Laser processing apparatus and laser processing method

Abstract

A laser processing apparatus includes a support section, an irradiation section, a moving mechanism, an input reception section, a display section capable of displaying a setting screen based on an input received by the input reception section, and a control section. The control section causes laser light from the irradiation section to branch into a plurality of processing lights, and causes a plurality of focal points of the plurality of processing lights to be located at a plurality of positions different from each other in a direction perpendicular to an irradiation direction of the laser light inside an object. The control section causes at least one of the support section and the irradiation section to move by the moving mechanism to move the positions of the plurality of focal points along a line. The setting screen includes a first setting screen for setting of a processing condition, and a second setting screen for correction of the processing condition, which is displayed separately from the first setting screen.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a laser processing apparatus and a laser processing method. BACKGROUND

[0002] At present, a laser processing apparatus is known, which causes laser light to branch into a plurality of processing lights and condenses the processing lights on an object, and forms a plurality of modified regions in the object respectively corresponding to a plurality of condensing points of the processing lights (for example, refer to Japanese Patent Application Publication No. 2011-051011). SUMMARY

[0003] In the laser processing apparatus as described above, in a case where, for example, a user interface constituting a GUI (Graphical User Interface) is mounted, a user inputs a processing condition on a setting screen of the user interface, and laser processing is performed based on the input. However, in this case, in laser processing in which laser light is caused to branch into a plurality of processing lights and condense, the possibility that the processing result is not uniform even in the same processing condition is high due to, for example, a device difference resulting from an influence of an optical system or the like. For this reason, although the user can consider the device difference and input the processing condition, such inputting is complicated, and the user-friendliness is poor.

[0004] Therefore, a technical problem of the present disclosure is to provide a laser processing apparatus and a laser processing method in which, in a case where laser processing in which laser light is caused to branch into a plurality of processing lights and condense is performed, the user-friendliness can be improved while the non-uniformity of the processing result is suppressed.

[0005] An aspect of the present disclosure provides a laser processing apparatus that forms a modified region inside an object by irradiating laser light to the object, including: a support portion that supports the object; an irradiation portion that irradiates laser light to the object supported by the support portion; a moving mechanism that moves at least one of the support portion and the irradiation portion; an input reception portion that receives an input; a display portion that can display a setting screen based on the input received by the input reception portion; and a control portion that controls the irradiation portion, the moving mechanism, and the display portion based on the input received by the input reception portion, the control portion causing the laser light from the irradiation portion to branch into a plurality of processing lights, and causing a plurality of condensing points of the plurality of processing lights to respectively be located at a plurality of positions different from each other in a direction perpendicular to an irradiation direction of the laser light inside the object, and moving at least one of the support portion and the irradiation portion by the moving mechanism to move the positions of the plurality of condensing points along a line, the setting screen including: a first setting screen for setting of a processing condition; and a second setting screen for correction of the processing condition, which is displayed separately from the first setting screen.

[0006] In the laser processing apparatus, when performing laser processing of branching laser into a plurality of processing lights and condensing the processing lights (hereinafter, both are referred to as "branching laser processing"), for example, a user can input a processing condition on a first setting screen displayed on the display section via the input receiving section. On the other hand, for example, a manager, an operator, a maintainer, or the like (hereinafter, referred to as "manager or the like") can correct the processing condition on a second setting screen displayed on the display section via the input receiving section so that a processing result does not vary due to equipment differences. That is, the user can input the processing condition of the branching laser processing without considering the equipment differences, and the manager or the like can correct the processing condition in the background so that the processing result does not vary due to the equipment differences. Therefore, in the case of performing the branching laser processing, it is possible to improve the user's ease of use while suppressing variation in the processing result.

[0007] In the laser processing apparatus of one aspect of the present disclosure, the irradiation section can have a spatial light modulator that modulates laser, and the control section can modulate the laser by the spatial light modulator so that the laser is branched into a plurality of processing lights, and so that a plurality of condensing points of the plurality of processing lights are located at mutually different positions in a direction perpendicular to the irradiation direction. In this case, it is possible to perform the branching laser processing using the spatial light modulator.

[0008] In the laser processing apparatus of one aspect of the present disclosure, the line can include a first line and a second line arranged along a direction perpendicular to the irradiation direction, the control section can locate a first condensing point of the plurality of condensing points at a position on the first line, and locate a second condensing point of the plurality of condensing points at a position on the second line, the processing condition set on the first setting screen can include at least either of an output of the processing light and an aberration of the processing light, and the correction of the processing condition set on the second setting screen can include at least either of an output correction and an aberration correction of the first condensing point, and an output correction and an aberration correction of the second condensing point. Thus, in the case of performing the branching laser processing of simultaneously forming a modified region along two lines, it is possible to specifically achieve improvement in the user's ease of use while suppressing variation in the processing result.

[0009] In the laser processing apparatus of one aspect of the present disclosure, it can also be that the line includes a first line and a second line arranged along a direction perpendicular to the irradiation direction, the control section causes a first one of the plurality of light spots to be located at a position on the first line and a second one of the plurality of light spots to be located at a position on the second line, the processing conditions set on the first setting screen include at least either of the output of the processing light and the aberration of the processing light, and the correction of the processing conditions set on the second setting screen includes at least either of the output correction and the aberration correction of the first line and the output correction and the aberration correction of the second line. Thus, in the case where branched laser processing of forming modified regions along two lines at the same time is performed, it is possible to specifically realize an improvement in the ease of use of the user while suppressing unevenness in the processing result.

[0010] In the laser processing apparatus of one aspect of the present disclosure, it can also be that the control section causes the plurality of light spots to be located at a plurality of positions different in the irradiation direction in such a manner that a plurality of modified regions are formed in the irradiation direction on one line, the processing conditions set on the first setting screen include at least either of the output and the aberration of a first modified region among the plurality of modified regions and the output and the aberration of a second modified region among the plurality of modified regions, and the correction of the processing conditions set on the second setting screen includes the output correction and the aberration correction of a first one of the plurality of light spots and the output correction and the aberration correction of a second one of the plurality of light spots. Thus, in the case where branched laser processing of forming a plurality of modified regions along one line at the same time is performed, it is possible to specifically realize an improvement in the ease of use of the user while suppressing unevenness in the processing result.

[0011] In the laser processing apparatus of one aspect of the present disclosure, it can also be that the control section causes the plurality of light spots to be located at a plurality of positions different in the irradiation direction in such a manner that a plurality of modified regions are formed in the irradiation direction on one line, the processing conditions set on the first setting screen include at least either of the output and the aberration of a first modified region among the plurality of modified regions and the output and the aberration of a second modified region among the plurality of modified regions, and the correction of the processing conditions set on the second setting screen includes at least either of the output correction and the aberration correction in the case where the moving direction in which the plurality of light spots are moved is a first moving direction and the output correction and the aberration correction in the case where the moving direction is a second moving direction opposite to the first moving direction. Thus, in the case where branched laser processing of forming a plurality of modified regions along one line at the same time is performed, it is possible to specifically realize an improvement in the ease of use of the user while suppressing unevenness in the processing result.

[0012] In the laser processing apparatus of one aspect of the present disclosure, it can also be that the control section causes the plurality of light condensing points to be located at different positions in the irradiation direction in a manner that a plurality of rows of modified regions are formed in the irradiation direction on one line, the processing conditions set on the first setting screen include at least any one of the output and the aberration of a first modified region among the plurality of rows of modified regions, and the processing conditions set on the second setting screen include at least any one of the output and the aberration of a second modified region among the plurality of rows of modified regions, the correction of the processing conditions on the second setting screen is set for each correction parameter, and the correction of the processing conditions on the second setting screen includes at least any one of the output correction and the aberration correction of the first modified region in a case where the moving direction in which the plurality of light condensing points are moved is a first moving direction, the output correction and the aberration correction of the second modified region in a case where the moving direction is the first moving direction, the output correction and the aberration correction of the first modified region in a case where the moving direction is a second moving direction that is the opposite direction of the first moving direction, and the output correction and the aberration correction of the second modified region in a case where the moving direction is the second moving direction. Thus, in a case where branched laser processing of simultaneously forming a plurality of rows of modified regions along one line is performed, it is possible to achieve an improvement in user-friendliness while suppressing unevenness in the processing result.

[0013] In the laser processing apparatus of one aspect of the present disclosure, it can also be that the processing conditions set on the first setting screen include a correction parameter, and the correction of the processing conditions set on the second setting screen is set for each correction parameter. Thus, the user can set the correction parameter on the first setting screen, and it is possible to correct the processing conditions corresponding to the correction parameter.

[0014] The laser processing apparatus of one aspect of the present disclosure can also include a photographing section that photographs an object by emitting at least any one of visible light and infrared light, and the control section can cause the display section to display a photographing result of the photographing section together with at least any one of the first setting screen and the second setting screen. Thus, when the processing conditions are input on the first setting screen via the input receiving section, and / or when the correction of the processing conditions is input on the second setting screen via the input receiving section, it is possible to easily refer to the photographing result of the photographing section.

[0015] In the laser processing apparatus of one aspect of the present disclosure, it can also be that the control section can cause the display section to display the second setting screen only in a case where the input receiving section receives an input of a lock release. Thus, it is possible to prohibit the correction of the processing conditions on the second setting screen by a user who cannot release the lock, for example.

[0016] The laser processing apparatus of one aspect of the present disclosure can also include a storage section that stores a history of the correction of the processing conditions set on the second setting screen. Thus, by referring to the history stored in the storage section, it is possible to grasp the state of unevenness in the processing result.

[0017] An aspect of the present disclosure provides a laser processing method of forming a modified region in an inside of an object using a laser processing apparatus, wherein the laser processing method includes: a step of inputting, via an input receiving section, a processing condition on a first setting screen displayed on a display section; and a step of inputting, via the input receiving section, a correction value of the processing condition that has been input on the first setting screen on a second setting screen displayed on the display section so that a difference in each processing result due to a plurality of processing light condensing and / or a difference in the processing result due to a difference in a moving direction of a plurality of condensing points is reduced.

[0018] In the laser processing method, when branch laser processing is performed, for example, a user inputs a processing condition on a first setting screen displayed on a display section. On the other hand, for example, a manager or the like corrects the processing condition in a manner that a processing result is uniform on a second setting screen displayed on the display section. That is, it is possible to make the user input a processing condition of branch laser processing without considering a difference in equipment, and at the same time, the manager or the like corrects the processing condition in the background so that the processing result does not become non-uniform due to the difference in equipment. Therefore, in the case where branch laser processing is performed, it is possible to improve the ease of use of the user, and at the same time, to suppress non-uniformity of the processing result. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a configuration diagram of a laser processing apparatus of the first embodiment.

[0020] Figure 2 is a plan view of an object of Figure 1

[0021] Figure 3 is a sectional view of a part of an object of Figure 2

[0022] Figure 4 is a perspective view that explains branch laser processing of the first embodiment.

[0023] Figure 5 is a schematic diagram of a user interface of Figure 1

[0024] Figure 6 (a) in FIG. 1 is a schematic diagram of an example of a first setting screen of the first embodiment, Figure 6 (b) in FIG. 1 is a schematic diagram of an example of a second setting screen of the first embodiment.

[0025] Figure 7 is a schematic diagram of an example of a second setting screen of the second embodiment.

[0026] Figure 8 is a perspective view that explains branch laser processing of the third embodiment. ​​​

[0027] Figure 9 (a) in FIG. 6 is a schematic view showing an example of the first setting screen of the third embodiment, Figure 9 (b) in FIG. 6 is a schematic view showing an example of the second setting screen of the third embodiment.

[0028] Figure 10 (b) in FIG. 7 is a schematic view showing an example of the second setting screen of the fourth embodiment.

[0029] Figure 11 (a) in FIG. 8 is a sectional view illustrating the branch laser processing of the fifth embodiment, Figure 11 (b) in FIG. 8 is another sectional view illustrating the branch laser processing of the fifth embodiment.

[0030] Figure 12 (a) in FIG. 9 is a schematic view showing an example of the first setting screen of the fifth embodiment, Figure 12 (b) in FIG. 9 is a schematic view showing an example of the second setting screen of the fifth embodiment.

[0031] Figure 13 (b) in FIG. 10 is a schematic view showing an example of the second setting screen of the sixth embodiment.

[0032] Figure 14 (b) in FIG. 11 is a schematic view showing an example of the second setting screen of the seventh embodiment.

[0033] Figure 15 (a) in FIG. 12 is a schematic view showing an example of the first setting screen of the eighth embodiment, Figure 15 (b) in FIG. 12 is a schematic view showing an example of the second setting screen of the eighth embodiment.

[0034] Figure 16 (a) in FIG. 13 is a sectional view illustrating the branch laser processing of the ninth embodiment, Figure 16 (b) in FIG. 13 is another sectional view illustrating the branch laser processing of the ninth embodiment.

[0035] Figure 17 (a) in FIG. 14 is a schematic view showing an example of the first setting screen of the ninth embodiment, Figure 17 (b) in FIG. 14 is a schematic view showing an example of the second setting screen of the ninth embodiment.

[0036] Figure 18 (b) in FIG. 15 is a schematic view showing an example of the second setting screen of the tenth embodiment.

[0037] Figure 19 (b) in FIG. 16 is a schematic view showing an example of the second setting screen of the eleventh embodiment.

[0038] Figure 20(a) in the diagram is a schematic representation of an example of a modified second setting screen. Figure 20 (b) is a schematic diagram of an example of a second setting screen representing another variation. Detailed Implementation

[0039] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Furthermore, in each drawing, the same or equivalent parts are labeled with the same symbols, and repeated descriptions are omitted.

[0040] [First Implementation Method]

[0041] The first embodiment will be described. For example... Figure 1 As shown, the laser processing apparatus 1 includes a support unit 2, a light source 3, an optical axis adjustment unit 4, a spatial light modulator 5, a focusing unit 6, an optical axis monitoring unit 7, a visible imaging unit 8A, an infrared imaging unit 8B, a moving mechanism 9, and a management unit 10. The laser processing apparatus 1 is a device that forms a modified region 12 on an object 11 by irradiating it with a laser beam L. In the following description, the three mutually orthogonal directions are referred to as the X direction, Y direction, and Z direction. In this embodiment, the X direction is a first horizontal direction, the Y direction is a second horizontal direction perpendicular to the first horizontal direction, and the Z direction is a vertical direction.

[0042] The support portion 2 supports the object 11 by adsorbing, for example, a film (not shown) that is pasted onto the object 11, such that the surface 11a and the back surface 11b of the object 11 are orthogonal to the Z direction. The support portion 2 is movable in both the X and Y directions. The support portion 2 is rotatable about a rotation axis along the Z direction.

[0043] Light source 3 emits laser L via, for example, pulse oscillation. Laser L is transmissive relative to object 11. Optical axis adjustment unit 4 adjusts the optical axis of laser L emitted from light source 3. In this embodiment, optical axis adjustment unit 4 changes the travel direction of laser L emitted from light source 3 to align it along the Z direction, and adjusts the optical axis of laser L. Optical axis adjustment unit 4 is, for example, composed of multiple reflectors capable of adjusting position and angle.

[0044] The spatial light modulator 5 is disposed in the laser processing head H. The spatial light modulator 5 modulates the laser light L emitted from the light source 3. The spatial light modulator 5 is a spatial light modulator (SLM) of a reflective type liquid crystal on silicon (LCOS). In the spatial light modulator 5, by appropriately setting a modulation pattern displayed on the liquid crystal layer, modulation of the laser light L is possible. In the present embodiment, the laser light L traveling along the Z direction to the lower side from the optical axis adjustment section 4 is incident into the laser processing head H, the laser light L incident into the laser processing head H is reflected by a mirror Hl horizontally at an angle with respect to the Y direction, and the laser light L reflected by the mirror Hl is incident into the spatial light modulator 5. The spatial light modulator 5 reflects and modulates the laser light L thus incident along the Y direction horizontally.

[0045] The condensing section 6 is installed to the bottom wall of the laser processing head H. The condensing section 6 condenses the laser light L modulated by the spatial light modulator 5 toward the object 11 supported by the support section 2. In the present embodiment, the laser light L horizontally reflected along the Y direction by the spatial light modulator 5 is reflected to the lower side along the Z direction by a dichroic mirror H2, and the laser light L reflected by the dichroic mirror H2 is incident into the condensing section 6. The condensing section 6 condenses the laser light L thus incident toward the object 11. The condensing section 6 is configured by installing a condenser lens unit 61 to the bottom wall of the laser processing head H via a drive mechanism 62. The drive mechanism 62 moves the condenser lens unit 61 along the Z direction by a driving force of, for example, a piezoelectric element.

[0046] Further, in the laser processing head H, an imaging optical system (omitted from illustration) is disposed between the spatial light modulator 5 and the condensing section 6. The imaging optical system is configured as a telecentric optical system on both sides of the imaging relationship between the reflecting surface of the spatial light modulator 5 and the entrance pupil surface of the condensing section 6. Thereby, the image of the laser light L at the reflecting surface of the spatial light modulator 5 (the image of the laser light L modulated by the spatial light modulator 5) is imaged to the entrance pupil surface of the condensing section 6. On the bottom wall of the laser processing head H, a pair of distance measuring sensors S1, S2 are installed in a manner to be located on both sides in the X direction of the condenser lens unit 61. Each distance measuring sensor S1, S2 emits distance measuring light (for example, laser light) with respect to the back surface 11b of the object 11, and detects the distance measuring light reflected by the back surface 11b, thereby acquiring displacement data of the back surface 11b. The laser processing head H is configured as an irradiation section.

[0047] The optical axis monitoring section 7 is disposed in the laser processing head H. The optical axis monitoring section 7 detects a portion of the laser L transmitted through the dichroic mirror H2. The detection result of the optical axis monitoring section 7 indicates, for example, the relationship between the optical axis of the laser L incident on the condenser lens unit 61 and the optical axis of the condenser lens unit 61. The visible light camera 8A is a camera that emits visible light V and acquires an image of the object 11 as an image of the visible light V. The visible light camera 8A is disposed in the laser processing head H. In the present embodiment, the visible light V emitted from the visible light camera 8A is irradiated to the back surface lib of the object 11 via the dichroic mirror H2 and the condensing section 6, and the visible light V reflected on the back surface lib is detected by the visible light camera 8A via the condensing section 6 and the dichroic mirror H2. The infrared camera 8B is a camera that emits infrared light and acquires an image of the object 11 as an infrared image of the infrared light. The infrared camera 8B is attached to the side wall of the laser processing head H.

[0048] The moving mechanism 9 includes a mechanism that moves at least either the laser processing head H or the support section 2 in the X direction, the Y direction, and the Z direction. The moving mechanism 9 drives at least either the laser processing head H or the support section 2 by a driving force of a known driving device such as a motor, to move the condensing point C of the laser L in the X direction, the Y direction, and the Z direction. In addition, the moving mechanism 9 includes a mechanism that rotates the support section 2. The moving mechanism 9 rotationally drives the support section 2 by a driving force of a known driving device such as a motor.

[0049] The management unit 10 has a control section 101, a user interface 102, and a storage section 103. The control section 101 controls the operation of each section of the laser processing apparatus 1. The control section 101 is configured as a computer device including a processor, a memory, a storage, a communication device, and the like. In the control section 101, the processor executes software (programs) read into the memory or the like, and controls the read and write of data in the memory and the storage, and the communication performed by the communication device. The user interface 102 performs the display and input of various data. The user interface 102 configures a GUI (Graphical User Interface) having a graphical-based operation system.

[0050] The user interface 102 includes, for example, at least either a touch panel, a keyboard, a mouse, a microphone, a tablet terminal, a monitor, or the like. The user interface 102 can receive various inputs by, for example, a touch input, a keyboard input, a mouse operation, a sound input, or the like. The user interface 102 can display various information on a display screen thereof. The user interface 102 corresponds to an input receiving section that receives an input, and a display section that can display a setting screen based on the received input. The storage section 103 is, for example, a hard disk or the like, and stores various data.

[0051] In the laser processing apparatus 1 configured as above, when the laser L is condensed inside the object 11, the laser L is absorbed in a portion corresponding to the condensing point (at least a part of the condensing region) C of the laser L, and a modified region 12 is formed inside the object 11. The modified region 12 is a region in which the density, the refractive index, the mechanical strength, other physical characteristics, and the like are different from those of the surrounding non-modified region. As the modified region 12, for example, a molten processing region, a crack region, an insulation breakdown region, a refractive index change region, and the like are given. The modified region 12 includes a plurality of modified points 12s and cracks extending from the plurality of modified points 12s.

[0052] As an example, the operation of the laser processing apparatus 1 when the modified region 12 is formed inside the object 11 along the line 15 for cutting the object 11 will be described.

[0053] First, the laser processing apparatus 1 rotates the support portion 2 so that the line 15 provided in the object 11 is parallel to the X direction. The laser processing apparatus 1 moves the support portion 2 in each of the X direction and the Y direction based on the image (for example, an image of the functional element layer possessed by the object 11) acquired by the infrared imaging portion 8B so that the condensing point C of the laser L is positioned on the line 15 when viewed from the Z direction. The laser processing apparatus 1 moves (height sets) the laser processing head H (that is, the condensing portion 6) in the Z direction based on the image (for example, an image of the surface 11a of the object 11) acquired by the visible imaging portion 8A so that the condensing point C of the laser L is positioned on the surface 11a. The laser processing apparatus 1 sets this position as a reference, and moves the laser processing head H in the Z direction so that the condensing point C of the laser L is positioned at a prescribed depth from the surface 11a.

[0054] Next, the laser processing apparatus 1 emits the laser L from the light source 3, and moves the support portion 2 in the X direction so that the condensing point C of the laser L relatively moves along the line 15. Hereinafter, the "relative moving direction of the laser L with respect to the object 11" will be referred to as the "processing travel direction". At this time, the laser processing apparatus 1 causes the drive mechanism 62 of the condensing portion 6 to operate based on the displacement data of the surface 11a acquired by the distance measuring sensor located on the front side of the processing travel direction of the laser L among the pair of distance measuring sensors S1, S2 so that the condensing point C of the laser L is positioned at a prescribed depth from the surface 11a.

[0055] Through the above actions, a series of modified regions 12 are formed along line 15 at a certain depth from surface 11a on the object 11. When laser L is emitted from light source 3 via pulse oscillation, multiple modified points 12s are formed and arranged in a series along the X direction. A modified point 12s is formed by irradiation with one pulse of laser L. A series of modified regions 12 is a collection of multiple modified points 12s arranged in a series. Adjacent modified points 12s are sometimes connected and sometimes separated depending on the pulse spacing of laser L (the value obtained by dividing the relative moving speed of the focusing point C relative to the object 11 by the repetition frequency of laser L). In this embodiment, the Z direction is the irradiation direction of laser L, and surface 11a is the laser incident surface. The position (at a predetermined depth) of the focusing point C from surface 11a in the Z direction is referred to as the "Z position".

[0056] like Figure 2 and Figure 3 As shown, object 11 is a wafer formed in the shape of a disc. Object 11 is constructed by stacking a functional element layer 22 on a semiconductor substrate 21. The semiconductor substrate 21 is, for example, a silicon substrate. The semiconductor substrate 21 has a first surface 21a and a second surface 21b opposite to the first surface 21a. The second surface 21b is the second surface 20b of object 11. Grooves 21c indicating crystal orientation are provided on the semiconductor substrate 21. Alternatively, an orientation plane may be provided on the semiconductor substrate 21 instead of grooves 21c. The functional element layer 22 is provided on the first surface 21a of the semiconductor substrate 21. The functional element layer 22 includes a plurality of functional elements 22a arranged in a matrix along the first surface 21a of the semiconductor substrate 21. Each functional element 22a is, for example, a light-receiving element such as a photodiode, a light-emitting element such as a laser diode, a circuit element such as a memory. Sometimes, multiple layers of functional elements 22a are stacked to form a three-dimensional structure.

[0057] Lines 15 are provided on the object 11. Lines 15 are lines forming a predetermined modified region 12. The object 11 is cut along each of the plurality of lines 15 for each functional element 22a. The plurality of lines 15 extend in a grid pattern along the second surface 21b of the object 11, passing through the spaces between each of the plurality of functional elements 22a (more specifically, through the center of the spacing regions 23 extending in a manner that pass through the spaces between adjacent functional elements 22a) when viewed from the thickness direction of the object 11. Each line 15 is a virtual line set on the object 11 by the laser processing apparatus 1. Alternatively, each line 15 may be an actual line drawn on the object 11. The setting of the lines 15 can be performed in the management unit 10. The lines 15 may also be lines specified by coordinates.

[0058] return Figure 1The control section 101 causes the laser L to branch into a plurality of machining lights by modulating the laser L with the spatial light modulator 5, and causes a plurality of focal points of the plurality of machining lights to be located at mutually different positions in the X direction and / or the Y direction. Specifically, the control section 101 controls the spatial light modulator 5 to cause the laser L to be emitted from the light source 3 in a state where the liquid crystal layer 56 of the spatial light modulator 5 displays a prescribed modulation pattern (a modulation pattern including a diffraction pattern, etc.), and causes the laser L to be condensed toward the object 11 by the condensing section 6. Thus, the control section 101 causes the laser L from the laser machining head H to branch into a plurality of machining lights, and causes each focal point C of the plurality of machining lights to be located at a plurality of positions different from each other in the horizontal direction inside the object 11.

[0059] The control section 101 of the present embodiment implements Figure 4 The control section 101 of the present embodiment implements Figure 4 In the branched laser machining illustrated in FIG. 6, the laser L is branched (diffracted) into the first machining light L1 and the second machining light L2. The first focal point C1 of the first machining light L1, which is a focal point C, is located inside the object 11 on the first line 15A. The second focal point C2 of the second machining light L2, which is a focal point C, is located inside the object 11 on the second line 15B. Also, while the laser L is being irradiated, at least one of the support section 2 and the laser machining head H is moved by the moving mechanism 9 to move the positions of the first and second focal points C1, C2 of the first and second machining lights L1, L2 in the machining advancing direction K1 along the first and second lines 15A, 15B.

[0060] Further, the first machining light L1 corresponds to -1st order light, and the second machining light L2 corresponds to +1st order light. The first line 15A and the second line 15B are lines 15 arranged in a direction perpendicular to the Z direction. In the illustrated example, the first line 15A and the second line 15B are adjacent. The first and second machining lights L1, L2 are branched from the laser L in an index direction (hereinafter, simply referred to as "index direction") that is orthogonal to the Z direction and the machining advancing direction K1. The positions of the first and second focal points C1, C2 differ only in the index direction. The interval of the plurality of modified points 12s formed at the same time (the interval of the modified points 12s produced by condensing of the first machining light L1 and the modified points 12s produced by condensing of the second machining light L2) is the branching pitch.

[0061] The control section 101 of the present embodiment controls the display of the user interface 102 based on input received in the user interface 102. As Figure 1 and Figure 5As shown, the control section 101 causes the user interface 102 to display an image 102A of the captured result of at least either of the visible capturing section 8A and the infrared capturing section 8B. At the same time, the control section 101 causes the user interface 102 to display a setting screen 102B for setting of branch laser processing. That is, the control section 101 causes the image 102A and the setting screen 102B to be displayed in a lined-up manner on one display screen of the user interface 102. Adjustment and switching of the displayed image 102A and the like can be performed based on input received in the user interface 102.

[0062] As shown in (a) of FIG. 10 and (b) of FIG. 10, the setting screen 102B includes a first setting screen G11 and a second setting screen G12. The control section 101 causes either of the first setting screen G11 and the second setting screen G12 to be displayed as the setting screen 102B in the user interface 102 based on input received in the user interface 102. Figure 6 Figure 6 The first setting screen G11 is a setting screen for setting of processing conditions for branch laser processing. The first setting screen G11 is a user's setting screen used by a user (particularly, an end user). The first setting screen G11 includes images used for operations for setting of the processing conditions. The setting (input) of the processing conditions on the first setting screen G11 can be of a selection type or a numerical value input type.

[0063] The second setting screen G12 is a setting screen used for correction of the processing conditions set in the first setting screen G11. The second setting screen G12 is a manager's setting screen used by, for example, a manager, an operator, and a maintainer (hereinafter, referred to as "managers and the like"). The second setting screen G12 includes images used for operations for setting of correction of the processing conditions. The setting (input) of the correction of the processing conditions on the second setting screen G12 can be of a selection type or a numerical value input type.

[0064] The second setting screen G12 is displayed separately from the first setting screen G11. The case of separate display refers to, for example, a case where images are not integrated, a case where they are distinguishable, a case where they are not in one form, a case where they are not displayed at the same time, a case where they are displayed separately, and a case including at least any of these. The second setting screen G12 is a setting screen that is not disclosed to a user.

[0065] The second setting screen G12 is displayed separately from the first setting screen G11. The case of separate display refers to, for example, a case where images are not integrated, a case where they are distinguishable, a case where they are not in one form, a case where they are not displayed at the same time, a case where they are displayed separately, and a case including at least any of these. The second setting screen G12 is a setting screen that is not disclosed to a user.

[0066] ​The second setting screen G12 can be displayed on the user interface 102 only for a certain period after, for example, an input of lock release is made from the administrator or the like. That is, the control section 101 can display the second setting screen G12 on the user interface 102 only in a case where an input of lock release is received in the user interface 102. As the input of lock release, there is no particular limitation, and, for example, a password input or the like can be given. Further, in a case where the second setting screen G12 is displayed in the user interface 102 after a certain period elapses after the input of lock release is received in the user interface 102, the first setting screen G11 can be forcibly displayed instead of the second setting screen G12.

[0067] Figure 6 In the example shown in (a) in FIG. 10, the machining conditions set on the first setting screen G11 include the number of branches of the laser L, the branch pitch, the Z position, the output of the machining light, and the spherical aberration of the machining light. The output of the machining light corresponds to the output of each of the plurality of machining lights. The spherical aberration of the machining light corresponds to the spherical aberration when each of the plurality of machining lights is focused. The "reference" of the parameters means that a reference value of the degree is set in advance. The reference value can be obtained by measurement or the like. "X1", "A1", and "B1" in the figure are written for convenience of explanation and mean arbitrary values.

[0068] In Figure 6 the example shown in (b) in FIG. 10, the correction of the machining conditions set on the second setting screen G12 includes the output correction and the spherical aberration correction of the first focal point C1 and the output correction and the spherical aberration correction of the second focal point C2. That is, in the second setting screen G12, the output correction and the spherical aberration correction can be made for each of the plurality of focal points C. The output correction of the focal point C is the correction of the output of the machining light that forms the focal point C. The spherical aberration correction of the focal point C is the correction of the spherical aberration when the machining light that forms the focal point C is focused. The "reference -1" of the parameters means one stage smaller than the reference value of the degree set in advance. The "reference +1" of each parameter means one stage larger than the reference value of the degree set in advance.

[0069] Further, the expression of the machining conditions and the correction thereof is not limited to the examples shown in (a) in FIG. 10 and (a) in FIG. 11. Figure 6 Figure 6 ​The example shown in (b) is not particularly limited. For example, instead of the "first spotlight point" and "second spotlight point" recorded in the second setting screen G12, it can be set as "left point" and "right point" representing spotlight points C to the left and right relative to the processing travel direction K1. For example, instead of the "first spotlight point" and "second spotlight point" recorded in the second setting screen G12, it can be set as "-1 light" and "+1 light" representing the first processing light L1 being a -1 light and the second processing light L2 being a +1 light. For example, instead of the "reference" and "reference ± α (α is an integer)" recorded in the first setting screen G11 and the second setting screen G12, it can be set as a numerical value, or it can be set as a record of large, medium, small, etc. stages.

[0070] Types of processing conditions Figure 6 (a) and Figure 6 The example shown in (b) is not particularly limited. For example, the machining conditions set in the first setting screen G11 may also include non-point aberrations. The correction of the machining conditions set in the second setting screen G12 may also include non-point aberration correction. The machining conditions set in the first setting screen G11 may also include beam shape (ellipticity, etc.). The correction of the machining conditions set in the second setting screen G12 may also include beam shape correction. The correction of the machining conditions set in the second setting screen G12 may also include Z position correction.

[0071] like Figure 1 As shown, the control unit 101 controls the laser processing head H and the moving mechanism 9 based on the input received in the user interface 102. The control unit 101 controls the driving of the laser processing head H and the moving mechanism 9 based on the processing conditions set in the first setting screen G11 and the corrections to the processing conditions set in the second setting screen G12. Specifically, the control unit 101 controls the spatial light modulator 5 based on the number of branches, branch spacing, output of the processing light, and spherical aberration of the processing light set on the first setting screen G11, and the output corrections and spherical aberration corrections of the first and second focusing points C1 and C2 set on the second setting screen G12. The control unit 101 controls the moving mechanism 9 based on the Z position set on the first setting screen G12.

[0072] The storage unit 103 stores the history (log) of corrections to the processing conditions set on the second setting screen G12 in association with the processing conditions set on the first setting screen G12. When the control unit 101 inputs an operation to display the history of corrections via the user interface 102, the control unit 101 displays the history of corrections on the user interface 102.

[0073] Next, an example of branch laser processing performed by laser processing apparatus 1 will be described.

[0074] The user inputs the processing conditions for the branch laser processing on the first setting screen G11 displayed on the user interface 102 by, for example, a touch input or the like. As a result, the branch laser processing is performed based on the input processing conditions. Here, each of the first and second processing lights L1, L2 is scanned along each of the first and second lines 15A, 15B (see FIG. 1). As a result, the modified region 12 is formed inside the object 11 along each of the first and second lines 15A, 15B. Figure 4 ). As a result, the modified region 12 is formed inside the object 11 along each of the first and second lines 15A, 15B.

[0075] At this time, in the branch laser processing, the processing results are not uniform even under the same processing conditions due to equipment differences caused by influences of the optical system or the like. For example, in the branch laser processing, the processing results (amount of cracks from the modified points 12s) caused by the condensing of the first and second processing lights L1, L2 are not uniform due to the equipment differences.

[0076] Therefore, in this case, the administrator or the like performs the input of the lock release on the user interface 102, and then performs the input of the screen switching on the user interface 102, and instead of the first setting screen G11, the second setting screen G12 is displayed as a back screen. The administrator or the like inputs the correction values of the processing conditions on the second setting screen G12 displayed on the user interface 102 so that the differences in the processing results of the condensing of the first and second processing lights L1, L2 are reduced. As a result, the input of the first setting screen G12 by the user remains as it is, and the non-uniformity of the processing results of the branch laser processing is suppressed.

[0077] In the above, in the laser processing apparatus 1 and the laser processing method, when the branch laser processing is performed, the user is able to input the processing conditions on the first setting screen G11 displayed on the user interface 102, for example. On the other hand, the administrator or the like is able to correct the processing conditions on the second setting screen G12 displayed on the user interface 102 so that the processing results are not non-uniform due to the equipment differences. That is, the user is able to input the processing conditions for the branch laser processing without considering the equipment differences, and the administrator or the like corrects the processing conditions in the background so that the processing results are not non-uniform due to the equipment differences. Therefore, in the case where the branch laser processing is performed, the ease of use of the user is improved, and the non-uniformity of the processing results is suppressed. Further, the user does not necessarily have knowledge and experience related to the equipment differences, and therefore, a structure in which the user performs the input considering the equipment differences is not realistic. In this regard, the laser processing apparatus 1 and the laser processing method in which the user performs the input of the processing conditions without considering the equipment differences are effective.

[0078] In the laser processing apparatus 1, the laser processing head H has the spatial light modulator 5. In the laser processing apparatus 1 and the laser processing method, the laser L is modulated by the spatial light modulator 5 to branch the laser L into the first and second processing lights L1, L2 and to locate these first and second focal points C1, C2 at different positions from each other in the X direction and / or the Y direction. In this case, the branched laser processing can be performed using the spatial light modulator 5.

[0079] In the laser processing apparatus 1 and the laser processing method, the line 15 includes the first and second lines 15A, 15B, the first focal point C1 of the first processing light L1 is located at a position on the first line 15A, and the second focal point C2 of the second processing light L2 is located at a position on the second line 15B. The processing conditions set on the first setting screen G11 include the output of the processing light and the spherical aberration of the processing light. The correction of the processing conditions set on the second setting screen G12 includes the output correction and the spherical aberration correction of the first focal point C1 and the output correction and the spherical aberration correction of the second focal point C2. Thereby, in the case where the branched laser processing of simultaneously forming the modified region 12 along the two lines 15 is performed, it is possible to specifically realize the improvement of the user's ease of use while suppressing the unevenness of the processing result. In particular, in the second setting screen G12, the processing conditions are corrected by the description for each focal point C, it is possible to correct the unevenness of the processing result of each focal point C.

[0080] In the laser processing apparatus 1 and the laser processing method, the image 102A of the shooting result of at least any one of the visible shooting section 8A and the infrared shooting section 8B is displayed on the user interface 102 together with the first setting screen G11 or together with the second setting screen G12. Thereby, the user can easily refer to the shooting results of the visible shooting section 8A and the infrared shooting section 8B when inputting the processing conditions on the first setting screen G11 and when inputting the correction of the processing conditions on the second setting screen G12.

[0081] In the laser processing apparatus 1 and the laser processing method, the second setting screen G12 can be displayed on the user interface 102 only in the case where the input of the lock release is received in the user interface 102. Thereby, it is possible to prohibit the correction of the processing conditions on the second setting screen G12 by the user who cannot release the lock, for example.

[0082] The laser processing apparatus 1 and the laser processing method store the history of the correction of the processing conditions set on the second setting screen G12 in the storage section 103. By referring to the history stored in the storage section 103, it is possible to grasp the state of the unevenness of the processing result.

[0083] [Second Embodiment]

[0084] The second embodiment will be described. In the description of the second embodiment, the differences from the first embodiment will be explained, and repeated descriptions will be omitted.

[0085] like Figure 7 As shown, the setting screen 102B of this embodiment includes a second setting screen G22 instead of the second setting screen G12 (see reference). Figure 6 (b)). The correction of the processing conditions set on the second setting screen G22 includes output correction and spherical aberration correction for the first line 15A and the second line 15B. That is, in the second setting screen G22, output correction and spherical aberration correction can be performed on each of the plurality of lines 15. Otherwise, the second setting screen G22 is the same as the second setting screen G12. The output correction of line 15 is the correction of the output of the processing light scanned along the line 15. The spherical aberration correction of line 15 is the correction of spherical aberration when the processing light scanned along the line 15 is focused.

[0086] In this embodiment, the same effect as the above-described embodiment is also shown, that is, when performing branched laser processing, the ease of use for the user is improved, while the unevenness of the processing results is suppressed.

[0087] In this embodiment, the correction of the processing conditions set on the second setting screen G22 includes output correction and spherical aberration correction for the first line 15A and output correction and spherical aberration correction for the second line 15B. Therefore, when performing branch laser processing to simultaneously form the modified region 12 along both lines 15, user-friendliness can be improved while suppressing uneven processing results. In particular, by correcting the processing conditions according to the description of each line 15 in the second setting screen G22, uneven processing results for each line 15 can be corrected.

[0088] [Third Implementation Method]

[0089] The third embodiment will be described. In the description of the third embodiment, the differences from the first embodiment will be explained, and repeated descriptions will be omitted.

[0090] The control unit 101 of this embodiment is implemented Figure 8 The diagram shows branched laser processing. In Figure 8In the branch laser processing shown, the laser L is branched into first processing light L1, second processing light L2, and third processing light L3. The first focal point C1 of the first processing light L1 is made to be located inside the object 11 on the first line 15A. The second focal point C2 of the second processing light L2 is made to be located inside the object 11 on the second line 15B. The third focal point C3 of the third processing light L3 is made to be located inside the object 11 on the third line 15C. Also, while the laser L is being irradiated, at least one of the support portion 2 and the laser processing head H is moved by the movement mechanism 9 so that the positions of the first to third focal points C1, C2, C3 are moved in the processing travel direction K1 along the first to third lines 15A, 15B, 15C.

[0091] Further, the first processing light L1 corresponds to -1 order light, the second processing light L2 corresponds to +1 order light, and the third processing light L3 corresponds to 0 order light. The first to third lines 15A, 15B, 15C are lines 15 arranged in a direction perpendicular to the Z direction. In the example shown, the first line 15A and the third line 15C are adjacent, and the second line 15B and the third line 15C are adjacent.

[0092] The first to third processing lights L1, L2, L3 are made by branching the laser L in the indexing direction.

[0093] The positions of the first to third focal points C1, C2, C3 differ only in the indexing direction.

[0094] As shown in (a) of FIG. 10 and (b) of FIG. 11, the setting screen 102B of the present embodiment includes a first setting screen G31 instead of the first setting screen G11 (see (a) of FIG. 6), and includes a second setting screen G32 instead of the second setting screen G12 (see (b) of FIG. 7). Figure 9 Figure 9 As shown in (a) of FIG. 10 and (b) of FIG. 11, the setting screen 102B of the present embodiment includes a first setting screen G31 instead of the first setting screen G11 (see (a) of FIG. 6), and includes a second setting screen G32 instead of the second setting screen G12 (see (b) of FIG. 7). Figure 6 Figure 6 As shown in (a) of FIG. 10 and (b) of FIG. 11, the setting screen 102B of the present embodiment includes a first setting screen G31 instead of the first setting screen G11 (see (a) of FIG. 6), and includes a second setting screen G32 instead of the second setting screen G12 (see (b) of FIG. 7).

[0095] As shown in (a) of FIG. 10 and (b) of FIG. 11, the setting screen 102B of the present embodiment includes a first setting screen G31 instead of the first setting screen G11 (see (a) of FIG. 6), and includes a second setting screen G32 instead of the second setting screen G12 (see (b) of FIG. 7). Figure 9 Figure 9 As shown in (a) of FIG. 10 and (b) of FIG. 11, the setting screen 102B of the present embodiment includes a first setting screen G31 instead of the first setting screen G11 (see (a) of FIG. 6), and includes a second setting screen G32 instead of the second setting screen G12 (see (b) of FIG. 7). ​​​

[0096] In this embodiment, the same effect as the above-described embodiment is achieved, namely, improving user-friendliness and suppressing uneven processing results when performing branched laser processing. Furthermore, instead of the "first focal point," "second focal point," and "third focal point" displayed in the second setting screen G12, the focal points C representing the left, right, and center relative to the processing direction K1 can be designated as "left point," "right point," and "center point."

[0097] [Fourth Implementation Method]

[0098] The fourth embodiment will be described. In the description of the fourth embodiment, the differences from the third embodiment will be explained, and repeated descriptions will be omitted.

[0099] like Figure 10 As shown, the setting screen 102B of this embodiment includes a second setting screen G42 instead of the second setting screen G32 (see reference). Figure 9 (b)). The calibration of the processing conditions set on the second setting screen G42 includes output calibration and spherical aberration correction for the first line 15A, the second line 15B, and the third line 15C. That is, in the second setting screen G22, output calibration and spherical aberration correction can be performed on each of the multiple lines 15. Apart from this, the second setting screen G42 is the same as the second setting screen G32.

[0100] In this embodiment, the same effect as the above-described embodiment is achieved, namely, improving user-friendliness while suppressing uneven processing results when performing branched laser processing.

[0101] In this embodiment, the correction of the processing conditions set on the second setting screen G42 includes output correction and spherical aberration correction for the first to third lines 15A, 15B, and 15C. Therefore, when performing branched laser processing to simultaneously form the modified region 12 along the three lines 15, user-friendliness can be improved while suppressing unevenness in the processing results. In particular, by using the lines 15 as a reference in the second setting screen G42, processing conditions can be corrected, thus suppressing unevenness in the processing results for each line 15.

[0102] [Fifth Implementation]

[0103] The fifth embodiment will be described. In the description of the fifth embodiment, the differences from the first embodiment will be explained, and repeated descriptions will be omitted.

[0104] The control unit 101 of this embodiment is implementedFigure 11 branch laser processing shown in (a) and Figure 11 branch laser processing shown in (b) in Figure 11 branch laser processing shown in (a) and Figure 11 branch laser processing shown in (b) in

[0105] Specifically, as shown in (a) in Figure 11 branch laser processing shown in (a) and

[0106] The second modification region 122 is located on the surface 11a side than the first modification region 121. The outbound direction K11 is the processing travel direction K1 toward one side of the X direction, and corresponds to the first moving direction. The first focal point C1 is located on the front side of the outbound direction K11 than the second focal point C2. The first focal point C1 is located on the back surface 11b side than the second focal point C2.

[0107] In addition, as shown in (b) in Figure 11 branch laser processing shown in (a) and

[0108] The return direction K12 is a processing travel direction K1 toward the other side of the X direction, and corresponds to the opposite direction of the first movement direction, that is, the second movement direction. The second focal point C2 is located on the front side of the first focal point Cl toward the return direction K12. The second focal point C2 is located on the back surface 11b side of the first focal point Cl.

[0109] As shown in (a) of FIG. 10B and (b) of FIG. 10B, the setting screen 102B of the present embodiment includes the first setting screen G51 instead of the first setting screen G11 (see (a) of FIG. 10A), and includes the second setting screen G52 instead of the second setting screen G12 (see (b) of FIG. 10A). Figure 12 Figure 12 As shown in (a) of FIG. 10B and (b) of FIG. 10B, the setting screen 102B of the present embodiment includes the first setting screen G51 instead of the first setting screen G11 (see (a) of FIG. 10A), and includes the second setting screen G52 instead of the second setting screen G12 (see (b) of FIG. 10A). Figure 6 Figure 6 As shown in (a) of FIG. 10B and (b) of FIG. 10B, the setting screen 102B of the present embodiment includes the first setting screen G51 instead of the first setting screen G11 (see (a) of FIG. 10A), and includes the second setting screen G52 instead of the second setting screen G12 (see (b) of FIG. 10A).

[0110] As shown in (a) of FIG. 10B and (b) of FIG. 10B, the setting screen 102B of the present embodiment includes the first setting screen G51 instead of the first setting screen G11 (see (a) of FIG. 10A), and includes the second setting screen G52 instead of the second setting screen G12 (see (b) of FIG. 10A). Figure 12 As shown in (a) of FIG. 10B and (b) of FIG. 10B, the setting screen 102B of the present embodiment includes the first setting screen G51 instead of the first setting screen G11 (see (a) of FIG. 10A), and includes the second setting screen G52 instead of the second setting screen G12 (see (b) of FIG. 10A).

[0111] As shown in (a) of FIG. 10B and (b) of FIG. 10B, the setting screen 102B of the present embodiment includes the first setting screen G51 instead of the first setting screen G11 (see (a) of FIG. 10A), and includes the second setting screen G52 instead of the second setting screen G12 (see (b) of FIG. 10A). Figure 12

[0112] As shown in (a) of FIG. 10B and (b) of FIG. 10B, the setting screen 102B of the present embodiment includes the first setting screen G51 instead of the first setting screen G11 (see (a) of FIG. 10A), and includes the second setting screen G52 instead of the second setting screen G12 (see (b) of FIG. 10A).

[0113] ​​​In the present embodiment, the plurality of light condensing points C are each located at a plurality of positions different in the Z direction in a manner that a plurality of rows of modified regions 12 are formed along one line 15. The machining conditions set on the first setting screen G51 include the output and spherical aberration of the first modified region 121 and the output and spherical aberration of the second modified region 122. The correction of the machining conditions set on the second setting screen G52 includes the output correction and spherical aberration correction of the first light condensing point C1 and the output correction and spherical aberration correction of the second light condensing point C2. Thus, in a case where branch laser machining is performed in which a plurality of rows of modified regions 12 are formed along one line 15 at the same time, it is possible to achieve an improvement in the ease of use of the user while suppressing unevenness in the machining results. In particular, in the first setting screen G51, it is possible to set the machining conditions for each modified region 12.

[0114] [Sixth Embodiment]

[0115] The sixth embodiment will be described. In the description of the sixth embodiment, points different from the fifth embodiment will be described, and the description of the repeated points will be omitted.

[0116] As shown in Figure 13 , the setting screen 102B of the present embodiment includes a second setting screen G62 instead of the second setting screen G52 (see (b) in Figure 12 ). The correction of the machining conditions set on the second setting screen G62 includes the output correction and spherical aberration correction in a case where the machining travel direction K1 is the outbound direction K11 (see (a) in Figure 11 ) and the output correction and spherical aberration correction in a case where the machining travel direction K1 is the inbound direction K12 (see (b) in Figure 11 ). That is, in the second setting screen G62, it is possible to perform the output correction and spherical aberration correction depending on which one of the outbound direction K11 and the inbound direction K12 the machining travel direction K1 is. Other than that, the second setting screen G62 is the same as the second setting screen G52.

[0117] In this present embodiment, in a case where branch laser machining is performed, the manager or the like inputs the correction values of the machining conditions in a manner that the difference in each machining result caused by the difference between the outbound direction K11 and the inbound direction K12 of the machining travel direction K1 is smaller on the second setting screen G62 displayed on the user interface 102.

[0118] In the present embodiment as well, the same effects as those of the above-described embodiments are achieved, that is, in a case where branch laser machining is performed, the ease of use of the user is improved, and it is possible to suppress unevenness in the machining results.

[0119] In this embodiment, the correction of the processing conditions set on the second setting screen G62 includes output correction and spherical aberration correction for the case where the processing travel direction K1 is the outgoing direction K11 and the case where it is the returning direction K12. Therefore, when performing branch laser processing that simultaneously forms multiple rows of modified regions 12 along a single line 15, user-friendliness can be improved while suppressing unevenness in the processing results. In particular, since the processing conditions can be corrected according to the different processing travel directions K1 in the second setting screen G62, unevenness in the processing results can be suppressed generally (or substantially) based on the processing travel direction K1.

[0120] [Seventh Implementation Method]

[0121] The seventh embodiment will be described. In the description of the seventh embodiment, the differences from the sixth embodiment will be explained, and repeated descriptions will be omitted.

[0122] like Figure 14 As shown, the setting screen 102B of this embodiment includes a second setting screen G72 instead of the second setting screen G62 (see reference). Figure 13 The correction of processing conditions set on the second setting screen G72 includes: output correction and spherical aberration correction for the case where the processing travel direction K1 is the outgoing direction K11 and the first modified area 121 is corrected; output correction and spherical aberration correction for the case where the processing travel direction K1 is the outgoing direction K11 and the second modified area 122 is corrected; output correction and spherical aberration correction for the case where the processing travel direction K1 is the returning direction K12 and the first modified area 121 is corrected; output correction and spherical aberration correction for the case where the processing travel direction K1 is the returning direction K12 and the second modified area 122 is corrected. That is, in the second setting screen G72, output correction and spherical aberration correction can be performed based on each of the multiple modified areas 12 and the direction in which the processing travel direction K1 is either the outgoing direction K11 or the returning direction K12. Otherwise, the second setting screen G72 is the same as the second setting screen G62.

[0123] In this embodiment, when performing branch laser processing, the manager or others input correction values ​​for processing conditions on the second setting screen G72 displayed on the user interface 102, so as to reduce the difference in processing results caused by focusing the first and second processing lights L1 and L2, and the difference in processing results caused by the difference between the processing travel direction K1 being the outgoing direction K11 or the returning direction K12.

[0124] In this embodiment, the same effect as the above-described embodiment is achieved, namely, improving user-friendliness while suppressing uneven processing results when performing branched laser processing.

[0125] In the present embodiment, the correction of the machining conditions set on the second setting screen G72 includes the output correction and the spherical aberration correction of the first and second modification regions 121, 122 for each of the case where the machining travel direction K1 is the outbound direction K11 and the case where the machining travel direction K1 is the inbound direction K12. Thereby, in the case where branch laser machining along one line 15 is performed while forming multiple columns of modification regions 12, it is possible to specifically achieve an improvement in the ease of use of the user while suppressing unevenness in the machining result. In particular, in the second setting screen G72, it is possible to correct the machining conditions according to the machining travel direction K1 and the different modification regions 12, and thus it is possible to suppress unevenness in the machining result according to the machining travel direction K1 and the different modification regions 12.

[0126] [The eighth embodiment]

[0127] The eighth embodiment will be described. In the description of the eighth embodiment, points different from the fifth embodiment will be described, and the description of the repeated points will be omitted.

[0128] As shown in (a) of FIG. 10 and (b) of FIG. 11, the setting screen 102B of the present embodiment includes the first setting screen G81 instead of the first setting screen G51 (see (a) of FIG. 6), and includes the second setting screen G82 instead of the second setting screen G52 (see (b) of FIG. 7). Figure 15 Figure 15 As shown in (a) of FIG. 10 and (b) of FIG. 11, the setting screen 102B of the present embodiment includes the first setting screen G81 instead of the first setting screen G51 (see (a) of FIG. 6), and includes the second setting screen G82 instead of the second setting screen G52 (see (b) of FIG. 7). Figure 12 Figure 12 As shown in (a) of FIG. 10 and (b) of FIG. 11, the setting screen 102B of the present embodiment includes the first setting screen G81 instead of the first setting screen G51 (see (a) of FIG. 6), and includes the second setting screen G82 instead of the second setting screen G52 (see (b) of FIG. 7).

[0129] As shown in (a) of FIG. 10, the machining conditions set on the first setting screen G81 include a correction parameter. The correction parameter is a parameter indicating a pattern, a tendency, a degree, or the like of the correction of the machining conditions. The correction parameter is indicated by a numerical value, for example. Other than this, the first setting screen G81 is the same as the first setting screen G51. As shown in (b) of FIG. 11, the output correction and the spherical aberration correction of the first condensing point C1 and the output correction and the spherical aberration correction of the second condensing point C2 set on the second setting screen G52 are grouped and set according to each correction parameter. Other than this, the second setting screen G82 is the same as the second setting screen G52. Figure 12 Figure 12 The control section 101 selects, from each group of the correction parameters set on the second setting screen G82, a group corresponding to the correction parameter set on the first setting screen G81 as a selection group. The control section 101 also controls the spatial light modulator 5 based on the output correction and the spherical aberration correction in the selection group set on the second setting screen G82.

[0130] The control section 101 selects, from each group of the correction parameters set on the second setting screen G82, a group corresponding to the correction parameter set on the first setting screen G81 as a selection group. The control section 101 also controls the spatial light modulator 5 based on the output correction and the spherical aberration correction in the selection group set on the second setting screen G82.

[0131] ​​​In this embodiment, when performing branched laser processing, the manager or other personnel input the correction values ​​for the processing conditions, grouped according to each correction parameter, on the second setting screen G82 displayed on the user interface 102, so as to reduce the difference between the processing results caused by focusing the first and second processing lights L1 and L2. The user inputs the processing conditions for branched laser processing and the desired correction parameters on the first setting screen G81 displayed on the user interface 102. Thus, based on the processing conditions input by the user and the corrections to the processing conditions input by the manager or other personnel and selected by the user as correction parameters, branched laser processing is performed.

[0132] In this embodiment, the same effect as the above-described embodiment is achieved, namely, improving user-friendliness while suppressing uneven processing results when performing branched laser processing.

[0133] In this embodiment, the processing conditions set on the first setting screen G81 include correction parameters, and the correction of the processing conditions set on the second setting screen G82 is set according to each correction parameter. Therefore, by setting the correction parameters on the first setting screen G81, the user can correct the processing conditions corresponding to those correction parameters. Administrators can set groups of corrections for several processing conditions according to each correction parameter, and the user can roughly adjust the correction of the processing conditions by setting the correction parameters.

[0134] [Ninth Implementation Method]

[0135] The ninth embodiment will be described. In the description of the ninth embodiment, the differences from the fifth embodiment will be explained, and repeated descriptions will be omitted.

[0136] like Figure 16 As shown in (a) of this embodiment, the control unit 101 branches the laser L into first to third processing beams L1, L2, and L3 and focuses them onto the object 11. The control unit 101 forms a first modified region 121, a second modified region 122, and a third modified region 123 along a line 15, with the first focusing point C1 of the first processing beam L1, the third focusing point C3 of the third processing beam L3, and the second focusing point C2 of the second processing beam L2 each located at multiple locations in the Z and X directions. Thus, the first modified region 121 is formed by focusing the first processing beam L1, the second modified region 122 is formed by focusing the third processing beam L3, and the third modified region 123 is formed by focusing the second processing beam L2. While the control unit 101 irradiates the object with the laser L, it moves the first to third focusing points C1, C2, and C3 along the line 15 in the path direction K11.

[0137] The second modified region 122 is located on the surface 11a side compared to the first modified region 121. The third modified region 123 is located on the surface 11a side compared to the second modified region 122. The first focusing point C1 is located on the front side of the path direction K11 compared to the third focusing point C3. The third focusing point C3 is located on the front side of the path direction K11 compared to the second focusing point C2. The first focusing point C1 is located on the back side 11b side compared to the second focusing point C2. The third focusing point C3 is located between the first focusing point C1 and the second focusing point C2 in the Z direction.

[0138] In addition, such as Figure 16 As shown in (b), the control unit 101 forms a first modified region 121, a second modified region 122, and a third modified region 123 along a line 15, and positions the second focusing point C2, the third focusing point C3, and the first focusing point C1 at multiple locations in the Z and X directions respectively. Thus, the first modified region 121 is formed by focusing the second processing light L2, the second modified region 122 is formed by focusing the third processing light L3, and the third modified region 123 is formed by focusing the first processing light L1. While irradiating with laser L, the control unit 101 moves the first to third focusing points C1, C2, and C3 along the line 15 in the return direction K12.

[0139] The second focusing point C2 is located ahead of the third focusing point C3 in the direction of return K12. The third focusing point C3 is located ahead of the first focusing point C1 in the direction of return K12. The first focusing point C1 is located on the side closer to surface 11a than the second focusing point C2. The third focusing point C3 is located between the first focusing point C1 and the second focusing point C2 in the Z direction.

[0140] like Figure 17 (a) and Figure 17 As shown in (b) of this embodiment, the setting screen 102B includes a first setting screen G91 instead of the first setting screen G51 (see reference). Figure 12 (a) includes a second setting screen G92 instead of the second setting screen G52 (see reference). Figure 12 (b) in the middle.

[0141] like Figure 17As shown in (a) of the figure, the processing conditions set on the first setting screen G91 include the number of branches of the laser L, and the Z-position, output, and spherical aberration of each of the first to third modification regions 121, 122, and 123. That is, in the first setting screen G91, the Z-position, output, and spherical aberration can be set for each of the multiple modification regions 12. Apart from this, the first setting screen G91 is the same as the first setting screen G51. The "A3", "B3", "C3", "D3", "E3", "F3", "G3", "H3", and "I3" in the figure are arbitrary values ​​for ease of explanation.

[0142] like Figure 17 As shown in (b), the calibration of the processing conditions set on the second setting screen G92 includes output calibration and spherical aberration correction for the first focusing point C1, the second focusing point C2, and the third focusing point C3. That is, on the second setting screen G92, output calibration and spherical aberration correction can be performed on each of the multiple focusing points C. Apart from this, the second setting screen G92 is the same as the second setting screen G52.

[0143] In this embodiment, the same effect as the above-described embodiment is achieved, namely, improving user-friendliness while suppressing uneven processing results when performing branched laser processing.

[0144] [Tenth Implementation Method]

[0145] The tenth embodiment will be described. In the description of the tenth embodiment, the differences from the ninth embodiment will be explained, and repeated descriptions will be omitted.

[0146] like Figure 18 As shown, the setting screen 102B in this embodiment includes a second setting screen G102 instead of the second setting screen G92 (see reference). Figure 17 (b)). The correction of the machining conditions set on the second setting screen G102 includes: when the machining travel direction K1 is the outgoing direction K11 (refer to...). Figure 16 In the case of output correction and spherical aberration correction in (a) and machining travel direction K1 being the return path direction K12 (refer to...), Figure 16 Output correction and spherical aberration correction (b) are included. That is, in the second setting screen G102, output correction and spherical aberration correction can be performed based on whether the processing travel direction K1 is the outgoing direction K11 or the returning direction K12. Otherwise, the second setting screen G102 is the same as the second setting screen G92.

[0147] In this embodiment, in the case where branch laser processing is performed, the manager or the like inputs correction values of the processing conditions on the second setting screen G102 displayed by the user interface 102 so as to make the difference in the processing result caused by the difference in the processing travel direction Kl being the outbound direction Kl 1 or the inbound direction Kl 2 smaller.

[0148] In the above, in this embodiment, the same effects as those of the above-described embodiment are also achieved, that is, in the case where branch laser processing is performed, the ease of use of the user is improved, and at the same time, the unevenness of the processing result is suppressed.

[0149] In this embodiment, the correction of the processing conditions set on the second setting screen G102 includes output correction and spherical aberration correction in the case where the processing travel direction Kl is the outbound direction Kl 1 and in the case where the processing travel direction Kl is the inbound direction Kl 2. Thereby, in the case where branch laser processing of simultaneously forming a plurality of rows of modified regions 12 along one line 15 is performed, the improvement of the ease of use of the user is specifically achieved, and at the same time, the unevenness of the processing result is suppressed. In particular, in the second setting screen G102, the processing conditions are corrected according to the difference in the processing travel direction Kl, and thus, the unevenness of the processing result as a whole can be suppressed according to the processing travel direction Kl.

[0150] [Eleventh Embodiment]

[0151] The eleventh embodiment will be described. In the description of the eleventh embodiment, points different from the tenth embodiment will be described, and the repeated description will be omitted.

[0152] As shown in Figure 19 , the setting screen 102B of this embodiment includes a second setting screen G112 instead of the second setting screen G102 (see Figure 18 ). The correction of the processing conditions set on the second setting screen G112 includes output correction and spherical aberration correction of the first modified region 121 in the case where the processing travel direction Kl is the outbound direction Kl 1, output correction and spherical aberration correction of the second modified region 122 in the case where the processing travel direction Kl is the outbound direction Kl 1, output correction and spherical aberration correction of the first modified region 121 in the case where the processing travel direction Kl is the inbound direction Kl 2, and output correction and spherical aberration correction of the second modified region 122 in the case where the processing travel direction Kl is the inbound direction Kl 2. That is, in the second setting screen G112, output correction and spherical aberration correction can be performed according to each of the plurality of modified regions 12 and which one of the outbound direction Kl 1 and the inbound direction Kl 2 the processing travel direction Kl is. Other than this, the second setting screen G112 is the same as the second setting screen G102.

[0153] In this embodiment, in a case where branch laser processing is performed, the manager or the like inputs a correction value of the processing condition on the second setting screen G102 displayed by the user interface 102 so as to make the difference in the processing result due to the difference in the processing result caused by the difference in the processing travel direction Kl being the outbound direction Kl 1 or the inbound direction Kl 2, and the difference in the processing result due to the condensing of the first and second processing lights Ll, L2 smaller.

[0154] In the above, in this embodiment, the same effects as those of the above-described embodiments are also achieved, that is, in a case where branch laser processing is performed, the ease of use of the user is improved, and at the same time, the unevenness of the processing result is suppressed.

[0155] In this embodiment, the output correction and the spherical aberration correction of the first and second modification regions 121, 122 in each of a case where the processing travel direction Kl is the outbound direction Kl 1 and a case where the processing travel direction Kl is the inbound direction Kl 2 are included in the correction of the processing condition set on the second setting screen G112. Thereby, in a case where branch laser processing in which a plurality of rows of modification regions 12 are formed along one line 15 is performed, the improvement of the ease of use of the user can be specifically achieved, and at the same time, the unevenness of the processing result is suppressed. In particular, in the second setting screen G72, the processing condition can be corrected according to the processing travel direction Kl and the modification region 12, and thus, the unevenness of the processing result can be suppressed according to the processing travel direction Kl and the modification region 12.

[0156] [Modified Example]

[0157] In the above, one mode of the present application is not limited to the above-described embodiments.

[0158] In the above-described embodiments, the number of branches of the laser L (the number of processing lights) is not limited to the above-described two branches and three branches, and can be four or more. In the above-described embodiments, by the user inputting a desired number of branches in the first setting screen, for example, branch laser processing can be performed by the processing light of the number of branches. In addition, in the above-described embodiments, by the user inputting a desired number of branches in the first setting screen, for example, the first setting screen and the second setting screen (the increase / decrease setting field) can be changed according to the number of branches.

[0159] In the above-described embodiments, the user interface 102 is included as the input receiving section and the display section, but is not limited thereto. The input receiving section and the display section can be other structures. As the input receiving section and the display section, various publicly known devices can be used. In the above-described embodiments, the user interface 102 displays the image 102A of the captured result, but can be free from the image 102A. In the above-described embodiments, the first setting screen and the second setting screen are switched and displayed on the user interface 102, but if they can be displayed separately, the user interface 102 can display both the first setting screen and the second setting screen.

[0160] The above-described embodiments can include a plurality of laser processing heads H as the irradiation section. In the above-described embodiments, the spatial light modulator 5 is not limited to a reflection-type spatial light modulator, but a transmission-type spatial light modulator can be used. In the above-described embodiments, the intervals of the condensing points C of the plurality of processing lights can be equal or different. In the above-described embodiments, both the laser processing head H and the support section 2 are movable by the moving mechanism 9, but at least one of them can be movable by the moving mechanism 9.

[0161] In the above-described embodiments, the kind of the object 11, the shape of the object 11, the size of the object 11, the number and direction of crystal orientations possessed by the object 11, and the face orientation of the principal surface of the object 11 are not particularly limited. In the above-described embodiments, the object 11 can be formed of a crystalline material having a crystal structure, or can be formed of a non-crystalline material having a non-crystalline structure (amorphous structure) instead of or in addition to the crystalline material. The crystalline material can be any one of an anisotropic crystal and an isotropic crystal. For example, the object 11 can include a substrate formed of at least any one of gallium nitride (GaN), silicon (Si), silicon carbide (SiC), LiTaO3, diamond, GaOx, sapphire (Al2O3), gallium arsenide, indium phosphide, glass, and alkali-free glass.

[0162] In the above-described embodiments, the modified region 12 can be, for example, a crystal region, a recrystallized region, or a gettering region formed in the inside of the object 11. The crystal region is a region that maintains the structure of the object 11 before processing. The recrystallized region is a region that is temporarily evaporated, ionized, or melted and then solidified as a single crystal or a polycrystal at the time of re-solidification. The gettering region is a region that exhibits a gettering effect of collecting and capturing impurities such as heavy metals, and can be continuously formed or intermittently formed. The above-described embodiments can be applied to processing such as ablation.

[0163] The laser processing apparatus 1 and the laser processing method of the above-described embodiments can also be combined with each other at least in part. In other words, any one of the above-described first to eleventh embodiments can also include a part or all of an embodiment other than any one of the above-described first to eleventh embodiments. For example, in the above-described embodiments, in addition to branching the laser L in the index direction, laser branching processing in which branching is performed in the processing travel direction K1 can also be implemented. In this case, it can also be possible to set a processing condition corresponding to such branching in the first setting screen, and it can be possible to set correction of the processing condition in the second setting screen.

[0164] In the above-described embodiments, the type of aberration is not particularly limited. For example, the aberration can include at least any one of spherical aberration, non-point aberration, and coma aberration. In the above-described embodiments, the parameter set in the first setting screen is not necessarily the only parameter that becomes the target of correction in the second setting screen. The parameter that can be corrected in the second setting screen can also include correction of a parameter different from the parameter set in the first setting screen. The correction of the processing condition by the second setting screen is not particularly limited, and for example, it can also include correction of the condensing state. For example, in the above-described first embodiment, the user interface 102 can be caused to display the first setting screen G11 (see (a) in FIG. 10) for the user, and on the other hand, the second setting screen G122 of (a) in FIG. 11 can be displayed for the manager or the like. Figure 6 Figure 20 In the above-described first embodiment, for example, the user interface 102 can be caused to display the first setting screen G11 (see (a) in FIG. 10) for the user, and on the other hand, the second setting screen G132 of (b) in FIG. 12 can be displayed for the manager or the like. Figure 6 Figure 20 In the above-described first embodiment, for example, the user interface 102 can be caused to display the first setting screen G11 (see (a) in FIG. 10) for the user, and on the other hand, the second setting screen G132 of (b) in FIG. 12 can be displayed for the manager or the like.

[0165] The above-described embodiments and modified examples are not limited to the above-described materials and shapes, and various materials and shapes can be applied. In addition, each structure of the above-described embodiments or modified examples can be arbitrarily applied to each structure of other embodiments or modified examples.

[0166] According to the present disclosure, it is possible to provide a laser processing apparatus and a laser processing method in which, in a case where laser processing is implemented in which laser is branched into a plurality of processing lights and then condensed, it is possible to improve the ease of use of the user while suppressing unevenness of the processing result.​​

Claims

1. A laser processing apparatus that forms a modified region inside an object by irradiating laser light to the object, wherein including: a support section that supports the object; an irradiation section that irradiates the object supported by the support section with the laser light; a moving mechanism that moves at least one of the support section and the irradiation section; an input receiving section that receives input; a display section that can display a setting screen based on input received by the input receiving section; and a control section that controls the irradiation section, the moving mechanism, and the display section based on input received by the input receiving section, the control section, causes the laser light from the irradiation section to branch into a plurality of machining lights, and causes a plurality of focal points of the plurality of machining lights to be located at a plurality of positions inside the object that are different from each other in a direction perpendicular to an irradiation direction of the laser light, moves at least one of the support section and the irradiation section by the moving mechanism to move the positions of the plurality of focal points along a line, the setting screen includes a first setting screen for setting of a machining condition and a second setting screen for correction of the machining condition that is displayed separately from the first setting screen, the line includes a first line and a second line that are arranged along a direction perpendicular to the irradiation direction, the control section causes a first focal point of the plurality of focal points to be located at a position on the first line and causes a second focal point of the plurality of focal points to be located at a position on the second line, the machining condition set on the first setting screen includes at least either of an output of the machining light and an aberration of the machining light, the correction of the machining condition set on the second setting screen includes at least either of output correction and aberration correction of the first focal point and output correction and aberration correction of the second focal point. including:

2. A laser processing apparatus that forms a modified region inside an object by irradiating laser light to the object, wherein a support section that supports the object; an irradiation section that irradiates the object supported by the support section with the laser light; a moving mechanism that moves at least one of the support section and the irradiation section; an input receiving section that receives input; a display section that can display a setting screen based on input received by the input receiving section; and a control section that controls the irradiation section, the moving mechanism, and the display section based on input received by the input receiving section, the control section, causes the laser light from the irradiation section to branch into a plurality of machining lights, and causes a plurality of focal points of the plurality of machining lights to be located at a plurality of positions inside the object that are different from each other in a direction perpendicular to an irradiation direction of the laser light, moves at least one of the support section and the irradiation section by the moving mechanism to move the positions of the plurality of focal points along a line, the setting screen includes a first setting screen for setting of a machining condition and a second setting screen for correction of the machining condition that is displayed separately from the first setting screen, the line includes a first line and a second line that are arranged along a direction perpendicular to the irradiation direction, the control section causes a first focal point of the plurality of focal points to be located at a position on the first line and causes a second focal point of the plurality of focal points to be located at a position on the second line, ​ ​ The processing condition set on the first setting screen includes at least any one of an output of the processing light and an aberration of the processing light, The correction of the processing condition set on the second setting screen includes at least any one of an output correction and an aberration correction of the first line, and an output correction and an aberration correction of the second line.

3. A laser processing apparatus that forms a modified region inside an object by irradiating laser light to the object, wherein Comprise: a support portion that supports the object; an irradiation portion that irradiates the object supported by the support portion with the laser light; a moving mechanism that moves at least one of the support portion and the irradiation portion; an input receiving portion that receives input; a display portion that can display a setting screen based on input received by the input receiving portion; and a control portion that controls the irradiation portion, the moving mechanism, and the display portion based on input received by the input receiving portion, the control portion, branches the laser light from the irradiation portion into a plurality of processing lights, and causes a plurality of focal points of the plurality of processing lights to be located at a plurality of positions different from each other in a direction perpendicular to an irradiation direction of the laser light inside the object, moves at least one of the support portion and the irradiation portion by the moving mechanism to move the positions of the plurality of focal points along a line, the setting screen includes a first setting screen for setting of a processing condition, and a second setting screen for correction of the processing condition displayed separately from the first setting screen, the control portion causes the plurality of focal points to be located at a plurality of positions different from each other in the irradiation direction in a manner that a plurality of rows of the modified regions are formed in the irradiation direction on one of the lines, the processing condition set on the first setting screen includes at least any one of an output and an aberration of a first modified region in the plurality of rows of the modified regions, and an output and an aberration of a second modified region in the plurality of rows of the modified regions, the correction of the processing condition set on the second setting screen includes an output correction and an aberration correction of a first focal point in the plurality of focal points, and an output correction and an aberration correction of a second focal point in the plurality of focal points. Comprise:

4. A laser processing apparatus that forms a modified region inside an object by irradiating laser light to the object, wherein a support portion that supports the object; an irradiation portion that irradiates the object supported by the support portion with the laser light; a moving mechanism that moves at least one of the support portion and the irradiation portion; an input receiving portion that receives input; a display portion that can display a setting screen based on input received by the input receiving portion; and a control portion that controls the irradiation portion, the moving mechanism, and the display portion based on input received by the input receiving portion, the control portion, branches the laser light from the irradiation portion into a plurality of processing lights, and causes a plurality of focal points of the plurality of processing lights to be located at a plurality of positions different from each other in a direction perpendicular to an irradiation direction of the laser light inside the object, moves at least one of the support portion and the irradiation portion by the moving mechanism to move the positions of the plurality of focal points along a line, ​ ​ The setting screen includes: a first setting screen for setting of a processing condition; and a second setting screen for correction of the processing condition, which is displayed separately from the first setting screen, The control section causes the plurality of light condensing points to be respectively located at a plurality of positions different in the irradiation direction, in a manner that a plurality of rows of the modified regions are formed in the irradiation direction on one of the lines, The processing condition set on the first setting screen includes at least any one of: output and aberration of a first modified region in the plurality of rows of the modified regions; and output and aberration of a second modified region in the plurality of rows of the modified regions, The correction of the processing condition set on the second setting screen includes at least any one of: output correction and aberration correction in a case where a moving direction in which the plurality of light condensing points are moved is a first moving direction; and output correction and aberration correction in a case where the moving direction is a second moving direction opposite to the first moving direction.

5. A laser processing apparatus that forms a modified region inside an object by irradiating laser light to the object, wherein Comprise: a support section that supports the object; an irradiation section that irradiates the object supported by the support section with the laser light; a moving mechanism that moves at least one of the support section and the irradiation section; an input receiving section that receives an input; a display section that can display a setting screen based on the input received by the input receiving section; and a control section that controls the irradiation section, the moving mechanism, and the display section based on the input received by the input receiving section, The control section, branches the laser light from the irradiation section into a plurality of processing lights, and causes a plurality of light condensing points of the plurality of processing lights to be respectively located at a plurality of positions different in a direction perpendicular to an irradiation direction of the laser light inside the object, moves at least one of the support section and the irradiation section by the moving mechanism to move the positions of the plurality of light condensing points along a line, The setting screen includes: a first setting screen for setting of a processing condition; and a second setting screen for correction of the processing condition, which is displayed separately from the first setting screen, The control section causes the plurality of light condensing points to be respectively located at a plurality of positions different in the irradiation direction, in a manner that a plurality of rows of the modified regions are formed in the irradiation direction on one of the lines, The processing condition set on the first setting screen includes at least any one of: output and aberration of a first modified region in the plurality of rows of the modified regions; and output and aberration of a second modified region in the plurality of rows of the modified regions, ​ The correction of the machining conditions set on the second setting screen includes at least one of the output correction and the aberration correction of the first modified region when the moving direction of the plurality of condensing points is a first moving direction, the output correction and the aberration correction of the second modified region when the moving direction is the first moving direction, the output correction and the aberration correction of the first modified region when the moving direction is a second moving direction opposite to the first moving direction, and the output correction and the aberration correction of the second modified region when the moving direction is the second moving direction.

6. The laser processing apparatus according to any one of claims 1 to 5, wherein the irradiation section has a spatial light modulator that modulates the laser light, the control section modulates the laser light by the spatial light modulator to branch the laser light into a plurality of machining lights, and causes a plurality of the condensing points of the plurality of machining lights to be located at mutually different positions in a direction perpendicular to the irradiation direction.

7. The laser processing apparatus according to any one of claims 1 to 5, wherein the machining conditions set on the first setting screen include correction parameters, the correction of the machining conditions set on the second setting screen is set for each correction parameter.

8. The laser processing apparatus according to any one of claims 1 to 5, wherein the shooting section emits at least one of visible light and infrared light to shoot the object, the control section causes the shooting result of the shooting section to be displayed on the display section together with at least one of the first setting screen and the second setting screen.

9. The laser processing apparatus according to any one of claims 1 to 5, wherein the control section is capable of displaying the second setting screen on the display section only when the input receiving section receives an input of a lock release.

10. The laser processing apparatus according to any one of claims 1 to 5, wherein the storage section stores a history of the correction of the machining conditions set on the second setting screen.

11. A laser processing method of forming a modified region in the inside of an object using the laser processing apparatus according to any one of claims 1 to 10, wherein includes: a step of inputting the machining conditions on the first setting screen displayed on the display section via the input receiving section; and a step of inputting, on the second setting screen displayed on the display section via the input receiving section, a correction value of the machining conditions that have been input on the first setting screen so that a difference in each machining result due to condensing of the plurality of machining lights and / or a difference in machining result due to a difference in moving direction of the plurality of condensing points becomes smaller.

Images