, the light emitting units include mini light emitting diodes (MiniLEDs), micro light emitting diodes (Micro LED), or organic light emitting diodes (OLED).

[0017] Some embodiments of the present disclosure disclose a display device comprising the light emitting device of any one or more of the preceding embodiments.

[0018] Some embodiments of the present disclosure disclose a backlight device comprising the light emitting device of any one or more of the preceding embodiments.

[0019] The above-mentioned embodiments of the present disclosure at least by mounting the driving circuit wafer on the carrier board having the light emitting unit thereon, form a modular structure integrated by the light emitting unit, the carrier board and the driving circuit wafer. The structure is further spliced to the main circuit board in units to achieve the technical effects of more consistent wiring and modification flexibility compared to the prior art, and the structural consistency between the modules can greatly reduce the color difference between the light emitting units in different areas of the main circuit board.

[0020] In order to make the above features and advantages of the present disclosure more obvious and easy to understand, the following embodiments are specifically described below with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0021] FIG. 1A A top view of a light emitting device in some embodiments of the present disclosure is shown;

[0022] FIG. 1B A cross-sectional view of a light emitting device in some embodiments of the present disclosure is shown;

[0023] FIG. 1C A cross-sectional view of a light emitting driving module in some embodiments of the present disclosure is shown;

[0024] FIG. 1D A bottom view of a light emitting driving module in some embodiments of the present disclosure is shown;

[0025] FIG. 2A A cross-sectional view of a light emitting device in some embodiments of the present disclosure is shown;

[0026] FIG. 2B A cross-sectional view of a light emitting driving module in some embodiments of the present disclosure is shown;

[0027] FIG. 3 A schematic view of a display device in some embodiments of the present disclosure is shown;

[0028] FIG. 4 A cross-sectional view of a backlight device in some embodiments of the present disclosure is shown;

[0029] FIG. 5A A cross-sectional view of a white light emitting diode package in some embodiments of the present disclosure is shown;

[0030] FIG. 5B FIG. 6A illustrates a cross-sectional view of a white light emitting diode package disposed on a carrier board in some embodiments of the present disclosure;

[0031] FIG. 5C FIG. 6A illustrates a cross-sectional view of a white light emitting diode package disposed on a carrier board in some embodiments of the present disclosure;

[0032] FIG. 6A FIG. 7A illustrates a top surface view of a single circuit board in a display device structure of the prior art;

[0033] FIG. 6B FIG. 7A illustrates a top surface view of a single circuit board in a display device structure of the prior art;

[0034] FIG. 6C FIG. 7A illustrates a top surface view of a single circuit board in a display device structure of the prior art;

[0035] FIG. 7A illustrates a top surface view of a single circuit board in a display device structure of the prior art;

[0036] FIG. 7A illustrates a top surface view of a single circuit board in a display device structure of the prior art.

[0037]

Symbol Explanation

[0038] 1000, 1000’: light emitting device

[0039] 100, 100’: main circuit substrate

[0040] 102: second contact pad

[0041] 104: housing portion

[0042] 200, 200’, 200”, 200-1”, 200-2”, 200-3”: light emitting driving module 210, 210’: carrier board

[0043] 2102, 2102’: first surface

[0044] 2104, 2104’: second surface

[0045] 2106’: recessed portion

[0046] 212: first contact pad

[0047] 230: light emitting unit

[0048] 230R: red light emitting sub-unit

[0049] 230G: green light emitting sub-unit

[0050] 230B: blue light emitting sub-unit

[0051] 230BC: blue light emitting diode wafer

[0052] 250: driving circuit wafer

[0053] 270, 270': encapsulation glue

[0054] 2702': wavelength conversion layer

[0055] 2704': filling material layer

[0056] 2000: display device

[0057] 3000: backlight device

[0058] 3010: diffusion plate

[0059] 3100: white light emitting diode package

[0060] 3110: light emitting diode

[0061] 3120: wire support

[0062] 3130: side wall

[0063] 3140: insulation part

[0064] H1: thickness sum

[0065] H2: thickness

[0066] CM: wavelength conversion material

[0067] S: circuit board

[0068] S1: upper surface

[0069] S3: light emitting unit

[0070] S2: lower surface

[0071] S4: driving circuit wafer DETAILED DESCRIPTION

[0072] To make the description of the present disclosure more detailed and complete, the following describes the illustrative description of the embodiments and specific examples of the present disclosure; but this is not the only form of implementation or use of the specific embodiments of the present disclosure. The embodiments disclosed below can be combined with each other or replaced by each other in a beneficial case, and other embodiments can be added in an embodiment without further description or explanation.

[0073] In the following description, numerous specific details are set forth to provide a thorough understanding of the embodiments below. However, embodiments of the present disclosure can be practiced without the specific details. In other instances, well-known structures and devices are shown in block diagram form.

[0074] Reference FIGS. 1A-1D . FIG. 1A A top view of a light emitting device 1000 is shown. FIG. 1B A cross-sectional view of a light emitting device 1000 is shown. FIG. 1C A cross-sectional view of a light emitting driving module 200 is shown. FIG. 1D A bottom view of a light emitting driving module 200 is shown.

[0075] Embodiments of the present disclosure disclose a light emitting device 1000, comprising a main circuit substrate 100 and a plurality of light emitting driving modules 200. The light emitting driving modules 200 can be assembled on the main circuit substrate 100. Each of the light emitting driving modules 200 comprises a carrier board 210, a plurality of light emitting units 230, and a driving circuit die 250. The carrier board 210 has a first surface 2102 facing away from the main circuit substrate 100 and a second surface 2104 facing towards the main circuit substrate 100. The light emitting units 230 are disposed on the first surface 2102 of the carrier board 210. The driving circuit die 250 is disposed on the second surface 2104 of the carrier board 210 and electrically connected to the light emitting units 230. The second surface 2104 can be fixed to the main circuit substrate 100. The driving circuit die 250 is located between the carrier board 210 and the main circuit substrate 100.

[0076] In FIG. 1D In the illustrated embodiments, a plurality of first contact pads 212 can be disposed on the second surface 2104 of the carrier board 210. The first contact pads 212 are distributed around the driving circuit die 250 and can serve as conductive pads for electrically connecting the driving circuit die 250 on the light emitting driving module 200 to other structures. The main circuit substrate 100 can also have a plurality of second contact pads 102 corresponding to the first contact pads 212. At least a portion of the first contact pads 212 are in contact with and fixed to at least a portion of the second contact pads 102. In other words, the driving circuit die 250 disposed on the carrier board 210 can be electrically connected to the main circuit substrate 100 through the first contact pads 212 and the second contact pads 102.

[0077] Again referring to FIG. 1A and FIG. 1BIn some embodiments, the main circuit board 100 has a plurality of receiving portions 104. The receiving portions 104 can be recessed spaces (not penetrating the main board) or penetrating spaces (penetrating the main board) recessed into the main circuit board 100. When the carrier board 210 is fixed to the main circuit board 100, the drive circuit chip 250 on the carrier board 210 can be received in one of the receiving portions 104. In detail, the aforementioned plurality of second contact pads 102 can be disposed around the receiving portion 104. The thickness sum H1 of the thickness of one first contact pad 212 and the thickness of one second contact pad 102 is less than the thickness H2 of the drive circuit chip 250. Therefore, when the light emitting drive module 200 is fixed to the main circuit board 100, the receiving portion 104 of the main circuit board 100 can receive the drive circuit chip 250.

[0078] The light emitting device 1000 described in the above embodiments is essentially a module that integrates the light emitting unit 230, the carrier board 210, and the drive circuit chip 250. In some embodiments, one module (i.e., one carrier board 210) can include 32 by 32 light emitting units 230, but is not limited thereto. When a plurality of light emitting drive modules 200 are disposed on one main circuit board 100, compared to the prior art (e.g., the content described in the above prior art section), the embodiments of the present disclosure can have a more uniform circuit layout, thereby greatly reducing the color difference between the light emitting units 230 in different regions of the main circuit board 100, reducing the interference of the wiring, and having the advantage that the length of the drive circuit path from the drive circuit chip 250 to the light emitting unit 230 is consistent among the modules. The above technical effects are quite lacking in the prior art, because the prior art needs to place the drive circuit chip in various positions on each main (and usually larger) circuit board according to different needs, resulting in a large difference in the length of the wiring from the drive circuit chip to the light emitting unit in different regions of the circuit board, thereby causing a difference in current and inconsistency in brightness. The embodiments of the present disclosure can substantially solve the above deficiencies of the prior art. In addition, the embodiments of the present disclosure can further avoid the occurrence of warping of the large circuit board (i.e., the main circuit board 100 in the embodiments of the present disclosure) during the process, because a smaller carrier board 210 is used as a module to make the circuit compared to the prior art in which all the main circuits are made on a large circuit board.

[0079] Reference FIG. 1CIn some embodiments, each of the light emitting units 230 of the light emitting driving module 200 is used to display a pixel, so that the light emitting device 1000 can be applied to a display device. Each of the light emitting units 230 can optionally include a red light emitting sub-unit 230R, a green light emitting sub-unit 230G, and a blue light emitting sub-unit 230B, so as to have a light emitting function with a wide enough color gamut. In order to improve contrast, the pixels or the red light emitting sub-units 230R, the green light emitting sub-units 230G, and the blue light emitting sub-units 230B can be separated by a black matrix. In some embodiments, the light emitting units 230 can further include a yellow light emitting sub-unit or a white light emitting sub-unit in addition to the red light emitting sub-units 230R, the green light emitting sub-units 230G, and the blue light emitting sub-units 230B.

[0080] In some embodiments, the red light emitting sub-unit 230R includes a red light emitting diode. In other embodiments, the red light emitting sub-unit 230R includes a blue or ultraviolet (UV) light emitting diode and a red wavelength conversion substance. The red wavelength conversion substance, for example, is a red phosphor or a red quantum dot or a mixture of a red phosphor and a red quantum dot, which can be used to absorb blue light or UV light and convert the blue light or UV light into red light.

[0081] The composition of the red phosphor, for example, includes a fluorinated phosphor A2[MF6]:Mn 4+ wherein A is selected from the group consisting of Li, Na, K, Rb, Cs, NH4, and combinations thereof, and M is selected from the group consisting of Ge, Si, Sn, Ti, Zr, and combinations thereof. Alternatively, the red phosphor can include (Sr,Ca)S:Eu, (Ca,Sr)2Si5N8:Eu, CaAlSiN3:Eu, (Sr,Ba)3SiO5:Eu, but is not limited thereto. The composition of the red quantum dot, for example, includes cadmium selenide (CdSe), perovskite quantum dot CsPb(Br 1-b I b wherein 0.5≦b≦1, but is not limited thereto.

[0082] In some embodiments, the green light emitting sub-unit 230G includes a green light emitting diode. In other embodiments, the green light emitting sub-unit 230G includes a blue or UV light emitting diode and a green wavelength conversion substance. The green wavelength conversion substance, for example, is a green phosphor or a green quantum dot or a mixture of a green phosphor and a green quantum dot, which can be used to absorb blue light or UV light and convert the blue light or UV light into green light.

[0083] The composition of the green phosphor, for example, includes Beta-SiAlON (Si 6-z Al z O z N 8-z :Eu 2+) or the like, but not limited thereto. Green quantum dots include CdSe, perovskite quantum dots CsPb(Cl 1-b I b )3 where 0 < b < 0.5, but not limited thereto.

[0084] In some embodiments, the blue light emitting sub-unit 230B includes a blue light emitting diode. In other embodiments, the blue light emitting sub-unit 230B includes a blue or UV light emitting diode with a blue wavelength conversion substance. The blue wavelength conversion substance is, for example, a blue phosphor or a blue quantum dot or a mixture of a blue phosphor and a blue quantum dot, which can be used to absorb blue or UV light and convert to a desired blue light wavelength distribution.

[0085] The composition of the blue phosphor includes, for example, a material selected from the group consisting of Sr4Al 14 O 25 :Eu, Dy and CaAl2O4:Eu, Nd, but not limited thereto. The blue quantum dots include CdSe, perovskite quantum dots CsPb(Cl a Br 1-a )3 where 0 < a < 1, but not limited thereto.

[0086] In some embodiments, the light emitting driving module 200 of the light emitting device 1000 further includes an encapsulation glue 270 disposed on the first surface 2102 of the carrier board 210 and covering the light emitting units 230. The encapsulation glue 270 can contain light absorbing substances, such as dark or black light absorbing substances, so that the light emitting device 1000 can absorb, for example, ambient light when used in the display field to improve the brightness contrast of the display. The carrier board 210 can also be a dark or black carrier board to improve the brightness contrast of the display, but not limited thereto. The dark or black carrier board is, for example, a carrier board made of bismaleimide-trazine resin (BT resin).

[0087] The red light emitting diode, the green light emitting diode and the blue light emitting diode can be generally common light emitting diode sizes, or smaller light emitting diodes, such as mini light emitting diodes (Mini LED) or micro light emitting diodes (Micro LED), can be selected according to requirements. In addition, the light emitting units 230 can also select to use organic light emitting diodes (OLED). For example, the red light emitting sub-unit 230R can be a red light emitting diode, a red mini light emitting diode, a red micro light emitting diode or a red organic light emitting diode. The size of the aforementioned mini light emitting diode is about 100 microns or more to 300 microns in lateral length, and the size of the micro light emitting diode is about 100 microns or less, more commonly in the range of 50 microns or less in lateral length.

[0088] ReferenceFIG. 2A and FIG. 2B . FIG. 2A A cross-sectional view of a light emitting device 1000' is shown in some embodiments of the present disclosure. FIG. 2B A cross-sectional view of a light emitting driving module 200' is shown in some embodiments of the present disclosure. Some embodiments of the present disclosure provide another type of structure of a light emitting device 1000'. Compared with the above-mentioned embodiments, the light emitting device 1000' described herein has the accommodation portion 104 (see FIG. 1) of the main circuit substrate 100 moved to the light emitting driving module 200'. FIG. 1B Compared with the above-mentioned embodiments, the light emitting device 1000' described herein has the accommodation portion 104 (see FIG. 1) of the main circuit substrate 100 moved to the light emitting driving module 200'. FIG. 1B In detail, the carrier board 210' of the light emitting driving module 200' has a recessed portion 2106' recessed toward the first surface 2102' on the second surface 2104'. In this structure, the driving circuit wafer 250 is disposed in the recessed portion 2106' of the carrier board 210'.

[0089] Since the space for accommodating the driving circuit wafer 250 is disposed in the carrier board 210' of each light emitting driving module 200' in the embodiments described by FIG. 2A and FIG. 2B , the space for digging holes in the main circuit substrate 100' is saved, i.e., the accommodation portion 104 is not needed. In this way, the space for wiring and circuit layout of the main circuit substrate 100 can be further increased. For example, the main circuit substrate 100 originally needs multiple layers of wiring, but in the embodiments described by FIG. 2A and FIG. 2B , the number of layers of wiring needed by the main circuit substrate 100' will be reduced, thereby increasing the space utilization of the main circuit substrate 100'.

[0090] Reference is made to FIG. 3 . FIG. 3 A schematic view of a display device 2000 is shown in some embodiments of the present disclosure. The light emitting device 1000 and the light emitting device 1000' described in the above-mentioned embodiments can be applied to make the display device 2000. FIG. 3 Examples include a display device 2000 in which the light emitting device 1000 or the light emitting device 1000' is used.

[0091] Reference is made to FIGS. 1A-4 . FIG. 4 A cross-sectional view of a backlight device 3000 is shown in some embodiments of the present disclosure. The light emitting device 1000 and the light emitting device 1000' described in the above-mentioned embodiments can be applied to make the backlight device 3000, especially when the light emitting unit 230 emits white light. It goes without saying that the aforementioned white light can be formed by mixing the red light emitting sub-unit 230R, the green light emitting sub-unit 230G, and the blue light emitting sub-unit 230B shown in the above-mentioned figures. In this case, the encapsulation glue 270 does not add light absorbing substances. FIG. 4Examples include backlight apparatus 3000 in which light emitting apparatus 1000 or light emitting apparatus 1000' is used. Diffusion plate 3010 elements are schematically depicted in the figures as would typically be included in backlight apparatus 3000, but diffusion plate 3010 is not limiting of the structure of backlight apparatus 3000.

[0092] Since there are many ways to make a white light emitting unit 230, two other example ways that are different from the three color light source are listed below for illustration, but are not intended to limit the scope of the disclosure.

[0093] The first way is that each light emitting unit 230 can be a white light emitting diode package 3100, which can refer to FIG. 4 light emitting driving module 200" of the disclosure. FIG. 5A A cross-sectional view of white light emitting diode package 3100 in some embodiments of the disclosure is shown. In some embodiments, white light emitting diode package 3100 includes a blue or UV light emitting diode (collectively labeled as light emitting diode 3110 in the figures) and a yellow wavelength conversion substance. The yellow wavelength conversion substance can be yellow phosphor or yellow quantum dots or a mixture of yellow phosphor and quantum dots, where the yellow phosphor can be, for example, Yttrium Aluminum Garnet (YAG) or Silicate, and the yellow quantum dots can be, for example, CdSe. In some embodiments, white light emitting diode package 3100 includes a blue light emitting diode 3110 and two wavelength conversion substances, such as red and green. In some embodiments, white light emitting diode package 3100 includes a UV light emitting diode and three wavelength conversion substances, such as red, green and blue. The above-mentioned four wavelength conversion substances, such as red / yellow / green / blue, can each include phosphor or quantum dots or a mixture of phosphor and quantum dots, and are not limited thereto. The composition of red / green / blue phosphor and quantum dots can refer to the above description and will not be repeated here. The four wavelength conversion substances are collectively labeled as wavelength conversion substance CM in the figures. FIG. 5A A cross-sectional view of white light emitting diode package 3100 in some embodiments of the disclosure is shown. In some embodiments, white light emitting diode package 3100 includes a blue or UV light emitting diode (collectively labeled as light emitting diode 3110 in the figures) and a yellow wavelength conversion substance. The yellow wavelength conversion substance can be yellow phosphor or yellow quantum dots or a mixture of yellow phosphor and quantum dots, where the yellow phosphor can be, for example, Yttrium Aluminum Garnet (YAG) or Silicate, and the yellow quantum dots can be, for example, CdSe. In some embodiments, white light emitting diode package 3100 includes a blue light emitting diode 3110 and two wavelength conversion substances, such as red and green. In some embodiments, white light emitting diode package 3100 includes a UV light emitting diode and three wavelength conversion substances, such as red, green and blue. The above-mentioned four wavelength conversion substances, such as red / yellow / green / blue, can each include phosphor or quantum dots or a mixture of phosphor and quantum dots, and are not limited thereto. The composition of red / green / blue phosphor and quantum dots can refer to the above description and will not be repeated here. The four wavelength conversion substances are collectively labeled as wavelength conversion substance CM in the figures.

[0094] FIG. 5B A cross-sectional view of white light emitting diode package 3100 in some embodiments of the disclosure is shown. In some embodiments, white light emitting diode package 3100 includes a blue or UV light emitting diode (collectively labeled as light emitting diode 3110 in the figures) and a yellow wavelength conversion substance. The yellow wavelength conversion substance can be yellow phosphor or yellow quantum dots or a mixture of yellow phosphor and quantum dots, where the yellow phosphor can be, for example, Yttrium Aluminum Garnet (YAG) or Silicate, and the yellow quantum dots can be, for example, CdSe. In some embodiments, white light emitting diode package 3100 includes a blue light emitting diode 3110 and two wavelength conversion substances, such as red and green. In some embodiments, white light emitting diode package 3100 includes a UV light emitting diode and three wavelength conversion substances, such as red, green and blue. The above-mentioned four wavelength conversion substances, such as red / yellow / green / blue, can each include phosphor or quantum dots or a mixture of phosphor and quantum dots, and are not limited thereto. The composition of red / green / blue phosphor and quantum dots can refer to the above description and will not be repeated here. The four wavelength conversion substances are collectively labeled as wavelength conversion substance CM in the figures. FIG. 5BA plurality of white light emitting diode packages 3100 is disposed on the carrier board 210 of the light emitting driving module 200 to provide a white light emitting device 1000. FIG. 5C A cross-sectional view of a white light emitting diode package 3100 disposed on a carrier board 210' is shown in some embodiments of the present disclosure. Please refer to FIG. 5C A plurality of white light emitting diode packages 3100 is disposed on the carrier board 210' of the light emitting driving module 200' to provide a white light emitting device 1000. Similarly, a plurality of light emitting driving modules 200' can be disposed on the main circuit board 100 to provide a backlight device. FIG. 1A A plurality of light emitting driving modules 200 or FIG. 5B A plurality of light emitting driving modules 200' can be disposed on the main circuit board 100 to provide a backlight device. FIG. 5C

[0095] The second case is to design each light emitting unit 230 as a blue light emitting diode wafer 230BC, i.e., all light sources of the light emitting driving module 200" on the main circuit board 100 are replaced by blue light emitting diode wafers 230BC. Please refer to FIGS. 6A-6C The embodiments shown in the three figures can be used to replace the light emitting driving module 200 in FIGS. 1B-1D In addition, after corresponding modifications are made to the embodiments of FIG. 2A and FIG. 2B , similar embodiments of FIGS. 6A-6C can be formed, but the carrier board 210 is replaced by the carrier board 210'. FIG. 6A A cross-sectional view of a light emitting driving module 200-1" is shown in some embodiments of the present disclosure. FIG. 6B A cross-sectional view of a light emitting driving module 200-2" is shown in some other embodiments of the present disclosure. FIG. 6C A cross-sectional view of a light emitting driving module 200-3" is shown in some other embodiments of the present disclosure. In the embodiments shown in the three figures, the light emitting unit 230 uses a blue light emitting diode wafer 230BC to emit blue light. In addition, the package adhesive 270' includes a wavelength conversion layer 2702' (please refer to FIG. 6A ) or a wavelength conversion layer 2702' plus a filler material layer 2704' (please refer to FIG. 6B ). In some embodiments, the filler material layer 2704' and the wavelength conversion layer 2702' are sequentially stacked on the carrier board 210 and the blue light emitting diode wafer 230BC, wherein the filler material layer 2704' contacts the carrier board 210 and the blue light emitting diode wafer 230BC and covers the light emitting path of the blue light emitting diode wafer 230BC. The filler material layer 2704' and the carrier board 210 jointly enclose the blue light emitting diode wafer 230BC. In the embodiments of FIG. 6B , the wavelength conversion layer 2702' contacts the filler material layer 2704'. In some other embodiments, as shown in FIG. 6C ​As shown, the wavelength conversion layer 2702' and the filling material layer 2704' are separated. The separated portion can be air or other material layers. It should be noted that... FIGS. 6A-6C In the embodiment shown, the encapsulating adhesive 270' is substantially transparent and does not contain the light-absorbing (black) substance found in the other embodiments described above.

[0096] Furthermore, the aforementioned wavelength conversion layer 2702' may include phosphors, quantum dots, or a combination of both. Phosphors and quantum dots in... FIGS. 6A-6C The wavelength conversion layer 2702' is illustrated with dots, and reference numerals are omitted. In one embodiment, the wavelength conversion layer 2702' includes a yellow wavelength conversion material. The yellow wavelength conversion material may be a yellow phosphor, a yellow quantum dot, or a mixture of yellow phosphor and quantum dots, wherein the yellow phosphor may be, for example, YAG phosphor or silicate phosphor, and the yellow quantum dot may be, for example, CdSe. In one embodiment, the wavelength conversion layer 2702' includes two wavelength conversion materials, red and green, wherein the red wavelength conversion material may be a red phosphor, a quantum dot, or a mixture of phosphor and quantum dots, and the green wavelength conversion material may be a green phosphor, a quantum dot, or a mixture of phosphor and quantum dots. The composition of the red phosphor, red quantum dot, green phosphor, and green quantum dot can be referred to the above description and will not be repeated here. Similarly, similar... FIG. 1A Multiple FIG. 6A The light-emitting driver module 200-1” or FIG. 6B The light-emitting driver module 200-2” or FIG. 6C The light-emitting driver module 200-3” is spliced ​​onto the main circuit board 100 as a backlight device.

[0097] In summary, the embodiments disclosed herein provide a light-emitting device, as well as a display device and a backlight device having this light-emitting device therein. By mounting a driving circuit chip on a carrier board with light-emitting units thereon to form a light-emitting driving module, the overall architecture of the light-emitting device presents a stacked sequence of light-emitting unit-carrier board-driving circuit chip-main circuit substrate. The light-emitting device with the features of this disclosure achieves a more uniform circuit layout compared to prior art due to the modularization of the light-emitting unit, carrier board, and driving circuit chip as a whole. It also significantly reduces color differences between light-emitting units in different areas of the main circuit substrate, reduces wiring interference, and maintains consistent driving circuit path length from the driving circuit chip to the light-emitting unit between modules. Furthermore, the light-emitting device is more convenient and faster to manufacture and test than existing technologies.

[0098] Although the present disclosure has been described with reference to specific embodiments, it is not intended to be limited to the details described herein, but rather it is intended to cover all alternatives, modifications, and equivalents as can be included within the spirit and scope of the disclosure as defined by the appended claims.

Claims

1. A light emitting device, characterized by, The application relates to a light emitting device, comprising: a main circuit substrate having a plurality of accommodating portions; and a plurality of light emitting driving modules capable of being spliced to the main circuit substrate, each of the plurality of light emitting driving modules comprising: a carrier plate having a first surface facing away from the main circuit substrate and a second surface facing the main circuit substrate; a plurality of red light emitting subunits, a plurality of green light emitting subunits and a plurality of blue light emitting subunits arranged on the first surface of the carrier plate; and a driving circuit wafer arranged on the second surface of the carrier plate and electrically connected to the plurality of red light emitting subunits, the plurality of green light emitting subunits and the plurality of blue light emitting subunits, wherein the second surface is fixed to the main circuit substrate, the driving circuit wafer is located between the carrier plate and the main circuit substrate, and the driving circuit wafer is accommodated in one of the plurality of accommodating portions; wherein a plurality of first contact pads are arranged on the second surface of the carrier plate and distributed around the driving circuit wafer, and the main circuit substrate is provided with a plurality of second contact pads corresponding to the plurality of first contact pads, at least a part of the plurality of first contact pads being in contact with and directly fixed to at least a part of the plurality of second contact pads.

2. The light emitting device of claim 1, wherein The periphery of each of the accommodating portions is provided with the plurality of second contact pads.

3. The light emitting device of claim 1, wherein The thickness sum of the thickness of one of the plurality of first contact pads and the thickness of one of the plurality of second contact pads is less than the thickness of the driving circuit wafer.

4. The light emitting device of claim 1, wherein One of the plurality of red light emitting subunits, one of the plurality of green light emitting subunits and one of the plurality of blue light emitting subunits are used to display a pixel.

5. The light emitting device of claim 4, wherein The application further comprises a packaging glue arranged on the first surface of the carrier plate to cover the plurality of red light emitting subunits, the plurality of green light emitting subunits and the plurality of blue light emitting subunits, wherein the packaging glue contains light-absorbing substances.

6. The light emitting device of claim 4, wherein The carrier plate is a dark or black carrier plate.

7. The light emitting device of claim 1, wherein The plurality of red light emitting subunits, the plurality of green light emitting subunits and the plurality of blue light emitting subunits mix light to emit white light or blue light.

8. The light emitting device of claim 1, wherein Each of the light emitting units comprises a one-millimeter light emitting diode, a micro light emitting diode or an organic light emitting diode.

9. A display device, characterized by comprising: The application relates to a light emitting device, comprising:

10. A backlight device, characterized by comprising: a main circuit substrate having a plurality of accommodating portions; and a plurality of light emitting driving modules capable of being spliced to the main circuit substrate, each of the plurality of light emitting driving modules comprising: a carrier plate having a first surface facing away from the main circuit substrate and a second surface facing the main circuit substrate; a plurality of red light emitting subunits, a plurality of green light emitting subunits and a plurality of blue light emitting subunits arranged on the first surface of the carrier plate; and a driving circuit wafer arranged on the second surface of the carrier plate and electrically connected to the plurality of red light emitting subunits, the plurality of green light emitting subunits and the plurality of blue light emitting subunits, wherein the second surface is fixed to the main circuit substrate, the driving circuit wafer is located between the carrier plate and the main circuit substrate, and the driving circuit wafer is accommodated in one of the plurality of accommodating portions; wherein a plurality of first contact pads are arranged on the second surface of the carrier plate and distributed around the driving circuit wafer, and the main circuit substrate is provided with a plurality of second contact pads corresponding to the plurality of first contact pads, at least a part of the plurality of first contact pads being in contact with and directly fixed to at least a part of the plurality of second contact pads. The periphery of each of the accommodating portions is provided with the plurality of second contact pads. The thickness sum of the thickness of one of the plurality of first contact pads and the thickness of one of the plurality of second contact pads is less than the thickness of the driving circuit wafer. One of the plurality of red light emitting subunits, one of the plurality of green light emitting subunits and one of the plurality of blue light emitting subunits are used to display a pixel. The application further comprises a packaging glue arranged on the first surface of the carrier plate to cover the plurality of red light emitting subunits, the plurality of green light emitting subunits and the plurality of blue light emitting subunits, wherein the packaging glue contains light-absorbing substances. The carrier plate is a dark or black carrier plate. The plurality of red light emitting subunits, the plurality of green light emitting subunits and the plurality of blue light emitting subunits mix light to emit white light or blue light. Each of the light emitting units comprises a one-millimeter light emitting diode, a micro light emitting diode or an organic light emitting diode. The application relates to a light emitting device, comprising: a main circuit substrate having a plurality of accommodating portions; and a plurality of light emitting driving modules capable of being spliced to the main circuit substrate, each of the plurality of light emitting driving modules comprising: a carrier plate having a first surface facing away from the main circuit substrate and a second surface facing the main circuit substrate; a plurality of red light emitting subunits, a plurality of green light emitting subunits and a plurality of blue light emitting subunits arranged on the first surface of the carrier plate; and a driving circuit wafer arranged on the second surface of the carrier plate and electrically connected to the plurality of red light emitting subunits, the plurality of green light emitting subunits and the plurality of blue light emitting subunits, wherein the second surface is fixed to the main circuit substrate, the driving circuit wafer is located between the carrier plate and the main circuit substrate, and the driving circuit wafer is accommodated in one of the plurality of accommodating portions; wherein a plurality of first contact pads are arranged on the second surface of the carrier plate and distributed around the driving circuit wafer, and the main circuit substrate is provided with a plurality of second contact pads corresponding to the plurality of first contact pads, at least a part of the plurality of first contact pads being in contact with and directly fixed to at least a part of the plurality of second contact pads.

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