Speaker structure and electronic equipment

Abstract

The present disclosure relates to a speaker structure and electronic equipment. The speaker structure includes a speaker body and a heat dissipation portion. The heat dissipation portion is fixedly connected to the speaker body. The heat dissipation portion and the speaker body form a rear sound cavity. The rear sound cavity is filled with a heat dissipation fluid. The heat dissipation coefficient of the heat dissipation fluid is greater than the heat dissipation coefficient of air. The speaker structure also includes an adsorption portion arranged inside the rear sound cavity. The adsorption portion is connected to the heat dissipation portion. When the heat dissipation fluid is heated, the adsorption portion transfers the heat to the heat dissipation portion through the adsorption portion. In this speaker structure, when the speaker body is heated, the heat dissipation fluid in the rear sound cavity is heated, and the heat is transferred to the heat dissipation portion through the adsorption portion for heat dissipation. This improves the heat dissipation efficiency, better avoids the problem of speaker structure damage due to untimely heat dissipation, effectively increases the power of the speaker structure, and then improves the volume and sound quality of the speaker structure, better meets user needs, and enhances the user experience.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic equipment, and in particular to a speaker structure and electronic equipment. Background Art

[0002] With the continuous advancement of technology, electronic devices are becoming more and more popular as a tool. People have higher and higher requirements for the volume and sound quality of speakers in electronic devices. The power of speakers is getting higher and higher, resulting in speaker heat dissipation becoming more and more a bottleneck restricting the improvement of volume and sound quality.

[0003] In addition, the heat source of the speaker is the voice coil. If the heat is not dissipated in time, it is easy to cause damage to the voice coil, making the speaker unusable. Summary of the Invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides a speaker structure and an electronic device.

[0005] According to a first aspect of an embodiment of the present disclosure, a speaker structure is provided, comprising a speaker body and a heat dissipation portion, the heat dissipation portion being fixedly connected to the speaker body, the heat dissipation portion and the speaker body forming a rear sound cavity, the rear sound cavity being filled with a heat dissipation fluid, the heat dissipation coefficient of the heat dissipation fluid being greater than the heat dissipation coefficient of air;

[0006] The speaker structure further includes an adsorption portion disposed inside the rear sound cavity, wherein the adsorption portion is connected to the heat dissipation portion. When the heat dissipation fluid is heated, the heat is transferred to the heat dissipation portion through the adsorption portion.

[0007] Wherein, the heat dissipation fluid includes an inert gas having a heat dissipation coefficient greater than that of air.

[0008] Wherein, the heat dissipation fluid includes helium.

[0009] Wherein, when the heat dissipation fluid is an inert gas, the adsorption part is a molecular sieve corresponding to the inert gas.

[0010] Wherein, the heat dissipation fluid includes magnetic fluid.

[0011] Wherein, when the heat dissipation fluid is magnetic fluid, the adsorption part is an air molecular sieve.

[0012] Wherein, the heat dissipation portion includes a metal sheet.

[0013] Wherein, the metal sheet is a steel sheet.

[0014] The speaker structure further includes a mesh portion fixedly connected to the speaker body, the mesh portion is arranged on a side of the adsorption portion away from the heat dissipation portion, and the adsorption portion is fixed between the heat dissipation portion and the mesh portion.

[0015] Wherein, the speaker body includes a bracket, and the mesh portion and the heat dissipation portion are fixedly connected to the bracket.

[0016] Wherein, when the heat dissipation fluid is an inert gas, the mesh portion comprises a metal mesh;

[0017] The heat dissipation portion includes a metal sheet;

[0018] The metal mesh and / or the metal sheet are fixedly connected to the bracket by injection molding.

[0019] Wherein, when the heat dissipation fluid is magnetic fluid, the mesh portion includes a nylon mesh.

[0020] The speaker body further includes a magnet and a voice coil arranged inside the magnet. A rear air outlet is provided on the magnet, and the heat dissipation fluid contacts the voice coil through the rear air outlet to dissipate heat.

[0021] According to a second aspect of an embodiment of the present disclosure, an electronic device is provided, on which the speaker structure as described above is provided.

[0022] The technical solutions provided by the embodiments of the present disclosure may include the following beneficial effects: the speaker structure of the present disclosure fills the rear sound cavity with a heat dissipation fluid having a heat dissipation coefficient greater than that of air, and is provided with a connected adsorption portion and heat dissipation portion. When the speaker body heats up, the heat dissipation fluid in the rear sound cavity is heated, and the heat is transferred from the heat dissipation fluid to the adsorption portion, which then transfers the heat to the heat dissipation portion through the adsorption portion for heat dissipation. The structure of the present disclosure can effectively improve heat dissipation efficiency, better avoid the problem of speaker structure damage due to untimely heat dissipation, effectively increase the power of the speaker structure, and improve the volume and sound quality of the speaker structure, better meet user needs, and enhance the user experience.

[0023] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0025] Figure 1 is a schematic structural diagram of a speaker structure according to an exemplary embodiment. DETAILED DESCRIPTION

[0026] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present invention, as detailed in the appended claims.

[0027] The source of heat in the speaker structure is the voice coil. In related technologies, the voice coil primarily dissipates heat through air. However, air has a heat dissipation coefficient of 0.023, making it a poor heat dissipation effect. Furthermore, air has a complex composition and poor stability, which can pose certain risks to the speaker structure.

[0028] In order to improve the heat dissipation effect of the speaker structure, graphite sheets are added around the speaker structure. Although this can achieve a certain heat dissipation effect, the heat dissipation effect is poor because it cannot directly contact the voice coil for heat dissipation.

[0029] Whether it is air cooling or heat dissipation by adding graphite sheets, neither can effectively dissipate the heat of the voice coil, thereby limiting the power of the speaker structure, affecting the volume and sound quality of the speaker structure, and failing to meet user demands for speaker quality.

[0030] The present disclosure provides a speaker structure, in which a heat dissipation fluid is filled in a rear sound cavity. The heat dissipation coefficient of the heat dissipation fluid is greater than that of air. The heat dissipation fluid is used to replace the original air, thereby improving the heat dissipation efficiency of the speaker structure, dissipating the heat of the voice coil in a more targeted manner, better avoiding the problem of damage to the voice coil or other structures due to untimely heat dissipation, improving the power of the speaker structure, and improving the volume and sound quality of the speaker structure, better meeting the needs of users, and improving the user experience.

[0031] In an exemplary embodiment, a speaker structure is provided, referring to Figure 1 As shown, the speaker structure includes a speaker body 1 and a heat dissipation part 2, and the heat dissipation part 2 is fixedly connected to the speaker body 1. The fixed connection method is, for example, injection molding connection, adhesive connection, clip connection, or fixed connection by fasteners, so as to ensure the overall structural stability of the speaker structure. The heat dissipation part 2 and the speaker body 1 form a rear sound cavity 3, and the rear sound cavity 3 is filled with a heat dissipation fluid. It should be noted that the amount of heat dissipation fluid filled in the rear sound cavity 3 can be set as needed. For example, when a better heat dissipation effect is required, the amount of heat dissipation fluid can be appropriately increased; when the heat dissipation requirements are lower, the amount of heat dissipation fluid can be appropriately reduced to save costs. In addition, in order to prevent the heat dissipation fluid from leaking, the rear sound cavity 3 is a closed structure.

[0032] When the speaker body 1 generates heat, for example, when the voice coil 13 generates heat, the heat dissipating fluid absorbs the heat generated by the speaker body 1 and dissipates it through other structures, thereby reducing the temperature of the speaker body 1. Specifically, the heat dissipating fluid absorbs the heat generated by the voice coil 13, thereby reducing the temperature of the voice coil 13 and preventing damage to the voice coil 13. The heat dissipation coefficient of the heat dissipating fluid is greater than that of air. Therefore, compared to air, the heat dissipation efficiency of the heat dissipating fluid is higher, resulting in a better heat dissipation effect, thereby preventing damage to the voice coil 13.

[0033] The speaker structure also includes an adsorption portion 4 disposed within the rear acoustic cavity 3. Adsorption portion 4 is connected to heat dissipation portion 2. "Connected" here includes both contact and connection. For example, adsorption portion 4 is in contact with heat dissipation portion 2. When the heat dissipation fluid absorbs heat from the speaker body 1, the heat dissipation fluid is heated. The heat dissipation fluid is adsorbed by adsorption portion 4, transferring the heat to adsorption portion 4. Adsorption portion 4 is in contact with heat dissipation portion 2, transferring the heat to heat dissipation portion 2 through adsorption portion 4, achieving rapid heat dissipation.

[0034] In one example, the heat dissipation fluid is a gas. When the heat dissipation fluid absorbs the heat emitted by the speaker body 1, the heat dissipation fluid is heated, and the air pressure in the rear sound cavity 3 increases. In order to relieve the air pressure in the rear sound cavity 3, the heat dissipation fluid moves toward the adsorption part 4 and is adsorbed by the adsorption part 4. The heat is transferred to the heat dissipation part 2 through the adsorption part 4 to achieve rapid heat dissipation.

[0035] In another example, the heat dissipation fluid is a liquid. In this case, in addition to the heat dissipation fluid, the rear sound cavity 3 also includes some air. When the speaker body 1 is heated, the temperature of the heat dissipation fluid and the air in the rear sound cavity 3 will increase, causing the air pressure in the rear sound cavity 3 to increase. In order to relieve the air pressure in the rear sound cavity 3, the adsorption part 4 adsorbs part or all of the air. At the same time, the speaker structure can also transfer heat to the heat dissipation part 2 through the adsorption part 4, and the heat dissipation part 2 transfers the heat to the outside of the speaker structure to improve the heat dissipation effect.

[0036] It should be noted that in this speaker structure, the adsorption portion 4 is not only used to transfer heat to the heat dissipation portion 2, but also plays a role in expanding the volume of the rear sound cavity 3 by adsorbing the gas or liquid in the rear sound cavity 3 to achieve the purpose of maintaining the air pressure balance in the rear sound cavity 3. The gas or liquid adsorbed by the adsorption portion 4 can be a heat dissipation fluid or other substances.

[0037] In an exemplary embodiment, a speaker structure is provided, referring to Figure 1As shown, this speaker structure is a further improvement on the above-mentioned speaker structure. In this speaker structure, the heat dissipation fluid is an inert gas with a heat dissipation coefficient greater than that of air. An example of an inert gas is helium, which has a heat dissipation coefficient of 0.144. Compared to air, when helium is used as the heat dissipation fluid, the heat dissipation efficiency of the speaker structure can be increased by approximately 7 times, providing heat dissipation conditions for increasing the power of the speaker structure, thereby significantly improving the volume and sound quality of the speaker structure.

[0038] Of course, it's understandable that when choosing a gas as a cooling fluid, two principles should be followed: first, the gas's heat dissipation coefficient should be greater than air to improve heat dissipation; second, the gas's stability should be good to avoid chemical reactions with the speaker's structural materials. Therefore, in addition to helium, other gases that meet these two conditions can also be used as cooling fluids.

[0039] When the heat dissipation fluid is an inert gas, the adsorption part 4 is a molecular sieve corresponding to the inert gas. For example, when the inert gas is helium, the adsorption part 4 is a helium molecular sieve, which is used to adsorb helium or release the helium adsorbed therein. When the voice coil 13 heats up, the air pressure in the rear sound cavity 3 increases, the helium molecules move toward the helium molecular sieve, and transfer the heat to the adsorption part 4. The adsorption part 4 transfers the heat to the heat dissipation part 2 through contact heat transfer, and the heat dissipation part 2 dissipates the heat to the outside of the speaker structure; when the voice coil 13 cools down, the air pressure in the rear sound cavity 3 decreases, the helium molecules break away from the helium molecular sieve, and re-enter the rear sound cavity 3 to continue heat conduction. Through the cooperation of helium, helium molecular sieve and heat dissipation part 2, the heat dissipation efficiency of the speaker structure is improved, and timely heat dissipation of the speaker structure is better ensured.

[0040] In an exemplary embodiment, a speaker structure is provided, referring to Figure 1 As shown, this horn structure is an improvement over the horn structure described above where the heat dissipation fluid is an inert gas. In this horn structure, the heat dissipation portion 2 is a metal sheet to improve its heat dissipation efficiency. For example, the metal sheet can be a steel sheet, which not only ensures heat dissipation efficiency but also ensures the structural strength of the heat dissipation portion 2.

[0041] The speaker structure also includes a mesh portion 6 fixedly connected to the speaker body 1. The mesh portion 6 is located on the side of the adsorption portion 4 facing away from the heat dissipation portion 2. The adsorption portion 4 is fixed between the heat dissipation portion 2 and the mesh portion 6 to ensure the normal operation of the adsorption portion 4. The mesh portion 6 is a metal mesh, for example, a steel mesh. The adsorption portion 4 is arranged between the metal sheet and the metal mesh to ensure the reliable installation of the adsorption portion 4. In other words, the metal sheet and the mesh portion 6, which serve as the support structure of the heat dissipation portion 2, serve to support the adsorption portion 4.

[0042] The speaker body 1 includes a bracket 11, to which the mesh portion 6 and the heat dissipation portion 2 are fixedly connected. The fixed connection herein includes a snap-on connection, an adhesive connection, an injection molding connection, or a connection via fasteners. The suction portion 4 is disposed within the space enclosed by the mesh portion 6, the bracket 11, and the heat dissipation portion 2. The bracket 11 is made of a plastic material. The mesh portion 6, the heat dissipation portion 2, and the bracket 11 are fixedly connected via injection molding, thereby improving the reliability of the connection between the mesh portion 6 and the bracket 11, and between the heat dissipation portion 2 and the bracket 11, and thereby ensuring that the suction portion 4 is securely positioned within the space enclosed by the mesh portion 6, the bracket 11, and the heat dissipation portion 2. Furthermore, because the heat dissipation portion 2 is a sheet metal and the mesh portion 6 is a metal mesh, the heat dissipation portion 2, the mesh portion 6, and the bracket 11 can be fixedly connected via injection molding. This not only facilitates and reduces processing costs, but also improves connection reliability. Furthermore, the use of injection molding to securely connect the heat dissipation portion 2, the mesh portion 6, and the bracket 11 can also reduce the weight of the speaker structure to a certain extent due to the lightweight plastic.

[0043] In one example, the heat dissipation fluid is helium, the adsorption part 4 is a helium molecular sieve, and the helium molecular sieve is fixed in the space surrounded by the metal mesh, the metal sheet and the bracket 11. The metal mesh and the metal sheet can not only provide a better and more reliable placement position for the helium molecular sieve, but also improve the heat dissipation effect. When the speaker body 1 is heated, the helium absorbs heat, the air pressure in the rear sound cavity 3 increases, the helium molecules pass through the metal mesh to move toward the helium molecular sieve, and transfer the heat to the metal sheet for heat dissipation. When the helium cools down, the air pressure in the rear sound cavity 3 decreases, the helium molecules break away from the helium molecular sieve, pass through the metal mesh and enter the rear sound cavity 3. Through the coordination of helium, helium molecular sieve, metal sheet and metal mesh, the heat dissipation efficiency of the speaker structure is improved, and it is better to ensure that the heat generated during the operation of the speaker structure is promptly dissipated to the outside of the speaker structure, so as to avoid damage to the speaker structure due to operation at high temperature.

[0044] In an exemplary embodiment, a speaker structure is provided, referring to Figure 1 As shown, the heat dissipation fluid in the speaker structure is magnetic fluid. In addition to being filled with magnetic fluid, the rear sound cavity 3 also retains some air, and the adsorption part 4 is an air molecular sieve to avoid damage to the speaker structure due to thermal expansion and contraction.

[0045] In addition, the speaker structure of this embodiment differs from the above-mentioned speaker structure in that the bracket 11 of this speaker structure is made of metal material to cooperate with the magnetic fluid for heat dissipation. The mesh portion 6 is a nylon mesh to prevent the magnetic fluid from adsorbing on the mesh portion 6 and affecting the heat dissipation effect.

[0046] When speaker body 1 heats up, the temperature of the magnetic fluid and the air in rear cavity 3 both rise, causing the air pressure in rear cavity 3 to increase. Air molecules move toward the air molecular sieve, transferring heat to the metal sheet for dissipation. Simultaneously, after absorbing heat, the magnetic fluid can also dissipate heat through metal bracket 11. When voice coil 13 cools down, the air pressure in rear cavity 3 decreases, causing air molecules to escape from the air molecular sieve. The coordination of magnetic fluid, air, air molecular sieve, bracket 11, and heat dissipation unit 2 improves the heat dissipation efficiency of the speaker structure, better ensuring timely heat dissipation from the speaker structure.

[0047] It should be noted that the heat dissipation fluid can be not only a single substance, but also a variety of substances. For example, the heat dissipation fluid can include a variety of inert gases. In this case, the adsorption part 4 can be a molecular sieve corresponding to any of the above-mentioned inert gases. For example, the adsorption part 4 is a molecular sieve corresponding to an inert gas with a higher content to improve the air pressure regulation ability and thus ensure a good heat dissipation effect. By combining inert gases in different proportions, different heat dissipation coefficients are achieved, thereby achieving different heat dissipation effects to meet different needs. Different needs include heat dissipation needs, cost needs, and safety needs. Of course, the heat dissipation fluid can also be a combination of magnetic fluid and inert gas. In this case, the adsorption part 4 is a molecular sieve corresponding to the corresponding inert gas.

[0048] In an exemplary embodiment, a speaker structure is provided, referring to Figure 1 As shown, this speaker structure is a further improvement on the previous speaker structure. It includes a speaker body 1 and a heat sink 2. The heat sink 2 is fixedly connected to the speaker body 1 by, for example, injection molding, bonding, snap-fitting, or fasteners to ensure the overall structural stability of the speaker. The heat sink 2 and the speaker body 1 form a rear acoustic cavity 3, which is filled with a cooling fluid. The heat sink 2 is made of steel, and the cooling fluid is helium.

[0049] The speaker structure also includes an adsorption portion 4 arranged inside the rear sound cavity 3, and a mesh portion 6 fixedly connected to the speaker body 1. The adsorption portion 4 is connected to the heat dissipation portion 2, and the mesh portion 6 is located on the side of the adsorption portion 4 away from the heat dissipation portion 2. The adsorption portion 4 is fixed between the heat dissipation portion 2 and the mesh portion 6 to support and protect the adsorption portion 4 to ensure normal use of the adsorption portion 4.

[0050] The speaker body 1 includes a bracket 11, to which the mesh portion 6 and the heat dissipation portion 2 are fixedly connected. The fixed connection herein includes a snap connection, an adhesive connection, an injection molding connection, or a connection via fasteners. The adsorption portion 4 is disposed within the space enclosed by the mesh portion 6, the bracket 11, and the heat dissipation portion 2. The bracket 11 is made of a plastic material. The mesh portion 6, the heat dissipation portion 2, and the bracket 11 are fixedly connected by injection molding to improve the reliability of the connection between the mesh portion 6 and the bracket 11, and between the heat dissipation portion 2 and the bracket 11, thereby ensuring that the adsorption portion 4 is reliably disposed within the space enclosed by the mesh portion 6, the bracket 11, and the heat dissipation portion 2.

[0051] To further enhance the heat dissipation effect, the heat dissipation portion 2 in this embodiment can also use a graphite sheet instead of a steel sheet to achieve a better heat dissipation effect. It is known that the use of both graphite sheets and steel sheets can achieve a better heat dissipation effect and provide a certain support function, thereby making the speaker structure have better heat dissipation and reliability.

[0052] The speaker body 1 also includes a magnet 12 and a voice coil 13 arranged inside the magnet 12. Since the voice coil 13 is the main heat source in the speaker structure, a rear air outlet 121 is opened on the magnet 12. The heat dissipation fluid contacts the voice coil 13 through the rear air outlet 121 to dissipate heat, further improving the heat conduction efficiency between the heat dissipation fluid and the voice coil 13, thereby improving the heat dissipation effect of the targeted heat dissipation of the voice coil 13, and providing heat dissipation guarantee for improving the volume and sound quality of the speaker structure.

[0053] The speaker body 1 also includes a diaphragm 14. The speaker structure produces sound through the vibration of the diaphragm 14. The diaphragm 14, the bracket 11 and the heat dissipation part 2 enclose a sealed rear sound cavity 3. When the diaphragm 14 vibrates, the volume of the rear sound cavity 3 will change, which will in turn cause "stretching" and "compression" of the gas in the rear sound cavity 3. In order to avoid excessive pressure in the rear sound cavity 3, which may cause damage to the speaker structure, the adsorption part 4 is used to balance the changes in air pressure in the rear sound cavity 3 caused by the vibration of the diaphragm 14. When the air pressure in the rear sound cavity 3 is high, the adsorption part 4 adsorbs the heat dissipation gas filled in the rear sound cavity 3 to reduce the air pressure in the rear sound cavity 3; when the air pressure in the rear sound cavity 3 decreases, the adsorption part 4 releases the heat dissipation gas absorbed therein to ensure that the air pressure in the rear sound cavity 3 always remains in a relatively stable state.

[0054] Part of the support 11 and the diaphragm 14 enclose a front acoustic cavity 5 having an opening. The front acoustic cavity 5 and the rear acoustic cavity 3 are located on opposite sides of the diaphragm 14. When the diaphragm 14 vibrates, the air pressure balance in the front acoustic cavity 5 is maintained through the opening. Furthermore, the support 11 in this embodiment can be entirely made of plastic, further reducing cost and the weight of the speaker structure.

[0055] When a user uses the speaker structure of this embodiment to play audio, the voice coil 13 generates a significant amount of heat during operation. The helium in the rear cavity 3 directly contacts the voice coil 13, absorbing the heat generated during operation more directly and efficiently, helping to dissipate heat and preventing damage to the voice coil 13 due to high-temperature operation. The helium in the rear cavity 3 expands due to heat. Since the rear cavity 3 is sealed and filled with helium, the vibration of the diaphragm 14 further reduces the volume of helium that can be accommodated in the rear cavity 3. To prevent damage to the speaker structure caused by the increased helium volume, the helium molecular sieve used as the adsorption portion 4 in this embodiment adsorbs the helium, reducing the pressure on the rear cavity 3 of the speaker structure. Simultaneously, the adsorption portion 4 adsorbs the helium molecules and transfers the heat from them to the heat dissipation portion 2, which then transfers the heat to the exterior of the speaker structure. Furthermore, since the helium molecules pass through the metal mesh used as the mesh portion 6 before contacting the adsorption portion 4, the contact between the helium molecules and the mesh also transfers some heat to the mesh, providing a certain heat dissipation effect.

[0056] When the speaker structure switches from a high-power state to a lower-power state, or switches to a stopped state, the heat generated by the voice coil decreases or stops generating heat. At this time, the adsorption portion 4 releases the helium molecules previously adsorbed so that the helium molecules can continue to be used for heat dissipation when the speaker structure generates a higher amount of heat next time.

[0057] In an exemplary embodiment, an electronic device is provided. The electronic device is a portable device such as a mobile phone, a tablet computer, a laptop computer, or a stereo that requires a speaker.

[0058] The speaker structure provided on this electronic device not only achieves better audio playback effects, but also prevents excessive heat generation, which could negatively impact the user experience. Even when a user plays audio or video files for extended periods, the heat generated by the speaker structure at high power can be dissipated promptly, improving the audio playback quality, reliability, and stability of the speaker structure, and ultimately, the brand reputation of the electronic device.

[0059] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the invention being indicated by the claims.

[0060] It should be understood that the present invention is not limited to the exact construction described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A speaker structure, characterized in that: The speaker structure includes a speaker body and a heat dissipation portion, the heat dissipation portion is fixedly connected to the speaker body, the heat dissipation portion and the speaker body form a rear sound cavity, and the rear sound cavity is filled with a heat dissipation fluid, and the heat dissipation coefficient of the heat dissipation fluid is greater than the heat dissipation coefficient of air; The speaker structure further includes an adsorption portion disposed inside the rear sound cavity, the adsorption portion being connected to the heat dissipation portion. When the heat dissipation fluid is heated, the heat is transferred to the heat dissipation portion through the adsorption portion. The adsorption portion adsorbs gas in the rear sound cavity to expand the volume of the rear sound cavity and maintain air pressure balance in the rear sound cavity. The adsorption portion is further used to release the adsorbed gas into the rear sound cavity.

2. The speaker structure according to claim 1, characterized in that: The heat dissipation fluid includes an inert gas having a heat dissipation coefficient greater than that of air.

3. The speaker structure according to claim 2, characterized in that: The heat dissipation fluid includes helium.

4. The speaker structure according to claim 2, characterized in that: When the heat dissipation fluid is an inert gas, the adsorption portion is a molecular sieve corresponding to the inert gas.

5. The speaker structure according to claim 1, characterized in that: The heat dissipation fluid includes magnetic fluid.

6. The speaker structure according to claim 5, characterized in that: When the heat dissipation fluid is magnetic fluid, the adsorption portion is an air molecular sieve.

7. The speaker structure according to claim 2 or 5, characterized in that: The heat dissipation portion includes a metal sheet.

8. The speaker structure according to claim 7, characterized in that: The metal sheet is a steel sheet.

9. The speaker structure according to claim 1, characterized in that: The speaker structure further includes a mesh portion fixedly connected to the speaker body, the mesh portion is arranged on a side of the adsorption portion away from the heat dissipation portion, and the adsorption portion is fixed between the heat dissipation portion and the mesh portion.

10. The speaker structure according to claim 9, characterized in that: The speaker body includes a bracket, and the mesh portion and the heat dissipation portion are fixedly connected to the bracket.

11. The speaker structure according to claim 10, characterized in that: When the heat dissipation fluid is an inert gas, the mesh portion comprises a metal mesh; The heat dissipation portion includes a metal sheet; The metal mesh and / or the metal sheet are fixedly connected to the bracket by injection molding.

12. The speaker structure according to claim 9, characterized in that: When the heat dissipation fluid is magnetic fluid, the mesh portion includes a nylon mesh.

13. The speaker structure according to claim 1, characterized in that: The speaker body further includes a magnet and a voice coil disposed inside the magnet. A rear air outlet is provided on the magnet, and the heat dissipation fluid contacts the voice coil through the rear air outlet to dissipate heat.

14. An electronic device, characterized in that: The electronic device is provided with the speaker structure according to any one of claims 1 to 13.

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